Method, device, processor and readable storage medium of processor for realizing laser oblique perforation processing in numerical control laser processing system

Abstract

The present application relates to a kind of numerical control laser processing system in the method for realizing laser oblique perforation processing, comprising the following steps: from current position, open height follow-up motion to the position of perforation just above, the position of height equal to cutting height from plate surface;According to tool path, adjust the posture of laser head when cutting;Laser head keeps posture unchanged, linearly retreats to cutting height;According to the perforation mode set by process, carry out perforation.The present application also relates to a kind of device for realizing laser oblique perforation, processor and computer readable storage medium.The method for realizing laser oblique perforation processing of numerical control laser processing system, device, processor and its computer readable storage medium using the present application, when using oblique perforation to carry out laser bevel cutting, realize the perforation under the premise of not damaging part.The present application has carried out the compensation of cutting position before and after oblique perforation, reduces the size error of bevel processing.

Description

Technical Field

[0001] The present invention relates to the field of laser cutting processing, in particular to the field of laser inclined piercing, and specifically refers to a method, apparatus, processor and computer-readable storage medium for realizing laser inclined piercing processing in a numerical control laser processing system. Background Art

[0002] In the processing process of laser cutting, when processing a relatively thick workpiece, piercing is first performed with a high-power laser, and then cutting is performed with an appropriate power. The purpose of piercing before cutting a thick plate is to ensure that the high-pressure airflow ejected from the laser head for blowing away molten slag during the cutting process is unobstructed and will not be blocked to flow backward. Backflow will cause the molten slag to rebound and hit the lens of the laser cutting head, thereby contaminating the lens and further affecting the processing effect, and even worse, directly damaging the lens.

[0003] Reference [1] invents a laser piercing method, which spatially divides the piercing process into two stages, and different laser parameters are adopted in the two stages respectively. A laser beam with high frequency and low duty cycle is used in stage I far away from the plate surface, and a laser beam with low frequency and low duty cycle is used in stage II relatively close to the plate surface, so as to improve the processing effect and cutting capability.

[0004] Reference [2] provides a piercing method aimed at reducing molten slag adhering to the piercing surface. This method divides piercing into three stages: in the first stage, at H1 which is farthest from the plate surface, a laser with low frequency and high peak power is used to irradiate the piercing position for a duration of t1, forming a small pit with a diameter of D1 on the surface of the plate; in the second stage, at H2 which is the second farthest from the plate surface, a laser with low frequency and a peak power slightly lower than that in the first stage is used to irradiate the piercing position for a duration t2 longer than t1, forming a small cylindrical pit with a diameter of D2 on the surface of the plate, where D2<D1; in the third stage, at the height H3 close to the plate surface, the plate is irradiated with a laser beam of high frequency and high peak power until the plate is penetrated.

[0005] For the purpose of improving piercing efficiency and optimizing piercing actions, Reference [3] invents a laser piercing method, a multi-stage piercing method and a continuous piercing method. The traditional piercing process is: the laser head starts to follow and moves to a low reference height above the plate surface, and then moves upward to the set piercing height. In order to improve efficiency, the present invention optimizes the process of moving to the piercing height. Considering the ranging accuracy problem when the height from the plate surface is greater than the measuring range of the capacitive displacement sensor (used for measuring the height from the plate), the inventive method proposed in the document is: when the piercing height is within the measuring range of the sensor, the height following control system is used to directly move to the piercing height; otherwise, when the piercing height is outside the measuring range, the height following control system is first used to move to the upper limit of the measuring range of the sensor, and then move upward to the piercing height.

[0006] Reference [4] proposed a fast and stable laser perforation method to solve the problems of bursting and overheating during the perforation process. The invention divides the perforation process into two stages t1 and t2 in time. The laser head is always kept at the perforation height. The laser frequency, duty cycle, focus and other parameters are different in each stage. After the laser beam of the first stage is used for puncture for t1, the laser beam of the second stage is switched until the perforation is completed.

[0007] Current laser perforation technology is designed for perforations that penetrate perpendicularly through a board surface. When performing beveling, if the perforation is done perpendicularly first, followed by cutting, the perpendicular perforation will damage the beveling of the part. Figure 1 As shown. This addresses the perforation problem in beveling processes.

[0008] References:

[0009] [1] Patent name: Laser perforation method; Authorization announcement number: CN 106799544 B Patentee: Han's Laser Technology Industry Group Co., Ltd.;

[0010] [2] Patent name: Laser perforation method and laser cutting through hole method; Authorization announcement number: CN 103878494B Patentee: Han's Laser Technology Industry Group Co., Ltd.;

[0011] [3] Patent name: A laser perforation method, a multi-stage perforation method and a continuous perforation method; Authorization announcement number: CN111745311 B Patentee: Han's Laser Technology Industry Group Co., Ltd.;

[0012] [4] Patent name: A laser perforation method; Authorization announcement number: CN 110773885 B Patentee: Jinan Bond Laser Co., Ltd. Summary of the Invention

[0013] The purpose of this invention is to overcome the shortcomings of the prior art and provide a method, apparatus, processor and computer-readable storage medium for laser oblique drilling in a CNC laser processing system that meets the requirements of small dimensional error, no damage to parts and wide applicability.

[0014] To achieve the above objectives, the method, apparatus, processor, and computer-readable storage medium for laser oblique drilling processing in the CNC laser processing system of the present invention are as follows:

[0015] The method for laser oblique drilling in this CNC laser processing system is characterized by the following steps:

[0016] (1) The laser head activates the height following function and moves from the current position to directly above the perforation position, at a height equal to the cutting height.

[0017] (2) Adjust the laser head posture during cutting according to the blade path;

[0018] (3) The laser head maintains its posture and retracts in a straight line to the cutting height;

[0019] (4) Perform perforation according to the perforation method set in the process.

[0020] Preferably, step (1) further includes the following steps:

[0021] The laser head nozzle is used to measure the height of the laser head nozzle from the plate surface in real time using a capacitive sensor. If the measured value is not equal to the set cutting height, the laser head is automatically adjusted to move up and down in the vertical direction to ensure that the actual height is consistent with the set height.

[0022] Preferably, step (2) specifically includes the following steps:

[0023] (2.1) Rotate the laser head with the center of the nozzle as the rotation center to adjust the posture;

[0024] (2.2) Compensate for the cutting position.

[0025] Preferably, the perforation method in step (4) includes segmented perforation, progressive perforation, or non-intrusive perforation.

[0026] Preferably, the piercing height during piercing in step (4) is greater than the cutting height.

[0027] The device for performing laser oblique drilling in a CNC laser processing system is characterized in that the device comprises:

[0028] A processor is configured to execute computer-executable instructions;

[0029] The memory stores one or more computer-executable instructions, which, when executed by the processor, implement the various steps of the method for laser oblique drilling processing in the above-described CNC laser processing system.

[0030] The processor used to implement laser oblique drilling processing in a CNC laser processing system is characterized in that the processor is configured to execute computer-executable instructions, which, when executed by the processor, implement the various steps of the method for implementing laser oblique drilling processing in the CNC laser processing system described above.

[0031] The main feature of this computer-readable storage medium is that it stores a computer program that can be executed by a processor to implement the various steps of the method for laser oblique drilling in the above-described CNC laser processing system.

[0032] The present invention discloses a method, apparatus, processor, and computer-readable storage medium for laser oblique drilling in a CNC laser processing system. When performing laser beveling with oblique drilling, the drilling is completed without damaging the part. The present invention compensates for the cutting position before oblique drilling, reducing dimensional errors in the beveling process. Attached Figure Description

[0033] Figure 1 This is a schematic diagram of a vertically perforated and beveled part, illustrating the method for laser oblique perforation processing in the CNC laser processing system of the present invention.

[0034] Figure 2 This is a flowchart of a method for laser oblique drilling in the CNC laser processing system of the present invention.

[0035] Figure 3 This is a schematic diagram of the oblique drilling action in the method of laser oblique drilling processing in the CNC laser processing system of the present invention.

[0036] Figure 4 This is a schematic diagram of the posture adjustment method for laser oblique drilling processing in the CNC laser processing system of the present invention.

[0037] Figure 5 This is a schematic diagram illustrating the method of retracting to the cutting height in the CNC laser processing system of the present invention for laser oblique drilling. Detailed Implementation

[0038] To more clearly describe the technical content of the present invention, the following description is provided in conjunction with specific embodiments.

[0039] The method for laser oblique drilling in the CNC laser processing system of the present invention includes the following steps:

[0040] (1) The laser head activates the height following function and moves from the current position to directly above the perforation position, at a height equal to the cutting height.

[0041] (2) Adjust the laser head posture during cutting according to the blade path;

[0042] (3) The laser head maintains its posture and retracts in a straight line to the cutting height;

[0043] (4) Perform perforation according to the perforation method set in the process.

[0044] In a preferred embodiment of the present invention, step (1) further includes the following steps:

[0045] The laser head nozzle is used to measure the height of the laser head nozzle from the plate surface in real time using a capacitive sensor. If the measured value is not equal to the set cutting height, the laser head is automatically adjusted to move up and down in the vertical direction to ensure that the actual height is consistent with the set height.

[0046] In a preferred embodiment of the present invention, step (2) specifically includes the following steps:

[0047] (2.1) Rotate the laser head with the center of the nozzle as the rotation center to adjust the posture;

[0048] (2.2) Compensate for the cutting position.

[0049] As a preferred embodiment of the present invention, the perforation method in step (4) includes segmented perforation, progressive perforation, or non-invasive perforation.

[0050] In a preferred embodiment of the present invention, the perforation height during perforation in step (4) is greater than the cutting height.

[0051] The apparatus of the present invention for performing laser oblique drilling processing in a CNC laser processing system, wherein the apparatus comprises:

[0052] A processor is configured to execute computer-executable instructions;

[0053] The memory stores one or more computer-executable instructions, which, when executed by the processor, implement the various steps of the method for laser oblique drilling processing in the above-described CNC laser processing system.

[0054] The present invention discloses a processor for implementing laser oblique drilling processing in a CNC laser processing system, wherein the processor is configured to execute computer-executable instructions, and when the computer-executable instructions are executed by the processor, the various steps of the method for implementing laser oblique drilling processing in the CNC laser processing system are implemented.

[0055] The computer-readable storage medium of the present invention stores a computer program that can be executed by a processor to implement the various steps of the method for laser oblique drilling in the above-described CNC laser processing system.

[0056] In a specific embodiment of the present invention, a method for laser oblique drilling is provided to solve the drilling problem during laser cutting for beveling, so as to achieve the effect of normal drilling without damaging the part during oblique cutting.

[0057] This case addresses the perforation problem in a bevel cutting scenario, proposing a method and procedure for oblique perforation. To solve the perforation problem in laser bevel cutting, this case proposes a method for perforation using an inclined laser head. This case discloses how to adjust the laser head's attitude before perforation, the attitude used at the start of perforation, and how to ensure the accuracy of the perforation position in an oblique perforation method. This case achieves oblique perforation by adjusting the cutting head's attitude step by step.

[0058] There are two methods for laser beveling: one is to pierce vertically first, and then adjust the laser head posture to the target posture for beveling; the other is to directly pierce at an angle using the posture for beveling. This case uses an inclined laser head for oblique piercing, and then cuts directly after piercing, which can improve cutting efficiency and avoid material waste.

[0059] In vertical piercing, the laser beam emitted from the laser head is perpendicular to the cutting surface; in oblique piercing, the laser beam emitted from the laser head is not perpendicular to the cutting surface. A common technique for bevel cutting and oblique piercing is to add a guide line. A vertical piercing is first performed at the starting point of the guide line, and then cutting continues along the guide line. The laser head posture is adjusted during the cutting process along the guide line. The guide line is a curve or straight line selected outside the starting point of the machining process, representing the piercing point. Oblique piercing may not require a guide line.

[0060] The machine tool used in the embodiments of this invention is a five-axis CNC machine tool. In addition to translation in the X, Y, and Z directions, the laser head can also rotate around the X and Z axes respectively. During rotation, the X and Z axes act as rotation axes. To distinguish them from the translation axes, the rotation axes X and Z are referred to as the A-axis and C-axis, respectively. The laser head structure of this machine tool is as follows: the C-axis is the main rotation axis, and the A-axis is the auxiliary rotation axis. Rotation of the C-axis changes the direction of the A-axis, but rotation of the A-axis does not change the direction of the C-axis.

[0061] To address the perforation problem in laser beveling, this invention provides a method for oblique perforation, comprising the following steps:

[0062] S1: The laser head activates its follow-up function, maintaining its current posture and moving to the position with coordinates (Xo, Yo, Zo, Ao, Co) based on the starting cutting point coordinates (Xo, Yo, Zo + Hc, A', C') provided by the toolpath. Here, Hc is the cutting height, A' and C' are the initial angles of the laser head's rotation along the A and C axes before it moves, respectively, and Ao and Co are the target angles of the laser head's rotation along the A and C axes at the starting cutting point (Xo, Yo, Zo).

[0063] The process of movement is as follows Figure 3As shown: the laser head moves from position ① to position ②. The follow-up function is essentially a height-following function. It uses a capacitive sensor to measure the height of the laser head nozzle from the board surface in real time. When this measured value is not equal to the set cutting height, it automatically adjusts the laser head to move up and down vertically to ensure that the actual height matches the set height. The purpose of moving to the cutting height is to obtain a reference height to determine the position of the perforation height. Because the board surface cannot be perfectly flat or perfectly horizontal, a reference height is needed.

[0064] Height refers to the vertical distance between the laser head nozzle and the board surface. It is a relative value, with the board surface as the reference. When the laser head nozzle is in contact with the board surface, the height is 0. Theoretically, the laser head should be moved to the board surface to obtain the reference, but in practice, for safety reasons, the laser head is only moved to the cutting height position to prevent the laser head from hitting the board and causing damage.

[0065] S2: Adjust the laser head to the cutting orientation, such as... Figure 3 As shown, the laser head moves from position ② to position ③. During beveling, the laser head is not perpendicular to the plate surface, therefore the laser head orientation needs to be adjusted to drill along the cutting direction. If the laser head is first drilled perpendicularly at the cutting point and then the orientation is adjusted, it may damage the beveled part, such as... Figure 1 As shown.

[0066] S2.1: Using the center of the laser head nozzle as the rotation center, adjust the attitude so that the coordinates of the laser head nozzle center change from (Xo, Yo, Zo+Hc, A', C') to (Xo, Yo, Zo+Hc, Ao, Co).

[0067] Actions such as Figure 4 The attitude is adjusted from 2.1 to 2.2. To ensure that the height of the laser head relative to the plate remains constant during the attitude adjustment process, the center of the laser head nozzle must be used as the center of rotation. To achieve the rotation of the laser head around the nozzle center point, the laser head must rotate around its rotation axis while also performing translational motion to achieve the effect of rotating around the nozzle center.

[0068] Enable the RTCP (Rotational Tool Center Point) function to rotate the laser head around the center point of the nozzle. RTCP refers to the Rotational Tool Center Point Control function, also known as the tool tip following function, which is a means for five-axis CNC machine tools to achieve complex machining.

[0069] S2.2: After adjusting the posture, compensate for the cutting position, the action is as follows: Figure 4 The laser head moves from posture 2.1 to posture 2.3. After the laser head rotates around the center point of the nozzle, the intersection of the beam and the plate surface is no longer at the position to be cut. If no compensation is made, the dimensions of the processed parts will be incorrect.

[0070] After cutting position compensation, the coordinates of the center point of the laser head nozzle change from (Xo, Yo, Zo+Hc, Ao, Co) to (Xo+dX, Yo+dY, Zo+Hc, Ao, Co), where dX = |PQ|*sin(Co), dY = |PQ|*cos(Co), dX and dY are the projections of the length |PQ| onto the X-axis and Y-axis, respectively, and |PQ| = Hc*tan(∠POQ). The sign of |PQ| depends on the sign of the angle ∠POQ, which is actually the bevel angle.

[0071] S3: The laser head maintains its posture and retracts in a straight line to the cutting height, such as... Figure 5 Positions ③ to ④ in the middle.

[0072] As the linear motion retracts to the cutting height, the coordinates of the midpoint of the laser head nozzle change as follows: (Xo+dX, Yo+dY, Zo+Hc, Ao, Co) → (Xo+dX+δX, Yo+dY+δY, Zo+Hb, Ao, Co), where δX and δY are the projections of the horizontal retraction distance |QS| onto the X and Y axes, respectively, δX = |QS|*sin(Co), δY = |QS|*cos(Co), and Hb is the set perforation height.

[0073] S4: Depending on the drilling method specified in the process plan, segmented drilling, progressive drilling, or non-contact drilling may be used. Currently, the commonly used laser drilling methods are: segmented drilling, progressive drilling, and non-contact drilling. Regardless of the drilling method, a drilling height is required, which must be greater than the cutting height.

[0074] For the specific implementation scheme of this embodiment, please refer to the relevant descriptions in the above embodiments, which will not be repeated here.

[0075] It is understood that the same or similar parts in the above embodiments can be referred to each other, and the contents not described in detail in some embodiments can be referred to the same or similar contents in other embodiments.

[0076] It should be noted that in the description of this invention, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance. Furthermore, in the description of this invention, unless otherwise stated, "a plurality of" means at least two.

[0077] Any process or method description in the flowchart or otherwise herein can be understood as representing a module, segment, or portion of code comprising one or more executable instructions for implementing a particular logical function or process, and the scope of the preferred embodiments of the invention includes additional implementations in which functions may be performed not in the order shown or discussed, including substantially simultaneously or in reverse order depending on the functions involved, as will be understood by those skilled in the art to which embodiments of the invention pertain.

[0078] It should be understood that various parts of the present invention can be implemented in hardware, software, firmware, or a combination thereof. In the above embodiments, multiple steps or methods can be implemented in software or firmware stored in memory and executed by a suitable instruction execution device. For example, if implemented in hardware, as in another embodiment, it can be implemented using any one or a combination of the following techniques known in the art: discrete logic circuits having logic gates for implementing logical functions on data signals, application-specific integrated circuits (ASICs) having suitable combinational logic gates, programmable gate arrays (PGAs), field-programmable gate arrays (FPGAs), etc.

[0079] Those skilled in the art will understand that all or part of the steps of the methods in the above embodiments can be implemented by a program instructing related hardware. The corresponding program can be stored in a computer-readable storage medium. When the program is executed, it includes one or a combination of the steps of the method embodiments.

[0080] Furthermore, the functional units in the various embodiments of the present invention can be integrated into a processing module, or each unit can exist physically separately, or two or more units can be integrated into a module. The integrated module can be implemented in hardware or as a software functional module. If the integrated module is implemented as a software functional module and sold or used as an independent product, it can also be stored in a computer-readable storage medium.

[0081] The storage media mentioned above can be read-only memory, disk, or optical disk, etc.

[0082] In the description of this specification, references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0083] The present invention discloses a method, apparatus, processor, and computer-readable storage medium for laser oblique drilling in a CNC laser processing system. When performing laser beveling with oblique drilling, the drilling is completed without damaging the part. The present invention compensates for the cutting position before oblique drilling, reducing dimensional errors in the beveling process.

[0084] In this specification, the invention has been described with reference to specific embodiments thereof. However, it will be apparent that various modifications and variations can be made without departing from the spirit and scope of the invention. Therefore, the specification and drawings should be considered illustrative rather than restrictive.

Claims

1. A method for laser oblique drilling processing in a CNC laser processing system, characterized in that, The method includes the following steps: (1) The laser head is activated with height following function. It moves from the current position to directly above the perforation position, at a height equal to the cutting height. (2) Adjust the laser head posture during cutting according to the tool path; (3) The laser head maintains its posture and retracts in a straight line to the perforation height; (4) Perform perforation according to the perforation method specified in the process; Step (2) specifically includes the following steps: (2.1) Rotate the laser head with the center of the nozzle as the rotation center to adjust the posture; (2.2) Compensate for the cutting position.

2. The method for laser oblique drilling processing in the CNC laser processing system according to claim 1, characterized in that, Step (1) further includes the following steps: The laser head nozzle is used to measure the height of the laser head nozzle from the plate surface in real time using a capacitive sensor. If the measured value is not equal to the set cutting height, the laser head is automatically adjusted to move up and down in the vertical direction to ensure that the actual height is consistent with the set height.

3. The method for laser oblique drilling processing in the CNC laser processing system according to claim 1, characterized in that, The perforation method in step (4) includes segmented perforation, progressive perforation, or non-invasive perforation.

4. The method for laser oblique drilling processing in the CNC laser processing system according to claim 1, characterized in that, In step (4), the piercing height is greater than the cutting height.

5. An apparatus for performing laser oblique drilling processing in a CNC laser processing system, characterized in that, The device includes: A processor is configured to execute computer-executable instructions; The memory stores one or more computer-executable instructions, which, when executed by the processor, implement the steps of the method for laser oblique drilling in the CNC laser processing system according to any one of claims 1 to 4.

6. A processor for performing laser oblique drilling processing in a CNC laser processing system, characterized in that, The processor is configured to execute computer-executable instructions, which, when executed by the processor, implement the steps of the method for laser oblique drilling processing in the CNC laser processing system according to any one of claims 1 to 4.

7. A computer-readable storage medium, characterized in that, It stores a computer program that can be executed by a processor to implement the various steps of the method for laser oblique drilling in the CNC laser processing system according to any one of claims 1 to 4.

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