Film peeling apparatus, delaminating apparatus provided with the same, and semiconductor manufacturing apparatus

Abstract

Embodiments of the present invention provide a film peeling apparatus capable of peeling a film from a wafer, a layering apparatus provided with the same, and a semiconductor manufacturing apparatus. The film peeling apparatus according to the present invention includes a chuck on which a wafer to which a film is attached is placed, a peeling roller that brings a tape for peeling the film from the wafer into contact with the film, and a peeling bar that adjusts a peeling angle between the film to which the tape is attached and the wafer.

Description

Technical Field

[0001] The present invention relates to a film stripping apparatus for removing films attached to wafers, a layering apparatus having the same, and semiconductor manufacturing equipment. Background Technology

[0002] Typically, semiconductor devices can be formed on a silicon wafer, which serves as a semiconductor substrate, by repeatedly performing a series of manufacturing processes. Semiconductor devices formed as described above can be manufactured into semiconductor packages through slicing, bonding, and packaging processes.

[0003] Recently, in order to improve integration, processes that stack semiconductor chips on wafers have been widely adopted. On the other hand, as a method to bond multiple chips onto a wafer simultaneously, a gas-assisted bonding method is being considered, in which each chip is pre-bonded onto the wafer, a film is covered on top, a high-temperature and high-pressure environment is created, and high-energy gases are used to bond the chips in one go.

[0004] After batch bonding is completed in this way, an additional process of removing the film from the wafer is required. Summary of the Invention

[0005] Therefore, embodiments of the present invention provide a film stripping apparatus capable of stripping a film from a wafer, a layering apparatus having the same, and a semiconductor manufacturing apparatus.

[0006] The problems solved by the present invention are not limited to those mentioned above, and those skilled in the art will clearly understand from the following description other problems not mentioned.

[0007] The membrane peeling apparatus according to the invention includes: a chuck on which a wafer with a membrane attached is placed; a peeling roller such that an adhesive tape for peeling the membrane from the wafer contacts the membrane; and a peeling bar for adjusting the peeling angle between the membrane with the adhesive tape attached and the wafer.

[0008] According to an embodiment of the present invention, the film peeling apparatus further includes: a chuck driving unit for moving the chuck in a horizontal direction; and a roller rotation driving unit that operates synchronously with the chuck driving unit and rotates the peeling roller. Alternatively, the roller rotation driving unit may rotate the peeling roller at the same speed as the chuck's movement speed via the chuck driving unit.

[0009] According to an embodiment of the present invention, the stripping bar may be provided as a bar shape with a triangular cross-section.

[0010] According to an embodiment of the present invention, the film stripping device may further include: a stripping rod rotation drive unit, which is coupled to the stripping rod and drives the stripping rod to rotate, thereby adjusting the angle at which the film is stripped from the wafer by the rotation of the stripping rod.

[0011] According to an embodiment of the present invention, the film peeling device may further include: a roller temperature regulating unit disposed in the internal space of the peeling roller, and regulating the temperature of the peeling roller.

[0012] According to an embodiment of the present invention, the film peeling device may further include: a roller vertical drive unit, which moves the peeling roller and the peeling bar in the vertical direction.

[0013] According to an embodiment of the present invention, the membrane peeling device may include: a chuck load sensor for measuring the pressure applied to both sides of the chuck; the membrane peeling device may further include: a chuck rotation drive unit for rotating the chuck based on the pressure applied to the chuck load sensor in order to align the chuck and the peeling roller.

[0014] A layering apparatus according to an embodiment of the present invention includes: a loading port for supplying a wafer with a film attached thereto; a wafer transport machine for transporting the wafer; a tape supply unit for supplying tape for peeling off the film; a film peeling device for peeling the film off the wafer using the tape; and a tape recycling unit for recycling the tape with the film attached. The film peeling device includes: a chuck for holding the wafer with the film attached thereto and configured to move horizontally; a peeling roller for contacting the tape used to peel the film off the wafer with the film and configured to rotate at a speed corresponding to the moving speed of the chuck; and a peeling bar for adjusting the peeling angle between the film with the tape attached and the wafer.

[0015] According to an embodiment of the present invention, the tape supply unit may include: a tape supply storage unit for supplying the tape in a wound state to the film peeling device; a tension control unit for controlling the tension of the tape; and a position control unit for controlling the position of the tape.

[0016] According to an embodiment of the present invention, the supply tension control unit may include: a tape supply roller for supplying the supply tape to the film peeling device; a supply tension measuring load sensor for measuring the tension of the supply tape; a supply roller motor for providing power to rotate the tape supply roller; and a supply roller clutch for adjusting the coupling force between the tape supply roller and the supply roller motor.

[0017] According to an embodiment of the present invention, the supply position control unit may include: a supply tape position sensor for determining the position of the supply tape; and a supply roller horizontal drive unit for adjusting the horizontal position of the tape supply roller by moving the tape supply roller according to the position information of the supply tape determined by the supply tape position sensor.

[0018] According to an embodiment of the present invention, the tape recycling unit may include: a tape recycling storage unit for storing the recycled tape with the film attached in a wound state; a recycling tension control unit for controlling the tension of the recycled tape; and a recycling position control unit for controlling the position of the recycled tape relative to the peeling roller.

[0019] According to an embodiment of the present invention, the recycling tension control unit may include: a tape recycling roller for supplying the recycled tape to the recycled tape storage unit; a recycling tension measuring load sensor for measuring the tension of the recycled tape; a recycling roller motor for providing power to rotate the tape recycling roller; and a recycling roller clutch for adjusting the engagement force between the tape recycling roller and the recycling roller motor.

[0020] According to an embodiment of the present invention, the recycling position control unit may include: a recycling tape position sensor for determining the position of the recycling tape; and a recycling roller horizontal drive unit for adjusting the horizontal position of the recycling tape by moving the recycling tape recycling roller according to the position information of the recycling tape determined by the recycling tape position sensor.

[0021] According to an embodiment of the present invention, the layering device may further include: a tape orientation control unit for correcting the skewness of the tape supplied to the film peeling device.

[0022] According to an embodiment of the present invention, the tape orientation control unit may include: a tape alignment roller configured to rotate relative to a vertical direction and supply the tape provided from the tape supply unit to the film peeling device; a tape position measuring sensor for measuring the position of the tape supplied to the film peeling device; and a tape alignment drive unit for controlling the rotation drive of the tape alignment roller based on the slope information of the tape.

[0023] According to an embodiment of the present invention, the layering device may further include a feed speed control unit, which works synchronously with the peeling roller and the chuck drive unit to control the supply speed and recycling speed of the tape.

[0024] According to an embodiment of the present invention, the layering device may further include: a supply tape replacement sensing sensor disposed in the tape supply section and measuring the amount of supply tape wound in the supply tape storage section; and a recycling tape replacement sensing sensor disposed in the tape recycling section and measuring the amount of recycling tape wound in the recycling tape storage section.

[0025] According to an embodiment of the present invention, the layering device may further include: a supply tape replacement unit disposed in the tape supply section and configured to hold both ends of the supply tape for cutting the supply tape when replacing the supply tape; and a recycling tape replacement unit disposed in the tape recycling section and configured to hold both ends of the recycling tape for cutting the recycling tape when replacing the recycling tape.

[0026] A semiconductor manufacturing apparatus according to the present invention includes: a loading port for supplying a wafer with a film attached thereto; a wafer transport module for transporting the wafer; a process processing module for performing process processing on the wafer; and a layering module for removing the film from the wafer. The layering module includes: a tape supply unit for supplying tape for peeling off the film; a film peeling device for peeling the film from the wafer using the tape; and a tape recycling unit for recycling the tape with the film attached. The film peeling device may include: a chuck for holding the wafer with the film attached thereto and configured to move horizontally; a peeling roller such that the tape for peeling the film from the wafer contacts the film and is configured to rotate at a speed corresponding to the moving speed of the chuck; and a peeling bar provided in a bar shape and adjusted by rotation drive between the film with the tape attached and the wafer.

[0027] According to the present invention, the chuck on which the wafer is placed is horizontally moved by the chuck drive unit and the roller that contacts the wafer with the stripping tape works synchronously with the chuck, thereby enabling the film to be stripped from the wafer more effectively.

[0028] The effects of the present invention are not limited to those mentioned above, and those skilled in the art will clearly understand other effects not mentioned from the following description. Attached Figure Description

[0029] Figure 1 as well as Figure 2 A schematic structure of the layered device according to the present invention is shown.

[0030] Figure 3 as well as Figure 4 A membrane peeling device according to the present invention is shown.

[0031] Figure 5 The process of peeling off a membrane in a membrane peeling apparatus according to the invention is shown.

[0032] Figure 6 The process of adjusting the peeling angle of the membrane in the membrane peeling apparatus according to the invention is shown.

[0033] Figures 7 to 9 The structure for aligning wafers and chucks in a film stripping apparatus according to the invention is shown.

[0034] Figure 10 as well as Figure 11 The outline structure of the supply tension control unit for controlling the tension of the supply tape in the layering device according to the present invention is shown.

[0035] Figure 12 The schematic structure of the supply position control unit for controlling the position of the supplied tape in the layering device according to the present invention is shown.

[0036] Figure 13 The outline structure of the recycling tension control unit for controlling the tension of the recycled tape in the layering device according to the present invention is shown.

[0037] Figure 14 The schematic structure of the recycling position control unit, which controls the position of the recycled tape in the layering device according to the present invention, is shown.

[0038] Figure 15a as well as Figure 15b The outline structure of the feed speed control unit for controlling the supply and recycling speed of the tape in the layering device according to the present invention is shown.

[0039] Figure 16a as well as Figure 16b The tape direction control section is shown in the layering device according to the present invention for correcting the horizontal skew of the tape.

[0040] Figure 17 This illustrates the operation of changing a sensing sensor with tape in a layering device according to the invention.

[0041] Figure 18 A tape replacement unit for replacing tape is shown in a layering device according to the invention.

[0042] Figure 19 A semiconductor manufacturing apparatus suitable for a layered module according to the present invention is shown.

[0043] (Explanation of reference numerals in the attached diagram)

[0044] 1: Layered equipment

[0045] 10: Loading Port

[0046] 20: Wafer conveying machine

[0047] 30: Membrane peeling device

[0048] 40: Tape Supply Department

[0049] 40A: Supply Tension Control Department

[0050] 40B: Supply Location Control Department

[0051] 45: Supply of tape replacement unit

[0052] 50: Tape Recycling Department

[0053] 50A: Recovery Tension Control Unit

[0054] 50B: Supply Location Control Department

[0055] 55: Tape Recycling Replacement Unit

[0056] 60: Feed rate control unit

[0057] 70: Tape Direction Control Section

[0058] 310: Chuck

[0059] 320: Peeling roller

[0060] 325: Roller rotation drive unit

[0061] 330: Peeling bar

[0062] 335: Peeling rod rotation drive unit

[0063] 340: Chuck Driver Unit

[0064] 350: Chuck Rotation Drive Unit

[0065] 360°: Vertical drive unit for rollers

[0066] W: Wafer

[0067] F: Membrane

[0068] T: Tape Detailed Implementation

[0069] Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings, so that those skilled in the art to which this invention pertains can readily implement it. The present invention can be implemented in various different ways and is not limited to the embodiments described herein.

[0070] To clearly illustrate the invention, irrelevant parts have been omitted, and the same or similar components are marked with the same reference numerals throughout the specification.

[0071] Furthermore, in multiple embodiments, the same reference numerals are used to describe only representative embodiments of the constituent elements having the same structure, while in other embodiments only structures different from the representative embodiments are described.

[0072] In the specification as a whole, when a part is described as being "connected (or combined)" with other parts, it not only refers to "direct connection (or combination)" but also includes cases where other components are placed in between for "indirect connection (or combination)". Furthermore, when a part is described as "including" a constituent element, unless otherwise stated otherwise, it means that other constituent elements may be included, rather than excluding them.

[0073] Unless otherwise defined, all terms used herein, including technical or scientific terms, shall have the same meaning as commonly understood by one of ordinary knowledge in the art to which this invention pertains. Terms such as those defined in commonly used dictionaries shall be interpreted as having the same meaning as in the relevant technical context, and shall not be ideally or excessively interpreted as having a formal meaning unless explicitly defined in this application.

[0074] This invention relates to a film removal apparatus for removing films attached to the top of a wafer, a layering apparatus having the same, and a semiconductor manufacturing apparatus. The structure and operation of the film removal apparatus, layering apparatus, and semiconductor manufacturing apparatus according to the invention are described below.

[0075] The film removal apparatus according to the present invention can be used in processes for removing films attached to wafers. Here, the film can be a film used in a one-time bonding process of chips pre-bonded to the wafer using high-temperature and high-pressure gases and removed from the wafer for subsequent processes. However, the applicability of the film removal apparatus according to the present invention is not limited; it can be used in processes for peeling and removing any type of film attachment from substrates (e.g., wafers, glass).

[0076] The membrane removal apparatus and the delamination module according to the present invention can be configured as separate devices. Furthermore, the membrane removal apparatus according to the present invention can be configured as such as... Figure 19 It is configured as a module within a semiconductor manufacturing apparatus (e.g., a bonding apparatus). For example, the bonding apparatus may include multiple process modules 1310, 1320 and a layering module 1240 as modules for removing the film remaining on the wafer after bonding is completed in each chamber, and may include a film removal apparatus according to the invention.

[0077] Figure 1 as well as Figure 2A schematic structure of a layering apparatus 1 according to the present invention is shown. The layering apparatus 1 according to the present invention can be configured in a semiconductor manufacturing plant and is equipment that performs the function of peeling and removing the film F from a wafer W to be used in a previous process. The layering apparatus 1 can peel the film F from the wafer W and provide the wafer W with the film F removed to equipment for the next process.

[0078] The layering apparatus 1 according to the present invention includes a loading port 10 for supplying a wafer W with a film F attached thereon, a wafer transport machine 20 for transporting the wafer W, a tape supply unit 40 for supplying tape T for peeling off the film F, a film peeling device 30 for peeling the film F off the wafer W using tape T, and a tape recycling unit 50 for recycling the tape T with the film F attached.

[0079] The film peeling apparatus 30 according to the present invention includes a chuck 310 on which a wafer W with a film F attached is placed and configured to move along a horizontal direction (X direction), a peeling roller 320 such that an adhesive tape T for peeling the film F from the wafer W contacts the film F and is configured to rotate at a speed corresponding to the moving speed of the chuck 310, and a peeling bar 330 for adjusting the peeling angle between the film F with the adhesive tape T attached and the wafer W.

[0080] According to the present invention, the film peeling apparatus 30 includes a chuck drive unit 340 that moves the chuck 310 in a horizontal direction, and a roller rotation drive unit 325 that operates synchronously with the chuck drive unit 340 and rotates the peeling roller 320 at the same speed as the movement speed of the chuck 310 via the chuck drive unit 340. The chuck 310, on which the wafer W is placed, moves horizontally (in the X direction) via the chuck drive unit 340, and the peeling roller 320, which contacts the wafer W with the peeling tape T, operates synchronously with the chuck 310, thereby enabling more efficient peeling of the film F from the wafer W. Furthermore, the chuck 310 is moved while the peeling roller 320 is in a fixed position, which, compared to moving the peeling roller 320 while the chuck 310 is in a fixed position, has the advantage of simplifying the overall device structure by fixing the position of the peeling roller 320 relative to the tape supply unit 40 and the tape recovery unit 50.

[0081] Loading port 10 can be located outside the layering device 1 and accommodates a transport container (e.g., FOUP (Front Opening Unified Pod)) 5 for accommodating wafers W. The transport container 5 can be placed into loading port 10 via a transport device (e.g., OHT (Overhead Hoist Transport)). After the wafers F have been peeled off, they can be transported in a loaded state via the transport device for subsequent processes after being placed back into the transport container 5 located in loading port 10.

[0082] The wafer transport machine 20 removes a wafer W from the transport container 5 placed in the loading port 10 and transports the wafer W to the chuck 310, then transfers the wafer W, after the film F has been peeled off, back to the transport container 5. The wafer transport machine 20 may include a robotic arm supporting the wafer W from below and a robotic arm that moves the robotic arm in the horizontal and vertical directions.

[0083] Figure 3 as well as Figure 4 A membrane peeling device 30 according to the present invention is shown.

[0084] The film peeling device 30 includes a chuck 310 on which a wafer W with a film F attached is placed and configured to move in a horizontal direction (X direction), a peeling roller 320 which is configured to rotate at a speed corresponding to the moving speed of the chuck 310 and which makes the adhesive tape T for peeling the film F from the wafer W contact the film F, and a peeling bar 330 for adjusting the peeling angle between the film F with the adhesive tape T attached and the wafer W.

[0085] The chuck 310, as a structure with a certain area, can be provided in a disk shape capable of holding the wafer W. The chuck 310 may include a wafer mounting surface on which the wafer W is placed, and can be linearly or rotary driven by a drive unit for driving the chuck 310. According to one example, a temperature regulating device for regulating the temperature of the wafer W may be provided in the chuck 310.

[0086] The peeling roller 320, configured as a cylindrical roller capable of rotating around a central axis, can move the tape T by rotating it while it is wound around the tape T. In particular, the peeling roller 320 can rotate in contact with the upper end of the film F on the wafer W to adhere the film to the tape T in order to peel off the film F from the wafer W. The peeling roller 320 can be driven to rotate by the roller rotation drive unit 325.

[0087] According to one embodiment, the film peeling apparatus 30 may include a roller temperature regulating unit 322 disposed within the internal space of the peeling roller 320 and for regulating the temperature of the peeling roller 320. The roller temperature regulating unit 322 may be composed of a heater and / or a cooler, which can regulate the temperature of the peeling roller 320 to maintain an optimal temperature for peeling the film F.

[0088] The roller rotation drive unit 325 is coupled to the peeling roller 320 and causes the peeling roller 320 to rotate. The roller rotation drive unit 325 is connected to the central axis of the peeling roller 320 to rotate the peeling roller 320. On the other hand, the roller rotation drive unit 325 is configured to operate synchronously with the chuck drive unit 340. That is, the rotation speed of the peeling roller 320 driven by the roller rotation drive unit 325 can be set to be the same as the movement speed of the chuck 310 driven by the chuck drive unit 340. The roller rotation drive unit 325 can operate via a control signal synchronized with the chuck drive unit 340.

[0089] The peeling bar 330 is positioned adjacent to the peeling roller 320 along the direction of movement of the tape T, causing the film F to be peeled off from the wafer W while still attached to the tape T. The peeling bar 330 is configured to be spaced a certain distance from the wafer W. The height of the peeling bar 330 relative to the chuck 310 can be configured to be higher than the height of the peeling roller 320 relative to the chuck 310. That is, the peeling bar 330 can be configured to be located at a higher position than the peeling roller 320.

[0090] The peeling rod 330 can be provided in a rod shape with a triangular cross-section. The angles of the triangle forming the peeling rod 330 can be the same or different. The peeling angle of the film F can be variably adjusted by rotating the peeling rod 330.

[0091] Reference Figure 5 An adhesive tape T, having adhesive properties, is attached to the film F above the wafer W while being wound around a peeling roller 320. Specifically, the film F is attached to the tape T by the horizontal movement of the chuck 310 and the rotation of the peeling roller 320, and the tape T with the film F attached moves to the tape collection section 50 due to the peeling angle set by the peeling rod 330.

[0092] According to an embodiment of the present invention, in another aspect, the film peeling device 30 includes a peeling rod rotation drive portion 335 coupled to the peeling rod 330 and driving the peeling rod 330 to rotate. The peeling rod 330 is configured to be rotatable by the peeling rod rotation drive portion 335, such as... Figure 6 As shown in (a) and (b), the peeling angle of the film F can be adjusted by rotating the peeling rod 330.

[0093] According to an embodiment of the present invention, the film peeling device 30 may include a roller vertical drive unit 360 for moving the peeling roller 320 and the peeling rod 330 in a vertical direction. The roller vertical drive unit 360 may work in conjunction with the peeling roller 320 and the peeling rod 330, and move the peeling roller 320 and the peeling rod 330 along the vertical direction (Z direction). The roller vertical drive unit 360 may be composed of a drive device such as a ball screw, a cylinder, or a linear motor. The roller vertical drive unit 360 may be fixed to a structure 365 that secures the peeling roller 320 and the peeling rod 330, and the peeling roller 320 and the peeling rod 330 rise and fall together through the lifting drive of the roller vertical drive unit 360.

[0094] According to an embodiment of the present invention, the film peeling apparatus 30 may further include a chuck rotation drive unit 350 for adjusting the slope of the chuck 310 to align the chuck 310 and the peeling roller 320. For accurate peeling of the film F, it is important that the front portion of the peeling roller 320 is uniformly and tightly attached to the chuck 310. Therefore, to align the peeling roller 320 and the chuck 310, the slope of the chuck 310 can be adjusted by the chuck rotation drive unit 350. Figure 7 as well as Figure 8 As shown, the chuck rotation drive unit 350 can be provided below the chuck 310 and configured to enable the chuck 310 to rotate about the horizontal axis (X-axis).

[0095] According to an embodiment of the present invention, load sensors 360A and 360B, which measure the load caused by the stripping roller 320, can be respectively provided on both sides of the chuck 310. The chuck rotation drive unit 350 can adjust the slope of the chuck 310 according to the load measured by each load sensor 360A and 360B. For example, as Figure 7 As shown, a first chuck load sensor 360A and a second chuck load sensor 360B can be configured on the left and right sides of the chuck 310, respectively, to measure the load F1 applied to the first chuck load sensor 360A and the load F2 applied to the second chuck load sensor 360B. The chuck rotation drive unit 350 can adjust the slope of the chuck 310 by comparing the load F1 applied to the first chuck load sensor 360A and the load F2 applied to the second chuck load sensor 360B.

[0096] In another embodiment of the present invention, elastic bodies 312A and 312B, such as springs, can be provided on both sides above the peeling roller 320. This configuration allows the peeling roller 320 to oscillate to a certain extent via the elastic bodies 312A and 312B, enabling uniform contact between the peeling roller 320 and the chuck 310 using the force applied by the elastic bodies 312A and 312B.

[0097] The following describes the tape supply section 40 that supplies tape T to the film peeling device 30 and the tape recycling section 50 that recycles tape T with film F attached.

[0098] According to the present invention, the tape supply unit 40 includes a tape storage unit 405 for supplying a wound tape UT to a film peeling device 30, a supply tension control unit 40A for controlling the tension of the tape UT, and a supply position control unit 40B for controlling the position of the tape.

[0099] Alternatively, the supply tape storage section 405 may store the supply tape UT supplied in the form of a reel, and the supply tape UT wound on the supply tape storage section 405 may be supplied by the film peeling devices 30 included in the tape supply section 40.

[0100] like Figure 10 As shown, the tape supply roller 410 for winding tape is provided in the tape storage section 405, and a supply roller motor 430 is provided to provide power for rotating the tape supply roller 410 and a supply roller clutch 440 for adjusting the engagement force between the tape supply roller 410 and the supply roller motor 430. In addition, a supply roller horizontal drive section 465 is included to move the tape supply roller 410 to align with the center position of the tape supply roller 410.

[0101] According to an embodiment of the present invention, a supply tension control unit 40A for controlling the tension of the supply tape UT may include a tape supply roller 410 for supplying the supply tape UT to the film peeling device 30, a supply tension measuring load sensor 420 for measuring the tension of the supply tape UT, a supply roller motor 430 for providing power to rotate the tape supply roller 410, and a supply roller clutch 440 for adjusting the coupling force between the tape supply roller 410 and the supply roller motor 430.

[0102] A tension measuring load sensor 420 can be installed in one of the rollers supplying the tape UT to the film peeling device 30. It measures the pressure (tension) of the tape UT generated in the corresponding roller and provides this information to a controller (not shown) that controls the supply roller motor 430 and the supply roller clutch 440. The controller can control the supply roller clutch 440 to maintain the tension of the tape UT at a certain level. For example, the supply roller clutch 440 can normally be maintained in a state where the tape supply roller 410 is partially engaged with the supply roller motor 430 (half-engaged state). However, when the tension of the tape UT is below a reference range, the supply roller clutch 440 can fully engage the tape supply roller 410 with the supply roller motor 430, and the supply roller motor 430 can rotate the tape supply roller 410 at a speed lower than the current speed at which the tape UT is disengaged, thereby increasing the tension of the tape UT. When the tension of the supplied tape UT is higher than the reference range, the supply roller clutch 440 may engage the tape supply roller 410 with the supply roller motor 430, and the supply roller motor 430 may rotate the tape supply roller 410 at a speed higher than the current speed at which the supplied tape UT is released, thereby reducing the tension of the supplied tape UT. If the tension of the supplied tape UT is measured to be within the reference range, the supply roller clutch 440 may disengage the tape supply roller 410 and the supply roller motor 430.

[0103] According to another embodiment of the invention, a tension adjusting mechanism 480 can be provided for adjusting the tension of a supplied tape UT. The tension adjusting mechanism 480 may include a rotating arm 484 rotatable about a rotating axis 482 and a tension adjusting roller 486 fixed to the rotating arm 484 and rotatable. Figure 11 As shown, the configuration can be such that the tension adjusting roller 486 contacts the supplied tape UT and the rotating arm 484 is rotatable about the center of the rotation axis 482. The rotating arm 484 can rotate based on the pressure measured by the supply tension measuring load sensor 420, and can be... Figure 11 Based on this, when the tension of the supply tape UT is low, the rotating arm 484 rotates clockwise to increase the tension of the supply tape UT; when the tension of the supply tape UT is high, the rotating arm 484 rotates counterclockwise to decrease the tension of the supply tape UT. The tension adjusting mechanism 480 can similarly be configured as part of the recovery tension control unit 50A for adjusting the tension of the recovery tape RT.

[0104] According to an embodiment of the present invention, the supply position control unit 40B may include a supply tape position sensor 450 for measuring the position of the supply tape UT and a supply roller horizontal drive unit 465 for adjusting the horizontal position of the tape supply roller 410 by moving the tape supply roller 410 based on the position information of the supply tape measured by the supply tape position sensor 450.

[0105] Reference Figure 12 The supply tape position sensor 450 can be configured on the roller of the line supplying the supply tape UT from the supply tape storage section 405 to the film peeling device 30, and can measure the relative position of the supply tape UT with respect to the roller. That is, the supply tape position sensor 450 can determine whether the supply tape UT is centered or deviated to the left or right. If the supply tape position sensor 450 confirms that the supply tape UT has deviated in a specific direction, a process for correcting the position of the supply tape UT towards the center can be performed.

[0106] The supply roller horizontal drive unit 465 can adjust the horizontal position (Y-direction position) of the belt supply roller 410 according to the position of the supply belt UT measured by the supply belt position sensor 450. More specifically, refer to Figure 12 The tape supply roller 410 is coupled to the horizontal moving structure 415, and the supply roller horizontal drive unit 465 moves the horizontal moving structure 415, thereby adjusting the position of the tape supply roller 410. For example, when the supplied tape UT deviates in the -Y direction, the tape supply roller 410 is moved in the +Y direction, and when the supplied tape UT deviates in the +Y direction, the tape supply roller 410 is moved in the -Y direction.

[0107] As described above, the tape supply unit 40 can supply tape UT with a certain tension to the film peeling device 30 in a state aligned with the center. The film F peeled off by the film peeling device 30 can be supplied to the tape recycling unit 50 for recycling tape in a state attached to the tape T.

[0108] According to the present invention, the tape recycling unit 50 may include a recycling tape storage unit 505 for storing the recycling tape RT with the film F attached in a wound state, a recycling tension control unit 50A for controlling the tension of the recycling tape RT, and a recycling position control unit 50B for controlling the position of the recycling tape RT.

[0109] The recycled tape storage unit 505 can store the recycled tape RT in a roll form. The recycled tape RT can be supplied from the film peeling device 30 to the recycled tape storage unit 505 through the rollers included in the tape recycling unit 50 and then stored in a wound state.

[0110] It may be that a tape recycling roller 510 for winding the recycled tape RT is provided in the recycled tape storage section 505, and a recycling roller motor 530 is provided to provide power for rotating the tape recycling roller 510 and a recycling roller clutch 540 for adjusting the engagement force between the tape recycling roller 510 and the recycling roller motor 530. In addition, a recycling roller horizontal drive section 565 is included to move the tape recycling roller 510 to align with the center position of the tape recycling roller 510.

[0111] According to an embodiment of the present invention, a recovery tension control unit 50A for controlling the tension of the recovery tape RT may include a tape recovery roller 510 that provides the recovery tape RT to the film peeling device 30, a recovery tension measuring load sensor 520 for measuring the tension of the recovery tape RT, a recovery roller motor 530 that provides power for rotating the tape recovery roller 510, and a recovery roller clutch 540 that adjusts the coupling force between the tape recovery roller 510 and the recovery roller motor 530.

[0112] Reference Figure 13 The recovery tension measuring load sensor 520 can be installed in one of the rollers supplying the recovery tape RT from the film peeling device 30 to the recovery tape storage section 505. It can measure the pressure (tension) of the recovery tape RT generated in the corresponding roller and provide this to a controller (not shown) that controls the recovery roller motor 530 and the recovery roller clutch 540. The controller can control the recovery roller clutch 540 to maintain the tension of the recovery tape RT at a certain level. For example, the recovery roller clutch 540 can normally be maintained in a state where the tape recovery roller 510 and the recovery roller motor 530 are not fully engaged or partially engaged (half-engaged state). However, when the tension of the recovery tape RT is below a reference range, the recovery roller clutch 540 can fully engage the tape recovery roller 510 and the recovery roller motor 530 can rotate the tape recovery roller 510 at a speed higher than the current speed at which the recovery tape RT is disengaged, thereby increasing the tension of the recovery tape RT. When the tension of the recycled tape RT is higher than the reference range, the recycling roller clutch 540 may engage the tape recycling roller 510 with the recycling roller motor 530, and the recycling roller motor 530 may rotate the tape recycling roller 510 at a speed lower than the current speed at which the recycled tape RT is released, thereby reducing the tension of the recycled tape RT. If the tension of the recycled tape RT is measured to be within the reference range, the recycling roller clutch 540 may disengage the tape recycling roller 510 and the recycling roller motor 530.

[0113] According to an embodiment of the present invention, the recycling position control unit 50B may include a recycling tape position sensor 550 for measuring the position of the recycling tape RT, and a recycling roller horizontal drive unit 565 for adjusting the horizontal position of the recycling roller 510 by moving the recycling roller 510 based on the position information of the recycling tape measured by the recycling tape position sensor 550.

[0114] The recycled tape position sensor 550 can be configured on the roller of the line connecting the film peeling device 30 to the recycled tape storage section 505, and can measure the relative position of the recycled tape RT with respect to the corresponding roller. That is, the recycled tape position sensor 550 can determine whether the recycled tape RT is located at the center of the roller or deviated to the left or right. If the recycled tape position sensor 550 confirms that the recycled tape RT has deviated in a specific direction, a process for correcting the position of the recycled tape RT towards the center can be performed.

[0115] The recovery roller horizontal drive unit 565 can adjust the horizontal position (Y-direction position) of the tape recovery roller 510 according to the position of the recovery tape RT measured by the recovery tape position sensor 550. More specifically, refer to... Figure 14 The tape recovery roller 510 is coupled to the horizontal moving structure 515, and the recovery roller horizontal drive unit 565 moves the horizontal moving structure 515, thereby adjusting the position of the tape recovery roller 510. For example, when the recovered tape RT deviates in the -Y direction, the tape recovery roller 510 is moved in the +Y direction, and when the recovered tape RT deviates in the +Y direction, the tape recovery roller 510 is moved in the -Y direction.

[0116] The layering device 1 according to the present invention further includes a feed speed control unit 60 that works synchronously with the peeling roller 320 and the chuck drive unit 340 and controls the supply and recovery speed of the tape T.

[0117] The feed speed control unit 60 can operate synchronously with the peeling roller 320 and the chuck drive unit 340 of the film peeling device 30, and can operate when overall speed control of the tape T is required. That is, by adjusting the overall moving speed of the tape T through the feed speed control unit 60, the peeling roller 320 and the chuck drive unit 340 operate synchronously with the feed speed control unit 60 to achieve smooth peeling of the film F. The supply roller motor 430 and the recovery roller motor 530, which drive the tape supply roller 410 and the tape recovery roller 510, provide power for supplying and recovering the tape T. However, since the supply roller clutch 440 and the recovery roller clutch 540 usually operate in a semi-clutch state, the feed speed control unit 60 is used to adjust the rotational speed of the tape supply roller 410 and the tape recovery roller 510.

[0118] Reference Figure 15a as well as Figure 15bThe feed speed control unit 60 may include an upper feed roller 610 and a lower feed roller 620, a lower structure 630 coupled to the lower feed roller 620, and a cylinder 640 for raising and lowering the lower feed roller 620. The upper feed roller 610 may be configured to rotate a motor 615 by means of a feed speed control, and the feed speed of the conveyor belt T may be determined by means of the feed speed control motor 615. On the other hand, the lower feed roller 620 may be raised or lowered by means of the cylinder 640. If the lower feed roller 620 is raised, both sides of the retractable conveyor belt RT are pressed tightly against the upper feed roller 610 and the lower feed roller 620, and the speed of the retractable conveyor belt RT is adjusted by means of the upper feed roller 610.

[0119] The layering apparatus 1 according to the present invention may include a tape direction control unit 70 for correcting the skewness of the tape T supplied to the film peeling device 30. Since the tape T is located at the center of the peeling roller 320 and needs to be prevented from skewing to one side, the tape direction control unit 70 can measure the position of the tape T supplied to the peeling roller 320 and correct the skewness of the tape T so that the tape T is centered.

[0120] According to an embodiment of the present invention, the tape direction control unit 70 may include a tape alignment roller 710 configured to rotate relative to the vertical direction and supply tape T provided from tape supply unit 40 to film peeling device 30, a tape position measuring sensor 720 for measuring the position of tape T supplied to film peeling device 30, and a tape alignment drive unit 730 for controlling the rotation drive of tape alignment roller 710 based on tape position information.

[0121] like Figure 16a as well as Figure 16b As shown, the tape alignment roller 710 is provided in the form of a conveyor belt, guiding the tape T supplied from the tape supply unit 40 to the film peeling device 30. The tape alignment roller 710 is coupled to the tape alignment drive unit 730 in a manner capable of rotating about a vertical axis (Z-axis). The tape alignment drive unit 730 can rotate the tape alignment roller 710 based on the skew information of the tape T, thereby aligning the tape T with the center of the peeling roller 320. The tape position measuring sensor 720 can be configured as follows... Figure 16a as well as Figure 16b As shown, the portion of the tape alignment roller 710 located towards the film peeling device 30 can provide a controller (not shown) for controlling the tape alignment drive unit 730 to determine the position of the tape T. When the tape T deviates to the left or right, the controller controlling the tape alignment drive unit 730 controls the tape alignment drive unit 730 to rotate the tape alignment roller 710. By rotating the tape alignment roller 710 through the tape alignment drive unit 730, the position of the tape T is corrected.

[0122] According to the present invention, the layering device 1 may include a supply tape replacement sensor 407 disposed in the tape supply section 40 and measuring the amount of supply tape UT wound in the supply tape storage section 405, and a recycling tape replacement sensor 507 disposed in the tape recycling section 50 and measuring the amount of recycling tape RT wound in the recycling tape storage section 505. (See also...) Figure 17 The supply tape replacement sensor 407 may include a laser-based distance sensor that can measure the distance between the supply tape replacement sensor 407 and the supply tape UT to calculate the amount of remaining supply tape UT. Similarly, the recycling tape replacement sensor 507 may include a laser-based distance sensor that can measure the distance between the recycling tape replacement sensor 507 and the recycling tape RT to calculate the amount of remaining recycling tape RT.

[0123] When the supply tape UT is completely depleted, a new supply tape roll needs to be added to replace the depleted roll. Similarly, when the amount of recycled tape RT exceeds a certain limit, a new recycled tape roll needs to be added to replace the roll wound with recycled tape RT. A layering device 1 according to an embodiment of the present invention may include means for effectively replacing the supply tape UT or the recycled tape RT.

[0124] According to an embodiment of the present invention, a supply tape replacement unit 45 may be provided in the supply tape storage section 405 and configured to hold both ends of the supply tape UT for cutting the supply tape UT when replacing the supply tape UT, and a recycling tape replacement unit 55 may be provided in the tape recycling section 50 and configured to hold both ends of the recycling tape RT for cutting the recycling tape RT when replacing the recycling tape.

[0125] Reference Figure 18 The tape replacement unit 45 includes clamps 470A, 470B, 470C, and 470D for holding both ends of the supply tape UT, and an upper shearing guide groove 472 and a lower shearing guide groove 474 for cutting the supply tape UT. When the supply tape UT needs to be replaced, the supply tape UT can be fixed by the clamps 470A, 470B, 470C, and 470D, and the operator can cut the supply tape UT along the upper shearing guide groove 472 and the lower shearing guide groove 474. If a new supply tape UT is inserted after cutting an existing supply tape UT, the end of the new supply tape UT is connected to the end of the existing supply tape UT, so that the supply tape UT can be connected uninterruptedly.

[0126] Similarly, the recycling tape replacement unit 55 includes clamps 570A, 570B, 570C, and 570D for holding both ends of the recycling tape RT, and an upper shearing guide groove 572 and a lower shearing guide groove 574 for cutting the recycling tape RT. When it is necessary to replace the recycling tape RT, the recycling tape RT can be fixed by the clamps 570A, 570B, 570C, and 570D, and the operator can cut the recycling tape RT along the upper shearing guide groove 572 and the lower shearing guide groove 574. If the recycling tape RT is cut, the upper recycling tape RT is left while the lower recycling tape RT is removed. If a new recycling tape RT is inserted after cutting an existing recycling tape RT, the end of the new recycling tape RT is connected to the end of the existing recycling tape RT, so that the recycling tape RT can be connected uninterruptedly.

[0127] On the other hand, the film stripping device 30 according to the present invention can be configured as part of a layering module 1240 for stripping the film F on the wafer W inside the semiconductor manufacturing equipment 1000.

[0128] like Figure 19 As shown, the semiconductor manufacturing apparatus 1000 according to the present invention includes a loading port 1100 for supplying a wafer W with a film F attached thereon, a wafer transport module 1200 for transporting the wafer W, process processing modules 1310 and 1320 for performing process processing on the wafer W, and a delamination module 1240 for removing the film F from the wafer W. The delamination module 1240 includes a tape supply section 40 for supplying tape T for peeling off the film F, a film peeling device 30 for peeling the film F from the wafer W using tape T, and a tape recycling section 50 for recycling the tape T with the film F attached. The film peeling apparatus 30 includes a chuck 310 on which a wafer W with a film F attached is placed and configured to move in a horizontal direction (X direction); a peeling roller 320 that allows an adhesive tape T for peeling the film F from the wafer W to contact the film F and is configured to rotate at a speed corresponding to the moving speed of the chuck 310; and a peeling bar 330 provided in the shape of a bar and adjusted by rotation drive between the film F with the adhesive tape T attached and the wafer W. On the other hand, although in Figure 19 The term is omitted, but a wafer transport machine for transporting wafer W can also be constructed within the layered module 1240.

[0129] Loading port 1100 can be located outside the semiconductor manufacturing equipment 1000 and accommodates a transport container for accommodating wafer W. The transport container can be placed in loading port 1100 by a transport device. After the wafer W has been stripped of film F, it can be placed back into the transport container located in loading port 1100 and then transported by the transport device in a loaded state for subsequent processes.

[0130] The wafer transfer module 1200 transfers wafers W between modules within the semiconductor manufacturing equipment 1000. The wafer transfer module 1200 includes a robotic arm that holds the lower part of the wafer W and supplies the wafer W to each module, and a transfer guide 1210 that moves the robotic arm.

[0131] Processing modules 1310 and 1320 perform processing on wafers W with a film F attached, or on wafers W with the film F removed by the layering module 1240. For example, processing modules 1310 and 1320 can be configured as chambers for batch bonding of wafers W with multiple pre-bonded dies and a film F attached on top, using high-temperature and high-pressure gases. Furthermore, processing modules 1310 and 1320 can be composed of modules capable of performing various processing steps such as coating, etching, vapor deposition, and cleaning.

[0132] The layering module 1240 can remove the film F attached to the wafer W that has undergone processing by the process processing modules 1310 and 1320, or to the wafer W placed from the loading port 1100. The layering module 1240 may include components similar to those previously processed by the process processing modules 1310 and 1320. Figures 1 to 18 The membrane peeling device 30 and the layering device 1 described herein have similar structures.

[0133] This embodiment and the accompanying drawings are merely illustrative of a portion of the technical concept included in this invention. It is obvious that variations and specific embodiments that can be readily derived by those skilled in the art within the scope of the technical concept included in the specification and drawings of this invention are all included within the scope of the claims of this invention.

[0134] Therefore, the concept of the present invention should not be limited to the illustrated embodiments, not only to the appended claims, but also to all concepts that are equivalent or modified from the claims.

Claims

1. A membrane peeling device, comprising: A chuck is used to hold a wafer with a film attached to it, and is configured to move horizontally. A peeling roller is configured to allow the tape used to peel the film from the wafer to contact the film and to rotate at a speed corresponding to the moving speed of the chuck. as well as A peeling rod is used to adjust the peeling angle between the film with the adhesive tape attached and the wafer. The membrane peeling device includes: A chuck load sensor is used to measure the pressure applied to both sides of the chuck. The membrane stripping device further includes: The chuck rotation drive unit rotates the chuck based on the pressure applied to the chuck load sensor in order to align the chuck and the stripping roller.

2. The membrane peeling device according to claim 1, wherein, The membrane stripping device further includes: The chuck drive unit moves the chuck horizontally; and The roller rotation drive unit works synchronously with the chuck drive unit to rotate the stripping roller. The roller rotation drive unit causes the stripping roller to rotate at the same speed as the chuck moving via the chuck drive unit.

3. The membrane peeling device according to claim 1, wherein, The stripping bar is provided in a bar shape with a triangular cross-section.

4. The membrane peeling device according to claim 1, wherein, The membrane stripping device further includes: A peeling rod rotation drive unit is attached to the peeling rod and drives the peeling rod to rotate. The angle at which the film is peeled off from the wafer is adjusted by rotating the peeling rod.

5. The membrane peeling device according to claim 1, wherein, The membrane stripping device further includes: A roller temperature regulating unit is disposed in the internal space of the stripping roller and regulates the temperature of the stripping roller.

6. The membrane peeling device according to claim 1, wherein, The membrane stripping device further includes: The vertical drive unit moves the peeling roller and the peeling bar in the vertical direction.

7. A layering device, comprising: The loading port is supplied with a wafer with a film attached to it; Wafer transport machine, for transporting the wafers; The tape supply department supplies tape for peeling off the film; A film peeling device that uses the tape to peel the film off the wafer; as well as The tape recycling section recycles the tape with the film attached. The membrane peeling device includes: A chuck is used to hold a wafer with a film attached to it, and is configured to move horizontally. A peeling roller, such that the tape used to peel the film from the wafer contacts the film, and is configured to rotate at a speed corresponding to the moving speed of the chuck; and A peeling rod is used to adjust the peeling angle between the film with the adhesive tape attached and the wafer. The membrane peeling device includes: A chuck load sensor is used to measure the pressure applied to both sides of the chuck. The membrane stripping device further includes: The chuck rotation drive unit rotates the chuck based on the pressure applied to the chuck load sensor in order to align the chuck and the stripping roller.

8. The layering device according to claim 7, wherein, The tape supply unit includes: The tape supply storage unit supplies the wound tape to the film peeling device; A tension control unit controls the tension of the supply tape; and The supply position control unit controls the position of the supply tape.

9. The layering device according to claim 8, wherein, The supply tension control unit includes: A tape supply roller supplies the tape to the film peeling device; A tension measuring load sensor is used to measure the tension of the supplied tape; A supply roller motor provides power for rotating the tape supply roller; and The supply roller clutch adjusts the engagement force between the belt supply roller and the supply roller motor.

10. The layering device according to claim 9, wherein, The supply position control unit includes: A tape position sensor is used to determine the position of the supplied tape. as well as The supply roller horizontal drive unit adjusts the horizontal position of the tape supply roller by moving the tape supply roller based on the position information of the supply tape measured by the supply tape position sensor.

11. The layering device according to claim 7, wherein, The tape recycling unit includes: The recycled tape storage section stores the recycled tape with the film attached in a wound state; A tension control unit controls the tension of the recycled tape; and The recycling position control unit controls the position of the recycled tape relative to the stripping roller.

12. The layering device according to claim 11, wherein, The recovery tension control unit includes: A tape recycling roller supplies the recycled tape to the recycled tape storage section; A tension measurement load sensor is used to measure the tension of the recycled tape. A recycling roller motor provides power for rotating the tape recycling roller; and The recovery roller clutch adjusts the engagement force between the belt recovery roller and the recovery roller motor.

13. The layering device according to claim 12, wherein, The recovery location control unit includes: A recycled tape position sensor determines the position of the recycled tape. The horizontal drive unit of the recycling roller adjusts the horizontal position of the recycling roller by moving the recycling roller according to the position information of the recycling tape measured by the recycling tape position sensor.

14. The layering device according to claim 7, wherein, The layering device further includes: The tape direction control unit corrects the skewness of the tape supplied to the film peeling device.

15. The layering device according to claim 14, wherein, The tape direction control unit includes: The tape alignment roller is configured to rotate relative to the vertical direction and supply the tape provided from the tape supply unit to the film peeling device; A tape position measuring sensor measures the position of the tape supplied to the film peeling device; and The tape alignment drive unit controls the rotation drive of the tape alignment roller based on the slope information of the tape.

16. The layering device according to claim 7, wherein, The layering device further includes: The feed speed control unit works synchronously with the peeling roller and the chuck drive unit of the film peeling device to control the supply speed and recycling speed of the tape.

17. The layering device according to claim 7, wherein, The layering device further includes: A tape replacement sensing sensor is installed in the tape supply section and measures the amount of tape wound in the tape storage section; and A tape recycling sensor is installed in the tape recycling section and measures the amount of recycled tape wound in the tape storage section.

18. The layering device according to claim 7, wherein, The layering device further includes: A tape replacement unit is disposed in the tape supply section and configured to hold both ends of the supply tape for cutting it during tape replacement; and A tape recycling unit is provided in the tape recycling section and configured to hold both ends of the recycled tape in order to cut the recycled tape when replacing it.

19. A semiconductor manufacturing apparatus, comprising: The loading port is supplied with a wafer with a film attached to it; The wafer transfer module transports the wafers. The process processing module performs process processing on the wafer; as well as Layered module, removing the film from the wafer, The layered module includes: The tape supply department supplies tape for peeling off the film; A film peeling device that uses the tape to peel the film off the wafer; and The tape recycling section recycles the tape with the film attached. The membrane peeling device includes: A chuck is used to hold a wafer with a film attached to it, and is configured to move horizontally. A peeling roller, such that the tape used to peel the film from the wafer contacts the film, and is configured to rotate at a speed corresponding to the moving speed of the chuck; and A peeling bar, provided in a bar shape and adjustable by rotation drive, allows for the peeling angle between the film to which the adhesive tape is attached and the wafer. The membrane peeling device includes: A chuck load sensor is used to measure the pressure applied to both sides of the chuck. The membrane stripping device further includes: The chuck rotation drive unit rotates the chuck based on the pressure applied to the chuck load sensor in order to align the chuck and the stripping roller.

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