线路板制备方法以及线路板
By forming blind vias and filling them with conductive material in the sub-board of the circuit board, the problem of insufficient density of the conductive connection layer is solved, achieving higher signal transmission reliability and production efficiency.
CN116156756BActive Publication Date: 2026-07-17SHENNAN CIRCUITS
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- SHENNAN CIRCUITS
- Filing Date
- 2021-11-19
- Publication Date
- 2026-07-17
AI Technical Summary
Technical Problem
In existing technologies, solder ball connections cannot meet the requirements of harsh operating environments, resulting in insufficient density of the conductive connection layer structure and significant signal transmission loss.
Method used
A first blind hole and a second blind hole are formed in the first and second sub-plates to be pressed, respectively, and conductive material is filled into the blind holes. The conductive connection layer is made denser by high-temperature pressing and sintering.
Benefits of technology
Double-sided lamination makes the conductive connection layer structure denser, reducing the overall network resistance and signal loss of the device, and improving product reliability and production efficiency.
✦ Generated by Eureka AI based on patent content.
Smart Images
Figure CN116156756B_ABST
Abstract
本申请公开了一种线路板制备方法以及线路板，该制备方法包括：获取到第一子板与第二子板；其中，第一子板上设置有第一焊盘，第二子板上设置有第二焊盘，第一焊盘与第二焊盘的位置相对应；对第一子板的第一预设位置进行钻孔处理，以形成第一盲孔；同时对第二子板的第二预设位置进行钻孔处理，以形成第二盲孔；其中，第一盲孔的位置与第二盲孔的位置相对应；同时在第一盲孔与第二盲孔中填充导电材料，以在第一盲孔与第二盲孔中分别形成第一导电介质层以及第二导电介质层；将第一子板与第二子板进行层叠压合，以使第一导电介质层与第二导电介质层电连接，形成线路板。本申请通过双面压合导电材料，能够使对接形成的导电连接层的结构更加致密。
Need to check novelty before this filing date? Find Prior Art