LED transfer device and transfer method

Abstract

The embodiment of the present invention discloses an LED transfer device and a transfer method. The LED transfer device includes: a main transfer plate and a sub-transfer plate; the first surface of the main transfer plate is provided with a first limiting structure, and the first surface of the main transfer plate is used to receive the LED chip to be transferred; the second surface of the sub-transfer plate is provided with a second limiting structure, and the second surface of the sub-transfer plate can be arranged opposite to the first surface of the main transfer plate, and the second limiting structure is used to cooperate with the first limiting structure to adjust the position of the LED chip to be transferred, so that the LED chip to be transferred is arranged on the main transfer plate according to a set rule. The embodiment of the present invention can improve the LED transfer yield.

Description

Technical Field

[0001] The embodiments of the present invention relate to display technology, and more particularly to an LED transfer device and a transfer method. Background Art

[0002] Mass transfer is one of the main difficult technologies in current LED display technology, among which how to accurately transfer LED chips in large quantities to the TFT backplane is the core issue of this technology.

[0003] At present, after the LED chip is prepared on the silicon-based substrate, it is necessary to use laser lift-off technology (LLO) to peel off the LED chip. After long-term research, the inventors found that in this process, the LED chip will fall from the silicon-based substrate to the temporary substrate. During the falling process, the air flow, gravity, or LLO energy difference may cause the LED chip to be displaced or rotated. In the subsequent picking process, it is difficult to correct the position of the LED chip, and it is impossible to ensure that the chip is accurately transferred to the corresponding position of the TFT backplane, which has a great impact on the LED transfer yield. Summary of the invention

[0004] The invention provides an LED transfer device and a transfer method to improve the LED transfer yield.

[0005] In a first aspect, an embodiment of the present invention provides an LED transfer device, comprising:

[0006] Main transfer plate and auxiliary transfer plate;

[0007] The first surface of the main transfer plate is provided with a first limiting structure, and the first surface of the main transfer plate is used to receive the LED chip to be transferred;

[0008] The second surface of the auxiliary transfer plate is provided with a second limiting structure, and the second surface of the auxiliary transfer plate can be arranged opposite to the first surface of the main transfer plate. The second limiting structure is used to cooperate with the first limiting structure to adjust the position of the LED chip to be transferred, so that the LED chip to be transferred is arranged on the main transfer plate according to a set rule.

[0009] The LED transfer device of the present embodiment includes a main transfer plate and a sub-transfer plate. A first limiting structure is set on the main transfer plate, and a second limiting structure is set on the sub-transfer plate. The second limiting structure cooperates with the first limiting structure to adjust the position of the LED chip to be transferred, so that the LED chip to be transferred is arranged on the main transfer plate according to the set rules, thereby improving the picking accuracy of the subsequent picking process, ensuring that the LED chip to be transferred is accurately transferred to the corresponding position of the TFT backplane, and improving the LED transfer yield.

[0010] Optionally, the first limiting structure includes a plurality of limiting grooves arranged in an array, each limiting groove corresponds to an LED chip to be transferred, or the first limiting structure includes a plurality of first limiting retaining walls arranged in an array;

[0011] The second limiting structure includes a plurality of second limiting retaining walls arranged in an array.

[0012] The manufacturing method of the retaining wall and the groove is simple and can play a good limiting role. In this embodiment, the first limiting structure adopts the first limiting retaining wall, the second limiting structure adopts the second limiting retaining wall, or the first limiting structure adopts the limiting groove, and the second limiting structure adopts the second limiting retaining wall. While playing a better role in adjusting the position and posture of the LED chip to be transferred, the process cost is reduced.

[0013] Optionally, the vertical projection of the second limiting retaining wall on the main transfer plate cooperates with the first limiting retaining wall to form a plurality of closed or semi-closed limiting areas, and each of the limiting areas corresponds to one LED chip to be transferred.

[0014] By forming the limiting area, it is easier to adjust the position of the LED chip.

[0015] Optionally, the ratio of the height of the first limiting retaining wall to the height of the LED chip to be transferred is greater than or equal to 1 / 2 and less than or equal to 2. While ensuring that the first limiting retaining wall has a good limiting effect, the material cost is reduced.

[0016] Optionally, when the height of the first limiting retaining wall is less than or equal to the height of the LED chip to be transferred or the first limiting retaining wall is a limiting groove, the ratio of the height of the second limiting retaining wall to the height of the LED chip to be transferred is greater than or equal to 1 / 2 and less than or equal to 2; while ensuring that the second limiting retaining wall plays a better role in moving and limiting the LED chip to be transferred, the material cost is reduced.

[0017] Optionally, when the height of the first limiting retaining wall is greater than the height of the LED chip to be transferred, the first limiting retaining wall and the LED chip to be transferred have a first height difference, the difference between the height of the second limiting retaining wall and the first height difference is greater than or equal to half the height of the LED chip to be transferred, and the ratio of the height of the second limiting retaining wall to the height of the LED chip to be transferred is less than or equal to 2. While ensuring that the second limiting retaining wall plays a better role in limiting the movement of the LED chip to be transferred, the material cost is reduced.

[0018] Optionally, each LED chip to be transferred is provided with a corresponding first limiting retaining wall and a corresponding second limiting retaining wall;

[0019] The shape of the first limiting retaining wall is L-shaped;

[0020] The second limiting retaining wall is in a strip shape, or the second limiting retaining wall is in an L shape.

[0021] The first limiting retaining wall is L-shaped, which can better limit the position of the LED chip to be transferred. When the second limiting retaining wall is L-shaped, the limiting area formed by the second limiting retaining wall and the first limiting retaining wall can hold the various edges of the LED chip to be transferred. By moving the second limiting retaining wall along the row direction and the column direction respectively, the LED chip to be transferred can be adjusted to the required position and posture. In addition, when the second limiting retaining wall adopts a strip structure, the limiting area formed by the second limiting retaining wall and the first limiting retaining wall can hold the three edges of the LED chip to be transferred. It is necessary to adjust the position of the secondary transfer plate once to realize the holding of the four edges of the LED chip to be transferred. In this way, the manufacturing process of the secondary transfer plate is relatively simple.

[0022] Optionally, the shape of the limiting groove is the same as the shape of the LED chip to be transferred, so that the limiting groove can better limit the LED chip to be transferred.

[0023] Optionally, the depth of the limiting groove is greater than or equal to 1 micron and less than or equal to the height of the LED chip to be transferred, so as to ensure that the limiting groove plays a good limiting role, reduce the process difficulty, and ensure that the LED chip can be easily moved out of the limiting groove.

[0024] Optionally, the material of the main transfer plate body includes PDMS, and the material of the first limiting retaining wall includes metal or plastic;

[0025] The materials of the auxiliary transfer plate body and the second limiting retaining wall include metal or plastic.

[0026] The PDMS material has a certain viscosity. The main body of the main transfer plate is made of PDMS, which can play a certain bonding role on the LED chip to be transferred. It can ensure that the LED chip to be transferred can stay on the main transfer plate more stably after falling onto the main transfer plate, and after the LED chip to be transferred is moved by the secondary transfer plate, the LED chip to be transferred can stay stably in the adjusted position.

[0027] In a second aspect, an embodiment of the present invention further provides an LED transfer method, comprising:

[0028] Transferring the LED chip to be transferred to the first surface of the main transfer plate; wherein the first surface of the main transfer plate is provided with a first limiting structure;

[0029] The second surface of the auxiliary transfer plate is arranged opposite to the first surface of the main transfer plate; wherein the second surface of the auxiliary transfer plate is provided with a second limiting structure;

[0030] The auxiliary transfer plate is moved so that the second limiting structure cooperates with the first limiting structure to adjust the position of the LED chips to be transferred, so that the LED chips to be transferred are arranged on the main transfer plate according to a set rule.

[0031] The LED transfer device of the embodiment of the present invention includes a main transfer plate and a sub-transfer plate. A first limiting structure is set on the main transfer plate, and a second limiting structure is set on the sub-transfer plate. The second limiting structure cooperates with the first limiting structure to adjust the position of the LED chip to be transferred, so that the LED chip to be transferred is arranged on the main transfer plate according to the set rules, thereby improving the picking accuracy of the subsequent picking process, ensuring that the LED chip to be transferred is accurately transferred to the corresponding position of the TFT backplane, and improving the LED transfer yield. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] Figure 1 is a schematic diagram of an LED transfer device provided by an embodiment of the present invention;

[0033] Figure 2 is a schematic diagram of another LED transfer device provided by an embodiment of the present invention;

[0034] Figure 3 is a schematic diagram of a main transfer plate provided by an embodiment of the present invention;

[0035] Figure 4 is a schematic diagram of an auxiliary transfer plate provided by an embodiment of the present invention;

[0036] Figure 5 is a schematic diagram of another main transfer plate provided by an embodiment of the present invention;

[0037] Figure 6 is a schematic diagram of another main transfer plate provided by an embodiment of the present invention;

[0038] Figure 7 is a schematic diagram of another main transfer plate provided by an embodiment of the present invention;

[0039] Figure 8 It is a schematic diagram of the cooperation between a second limiting retaining wall and a main transfer plate provided by an embodiment of the present invention;

[0040] Fig. 9 is a schematic diagram of another LED transfer device provided by an embodiment of the present invention;

[0041] Fig.10 It is a flow chart of an LED transfer method provided by an embodiment of the present invention. DETAILED DESCRIPTION

[0042] The present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It is to be understood that the specific embodiments described herein are only used to explain the present invention, rather than to limit the present invention. It should also be noted that, for ease of description, only parts related to the present invention, rather than all structures, are shown in the accompanying drawings.

[0043] The embodiment of the present invention provides an LED transfer device. Figure 1 is a schematic diagram of an LED transfer device provided by an embodiment of the present invention, Figure 2 is a schematic diagram of another LED transfer device provided by an embodiment of the present invention, Figure 3 is a schematic diagram of a main transfer plate provided by an embodiment of the present invention, Figure 4 is a schematic diagram of a secondary transfer plate provided by an embodiment of the present invention, with reference to Figure 1-Figure 4 , the device comprises:

[0044] A main transfer plate 10 and a secondary transfer plate 20;

[0045] A first limiting structure 11 is disposed on the first surface of the main transfer plate 10, and the first surface of the main transfer plate is used to receive the LED chip 30 to be transferred;

[0046] A second limiting structure 21 is provided on the second surface of the auxiliary transfer plate 20. The second surface of the auxiliary transfer plate 20 can be arranged opposite to the first surface of the main transfer plate 10. The second limiting structure 21 is used to cooperate with the first limiting structure 11 to adjust the position of the LED chip 30 to be transferred, so that the LED chip 30 to be transferred is arranged on the main transfer plate 10 according to a set rule.

[0047] Among them, after the LED chip 30 to be transferred is prepared on the silicon-based substrate, the LLO technology is used to peel off the LED chip 30 to be transferred, and the LED chip 30 to be transferred falls onto the main transfer plate 10 after being peeled off. After the LED chip 30 to be transferred falls onto the main transfer plate 10, the auxiliary transfer plate 20 can be inverted on the main transfer plate 10, that is, the second surface of the auxiliary transfer plate 20 is set to face the first surface of the main transfer plate 10, and the second limiting structure 21 can be used to move the LED chip 30 to be transferred by moving the auxiliary transfer plate 20, and the LED chip 30 to be transferred can be adjusted to a suitable position and a suitable posture by the second limiting structure 21 and the first limiting structure 11. The setting rule is the arrangement rule required for the LED chip to be transferred, which may include an array arrangement, etc., and this embodiment does not make specific limitations.

[0048] It can be understood that the LED chip to be transferred in the present application can be a Micro-LED chip.

[0049] Specifically, refer to Figure 2-Figure 4The second limiting structure 21 and the first limiting structure 11 can be in the form of a retaining wall or the like. The first limiting structure 11 and the second limiting structure 21 can correspond to each other one by one, and a group of the first limiting structure 11 and the second limiting structure 21 corresponding to each other corresponds to one LED chip 30 to be transferred. Each group of the first limiting structure 11 and the second limiting structure 21 corresponding to each other can position one LED chip 30 to be transferred, so that the LED chip 30 to be transferred can reach the required posture and position.

[0050] also, Figure 5 is a schematic diagram of another main transfer plate provided by an embodiment of the present invention, Figure 6 is a schematic diagram of another main transfer plate provided by an embodiment of the present invention, with reference to Figure 5 and Figure 6 , a row or a column or all the LED chips 30 to be transferred may correspond to a first limiting structure 11, the first limiting structure 11 includes a plurality of sub-regions 101, each sub-region 101 corresponds to a LED chip 30 to be transferred. A second limiting structure 21 is corresponding to each sub-region 101, and the second limiting structure 21 drives the LED chip 30 to be transferred in the corresponding sub-region 101 to move by moving the secondary transfer plate 20.

[0051] The LED transfer device of the present embodiment includes a main transfer plate and a sub-transfer plate. A first limiting structure 11 is set on the main transfer plate 10, and a second limiting structure 21 is set on the sub-transfer plate 20. The second limiting structure 21 cooperates with the first limiting structure 11 to adjust the position of the LED chip 30 to be transferred, so that the LED chip 30 to be transferred is arranged according to the set rules on the main transfer plate 10, thereby improving the picking accuracy of the subsequent picking process, ensuring that the LED chip 30 to be transferred is accurately transferred to the corresponding position of the TFT backplane, and improving the LED transfer yield.

[0052] It should be noted that the arrangement and spacing of the first limiting structure 11 (or the sub-region 101 of the first limiting structure 11) and the second limiting structure 21 can be determined according to the arrangement of the LED chips 30 to be transferred on the silicon-based substrate and the setting rules. As long as it can be ensured that after the LED chips 30 to be transferred are peeled off and fall onto the main transfer substrate 10, each LED chip 30 to be transferred corresponds to a first limiting structure 11 or a sub-region 101.

[0053] Figure 7 is a schematic diagram of another main transfer plate provided in an embodiment of the present invention, optionally, refer to Figure 3-Figure 7 The first limiting structure 11 includes a plurality of limiting grooves 112 arranged in an array, each limiting groove 112 corresponds to an LED chip 30 to be transferred, or the first limiting structure 11 includes a plurality of first limiting retaining walls 111 arranged in an array;

[0054] The second limiting structure 21 includes a plurality of second limiting retaining walls 211 arranged in an array.

[0055] Specifically, when the first limiting structure 11 includes the first limiting retaining wall 111, the relative position of the second limiting retaining wall 211 and the first limiting retaining wall 111 is adjusted by moving the secondary transfer plate 20, so as to adjust the position and posture of the LED chip 30 to be transferred. When the first limiting structure 11 includes the limiting groove 112, the secondary transfer plate 20 is moved to enable the second limiting structure 21 to move the LED chip 30 to be transferred that has not fallen into the limiting groove 112, so that all the LED chips 30 to be transferred are located in the limiting groove 112, and the limiting groove 112 can play a role in limiting the position and posture of the LED chip 30 to be transferred, so as to adjust the posture and position of the LED chip 30 to be transferred.

[0056] It is understandable that the size of the limiting groove 112 can be larger than the LED chip 30 to be transferred. At this time, the posture and position of the LED chip 30 to be transferred in the limiting groove 112 can be changed by moving the auxiliary transfer plate 20.

[0057] The manufacturing method of the retaining wall and the groove is simple and can play a good limiting role. In this embodiment, the first limiting structure 11 adopts the first limiting retaining wall 111, and the second limiting structure 21 adopts the second limiting retaining wall 211, or the first limiting structure 11 adopts the limiting groove 112, and the second limiting structure 21 adopts the second limiting retaining wall 211. While playing a better role in adjusting the position and posture of the LED chip 30 to be transferred, the process cost is reduced.

[0058] Figure 8 2 is a schematic diagram of the cooperation between the second limiting retaining wall 211 and the main transfer plate 10 provided in an embodiment of the present invention. Figure 2 and Figure 8 The vertical projection of the second limiting retaining wall 211 on the main transfer plate 10 cooperates with the first limiting retaining wall 111 to form a plurality of closed or semi-closed limiting areas 40, and each limiting area 40 corresponds to an LED chip 30 to be transferred.

[0059] Specifically, refer to Figure 2 The vertical projection of the second limiting retaining wall 211 on the main transfer plate 10 cooperates with the first limiting retaining wall 111 to form a plurality of closed limiting areas 40, each limiting area 40 corresponds to an LED chip 30 to be transferred, and by moving the secondary transfer plate 20 along the row direction and the column direction respectively, the second limiting retaining wall 211 and the first limiting retaining wall 111 can adjust the LED chips 30 to be transferred to be arranged in an array in the row direction and the column direction.

[0060] It is understandable that the specific moving direction of the auxiliary transfer plate 20 can be the row direction, column direction or oblique direction, which can be set according to the actual situation, as long as it can meet the requirements of adjusting the LED chips 30 to be transferred to the set regular arrangement, and no specific limitation is made here. Figure 1 and Figure 8 The vertical projection of the second limiting retaining wall 211 on the main transfer plate 10 cooperates with the first limiting retaining wall 111 to form a plurality of semi-enclosed limiting areas 40. The position of the LED chip 30 to be transferred along the row direction can be adjusted by moving the secondary transfer plate 20 along the row direction, and then the relative position of the second limiting retaining wall 211 and the first limiting retaining wall 111 can be adjusted by rotating the secondary transfer plate 20. For example, the second limiting retaining wall 211 can be made parallel to the row direction, and the position of the LED chip 30 to be transferred along the column direction can be adjusted by moving the second limiting retaining wall 211 along the column direction, and finally the LED chip 30 to be transferred can be adjusted to be arranged in an array in the row and column directions.

[0061] Fig. 9 is a schematic diagram of another LED transfer device provided by an embodiment of the present invention, optionally, refer to Figure 1 and Fig. 9 , the ratio of the height of the first limiting retaining wall 111 to the height of the LED chip 30 to be transferred is greater than or equal to 1 / 2 and less than or equal to 2.

[0062] Specifically, when the height of the first limiting retaining wall 111 is low, the first limiting retaining wall 111 cannot play a good limiting role, and when the height of the first limiting retaining wall 111 is high, it causes material waste. By setting the ratio of the height of the first limiting retaining wall 111 to the height of the LED chip 30 to be transferred to be greater than or equal to 1 / 2 and less than or equal to 2, while ensuring that the first limiting retaining wall 111 has a good limiting role, the material cost is reduced.

[0063] Optional, reference Fig. 9 When the height of the first limiting retaining wall 111 is less than or equal to the height of the LED chip 30 to be transferred or the first limiting retaining wall 111 is a limiting groove, the ratio of the height of the second limiting retaining wall 211 to the height of the LED chip 30 to be transferred is greater than or equal to 1 / 2 and less than or equal to 2.

[0064] Specifically, when the height of the second limiting retaining wall 211 is low, the second limiting retaining wall 211 may not be able to move the LED chip 30 to be transferred well, and when the height of the second limiting retaining wall 211 is high, it causes material waste. By setting the ratio of the height of the second limiting retaining wall 211 to the height of the LED chip 30 to be transferred to be greater than or equal to 1 / 2 and less than or equal to 2, while ensuring that the second limiting retaining wall 211 plays a good role in moving and limiting the LED chip 30 to be transferred, the material cost is reduced.

[0065] Optional, reference Figure 1 When the height of the first limiting retaining wall 111 is greater than the height of the LED chip 30 to be transferred, the first limiting retaining wall 111 and the LED chip 30 to be transferred have a first height difference h1, the difference between the height of the second limiting retaining wall 211 and the first height difference h1 is greater than or equal to half the height of the LED chip 30 to be transferred, and the ratio of the height of the second limiting retaining wall 211 to the height of the LED chip 30 to be transferred is less than or equal to 2. This arrangement ensures that the second limiting retaining wall 211 plays a better role in moving and limiting the LED chip 30 to be transferred, while reducing the material cost.

[0066] Optional, reference Figure 2 and Figure 8 Each LED chip 30 to be transferred is correspondingly provided with a first limiting retaining wall 111 and a second limiting retaining wall 211; the first limiting retaining wall 111 is L-shaped; the second limiting retaining wall 211 is strip-shaped, or the second limiting retaining wall 211 is L-shaped.

[0067] Specifically, a first limiting retaining wall 111 and a corresponding second limiting retaining wall 211 form a limiting area 40. Since the shape of the LED chip 30 to be transferred is generally rectangular, the first limiting retaining wall 111 is L-shaped, which can better limit the LED chip 30 to be transferred. When the second limiting retaining wall 211 is L-shaped, the limiting area 40 composed of the second limiting retaining wall 211 and the first limiting retaining wall 111 can hold each edge of the LED chip 30 to be transferred, and the LED chip 30 to be transferred can be adjusted to the required position and posture by moving the second limiting retaining wall 211 in the row direction and the column direction respectively. In addition, when the second limiting retaining wall 211 adopts a strip structure, the limiting area 40 composed of the second limiting retaining wall 211 and the first limiting retaining wall 111 can hold the three edges of the LED chip 30 to be transferred, and the orientation of the secondary transfer plate needs to be adjusted once to realize the holding of the four edges of the LED chip 30 to be transferred. In this way, the manufacturing process of the secondary transfer plate is relatively simple.

[0068] Optional, reference Figure 7 The shape of the limiting groove 112 is the same as the shape of the LED chip to be transferred.

[0069] Such arrangement enables the limiting groove 112 to better limit the position of the LED chip to be transferred. Exemplarily, when the LED chip to be transferred is rectangular, the projection of the limiting groove 112 on the main transfer plate 10 is rectangular, the projection length of the limiting groove 112 can be 2-3 microns larger than the length of the LED chip to be transferred, and the projection width of the limiting groove 112 can be 2-3 microns larger than the width of the LED chip to be transferred, thereby facilitating the LED chip to be transferred to enter and exit the groove.

[0070] Optionally, the depth of the limiting groove is greater than or equal to 1 micrometer and less than or equal to the height of the LED chip to be transferred.

[0071] Specifically, if the depth of the limiting groove is too small, the manufacturing process will be more difficult and may not be able to play a good limiting role for the LED chip to be transferred. When the depth of the limiting groove is too large, it will be unfavorable for the subsequent removal of the LED chip to be transferred. By setting the depth of the limiting groove to be greater than or equal to 1 micron and less than or equal to the height of the LED chip to be transferred, the limiting groove can play a good limiting role, reduce the process difficulty, and ensure that the LED chip can be easily moved out of the limiting groove.

[0072] Optionally, the material of the main transfer plate body includes polydimethylsiloxane PDMS, and the material of the first limiting retaining wall includes metal or non-metal such as plastic, etc. It can be understood that the main transfer plate body is the part of the main transfer plate except the first limiting structure.

[0073] Specifically, the PDMS material has a certain viscosity, and the main body of the main transfer plate is made of PDMS, which can play a certain bonding role on the LED chip to be transferred, and can ensure that the LED chip to be transferred can stay on the main transfer plate more stably after falling onto the main transfer plate, and after the LED chip to be transferred is moved by the secondary transfer plate, the LED chip to be transferred can stay stably at the adjusted position.

[0074] The first limit retaining wall can be made of metal or non-metal such as plastic, and this embodiment does not make specific limitations. Exemplarily, the first limit retaining wall can be made of PDMS. The materials of the auxiliary transfer plate body and the second limit retaining wall include metal or non-metal such as plastic to reduce material costs. It can be understood that the auxiliary transfer plate body is the part of the auxiliary transfer plate except the second limit structure.

[0075] The embodiment of the present invention also provides an LED transfer method. Fig.10 is a flow chart of an LED transfer method provided by an embodiment of the present invention, referring to Fig.10 , the method comprising:

[0076] S110, transferring the LED chip to be transferred to the first surface of the main transfer plate; wherein the first surface of the main transfer plate is provided with a first limiting structure.

[0077] S120, setting the second surface of the auxiliary transfer plate opposite to the first surface of the main transfer plate; wherein the second surface of the auxiliary transfer plate is provided with a second limiting structure.

[0078] Specifically, when the auxiliary transfer plate and the main transfer plate are arranged opposite to each other, the second limiting structure may not contact the main transfer plate, thereby reducing the movement resistance of the auxiliary transfer plate.

[0079] S130, moving the secondary transfer plate, so that the second limiting structure cooperates with the first limiting structure to adjust the position of the LED chips to be transferred, so that the LED chips to be transferred are arranged on the main transfer plate according to a set rule.

[0080] The LED transfer method provided in the embodiment of the present invention and the LED transfer device provided in any embodiment of the present invention belong to the same inventive concept and have the same beneficial effects. For technical details not detailed in this embodiment, please refer to the LED transfer device provided in any embodiment of the present invention.

[0081] Note that the above are only preferred embodiments of the present invention and the technical principles used. Those skilled in the art will understand that the present invention is not limited to the specific embodiments described herein, and that various obvious changes, readjustments, combinations and substitutions can be made by those skilled in the art without departing from the scope of protection of the present invention. Therefore, although the present invention has been described in more detail through the above embodiments, the present invention is not limited to the above embodiments, and may include more other equivalent embodiments without departing from the concept of the present invention, and the scope of the present invention is determined by the scope of the appended claims.

Claims

1. An LED transfer device, characterized in that: include: Main transfer plate and auxiliary transfer plate; The first surface of the main transfer plate is provided with a first limiting structure, and the first surface of the main transfer plate is used to receive the LED chip to be transferred; The second surface of the auxiliary transfer plate is provided with a second limiting structure, and the second surface of the auxiliary transfer plate can be arranged opposite to the first surface of the main transfer plate. The second limiting structure is used to cooperate with the first limiting structure to adjust the position of the LED chip to be transferred, so that the LED chip to be transferred is arranged on the main transfer plate according to a set rule.

2. The transfer device according to claim 1, characterized in that: The first limiting structure includes a plurality of limiting grooves arranged in an array, each limiting groove corresponds to an LED chip to be transferred, or the first limiting structure includes a plurality of first limiting retaining walls arranged in an array; The second limiting structure includes a plurality of second limiting retaining walls arranged in an array.

3. The transfer device according to claim 2, characterized in that: The vertical projection of the second limiting retaining wall on the main transfer plate cooperates with the first limiting retaining wall to form a plurality of closed or semi-closed limiting areas, and each of the limiting areas corresponds to one LED chip to be transferred.

4. The transfer device according to claim 2, characterized in that: The ratio of the height of the first limiting retaining wall to the height of the LED chip to be transferred is greater than or equal to 1 / 2 and less than or equal to 2.

5. The transfer device according to claim 4, characterized in that: When the height of the first limiting retaining wall is less than or equal to the height of the LED chip to be transferred or the first limiting retaining wall is a limiting groove, the ratio of the height of the second limiting retaining wall to the height of the LED chip to be transferred is greater than or equal to 1 / 2 and less than or equal to 2; When the height of the first limiting retaining wall is greater than the height of the LED chip to be transferred, the first limiting retaining wall and the LED chip to be transferred have a first height difference, the difference between the height of the second limiting retaining wall and the first height difference is greater than or equal to half of the height of the LED chip to be transferred, and the ratio of the height of the second limiting retaining wall to the height of the LED chip to be transferred is less than or equal to 2.

6. The transfer device according to claim 3, characterized in that: Each LED chip to be transferred corresponds to one of the first limiting retaining walls and one of the second limiting retaining walls; The shape of the first limiting retaining wall is L-shaped; The second limiting retaining wall is in a strip shape, or the second limiting retaining wall is in an L shape.

7. The transfer device according to claim 2, characterized in that: The shape of the limiting groove is the same as the shape of the LED chip to be transferred.

8. The transfer device according to claim 2, characterized in that: The depth of the limiting groove is greater than or equal to 1 micron and less than or equal to the height of the LED chip to be transferred.

9. The transfer device according to claim 2, characterized in that: The material of the main transfer plate body includes PDMS, and the material of the first limiting retaining wall includes metal or plastic; The materials of the auxiliary transfer plate body and the second limiting retaining wall include metal or plastic.

10. A method for transferring LED, characterized in that: include: Transferring the LED chip to be transferred to the first surface of the main transfer plate; wherein the first surface of the main transfer plate is provided with a first limiting structure; The second surface of the auxiliary transfer plate is arranged opposite to the first surface of the main transfer plate; wherein the second surface of the auxiliary transfer plate is provided with a second limiting structure; The auxiliary transfer plate is moved so that the second limiting structure cooperates with the first limiting structure to adjust the position of the LED chips to be transferred, so that the LED chips to be transferred are arranged on the main transfer plate according to a set rule.

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