Cooling device and electronic device

Abstract

The present disclosure relates to a cooling device and an electronic device; the cooling device comprises a condensing part and a sealed part, wherein the sealed part can accommodate a cooling liquid capable of immersing a circuit board on which a heat generating element is installed; the condensing part comprises a condensing tube and an air cooling structure for dissipating heat from the condensing tube; the condensing tube is in communication with the sealed part; and the air cooling structure is arranged on at least one side of the condensing tube. Thus, the present disclosure can effectively reduce the working temperature of the chip by using phase change heat transfer, without the need to design and arrange additional liquid cooling structures, thereby reducing the design complexity and saving the internal space of the electronic device.

Description

Technical Field

[0001] This disclosure relates to, but is not limited to, the field of radiator technology, and particularly to a cooling device and electronic equipment. Background Technology

[0002] As the power of electronic devices increases, the heat dissipation of key components has gradually become a technical bottleneck for various manufacturers. The heat dissipation problem directly affects the lifespan and power consumption of electronic devices. Currently, most consumer electronic devices use natural heat dissipation or forced air cooling. Some data centers have deployed water cooling devices. However, due to the large number of heat-generating components on the circuit board and the continuous increase in heat flux density, the temperature uniformity of electronic components has become a new challenge.

[0003] In related technologies, liquid cooling devices are usually installed using additional external components, such as condenser rings and pumps that are set up independently of the internal heat dissipation mechanism of current electronic devices. This not only results in high design complexity and large footprint, but also high reliability and cost.

[0004] There is currently no effective solution to the problem that the design complexity and size of the heat dissipation problem in related technologies for electronic devices are far greater than the actual application requirements. Summary of the Invention

[0005] This disclosure provides a cooling device and electronic device to reduce design complexity and save internal space in electronic devices.

[0006] According to a first aspect of the present disclosure, a cooling device is provided, comprising: a condensing portion and a sealing portion, wherein the sealing portion is capable of containing a coolant, and the coolant is capable of immersing a circuit board on which a heating element is mounted; the condensing portion includes a condensing tube and an air-cooling structure for dissipating heat from the condensing tube; the condensing tube is in communication with the sealing portion; and the air-cooling structure is disposed on at least one side of the condensing tube.

[0007] In the above scheme, the condenser is a flat metal tube; or, the condenser has a capillary structure inside.

[0008] In the above scheme, the outer wall of the condenser tube is provided with multiple fins.

[0009] In the above scheme, the condensation part further includes: a first shell, the first shell forming a first accommodating cavity, and the condenser tube being housed in the first accommodating cavity.

[0010] In the above scheme, the air-cooled structure includes heat dissipation holes, which are opened on the side wall of the first housing.

[0011] In the above scheme, the first housing also includes a heat dissipation duct, wherein the heat dissipation duct is housed in the first accommodating cavity, the heat dissipation duct is distributed according to the position of the condenser tube, and the heat dissipation duct is connected to the heat dissipation hole.

[0012] In the above scheme, the air-cooled structure includes a cooling fan.

[0013] In the above scheme, when the air-cooled structure includes a cooling fan, the cooling device also includes: a first power supply, which is connected to the cooling fan.

[0014] In the above scheme, when the air-cooled structure includes a cooling fan, the cooling device further includes a first control circuit, which is connected to the cooling fan.

[0015] In the above scheme, the sealing part includes a second housing, which encloses a second accommodating cavity; the condensing cavity of the condenser tube is connected to the second accommodating cavity.

[0016] In the above scheme, the second housing includes: a cover plate, a bottom plate, and a side plate; wherein, a through hole is provided on the cover plate, and a condenser tube is disposed at the through hole; the cover plate, the bottom plate, the side plate, and the condenser tube form a sealed space.

[0017] According to a second aspect of the present disclosure, an electronic device is provided, comprising: a cooling device as described above and a circuit board, wherein the circuit board is immersed in a coolant in a sealed portion, a first surface of the circuit board faces the surface of the coolant, the number of heating elements disposed on the first surface is greater than the number of heating elements disposed on the second surface of the circuit board, and the first surface and the second surface are opposite to each other.

[0018] In the above scheme, the angle between the circuit board and the surface of the coolant is a preset angle.

[0019] In the above scheme, the electronic device also includes: a second power supply, which is connected to the circuit board.

[0020] In the above scheme, the electronic device also includes a second control circuit, which is connected to the circuit board and the second power supply respectively.

[0021] In the above scheme, the electronic device also includes a third control circuit, which is connected to the circuit board.

[0022] The technical solution provided in this disclosure may include the following beneficial effects:

[0023] In this disclosure, by containing a coolant in a sealed portion that can be used to cool the circuit board during operation, and after the coolant vaporizes, the coolant is converted from a gaseous state to a liquid state through a condensation portion and flows back to the sealed portion, heat dissipation of the circuit board during operation is achieved through a combination of liquid cooling and air cooling modes. This achieves effective reduction of chip operating temperature by using phase change heat transfer, and reduces design complexity and saves internal space of electronic devices because no additional liquid cooling structure needs to be designed and arranged separately.

[0024] It should be understood that the above general description and the following detailed description are exemplary and explanatory only, and are not intended to limit this disclosure. Attached Figure Description

[0025] The accompanying drawings, which are incorporated in and form a part of this specification, illustrate embodiments consistent with this disclosure and, together with the description, serve to explain the principles of this disclosure.

[0026] Figure 1 A schematic diagram of a cooling device provided in an exemplary embodiment is shown;

[0027] Figure 2 A schematic diagram of the fins of a condenser tube in a cooling device provided in an exemplary embodiment is shown;

[0028] Figure 3 An explosion schematic diagram of a cooling device provided in an exemplary embodiment is shown;

[0029] Figure 4 A cross-sectional schematic diagram of a cooling device provided in an exemplary embodiment is shown;

[0030] Figure 5 A schematic diagram of an electronic device provided in an exemplary embodiment is shown;

[0031] Figure 6 A schematic diagram of the appearance of an electronic device provided in an exemplary embodiment is shown. Detailed Implementation

[0032] The embodiments of this disclosure are described below with reference to the accompanying drawings. In the following description, reference is made to the accompanying drawings, which form part of this application and illustrate specific aspects of the embodiments of this disclosure or to illustrate specific aspects of the embodiments of this disclosure. It should be understood that the embodiments of this disclosure can be used in other aspects and may include structural or logical variations not depicted in the drawings. Therefore, the following detailed description should not be construed in a limiting sense, and the scope of this application is defined by the appended claims. For example, it should be understood that the disclosure in connection with the described methods can also be applied to corresponding devices or systems for performing the methods, and vice versa. For example, if one or more specific method steps are described, the corresponding device may include one or more units, such as functional units, to perform the described one or more method steps (e.g., one unit performs one or more steps, or multiple units, each performing one or more of multiple steps), even if such one or more units are not explicitly described or illustrated in the drawings. On the other hand, for example, if a specific apparatus is described based on one or more units such as functional units, the corresponding method may include a step to perform the functionality of one or more units (e.g., a step to perform the functionality of one or more units, or multiple steps, each of which performs the functionality of one or more units among a plurality of units), even if such one or more steps are not explicitly described or illustrated in the accompanying drawings. Furthermore, it should be understood that, unless otherwise expressly stated, features of the various exemplary embodiments and / or aspects described herein can be combined with each other.

[0033] Example 1

[0034] This disclosure provides a cooling device that can be installed in or externally connected to an electronic device for dissipating heat from a circuit board containing one or more heat-generating components. For example, the circuit board can be a computing board in a computing device, a motherboard in a server rack, etc.

[0035] Figure 1 A schematic diagram of a cooling device provided in an exemplary embodiment is shown, such as Figure 1 As shown, the cooling device may include a condenser section 12 and a sealing section 14. The sealing section 14 can contain coolant, which can immerse the circuit board 20 on which the heat-generating element is mounted, for immersion heat dissipation. The condenser section 12 may include a condenser pipe 121 and a fan-cooled structure 122 for dissipating heat from the condenser pipe; the condenser pipe 121 is connected to the sealing section 14; the fan-cooled structure 122 is disposed on at least one side of the condenser pipe 121.

[0036] Specifically, such as Figure 1As shown, the cooling device provided in this embodiment consists of a condensation section 12 and a sealing section 14. The sealing section 14 is used to store coolant and circuit board 20. Circuit board 20 is immersed in coolant. When circuit board 20 is in working state, when the components in circuit board 20 heat up, the coolant carries away the heat from the surface of the components and vaporizes from liquid to gas, reaching the condenser tube 121 in the condensation section 12. Based on the positional relationship of the air-cooling structure 122 disposed on at least one side of the condenser tube 121, the air-cooling structure 122 dissipates heat from the condenser tube 121. The vaporized coolant is converted from gas to liquid in the condenser tube 121 and flows back to the sealing section 14.

[0037] It should be noted that, in this embodiment, the circuit board 20 can be a printed circuit board assembly (PCBA). The PCBA includes a TOP side (also called the front side, or first surface) and a BOT side (also called the back side, or second surface), wherein the number of heat-generating elements on the TOP side is greater than the number of heat-generating elements on the BOT side. In practical applications, these heat-generating elements can be high-power chips such as CPUs and GPUs.

[0038] In this embodiment of the disclosure, after coolant is injected into the sealing portion 14, the entire PCBA is immersed in the coolant, with the TOP surface facing the surface of the coolant, which can also be understood as the TOP surface facing upwards.

[0039] In this embodiment of the disclosure, the PCBA can be modified by a hollowing process to change the shape of a specific part of the circuit board, thereby promoting the rise of the back bubble of the PCBA. Alternatively, the rise of the back bubble of the PCBA can be promoted by controlling the tilt angle of the PCBA. This embodiment of the disclosure is only used as an example to illustrate the cooling device provided in this disclosure, and is not limited to any specific application.

[0040] After all the components on the PCBA are in operation, as the power of the heating elements increases, the heating elements on the top surface generate heat, causing the coolant to boil locally. The coolant absorbs the heat from the heating elements and carries away the heat through vaporization (i.e., the coolant changes from a liquid to a gaseous state), thus dissipating heat from the heating elements and ensuring the stability of their operating temperature. Then, the gaseous coolant rises from the sealed section 14 to the condenser section 12 and enters the condenser tube 121. The air-cooled structure 122 dissipates heat from the condenser tube 121, causing the temperature of the coolant entering the condenser tube 121 to decrease, condensing the gaseous coolant and causing it to change from a gaseous state to a liquid state, before flowing back to the sealed section 14. In this way, through the two-phase circulation of the coolant, heat dissipation is achieved for the circuit board 20.

[0041] In some possible embodiments, the condenser tube 121 can be one or more. When there are multiple condenser tubes 121 in the condensation section 12, the positions of the condenser tubes 121 can be distributed according to the reserved positions of the sealing section 14. The reserved positions can be set according to the position of each heating element on the PCBA, so that the coolant can be effectively collected after vaporization at each heating element position.

[0042] The condenser tubes 121 can also be placed in groups, with each group containing a unit number of condenser tubes 121, so that they can be cooled in a concentrated manner. This allows for targeted heat dissipation when the air-cooled structure 122 dissipates heat in the subsequent process.

[0043] In a preferred embodiment, the condenser tube 121 in this disclosure can be a flat metal tube; or, the condenser tube 121 is provided with a capillary structure. It is understood that the condensation cavity of the condenser tube 121 has a hollow structure, wherein the hollow structure includes: a flat hollow shape or a capillary structure.

[0044] Specifically, the condensation chamber of each condenser tube 121 can be used to collect the vaporized coolant and condense it from a gaseous state to a liquid state. Furthermore, to accelerate the return of the condensed coolant to the sealing part 14, when the condenser tube 121 is a flat metal tube, the cross-sectional area of ​​the flat tube is much larger than that of a cylindrical tube. Based on the thermal conductivity of metal, when the condenser tube 121 is a flat metal tube, by utilizing the thermal conductivity of metal and increasing the heat dissipation area of ​​the condenser tube 121, the conversion of the coolant from a gaseous state to a liquid state is accelerated, achieving a two-phase circulation. The flat metal tube can be manufactured using methods such as aluminum profile extrusion and casting.

[0045] Alternatively, to accelerate the return of condensed coolant to the sealing portion 14, a capillary structure can be provided inside the condenser tube 121. This reduces the amount of coolant adhering to the inner wall of the condenser tube 121 and allows it to return to the sealing portion 14 along the capillary structure. The capillary structure can be formed by machining the interior of the condenser tube 121, and it includes at least one groove formed on the inner wall of the condenser tube 121. For example, the groove on the inner wall of the condenser tube 121 can be spirally upward along the inner wall. The capillary structure improves the coolant return capacity of the condenser tube 121.

[0046] In a preferred embodiment, the outer wall of the condenser tube 121 in this embodiment is provided with a plurality of fins.

[0047] Specifically, the outer wall of the condenser tube 121 is provided with multiple fins 1211, which can be implemented in at least two ways: that is, multiple fins are machined onto the outer wall of the condenser tube 121 by means of machining, or multiple fins are distributed on the outer surface of the condenser tube 121 by means of fixing such as sleeve, welding or bonding. Since the provision of multiple fins increases the heat dissipation area of ​​the condenser tube 121, the condenser tube 121 can accelerate the completion of the two-phase circulation of the coolant when condensing the gaseous coolant, thereby improving the heat dissipation efficiency of the circuit board 20 during operation.

[0048] in, Figure 2 A schematic diagram of the fins of a condenser tube in a cooling device provided by an exemplary embodiment is shown. Figure 2 As shown, in this embodiment, the outer wall of the condenser tube 121 is provided with multiple fins, wherein each fin is arranged in parallel and from bottom to top from the bottom of the condenser tube 121. It should be noted that... Figure 2 Only the structure of one condenser tube 121 is shown; in this embodiment, the structure of each condenser tube may be the same.

[0049] In some possible implementations, the cooling device provided in the embodiments of this disclosure is as follows: Figure 3 As shown, Figure 3 An explosion schematic diagram of a cooling device provided in an exemplary embodiment is shown.

[0050] In this embodiment of the present disclosure, the condensation section 12 further includes: a first housing 123, the first housing 123 forming a first accommodating cavity, and the condenser tube 121 being accommodated in the first accommodating cavity.

[0051] like Figure 3 As shown, the space formed by the first housing 123 of the condensing section 12 can be called the first accommodating cavity. The condensing pipe 121 and the air-cooling structure 122 are both disposed on the first housing, and the condensing pipe 121 is disposed in the first accommodating cavity.

[0052] It should be noted that the embodiments of this disclosure implement the heat dissipation and cooling process of the condenser tube 121 in at least the following three ways:

[0053] Method 1: Natural wind cooling.

[0054] In a preferred embodiment, the air-cooled structure 122 includes heat dissipation holes 1221, which are formed on the side wall of the first housing 123.

[0055] like Figure 3 As shown, the heat dissipation hole 1221 is located on the side wall of the first housing 123 and is used to introduce outside air (or cold air introduced by external devices) into the first accommodating cavity to realize natural wind to dissipate heat from the condenser tube 121.

[0056] In this embodiment of the present disclosure, the first housing 123 further includes a heat dissipation duct, wherein the heat dissipation duct is housed in the first accommodating cavity, the heat dissipation duct is distributed according to the position of the condenser tube 121, and the heat dissipation duct is connected to the heat dissipation hole 1221.

[0057] In this process, without adding any forced air cooling equipment, by opening a heat dissipation duct in the first housing 123, the heat dissipation duct in the first accommodating cavity can target the air introduced from the heat dissipation hole 1221 to the position of each condenser 121 according to the position of each condenser 121, thereby achieving effective heat dissipation of the condenser 121 surface by natural wind.

[0058] Method 2: Cooling fan for heat dissipation.

[0059] In a preferred embodiment, the air-cooled structure 122 includes a cooling fan 1222; wherein the cooling fan 1222 is mounted on at least one side of the condenser tube 121.

[0060] Specifically, such as Figure 3 As shown, the connection structure between the cooling fan 1222 and other components of the condenser section 12 is as follows: the cooling fan 1222 is located on one side of the condenser tube 121, and the number of heat dissipation holes 1221 is set according to the number of cooling fans 1222. The airflow generated by the operation of the cooling fan 1222 can dissipate heat from the condenser tube 121, improve the condensation efficiency of the coolant, and accelerate the two-phase circulation of the coolant.

[0061] In this embodiment, the number of cooling fans 1222 is not limited, and the number of cooling fans 1222 can be increased or decreased according to the heat dissipation requirements; or, in the case of multiple cooling fans, the number of cooling fans turned on (or the number of cooling fans turned off) is adjusted according to the monitored operating temperature of the PCBA based on the control signal, so as to meet the heat dissipation requirements of the PCBA in real time; the embodiments of this disclosure are only described using the above as an example to implement the cooling device provided by this disclosure, and are not specifically limited.

[0062] Furthermore, it should be noted that, in the implementation of this embodiment, the cooling fan 1222 is also configured as follows: without the first housing 123, the cooling fan 1222 is positioned on one side of the condenser pipe 121, and neither the condenser pipe 121 nor the cooling fan 1222 is enclosed by any housing. While the cooling fan 1222 is running, the condenser pipe 121 is in direct contact with the outside air, increasing the heat dissipation space, improving the condensation efficiency of the coolant, and accelerating the two-phase circulation of the coolant.

[0063] Furthermore, based on the connection structure between the cooling fan 1222 and the condenser tube 121, the cooling fan 1222 cools the condenser tube 121 and the fins, the gaseous coolant is reliquefied, and flows back to the sealing part 14 under the action of gravity, thereby realizing the phase change cooling of the cooling device provided in this embodiment of the present disclosure.

[0064] When the air-cooled structure 122 includes a cooling fan 1222, the cooling device provided in this embodiment of the present disclosure further includes a first power supply 13, which is connected to the cooling fan 1222.

[0065] When the air-cooled structure 122 includes a cooling fan 1222, the cooling device provided in this embodiment of the present disclosure further includes: a first control circuit 15, which is connected to the cooling fan 1222.

[0066] Specifically, in this embodiment of the present disclosure, the first power supply 13 is connected to the cooling fan 1222, and the first control circuit 15 is connected to the cooling fan 1222. Figure 3 Not shown in the image. Figure 3 The first power supply 13 is used to supply power to the cooling fan 1222, and the first control circuit 15 is used to control the operation of the cooling fan 1222. Controlling the operation of the cooling fan 1222 may include at least one or a combination of: controlling the cooling fan 1222 to turn on or off, controlling the operating speed of the cooling fan 1222, or controlling the rotation direction of the fan blades of the cooling fan 1222.

[0067] Method 3: A combination of Method 1 and Method 2.

[0068] With the first housing 123 provided with heat dissipation holes 1221, the cooling fan 1222 is matched with the heat dissipation holes 1221 and connected to the heat dissipation duct. Through the operation of the cooling fan 1222, the outside air is accelerated into the first housing 123. The accelerated air is delivered to each condenser pipe 121 through the heat dissipation duct, thereby improving the condensation efficiency of the coolant and accelerating the two-phase circulation of the coolant.

[0069] In a preferred embodiment, the sealing portion 14 includes a second housing 141 that forms a second accommodating cavity; the condensing cavity of the condenser tube 121 is in communication with the second accommodating cavity.

[0070] Among them, such as Figure 3 As shown, the significance of the connection between the condensing chamber of the condenser tube 121 and the second accommodating chamber is that the coolant in the gaseous state in the condenser tube 121 is condensed into liquid coolant. Through the structure that connects the condenser tube 121 and the second accommodating chamber, the liquid coolant in the condensing chamber of the condenser tube 121 can flow back into the second accommodating chamber, realizing the two-phase circulation of coolant.

[0071] The second housing 141 includes a cover plate 1411, a bottom plate 1412, and a side plate 1413; the cover plate 1411 has a through hole, and the condenser pipe 121 is disposed at the through hole; the cover plate 1411, the bottom plate 1412, the side plate 1413, and the condenser pipe 121 form a sealed space.

[0072] Specifically, in this embodiment, the condenser tube 121 is fixed to the cover plate 1411 by friction welding, brazing or adhesive bonding. The sealing cavity formed by the cover plate 1411, the bottom plate 1412 and the side plate 1413 is formed by sealing rings, sealant and other sealing methods to constitute a sealing structure, wherein the condenser tube 121 and the inside of the sealing cavity are connected.

[0073] In addition, in this embodiment, the condenser tube 121 can also be connected to the sealing cavity by means of mechanical connection and sealing ring.

[0074] In this embodiment of the disclosure, Figure 4 A cross-sectional schematic diagram of a cooling device provided in an exemplary embodiment is shown. Figure 4 As shown in the cross-sectional schematic diagram of the cooling device provided in this embodiment, a condenser 121, a first power supply 13, a first control circuit 15, and a cooling fan 1222 are shown. The shaded area where the condenser 121 and the cooling fan 1222 overlap is the fin of the condenser 121.

[0075] It should be noted that the cooling device provided in this embodiment is only illustrated by the above example to illustrate the cooling device provided in this embodiment, and is not specifically limited.

[0076] The cooling device provided in this embodiment features an integrated air-liquid cooling chassis design, immersing the circuit board 20 and heating element in the coolant. The heat from the heating element is carried away by the boiling of the coolant, ensuring that the operating temperature of the heating element remains within a safe range, thereby achieving cooling and temperature uniformity of the heating element. The phase change liquid is directly cooled by the integrated air-cooled heat exchange section (condenser section 12 and sealing section 14), achieving short cooling distance and high heat exchange efficiency. The integrated design allows for flexible application, suitable for independent transportation and operation, and can directly replace current air-cooled products in cluster applications, adapting to various air-cooled application scenarios and deployment forms. Compared with liquid-cooled products, its integrated design eliminates the need for pumps and pipelines, making the overall design more compact and convenient.

[0077] Furthermore, compared to the widely used air cooling and water cooling methods, the cooling device provided in this disclosure utilizes phase change heat transfer, which effectively reduces the operating temperature of the heating element, improves temperature uniformity, and reduces system energy consumption. The efficient cooling of phase change heat transfer reduces the size of air cooling, and the integrated design eliminates the complex components of water cooling. Additionally, the condenser tube structure provided in this disclosure enables heat dissipation for high-power systems, is simple to manufacture, and has a lower cost compared to VC, gravity heat pipes, etc.

[0078] Example 2

[0079] This disclosure provides, for example Figure 5 The electronic device shown, Figure 5 A schematic diagram of an electronic device provided in an exemplary embodiment is shown.

[0080] This disclosure provides an electronic device, specifically including: a cooling device 52 and a circuit board 54 as in embodiment 1, wherein the circuit board 54 is immersed in a coolant in a sealed portion, the first surface of the circuit board 54 faces the surface of the coolant, the number of heating elements disposed on the first surface is greater than the number of heating elements disposed on the second surface of the circuit board 54, and the first surface and the second surface are opposite to each other.

[0081] The electronic device provided in this embodiment can be a server, server cluster, or computer, or other computing device with high computing power and high chip energy consumption. The structure of the cooling device 52 can be found in the description of the cooling device in Embodiment 1 above, and will not be repeated here.

[0082] In this embodiment, the first surface of the circuit board 54 can be the TOP surface of the circuit board 54, and the second surface can be the BOT surface of the circuit board 54. The TOP surface is equivalent to the front side of the circuit board, and the BOT surface is equivalent to the back side of the circuit board. The TOP surface and the BOT surface are matched. The difference between the two is that the TOP surface has more components (i.e., the heat-generating components in this embodiment) while the BOT surface has fewer components. Therefore, the TOP surface is set to face upward so that the coolant can completely immerse the surface and accelerate the removal of heat from the heat-generating components on the TOP surface during the two-phase circulation of the coolant, thereby achieving the purpose of heat dissipation of the circuit board 54.

[0083] Specifically, circuit board 54 is completely immersed in coolant. When the electronic device is running, if the temperature of the heat-generating element (such as the chip) exceeds the boiling point of the liquid, the coolant will locally boil in the area near the chip, and the heat from the chip will be carried away by the vaporization of the surface liquid. Once the device is running stably, the system reaches heat transfer equilibrium. At this point, the heat generated by the chip is continuously carried away through phase change, ensuring the stability of the chip's operating temperature.

[0084] It should be noted that the PCBA (i.e., circuit board 54 in this embodiment) material in this disclosure can be FR-4 grade material, aluminum-based material, copper-based material, etc., and this disclosure does not impose specific limitations on it. In addition, the surface of the chip can be without a thermal expansion surface, or it can be in the form of increasing the thermal expansion surface through soldering, gluing, deposition, etc., only to achieve the electronic device provided in this disclosure embodiment, and no specific limitation is imposed.

[0085] In this embodiment of the disclosure, the angle between the circuit board 54 and the surface of the coolant can be a preset angle.

[0086] Specifically, the angle between the circuit board 54 and the coolant surface is set to a preset angle so that the high-power heating element can effectively contact the coolant according to the tilted position, so that the coolant can more effectively carry away the heat dissipated by the heating element during the vaporization process and maintain the normal working state of the heating element.

[0087] In a preferred embodiment, the electronic device provided in this disclosure further includes a second power supply 56 connected to the circuit board 54.

[0088] Specifically, such as Figure 5 As shown, the second power supply 56 is connected to the circuit board 54 via a copper strip. The copper strip passes through a hole in the sealing part of the cooling device 52, and sealant is applied around the copper strip to seal the hole. Then, the second power supply 56 supplies power to the circuit board 54.

[0089] It should be noted that the first power supply in the cooling device 52 can be the same power supply as the second power supply 56, or the same power supply can be two power modules that supply power to the circuit board and the cooling fan respectively.

[0090] In this embodiment of the disclosure, the control circuit in the electronic device includes two implementation methods:

[0091] In the first method, the second control circuit 58 is connected to the circuit board 54 and the second power supply 56 respectively.

[0092] In a preferred embodiment, the electronic device provided in this disclosure further includes a second control circuit 58, which is connected to the circuit board 54 and the second power supply 56, respectively.

[0093] Specifically, in this embodiment, the second control circuit 58 is connected to the circuit board 54 and the second power supply 56, respectively, for monitoring and controlling the circuit board 54 and obtaining power from the second power supply 56. The second control circuit 58 in this embodiment can be the first control circuit in Embodiment 1, or two different control units located on the same integrated control board as the first control circuit.

[0094] This disclosure includes embodiments, Figure 6 A schematic diagram of the appearance of an electronic device provided in an exemplary embodiment is shown, such as Figure 6 As shown, the electronic device consists of a cooling device, a second power supply 56, and a second control circuit 58. The circuit board is mounted on the sealed part of the cooling device, the second power supply 56 is located below the cooling device, and the second control circuit 58 is located on the right side of the cooling device. This embodiment is only described using the above example to illustrate the electronic device provided in this embodiment, and is not specifically limited.

[0095] In addition, the second power supply 56 can also be installed on the top of the machine or on the left and right sides, depending on the electronic equipment provided in this embodiment, and no specific limitation is made.

[0096] In a preferred embodiment, the third control circuit is connected to the circuit board 54.

[0097] In the above-described scheme, the electronic device provided in this embodiment of the disclosure further includes: a third control circuit, which is connected to the circuit board 54.

[0098] The third control circuit is connected to the circuit board 54 and is used to control the operation of the circuit board 54, or to forward external instructions to the circuit board 54 through the third control circuit.

[0099] It should be noted that in this embodiment, the second control circuit 58 and the third control circuit can be the same control circuit, or they can be two different control units on the same integrated control board. Both the second control circuit 58 and the third control circuit can be connected to the circuit board 54 via an aviation connector, wherein the aviation connector is also sealed and fixed to the outer wall of the sealed part in the cooling device by sealant.

[0100] In this embodiment of the present disclosure, the electronic device provided by the present disclosure contains a coolant in a sealed portion of the cooling device that can be used to cool the circuit board during operation. After the coolant vaporizes, the coolant is converted from a gaseous state to a liquid state through a condensation portion and flows back to the sealed portion. This achieves heat dissipation of the circuit board during operation through a combination of liquid cooling and air cooling modes. By adopting phase change heat dissipation, the chip operating temperature can be effectively reduced, the temperature uniformity can be improved, and the system energy consumption can be reduced. The volume of air cooling is reduced, and the integrated design eliminates the complex components of water cooling.

[0101] Those skilled in the art will appreciate that the functionality described in conjunction with the various illustrative logic blocks, modules, and algorithmic steps disclosed herein can be implemented in hardware, software, firmware, or any combination thereof. If implemented in software, the functionality described by the various illustrative logic blocks, modules, and steps can be stored or transmitted as one or more instructions or codes on a computer-readable medium and executed by a hardware-based processing unit. The computer-readable medium may comprise a computer-readable storage medium, which corresponds to a tangible medium, such as a data storage medium, or a communication medium that includes any medium facilitating the transfer of a computer program from one place to another (e.g., according to a communication protocol). In this way, the computer-readable medium may substantially correspond to (1) a non-transitory tangible computer-readable storage medium, or (2) a communication medium, such as a signal or carrier wave. The data storage medium may be any available medium accessible by one or more computers or one or more processors to retrieve instructions, code, and / or data structures for implementing the techniques described in this application. A computer program product may comprise a computer-readable medium.

[0102] The technology of this application can be implemented in a wide variety of devices or apparatuses, including wireless handheld devices, integrated circuits (ICs), or a set of ICs (e.g., chipsets). The various components, modules, or units described in this application are intended to emphasize functional aspects of the apparatuses used to perform the disclosed technology, but do not necessarily need to be implemented by different hardware units. In fact, as described above, the various units can be combined with suitable software and / or firmware within a codec hardware unit, or provided via interoperable hardware units (comprising one or more processors as described above).

[0103] In the above embodiments, the descriptions of each embodiment have different focuses. For parts not described in detail in a certain embodiment, please refer to the relevant descriptions in other embodiments.

[0104] The above description is merely an exemplary embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. An electronic device, comprising: include: A cooling device and a circuit board, wherein the cooling device includes a condensing portion and a sealing portion, the sealing portion being capable of containing coolant; the condensing portion includes a condenser tube and an air-cooling structure for dissipating heat from the condenser tube; the condenser tube is connected to the sealing portion; the air-cooling structure is disposed on at least one side of the condenser tube; a capillary structure is disposed inside the condenser tube; the capillary structure includes at least one groove formed on the inner wall of the condenser tube, the groove being spirally upward along the inner wall of the condenser tube; the condensing portion further includes: a first housing; the first housing further includes a heat dissipation duct; The air-cooled structure includes heat dissipation holes and a cooling fan; wherein, the first housing forms a first accommodating cavity, the condenser tubes and the heat dissipation ducts are housed within the first accommodating cavity, and the heat dissipation holes are formed on the side wall of the first housing; the cooling fan matches the heat dissipation holes and is connected to the heat dissipation ducts; the heat dissipation ducts communicate with the heat dissipation holes; the heat dissipation ducts are configured to be distributed according to the position of the condenser tubes; through the operation of the cooling fan, outside air is accelerated and introduced through the heat dissipation holes, and the accelerated air is guided to the surface of each condenser tube through the heat dissipation ducts; The circuit board is completely immersed in the coolant in the sealed portion, with the first surface of the circuit board facing the surface of the coolant. The number of heating elements on the first surface is greater than the number of heating elements on the second surface of the circuit board. The first surface and the second surface are opposite to each other. The circuit board includes a portion formed by a cutout process. The angle between the circuit board and the surface of the coolant is a preset angle.

2. The electronic device of claim 1, wherein, The outer wall of the condenser tube is provided with multiple fins.

3. The electronic device of claim 1, wherein, When the air-cooled structure includes a cooling fan, the cooling device further includes a first power supply, which is connected to the cooling fan.

4. The electronic device of claim 3, wherein, When the air-cooled structure includes a cooling fan, the cooling device further includes a first control circuit, which is connected to the cooling fan.

5. The electronic device of claim 1, wherein, The sealing portion includes a second housing, which forms a second accommodating cavity; the condensing cavity of the condenser tube is connected to the second accommodating cavity.

6. The electronic device of claim 5, wherein, The second housing includes a cover plate, a bottom plate, and a side plate; wherein, a through hole is provided on the cover plate, and the condenser tube is disposed at the through hole; the cover plate, the bottom plate, the side plate, and the condenser tube form a sealed space.

7. The electronic device of claim 1, wherein, The electronic device also includes a second power supply connected to the circuit board.

8. The electronic device of claim 7, wherein, The electronic device further includes a second control circuit, which is connected to the circuit board and the second power supply respectively.

9. The electronic device of claim 1, wherein, The electronic device further includes a third control circuit connected to the circuit board.

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