System for automated processing of samples for analysis and sample processing method using the same

Abstract

A system for automated processing of analysis samples, a wafer analysis automation system, and a method of processing analysis samples are disclosed. The system for automated processing of analysis samples includes a sample processing unit configured to manufacture a plurality of unit wafers by cutting an analysis target wafer, and configured to manufacture an analysis sample by processing the unit wafers via at least one process; a sample storage unit in which a loading area has been formed, a receiving holder, on which a unit wafer and an analysis sample have been loaded, is transported into the loading area and transported out of the loading area; and a sample transport unit configured to mutually transport the analysis target wafer, the unit wafer, and the analysis sample between the sample processing unit and the sample storage unit.

Description

[0001] Cross-reference to related applications

[0002] This application requests approval from the Korean Intellectual Property Office. November 16, 2021 The application number submitted is 10-2021-0157807 Korean patent applications and August 22, 2022 The application number submitted is 10-2022-0105017 The priority of the Korean patent application, the entire contents of which are incorporated herein by reference. Technical Field

[0003] Various embodiments relate to a system for automated processing of analytical samples, and a system capable of automating all processes of analytical sample processing by automating the wafer warehousing process, the processing for manufacturing analytical samples, and the allocation of each analytical sample. Background Technology

[0004] With the continuous improvement of semiconductor device integration technology, a large number of devices are integrated onto a single wafer. Consequently, the presence of defects on the wafer has a significant impact on yield. Therefore, the importance of the analysis process for inspecting for defects on wafers is gradually increasing. Specifically, as device integration density increases, the need to analyze more subtle defects also increases.

[0005] Semiconductor devices are analyzed using analytical equipment such as scanning electron microscopy (SEM), transmission electron microscopy (TEM), focused ion beam (FIB), or secondary ion mass spectrometry (SIMS). The analysis of semiconductor devices is performed by using a method that separately manufactures analytical samples by processing the wafer via a preprocessing method, and then analyzes the manufactured samples.

[0006] Typically, analytical samples are manufactured by processing wafers using different methods depending on the analytical approach applied to the sample, and by performing multiple processing steps using processing equipment (such as ion milling, dicing, or indentation equipment) for each unit module. However, in such processing equipment, because the manufacturers of the processing equipment differ from one another, the equipment and samples between manufacturers are not standardized. This presents problems such as difficulty in automating the processing equipment because information and material correlation between equipment components are impossible; significantly increased labor costs, analytical costs, and analytical time due to the need for worker intervention; and difficulties in infrastructure construction. Summary of the Invention

[0007] In one embodiment, a system for automated processing of analytical samples may include: a sample processing unit configured to manufacture a plurality of unit wafers by dicing an analytical target wafer and configured to manufacture analytical samples by processing the unit wafers via at least one processing step; a sample storage unit in which a loading region has been formed, a receiving holder being moved into and out of the loading region, on which the unit wafers and analytical samples have been loaded; and a sample transport unit configured to transport the analytical target wafers, unit wafers, and analytical samples between the sample processing unit and the sample storage unit.

[0008] According to one embodiment, the receiver holder may include: a holder body configured to support a cell wafer and an analytical sample below them; a first receiver stage formed on one side of the holder body at the top of the holder body and configured to form a space to which the cell wafer is coupled in an attachable and detachable configuration; and a second receiver stage formed on the other side of the holder body at the top of the holder body and configured to form a space to which a grid of cell wafers is coupled in an attachable and detachable configuration.

[0009] The first receiving stage may have the following structure: a fixing slot inserted into and formed on one side of the holder body on the upper side of the holder body; a support plate mounted in the fixing slot and configured to seat the cell wafer at the top of the support plate and to form an axis at the bottom of the support plate; an elastic member mounted along the outer circumferential surface of the axis; an elastic clip fitted with a capture protrusion formed to protrude from the inner wall of the fixing slot; and a clamping unit inserted into and coupled to the fixing slot to form a movable space in which the elastic clip moves, and the clamping unit is configured to fix the cell wafer and the cover together on the upper side of the clamping unit, wherein an exposure hole has been formed in the cover, such that the capture protrusion is exposed on one side of the clamping unit at the top of the clamping unit by applying pressure to the cell wafer.

[0010] According to one embodiment, the sample storage unit may have a structure including: a first loading region where a receiver holder is stored and the first loading region is configured to form a space in which a cell wafer is coupled to at least one of a first receiver stage and a second receiver stage of the receiver holder; and a second loading region configured to form a space in which analytical samples are transported into and out of the space.

[0011] According to one embodiment, the sample delivery unit may have a structure including: a first delivery module configured to deliver an analysis target wafer to a sample processing unit; a second delivery module configured to deliver a unit wafer and attach the unit wafer to a receiving holder; and a third delivery module configured to deliver the unit wafer to the sample processing unit.

[0012] According to one embodiment, the system may further include a sample classification unit, which includes: a tag module mounted on one side of a receiving holder and configured to store an identification code of a cell wafer and an identification code of the receiving holder; a reading module configured to identify the identification code already stored in the tag module; and a code generation module configured to generate an identification code and to transmit the generated identification code to the tag module.

[0013] According to one embodiment, the system may further include a controller comprising: a communication module configured to transmit and receive identification codes identified by a reading module; a terminal module installed in a sample processing unit and configured to receive individual processing information and perform control to execute the processing procedure; a management module configured to store identification codes of unit wafers and analytical samples received in a sample storage unit and configured to manage the loading and unloading of unit wafers and analytical samples received in the sample storage unit; and a processing information generation module configured to generate individual processing information for unit wafers based on the identification codes and configured to transmit the generated individual processing messages to the terminal module, the management module, and the sample delivery unit. The controller may be configured to control the operation of the sample processing unit, the sample storage unit, and the sample delivery unit based on the identification codes.

[0014] The processing information generation module can be configured to generate processing information by receiving the analysis scheme information when the management server generates analysis scheme information for a unit wafer based on the identification code and transmits the generated analysis scheme information.

[0015] According to one embodiment, the system may further include a manager terminal unit configured to receive drive status and task information of the sample processing unit, the sample storage unit, and the sample delivery unit.

[0016] In one embodiment, an automated wafer analysis system may include: a sample processing unit configured to manufacture a plurality of unit wafers by dicing an analysis target wafer and configured to manufacture analytical samples by processing the unit wafers via at least one processing step; a sample storage unit in which a loading region has been formed, a receiving holder being moved into and out of the loading region, on which unit wafers and analytical samples have been loaded; a sample analysis unit configured to analyze the analytical samples moved out of the sample storage unit; and a sample transport unit configured to transport the analysis target wafer, unit wafers, and analytical samples between the sample processing unit and the sample storage unit.

[0017] In one embodiment, a method for processing an analytical sample may include: a first processing step of conveying an analytical target wafer to a sample processing unit and forming a plurality of unit wafers by performing a dicing process on the analytical target wafer; a first storage step of separating the unit wafers from the analytical target wafers and loading and holding the unit wafers in a receiving holder that has been received in a sample storage unit; a second processing step of removing the receiving holder with the unit wafers loaded from the sample storage unit, conveying the receiving holder to the sample processing unit, and manufacturing an analytical sample by processing the unit wafers based on an identification code in a manner corresponding to individual processing information; and a second storage step of conveying the receiving holder with the analytical sample loaded and receiving the receiving holder in the sample storage unit. Attached Figure Description

[0018] Figure 1 This is a structural diagram illustrating a system for automated processing of samples for analysis, according to one embodiment.

[0019] Figure 2 This is a conceptual diagram illustrating a system for automated processing of samples for analysis, according to one embodiment.

[0020] Figure 3 This is a processing state diagram of a system for automated processing of samples for analysis, according to one embodiment.

[0021] Figure 4 This is a cross-sectional view of the receiver holder of a system for automated processing of samples for analysis, according to one embodiment.

[0022] Figure 5 This is a block diagram illustrating the process of generating an identification code via a code generation module during the manufacture of a sample for SEM analysis using a system for automated processing of samples for analysis, according to one embodiment.

[0023] Figure 6 This is a structural diagram illustrating an automated wafer analysis system according to one embodiment.

[0024] Figure 7 This is a process diagram illustrating a method for processing an analytical sample according to one embodiment.

[0025] Figure 8 This is a flowchart illustrating the detailed process of processing steps in a method for processing an analytical sample according to one embodiment. Detailed Implementation

[0026] Some terms used in this specification may be defined as having the following meanings.

[0027] First, a wafer refers to the raw material used for analysis. Wafer raw materials can be manufactured according to various standards and can have various diameters, such as 150mm, 200mm, 300mm, and 450mm. Furthermore, the wafer can include various types of wafers, such as semiconductor wafers, wafers for light-emitting diodes (LEDs), and wafers for solar cells. The wafer can be a bare wafer.

[0028] A unit wafer S can refer to a wafer before processing, which has been manufactured by dicing to produce analytical samples AS. In other words, a unit wafer S can refer to a wafer piece.

[0029] The sample AS for analysis can refer to a unit wafer S that has undergone one or more processing procedures (such as dicing, indentation, ion milling, polishing, coating, grinding, cleaning, and punching) for wafer analysis.

[0030] "Processing" can refer to all preprocessing procedures performed within an automated system according to one embodiment until the wafer becomes an analytical sample AS.

[0031] "Analysis" can refer to sample analysis, which is performed in the sample analysis unit 700 described later or in the analysis equipment in an actual analysis laboratory for wafer analysis.

[0032] Furthermore, the apparatus described in this specification may be entirely hardware, or may have both hardware and software aspects. For example, a system for automated processing of samples for analysis, each terminal, device, or server communicating with the system, and each module or unit contained in each terminal, device, or server, can generally refer to: an apparatus for exchanging data of a specific format and content electronically, and the software associated with that apparatus. In this specification, terms such as “unit,” “module,” “server,” “system,” “platform,” “apparatus,” or “terminal” may be intended to represent a combination of hardware and software driven by the corresponding hardware. For example, in this case, the hardware may be a data processing device containing a CPU or other processor. Furthermore, the software driven by the hardware may represent a process, object, executable file, thread of execution, or program.

[0033] The following describes in detail a system 10 for automated processing of samples for analysis according to one embodiment.

[0034] Figure 1 This is a structural diagram illustrating a system for automated processing of samples for analysis, according to one embodiment. Figure 2 This is a conceptual diagram of a system for automated processing of samples for analysis, according to one embodiment. Figure 3 This is a processing state diagram of a system for automated processing of samples for analysis, according to one embodiment.

[0035] refer to Figures 1 to 3 According to one embodiment, a system for automated processing of samples for analysis may have a structure comprising: a sample processing unit 100, a sample storage unit 200, and a sample delivery unit 300.

[0036] The sample processing unit 100 can perform the following functions: to manufacture multiple unit wafers S by dicing the target wafer W for analysis, and to manufacture analytical samples AS by processing the unit wafers S through at least one processing procedure.

[0037] The sample processing unit 100 can manufacture analytical samples AS, which can have various forms. For example, the analytical sample AS can be a sample for scanning electron microscopy (SEM) analysis or a sample for transmission electron microscopy (TEM) analysis. Samples for SEM analysis and samples for TEM analysis can be manufactured by applying different processing methods to the unit wafer S. That is, the sample processing unit 100 can generate unit wafer S, and can manufacture analytical samples AS of various types and forms by processing the generated unit wafer S via at least one processing method.

[0038] Therefore, the sample processing unit 100 can manufacture analytical samples AS by processing the wafer using at least one of the methods such as cutting, indentation, ion milling, polishing, coating, grinding, and cleaning. For this purpose, the sample processing unit 100 may include at least one processing device selected from the following: a cutting device, an indentation device, an ion milling device, a polishing device, a coating device, a grinding device, a cleaning device, and a punching device. Thus, the sample processing unit 100 can manufacture unit wafers S, and can form indented regions in the unit wafer S by performing an indentation process on the unit wafer S, or can perform an ion milling process to polish the unit wafer S to a fine thickness. Furthermore, the sample processing unit 100 can perform a polishing process to smooth the surface of the unit wafer S, can pierce the unit wafer S through punching, or can perform a cleaning process to remove residues from the surface of the unit wafer S.

[0039] The sample processing unit 100 can form multiple unit wafers S by dicing wafers, and can manufacture analytical samples AS by processing the unit wafers S. That is, as shown in the figure... Figure 3 As shown, the target analysis wafer W can be transported to the first processing apparatus 100a. The target analysis wafer W, comprising multiple unit wafers S, can be manufactured by performing a dicing process on the target analysis wafer W. The manufactured target analysis wafer W can be stored in the sample storage unit 200.

[0040] First, the sample processing unit 100 can generate multiple unit wafers S by dicing the target analysis wafer W. Subsequently, the generated unit wafers S can be separated by the sample transport unit and loaded onto the receiving holder 230. The analysis sample AS can be manufactured by processing the unit wafers S, as described above, onto the receiving holder 230 via any one or more processing methods.

[0041] Furthermore, the sample processing unit 100 can manufacture analytical samples AS in the following manner: the sample processing unit 100 processes the unit wafer S by controlling it with individual processing information based on the unit wafer S, which is generated based on the identification code through the analysis scheme information. For example, when the analysis scheme information indicates the processing of analytical samples AS for large-area SEM analysis, the sample processing unit 100 can generate the unit wafer S, perform indentation processing on the unit wafer S, and then manufacture a sample for SEM analysis by processing the unit wafer S via two methods for ion milling.

[0042] The unit wafer S can be transported by the sample transport unit 300 so that processing can be performed via one or more different methods. That is, such as Figure 3As shown, a sample that has been processed by the second processing device 100b can be transported and processed in the third processing device 100c.

[0043] The manufactured analytical sample AS can be shipped out from the processing device installed in the sample processing unit 100 and received in the sample storage unit 200. The analytical sample AS already received in the sample storage unit 200 can be shipped out again, and additional processing can be performed on the analytical sample AS.

[0044] The sample storage unit 200 may have a structure in which a loading region is formed, a receiving holder 230 is transported into and out of the loading region, the receiving holder 230 having respectively loaded cell wafers S and analytical samples AS. Therefore, the sample storage unit 200 can store and hold multiple cell wafers S and analytical samples AS.

[0045] The sample storage unit 200 may have a structure that includes a storage chamber 210 and a receiving holder 230.

[0046] A loading area can be formed in storage chamber 210, allowing multiple unit wafers S and analytical samples AS to be stored and held within storage chamber 210. Storage chamber 210 can receive unit wafers S, can ship unit wafers S out, can manufacture analytical samples AS by processing unit wafers S, and can then receive the manufactured analytical samples AS. When unit wafers S and analytical samples AS need to wait through multiple processing steps, they can be stored in storage chamber 210.

[0047] Storage chamber 210 may have a structure in which multiple loading areas are formed. For example, storage chamber 210 may have a structure that includes a first loading area 211 and a second loading area 213.

[0048] The unloaded cell wafer S is stored in the first loading region 211. The first loading region 211 can form a space where the cell wafer S is loaded on the receiving holder 230, and can also form a space where the receiving holder 230' is loaded, on which the cell wafer S has been loaded.

[0049] Furthermore, the first loading area 211 may have the following structure: a wafer station 212 has been formed on one side of the first loading area 211, on which the analysis target wafer W is loaded and then transported after undergoing dicing.

[0050] Therefore, the receiver holder 230 can receive the unloaded cell wafer S in the first loading region 211.

[0051] Furthermore, the first loading region 211 may have a structure in which a wafer station 212 has been formed, on which the analysis target wafer W, which has undergone dicing in the dicing apparatus of the sample processing unit 100, is transported and loaded. Therefore, the first loading region 211 can provide space for: separating the unit wafer S from the analysis target wafer W; transporting and loading the separated unit wafer S onto a receiving holder 230 that has not yet been loaded with unit wafer S; and forming a receiving holder 230' that has been loaded with unit wafer S. Furthermore, the first loading region 211 can receive and store the receiving holder 230' that has been loaded with unit wafer S.

[0052] The second loading region 213 can be formed on one side of the first loading region 211, and can form a space in which the receiving holder for the loaded cell wafer S is transported in and out.

[0053] Specifically, an analytical sample AS can be manufactured when the receiver holder 230' of the loaded cell wafer S is transported from the first loading area and then processed in the sample processing unit 100. The receiver holder 230'' of the loaded analytical sample AS is transported and received in the second loading area 213. The receiver holder 230'' of the loaded analytical sample AS can be transported from the second loading area 213 to perform an analysis process on the analytical sample AS.

[0054] Furthermore, the second loading area 213 may include multiple divided receiving spaces. Therefore, for each category, the analytical sample AS can be classified according to the analysis scheme and received in the multiple divided receiving spaces. Multiple analytical samples AS can be received and held in the second loading area 213, and can also be transported out of the second loading area 213.

[0055] Storage chamber 210 may have a structure in which at least one opening has been formed on one surface of storage chamber 210, and may have a structure in which a cover for opening and closing the opening has been installed. Therefore, storage chamber 210 may be structured such that unit wafer S and analytical sample AS are transported in and out through the opening of storage chamber.

[0056] The sample storage unit 200 with this structure can transport the unit wafer S received in the storage chamber 210 to the sample processing unit 100 for processing. Furthermore, the sample storage unit 200 can transport analytical samples AS that have been manufactured using any one or more processing methods to a specific processing device included in the sample processing unit 100 to hold the analytical samples AS and perform additional processing. Analytical samples AS that have been transported out and additionally processed can be returned to the sample storage unit 200 via the sample transport unit 300 and held therein.

[0057] The receiver holder 230 can be configured such that the unit wafer S and the analytical sample AS are received and transported by the sample transport unit. For this purpose, the receiver holder 230 can form a space on which the unit wafer S or the analytical sample AS is mounted. Furthermore, the receiver holder 230 may include means to be mounted on each processing device of the sample processing unit 100 and on the sample transport unit 300. The unit wafer S can be stored in the storage chamber 210 in a state where the unit wafer S has been loaded onto the receiver holder 230, and can be transported out from the storage chamber 210 for processing in the manufacture of the analytical sample AS. The receiver holder 230 can be configured such that the analytical sample AS is loaded onto this structure after the unit wafer S has been processed in the sample processing unit 100.

[0058] Figure 4 This is a cross-sectional view of a receiver holder 230 of a system for automated processing of samples for analysis, according to one embodiment.

[0059] refer to Figure 4 The receiver holder 230 may have a structure including a holder body 231 and multiple receiver stages 233a and 233b.

[0060] The holder body 231 can have a given shape and can be formed into a structure to be received in each storage chamber 210 and sample processing unit 100. The holder body 231 can have a coupling groove 232 formed on one side of the holder body 231, such that the coupling groove is coupled to a fixing device already installed in the processing apparatus by clamping, and can be coupled to the processing apparatus of the sample processing unit 100. The processing apparatus can have a structure in which a fixing device with the same structure is installed to fix the holder body 231. If the processing apparatuses are manufactured by different companies, it is difficult to install the receiving holder 230 in each processing apparatus and it is difficult to perform the processing. Therefore, the receiving holder 230 can be fixed by using a method of installing the same fixing device in each processing apparatus. Therefore, the holder body 231 can be formed into a structure that can be installed in multiple types of processing apparatuses manufactured by different companies.

[0061] The receiver holder 230 may have the following structure: in which multiple receiver stages 233a and 233b have been formed, so that the cell wafer S can be processed by using different methods depending on the analysis method.

[0062] For example, the receiver holder 230 may have a structure that includes a first receiver stage 233a and a second receiver stage 233b.

[0063] The first receiving stage 233a can be formed on one side of the holder body 231 on top of the holder body 231, and can form the receiving space of the receiving unit wafer S. The first receiving stage 233a can be mounted with a structure in which the unit wafer S can be connected to and detached from the structure, and can have a structure including a clamping unit 235 for the structure.

[0064] Specifically, the clamping unit 235 may have a structure including a fixing groove 2351, a support plate 2353, an elastic member 2355, an elastic clamp 2357, and a cover 2359.

[0065] The fixing groove 2351 can be inserted into and formed on the top of the holder body 231 on one side of the holder body 231, and can have a structure in which the top of the holder body 2351 is opened, and can form a structure in which the support plate 2353, the elastic member 2355 and the elastic clip 2357 are received in the fixing groove 2351.

[0066] The support plate 2353 can be installed in the fixing groove 2351 and can have the following structure: the unit wafer S is located on the top of the support plate 2353 and an axis has been formed at the bottom of the support plate 2353.

[0067] The elastic member 2355 can be mounted on the outer circumferential surface of the axis formed at the bottom of the support plate 2353. The elastic member 2355 can be implemented as an elastic spring with the following characteristics: when the top of the support plate 2353 is pressed, causing the support plate 2353 to descend, the elastic member 2355 contracts, and when the pressure on the top of the support plate 2353 is released, causing the support plate 2353 to rise, the elastic member 2355 returns to its original position.

[0068] The elastic clip 2357 has the following structure: a trapping protrusion 2357a is formed, which protrudes from the inner wall of the fixing groove 2351. The elastic clip 2357 can be structured such that when the top of the support plate 2353 is pressurized, the trapping protrusion 2357a extends to both sides of the elastic clip 2357; and when the pressure on the top of the support plate 2353 is released, the trapping protrusion 2357a resets, and the unit wafer S is fixed to the fixing groove 2351 by clamping both side surfaces of the unit wafer S. Furthermore, the elastic clip 2357 can be structured such that when the top of the unit wafer S is pressurized, the trapping protrusion 2357a extends to both sides of the elastic clip 2357, the support plate 2353 rises, and the unit wafer S is transported out of the fixing groove 2351.

[0069] The cover 2359 can be inserted and coupled to the inner wall of the fixing groove 2351 to form a movable space that can be elastically clamped therein, and can have the following structure: an exposure hole has been formed so that the capture protrusion 2357a is exposed on one side of the cover 2359 at the top of the cover 2359.

[0070] By using the clamping unit 235, the cell wafer S can be easily secured so that it can be attached to the first receiving stage 233a and detached from the first receiving stage 333a.

[0071] The second receiver stage 233b can be formed on the other side of the holder body at the top of the holder body, and can form a space for receiving the unit wafer S. The second receiver stage 233b can form a space to which the grid 237 is coupled in the form of an attachable and detachable structure at the top of the second receiver stage 233b. The unit wafer can be mounted on top of the grid 237. The grid 237 can be implemented using a general grid structure of various forms, which has the following structure: at least one support arm is formed on one side of the grid 237, and the unit wafer is mounted on the at least one support arm. A representative example of the grid 237 can be a crescent-shaped grid. That is, with the grid 237 fixed and formed in the second receiver stage 233b, the unit wafer S can be mounted on top of the support arm of the grid 237. In this case, the unit wafer mounted on top of the grid 237 can be processed to have a size of 0.1 to 20 μm, or it can be manufactured by additional processing of the unit wafer. Specifically, the unit wafer mounted at the top of grid 237 can be processed to have a size of several μm. The second receiving stage can fabricate samples for analysis (e.g., TEM analysis).

[0072] Therefore, the second receiving stage 233b can form a space in which samples extracted from the unit wafer and the grid are coupled in a connectable and detachable structure.

[0073] Furthermore, a fixing device for securing the mesh 237 can also be installed in the second receiving stage 233b. The fixing device can have the same structure as the clamping unit 235. Therefore, the mesh 237 can have a structure in which it is fixed to the clamping unit 235 on both side surfaces of the mesh 237.

[0074] The receiver holder 230 with this structure can provide a loading space for loading a cell wafer S to analyze the target wafer W using different methods.

[0075] The sample delivery unit 300 can deliver the target wafer W, the unit wafer S, the receiver holder that has been loaded with the unit wafer S, and the receiver holder that has been loaded with the sample AS for analysis.

[0076] Therefore, the sample delivery unit 300 may have a structure that includes a first delivery module to a third delivery module 310, 320 and 330.

[0077] The first transport module 310 functions to transport the target wafer W to the sample processing unit 100. The target wafer W can be transported by a transport container F, such as a front-opening wafer transfer box (FOUP). The first transport module 310 can transport the target wafer W, which has been transported by the transport container F, to the dicing device of the sample processing unit 100, so that the target wafer W undergoes dicing to form a unit wafer S.

[0078] In addition, the first transport module 310 can also perform the following functions: transporting and receiving the diced target wafer W in the wafer station 212 of the sample storage unit 200, separating the unit wafer S, and removing the residue on the target wafer W received in the wafer station 212. The residue on the target wafer W can be transported and stored in a separate storage space or discarded.

[0079] The first transport module 310 can be implemented by using a general-purpose wafer transport device of various forms for transporting the target wafer W for analysis, such as a wafer transport device equipped with a robotic arm.

[0080] The second transport module 320 functions to transport the unit wafer S and attach it to the receiving holder 230. The second transport module 320 can be implemented with a structure including: a vacuum chuck for picking up and separating the unit wafer S from the target analysis wafer W; a lifting member for moving the vacuum chuck up and down; and a transport member for transporting the vacuum chuck to the sample storage unit 200 where the receiving holder 230 has been received. When the vacuum chuck of the second transport module 320 secures the unit wafer S by vacuum adsorption, the lifting member can move the vacuum chuck upwards. The transport member transports the unit wafer S to the sample storage unit. Therefore, the unit wafer S can be pressurized or attached to the grid 237 at the top of the receiving holder 230. The second transport module 320 can be implemented using a general-purpose die pick-up device of various forms used to join multiple dies formed by dicing wafers. That is, the second conveying module 320 can be implemented by using a conveying device having a structure that is capable of: adsorbing the unit wafer S, moving upward to the upper side of the second conveying module 320, conveying the unit wafer S in the state of having picked up the unit wafer S, moving downward to attach the unit wafer S to the first receiving stage 233a or the second receiving stage 233b of the receiving holder, and pressurizing the unit wafer S.

[0081] In addition, the second delivery module 320 can also remove the sample AS for analysis from the receiver 230″ which has been loaded with the sample AS for analysis.

[0082] The second transport module 320 can be implemented using a chip transport device equipped with a universal vacuum chuck of various forms, which is used to separate semiconductor chips from wafers. It can also be implemented using a transport device with a structure that can adsorb unit wafers S, move to the upper side of the structure, transport unit wafers S while the structure has picked up unit wafers S, and move downward and pressurize unit wafers S to attach unit wafers S to the first receiving stage 233a or the second receiving stage 233b of the receiving holder.

[0083] The third transport module 330 can be configured to transport, between the processing unit of the sample processing unit 100 and the sample storage unit 200, a receiver holder 230' with a unit wafer S attached and a receiver holder 230″ with an analytical sample AS attached. Furthermore, the third transport module 330 can also transport the receiver holder 230″ loaded (stored in the sample storage unit 200) of the analytical sample AS to the sample analysis unit, and can also transport the receiver holder 230″ loaded with the analytical sample AS from the sample analysis unit after analysis processing.

[0084] The third conveying module 330 can be implemented by using a general-purpose article conveying device, including a robotic arm, which has various forms for conveying articles.

[0085] Furthermore, after performing the analysis process using the analysis sample AS, the third delivery module 330 can remove the receiver holder 230″ loaded with the analysis sample AS from the sample analysis unit and can deliver the removed receiver holder 230″ to the first loading area 211.

[0086] Therefore, the sample transport unit 300 can be implemented using a robotic arm, a device front-end module (EFEM) typically used for transporting wafers, a wafer transport device, a die pick-up device, or a conveyor belt. Sample transport units 300 can be installed in multiples in the system and can be configured to transport wafers, unit wafers S, and analytical samples AS in each component. At least one of the terminal module 520, the reading module 430, and the tag module 410 can be installed in each transport module 310, 320, and 330 of the sample transport unit 300. Therefore, the drive of the sample transport unit 300 can be controlled by a controller 500 to be controlled later.

[0087] A system for automated processing of samples for analysis, according to one embodiment, may include a sample classification unit 400.

[0088] The sample classification unit 400 can generate, store, and retrieve identification codes, which include unique identification information for each of the target wafer W, the unit wafer S, and the analysis sample AS. The unit wafer S and the analysis sample AS can be separately received and stored in the sample storage unit 200 based on their respective identification codes. The sample classification unit 400 can generate identification codes and assign them to the analysis samples, enabling the analysis samples to be identified. Therefore, the system 10 for automated processing of analysis samples according to one embodiment can automate the processes of wafer warehousing and manufacturing, receiving, and shipping analysis samples.

[0089] Therefore, the sample classification unit 400 may have a structure that includes a label module 410, a reading module 430, and a code generation module 450.

[0090] The tag module 410 can be installed on one side of the receiver holder 230 and can store the identification codes of the receiver holder 230, the cell wafer S, and the analysis sample AS.

[0091] In addition, the tag module 410 can be installed in the wafer holder used to transport the target wafer W for analysis, and can store the identification code of the target wafer W for analysis.

[0092] The identification code may include at least one of the following: the batch ID, wafer ID, lens ID, or receiver holder ID of the target wafer W; the processing history information or analysis scheme information of the analysis sample AS; and unique identification information, which includes a combination of the batch ID, wafer ID, lens ID, or receiver holder ID of the target wafer W and the processing history information or analysis scheme information of the analysis sample AS.

[0093] Typically, a semiconductor device manufacturing method may include cell processing for each batch of 25 wafers. Therefore, a batch ID can refer to identification information of a batch containing wafers. A wafer ID can be assigned when wafers are entered into the semiconductor device production line and can refer to identification information about which slot among 1 to 25 slots within the batch the target wafer has been installed. By using the batch ID and wafer ID, the origin of the target wafer can be tracked and its unique identification information can be used. A lens ID can indicate unique identification information, such as the separation position of the cell wafer manufactured by dicing. A receiving holder ID can include unique identification information of the holder and information indicating the position of the station within the holder or the position where the cell wafer has been loaded. Processing history information can include information indicating the processing history, about which process was used to process the sample for analysis. Analysis scheme information can include information identifying which analysis will be applied to the sample for analysis.

[0094] Tag module 410 can have the following forms, including barcodes, radio frequency identification (RFID) tags, English letters, and numbers. Tag module 410 cannot be implemented in physical form. For example, tag module 410 can be provided only in software form.

[0095] Specifically, the tag module 410 may include at least one of the following: an RFID tag, an IC chip, a barcode in which identification information is written, and a QR code in which identification information is written. Specifically, the tag module 410 can be implemented using an RFID tag or IC chip capable of near-field communication (NFC).

[0096] The tag module 410 can store identification codes. The identification tag can store identification codes based on the unique identification information of one or more of the cell wafer S to be identified and the analysis sample AS.

[0097] The reading module 430 can identify the identification code stored in the tag module 410 and can transmit the identified identification code to the controller 500 and the management server unit 600. The reading module 430 may have a structure including at least one tag reader connected to a communication network for transmitting the identification code.

[0098] The reading module 430 can be installed in each of the sample processing unit 100, the sample storage unit 200, and the sample delivery unit 300.

[0099] Specifically, the reading module 430 can be installed on one side of the processing device provided in the sample processing unit 100, and can identify the identification code of the tag module 410 that has been installed in the receiving holder 230, and can transmit the identified identification code to the controller 500 and the management server unit 600. Therefore, when the receiving holder 230 of the unit wafer S is transported to any of the processing devices included in the sample processing unit 100, the reading module 430 can identify the identification code of the tag module 410 that has been installed in the transported receiving holder 230, and can transmit the identified identification code.

[0100] Furthermore, the reading module 430 can be installed in the second transport module 320 included in the sample transport unit 300. Therefore, the reading module 430 can identify the identification code of the target analysis wafer W from the tag module 410, such as batch ID, wafer ID, or lens ID, which has already been installed in the target analysis wafer W during the separation of the unit wafer S from the diced target analysis wafer W. The reading module 430 can transmit the identified identification code, and can also identify the identification code in the receiving holder 230 during the loading of the unit wafer S onto the receiving holder 230. This allows the batch ID, wafer ID, or lens ID of the target analysis wafer W, as well as the identification information for the separation position of the unit wafer S, to be stored in the tag module 410 already installed in the receiving holder 230. The management server unit 600 can then generate inventory information indicating that the receiving holder with the loaded unit wafer S has been stored in the first receiving area.

[0101] Furthermore, the reading module 430 can be additionally installed in the third delivery module 330 included in the sample delivery unit 300. Therefore, if the second loading area 213 includes receiving spaces that have been divided into multiples, the analytical sample AS can be received in each category of receiving space based on the processing information of the receiving holder of the loaded analytical sample AS.

[0102] Furthermore, the reading module 430 can be installed in the sample storage unit 200. The reading module 430, already installed in the sample storage unit 200, can identify the identification code of the tag module of the receiving holder, on which the shipped cell wafer S has been loaded. Additionally, the reading module 430 can identify the identification code of the tag module of the receiving holder, on which the analytical sample AS processed in each processing device has been loaded. Therefore, inventory information can be generated and stored in the second receiving area.

[0103] More specifically, the reading module 430 can be provided together with the processing device or terminal module of the sample delivery unit. The receiver holder 230', which has been loaded with cell wafer S, can be delivered to a specific processing device based on processing information. When cell wafer S is placed in the corresponding processing device, the reading module 430 can read the identification information of cell wafer S from the tag module 410.

[0104] Specifically, the reading module 430 can continuously transmit reading signals to the transport path of the sample transport unit 300, along which the unit wafer S is transported. When the unit wafer S is positioned on the transport path, the reading module 430 can detect that the unit wafer S has been placed in a specific processing device based on the received reflected signal. Alternatively, if the tag module 410 attached to the receiver holder 230 is an active signal transponder, the reading module 430 can detect the tag module 410 by receiving signals from transponders positioned within a given distance.

[0105] Alternatively, the reading module 430 can be implemented using multiple readers, including an autofocus control device, a scanning camera, and a control program.

[0106] The identification code of the tag module 410, recognized by the reading module 430, can be transmitted to the management server unit 600 over at least one of a wired communication network and a wireless communication network. In this specification, communication methods via wired and / or wireless networks can include all communication methods by which an object can be networked, and this disclosure is not limited to wired communication, wireless communication, 3G, 4G, or other methods. Furthermore, this is the same as communication between the terminal module and the reading module or other devices, or communication between the system and the management server unit.

[0107] The management server unit 600 can store information such as analysis plans, batch information, and processing locations. Specifically, batch information may include wafer mapping information or analysis location information.

[0108] The code generation module 450 can generate identification codes that include various types of unique identification information, and can assign the generated identification codes to the tag module 410 that has been installed in the receiver holder, so that the generated identification codes are stored in the tag module 410. Since each of the unit wafer S and the analysis sample AS can be identified based on such identification codes, the loading and unloading of each of the unit wafer S and the analysis sample AS that has been received in the sample storage unit 200 can be automatically controlled.

[0109] Specifically, when the reading module 430, which has been installed in the processing device, identifies the identification code of the tag module 410, which has been installed in the receiving holder 230, after the processing device has performed the processing, the code generation module 450 can generate a new identification code and transmit the new identification code to the corresponding tag module 410 in order to update the processing information.

[0110] Although the analytical sample AS is manufactured by processing various types of unit wafers S (with different materials, manufacturing methods, or forms), the code generation module 450 can generate new identification codes based on the applied processing procedure and assign these new identification codes to the tag module 410, allowing each analytical sample AS to be identified. Therefore, the processes of warehousing multiple analytical target wafers W and manufacturing, transporting, and shipping analytical sample ASs can be automated.

[0111] More specifically, after the target wafer W is stored and diced, during the process of separating the unit wafers S and loading them onto the receiving holder 230, the reading module 430, already installed in the second transport module 320, can identify the tag module 410 already installed on one side of the target wafer W and the tag module 410 already installed in the receiving holder 230. Through this process, the code generation module 450 can identify the batch ID and wafer ID of the target wafer and the lens ID of the unit wafer, generate a first identification code, and assign the first identification code to the unit or tag module of the receiving holder.

[0112] Subsequently, the receiver holder 230', already loaded with unit wafer S, can be transported from the sample storage unit 200. This receiver holder can be delivered to the corresponding processing device based on the analysis scheme information of unit wafer S, and can be processed in the corresponding processing device. A reading module 430 can be mounted on one side of the processing device and can identify the tag module 410 attached to the receiver holder. After the processing is completed in the terminal module 520 of the processing device and a completion signal is generated, the tag module 410 of the receiver holder can be identified by the reading module 430 of the processing device during the process of the sample transport unit 300 transporting the receiver holder 230 from the processing device. The code generation module 450 can determine that the unit wafer has been processed in the corresponding processing device, generate a second identification code, and assign the second identification code to the tag module 410 of the receiver holder 230, so that the second identification code is stored in the tag module 410. By using a processing device, the generation of such a second identifier can be performed at each step of processing the unit wafer, such that information about all processing procedures already performed is included in the second identifier. Therefore, the identifier can include processing history information of the sample for analysis.

[0113] That is, the code generation module 450 can generate registration information indicating new records for each segment of processing of the target wafer W, unit wafer S, and analysis sample AS based on information from the target wafer W, unit wafer S, and analysis sample AS. It can additionally generate an identification code for each of the target wafer W, unit wafer S, and analysis sample AS by merging the registration information for each step, and can continuously assign the identification codes to the target wafer W, unit wafer S, and analysis sample AS. Therefore, according to one embodiment, the system 10 can automatically control the loading and unloading of the unit wafer S and analysis sample AS because the unit wafer S and analysis sample AS can be automatically identified based on their respective identification codes.

[0114] Figure 5 This is a block diagram illustrating the process of generating an identification code via a code generation module during the manufacture of samples for SEM analysis using a system that automates the processing of samples for analysis, according to one embodiment.

[0115] refer to Figure 5 In the dicing process P1, to create samples for SEM analysis, the target wafer W is first transported to the dicing apparatus of the sample processing unit 100. The reading unit A of the reading module, which is mounted on one side of the dicing apparatus, can identify the identification code of the target wafer W by recognizing the tag module 410 mounted on one side of the target wafer W, and can transmit the identified identification code. The management server unit 600 can receive the identification code and control the dicing apparatus to perform dicing processing on the target wafer W by transmitting processing signals to the terminal unit A of the terminal module 520, which is mounted on one side of the dicing apparatus of the sample processing unit 100.

[0116] In storage process P2, the analysis target wafer W, which has already undergone dicing, can be transported and received in the sample processing unit 100. In this case, the reading unit B, which is installed in the sample processing unit 100, can identify the identification code of the analysis target wafer W that has undergone dicing and can transmit the identified identification code to the management server unit 600.

[0117] Subsequently, the management server unit 600 can receive the identification code of the analysis target wafer W that has undergone dicing, generate a drive signal, and transmit the drive signal to the terminal unit B of the second transport module 320. The second transport module 320 can receive the drive signal, separate the unit wafer S from the analysis target wafer W that has undergone dicing, and load the separated unit wafer S onto the receiving holder 230. The reading unit B of the second transport module 320 can identify the identification code of the receiving holder 230', and can transmit the identified identification code to the management server unit 600 and the code generation module 450.

[0118] In this configuration, the management server unit 600 can transmit the analysis protocol information to the processing information generation module 540. The processing information generation module 540 can receive the analysis protocol information, generate individual processing information, and transmit the individual processing information to the terminal unit C of the indentation device, the terminal unit D of the ion cleaning device, and the terminal unit of the third delivery module in the sample processing unit 100.

[0119] Subsequently, during the indentation process P3, the terminal unit of the third transport module 330 can receive individual processing information and can transport the receiving holder 230' from the sample storage unit 200. This receiving holder has already loaded the unit wafer corresponding to the individual processing information. The receiving holder 230' can be transported to the indentation device, which has already loaded the transported unit wafer. The first analytical sample can be manufactured by performing an indentation process on the unit wafer. The reading unit C of the indentation device can identify the identification code of the receiving holder 230' that has loaded the unit wafer and can transmit the identified identification code to the management server unit 600. The management server unit can store the received identification code, can generate a new identification code related to the indentation process via the code generation module 450, and can transmit the new identification code to the tag module 410 that has loaded the corresponding analytical sample, so that the new identification code is stored in the tag module 410. The identification code of the first analytical sample may include the indentation process number, wheel specification, etc.

[0120] Subsequently, during the ion milling process P4, the third transport module 330 can remove the receiving holder 230″ loaded with the first analytical sample from the indentation device and transport the receiving holder 230″ to the ion cleaning device. The first analytical sample can undergo ion milling and be manufactured into a second analytical sample. The reading unit D, which has been installed on one side of the indentation device, can transmit the identification code of the second analytical sample. The management server unit 600 can receive and store the corresponding identification code. The code generation module 450 can generate a new identification code related to the indentation process and can transmit the new identification code to the tag module 410 loaded with the second analytical sample, so that the new identification code is stored in the tag module 410. The unique identification information of the second analytical sample may include information about whether ion milling has been performed, processing number, etc.

[0121] A system for automated processing of samples for analysis, according to one embodiment, may include a controller 500.

[0122] The controller 500 can control the operation of the sample processing unit 100, sample storage unit 200, sample transport unit 300, and sample classification unit 400 based on identification codes. Therefore, the processing of samples for analysis can be automated.

[0123] The controller 500 may have a structure that includes a communication module 510, a terminal module 520, a management module 530, and a processing information generation module 540.

[0124] The communication module 510 can receive the identification code identified in the reading module 430, and can transmit the received identification code to the management module 530, the information generation module 540, and the management server unit. The communication module 510 can form a structure for transmitting and receiving identification codes, processing information, and analyzing scheme information.

[0125] Through communication with the terminal module 520 included in one or more process steps, the communication module 510 can receive information read by the reading module 430 from the tag module 410, which has been attached to the receiving holder 230′ or 230″. In this case, the identification code read from the tag module 410 may include: identification information of the cell wafer and the analysis sample; and information such as the history or current state of the processing procedures already performed on the cell wafer and the analysis sample, or the type or characteristics of the process that needs to be performed subsequently.

[0126] Terminal module 520 can be installed in the processing device of sample processing unit 100 and can function as follows: receiving individual processing information generated by processing information generation module 540 and individually controlling each processing device to execute the processing procedure. When the processing procedure is completed in the processing device, terminal module 520 can generate a completion signal and transmit the completion signal to code generation module 450. Code generation module 450 can be configured to transmit the generated new identification code to tag module 410 and management server unit 600, so that the identification code is stored in tag module 410 and management server unit 600. Terminal module 520 can be provided in multiple forms to correspond to multiple processing devices.

[0127] The terminal module 520 can be installed on one side of the sample delivery unit 300, and can receive and process information, as well as control the drive of the sample delivery unit 300.

[0128] Specifically, when receiving individual processing information from the processing information generation module 540, the terminal module 520 can deliver the receiving holder 230' to the corresponding processing device based on the individual processing information, on which the unit wafer corresponding to the individual processing information has been loaded.

[0129] Furthermore, when processing of a cell wafer is completed based on individual processing information, the terminal module 520 can transport the receiver holder 230″ that has been loaded with analytical sample AS to the sample storage unit 200, and can receive the receiver holder 230″ that has been loaded with analytical sample AS of each category in the second loading area 213 based on individual processing information.

[0130] Furthermore, the terminal module 520 can be configured to receive a transmission signal from the sample analysis unit, which will be described later, and to transmit a receiver holder 230″ to the sample analysis unit, on which the corresponding sample for analysis has been loaded.

[0131] The management module 530 can collect and store management information on the number of receiver holders 230′ (with cell wafers already loaded) and receiver holders 230″ (with samples for analysis already loaded) received in the sample storage unit 200. The management module 530 can be installed on one side of the sample storage unit 200.

[0132] Furthermore, by identifying the identification code of the receiver holder 230″ (which has been loaded with analytical samples from the read module 430 installed in the sample storage unit 200), the management module 530 can collect and store management information on the number of receiver holders 230″ that have been loaded with analytical samples.

[0133] The information generation module 540 can perform the following functions: generate individual processing information for the unit wafer S based on the identification code, and transmit the generated individual processing information to the terminal module 520, the management module 530, and the sample delivery unit 300.

[0134] Therefore, the processing order of the unit wafer S can be determined before processing it in the sample processing unit 100. By processing the unit wafer S using at least one processing method based on individual processing information, an analytical sample AS can be manufactured.

[0135] Specifically, when the management server unit receives the identification code from the reading module 430 and generates and transmits the analysis scheme information, the processing information generation module 540 can receive the analysis scheme information and generate separate processing information.

[0136] Individual processing information can define the type of processing procedure to be performed on a cell wafer in the future, or it can define characteristics associated with the corresponding processing procedure, such as the number of parts processed, the size, or the processing method.

[0137] The analysis scheme information may include information about the analysis method for the target wafer W. The analysis sample AS can be manufactured by processing the unit wafer S using different methods based on the analysis scheme information. Therefore, the processing information generation module 540 can generate different processing information based on the analysis scheme information. That is, the analysis scheme information may include information about how the target wafer W will be analyzed.

[0138] Furthermore, the processing information generation module 540 can be configured to generate individual processing information by adjusting at least one of the processing procedure, processing method, processing location, and processing quantity of unit wafers based on the analysis scheme information collected by the management module 530 and information about the number of unit wafers S. Additionally, the processing apparatus of the sample processing unit 100 can adjust the processing location and processing method. Furthermore, the sample transport unit 300 can transport unit wafers to the sample processing unit 100 based on the processing quantity.

[0139] Therefore, the communication module 510 can transmit the separately processed information generated by the processing information generation module 540 back to the terminal module 520. The processing device with the corresponding terminal module 520 installed can be configured to process the corresponding unit wafer S.

[0140] Furthermore, separately processed information can be transmitted to the terminal module 520 of the sample delivery unit 300. Therefore, the receiver holder 230', which has been loaded with the corresponding cell wafer S, can be delivered to the processing device that has been equipped with the terminal module 520.

[0141] In addition, the processed information can be transmitted to the terminal module 520 that has been installed in the sample storage unit 200, so that it can be determined whether the corresponding unit wafer S has been shipped out and the inventory information can be changed.

[0142] Furthermore, the communication module 510 can transmit the individual processing information generated by the processing information generation module 540 back to the terminal module 520. The terminal module 520 can output a processing signal, enabling the corresponding processing device in the corresponding processing step to execute the processing procedure. In this case, individual processing information can be transmitted to one or more devices set in the processing step, which corresponds to the terminal module 520 that has already transmitted (read from the tag module 410) information.

[0143] The controller 500 may include a check module 550. The check module 550 may be mounted on one side of the processing device of the sample processing unit 100. The check module 550 can identify the status of the sample processing unit 100. When the status of the sample processing unit 100 is identified as a drive state, a periodic check state, or a fault state, the check module 550 can generate a wait signal and transmit the wait signal to the sample transport unit 300, causing the sample transport unit 300 to be controlled to maintain a command wait state based on a preset time value, without performing transport processing.

[0144] The inspection module 550 can be implemented by using a vibration sensor, a weight detection sensor, or a combination of a vibration sensor and a weight detection sensor, and can also be implemented by introducing various sensors other than those mentioned above.

[0145] The controller 500 may include an input module 560. The input module 560 is a component that enables users to input analysis scheme information or allows administrators to input various types of update information to control the system 10. When a user inputs control information for system control, the input module 560 can transmit the control information to the management server unit 600. The management server unit 600 can store the analysis scheme information and control information, and can control the system's drives.

[0146] For example, when a user instructs the creation of a large-area sample for SEM analysis via input module 560, controller 500 can control the operation of each component, so that the sample for SEM analysis is created and stored. Input module 560 can be implemented using a keyboard, dome switch, touchpad, jog wheel, or jog switch.

[0147] According to one embodiment, a system 10 for automated processing of samples for analysis may include a controller 500 having components, and may integrate and manage processes for manufacturing and transporting unit wafers and samples for analysis.

[0148] A system 10 for automated processing of samples for analysis, according to one embodiment, may include a management server unit 600. The management server unit 600 may function to store and transmit identification codes, individually process information, analysis scheme information, and values ​​input by the user; and to integrate and manage various types of information. The management server unit 600 may be implemented as an analysis request calculation system. The analysis request calculation system may have multiple S / Ns. Such information may include analysis scheme information and may include information associated with FABs, such as the required location or batch information for analysis of the target wafer. Furthermore, the management server unit 600 may be applied to or skip processing procedures, and may be used to ship, transport, process, and analyze target wafers in the wafer storage area based on said information.

[0149] The system 10 for automated processing of samples for analysis, according to one embodiment, may further include a processing and testing unit.

[0150] The processing inspection unit can be installed between the sample processing unit 100 and the sample storage unit 200, and can identify the processing location coordinates and whether defects have appeared in the analytical sample AS transported by the sample delivery unit 300. These defects may include contamination, scratches, debris, or cracks.

[0151] If a defect is detected in the analytical sample AS, the processing inspection unit can execute controls to discard the analytical sample AS instead of receiving it in the sample storage unit 200. The processing inspection unit can be implemented using an optical microscope or an analytical apparatus.

[0152] According to one embodiment, the components of a system 10 for automated processing of samples for analysis can be formed into a structure that transmits and receives various types of information and is controlled by connecting to a communication network in a wired or wireless manner.

[0153] Furthermore, according to one embodiment, the system for automated processing of samples for analysis may also include a manager terminal unit that receives drive status and task information of the sample processing unit, the sample storage unit, and the sample delivery unit.

[0154] The manager terminal unit can monitor the system 10 in real time by receiving the status information of each processing device of the sample processing unit 100 and the task information of the processing process executed in the processing device. It can also enable the manager to take immediate action by inputting control commands to the controller 500 when an error occurs, so that the drive of the sample processing unit 100 can be controlled.

[0155] A system for automated processing of samples for analysis, according to one embodiment, can provide various services via wireless or wired communication connections between multiple processing devices, a manager terminal unit (or client), and a management server unit. The manager terminal unit can be a personal computer (PC), including a desktop computer, tablet computer, or laptop computer, and can be a mobile personal communication device, such as a smart device including a personal digital assistant (PDA), mobile phone, or smartphone. A data generation unit for generating status and task information can be installed in each processing device. The processing device can include multiple sensors for the data generation unit. Therefore, measurements detected by the sensors can be provided to the data generation unit. The data generation unit can generate status and task information for the processing devices and can transmit the status and task information to the management server unit. The management server unit can transmit the status and task information to the manager terminal unit, enabling the manager to identify the status of the processing devices in real time.

[0156] The measurements detected by the sensors may include: the operating or wear status of each part of the processing device, the steps performed during the processing, and the defect status and process status of the processing.

[0157] A unique identifier can be assigned to a processing unit. The data generation unit can transmit status and task information generated based on sensor measurements, as well as the device identifier, allowing the administrator to check: which processing unit within the sample processing unit is defective, what the process status is, or which processing procedure is being executed via the manager terminal unit.

[0158] According to one embodiment, the system 10 for automated processing of samples for analysis can quickly provide analytical results through unmanned automation of the wafer processing process, which can enhance the competitiveness of analytical technology and reduce the manpower, cost and time consumption for sample processing.

[0159] Figure 6 This is a structural diagram illustrating an automated wafer analysis system according to one embodiment.

[0160] refer to Figure 6According to one embodiment, the automated wafer analysis system 20 may have a structure including a sample processing unit 100, a sample storage unit 200, a sample transport unit 300, and a sample analysis unit 700.

[0161] The sample processing unit 100, sample storage unit 200 and sample delivery unit 300 have the same structure as those components of the system 10 for automated processing of samples for analysis, and detailed descriptions of the sample processing unit 100, sample storage unit 200 and sample delivery unit 300 are omitted.

[0162] The first loading area 211 of the sample storage unit 200 provides space for analyzing the receiver 230″ of the sample AS that has been loaded with the analysis sample AS after analysis using the analysis scheme. The first loading area 211 also provides space for removing the analysis sample AS after analysis from the receiver 230″. Therefore, the receiver 230″ of the sample AS that is not yet loaded with the cell wafer S or the analysis sample AS can be held in the first loading area 211.

[0163] Furthermore, the second transport module 320 of the sample transport unit 300 can separate the analytical sample AS from the clamping unit 235 by pressurizing the analytical sample AS, or can remove the analytical sample AS from the grid 237 by separating the analytical sample AS.

[0164] The second delivery module 320 may have a structure in which the reading module 430 and the terminal module 520 are already installed. Therefore, the identification code of the tag module 410 already installed in the receiver holder 230 can be identified. The code generation module can be configured to generate a new identification code and transmit the new identification code to the tag module 410 corresponding to that identification code, so that the receiver holder 230, even if it is not yet loaded with cell wafers and analysis samples, can be reused.

[0165] The sample analysis unit 700 may include at least one analysis device and may analyze the analytical sample AS transported from the sample storage unit 200 based on analysis scheme information.

[0166] The sample analysis unit 700 may include various general-purpose analysis devices used for wafer analysis.

[0167] Specifically, the sample analysis unit 700 can analyze the sample for analysis using at least one of the following methods: electron microscopy analysis using scanning electron microscopy (SEM) and / or transmission electron microscopy (TEM), focused ion beam (FIB) analysis, secondary ion mass spectrometry (SIMS), atomic force microscopy (AFM) analysis, scanning probe microscopy (SPM) analysis, X-ray photoelectron spectroscopy (XPS), ion scattering spectroscopy (ISS), photoelectron emission microscopy (PEEM) analysis, Auger electron spectroscopy, low-energy electron diffraction (LEED) analysis, reflected high-energy diffraction (RHEED) analysis, and electron energy loss spectroscopy (EELS).

[0168] The sample analysis unit 700 can examine defects in the target wafer by analyzing the sample AS, thereby enabling improvements to the wafer manufacturing method.

[0169] The sample delivery unit 300 can be included in the reading module 430. The sample delivery unit 300 can identify the analytical sample AS based on the identification tag of the tag module 410, and can deliver the analytical sample AS to a specific device in the sample analysis unit 700, as well as between the devices constituting the sample analysis unit 700. Therefore, all processes for wafer analysis can be automated.

[0170] In addition, the controller 500 may also include a detection module 570, which identifies the status of the sample analysis unit 700. When the status of the sample analysis unit 700 is identified as a driving state, a periodic inspection state, or a fault state, the detection module 570 can generate a wait signal to perform control, causing the sample delivery unit 300 to maintain a wait state based on a preset time value and stop supplying the sample AS for analysis to the sample analysis unit 700.

[0171] According to one embodiment, the automated wafer analysis system 20 may include all sample classification units 400, controllers 500, management server units 600, processing and inspection units, and power supply units.

[0172] Figure 7 This is a process diagram illustrating a method for processing an analytical sample according to one embodiment.

[0173] refer to Figure 7 A method for processing an analysis sample according to one embodiment may include: a first processing step S100, a first storage step S200, a second processing step S300, and a second storage step S400.

[0174] The first processing step S100 may be the following steps: transporting the target wafer W to the sample processing unit 100 and forming multiple unit wafers S by performing a dicing process on the target wafer W.

[0175] Specifically, in this step, the target wafer W can be transported to a transport container such as a FOUP. The target wafer W can be transported to the sample processing unit 100 via the sample transport unit 300. The sample processing unit 100 can manufacture multiple unit wafers S by performing a dicing process on the target wafer W.

[0176] The first storage step S200 may be the following steps: separating the unit wafer S from the analysis target wafer W, and holding the unit wafer S by loading it onto the receiver holder 230 received in the sample storage unit 200.

[0177] Specifically, the unit wafer S can be separated from the analysis target wafer W via the sample delivery unit 300 and can be transported to the first loading area 211 where the receiver holder 230 has been received. With the unit wafer S already positioned on the first receiver stage 233a or the second receiver stage 233b of the receiver holder 230, the unit wafer S can be lowered and secured to the first receiver stage 233a or the second receiver stage 233b. In this case, the unit wafer S can be loaded onto the receiver holder 230 by applying pressure to the clamping unit 235 already formed in the first receiver stage 233a, or by securing the unit wafer S to the grid 237 already secured to the top of the second receiver stage 233b. The receiver holder 230' with the unit wafer loaded can be stored in the first loading area 211.

[0178] In addition, the first storage step S200 may also include the following steps: storing the receiving holder of the loaded cell wafer; and determining by the inspection module 550 whether the cell wafer S can be processed in the sample processing unit 100 when generating the corresponding cell wafer dispatch signal based on individual processing information.

[0179] The inspection module 550 can identify the status of the sample processing unit 100 and perform control by generating a wait signal when the sample processing unit 100 is in a drive state, a periodic inspection state, or a fault state, and transmitting the wait signal to the sample transport unit 300, causing the sample transport unit 300 to maintain a command wait state based on a preset time value without performing transport processing. Subsequently, the inspection module 550 can determine and select which analytical device in the sample analysis unit 700 the analytical sample will be transported to based on the identification code.

[0180] The second processing step S300 may be the following steps: taking out the receiver holder 230' that has been loaded with the unit wafer S from the sample storage unit 200, transporting the receiver holder 230' to the sample processing unit 100, and manufacturing an analytical sample AS by processing the unit wafer S.

[0181] In this step, the sample transport unit 300 can receive individual processing information generated by the processing information generation module 540, can transport the receiving holder 230' that has been loaded with the unit wafer S corresponding to the individual processing information from the sample storage unit 200, and can transport the receiving holder 230' that has been loaded with the corresponding unit wafer to the processing device corresponding to the individual processing information.

[0182] Furthermore, the terminal module 520 of the sample processing unit can recognize the individual processing information generated by the processing information generation module 540, and can process the receiving holder 230' that has been loaded with the corresponding unit wafer. In this step, an analytical sample AS can be manufactured by processing the unit wafer S using at least one processing method. The unit wafer S can be processed based on the individual processing information already generated by the processing information generation module 540.

[0183] The second storage step S400 may be the following steps: transporting the receiver holder 230″ which has been loaded with the sample AS for analysis, and receiving the receiver holder 230″ in the second loading area 213 of the sample storage unit.

[0184] In this step, the receiver holder 230″, which has already loaded the processed analytical sample, can be received. The tag module 410, which has been installed in the receiver holder, can identify the identification code of the analytical sample. This identification code can be stored in the management module 530.

[0185] Analytical samples AS can be manufactured using automated methods. When the sample delivery unit 300 receives an output signal for analysis from the management module 530, the sample delivery unit 300 can deliver the receiver holder 230″, which is already loaded with the manufactured analytical sample AS, to the sample analysis unit 700. The sample analysis unit 700 can perform analysis on the analytical sample AS.

[0186] Figure 8 This is a flowchart illustrating the detailed process of processing steps in a method for processing an analytical sample according to one embodiment.

[0187] refer to Figure 8More specifically, a method for processing a unit wafer is described according to one embodiment. First, the target analysis wafer W can be stored in a wafer transport container such as a FOUP. The stored target analysis wafer W can be transported to a sample processing unit 100. The sample processing unit 100 can perform a dicing process on the target analysis wafer W.

[0188] Subsequently, the analysis target wafer W, which has already undergone dicing, can be received in the wafer station 212 of the sample storage unit. Cell wafers S can be selected and separated from the analysis target wafer W (which has already been received in the wafer station 212). The separated cell wafers S can be loaded onto the receiving holder 230. Therefore, the cell wafers S can be stored in the sample storage unit 200.

[0189] Subsequently, the receiver holder 230, on which the unit wafer S has been loaded and stored, can be removed from the sample storage unit 200. The sample processing unit 100 can then process the unit wafer S to manufacture an analytical sample AS. The manufactured analytical sample AS is in a state where it has been loaded onto the receiver holder 230″. As described above, the receiver holder 230″ on which the analytical sample AS has been loaded can be transported to the sample storage unit 200 and received and stored in the sample storage unit 200.

[0190] As described above, in the step of separating the unit wafer S from the target wafer W, the tag module already installed on one side of the target wafer W can identify the identification code of the target wafer W. The identification code can be performed by the second transport module 320. The second transport module 320 can transport and load the separated unit wafer S onto the receiving holder 230. In this process, the identification code can be identified from the tag module 410 already installed in the receiving holder 230, and the identification code can be transported. In this case, the reading module 430 can transmit the identified identification code to the processing information generation module 540 and the management server unit 600.

[0191] Subsequently, a new identification code can be generated based on the identification code of the target wafer W and the identification code of the receiver holder 230, and can be transmitted and stored in the tag module 410 of the receiver holder.

[0192] The identification code of the target wafer W may include the batch ID, wafer ID, and lens ID of the target wafer. The identification code of the receiver holder 230 may include: unique identification information of the receiver holder, and identification information indicating the positions of the first receiver stage 233a and the second receiver stage 233b in the receiver holder 230.

[0193] Therefore, a new identifier can be generated based on the identifier of the target wafer W and the identifier of the receiver holder 230, and this new identifier can be stored in the tag module 410 of the receiver holder 230' already loaded with the unit wafer S. That is, the new identifier can refer to the identifier of the unit wafer S, which includes both the identifier of the target wafer W and the identifier of the receiver holder 230.

[0194] Subsequently, the management server unit 600 can identify and analyze the identification code of the target wafer W, generate analysis scheme information based on the identified identification code, and transmit the generated analysis scheme information to the processing information generation module 540. The processing information generation module 540 can generate individual processing information based on the analysis scheme information and transmit the generated individual processing information.

[0195] Furthermore, the target analysis wafer W, which has already undergone dicing, can then be received in the wafer station 212 of the sample storage unit. Cell wafers S can be selected and separated from the target analysis wafer W (which has already been received in the wafer station 212). The separated cell wafers S can then be loaded onto the receiving holder 230.

[0196] When the processing of the cell wafer is completed, the terminal module 520 can generate a completion signal and transmit it to the code generation module 450. The code generation module 450 can generate a new identification code including processing information, and can store the new identification code in the tag module 410 of the receiver holder 230' that has been loaded with the cell wafer. An analysis sample AS can be manufactured by performing such a process at least once.

[0197] More specifically, the second processing step S300 can be performed by breaking it down into the following steps.

[0198] First, the processing procedure for the cell wafer to be processed can be selected by identifying the analysis scheme information in the identification code, which has been identified from the tag module of the receiving holder 230' that has already loaded the cell wafer. The cell wafer can be transported to the processing device indicated in the analysis scheme information. The processing procedure can be performed on the cell wafer. For example, in order to manufacture a large-area sample for SEM analysis, a first analytical sample can be manufactured by performing an indentation process on the cell wafer to be processed. Identification information of the first analytical sample can be stored. The identification information of the first analytical sample may include the indentation process number and the wheel specification.

[0199] Subsequently, after the first analytical sample is transported to the ion cleaning apparatus, a second analytical sample can be manufactured by performing an ion cleaning process on the first analytical sample. The unique identification information of the second analytical sample can then be stored. This unique identification information may include: whether an ion cleaning process has been performed; and a processing number. An identification code for the second analytical sample can be generated based on the unique identification information, and this identification code can be stored and assigned to the second analytical sample.

[0200] According to one embodiment, a system and method for automating the processing of analytical samples can rapidly provide analytical results, enhance the competitiveness of analytical techniques, and reduce the manpower, cost, and time required for sample processing by automating all processes, including: wafer warehousing, sample processing, and the process of allocating samples for each analysis based on identification codes.

[0201] Furthermore, although manufacturers use different processing devices, automated systems can be achieved by introducing standardized receiver holders and adjusting the processing equipment according to the standards of the receiver holders to process samples for analysis.

[0202] Therefore, systems for automated processing of analytical samples can be used to process analytical samples used for wafer analysis in the semiconductor, solar energy, and display industries.

[0203] A detailed description of preferred embodiments of the present disclosure as disclosed above has been provided to enable those skilled in the art to implement and practice the present disclosure. Although the invention has been described with reference to preferred embodiments, those skilled in the art will understand that the present disclosure can be modified and changed in various ways without departing from its scope. For example, those skilled in the art can use each element described in the embodiments in a manner that combines the elements. Therefore, the present disclosure is not intended to be limited to the described embodiments, but is intended to allocate the widest scope consistent with the disclosed principles and novel features.

Claims

1. A system for automated processing of samples for analysis, the system comprising: A sample processing unit manufactures multiple unit wafers by dicing an analytical target wafer and manufactures analytical samples by processing the unit wafers via at least one processing step. A sample storage unit in which a loading area has been formed, a receiving holder is transported into and out of the loading area, and the unit wafer and the analytical sample have been loaded on the receiving holder; as well as A sample delivery unit, which transfers the target wafer, the unit wafer, and the analytical sample between the sample processing unit and the sample storage unit. The receiver holder includes: A holder body that supports the unit wafer and the analytical sample below the unit wafer and the analytical sample; A first receiving stage is formed on one side of the holder body at the top of the holder body, forming a space, and the unit wafer is coupled to the space in an attachable and detachable configuration. The first receiving stage includes a clamping unit, which includes: A fixing groove is inserted into and formed on one side of the holder body on the upper side of the holder body; A support plate is installed in the fixing groove, and the unit wafer is seated on the top of the support plate and the shaft is formed at the bottom of the support plate. An elastic member, which is mounted along the outer circumferential surface of the axis; An elastic clip, the elastic clip being fitted with a capture protrusion formed to protrude from the inner wall of the fixing groove; When pressure is applied to the top of the support plate, the capture protrusions extend to both sides of the elastic clamp; when the pressure is released, the capture protrusions return to their original position. When the top of the unit wafer located in the first receiving stage is pressurized, the capture protrusion extends to both sides of the elastic clamp, the support plate rises, and the unit wafer is transported out of the fixing groove.

2. The system according to claim 1, wherein, The sample processing unit processes the unit wafer by using at least one of the following processing devices: a cutting device, an indentation device, an ion milling device, a polishing device, a coating device, a grinding device, a cleaning device, and a punching device.

3. The system according to claim 1, wherein, The receiver holder further includes: A second receiving stage is formed on the other side of the holder body at the top of the holder body, and forms a space in which the grid of the unit wafers is mounted is coupled to the space in an attachable and detachable structure.

4. The system according to claim 1, in, The clamping unit secures the unit wafer to its upper side, and the clamping unit further includes a cover holder. The cover is inserted into and coupled to the inner wall of the fixing groove to form a movable space in which the elastic clamp moves, wherein an exposure hole is formed in the cover so that the capture protrusion is exposed on one side of the cover at the top of the cover.

5. The system according to claim 3, wherein, The sample storage unit includes: A first loading region, in which the receiver holder is stored, and the first loading region forms a space in which the cell wafer is coupled to at least one of a first receiving stage and a second receiving stage of the receiver holder; and A second loading area forms a space in which the analytical sample is transported into and out.

6. The system according to claim 1, wherein, The sample delivery unit includes: A first delivery module, which delivers the target wafer for analysis to the sample processing unit; A second delivery module, which delivers the unit wafer and attaches the unit wafer to the receiving holder; and The third delivery module delivers the unit wafer to the sample processing unit.

7. The system according to claim 1 further includes a sample classification unit, the sample classification unit comprising: A tag module is installed on one side of the receiver holder and stores the identification code of the unit wafer and the identification code of the receiver holder; A reading module that identifies the identification code already stored in the tag module; and The code generation module generates the identification code and transmits the generated identification code to the tag module.

8. The system according to claim 7, wherein, The identification code includes at least one of the following: the batch ID of the unit wafer, the wafer ID of the unit wafer, the lens ID and the receiver holder ID, as well as the processing history information and analysis scheme information of the sample used for analysis.

9. The system according to claim 7, wherein, The label module includes at least one of the following: an electronic label, an IC chip, a barcode, and a QR code, wherein identification information has been written into the barcode and the identification information has been written into the QR code.

10. The system of claim 7, further comprising a controller, the controller comprising: A communication module that transmits and receives identification codes recognized by the reading module; A terminal module is installed in the sample processing unit and receives individual processing information and performs control to cause the processing to be executed. The management module stores the identification codes of the unit wafers and analytical samples that have been received in the sample storage unit, and manages the import and export of the unit wafers and analytical samples that have been received in the sample storage unit. as well as The processing information generation module generates individual processing information for the unit wafer based on the identification code, and transmits the generated individual processing information to the terminal module, the management module, and the sample delivery unit. The controller controls the operation of the sample processing unit, the sample storage unit, and the sample delivery unit based on the identification code.

11. The system according to claim 10, wherein, The processing information generation module is configured to generate the processing information by receiving the analysis scheme information when the management server generates the analysis scheme information of the unit wafer based on the identification code and transmits the generated analysis scheme information.

12. The system according to claim 11, wherein, The processing information generation module is configured to generate the individual processing information by adjusting at least one of the processing status, processing position, and processing quantity of the unit wafer, based on the analysis scheme information and quantity information of the unit wafer already collected by the management module.

13. The system according to claim 10, wherein, The controller includes an inspection module that identifies the status of the sample processing unit. When the status of the sample processing unit is identified as a driving state, a periodic inspection state, or a fault state, the inspection module controls the sample delivery unit to maintain a command waiting state based on a preset time value by generating a waiting signal.

14. The system according to claim 1 further includes a manager terminal unit, the manager terminal unit receiving the drive status and task information of the sample processing unit, the sample storage unit, and the sample delivery unit.

15. An automated wafer analysis system, comprising: A sample processing unit manufactures multiple unit wafers by dicing an analytical target wafer, and manufactures analytical samples by processing the unit wafers through at least one processing step. A sample storage unit in which a loading area has been formed, a receiving holder is transported into and out of the loading area, and the unit wafer and the analytical sample have been loaded on the receiving holder; A sample analysis unit that analyzes the analytical sample transported from the sample storage unit; as well as A sample delivery unit, which transfers the target wafer, the unit wafer, and the analytical sample between the sample processing unit and the sample storage unit. The receiver holder includes: A holder body that supports the unit wafer and the analytical sample below the unit wafer and the analytical sample; A first receiving stage is formed on one side of the holder body at the top of the holder body, forming a space, and the unit wafer is coupled to the space in an attachable and detachable configuration. The first receiving stage includes a clamping unit, which includes: A fixing groove is inserted into and formed on one side of the holder body on the upper side of the holder body; A support plate is installed in the fixing groove, and the unit wafer is seated on the top of the support plate and the shaft is formed at the bottom of the support plate. An elastic member, which is mounted along the outer circumferential surface of the axis; An elastic clip, the elastic clip being fitted with a capture protrusion formed to protrude from the inner wall of the fixing groove; When pressure is applied to the top of the support plate, the capture protrusions extend to both sides of the elastic clamp; when the pressure is released, the capture protrusions return to their original position. When the top of the unit wafer located in the first receiving stage is pressurized, the capture protrusion extends to both sides of the elastic clamp, the support plate rises, and the unit wafer is transported out of the fixing groove.

16. The wafer analysis automation system according to claim 15 further includes a detection module, the detection module being configured to: generate a waiting signal when the state of the sample analysis unit is identified as a driving state, a periodic inspection state, or a fault state, and the detection module being configured to: identify the state of the sample analysis unit, such that the sample delivery unit maintains a waiting state based on a preset time value, and stops supplying the analysis sample to the sample analysis unit.

17. The automated wafer analysis system according to claim 15, wherein, The sample analysis unit analyzes the sample to be analyzed using one or more methods selected from the group consisting of: electron microscopy, focused ion beam analysis, secondary ion mass spectrometry, atomic force microscopy, scanning probe microscopy, X-ray photoelectron spectroscopy, ion scattering spectroscopy, Auger electron spectroscopy, low-energy electron diffraction analysis, photoelectric emission microscopy, high-energy reflection diffraction analysis, and electron energy loss spectroscopy.

18. A method for processing a sample for analysis, the method comprising: The first processing step involves transporting the target wafer for analysis to the sample processing unit and forming multiple unit wafers by performing a dicing process on the target wafer for analysis. In the first storage step, the unit wafer is separated from the target analysis wafer, and the unit wafer is loaded and held in a receiving holder that has been received in the sample storage unit. The second processing step involves removing the receiver holder, which has been loaded with the unit wafer, from the sample storage unit, delivering the receiver holder to the sample processing unit, and processing the unit wafer based on an identification code in a manner corresponding to individual processing information to manufacture an analytical sample. as well as The second storage step involves conveying the receiver holder already loaded with the analytical sample and receiving the receiver holder in the sample storage unit. The receiver holder includes: A holder body that supports the unit wafer and the analytical sample below the unit wafer and the analytical sample; A first receiving stage is formed on one side of the holder body at the top of the holder body, forming a space, and the unit wafer is coupled to the space in an attachable and detachable configuration. The first receiving stage includes a clamping unit, which includes: A fixing groove is inserted into and formed on one side of the holder body on the upper side of the holder body; A support plate is installed in the fixing groove, and the unit wafer is seated on the top of the support plate and the shaft is formed at the bottom of the support plate. An elastic member, which is mounted along the outer circumferential surface of the axis; An elastic clip, the elastic clip being fitted with a capture protrusion formed to protrude from the inner wall of the fixing groove; When pressure is applied to the top of the support plate, the capture protrusions extend to both sides of the elastic clamp; when the pressure is released, the capture protrusions return to their original position. When the top of the unit wafer located in the first receiving stage is pressurized, the capture protrusion extends to both sides of the elastic clamp, the support plate rises, and the unit wafer is transported out of the fixing groove.

19. The method according to claim 18, wherein, In the first storage step, in the step of separating the unit wafer from the analysis target wafer and loading the separated unit wafer, the identification codes of the analysis target wafer, the unit wafer, and the receiving holder are identified, a new identification code and analysis scheme information are generated based on the identification code, and individual processing information of the unit wafer is generated based on the analysis scheme information and the individual processing information is transmitted to the sample processing unit and the sample storage unit.

20. The method according to claim 19, wherein, In the second processing step, the sample delivery unit receives the individual processing information, transports the unit wafer corresponding to the new identification code from the sample storage unit and delivers the unit wafer to the sample processing unit, and the sample processing unit receives the individual processing information and processes the unit wafer to manufacture an analytical sample.

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