Component testing fixture

Abstract

This application provides a component testing fixture, including an additional circuit board, a signal feeder, and a metal conductive element. The additional circuit board defines a support surface. The signal feeder is fixed to the additional circuit board and includes a first transmission element and a second transmission element. The metal conductive element is disposed on the support surface and includes an electrically insulated first conductive element and a second conductive element, the first conductive element being electrically connected to the first transmission element, and the second conductive element being electrically connected to the second transmission element. The support surface defines a sensing area, and the metal conductive elements within the periphery of the sensing area are not coplanar with the metal conductive elements outside the periphery of the sensing area.

Description

Technical Field

[0001] This application relates to a component inspection fixture, and more particularly to a component inspection fixture that can reduce measurement errors. Background Technology

[0002] With the advancement of technology, not only smartphones and computers, but also everyday tools, vehicles, and various detectors are increasingly supporting network connectivity. While this makes life more convenient, it also means that the components within these devices have higher specifications. For example, with the increasing prevalence of 5G connectivity, passive components in devices need to support higher frequency bands, and testing equipment for these new passive components also needs to operate at higher frequencies. Traditional impedance analyzers require calibration before measuring the passive component under test, such as using open-circuit standards. However, the circuit architecture of traditional impedance analyzers ignores the errors of the testing fixture. For example, the testing fixture may have extremely small parasitic capacitances, causing the impedance measured using open-circuit standards to be far less than infinity when operating at high frequencies. Furthermore, frequent insertion and removal of traditional testing fixtures can alter the electronic path length for signal transmission, leading to calibration inaccuracies in impedance analyzers at high frequencies.

[0003] Therefore, the industry needs a new testing fixture that can reduce the calibration error of impedance analyzers at high frequencies, so as to facilitate accurate calibration and measurement of the components under test. Summary of the Invention

[0004] The technical problem to be solved by this application is to provide a component testing fixture, which improves the signal feeding path and the position of the component under test, thereby reducing parasitic capacitance and avoiding length errors in the electronic path.

[0005] This application discloses a component testing fixture, comprising an additional circuit board, a signal feed section, a first conductive element, and a second conductive element. The additional circuit board includes a support surface, a first through hole, and a second through hole. The signal feed section includes a first transmission element and a second transmission element. The first conductive element includes a first body portion and a first cantilever, disposed on the support surface and electrically connected to the first transmission element. The first cantilever is at a first angle to the support surface, and a first end of the first cantilever is at a first height from the first body portion. The second conductive element includes a second body portion and a second cantilever, disposed on the support surface and electrically connected to the second transmission element. The second cantilever is at a first angle to the support surface, and a second end of the second cantilever is at a first height from the second body portion. The first through hole and the second through hole respectively accommodate the first transmission element and the second transmission element.

[0006] In some embodiments, a first transmission element may pass through a first through hole and protrude from the support surface, and a second transmission element may pass through a second through hole and protrude from the support surface. A first body portion contacts the first transmission element, and a second body portion contacts the second transmission element. When the first end and the second end respectively abut against the first electrode and the second electrode of the component under test, the first end is at a second height from the first body portion, and the second end is at a second height from the second body portion, and the second height may be less than the first height. Furthermore, the additional circuit board may have multiple second through holes, and the signal feeder may have multiple second transmission elements, each second transmission element passing through one of the multiple second through holes, and the distance between each second through hole and the first through hole may be the same. In addition, the component testing fixture may include a lifting unit and a signal adapter, the signal feeder is electrically connected to the signal adapter, the additional circuit board and the signal adapter are fixed to the lifting unit, and the lifting unit can move the additional circuit board and the signal adapter simultaneously in the vertical direction.

[0007] This application also proposes a component testing fixture, comprising an additional circuit board, a signal feeder, and a metal conductive element. The additional circuit board defines a support surface. The signal feeder is fixed to the additional circuit board and includes a first transmission element and a second transmission element. The metal conductive element is disposed on the support surface and includes an electrically insulated first conductive element and a second conductive element, the first conductive element being electrically connected to the first transmission element, and the second conductive element being electrically connected to the second transmission element. The support surface defines a sensing area, and the metal conductive elements within the periphery of the sensing area are not coplanar with the metal conductive elements outside the periphery of the sensing area.

[0008] In some embodiments, the signal feed section and the sensing area may not overlap in the vertical direction. Furthermore, the component detection fixture may include a top cover that shields the metal conductive elements outside the periphery of the sensing area.

[0009] In summary, the component testing fixture of this application includes a signal feeder fixed on an additional circuit board, and the signal feeder can be electrically connected to a metal conductive element. Furthermore, the metal conductive element of the component testing fixture that contacts the component under test is elastic, allowing the component under test to be pressed firmly against the metal conductive element, thereby fixing the electronic path length for signal transmission and reducing the effect of parasitic capacitance.

[0010] The other effects and embodiments of this application are described in detail below with reference to the accompanying drawings. Attached Figure Description

[0011] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0012] Figure 1 This is a perspective view of a component testing fixture according to an embodiment of this application;

[0013] Figure 2 This is a perspective view of a partial component testing fixture according to an embodiment of this application;

[0014] Figure 3 This is a perspective view of an additional circuit board according to an embodiment of this application;

[0015] Figure 4 This is a perspective view of a signal feed section according to an embodiment of this application;

[0016] Figure 5 This is a perspective view of a metal conductive component according to an embodiment of this application;

[0017] Figure 6 This is a side view of a metal conductive component according to an embodiment of this application;

[0018] Figure 7 This is a perspective view of a component testing fixture according to another embodiment of this application;

[0019] Figure 8 This is a schematic diagram of the electronic path in a metallic conductive component according to an embodiment of this application.

[0020] Symbol Explanation

[0021] 1: Component testing fixture 10: Additional circuit board 10a: Support surface

[0022] 100: Top cover; 100a: Opening; 106: Tank.

[0023] 102: Through hole (first through hole)

[0024] 104: Through hole (second through hole)

[0025] 12: Signal feed unit 120: First transmission element 122: Second transmission element

[0026] 124: Connector; 14: Metal conductive component; 140: First conductive component

[0027] 1400: First body part; 1402: First cantilever; 1402a: First end

[0028] 1404: Through hole; 142: Second conductive element; 1420: Second body part

[0029] 1422: Second cantilever; 1422a: Second end; 1424: Through hole

[0030] 16: Connector; 18: Box A: Sensing Area

[0031] D1~D4: Distance to DUT: Component under test; H: Height

[0032] θ: Angle Detailed Implementation

[0033] In the embodiments described below, the positional relationships include: up, down, left, and right. Unless otherwise specified, they are all based on the direction shown by the components in the diagram.

[0034] Please see Figure 1 and Figure 2 , Figure 1 This is a perspective view of a component testing fixture according to an embodiment of this application. Figure 2 This is a perspective view of a component testing fixture according to an embodiment of this application. As shown in the figure, the component testing fixture 1 includes an additional circuit board 10, a signal feed section 12, and a metal conductive element 14, wherein... Figure 2 Based on Figure 1 The component testing fixture 1 is shown in a perspective view after the top cover 100 has been removed. Regarding the component's position, the additional circuit board 10 can be defined with a support surface 10a, which faces upwards in the view. A signal feed section 12 passes through the additional circuit board 10; a portion of the signal feed section 12 is below the additional circuit board 10, while a portion of the signal feed section 12 is exposed on the support surface 10a. However, the portion of the signal feed section 12 exposed on the support surface 10a should not pass through the top cover 100. Furthermore, a metal conductive element 14 is disposed on the support surface 10a of the additional circuit board 10, and the metal conductive element 14 is generally positioned between the additional circuit board 10 and the top cover 100. In practice, the component testing fixture 1 can be used in conjunction with an impedance analyzer (not shown) to measure the component under test (DUT), particularly to measure various electrical parameters of the DUT under high-frequency signals. In one example, when the component under test (DUT) is a passive component, the component testing fixture 1 can carry the DUT, and then the impedance analyzer can measure the electrical parameters of the DUT, such as impedance magnitude, impedance angle, equivalent series resistance (ESR), and quality factor Q.

[0035] At Figure 1In this embodiment, the upper cover 100 has an opening 100a, through which the component under test (DUT) can contact the metal conductive element 14 from a downward direction. In practice, the side of the DUT facing the component testing fixture 1 may expose more than two electrodes. This embodiment does not limit the electrode form of the DUT; for example, it can be a pad or a pin. Those skilled in the art will understand that when the DUT contacts the metal conductive element 14 downward through the opening 100a, the metal conductive element 14 and the DUT can be electrically connected, and the aforementioned impedance analyzer can then perform measurements. In one example, the size of the opening 100a can be approximately the size of the DUT. Only when the DUT is aligned through the opening 100a can it correctly contact the corresponding position of the metal conductive element 14, thus avoiding misplacement of the DUT. The electrical connection method between the DUT and the metal conductive element 14 will be described in detail below. In addition, the top cover 100 also has the function of protecting the metal conductive component 14. For example, when the component under test (DUT) moves to the component testing fixture 1, the top cover 100 can block the plate or film layer carrying the DUT, allowing only the DUT of known thickness to pass through the opening 100a, thus preventing the plate or film layer carrying the DUT from excessively compressing the metal conductive component 14. The combination relationship between the additional circuit board 10, the signal feed section 12, and the metal conductive component 14 will be explained below.

[0036] Please refer to the following: Figure 2 , Figure 3 and Figure 4 , Figure 3 This is a perspective view of an additional circuit board according to an embodiment of this application. Figure 4This is a perspective view of a signal feed section according to an embodiment of this application. As shown, a plurality of through holes can be seen on the support surface 10a of the auxiliary circuit board 10. Some of the through holes can be used for heat dissipation or fixing other peripheral components, which will not be described in detail in this embodiment. In addition, the auxiliary circuit board 10 also includes through holes 102 (first through holes), a plurality of through holes 104 (second through holes) and a groove 106, wherein the through holes 102 and the plurality of through holes 104 are used to accommodate the signal feed section 12. For example, the through hole 102 can accommodate the first transmission element 120 of the signal feed section 12, and the through hole 104 can accommodate the second transmission element 122. In practice, since the first transmission element 120 and the second transmission element 122 transmit signals of different polarities, the auxiliary circuit board 10 should be made of insulating material to avoid signal interference. In addition, the connector 124 of the signal feed section 12 can be used to connect a signal adapter to transfer the measurement signal to a downstream device (e.g., an impedance analyzer). In terms of the positional relationship of the components, the connector 124 is below the auxiliary circuit board 10, so the ends of the first transmission member 120 and the second transmission member 122 and the connector 124 can be regarded as being located on opposite sides of the auxiliary circuit board 10 respectively.

[0037] As shown in the figure, the first transmission element 120 and the second transmission element 122 penetrate the additional circuit board 10 and are exposed on the support surface 10a, for the purpose of contacting and electrically connecting the metal conductive element 14 on the support surface 10a. This embodiment does not limit whether the groove 106 penetrates the additional circuit board 10; the function of the groove 106 will be described in later embodiments. In one example, the through-holes 102 in this embodiment can be arranged at the center of a plurality of through-holes 104, i.e., the distance between each through-hole 104 and the through-hole 102 is the same. In other words, the first transmission element 120 can be located at the center of a plurality of second transmission elements 122. One advantage is that when the first transmission element 120 is used to transmit sensing signals and the plurality of second transmission elements 122 are used for grounding, the plurality of second transmission elements 122 can shield noise to reduce interference to the sensing signals transmitted by the first transmission element 120.

[0038] It is worth noting that although this embodiment illustrates one first transmission element 120 and four second transmission elements 122, and the shape of the second transmission elements 122 (rectangular prism) is slightly different from the shape of the first transmission element 120 (cylindrical), this embodiment does not limit the number, shape, or arrangement of the first transmission elements 120 and the second transmission elements 122. Those skilled in the art will understand that the function of the first transmission elements 120 and the second transmission elements 122 is to transmit signals of different polarities, and the number of the first transmission elements 120 and the second transmission elements 122 does not have an impact. For example, the number of second transmission elements 122 can be greater than four, or there can be only one second transmission element 122 and a corresponding through hole 104; both should be able to achieve the basic function of transmitting signals of different polarities. On the other hand, the signal feeder 12 may not necessarily be locked to the auxiliary circuit board 10. In this embodiment, the signal feeder 12 may also be prevented from becoming loose from the auxiliary circuit board 10 by engaging or tightly fitting the components. For example, a tight fit can be achieved by the shape of the second transmission member 122 (rectangular prism) and the shape of the through hole 104 (round hole). Of course, in this embodiment, the signal feeder 12 and the auxiliary circuit board 10 can also be assembled by external auxiliary components, so that the second transmission member 122 only passes through the through hole 104 without contacting each other. Other auxiliary components of the component detection fixture 1 will be described later.

[0039] Please refer to the following: Figures 2 to 6 , Figure 5 This is a perspective view of a metal conductive component according to an embodiment of this application. Figure 6This is a side view of a metal conductive element according to an embodiment of this application. As shown, the metal conductive element 14 can be divided into two mutually insulated parts, such as a first conductive element 140 and a second conductive element 142. Different electrodes of the aforementioned component under test (DUT) can respectively contact the first conductive element 140 and the second conductive element 142, so that the DUT can receive the input signal from the impedance analyzer through the first conductive element 140 and the second conductive element 142. The first conductive element 140 may include a first body portion 1400 and a first cantilever 1402, and the second conductive element 142 may include a second body portion 1420 and a second cantilever 1422. In one example, the area of ​​the first body portion 1400 is smaller than the area of ​​the second body portion 1420, and the second body portion 1420 surrounds the first body portion 1400, but this embodiment is not limited thereto. Furthermore, the second body portion 1420 can be electrically connected to the second transmission element 122 to serve as the system's ground terminal, while the first body portion 1400 can serve as a sensing terminal to receive sensing signals from the first transmission element 120. This embodiment does not limit the thickness of the first conductive element 140 and the second conductive element 142; however, the thicknesses of the first conductive element 140 and the second conductive element 142 can be the same. For example, the first body portion 1400 and the first cantilever 1402 can be stamped from the same sheet metal, and the second body portion 1420 and the second cantilever 1422 can be stamped from the same sheet metal. Alternatively, the first conductive element 140 and the second conductive element 142 can be stamped from the same sheet metal, thus making their thicknesses the same.

[0040] As shown in the figure, the first body portion 1400 and the second body portion 1420 are fixed to the support surface 10a of the additional circuit board 10, while the first cantilever 1402 and the second cantilever 1422 are bent upwards and slightly away from the support surface 10a. In this embodiment, the first cantilever 1402 and the second cantilever 1422 are referred to as being within the sensing area A of the support surface 10a. This embodiment does not limit the range of the sensing area A, but it should at least include the area of ​​the first cantilever 1402 and the second cantilever 1422 projected onto the support surface 10a in the vertical direction. In one example, the first cantilever 1402 and the second cantilever 1422 may have the same length and may be raised upwards from the first body portion 1400 and the second body portion 1420 by the same angle θ (first angle). In this embodiment, the end positions of the first cantilever 1402 and the second cantilever 1422 are defined as the first end 1402a and the second end 1422a, respectively. In other words, the first end 1402a and the second end 1422a should be furthest away from the first body portion 1400 and the second body portion 1420, or in other words, the first end 1402a and the second end 1422a should be furthest away from the support surface 10a. Positionally, when the upper cover 100 covers the metal conductive member 14, the first end 1402a and the second end 1422a should be exposed through the opening 100a of the upper cover 100. That is, from a top-down view, at least the first end 1402a and the second end 1422a should not be obscured by the upper cover 100.

[0041] Furthermore, when the first cantilever 1402 and the second cantilever 1422 have the same length and are raised at the same angle θ, the first end 1402a and the second end 1422a in this embodiment can be defined to have the same height H. Specifically, in this embodiment, the first body portion 1400 and the second body portion 1420 can be defined to be in the same plane, or the first body portion 1400 and the second body portion 1420 can be said to form a coplanar plane. Then, using the plane containing the first body portion 1400 and the second body portion 1420 as a reference, the first end 1402a and the second end 1422a are defined to be at a first height. Here, the first height refers to the vertical distance between the first end 1402a and the first body portion 1400, and the vertical distance between the second end 1422a and the second body portion 1420, under a preset state. In one example, the aforementioned preset state refers to the state before the component under test (DUT) comes into contact with the first conductive element 140 and the second conductive element 142, that is, before the first cantilever 1402 and the second cantilever 1422 are squeezed by the component under test (DUT). It is worth noting that this embodiment does not limit the first cantilever 1402 and the second cantilever 1422 to have the same length, and the first cantilever 1402 and the second cantilever 1422 can also have different upward lifting angles. Those skilled in the art will understand that even if the first cantilever 1402 and the second cantilever 1422 have different lengths, it is possible to select the upward lifting angle of the first cantilever 1402 and the second cantilever 1422 so that the first end 1402a and the second end 1422a have the same height H. In other words, as long as the first end 1402a and the second end 1422a have the same height H, and the first cantilever 1402 and the second cantilever 1422 are elastic, they should fall within the scope of this embodiment.

[0042] Since the first cantilever 1402 and the second cantilever 1422 are elastic, those skilled in the art will know that when the first cantilever 1402 and the second cantilever 1422 are pressed by the component under test (DUT), the angle θ and the height H will both begin to change. For example, the angle θ and the height H will be less than the values ​​in the preset state. That is to say, when the component under test (DUT) contacts the first end 1402a and the second end 1422a, it not only means that the electrodes of the component under test (DUT) are electrically connected to the first end 1402a and the second end 1422a respectively, but also that the first end 1402a and the second end 1422a are pressed against the plane where the first body part 1400 and the second body part 1420 are located. As mentioned above, since the upper cover 100 of this embodiment can block the plate or film layer that carries the component under test (DUT), allowing only the component under test (DUT) of known thickness to pass through the opening 100a, the height H of the first end 1402a and the second end 1422a should be fixed (second height) at this time, and the second height will be less than the first height. Of course, the angle θ between the first end 1402a and the second end 1422a should also be fixed at this time (the second angle), and the second angle will also be smaller than the first angle. This embodiment does not limit the values ​​of angle θ and height H in the preset state. However, although the first end 1402a and the second end 1422a will be exposed in the opening 100a, in order to better protect the first end 1402a and the second end 1422a, the first end 1402a and the second end 1422a will not protrude from the top surface of the cover 100, that is, the first height does not exceed the thickness of the cover 100.

[0043] It is worth mentioning that in the example where the support surface 10a of the additional circuit board 10 has a groove 106, the groove 106 should be within the sensing area A, that is, below the projection of the first cantilever 1402 and the second cantilever 1422 in the vertical direction. In this case, if the component under test (DUT) is greater than the first height, the first cantilever 1402 and the second cantilever 1422 in this embodiment may be compressed by the DUT and fall below the plane where the first body portion 1400 and the second body portion 1420 are located. As can be seen from the above, this embodiment does not limit the bending angle of the first cantilever 1402 and the second cantilever 1422. As long as the first cantilever 1402 and the second cantilever 1422 can return to the preset angle θ and height H under a preset state (without external force), they should fall within the scope of this embodiment. In one example, the groove 106 may also be filled with an elastomer, such as a colloid or other material that helps the first cantilever 1402 and the second cantilever 1422 return to the preset angle θ and height H. Of course, the additional circuit board 10 may not have the groove 106, but may only have an elastomer at the location of the groove 106 shown in this embodiment. As long as the component under test (DUT) is not greater than the first height, it should also have a similar function.

[0044] Depend on Figure 5It is understood that the first body portion 1400 may have a through hole 1404, and the second body portion 1420 may have multiple through holes 1424. Positionally, the through hole 1404 and the multiple through holes 1424 may correspond to the through hole 102 and the multiple through holes 104, respectively. Therefore, the first transmission member 120 not only passes through the through hole 102 but also simultaneously protrudes from the through hole 1404, allowing the first transmission member 120 to contact and electrically connect to the first body portion 1400. Similarly, each second transmission member 122 not only passes through its corresponding through hole 104 but also simultaneously protrudes from its corresponding through hole 1424, allowing multiple second transmission members 122 to simultaneously contact and electrically connect to the second body portion 1420. One advantage is that, since multiple second transmission elements 122 are used for grounding, the second body portion 1420 surrounding the first body portion 1400 can be stably grounded. Those skilled in the art will understand that multi-point grounding reduces parasitic capacitance and contributes to measurement stability. The combined additional circuit board 10, signal feed section 12, and metal conductive element 14 then... Figure 2 The illustrations are shown below and will not be repeated here.

[0045] Please refer to the following: Figure 1 and Figure 7 , Figure 7 This is a perspective view of a component testing fixture according to another embodiment of this application. As shown, the additional circuit board 10 can also be locked together with the housing 18 via other connectors 16. The housing 18 is used to house the aforementioned signal adapter, which can then be connected to an impedance analyzer at the rear. In practice, the signal adapter inside the housing 18 can fix the connector 124 of the signal feed section 12. Since the relative position of the signal adapter and the signal feed section 12 is fixed, and the placement positions of the component under test (DUT) on the first cantilever 1402 and the second cantilever 1422 are also fixed, the component testing fixture 1 provided in this embodiment can fix the electronic path length from the DUT to the signal adapter, which can reduce the error in electronic path length when calibrating and measuring different DUTs.

[0046] This embodiment demonstrates a measurement method where the component testing fixture 1 remains stationary while the component under test (DUT) passes through the opening 100a to contact the first cantilever 1402 and the second cantilever 1422; however, it is not limited to this method. In practical operation, the DUT may also remain stationary while the component testing fixture 1 moves towards it, allowing the DUT to pass through the opening 100a to contact the first cantilever 1402 and the second cantilever 1422. As in the previous example, because the relative positions of the signal adapter and the signal feed unit 12 are fixed, and the placement positions of the DUT on the first cantilever 1402 and the second cantilever 1422 are also fixed, the electronic path length from the DUT to the signal adapter can also be fixed, reducing errors in the electronic path length that occur when calibrating and measuring different DUTs.

[0047] Please refer to the following: Figure 2 and Figure 8 , Figure 8 This is a schematic diagram of the electronic path in a metallic conductive component according to an embodiment of this application. As shown, the aforementioned first transmission element 120 is electrically connected to the through-hole 1404, and then passes through the first body portion 1400 and the first cantilever 1402 from the position of the through-hole 1404, and then is electrically connected to an electrode of the component under test (DUT) at the position of the first end 1402a. Accordingly, the length of an electronic path from the first transmission element 120 to the DUT can be expressed as a distance D1. To meet the requirements of high-frequency testing, the distance D1 can be in the range of 8.5mm to 9mm, for example, 8.75mm, which can be determined by those skilled in the art based on the operating frequency band. Furthermore, when selecting the second transmission element 122 with the shortest electronic path length from among multiple second transmission elements 122, the selected second transmission element 122 is electrically connected to the through hole 1424, then passes through the second body portion 1420 to one end of the second cantilever 1422, and then electrically connects to another electrode of the component under test (DUT) at the other end (second end 1422a) of the second cantilever 1422. Accordingly, the electronic path length from the second transmission element 122 with the shortest electronic path length to the DUT can be expressed as the sum of distances D2, D3, and D4. The distance D2 can range from 12mm to 14mm, for example, 13mm. The distance D3 can range from 0.5mm to 1.5mm, for example, 1mm. The distance D4 can range from 2.5mm to 3.5mm, for example, 3mm. Similarly, those skilled in the art can determine the values ​​of distances D2, D3, and D4 based on the operating frequency band; this embodiment is not limited to this.

[0048] In summary, the component testing fixture of this application includes a signal feeder fixed to an additional circuit board, and the signal feeder can be electrically connected to a metal conductive element, which can reliably contact the component under test. Therefore, the component testing fixture of this application can accurately align the component under test and minimize movement during component replacement, resulting in a more consistent electronic path length. Furthermore, the design of the signal feeder in the component testing fixture of this application can reduce parasitic capacitance and avoid errors in the electronic path length.

[0049] The embodiments and / or implementation methods described above are merely preferred embodiments and / or implementation methods for implementing the technology of this application, and are not intended to limit the implementation methods of the technology of this application in any way. Any person skilled in the art may make some modifications or alterations to other equivalent embodiments without departing from the scope of the technical means disclosed in this application, but these should still be regarded as the technology or embodiments that are substantially the same as those of this application.

Claims

1. A component testing fixture, characterized in that, Include: An additional circuit board includes a support surface, a first through hole, and a second through hole; A signal feed unit includes a first transmission element and a second transmission element; A first conductive element, comprising a first body and a first cantilever, is disposed on the support surface and electrically connected to the first transmission element. The first cantilever forms a first angle with the support surface, and a first end of the first cantilever is at a first height from the first body. A second conductive element includes a second body portion and a second cantilever. The second body portion is disposed on the support surface and electrically connected to the second transmission element. The second cantilever is at the first angle to the support surface, and a second end of the second cantilever is at the first height from the second body portion. The first through hole and the second through hole respectively accommodate the first transmission element and the second transmission element; The first transmission component passes through the first through hole and protrudes from the support surface, the second transmission component passes through the second through hole and protrudes from the support surface, the first body portion contacts the first transmission component, and the second body portion contacts the second transmission component.

2. The component testing fixture according to claim 1, characterized in that, When the first end and the second end respectively abut against a first electrode and a second electrode of a component under test, the first end reaches a second height from the first body portion, the second end reaches the second height from the second body portion, and the second height is less than the first height.

3. The component testing fixture according to claim 1, characterized in that, The additional circuit board further has multiple second through holes, and the signal feed section further has multiple second transmission elements, each of which is disposed through one of the second through holes, and each of the second through holes is at the same distance from the first through hole.

4. The component testing fixture according to claim 1, characterized in that, It also includes a housing that is connected to the additional circuit board and is used to house a signal adapter, the signal feed section being electrically connected to the signal adapter.

5. A component testing fixture, characterized in that, Include: An additional circuit board is defined with a support surface having a first through hole and a second through hole; A signal feed unit, fixed to the additional circuit board, includes a first transmission element and a second transmission element; and A metal conductive element is disposed on the support surface, comprising a first conductive element and a second conductive element that are electrically insulated from each other, the first conductive element being electrically connected to the first transmission element, and the second conductive element being electrically connected to the second transmission element; The support surface defines a sensing area, and the metal conductive element within the periphery of the sensing area is not coplanar with the metal conductive element outside the periphery of the sensing area. The first transmission element passes through the first through hole and is exposed on the support surface, the second transmission element passes through the second through hole and is exposed on the support surface, the first conductive element contacts the first transmission element, and the second conductive element contacts the second transmission element.

6. The component testing fixture according to claim 5, characterized in that, In a vertical direction, the signal feed section does not overlap with the sensing area.

7. The component testing fixture according to claim 5, characterized in that, It also includes a top cover that shields the metal conductive element outside the periphery of the sensing area.

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