Processing apparatus and method for light emitting diodes

Abstract

The present disclosure provides a processing device and method of a light emitting diode, belonging to the technical field of optoelectronic manufacturing. The processing device comprises a box body, a first moving mechanism, a second moving mechanism, a third moving mechanism, a lifting platform and a film expanding mechanism, all of which are located in the box body; the first moving mechanism is used to drive a white film carrying the light emitting diode, the second moving mechanism is used to drive a blue film, and the third moving mechanism is used to drive the lifting platform to move in a film reversing area and a film expanding area; the lifting platform is used to lift the blue film from below when the white film and the blue film are both located in the film reversing area, so that the blue film is attached to the light emitting diode on the white film away from the surface of the white film; and the lifting platform is also used to lift the blue film to the position of the film expanding mechanism for film expanding when the blue film and the light emitting diode on the blue film are located in the film expanding area. The embodiment of the present disclosure can improve the problems of long film reversing and film expanding cycle after wafer cracking and easy tilting of the die on the blue film.

Description

Technical Field

[0001] This disclosure relates to the field of optoelectronic manufacturing technology, and in particular to a processing apparatus and method for light-emitting diodes. Background Technology

[0002] Light-emitting diodes (LEDs) are highly influential new products in the optoelectronics industry. They are characterized by their small size, long lifespan, rich and colorful colors, and low energy consumption. They are widely used in lighting, displays, signal lights, backlights, toys, and other fields.

[0003] In related technologies, fabricated wafers are typically cleaved to form grains. The cleaved grains adhere to a white film, but the white film has poor expandability. Therefore, a casting machine is used to transfer the grains from the white film to a blue film; this transfer process is called casting. After casting, the blue film is stretched on a spreading machine to expand the grain spacing to a certain multiple; this process is called spreading.

[0004] Because casting and expansion are performed on different equipment, the grains attached to the blue film after casting need to be manually moved to the expansion machine, which is a cumbersome and time-consuming process. Furthermore, the casting process involves heating, and during the transfer, the blue film shrinks due to thermal expansion and contraction, causing the grains on the blue film to become misaligned. Summary of the Invention

[0005] This disclosure provides a processing apparatus and method for light-emitting diodes, which can improve the problems of long wafer cleaving and film spreading cycles, and the tendency for the die to become skewed on the blue film. The technical solution is as follows:

[0006] On one hand, this disclosure provides a processing apparatus for light-emitting diodes (LEDs). The processing apparatus includes: a housing and a first moving mechanism, a second moving mechanism, a third moving mechanism, a lifting platform, and a film expansion mechanism, all located within the housing. The housing has a side-by-side film-casting area and a film expansion area. The first moving mechanism, the second moving mechanism, and the third moving mechanism are arranged vertically in sequence, with the first moving mechanism positioned above the second moving mechanism. The first moving mechanism drives a white film carrying LEDs to move within the film-casting area and the film expansion area. The second moving mechanism drives a blue film to move within the film-casting area and the film expansion area. The third moving mechanism drives the lifting platform to move within the film-casting area and the film expansion area. The film expansion mechanism is located within the film expansion area. The lifting platform is used to lift the blue film from below when both the white film and the blue film are located within the film-casting area, so that the blue film adheres to the surface of the LEDs on the white film away from the white film. It is also used to lift the blue film to the position of the film expansion mechanism for film expansion when the blue film and the LEDs on the blue film are located within the film expansion area.

[0007] Optionally, both the first moving mechanism and the second moving mechanism include: a telescopic component, a carrier, and two tracks, the two tracks being distributed in parallel and spaced apart, the carrier being attached to the two tracks, and the telescopic component being used to drive the carrier to move along the tracks.

[0008] Optionally, the telescopic assembly includes a linear motor and a robotic arm, the linear motor being connected to the robotic arm, the linear motor moving in the same direction as the length of the track, and the robotic arm being controllably connected to or separated from the carrier.

[0009] Optionally, the housing is provided with two first feeding ports and two second feeding ports. The two first feeding ports are located on opposite side walls of the housing and are respectively opposite to the two ends of the track of the first moving mechanism. The two second feeding ports are located on opposite side walls of the housing and are respectively opposite to the two ends of the track of the second moving mechanism.

[0010] Optionally, the carrier of the second moving mechanism is a ring structure, the blue film is attached to the end face of the ring structure and covers the through hole of the ring structure, and the film expanding mechanism includes a film expanding ring, the outer diameter of the film expanding ring being smaller than the inner diameter of the ring structure.

[0011] Optionally, the lifting platform includes a telescopic component, a support platform, and a heating component. One end of the telescopic component is connected to the support platform, and the other end of the telescopic component is connected to the third moving mechanism. The heating component is located in the support platform.

[0012] Optionally, the heating element includes a heating wire, and the support platform has a cavity inside, with the heating wire located inside the cavity of the support platform.

[0013] Optionally, the lifting platform further includes a vacuum disk located on the end face of the platform away from the telescopic member.

[0014] Optionally, the third moving mechanism includes a drive motor, a ball screw, and a slider. The output end of the drive motor is coaxially connected to the ball screw, and the slider is fitted outside the ball screw and threadedly connected to the ball screw.

[0015] On the other hand, this disclosure also provides a method for processing light-emitting diodes (LEDs). The method is executed using the processing apparatus described above, and includes: mounting a white film carrying the LED on a first moving mechanism; mounting a blue film on a second moving mechanism; controlling the first moving mechanism to drive the white film, controlling the second moving mechanism to drive the blue film, and controlling the third moving mechanism to drive the lifting platform to move to the film-casting area; controlling the lifting platform to lift the blue film, so that the blue film contacts the surface of the LED away from the white film, for film casting; controlling the lifting platform to retract, and controlling the second moving mechanism to drive the blue film and controlling the third moving mechanism to drive the lifting platform to move to the film-expanding area; controlling the lifting platform to lift the blue film, so that the blue film moves to the location of the film-expanding mechanism, for film expansion.

[0016] The beneficial effects of the technical solutions provided in this disclosure include at least the following:

[0017] The processing apparatus provided in this embodiment includes a housing, a first moving mechanism, a second moving mechanism, a third moving mechanism, a lifting platform, and a film expanding mechanism, with the first moving mechanism located above the second moving mechanism. Specifically, the first moving mechanism drives the white film to move between the film casting area and the film expanding area, the second moving mechanism drives the blue film to move between the film casting area and the film expanding area, and the third moving mechanism drives the lifting platform to move between the film casting area and the film expanding area.

[0018] When the first moving mechanism drives the white film, the second moving mechanism drives the blue film, and the third moving mechanism drives the lifting platform to move to the casting area of ​​the housing, the lifting platform can lift the blue film, causing it to adhere to the surface of the LED away from the white film, thus completing the casting operation. When the second moving mechanism drives the blue film to the film expansion area, the third moving mechanism drives the lifting platform to the film expansion area, and the lifting platform lifts the blue film to the position of the film expansion mechanism, thus performing the film expansion operation.

[0019] Compared to related technologies where casting and expansion are performed separately using two different devices, this embodiment uses a moving mechanism to control the LED to move to different areas within the housing. Within these areas, a lifting platform and expansion mechanism continuously complete the casting and expansion operations, significantly simplifying the post-wafer cleaving casting and expansion process and shortening the processing cycle. Because casting and expansion are performed in the same device, expansion can be performed immediately after casting, avoiding the problem of misaligned grains on the blue film caused by thermal expansion and contraction during transfer after LED casting. Attached Figure Description

[0020] To more clearly illustrate the technical solutions in the embodiments of this disclosure, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this disclosure. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0021] Figure 1 This is a schematic diagram of the structure of a light-emitting diode processing device provided in an embodiment of this disclosure;

[0022] Figure 2 This is a schematic diagram of a ring structure provided in an embodiment of the present disclosure;

[0023] Figure 3 This is a flowchart of a method for processing a light-emitting diode provided in an embodiment of this disclosure.

[0024] The markings in the diagram are explained as follows:

[0025] 10. Box; 11. First feeding port; 12. Second feeding port;

[0026] 21. First moving mechanism; 22. Second moving mechanism; 201. Carrier; 202. Track; 203. Linear motor; 204. Robotic arm;

[0027] 30. Third moving mechanism; 31. Drive motor; 32. Ball screw;

[0028] 40. Lifting platform; 41. Telescopic component; 42. Support platform; 43. Heating component;

[0029] 50. Film expansion mechanism;

[0030] 1a. Inverted film area; 1b. Expanded film area. Detailed Implementation

[0031] To make the objectives, technical solutions, and advantages of this disclosure clearer, the embodiments of this disclosure will be described in further detail below with reference to the accompanying drawings.

[0032] Unless otherwise defined, the technical or scientific terms used herein shall have the ordinary meaning as understood by one of ordinary skill in the art to which this disclosure pertains. The terms “first,” “second,” “third,” and similar terms used in this patent application specification and claims do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Similarly, the terms “an” or “a” and similar terms do not indicate a quantity limitation, but rather indicate the presence of at least one. The terms “comprising” or “including” and similar terms mean that the elements or objects preceding “comprising” or “including” encompass the elements or objects listed following “comprising” or “including” and their equivalents, and do not exclude other elements or objects. The terms “connected” or “linked” and similar terms are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. The terms “upper,” “lower,” “left,” “right,” “top,” and “bottom,” etc., are used only to indicate relative positional relationships; when the absolute position of the described objects changes, the relative positional relationship may also change accordingly.

[0033] Figure 1 This is a schematic diagram of the structure of a light-emitting diode processing device provided in an embodiment of this disclosure. Figure 1 As shown, the processing device includes: a housing 10 and a first moving mechanism 21, a second moving mechanism 22, a third moving mechanism 30, a lifting platform 40, and a film expanding mechanism 50, all located within the housing 10.

[0034] The housing 10 has a side-by-side inverted film area 1a and an expanded film area 1b.

[0035] like Figure 1 As shown, the first moving mechanism 21, the second moving mechanism 22, and the third moving mechanism 30 are arranged in sequence along the vertical direction, with the first moving mechanism 21 located above the second moving mechanism 22. The first moving mechanism 21 is used to drive the white film carrying the light-emitting diode to move in the casting region 1a and the expansion region 1b. The second moving mechanism 22 is used to drive the blue film to move in the casting region 1a and the expansion region 1b. The third moving mechanism 30 is used to drive the lifting platform 40 to move in the casting region 1a and the expansion region 1b.

[0036] like Figure 1 As shown, the film expansion mechanism 50 is located in the film expansion region 1b.

[0037] The lifting platform 40 is used to lift the blue film from below when both the white film and the blue film are located in the casting area 1a, so that the blue film and the light-emitting diodes on the white film are attached to the surface away from the white film.

[0038] The lifting platform 40 is also used to lift the blue film to the position of the film expansion mechanism 50 for film expansion when the blue film and the light-emitting diodes on the blue film are located in the film expansion area 1b.

[0039] The processing apparatus provided in this embodiment includes a housing 10, a first moving mechanism 21, a second moving mechanism 22, a third moving mechanism 30, a lifting platform 40, and a film expanding mechanism 50. The first moving mechanism 21 is located above the second moving mechanism 22. Specifically, the first moving mechanism 21 drives the white film to move between the casting and expanding areas, the second moving mechanism 22 drives the blue film to move between the casting and expanding areas, and the third moving mechanism 30 drives the lifting platform 40 to move between the casting and expanding areas.

[0040] When the first moving mechanism 21 drives the white film, the second moving mechanism 22 drives the blue film, and the third moving mechanism 30 drives the lifting platform 40 to move to the casting area of ​​the housing 10, the lifting platform 40 can lift the blue film, causing it to adhere to the surface of the light-emitting diode away from the white film, thus completing the casting operation. When the second moving mechanism 22 drives the blue film to the film expansion area, the third moving mechanism 30 drives the lifting platform 40 to move to the film expansion area, and the lifting platform 40 lifts the blue film to the position of the film expansion mechanism 50, thus performing the film expansion operation.

[0041] Compared to related technologies where casting and expansion are performed separately using two different devices, this embodiment uses a moving mechanism to control the LED to move to different areas within the housing 10. Within these areas, the lifting platform 40 and the expansion mechanism 50 continuously complete the casting and expansion operations, significantly simplifying the post-wafer cleaving casting and expansion process and shortening the processing cycle. Because casting and expansion are performed in the same device, expansion can be performed immediately after casting, avoiding the problem of misaligned grains on the blue film caused by thermal expansion and contraction during transfer after LED casting.

[0042] Optionally, such as Figure 1 As shown, both the first moving mechanism 21 and the second moving mechanism 22 include: a telescopic component, a carrier 201 and two tracks 202. The two tracks 202 are distributed in parallel and spaced apart. The carrier 201 is attached to the two tracks 202. The telescopic component is used to drive the carrier 201 to move along the tracks 202.

[0043] In this embodiment of the present disclosure, the carrier 201 of the first moving mechanism 21 is used to carry a white film with light-emitting diodes.

[0044] For example, the carrier 201 of the first moving mechanism 21 may be a support plate, and the white film is mounted on the side of the support plate facing the second moving mechanism 22 so that the light-emitting diodes on the white film face the blue film on the second moving mechanism 22, so as to facilitate subsequent film pouring operations.

[0045] For example, the carrier 201 on the second moving mechanism 22 is used to carry the blue film. The blue film on the second moving mechanism 22 can be an annular structure. The blue film is attached to the annular structure and covers the through holes of the annular structure.

[0046] Figure 2 This is a schematic diagram of a ring-shaped structure provided in an embodiment of this disclosure. For example... Figure 2 As shown, the ring structure is a rectangular ring. The length L of the rectangular ring is 210 nm.

[0047] In this embodiment, the annular structure overlaps two tracks 202, and the lifting platform 40 is positioned between the two tracks 202. When the lifting platform 40 moves up and down, it can push the annular structure through the gap between the two tracks 202, thereby pushing the annular structure and the blue film together upwards to the carrier 201 position of the first moving mechanism 21, allowing the blue film to adhere to the light-emitting diode. Furthermore, using the annular structure as the carrier 201 exposes the blue film, allowing the lifting platform 40 to apply external force to the blue film, making the blue film adhere more tightly to the light-emitting diode.

[0048] For example, the annular structure can be a circular ring, the blue film is attached to the end face of the annular structure and covers the through hole of the annular structure, and the film expansion mechanism 50 includes an expansion ring, the outer diameter of which is smaller than the inner diameter of the annular structure.

[0049] When the lifting platform 40 raises the annular structure to the expansion ring, because the outer diameter of the expansion ring is smaller than the inner diameter of the annular structure, the edge area of ​​the blue film will abut against the expansion ring when the lifting platform 40 raises it. When the lifting platform 40 continues to raise, the edge area of ​​the blue film will be pulled by the expansion ring, thereby stretching and deforming the blue film, so that the spacing between the light-emitting diodes on the blue film can be expanded to a certain extent, thus achieving film expansion.

[0050] For example, the annular structure can be a rectangular ring, with the blue film adhering to the end face of the annular structure and covering the through hole of the annular structure. The film expansion mechanism 50 includes an expansion ring, the outer diameter of which is smaller than the length of the short side of the annular structure.

[0051] Optionally, such as Figure 1 As shown, the housing 10 is provided with two first feeding ports 11 and two second feeding ports 12. The two first feeding ports 11 are located on opposite side walls of the housing 10, and the two first feeding ports 11 are respectively opposite to the two ends of the track of the first moving mechanism 21.

[0052] like Figure 1 As shown, the two second feeding ports 12 are located on opposite side walls of the housing 10, and the two second feeding ports 12 are respectively opposite to the two ends of the track of the second moving mechanism 22.

[0053] In this embodiment, four feeding ports are provided on the two side walls of the housing 10 opposite to the two ends of the track 202. Two first feeding ports 11 are opposite to the two ends of the track 202 of the first moving mechanism 21, and are used to mount white film onto the carrier 201 of the first moving mechanism 21. Two second feeding ports 12 are opposite to the two ends of the track 202 of the second moving mechanism 22, and are used to mount blue film onto the carrier 201 of the second moving mechanism 22.

[0054] Optionally, such as Figure 1 As shown, the telescopic assembly includes a linear motor 203 and a robotic arm 204. The linear motor 203 is connected to the robotic arm 204. The direction of motion of the linear motor 203 is consistent with the length direction of the track 202. The robotic arm 204 can be controllably connected to or separated from the carrier 201.

[0055] The linear motor 203 is a device that directly converts electrical energy into linear motion. The linear motor 203 has a moving block that can reciprocate along a straight line. After the moving block is connected to the robotic arm 204, it can drive the robotic arm 204 to also reciprocate along a straight line. Thus, when the robotic arm 204 is connected to the carrier 201, the robotic arm 204 can also drive the carrier 201 to move along the track 202. When the robotic arm 204 is separated from the carrier 201, the carrier 201 is no longer under the control of the linear motor 203 and stops moving.

[0056] Since the carrier 201 of the second moving mechanism 22 will detach from the track 202 as the lifting platform 40 is lifted during the film pouring process, by setting up a robotic arm 204, the robotic arm 204 can be selectively connected to or separated from the carrier 201. This can prevent the linear motor 203 from being dragged when the carrier 201 is lifted, thus improving reliability.

[0057] Optionally, such as Figure 1 As shown, the lifting platform 40 includes a telescopic member 41, a support platform 42, and a heating element 43. One end of the telescopic member 41 is connected to the support platform 42, and the other end of the telescopic member 41 is connected to the third moving mechanism 30. The heating element 43 is located in the support platform 42.

[0058] In this embodiment of the disclosure, the telescopic member 41 can be an electric telescopic rod, a pneumatic cylinder, or a hydraulic cylinder, as long as it can achieve telescopic extension.

[0059] One end of the telescopic component 41 is connected to the support platform 42, thus enabling the support platform 42 to push the blue film. The other end of the telescopic component 41 is connected to the third moving mechanism 30, which drives the telescopic component 41 to move, thereby moving the support platform 42 along the first direction and controlling the movement of the support platform 42 in the film expansion area and the film pouring area.

[0060] For example, such as Figure 1 As shown, the support platform 42 can be a cylindrical structure, and the maximum length of the cross-section of the support platform 42 is less than the distance between the two tracks 202, so that the support platform 42 will not be stuck by the tracks 202 during the process of lifting the blue membrane.

[0061] For example, the heating element 43 includes a heating wire, and the interior of the support platform 42 has a cavity, with the heating wire located inside the cavity of the support platform 42.

[0062] The support platform 42 can be a cylindrical structure, with a heating wire placed inside the cavity of the cylindrical structure. When the heating wire is energized, the cavity of the cylindrical structure heats up, thereby heating the support platform 42 as well. In this way, during the casting process, the support platform 42 heats the blue film to ensure that the temperature conditions for casting meet the requirements and the casting operation is completed smoothly.

[0063] Optionally, the lifting platform 40 also includes a vacuum disk located on the end face of the platform 42 away from the telescopic member 41. In this way, during the coating process, the blue film is adsorbed by the vacuum disk, which improves the reliability of the connection between the blue film and the platform 42, thus preventing deviations in the film pouring process.

[0064] Furthermore, after the casting is completed, the vacuum disk of the support stage 42 can continue to maintain the adsorption force to hold the blue film. That is, after the casting is completed and the blue film descends to the second track 202, the vacuum disk still maintains the adsorption force on the blue film, and the support stage 42 and the blue film move together to the film expansion mechanism 50. In this way, the vacuum disk also maintains the adsorption force during the process of the blue film being transferred to the film expansion area, so the blue film will not deform due to cooling, causing the light-emitting diodes to be displaced on the blue film.

[0065] Optionally, such as Figure 1 As shown, the third moving mechanism 30 includes a drive motor 31, a ball screw 32, and a slider. The output end of the drive motor 31 is coaxially connected to the ball screw 32, and the slider is fitted outside the ball screw 32 and threadedly connected to the ball screw 32.

[0066] A baffle can be provided on one side of the slider, arranged along the first direction, with the side of the baffle fitting against one side of the slider. This prevents the slider from rotating along with the ball screw 32 when it rotates under the drive of the drive motor 31, instead allowing the slider to reciprocate along the axis of the ball screw, thereby achieving the purpose of driving the support platform 42 to reciprocate between the casting area and the expansion area.

[0067] Figure 3 This is a flowchart of a method for processing a light-emitting diode according to an embodiment of this disclosure. Figure 3 As shown, the processing method is performed using the processing apparatus described above, including:

[0068] Step S11: Install the white film carrying the light-emitting diode onto the first moving mechanism.

[0069] Specifically, this may include: cutting off excess white film from the white film on which the cleaved LEDs are arranged, then mounting the white film on the carrier of the first moving mechanism and placing it on two tracks from the feed port.

[0070] In this embodiment of the disclosure, the light-emitting diode may include a substrate, an epitaxial layer, a first electrode, a second electrode, and a passivation layer stacked sequentially. The epitaxial layer includes a first semiconductor layer, a multiple quantum well layer, and a second semiconductor layer stacked sequentially on the substrate. The surface of the second semiconductor layer has a groove exposing the first semiconductor layer. The first electrode is located within the groove, and the second electrode is located on the side of the second semiconductor layer away from the substrate. The passivation layer is located at least on the second semiconductor layer, the first electrode, the groove, and the second electrode, and has two through-holes exposing the first electrode and the second electrode, respectively.

[0071] Optionally, the substrate is a sapphire substrate. Sapphire substrates have high light transmittance, meaning they are transparent. Furthermore, sapphire material is relatively hard and chemically stable, giving the light-emitting diode good luminous efficacy and stability.

[0072] In this embodiment of the disclosure, one of the first semiconductor layer and the second semiconductor layer is a p-type layer, and the other of the first semiconductor layer and the second semiconductor layer is an n-type layer.

[0073] As an example, the first semiconductor layer is a p-type layer, and the first electrode is a p-type electrode. The second semiconductor layer is an n-type layer, and the second electrode is an n-type electrode.

[0074] Optionally, the first semiconductor layer is an n-type AlGaInP layer. The thickness of the n-type AlGaInP layer can be from 0.5 μm to 3 μm.

[0075] Optionally, the multiple quantum well layer includes alternating AlGaInP quantum well layers and AlGaInP quantum barrier layers, with different Al contents in the AlGaInP quantum well layers and AlGaInP quantum barrier layers. The multiple quantum well layer may include 3 to 8 alternating stacked AlGaInP quantum well layers and AlGaInP quantum barrier layers.

[0076] As an example, in an embodiment of this disclosure, the multi-quantum-well layer includes five alternating stacked AlGaInP quantum-well layers and AlGaInP quantum-barrier layers.

[0077] Optionally, the thickness of the multi-quantum well layer can be from 150 nm to 200 nm.

[0078] Optionally, the second semiconductor layer is an indium-doped p-type AlInP layer. The thickness of the p-type AlInP layer can be from 0.5 μm to 3 μm.

[0079] Optionally, the passivation layer can be a distributed Bragg reflection (DBR layer), which consists of multiple periodically alternating layers of SiO2 and TiO2. The number of periods in the DBR layer can be between 20 and 50. For example, the DBR layer may have 32 periods.

[0080] The thickness of the SiO2 layer in the DBR layer can be from 800 angstroms to 1200 angstroms, and the thickness of the TiO2 layer can be from 500 angstroms to 900 angstroms.

[0081] In addition to passivation, the DBR layer also reflects light emitted from the multi-quantum-well layer back to the substrate, improving light extraction efficiency.

[0082] Optionally, the light-emitting diode further includes: a first solder block and a second solder block, the first solder block and the second solder block being located on the passivation layer, the first solder block being connected to the first electrode through a through hole, and the second solder block being connected to the second electrode through another through hole.

[0083] For example, both the first solder joint block and the second solder joint block are rectangular blocks to increase the area and facilitate conductivity. Furthermore, the first solder joint blocks and the second solder joint blocks are distributed alternately on the surface of the passivation layer.

[0084] Optionally, a protective layer is further provided on the surface of the passivation layer, and the protective layer extends from the surface of the passivation layer to the substrate, and the protective layer has through holes exposing the first solder joint block and the second solder joint block to facilitate electrical connection.

[0085] For example, in this embodiment of the disclosure, the protective layer may be a silicon oxide layer with a thickness of 2000 angstroms.

[0086] Step S12: Install the blue film on the second moving mechanism.

[0087] Specifically, this may involve cutting a 210nm blue film and attaching it to a ring-shaped structure, covering the through-holes in the ring structure with the blue film. Then, the ring structure is placed onto two tracks through a feed port.

[0088] Step S13: Control the first moving mechanism to drive the white film, control the second moving mechanism to drive the blue film, and control the third moving mechanism to drive the lifting platform to move to the film pouring area.

[0089] Specifically, this may include: controlling the robotic arm of the second moving mechanism to connect with the ring-shaped structure, and dragging the ring-shaped structure to the casting area via a linear motor. Simultaneously, controlling the robotic arm of the first moving mechanism to connect with the carrier, and dragging the white film on the carrier to the casting area via a linear motor. Then, controlling the third moving structure to drive the lifting platform to also move to the casting area.

[0090] Before step S14, the processing method further includes: heating the lifting platform to raise the temperature of the surface of the lifting platform in contact with the blue film to a set temperature.

[0091] Specifically, this may include: energizing the heating wire of the lifting platform to heat the platform, and controlling the temperature of the surface of the platform used to attach the blue film to rise to the set temperature.

[0092] Step S14: Control the lifting platform to lift the blue film so that the blue film contacts the surface of the light-emitting diode away from the white film, in order to perform the film pouring.

[0093] After the casting process is completed, the LEDs on the white film are all attracted to the blue film. Therefore, after the lifting platform is recovered, the blue film carrying the LEDs also descends to the track of the second moving mechanism.

[0094] The processing method prior to step S15 also includes: tearing off the white film using a film-tearing gripper to expose the surface of the light-emitting diode away from the blue film.

[0095] Step S15: Control the lifting platform to retract, and control the second moving mechanism to drive the blue film and control the third moving mechanism to drive the lifting platform to move to the film expansion area.

[0096] Specifically, this can include: retracting the telescopic component so that the blue film descends and returns to the two tracks; then, controlling the robotic arm of the second moving mechanism to connect with the ring structure, and dragging the ring structure to the film expansion area via a linear motor; at the same time, controlling the third moving structure to drive the lifting platform to also move to the film expansion area.

[0097] Step S16: Control the lifting platform to lift the blue film, so that the blue film moves to the position of the film expansion mechanism to expand the film.

[0098] Specifically, this can include: lifting the blue film using a lifting platform, moving the blue film to the film expansion mechanism, stretching the blue film using the film expansion mechanism, expanding the spacing between the light-emitting diodes on the blue film to a certain multiple, and completing the film expansion.

[0099] Optionally, when a vacuum disk is provided on the end face of the support platform away from the telescopic component, the blue film can be adsorbed by the vacuum disk during the coating process, which can improve the connection reliability between the blue film and the support platform and avoid deviation in the casting process.

[0100] Furthermore, after the casting process is completed, the vacuum disk on the support platform can continue to maintain the adsorption force on the blue film. That is, after the casting process is completed and the blue film descends to the second track, the vacuum disk still maintains the adsorption force on the blue film, and the support platform and the blue film move together to the film expansion mechanism. In this way, the vacuum disk also maintains the adsorption force during the process of the blue film being transferred to the film expansion area, so the blue film will not deform due to cooling, causing the light-emitting diodes to be displaced on the blue film.

[0101] Finally, insert the LED into the empty cartridge.

[0102] In related technologies, manual or single-equipment operations require transporting white film to a laminating machine, and after lamination, blue film needs to be transported to an expanding machine. This type of equipment is inefficient, with an average single-piece operation time of 2 minutes. In contrast, the LED processing method provided in this disclosure takes about 30 seconds, significantly improving operational efficiency.

[0103] The above description is merely an optional embodiment of this disclosure and is not intended to limit this disclosure. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this disclosure should be included within the protection scope of this disclosure.

Claims

1. A processing device for light-emitting diodes, characterized in that, The processing device includes: a housing (10) and a first moving mechanism (21), a second moving mechanism (22), a third moving mechanism (30), a lifting platform (40), and a film expanding mechanism (50), all located within the housing (10). The box (10) has a side-by-side inverted film area and an expanded film area; The first moving mechanism (21), the second moving mechanism (22) and the third moving mechanism (30) are arranged in sequence along the vertical direction, and the first moving mechanism (21) is located above the second moving mechanism (22). The first moving mechanism (21) is used to drive the white film carrying the light-emitting diode to move in the casting area and the expansion area. The second moving mechanism (22) is used to drive the blue film to move in the casting area and the expansion area. The third moving mechanism (30) is used to drive the lifting platform (40) to move in the casting area and the expansion area. The film expansion mechanism (50) is located in the film expansion area and is located above the third moving mechanism (30); The lifting platform (40) is used to lift the blue film from below the blue film when both the white film and the blue film are located in the inverted film area, so that the blue film is attached to the surface of the white film away from the light-emitting diodes on the white film. It is also used to lift the blue film to the position of the film expansion mechanism (50) when the blue film and the light-emitting diode on the blue film are located in the film expansion area.

2. The processing apparatus according to claim 1, characterized in that, Both the first moving mechanism (21) and the second moving mechanism (22) include: a telescopic component, a carrier (201) and two tracks (202), the two tracks (202) are distributed in parallel and spaced apart, the carrier (201) is attached to the two tracks (202), and the telescopic component is used to drive the carrier (201) to move along the tracks (202).

3. The processing apparatus according to claim 2, characterized in that, The telescopic assembly includes a linear motor (203) and a robotic arm (204). The linear motor (203) is connected to the robotic arm (204). The direction of motion of the linear motor (203) is consistent with the length direction of the track (202). The robotic arm (204) can be controllably connected to or separated from the carrier (201).

4. The processing apparatus according to claim 2, characterized in that, The box (10) is provided with two first feeding ports (11) and two second feeding ports (12). The two first feeding ports (11) are located on opposite side walls of the box (10), and the two first feeding ports (11) are respectively opposite to the two ends of the track of the first moving mechanism (21). The two second feeding ports (12) are located on opposite side walls of the box (10), and the two second feeding ports (12) are respectively opposite to the two ends of the track of the second moving mechanism (22).

5. The processing apparatus according to claim 2, characterized in that, The carrier (201) of the second moving mechanism (22) is a ring structure. The blue film is attached to the end face of the ring structure and covers the through hole of the ring structure. The film expansion mechanism includes a film expansion ring, and the outer diameter of the film expansion ring is smaller than the inner diameter of the ring structure.

6. The processing apparatus according to any one of claims 1 to 5, characterized in that, The lifting platform (40) includes a telescopic component (41), a support platform (42) and a heating component (43). One end of the telescopic component (41) is connected to the support platform (42), and the other end of the telescopic component (41) is connected to the third moving mechanism (30). The heating component (43) is located in the support platform (42).

7. The processing apparatus according to claim 6, characterized in that, The heating element (43) includes a heating wire, and the support platform (42) has a cavity inside, with the heating wire located inside the cavity of the support platform (42).

8. The processing apparatus according to claim 6, characterized in that, The lifting platform (40) also includes a vacuum disk located on the end face of the support platform (42) away from the telescopic member (41).

9. The processing apparatus according to claim 6, characterized in that, The third moving mechanism (30) includes a drive motor (31), a ball screw (32) and a slider. The output end of the drive motor (31) is coaxially connected to the ball screw (32). The slider is fitted outside the ball screw (32) and is threadedly connected to the ball screw (32).

10. A method for processing a light-emitting diode, characterized in that, The processing method is performed using the processing apparatus as described in any one of claims 1 to 9, comprising: A white film carrying light-emitting diodes is mounted on the first moving mechanism; Install the blue film onto the second moving mechanism; Control the first moving mechanism to drive the white film, control the second moving mechanism to drive the blue film, and control the third moving mechanism to drive the lifting platform to move to the film pouring area; The lifting platform is controlled to lift the blue film, so that the blue film contacts the surface of the light-emitting diode away from the white film, in order to perform the film pouring; Control the lifting platform to retract, control the second moving mechanism to drive the blue film, and control the third moving mechanism to drive the lifting platform to move to the film expansion area; The lifting platform is controlled to lift the blue film, so that the blue film moves to the position of the film expansion mechanism for film expansion.

Images