Venting package cover of chip package structure and manufacturing method thereof

Abstract

The present application provides a breathable package cover of a chip package structure and a manufacturing method thereof. The breathable package cover of the chip package structure comprises a cover body, a through hole and a hydrophobic breathable film. The cover body is integrally formed. The through hole penetrates the cover body. The hydrophobic breathable film is combined with the cover body and covers the through hole. Part of the hydrophobic breathable film is embedded in the cover body.

Description

Technical Field

[0001] This invention relates to a breathable encapsulation cover for a chip packaging structure and its manufacturing method. Background Technology

[0002] With increasing emphasis on environmental health and protection, air quality monitoring has been widely implemented, primarily through long-term environmental detection using gas sensors. To adapt to extended operation and varying environments and climates, the environmental tolerance requirements for gas sensors are gradually increasing.

[0003] Currently, most commercially available gas sensors use hydrophobic and breathable membranes that are adhesively fixed to the gas sensor's inlet after chip packaging. However, these membranes must provide hydrophobicity, and this property can lead to poor adhesion of the adhesive. Consequently, commercially available gas sensors may experience poor adhesion of the hydrophobic and breathable membrane, which in turn affects the sensor's durability. Summary of the Invention

[0004] This invention relates to a breathable encapsulation cover for a chip packaging structure and its manufacturing method, which can enhance the adhesion of the hydrophobic and breathable membrane and improve the reliability of the component.

[0005] According to an embodiment of the present invention, the breathable encapsulation cover of the chip packaging structure includes a cover body, a through hole, and a hydrophobic breathable membrane. The cover body is integrally formed. The through hole penetrates the cover body. The hydrophobic breathable membrane is bonded to the cover body and shields the through hole. A portion of the hydrophobic breathable membrane is embedded within the cover body.

[0006] According to an embodiment of the present invention, a method for manufacturing a breathable encapsulation cover for a chip packaging structure includes the following steps: Providing a hydrophobic and breathable membrane; Curing a liquid encapsulation material into a cover body; Forming a through-hole in the cover body and penetrating the cover body; Covering the through-hole with the hydrophobic and breathable membrane; Embedding a plurality of positioning holes of the hydrophobic and breathable membrane within the cover body; Anchoring portions of a plurality of holes in the cover body are respectively located within the positioning holes.

[0007] In the chip packaging structure and its breathable packaging cover manufacturing method according to an embodiment of the present invention, since part of the hydrophobic and breathable membrane is embedded in the cover body, the hydrophobic and breathable membrane is not easy to fall off and the structure is simple. Attached Figure Description

[0008] Figure 1 This is a top view schematic diagram of a breathable encapsulation cover of a chip packaging structure according to an embodiment of the present invention, applied to the chip packaging structure;

[0009] Figure 2 yes Figure 1 A cross-sectional view along line II;

[0010] Figure 3 yes Figure 1 A top view schematic diagram of the hydrophobic and breathable membrane of the breathable encapsulation cover of the chip packaging structure at the material stage;

[0011] Figure 4 yes Figure 1 A top view schematic diagram of another embodiment of the hydrophobic and breathable membrane of the breathable encapsulation cover of the chip packaging structure in the material stage;

[0012] Figure 5 This is a cross-sectional schematic diagram of a breathable encapsulation cover of a chip packaging structure according to another embodiment of the present invention applied to a chip packaging structure;

[0013] Figures 6A to 6E This is a schematic cross-sectional view of the manufacturing method of a breathable encapsulation cover for a chip packaging structure according to an embodiment of the present invention. Detailed Implementation

[0014] Reference will now be made in detail to exemplary embodiments of the invention, examples of which are illustrated in the accompanying drawings. Wherever possible, the same element references are used in the drawings and description to denote the same or similar parts.

[0015] Figure 1 This is a top view schematic diagram of a ventilated encapsulation cover applied to a chip packaging structure according to an embodiment of the present invention. Figure 2 yes Figure 1 A cross-sectional view along line II. For ease of explanation, Figure 1 The middle section of line II is offset by a certain distance from the sides, in order to simultaneously... Figure 2 The image shows through holes and positioning holes. Please refer to [the image / reference]. Figure 1 and Figure 2 The chip packaging structure 50 of this embodiment, which utilizes the ventilated packaging cover 100, includes a base 52 and a chip 52A. In this embodiment, the ventilated packaging cover 100 is assembled with the base 52 and covers the chip 52A. A chamber C30 is formed between the ventilated packaging cover 100 and the base 52. The ventilated packaging cover 100 includes a cover body 110, a through hole H10, and a hydrophobic and breathable membrane 120. The cover body 110 is integrally formed. The through hole H10 penetrates the cover body 110.

[0016] A hydrophobic and breathable membrane 120 is integrated with the cover body 110 and shields the through-hole H10. A portion of the hydrophobic and breathable membrane 120 is embedded within the cover body 110. In this embodiment, the hydrophobic and breathable membrane 120 includes a membrane body 122 and multiple positioning holes H20 penetrating the membrane body 122. The positioning holes H20 are embedded within the cover body 110. The chamber C30 communicates with the outside world via the hydrophobic and breathable membrane 120 and the through-holes H10. Through the hydrophobic and breathable membrane 120, external gas can enter the chamber C30 and contact the chip 52A, but moisture and other foreign matter cannot enter the chamber C30. A portion of the hydrophobic and breathable membrane 120 is embedded within the cover body 110. A portion of the cover body 110 penetrates the positioning holes H20.

[0017] In the chip packaging structure 50 of this embodiment, because the cover body 110 is integrally formed, that is, while the cover body 110 is being formed, a portion of the hydrophobic and breathable membrane 120 is also embedded within the cover body 110. Therefore, after the cover body 110 is formed, the hydrophobic and breathable membrane 120 is also fixed in place. In this way, it can be ensured that the hydrophobic and breathable membrane 120 will not fall off, thereby improving the reliability of the breathable packaging cover 100 of the chip packaging structure 50. In addition, no additional process is required to fix the hydrophobic and breathable membrane 120, which can reduce manufacturing process and material costs.

[0018] In this embodiment, the through-hole H10 is located above the chip 52A, and the hydrophobic and breathable membrane 120 is suspended above the chip 52A. Thus, the chip 52A can quickly respond to changes in the external environment. Furthermore, the chip 52A in this embodiment can be a gas sensing chip.

[0019] In this embodiment, the membrane body 122 has an embedded portion 122A embedded in the cover body 110 and a through-hole portion 122B covering the through-hole H10. The positioning holes H20 penetrate the embedded portion 122A and are located on both opposite sides of the through-hole portion 122B, and also on both opposite sides of the breathable sealing cover 100, thus the hydrophobic and breathable membrane 120 can be stably fixed. In this embodiment, the cover body 110 has a main body portion 112 surrounding the through-hole H10 and a plurality of hole anchoring portions 114 located within the main body portion 112. These hole anchoring portions 114 are respectively located within the positioning holes H20 of the hydrophobic and breathable membrane 120. The hole anchoring portions 114 of the cover body 110 are engaged within the positioning holes H20 of the hydrophobic and breathable membrane 120, thus the hydrophobic and breathable membrane 120 is fixed by the cover body 110.

[0020] Furthermore, the hydrophobic and breathable membrane 120 of this embodiment may also have multiple notches H30, which penetrate the embedded portion 122A of the membrane body 122 and are adjacent to the edge of the membrane body 122, and are also located at the edge of the hydrophobic and breathable membrane 120. A portion of the cover body 110 passes through the notches H30, and the notches H30 are embedded within the cover body 110. On the other hand, the cover body 110 also has multiple notch anchoring portions 116 located within the main body portion 112. These notch anchoring portions 116 are respectively located within the notches H30 of the hydrophobic and breathable membrane 120. The notch anchoring portions 116 of the cover body 110 are engaged within the notches H30 of the hydrophobic and breathable membrane 120, thus also fulfilling the function of clamping and preventing displacement of the hydrophobic and breathable membrane 120. In this embodiment, the notches H30 are located, for example, on two opposite sides of the breathable sealing cover 100.

[0021] In this embodiment, the portion of the hydrophobic and breathable membrane 120 surrounding the through-hole H10, both facing and facing away from the chip 52A, is covered by the cover body 110. That is, the portion of the hydrophobic and breathable membrane 120 surrounding the through-hole H10 is held in place by the cover body 110 from above and below. On the other hand, the embedded portion 122A of the hydrophobic and breathable membrane 120 is located around the through-hole H10, and both the facing and facing away from the chip 52A of the embedded portion 122A are covered by the cover body 110, while the facing and facing away from the chip 52A of the through-hole portion 122B of the hydrophobic and breathable membrane 120 are not covered by the cover body 110.

[0022] In this embodiment, the hydrophobic and breathable membrane 120 is coated with polytetrafluoroethylene, thus possessing both hydrophobic and breathable properties. In this embodiment, the material of the breathable sealing cap 100 is, for example, plastic.

[0023] Figure 3 yes Figure 1 The diagram shows a top view of the hydrophobic and breathable membrane of the breathable encapsulation cover in the chip packaging structure during the material stage. Please refer to... Figure 1 and Figure 3 In this embodiment, the hydrophobic and breathable membrane 120 has a relatively large size before being embedded in the cover body 110. In addition to the previously mentioned positioning holes H20 and notches H30, the hydrophobic and breathable membrane 120 also has multiple openings H40 around its perimeter for positioning purposes during the manufacturing process. After the hydrophobic and breathable membrane 120 is embedded in the cover body 110, the portion of the hydrophobic and breathable membrane 120 extending beyond the cover body 110 is cut off, and the openings H40 are also cut off.

[0024] Figure 4 yes Figure 1 A top view schematic diagram of another embodiment of the hydrophobic and breathable membrane of the breathable encapsulation cover of the chip packaging structure in the material stage. Please refer to... Figure 4 In this embodiment, the hydrophobic and breathable membrane 300 and Figure 3Similar to the hydrophobic and breathable membrane 120, the difference lies in that a single hydrophobic and breathable membrane 300 has nine cuttable segments distributed on it. Figure 2 The hydrophobic and breathable membrane 120 shown is suitable for batch manufacturing. The hydrophobic and breathable membrane 300 also has multiple openings H50 around its perimeter for positioning purposes during the manufacturing process.

[0025] Figure 5 This is a cross-sectional schematic diagram of a ventilated encapsulation cover applied to a chip packaging structure according to another embodiment of the present invention. Please refer to... Figure 5 In this embodiment, the chip packaging structure 60 and Figure 2 The chip packaging structure 50 is basically the same as that of the other two, and only the differences will be described here. In this embodiment, the surface S12 of the hydrophobic and breathable membrane 120 surrounding the through hole H32, facing away from the chip 52A, is covered by the cover body 130, while the surface S14 of the hydrophobic and breathable membrane 120 surrounding the through hole H32, facing the chip 52A, is not covered by the cover body 130. However, the other parts of the hydrophobic and breathable membrane 120 are still embedded in the cover body 110, so it can still be stably positioned.

[0026] Figures 6A to 6E This is a schematic cross-sectional view of the manufacturing method of the ventilated encapsulation cover of the chip package structure according to this embodiment. The manufacturing method of the ventilated encapsulation cover of the chip package structure of this embodiment includes at least the following: Figure 6B and Figure 6D The steps are shown below. Please refer to them. Figure 6B A hydrophobic and breathable membrane 120 is provided. In this embodiment, the hydrophobic and breathable membrane 120 has a plurality of positioning holes H20. Next, please refer to... Figure 6D The liquid encapsulation material 110A is solidified into a cover body 110. A through hole H10 is formed in and penetrates the cover body 110. A hydrophobic and breathable membrane 120 covers the through hole H10. The portion of the hydrophobic and breathable membrane 120 with positioning holes H20 is embedded in the cover body 110, that is, the positioning holes H20 are embedded in the cover body 110. A portion of the cover body 110 penetrates the positioning holes H20, that is, multiple hole anchoring portions 114 of the cover body 110 are respectively located in these positioning holes H20.

[0027] In the manufacturing method of the breathable encapsulation cover of the chip packaging structure in this embodiment, since the hydrophobic and breathable membrane 120 is also fixed when the cover body 110 is integrally formed, there is no need to perform additional processes to fix the hydrophobic and breathable membrane 120, which can reduce the manufacturing process and material costs.

[0028] In this embodiment, the step of solidifying the liquid encapsulation material 110A into a cover body 110 and embedding the positioning hole H20 of the hydrophobic and breathable membrane 120 into the cover body 110 is to perform an injection molding process, but the present invention is not limited thereto.

[0029] The following examples illustrate other specific steps in the manufacturing method of the breathable encapsulation cover of the chip packaging structure in this embodiment, but the present invention is not limited thereto. Please refer to... Figure 6A First, let's look at mold 210, where the lower mold 210 has multiple locating pins 212. Next, please refer to... Figure 6B The hydrophobic and breathable membrane 120 is positioned on the lower mold 210 by the positioning pin 212. Specifically, the positioning pin 212 passes through the opening H40 of the hydrophobic and breathable membrane 120 to position the membrane. Next, please refer to... Figure 6C An upper mold 220 and a lower mold 210 are closed to form a molding cavity C10 within the upper mold 220 and the lower mold 210, which communicates with an injection channel 222. The upper mold 220 and the lower mold 210 also form a closed cavity C20. The closed cavity C20 isolates the molding cavity C10 from the injection channel 222. In this embodiment, the injection channel 222 is located in the upper mold 220, but the invention is not limited thereto.

[0030] Next, please refer to Figure 6D Liquid encapsulation material 110A is injected into the molding cavity C10 through injection channel 222 and solidified into a cap body 110. Since the sealing cavity C20 is isolated from the molding cavity C10 and injection channel 222, the encapsulation material 110A does not enter the sealing cavity C20, and the through-hole H10 is formed in the sealing cavity C20. Furthermore, the encapsulation material 110A injected through injection channel 222 also passes through the positioning hole H20, so after it solidifies into the cap body 110, it can position the hydrophobic and breathable membrane 120 through the positioning hole H20. Finally, please refer to... Figure 6E This causes the cover body 110 to detach from the film.

[0031] In summary, in the chip packaging structure and its breathable packaging cover manufacturing method of the present invention, the hydrophobic and breathable membrane is embedded in the integrally formed cover body. The positioning of the hydrophobic and breathable membrane is also completed when the cover body is formed. No additional positioning structure is required and it is not easy to fall off. The manufacturing process and material costs are also low.

[0032] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, and not to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A breathable encapsulation cover for a chip packaging structure, applied to a chip packaging structure, characterized in that, The ventilated encapsulation cover of this chip packaging structure includes: The lid is molded as a single piece. A through hole extends through the body of the cover; and A hydrophobic and breathable membrane is combined with the cover body and covers the through hole, with a portion of the hydrophobic and breathable membrane embedded in the cover body. The hydrophobic and breathable membrane includes a membrane body and a plurality of positioning holes penetrating the membrane body, the positioning holes being embedded in the cover body; The cover body has a main body portion surrounding the through hole and a plurality of hole anchoring portions located within the main body portion, the hole anchoring portions being located within the positioning holes of the hydrophobic and breathable membrane.

2. The ventilated encapsulation cover of the chip packaging structure according to claim 1, characterized in that, The chip packaging structure also includes a base and a chip disposed on the base, the via is located above the chip, and the hydrophobic and breathable membrane is suspended above the chip.

3. The ventilated encapsulation cover of the chip packaging structure according to claim 1, characterized in that, The membrane body has an embedded portion embedded in the cover body and a through-hole portion covering the through hole. The positioning holes of the hydrophobic and breathable membrane penetrate the embedded portion and are located on two opposite sides of the through-hole portion.

4. The ventilated encapsulation cover of the chip packaging structure according to claim 1, characterized in that, The hydrophobic and breathable membrane also includes multiple notches that penetrate the embedded portion of the membrane body and are adjacent to the edge of the membrane body. The cover body also has multiple notch anchoring portions located within the main body portion, and these notch anchoring portions are respectively located within the notches of the hydrophobic and breathable membrane.

5. The ventilated encapsulation cover of the chip packaging structure according to claim 3, characterized in that, The chip packaging structure also includes a base and a chip disposed on the base. The hydrophobic and breathable membrane is suspended above the chip. The embedded part of the hydrophobic and breathable membrane is around the through hole, and the surface of the embedded part facing away from the chip is covered by the cover body.

6. The ventilated encapsulation cover of the chip packaging structure according to claim 3, characterized in that, The chip packaging structure also includes a base and a chip disposed on the base. The hydrophobic and breathable membrane is suspended above the chip. The surfaces of the hydrophobic and breathable membrane facing away from the chip are not covered by the cover body.

7. The ventilated encapsulation cover of the chip packaging structure according to claim 1, characterized in that, These positioning holes are located on opposite sides of the through hole.

8. The ventilated encapsulation cover of the chip packaging structure according to claim 1, characterized in that, The hydrophobic and breathable membrane also includes multiple openings penetrating the membrane body, which are adjacent to the edge of the membrane body and embedded in the cover body.

9. The ventilated encapsulation cover of the chip packaging structure according to claim 8, characterized in that, These notches are located on opposite sides of the through hole.

10. The ventilated encapsulation cover of the chip packaging structure according to claim 2, characterized in that, This chip is a gas sensor chip.

11. The ventilated encapsulation cover of the chip packaging structure according to claim 1, characterized in that, The hydrophobic and breathable membrane is coated with polytetrafluoroethylene.

12. The ventilated encapsulation cover of the chip packaging structure according to claim 1, characterized in that, The chip packaging structure also includes a base and a chip disposed on the base, wherein the hydrophobic and breathable membrane is suspended above the chip, and the surface of the hydrophobic and breathable membrane facing the chip around the through hole is not covered by the cover body, while the surface of the hydrophobic and breathable membrane facing away from the chip around the through hole is covered by the cover body.

13. A method for manufacturing a breathable encapsulation cover for a chip packaging structure, characterized in that, include: Provides a hydrophobic and breathable membrane; as well as The liquid encapsulation material is solidified into a cover body, wherein a through hole is formed in the cover body and penetrates the cover body, the through hole is shielded by a hydrophobic and breathable membrane, a plurality of positioning holes of the hydrophobic and breathable membrane are embedded in the cover body, and a plurality of hole anchoring portions of the cover body are respectively located in the positioning holes.

14. The method for manufacturing a breathable encapsulation cover for a chip packaging structure according to claim 13, characterized in that, The step of solidifying the liquid encapsulation material into the cover body and embedding the positioning holes of the hydrophobic and breathable membrane into the cover body is to perform an embedded injection molding process.

15. The method for manufacturing a breathable encapsulation cover for a chip packaging structure according to claim 13, characterized in that, The steps of solidifying the liquid encapsulation material into the cap body and embedding the positioning holes of the hydrophobic and breathable membrane within the cap body include: A lower mold is provided, wherein the lower mold has multiple locating pins; The hydrophobic and breathable membrane is positioned on the lower mold using these locating pins; The upper mold and the lower mold are closed to form a molding cavity that communicates with the injection channel in the upper mold and the lower mold. The upper mold and the lower mold also form a closed cavity that is isolated from the molding cavity and the injection channel. Liquid encapsulation material is injected into the molding cavity through the injection channel and solidified into the cap body, wherein the through-hole is formed in the closed cavity, and the encapsulation material passes through the positioning holes; and This causes the cover body to detach from the film.

16. The method for manufacturing a breathable encapsulation cover for a chip packaging structure according to claim 13, characterized in that, Multiple notches in the hydrophobic and breathable membrane are located at the edge of the hydrophobic and breathable membrane, and multiple notches in the cover body are anchored within these notches.

17. The method for manufacturing a breathable encapsulation cover for a chip packaging structure according to claim 13, characterized in that, The hydrophobic and breathable membrane is coated with polytetrafluoroethylene.

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