Substrate processing apparatus and substrate processing method using the same

Abstract

The present application provides a substrate processing device with improved efficiency and productivity. The substrate processing device of the present application includes a process chamber having a processing space inside, a transfer robot that moves a substrate into and out of the processing space and includes a robot hand for grabbing the substrate, and a teach buffer that arranges the robot hand, wherein the teach buffer includes a teach plate that provides a reference point and at least one camera that faces the teach plate, wherein the camera photographs the reference point of the teach plate, and the transfer robot aligns the robot hand with the reference point by using the camera.

Description

Technical Field

[0001] The present invention relates to a substrate processing apparatus and a substrate processing method using the substrate processing apparatus. Background Technology

[0002] To manufacture semiconductor devices, a variety of processes are used to process the substrate, including photolithography, etching, ashing, ion implantation, thin film deposition, and cleaning, in order to form the desired pattern on the substrate.

[0003] To perform the above processes, the substrate needs to be transferred and transported to various process chambers. Specifically, a transport robot capable of transferring and transporting the substrate is used to move the substrate to each chamber. At this point, the transport robot needs to be aligned before the substrate can be accurately moved to the desired position. Controlling and aligning the robot visually could take a significant amount of time. Summary of the Invention

[0004] Technical problems to be solved

[0005] The technical problem to be solved by the present invention is to provide a substrate processing apparatus that improves efficiency and productivity.

[0006] Another technical problem to be solved by the present invention is to provide a substrate processing method that improves efficiency and productivity.

[0007] The problems to be solved by the present invention are not limited to those described above. Other problems not mentioned can be clearly understood by those skilled in the art through the following description.

[0008] Solution

[0009] To solve the above-mentioned technical problems, a substrate processing apparatus according to one aspect of the present invention includes: a process chamber having a processing space inside; a transport robot for moving a substrate into and out of the processing space, and including a manipulator for gripping the substrate; and a teach pendant for aligning the manipulator, wherein the teach pendant includes a teach pendant providing a reference point and at least one camera facing the teach pendant, the camera capturing the reference point of the teach pendant, and the transport robot aligning the manipulator with the reference point by using the camera.

[0010] In some embodiments, the robot includes alignment marks disposed at the end of the robot, and the teach buffer aligns the robot by comparing the alignment marks with a reference point.

[0011] In some embodiments, the alignment mark is aligned with the center point of the substrate.

[0012] In some embodiments, a reference point is captured at a first location, and the robotic arm is aligned at the first location.

[0013] In some embodiments, the vertical distance between the teaching board and the camera is the same as the vertical distance between the robot and the camera.

[0014] In some embodiments, the camera includes a prism configuration.

[0015] In some embodiments, the camera includes a first camera and a second camera spaced apart from each other.

[0016] In some embodiments, the reference points include a first reference point and a second reference point that are spaced apart from each other, a first camera captures the first reference point, and a second camera captures the second reference point.

[0017] In some embodiments, the robotic arm includes a first hand and a second hand spaced apart from each other, the first hand being aligned with a first reference point and the second hand being aligned with a second reference point.

[0018] To solve the above-mentioned technical problems, a substrate processing apparatus according to another aspect of the present invention includes: a process chamber having a processing space inside; a transport robot for moving a substrate into and out of the processing space, and including a first hand and a second hand for gripping the substrate; and a teaching buffer for aligning the first hand and the second hand, wherein the teaching buffer includes a teaching board providing a first reference point and a second reference point, a first camera for capturing the first reference point, and a second camera for capturing the second reference point, wherein the transport robot uses the first reference point to align the first hand and uses the second reference point to align the second hand.

[0019] In some embodiments, the first hand includes a first alignment mark disposed at the end of the first hand, and the teaching buffer aligns the first hand by comparing the first alignment mark with a first reference point.

[0020] In some embodiments, the vertical distance between the first camera and the first reference point is the same as the vertical distance between the first hand and the first camera, and the vertical distance between the second camera and the second reference point is the same as the vertical distance between the second camera and the second hand.

[0021] In some embodiments, the vertical position of the first reference point and the second reference point being photographed is the same as the vertical position of the first hand and the second hand being aligned.

[0022] In some embodiments, the camera includes a prism configuration.

[0023] To solve the above-mentioned technical problems, a substrate processing method according to one aspect of the present invention includes the following steps: loading a teach pendant including reference points into a teach buffer; using a camera arranged above the teach pendant to photograph the reference points; loading a robot including alignment marks into the teach buffer; and aligning the robot by comparing the reference points with the alignment marks, wherein the robot grips the substrate and moves the substrate into and out of a process chamber.

[0024] In some embodiments, the alignment mark may be aligned with the center point of the substrate.

[0025] In some embodiments, the teaching board is loaded at the same location as the robotic arm.

[0026] In some embodiments, the camera includes a first camera and a second camera spaced apart from each other, and the reference point includes a first reference point and a second reference point spaced apart from each other. The first camera is used to capture the first reference point, and the second camera is used to capture the second reference point.

[0027] In some embodiments, the robotic arm includes a first hand and a second hand spaced apart from each other.

[0028] The first hand is aligned with the first reference point, and the second hand is aligned with the second reference point.

[0029] In some embodiments, the camera includes a prism configuration.

[0030] Specific details of other embodiments are included in the description and drawings of this invention. Attached Figure Description

[0031] Figure 1 This is a schematic plan view of a substrate processing apparatus according to some embodiments of the present invention.

[0032] Figure 2 It is used for explanation Figure 1 Example diagram of a teach buffer.

[0033] Figure 3 It is used for explanation Figure 2 An exemplary top view of the teaching board.

[0034] Figure 4 It is used for explanation Figure 1 Example image of a work robot.

[0035] Figure 5 This is an exemplary flowchart illustrating a substrate processing method according to some embodiments.

[0036] Figure 6 It is used for explanation Figure 5 The diagram for step S100.

[0037] Figure 7 and Figure 8 It is used for explanation Figure 5 The diagram for step S200.

[0038] Figure 9 It is used for explanation Figure 5 The diagram for step S300.

[0039] Figure 10 It is used for explanation Figure 5 The diagram for step S400.

[0040] Figure 11 and Figure 12 It is used for explanation Figure 5 The diagram for step S500. Detailed Implementation

[0041] Preferred embodiments of the invention will be described in detail below with reference to the accompanying drawings. The advantages and features of the invention, as well as the methods for achieving these advantages and features, will become apparent from the embodiments described in detail below in conjunction with the accompanying drawings. However, the invention is not limited to the embodiments disclosed below, but can be implemented in various different forms, and these embodiments are provided only to complete the disclosure of the invention and to fully inform those skilled in the art of the scope of the invention, and the invention is defined only by the scope of the claims. Throughout the specification, the same reference numerals refer to the same constituent elements.

[0042] When an element or layer is referred to as being "above" or "on top of" another element or layer, it includes not only being directly above another element or layer, but also cases where another layer or element is intervening in between. Conversely, when an element is referred to as being "directly above" or "straight above," it indicates that there is no other element or layer intervening in between.

[0043] Spatial relative terms such as “below,” “under,” “lower,” “above,” and “upper” can be used to describe the relationship between one element or component and other elements or components as shown in the figure. Spatial relative terms should be understood to include terms indicating different orientations of the element during use or operation, in addition to those shown in the figure. For example, in the case where the element shown in the figure is flipped, an element described as “below” or “under” another element can be positioned “above” another element. Therefore, the exemplary term “below” can include both lower and upper orientations. Element can also be oriented in other directions, and therefore spatial relative terms can be interpreted according to orientation.

[0044] Although terms such as "first," "second," etc., are used to describe various elements, constituent elements, and / or parts, it is clear that these elements, constituent elements, and / or parts are not limited by these terms. These terms are only used to distinguish one element, constituent element, or part from other elements, constituent elements, or parts. Therefore, within the technical concept of this invention, the first element, first constituent element, or first part mentioned below can obviously also be a second element, second constituent element, or second part.

[0045] The terminology used in this specification is for describing embodiments and is not intended to limit the invention. In this specification, the singular form also includes the plural form unless otherwise specified in the sentence. The terms "comprises" and / or "comprising" as used in this specification mean including the mentioned constituent elements, steps, operations, and / or components, without excluding the presence or addition of more than one other constituent element, step, operation, and / or component.

[0046] Unless otherwise defined, all terms used in this specification (including technical and scientific terms) may be used in the sense that would be commonly understood by one of ordinary skill in the art to which this invention pertains. Furthermore, unless explicitly defined otherwise, terms defined in commonly used dictionaries should not be interpreted in an idealized or excessive manner.

[0047] In the following description, embodiments of the present invention will be described in detail with reference to the accompanying drawings. When describing with reference to the drawings, the same or corresponding constituent elements will be assigned the same reference numerals regardless of the drawing numbers, and repeated descriptions thereof will be omitted.

[0048] In the following text, reference will be made to Figures 1 to 4 A substrate processing apparatus according to some embodiments is described.

[0049] Figure 1 This is a schematic plan view of a substrate processing apparatus according to some embodiments of the present invention.

[0050] Reference Figure 1 According to some embodiments, the substrate processing apparatus includes an Equipment Front-End Module 10 and a process module 20. The Equipment Front-End Module 10 may be disposed on one side of the process module 20. For example, the Equipment Front-End Module 10 may be disposed in front of the process module 20. The Equipment Front-End Module 10 may include a plurality of loading ports 100 and an indexing module 200. The process module 20 may include a load locking chamber 300, a process chamber 400, a transport chamber 500, a transport robot 600, and a teach pendant buffer 700.

[0051] Indexing module 200 is arranged between loading port 100 and process module 20. Indexing module 200 transfers substrate W between loading port 100 and process module 20. Each loading port 100 provides space for placing a container FOUP containing the substrate W. Indexing module 200 may include indexing robot 210. Indexing robot 210 can remove substrate W from the container FOUP placed on loading port 100 and transfer the substrate W before processing to process module 20. Furthermore, indexing robot 210 can also feed processed substrate W from process module 20 into container FOUP.

[0052] Process module 20 may include a transport chamber 500, multiple load locking chambers 300, and multiple process chambers 400. In a plan view, the transport chamber 500 may have a polygonal shape. The load locking chambers 300 and process chambers 400 may be arranged at the corners of the transport chamber 500. The load locking chamber 300 may be arranged at the corner of the transport chamber 500 closest to the front-end module 10.

[0053] For example, in a plan view, the transport chamber 500 may have a hexagonal shape. The transport chamber 500 may have six corners. Four process chambers 400 and two load locking chambers 300 may be respectively arranged at the four corners of the process chamber 400. However, the technical concept of the present invention is not limited thereto. Obviously, the shape of the transport chamber 500 and the number of process chambers 400 and load locking chambers 300 arranged adjacent to the transport chamber 500 can be changed.

[0054] A transport robot 600 may be disposed inside a transport chamber 500. The transport robot 600 transports a substrate W between a load locking chamber 300 and a process chamber 400. The transport robot 600 may include a robotic arm 610 and a robotic hand 620. The robotic hand 620 can grasp the substrate W. The robotic arm 610 can move along the x-axis, y-axis, and z-axis. In some embodiments, the transport robot 600 may utilize a camera of a teach pendant 700. Figure 2 (720) to align the robotic arm 620.

[0055] The load-locking chamber 300 provides space for temporarily storing the substrate W being moved into or out of the process module 20. The interior of the load-locking chamber 300 can be converted to vacuum or atmospheric pressure. Thus, the interiors of the transport chamber 500 and the process chamber 400 can be maintained under vacuum, while the interior of the device front-end module 10 can be maintained under atmospheric pressure. A first gate valve 310 is installed between the load-locking chamber 300 and the device front-end module 10. A second gate valve 330 is installed between the load-locking chamber 300 and the transport chamber 500. Only one of the first gate valve 310 and the second gate valve 330 can be opened, allowing the interiors of the transport chamber 500 and the process chamber 400 to maintain a vacuum.

[0056] The process chamber 400 is used to perform processes on the substrate W. The process chamber 400 may include a processing space inside it. For example, the process chamber 400 may perform at least one of etching, photolithography, and development processes, but is not limited thereto.

[0057] In some embodiments, the substrate processing apparatus may further include a control module 1000. The control module 1000 can control the transport chamber 500, the load locking chamber 300, the process chamber 400, the transport robot 600, and the teach pendant buffer 700. Furthermore, the control module 1000 can control the transport robot 600's transfer of the substrate W. The control module 1000 may also use the teach pendant buffer 700 to control the alignment of the transport robot 600, but is not limited thereto.

[0058] The teach pendant 700 can be disposed outside or inside the transport chamber 500. The teach pendant 700 can be used to automatically align the robotic arm 620 of the transport robot 600. Figure 2 Let me describe the teach buffer 700 in detail.

[0059] Figure 2 It is used for explanation Figure 1 Example diagram of a teach buffer. Figure 3 It is used for explanation Figure 2 An exemplary top view of the teaching board.

[0060] Reference Figure 2 and Figure 3 The teach buffer 700 may include a buffer body 710, a camera 720, and a teach board 730.

[0061] Camera 720 can be mounted on buffer body 710. Camera 720 can face teaching board 730. Camera 720 can photograph reference point 735 of teaching board 730. Camera 720 may include, but is not limited to, a prism configuration.

[0062] In some embodiments, at least one camera 720 may be included. For example, camera 720 may include a first camera 720a and a second camera 720b. The first camera 720a and the second camera 720b may be spaced apart from each other. The first camera 720a and the second camera 720b may respectively capture images of a first reference point 735a and a second reference point 735b. Camera 720 may generate an image by capturing images of reference point 735 of the teaching board 730. Camera 720 may generate reference coordinates by capturing images of reference point 735.

[0063] The teach pendant 730 can be disposed inside the buffer body 710. The teach pendant 730 can be loaded into or unloaded from the buffer body 710 (see reference numeral 740 in the accompanying drawings). For example, when the camera 720 photographs the teach pendant 730, the teach pendant 730 can be loaded into the buffer body 710. When the camera 720 photographs the robotic arm (…), the teach pendant 730 can be loaded into the buffer body 710. Figure 1 When aligning (620), the teach pendant 730 can be unloaded from the buffer body 710.

[0064] The teaching pendant 730 may include a plate 731 and a reference point 735. The reference point 735 may be located on the plate 731. The reference point 735 may be used for aligning a robotic arm ( Figure 1 The reference point 735 (620) may include at least one reference point 735. For example, reference point 735 may include a first reference point 735a and a second reference point 735b. However, the technical concept of the present invention is not limited thereto.

[0065] In some embodiments, the first reference point 735a can be used to align the first hand ( Figure 4 (620a). The second reference point 735b can be used to align the second hand ( Figure 4 (620b). The first reference point 735a may correspond to the first alignment mark ( Figure 4 (625a). The second reference point 735b may correspond to the second alignment mark ( Figure 4 (625b).

[0066] Figure 4 It is used for explanation Figure 1 Example image of a delivery robot. (See reference) Figure 4 A more detailed description of the transport robot 600.

[0067] Reference Figure 4 The transport robot 600 includes a robotic arm 610 and a robotic hand 620. The robotic hand 620 can be used to grasp a substrate ( Figure 1 The robotic arm 610 can be an arm for moving the robotic hand 620 and the substrate W.

[0068] For example, a robotic arm 620 may include a first hand 620a and a second hand 620b. The first hand 620a and the second hand 620b may be spaced apart from each other. Each robotic arm 620 includes an alignment mark 625. The alignment mark 625 may be a mark used for aligning the robotic arms 620. For example, a camera in a teach pendant ( Figure 2 The 720 can photograph the reference point of the teaching board ( Figure 3 (735), and align the robot arm 620 by comparing the captured reference point with the alignment mark 625. The reference point will be... Figures 5 to 12 Describe in detail the alignment method of the robotic arm 620.

[0069] The alignment mark 625 includes a first alignment mark 625a and a second alignment mark 625b. The first alignment mark 625a is formed on the first hand portion 620a. The second alignment mark 625b is formed on the second hand portion 620b. The first alignment mark 625a can be used to align the first hand portion 620a. The second alignment mark 625b can be used to align the second hand portion 620b. However, the technical concept of the present invention is not limited thereto.

[0070] In some embodiments, the alignment mark 625 may be aligned with the center point of the substrate, but is not limited thereto. In some embodiments, the alignment mark 625 is shown as having a cross shape, but is not limited thereto.

[0071] The following describes the operation method of the substrate processing apparatus and the substrate processing method according to some embodiments.

[0072] Figure 5 This is an exemplary flowchart illustrating a substrate processing method according to some embodiments.

[0073] Reference Figure 5 According to some embodiments, a substrate processing method may include the following steps: loading a teach pendant into a teach buffer (S100); using a camera to photograph a reference point (S200); unloading the teach pendant (S300); loading a robot into the teach buffer (S400); and aligning the robot (S500). (Refer to...) Figures 6 to 12 Describe each step.

[0074] Figure 6 It is used for explanation Figure 5 The diagram for step S100.

[0075] Reference Figure 5 and Figure 6 The teach pendant 730 can be loaded into the buffer body 710 (see reference numeral 740a). The teach pendant 730 can be loaded at a position that overlaps with the camera 720 in the vertical direction. The teach pendant 730 can be loaded at a first vertical position P1.

[0076] Figure 7 and Figure 8 It is used for explanation Figure 5 The diagram shows step S200.

[0077] Reference Figure 5 and Figure 7 The teaching pendant 730 can be loaded at a position that overlaps with the camera 720 in the vertical direction. The reference point 735 of the teaching pendant 730 can be vertically overlapped with the camera 720. For example, the first camera 720a can be vertically overlapped with the first reference point 735a, and the second camera 720b can be vertically overlapped with the second reference point 735b.

[0078] The teaching board 730 can be loaded into the first vertical position P1. The vertical distance between the camera 720 and the teaching board 730 can be a first height H1. The vertical distance between the first camera 720a and the first reference point 735a can be a first height H1. The vertical distance between the second camera 720b and the second reference point 735b can be a first height H1.

[0079] Next, refer to Figure 5 and Figure 8 The camera 720 can capture a picture of the reference point 735 (S200) of the teaching board 730.

[0080] Camera 720 can generate image 735I by capturing a reference point 735. For example, first camera 720a can generate first image 735I1 by capturing a first reference point 735a. Second camera 720b can generate second image 735I2 by capturing a second reference point 735b.

[0081] Camera 720 can generate reference coordinates by capturing images of reference point 735. For example, first camera 720a can generate first reference coordinates by capturing images of first reference point 735a. Second camera 720b can generate second reference coordinates by capturing images of second reference point 735b. For example, the first reference coordinates could be (0,0), and the second reference coordinates could be (1,0).

[0082] Figure 9 It is used for explanation Figure 5 The diagram for step S300.

[0083] Reference Figure 5 and Figure 9 The teaching pendant 730 can be unloaded from the buffer body 710 (S300). The teaching pendant 730 can be unloaded in the direction opposite to the loading direction (refer to reference numeral 740b). However, the technical concept of the present invention is not limited thereto.

[0084] Figure 10 It is used for explanation Figure 5 The diagram for step S400.

[0085] Reference Figure 5 and Figure 10 The robotic arm 620 can be loaded into the teach pendant buffer 700 (S400).

[0086] A robotic arm 620 (refer to reference numeral 601) can be loaded at the first vertical position P1. The vertical position where the robotic arm 620 is loaded onto the teach pendant 700 can be the same as the vertical position where the teach pendant 730 is loaded onto the buffer body 710. That is, the position where the reference coordinates are formed by photographing the reference point 735 and the position for aligning the robotic arm 620 can be the same. Therefore, the robotic arm 620 can be aligned more accurately.

[0087] Figure 11 and Figure 12 It is used for explanation Figure 5 The diagram for step S500.

[0088] Reference Figure 5 , Figure 11 and Figure 12 It can align the robotic arm 620 (S500).

[0089] "Alignment" can mean that the coordinates of the reference point 735 of the teaching pendant 730 are consistent with the coordinates of the alignment mark 625 of the robot arm 620. For example, when the coordinates of the reference point 735 of the teaching pendant 730 are (0,0), if the coordinates of the alignment mark 625 of the robot arm 620 are (0,0), then it can be determined that the robot arm 620 is aligned.

[0090] More specifically, the robotic arm 620 can be aligned using a camera 720. For example, a first camera 720a can align the first hand 620a by comparing a first reference point 735a and a first alignment mark 625a. A second camera 720b can align the second hand 620b by comparing a second reference point 735b and a second alignment mark 625b.

[0091] In some embodiments, the vertical distance between the camera 720 and the robotic arm 620 can be a second height H2. The second height H2 can be the same as the first height H1. That is, the first height H1 when the camera 720 captures the reference point 735 is the same as the second height H2 when the camera 720 is aligned with the robotic arm 620, thus allowing for more precise alignment of the robotic arm 620.

[0092] exist Figure 12In the present invention, reference point 735 and robotic arm 620 are not aligned. The first hand 620a can be aligned by comparing the first reference point 735a and the first alignment mark 625a. The second hand 620b can be aligned by comparing the second reference point 735b and the second alignment mark 625b. The robotic arm 620 is aligned by aligning the first hand 620a and the second hand 620b. In this case, if the robotic arm 620 is rotated counterclockwise, it can be aligned. However, the technical concept of the present invention is not limited to this. Of course, the robotic arm 620 can also be aligned by moving in the x-direction or y-direction.

[0093] By using a substrate processing apparatus according to some embodiments, an automated process can be used to align the robot 620. Therefore, the robot 620 can be aligned more efficiently and accurately.

[0094] The embodiments of the present invention have been described above with reference to the accompanying drawings. However, those skilled in the art should understand that the present invention can be implemented in other specific forms without changing its technical concept or essential features. Therefore, the above embodiments should be understood as exemplary in all respects, and not restrictive.

Claims

1. A substrate processing apparatus, comprising: Process chamber, which has processing space inside; A transport robot for moving substrates into and out of the processing space, and includes a robotic arm for gripping the substrates; as well as A teach pendant buffer is used to align the robotic arm; The teaching buffer includes a teaching board that provides a reference point and at least one camera facing the teaching board. The camera captures the reference point of the teaching board, and The delivery robot aligns its robotic arm with the reference point using the camera. The reference point was photographed at the first position, and The robotic arm is aligned at the first position. The vertical distance between the teaching board and the camera is the same as the vertical distance between the robotic arm and the camera.

2. The substrate processing apparatus according to claim 1, wherein, The robotic arm includes alignment marks disposed at its end, and The teach buffer aligns the robot by comparing the alignment mark with the reference point.

3. The substrate processing apparatus according to claim 2, wherein, The alignment mark is aligned with the center point of the substrate.

4. The substrate processing apparatus according to claim 1, wherein, The camera includes a prism configuration.

5. The substrate processing apparatus according to claim 1, wherein, The cameras include a first camera and a second camera that are spaced apart from each other.

6. The substrate processing apparatus according to claim 5, wherein, The reference points include a first reference point and a second reference point that are spaced apart from each other, and The first camera captures a picture of the first reference point, and the second camera captures a picture of the second reference point.

7. The substrate processing apparatus according to claim 6, wherein, The robotic arm includes a first hand and a second hand spaced apart from each other, and The first hand is aligned with the first reference point, and the second hand is aligned with the second reference point.

8. A substrate processing apparatus, comprising: Process chamber, which has processing space inside; A transport robot for moving a substrate into and out of the processing space, and includes a first hand and a second hand for grasping the substrate; as well as A teaching buffer is used to align the first hand and the second hand; The teaching buffer includes: a teaching board providing a first reference point and a second reference point; a first camera for capturing images of the first reference point; and a second camera for capturing images of the second reference point. The transport robot uses the first reference point to align the first hand and the second reference point to align the second hand. The vertical positions of the first reference point and the second reference point are the same as the vertical positions of the first hand and the second hand when they are aligned.

9. The substrate processing apparatus according to claim 8, wherein, The first hand includes a first alignment mark disposed at the end of the first hand. The teaching buffer aligns the first hand by comparing the first alignment mark with the first reference point.

10. The substrate processing apparatus according to claim 8, wherein, The vertical distance between the first camera and the first reference point is the same as the vertical distance between the first hand and the first camera, and The vertical distance between the second camera and the second reference point is the same as the vertical distance between the second camera and the second hand.

11. The substrate processing apparatus according to claim 8, wherein, The first camera and the second camera are prism-type.

12. A substrate processing method, comprising: Load the teach pendant, including the reference point, into the teach buffer; Use a camera positioned above the teaching board to photograph the reference point; Load the robotic arm, including alignment marks, into the teaching buffer; and The robotic arm is aligned by comparing the reference point with the alignment mark. The robotic arm grips the substrate and moves it into and out of the process chamber. The teaching board is loaded at the same position as the robotic arm. The vertical distance between the teaching board and the camera is the same as the vertical distance between the robotic arm and the camera.

13. The substrate processing method according to claim 12, wherein, The alignment mark is aligned with the center point of the substrate.

14. The substrate processing method according to claim 12, wherein, The cameras include a first camera and a second camera spaced apart from each other. The reference points include a first reference point and a second reference point that are spaced apart from each other, and The first camera captures a picture of the first reference point, and the second camera captures a picture of the second reference point.

15. The substrate processing method according to claim 14, wherein, The robotic arm includes a first hand and a second hand that are spaced apart from each other. The first hand is aligned with the first reference point, and the second hand is aligned with the second reference point.

16. The substrate processing method according to claim 12, wherein, The camera includes a prism configuration.

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