A transparent printed circuit board suitable for various environments
By using a transparent CPI film and a movable cover to fix the chip on the LED display circuit board, and combining it with a drive motor and a turbulence assembly transmission mechanism, the problems of diode detachment and poor heat dissipation on the circuit board under high temperature conditions are solved, achieving higher heat resistance and better heat dissipation effect.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- ZIBO SONGBAI ELECTRONIC TECH CO LTD
- Filing Date
- 2022-09-13
- Publication Date
- 2026-07-17
AI Technical Summary
Existing LED display printed circuit boards are prone to diode detachment under high temperature environments, and the chip soldering and mounting methods are not convenient for disassembly, and the heat dissipation effect is poor, which affects the normal operation of the equipment.
A transparent CPI film is used instead of a PET film. A movable top cover and a fixing base are used to fix the chip. A drive motor drives a heat dissipation fan and a turbulence component. The heat dissipation efficiency is improved through a transmission mechanism. The chip pins are installed by plugging in the chip, and coolant and spiral blades are used to accelerate heat transfer.
It improves the heat resistance of the circuit board, makes chip installation and removal more convenient, significantly improves heat dissipation efficiency, has a wider range of applicable environments, and avoids equipment damage due to heat accumulation.
Smart Images
Figure CN116156742B_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of circuit board technology, specifically to a transparent printed circuit board suitable for various environments. Background Technology
[0002] Printed circuit boards, also known as PCBs, are providers of electrical connections for electronic components. A printed circuit board can be a relatively thin, layered substrate on which integrated circuits and other electronic components can be mounted to form, for example, printed circuit assemblies.
[0003] Existing LED displays mostly use printed circuit boards made of PET film. However, when the display is working, the diodes on the circuit board generate a lot of heat. The LED chips on the PET film will fall off due to the heat generated by the diodes, resulting in poor heat resistance and limited applicable environments. In addition, existing circuit boards will install components such as chips. The chips are mostly fixed by pin soldering, which is not convenient for disassembly. Moreover, the chips generate a lot of heat when working. If it is not dissipated in time, it will affect the normal operation of the equipment and may even burn out the equipment. Summary of the Invention
[0004] The purpose of this invention is to provide a transparent printed circuit board suitable for various environments, in order to solve the problems mentioned in the background art.
[0005] To achieve the above objectives, the present invention provides the following technical solution: a transparent printed circuit board suitable for various environments, comprising a circuit board body, a fixing seat on the circuit board body, a mounting slot on the fixing seat, a chip mounted in the mounting slot, a plurality of pins on the chip, the pins being inserted into a mating tube, a connecting post connected to the bottom of the mating tube, a movable top cover connected to the fixing seat, a groove on the movable top cover, a drive motor mounted in the groove, a primary cooling fan connected to the drive motor, an inner cavity within the fixing seat, a baffle assembly for improving heat dissipation efficiency within the inner cavity, and a transmission mechanism connecting the primary cooling fan and the baffle assembly.
[0006] Preferably, the circuit board body includes a substrate and a covering material.
[0007] Preferably, the substrate includes a transparent polyimide film base layer, an adhesive layer is disposed on the transparent polyimide film base layer, and the covering material includes an adhesive bonded to the substrate and a transparent polyimide film base layer coating.
[0008] Preferably, the substrate is symmetrically provided with two layers. The substrate includes a transparent polyimide film base layer, a copper foil is disposed in the adhesive, and the covering material includes a transparent polyimide film base layer coating. Adhesives for connecting to the two substrates are respectively disposed on both sides of the transparent polyimide film base layer coating.
[0009] Preferably, the turbulence assembly includes a lower rotating rod rotatably installed in the inner cavity, with two sets of spiral blades arranged in the middle of the lower rotating rod, and two-stage cooling fans installed at both ends of the lower rotating rod.
[0010] Preferably, the transmission mechanism includes a top column mounted on the top of the primary cooling fan, a first gear connected to the top of the top column, an upper rotating rod rotatably mounted in the groove, a second gear disposed in the middle of the upper rotating rod, the second gear meshing with the first gear, and a third gear mounted at one end of the upper rotating rod.
[0011] Preferably, one side of the movable cover has a side cavity, the end of the upper rotating rod extends into the side cavity, an inner plate is provided in the side cavity, a vertical shaft is rotatably mounted on the inner plate, a fourth gear is mounted on the top of the vertical shaft, the fourth gear and the third gear are meshed and connected, a bottom column is fixedly connected to the bottom of the vertical shaft, the bottom column is a square column, the lower end of the bottom column is movably inserted into the movable sleeve, a lifting block is rotatably sleeved on the outside of the movable sleeve, and a compression spring is provided between the lifting block and the inner plate.
[0012] Preferably, the movable sleeve penetrates the bottom surface of the movable top cover, and the movable sleeve and the movable top cover are rotatably connected, with an upper connecting plate connected to the bottom end of the movable sleeve.
[0013] Preferably, a bottom shaft is rotatably mounted next to the mounting slot, and a lower mating plate is provided at the top of the bottom shaft. The lower mating plate and the upper mating plate fit tightly together. A fifth gear is mounted at the bottom of the bottom shaft, and a sixth gear is mounted on the lower rotating rod. The sixth gear and the fifth gear are meshed together.
[0014] Compared with the prior art, the beneficial effects of the present invention are:
[0015] 1. This invention uses transparent CPI (polyimide) film to replace the currently popular PET film for LED display screens. CPI film has a temperature resistance of over 0 degrees Celsius, so it is easier to use for SMT mounting of LED diode devices than PET film. LED chips are also more firmly attached to CPI film than to PET film and are not affected by the diodes falling off due to heat. Its heat resistance is greatly improved, making it applicable to a wider range of environments.
[0016] 2. In this invention, the chip is installed in the mounting slot, and the pins on the chip are inserted into the mating tubes. After the movable top cover and the fixed base are fixedly connected, the chip can be pressed and fixed. Compared with the current soldering and fixing installation method, disassembly and assembly are more convenient.
[0017] 3. In this invention, the chip generates heat during operation. A drive motor rotates a primary cooling fan to dissipate heat from above, while heat also enters the coolant in the inner cavity from below. Furthermore, the inclusion of a flow-deflecting component and transmission mechanism enhances heat dissipation. The primary cooling fan's rotation drives the first gear, which in turn drives the upper rotating rod and the third gear. The meshing of the third and fourth gears causes the vertical shaft to rotate, which in turn drives the movable sleeve. This, in turn, causes the movable sleeve to rotate the upper mating plate. The tight fit between the upper and lower mating plates, coupled with significant friction at the connection point, causes the lower mating plate to rotate the bottom shaft and the fifth gear. The meshing of the fifth and sixth gears causes the lower rotating rod to rotate, which in turn causes the secondary cooling fan to rotate, dissipating heat from both sides into the coolant in the inner cavity. Simultaneously, the rotation of the spiral blades accelerates the circulation of the coolant in the inner cavity, speeding up heat transfer and thus improving heat dissipation efficiency. Attached Figure Description
[0018] Figure 1 This is a schematic diagram of the device structure of the present invention;
[0019] Figure 2 This is the circuit board structure in the first embodiment of the present invention;
[0020] Figure 3 This is the circuit board structure in the second embodiment of the present invention;
[0021] Figure 4 for Figure 1 Enlarged view of point A in the middle;
[0022] Figure 5 for Figure 1 Enlarged view of section B in the middle.
[0023] In the diagram: 1. Circuit board body, 101. Substrate, 102. Covering material, 103. Copper foil, 2. Fixing base, 3. Mounting groove, 301. Connecting tube, 302. Chip, 4. Pin, 401. Movable top cover, 5. Drive motor, 6. Primary cooling fan, 7. Top column, 8. First gear, 9. Upper rotating rod, 10. Second gear, 11. Third gear, 12. Side cavity, 13. Inner plate, 14. Vertical shaft, 15. Fourth gear, 16. Bottom column, 17. Movable sleeve, 18. Lifting block, 19. Compression spring, 20. Upper connecting plate, 21. Bottom shaft, 22. Lower connecting plate, 23. Fifth gear, 24. Lower rotating rod, 25. Sixth gear, 26. Spiral blade, 27. Secondary cooling fan, 28. Detailed Implementation
[0024] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.
[0025] Please see Figures 1 to 5 The present invention provides a technical solution: a transparent printed circuit board suitable for various environments, comprising a circuit board body 1, the circuit board body 1 comprising a substrate 101 and a covering material 102. In a first embodiment, the substrate 101 comprises a transparent polyimide film base layer, and an adhesive layer is disposed on the transparent polyimide film base layer. The covering material 102 comprises an adhesive connected to the substrate 101 and a transparent polyimide film base layer coating. In a second embodiment, the substrate 101 is symmetrically disposed with two layers. The substrate 101 comprises a transparent polyimide film base layer, and a copper foil 103 is disposed in the adhesive. The covering material 102 comprises a transparent polyimide film base layer coating, and adhesives connected to the two substrates 101 are respectively disposed on both sides of the transparent polyimide film base layer coating.
[0026] This invention uses transparent CPI (polyimide) film to replace the currently popular PET film for LED display screens. CPI film has a temperature resistance of over 300 degrees Celsius, making it easier to perform SMT mounting of LED diode devices than PET film. LED chips are also more firmly attached to CPI film than to PET film and are not affected by the diodes detaching due to heat. Its heat resistance is greatly improved, making it suitable for a wider range of environments.
[0027] A mounting base 2 is provided on the circuit board body 1. The mounting base 2 has a mounting slot 3, in which a chip 4 is installed. The chip 4 has several pins 401, which are inserted into a mating tube 301. A connecting post 302 is connected to the bottom of the mating tube 301. A movable top cover 5 is connected to the mounting base 2. One end of the movable top cover 5 is hinged to the mounting base 2, and the other end is fixedly connected to the mounting base 2 by screws. A groove is provided on the movable top cover 5, in which a drive motor 6 is installed. The drive motor 6 is connected to... The primary cooling fan 7, driven by the drive motor 6, dissipates heat transferred from above to the bottom of the groove. The mounting base 2 has an inner cavity containing coolant. The parts where the bottom and top surfaces of the chip 4 connect the mounting base 2 and the movable top cover 5 have good thermal conductivity, allowing for rapid heat transfer. The inner cavity is equipped with a turbulence-inducing component to improve heat dissipation efficiency. The turbulence-inducing component includes a lower rotating rod 25 rotatably mounted in the inner cavity. Two sets of spiral blades 27 are provided in the middle of the lower rotating rod 25. Secondary cooling fans 28 are installed at both ends of the lower rotating rod 25.
[0028] A transmission mechanism connects the primary cooling fan 7 and the airflow turbulence assembly. The transmission mechanism includes a top post 8 mounted on the top of the primary cooling fan 7. A first gear 9 is connected to the top of the top post 8. An upper rotating rod 10 is rotatably mounted within a groove. A second gear 11 is located in the middle of the upper rotating rod 10, meshing with the first gear 9. A third gear 12 is mounted at one end of the upper rotating rod 10. A side cavity 13 is provided inside one side of the movable upper cover 5. The end of the upper rotating rod 10 extends into the side cavity 13. A... An inner plate 14 is provided, and a vertical shaft 15 is rotatably mounted on the inner plate 14. A fourth gear 16 is mounted on the top of the vertical shaft 15, and the fourth gear 16 is meshed with the third gear 12. A base column 17 is fixedly connected to the bottom of the vertical shaft 15. The base column 17 is a square column, and the lower end of the base column 17 is movably inserted into the movable sleeve 18. The movable sleeve 18 can move longitudinally on the base column 17 and will rotate with the base column 17. A lifting block 19 is rotatably sleeved on the outside of the movable sleeve 18. A compression spring 20 is provided between the lifting block 19 and the inner plate 14.
[0029] The movable sleeve 18 penetrates the bottom surface of the movable upper cover 5 and is rotatably connected to the movable upper cover 5. The bottom end of the movable sleeve 18 is connected to the upper docking plate 21. The bottom shaft 22 is rotatably installed next to the mounting groove 3. The top end of the bottom shaft 22 is provided with the lower docking plate 23. The lower docking plate 23 and the upper docking plate 21 fit tightly together. When the movable upper cover 5 and the fixed seat 2 are together, the compression spring 20 pushes the lifting block 19 down, which increases the pressure between the lower docking plate 23 and the upper docking plate 21. The friction between the lower docking plate 23 and the upper docking plate 21 is very large, so that the two can rotate synchronously. The bottom end of the bottom shaft 22 is equipped with the fifth gear 24, and the lower rotating rod 25 is equipped with the sixth gear 26. The sixth gear 26 and the fifth gear 24 are meshed and connected.
[0030] In this invention, chip 4 is installed in mounting slot 3, and pins 401 on chip 4 are correspondingly inserted into mating tubes 301. After the movable top cover 5 and the fixing base 2 are fixedly connected, chip 4 can be pressed and fixed. Compared with the current welding and fixing method, disassembly and assembly are more convenient. When chip 4 is working, it generates heat. The drive motor 6 drives the first-stage cooling fan 7 to rotate, which can dissipate heat from the top of chip 4. The heat also enters the coolant in the inner cavity from the bottom. Because of the turbulence component and transmission mechanism that improve heat dissipation, the rotation of the first-stage cooling fan 7 can drive the first gear 9 to rotate, which in turn drives the upper rotating rod 10 and the third gear through the second gear 11. When gear 12 rotates, the engagement of the third gear 12 and the fourth gear 16 causes the vertical shaft 15 to drive the movable sleeve 18 to rotate, which in turn causes the movable sleeve 18 to drive the upper mating plate 21 to rotate. The upper mating plate 21 and the lower mating plate 23 are tightly fitted together with a large friction at the connection point, which causes the lower mating plate 23 to drive the bottom shaft 22 and the fifth gear 24 to rotate. The engagement of the fifth gear 24 and the sixth gear 26 causes the lower rotating rod 25 to rotate, which in turn causes the secondary cooling fan 28 to rotate to dissipate heat and cool the coolant in the inner cavity from both sides. At the same time, the rotation of the spiral blades 27 can accelerate the circulation of the coolant in the inner cavity, speed up heat transfer, and thus improve heat dissipation efficiency.
[0031] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.
Claims
1. A transparent printed circuit board suitable for various environments, comprising a circuit board body (1), characterized in that: The circuit board body (1) is provided with a fixing seat (2), the fixing seat (2) is provided with a mounting groove (3), a chip (4) is installed in the mounting groove (3), the chip (4) is provided with a number of pins (401), the pins (401) are inserted into the docking tube (301), the bottom of the docking tube (301) is connected to a connecting post (302), the fixing seat (2) is connected to a movable top cover (5), the movable top cover (5) is provided with a groove, a drive motor (6) is installed in the groove, the drive motor (6) is connected to a primary heat dissipation fan (7), the fixing seat (2) is provided with an inner cavity, the inner cavity is provided with a turbulence component for improving heat dissipation efficiency, and a transmission mechanism is connected between the primary heat dissipation fan (7) and the turbulence component.
2. The transparent printed circuit board suitable for various environments according to claim 1, characterized in that: The circuit board body (1) includes a substrate (101) and a covering material (102).
3. A transparent printed circuit board suitable for various environments according to claim 2, characterized in that: The substrate (101) includes a transparent polyimide film base layer, and an adhesive layer is disposed on the transparent polyimide film base layer. The covering material (102) includes an adhesive layer connected to the substrate (101) and a transparent polyimide film base layer coating.
4. A transparent printed circuit board suitable for various environments according to claim 2, characterized in that: The substrate (101) is symmetrically provided with two layers. The substrate (101) includes a transparent polyimide film base layer, and a copper foil (103) is provided in the adhesive. The covering material (102) includes a transparent polyimide film base layer coating. Adhesives that connect to the two substrates (101) are respectively provided on both sides of the transparent polyimide film base layer coating.
5. A transparent printed circuit board suitable for various environments according to claim 1, characterized in that: The turbulence assembly includes a lower rotating rod (25) rotatably installed in the inner cavity, with two sets of spiral blades (27) arranged in the middle of the lower rotating rod (25), and two secondary cooling fans (28) installed at both ends of the lower rotating rod (25).
6. A transparent printed circuit board suitable for various environments according to claim 1, characterized in that: The transmission mechanism includes a top column (8) installed at the top of the first-stage cooling fan (7), a first gear (9) connected to the top of the top column (8), an upper rotating rod (10) rotatably installed in the groove, a second gear (11) provided in the middle of the upper rotating rod (10), the second gear (11) and the first gear (9) meshing and connected, and a third gear (12) installed at one end of the upper rotating rod (10).
7. A transparent printed circuit board suitable for various environments according to claim 1, characterized in that: The movable cover (5) has a side cavity (13) inside one side. The end of the upper rotating rod (10) extends into the side cavity (13). An inner plate (14) is provided in the side cavity (13). A vertical shaft (15) is rotatably mounted on the inner plate (14). A fourth gear (16) is installed on the top of the vertical shaft (15). The fourth gear (16) and the third gear (12) are meshed and connected. A bottom column (17) is fixedly connected to the bottom of the vertical shaft (15). The bottom column (17) is a square column. The lower end of the bottom column (17) is movably inserted into the movable sleeve (18). A lifting block (19) is rotatably sleeved on the outside of the movable sleeve (18). A compression spring (20) is provided between the lifting block (19) and the inner plate (14).
8. A transparent printed circuit board suitable for various environments according to claim 7, characterized in that: The movable sleeve (18) penetrates the bottom surface of the movable upper cover (5), and the movable sleeve (18) and the movable upper cover (5) are rotatably connected. The bottom end of the movable sleeve (18) is connected to the upper docking plate (21).
9. A transparent printed circuit board suitable for various environments according to claim 1, characterized in that: A bottom shaft (22) is rotatably mounted next to the mounting slot (3). A lower mating plate (23) is provided at the top of the bottom shaft (22). The lower mating plate (23) and the upper mating plate (21) fit tightly together. A fifth gear (24) is installed at the bottom end of the bottom shaft (22). A sixth gear (26) is installed on the lower rotating rod (25). The sixth gear (26) and the fifth gear (24) mesh together.