Electroplating frame unit for holding a substrate in a chemical and / or electrolytic surface treatment of the substrate

Abstract

The present disclosure relates to an electroplating frame unit for holding a substrate in a chemical and / or electrolytic surface treatment of the substrate and a method of assembling an electroplating frame unit for holding a substrate in a chemical and / or electrolytic surface treatment of the substrate. The electroplating frame unit comprises a front plate, a back plate and a vacuum unit. The front plate comprises a front frame part surrounding a front recess part. The back plate comprises a back frame part. The front frame part and the back frame part are interconnected to hold the substrate between the front frame part and the back frame part. The vacuum unit is configured to reduce an internal pressure between the front frame part and the back frame part to below an ambient pressure to attach the front frame part to the back frame part.

Description

Technical Field

[0001] Electroplating is one of the most widely used techniques for metallizing surfaces or parts thereof across many different industries, particularly in the semiconductor sector. This is due to the simplicity and scalability of the electroplating process, which can be applied to various types and sizes of substrates. Other advantages include low operating costs, making electroplating or electrodeposition the preferred method for substrate metallization. Furthermore, multiple substrates can be processed simultaneously.

[0002] To achieve sufficient film quality and uniformity in the electroplating process, ensuring excellent electrical contact with one or more surfaces of the substrate is particularly important. This typically involves the presence of one or more conductive seed layers to distribute current density across the surface region of the substrate. Excellent electrical contact is achieved by mounting the substrate for the electroplating process on an electroplating frame, which serves as a support frame in the process. The electroplating frame also acts as a transport frame, moving the substrate from the loading / unloading station through the electrolyte electroplating system and process flow back to the loading / unloading station. The electroplating frame can also be designed to process multiple substrates simultaneously.

[0003] Existing electroplating frames consist of two frame components: an upper frame and a lower frame, with the substrate clamped between them by mechanical force. These frame components press the electrical contacts against the substrate surface, which has a seed layer already formed for the electroplating process. Some frames are clamped together; others must be manually connected. To prevent the electrical contacts from being electroplated, a sealing ring can be used around the contacts; such frames are called dry contact frames. Wet contact frames also exist, which do not seal the electrical contacts in an electrolyte solution.

[0004] Existing electroplating frames rely on complex geometric clamping systems to apply mechanical force and ensure a secure hold on the substrate, typically requiring numerous screws for manual tightening. This manual tightening process often results in uneven force applied to the substrate, leading to unreliable electrical contact and an uneven electroplating process.

[0005] Because the base needs to be secured by manually tightening screws, fully automated loading and unloading is not possible, or can only be achieved through a complex robotic system.

[0006] Another major drawback of these complex geometric clamping systems is the presence of corners, edges, and gaps, which are very challenging and time-consuming to rinse and dry after the electroplating process. Thorough rinsing to remove all chemical residues, and thorough drying to avoid leaving any dried residue, are essential for the successful completion of the electroplating process.

[0007] In the case of a dry contact frame, most of the substrate surface is shielded by the electrolyte plating solution. This means a large area of ​​the substrate's upper surface is consumed in manufacturing the electrical contacts, thus reducing the usable surface area for component fabrication. Having more surface area available for manufacturing functional components would offer a significant cost advantage for the plating process.

[0008] Furthermore, it has been found that dry contact frames using sealing rings to protect electrical contacts are highly problematic during automated loading and unloading of large substrates, frequently leading to failed electrical contacts. These failed contacts are often not detected immediately, but only discovered after the electroplating process is complete, at which point the substrate has already failed to be processed and must be scrapped at a high cost.

[0009] In the case of wet contact frames, electrical contacts or pins typically provide very reliable electrical contact, but they are coated with a large amount of coating during the electroplating process. Over time, the large amount of coating on the electrical contacts results in a larger surface contact area, which will lead to changes in the electroplating of the substrate in subsequent processing (as the contact area increases, more current will pass through).

[0010] Furthermore, when using wet contact frames, the electrical contact areas tend to have a thicker metal layer plated on the substrate surface compared to other areas on the substrate (overplating). When the substrate is processed multiple times during component manufacturing through electroplating processes (typically up to 10 times or more), the significantly thicker metal layer in the electrical contact areas can cause problems in subsequent substrate processing, such as during the application of subsequent surface layers, such as photoresist, insulating, or passivation layers. Summary of the Invention

[0011] Therefore, it may be necessary to provide an improved electroplating frame unit for holding the substrate during chemical and / or electrolytic surface treatment of the substrate, in particular enabling a more uniform electroplating process.

[0012] The aforementioned problems can be addressed by the content of the independent claims, wherein further embodiments are incorporated in the dependent claims. It should be noted that the various aspects of this disclosure described below are also applicable to electroplating frame units for holding a substrate during chemical and / or electrolytic surface treatment of a substrate, and to methods of assembling electroplating frame units for holding a substrate during chemical and / or electrolytic surface treatment of a substrate.

[0013] According to this disclosure, an electroplating frame unit is proposed for retaining a substrate during chemical and / or electrolytic surface treatment. The electroplating frame unit includes:

[0014] -Front panel,

[0015] -Back panel, and

[0016] -Vacuum unit.

[0017] The front panel includes a front frame component surrounding the front recess component.

[0018] The rear panel includes a rear frame component. Optionally, the rear frame component surrounds the rear recess component.

[0019] The front frame component and the rear frame component are interconnected to hold the base between the front frame component and the rear frame component.

[0020] The vacuum device is configured to reduce the internal pressure between the front frame component and the rear frame component to below the ambient pressure in order to attach the front frame component to the rear frame component.

[0021] The front plate and the rear plate can together form an electroplating frame. The front plate and the rear plate can each form a frame surrounding a groove or hole.

[0022] The front frame component and the rear frame component are interconnected, which can be understood as the front frame component and the rear frame component merely contacting each other, being arranged adjacent to each other and in contact. The front frame component and the rear frame component are not fastened to each other.

[0023] The internal pressure can be understood as the pressure inside the cavity formed and surrounded by the front frame component and the rear frame component.

[0024] The ambient pressure can be understood as atmospheric pressure.

[0025] The vacuum unit can be understood as a pump, specifically a suction pump. The pressure difference between the internal pressure and the ambient pressure generates suction between the front frame component and the rear frame component. This suction can attach or fix the front frame component and the rear frame component to mechanically hold and electrically contact the substrate between them.

[0026] The new electroplated frame unit can be understood as a wet-contact vacuum frame, wherein the front frame component and the rear frame component are held together by suction. This suction can generate mechanical force on the substrate to secure the substrate between the front frame component and the rear frame component. In other words, the front frame component and the rear frame component can be understood as two partial frames or half-frames held together by reduced pressure or vacuum rather than conventionally used mechanical fastening devices (such as screws for holding and contacting the substrate).

[0027] The new electroplating frame unit exhibits excellent mechanical stability and applies particularly uniform and well-defined forces to the substrate, improving substrate adhesion. This results in highly reliable electrical contact, especially on at least one front and / or back side of the substrate, leading to very uniform electroplating. The new electroplating frame unit enables simple, rapid, and reliable automated loading and unloading of large substrates, while manual loading is preferably retained.

[0028] The new electroplating frame unit can eliminate or at least significantly reduce the side effects of electroplating on electrical contacts, which allows for stable electroplating of the substrate in subsequent processing steps. The new electroplating frame unit can significantly alleviate or reduce over-plating in the electrical contact areas of the substrate surface, which enables stable electroplating in subsequent processing steps on the same substrate. The new electroplating frame unit can significantly reduce the shielded contact area during the electroplating process, thus leaving more surface area for the fabrication of functional components.

[0029] The new electroplated frame unit can be rinsed and dried very easily, efficiently and effectively without increasing rinsing and drying time and / or leaving drying residues (such as water stains) on the substrate surface (especially in the corners, edges and gaps of the material).

[0030] In one embodiment, the vacuum unit includes an internal pressure reduction source disposed within the electroplating frame. The internal pressure reduction source can be a pump, preferably a vacuum pump. It can be disposed between the front frame component and the rear frame component. It can also be attached to the front plate and / or the rear plate.

[0031] In one embodiment, the vacuum unit includes a vacuum connection line configured to connect to an external pressure-reducing source located outside the electroplating frame. This can serve as an alternative to or supplement to an internal pressure-reducing source. In the latter case, the external pressure-reducing source can be designed to directly reduce pressure, while the internal pressure-reducing source can be designed to only adjust the pressure reduction, for example, based on changing conditions or pressure loss. The external pressure-reducing source can be located at the loading / unloading station of the substrate. The external pressure-reducing source can be a pump, preferably a vacuum pump.

[0032] In one embodiment, the electroplating frame unit further includes electrical contact members disposed on the front frame member and / or the rear frame member for electrical contact with the substrate. The electrical contact members may include electrical contacts pressed onto the substrate. In one embodiment, the electrical contact members extend from the front frame member to the front recess member. In one embodiment, the electrical contact members extend from the rear frame member to the rear recess member. In one embodiment, the electrical contact members are finger-shaped. This means that the electrical contact members have a longitudinal extension that is greater than the width of the electrical contact members perpendicular to the longitudinal extension. Furthermore, the longitudinal extension and / or the width is preferably greater than the material or wall thickness of the electrical contact members. The electrical contacts may be made of metal or alloy (such as copper alloy) and have a non-conductive coating (such as a coating made of plastic, especially a thermoplastic fluoropolymer (such as Halar)) to expose the conductive metal or alloy only at the location where the electrical contact members are in direct contact with the substrate. The shape of electrical contact components, with or without coating, can reduce the open electrical contact area to direct contact only with the substrate surface, thereby significantly reducing over-plating on the electrical contact components.

[0033] The above design ensures that only a very small amount of substrate is shielded or blocked in the electrolyte solution, leaving more surface area for the fabrication of functional components. Another advantage of extended or finger-shaped electrical contacts is their excellent rinsing and drying performance, as only a very small amount of substrate is shielded or blocked, preventing penetration by the rinsing fluid and drying airflow. When the substrate is pulled out of the rinsing tank, there is minimal resistance to the meniscus of the rinsing fluid and minimal resistance to the drying airflow, and the absence of hidden corners minimizes the risk of residue buildup.

[0034] In one embodiment, the electrical contact components are disposed on a front frame component and a rear frame component. The electrical contacts on the front frame component can be displaced relative to the electrical contacts on the rear frame component. In other words, the electrical contacts or fingers on the front frame component or half-frame are not aligned to the same position as the electrical contacts or fingers on the rear frame component or half-frame, but are displaced relative to each other by a certain distance. Specifically, the electrical contacts or fingers can be offset from left to right or from top to bottom. This displaced arrangement of the electrical contacts can result in more uniform electroplating.

[0035] The longitudinal extension or finger-like electrical contact of the front frame component may have a first direction; the finger-like electrical contact of the rear frame component may have a second direction. The directions may be the same, but preferably different. For example, the first and second directions intersect, such that when viewed from a top view, the finger-like electrical contacts of the front frame component and the finger-like electrical contacts of the rear frame component will intersect each other. The direction may be characterized by an angle with the edge of each frame component. The angle between the finger-like electrical contact and the adjacent edge of the corresponding frame component may be in the range of 10° to 80°, preferably in the range of 20° to 70°, and more preferably in the range of 30° to 70°.

[0036] The repositioning of electrical contact components allows for multiple subsequent processing of the same substrate without increasing the deposited metal layer in the contact area. This can be achieved by first inverting the substrate during installation and then rotating it 180 degrees twice for subsequent processing. In this way, the average over-plating of the contact area is balanced across the entire substrate edge. For example, if a set of two, three, or more plating frames are applied during subsequent processing, differing only in the position of the finger portions, no electrical contacts are made to touch twice. This can result in a final smooth deposition of metal at the substrate edge, allowing a large portion of the substrate to be used for functional components. This reduces consumable costs and saves on substrate, chemicals, electricity, and other required resources.

[0037] In one embodiment, the electrical contact component is spring-loaded. The electrical contact may be made of a metal (such as Au) or alloy and is covered with a membrane made of a plastic material (such as PTFE) to achieve the spring-loaded function. The spring-loaded electrical contact component can be understood as a single-pin spring-loaded lead, which may include a plunger, a cylinder, and a spring. When force is applied to the lead, the spring is compressed, and the plunger moves inside the cylinder. The shape of the cylinder holds the plunger in place, preventing the spring from pushing the plunger out when the lead is not locked. Preferably, a seal or membrane exists between the plunger and the cylinder to prevent any liquid or electrolyte from entering the cylinder and contacting the spring. Otherwise, the liquid or electrolyte may crystallize, hindering the movement of the spring and consequently the movement of the electrical contact component. In other words, the spring load prevents any liquid or electrolyte from leaking into areas where it should not enter. Excellent electrical contact is always ensured, and the electrical contact can be automatically tested before the electroplating frame with the substrate is immersed in the electroplating solution. The spring load force is configured and designed to ensure that each electrical contact applies the same constant force to the substrate, thereby ensuring a constant power density is transferred from the electrical contact to the substrate to ensure uniform electroplating.

[0038] In one embodiment, the electroplating frame unit further includes a sealing unit disposed at the front frame member and / or the rear frame member to seal the front frame member relative to the rear frame member. The sealing unit may be a sealing ring or include a sealing ring. The sealing unit may be disposed around the electrical contacts. It can prevent the electrical contacts from being electroplated due to the influence of the electrolyte.

[0039] Compared to traditional mechanical fastening devices (such as screws), the advantage of using reduced pressure or vacuum to secure the front and rear plates as two partial frames or half-frames is that very uniform and well-defined forces can be applied, thus reducing the magnitude of the force. This allows for the use of softer materials to construct the electroplating frame units, compared to existing technologies that use materials such as stainless steel. Many softer materials, such as aluminum or many copper alloys, have the advantage of higher electrical and thermal conductivity as fundamental material properties, thus allowing higher current densities (up to 400 amperes) to reach the substrate surface, resulting in a significant increase in the speed of the deposition process. This leads to a significant increase in substrate yield per deposition unit, thereby significantly reducing equipment ownership costs and improving profitability. High thermal conductivity is also an advantage for safety reasons, preventing overheating in the event of sudden, locally very high current densities. Many materials can be used to construct new electroplating frame units using this design, such as stainless steel, Ti-Pt, Au, Pt, CuSn6, Ag, CuBe, and so on.

[0040] As described above, compared to conventionally used mechanical fastening devices (such as screws), using reduced pressure or vacuum allows for a more uniform force on the substrate, thus reducing the magnitude of the force. The smaller force allows for the use of a thinner electroplating frame composed of the front and rear plates compared to existing technologies. In one example, the thickness of the electroplating frame at the connection point between the front and rear frame components is 15 mm or less, preferably 13 mm or less. In another example, the thickness of the electroplating frame at the connection point between the front and rear frame components is in the range of 5 to 15 mm, more preferably 5 to 10 mm. Compared to existing technologies, a thinner electroplating frame allows the substrate to be positioned significantly closer to the distribution body (e.g., for high-speed electroplating), which can further increase the electroplating speed.

[0041] As described above, compared to existing technologies, using reduced pressure or vacuum allows for the use of smaller forces, thus enabling the use of softer electroplated frames. In one embodiment, the front frame component and / or the rear frame component is made of a material with a yield strength of 500 MPa or less. The front frame component and / or the rear frame component may also be made of a material with a yield strength of 400 MPa or less. The yield strength can be in the range of 50 to 300 MPa, preferably 50 to 200 MPa, and more preferably 50 to 100 MPa. The front frame component and / or the rear frame component may be made of a material with a yield strength lower than that of conventionally used steel.

[0042] Compared to existing technologies, using reduced pressure or vacuum allows for the use of smaller forces, enabling the use of softer and / or thinner electroplating frames (front and rear plates together). The softer and / or thinner electroplating frames exhibit higher electrical and thermal conductivity compared to existing materials (e.g., steel), thus allowing for higher current densities to reach the substrate surface, thereby significantly increasing the speed of the deposition process. In one embodiment, the front frame component and / or the rear frame component are made of materials with a conductivity of 2*10⁻⁶ at 20°C. 6 Made of materials with a conductivity of S / m or higher, preferably with a conductivity of 3*10 at 20°C. 6 S / m or higher, more preferably a conductivity of 4*10 at 20°C. 6 S / m or higher. In one embodiment, the front frame component and / or the rear frame component is made of a material with a thermal conductivity of 65 W / mK or higher at 20°C, preferably 150 W / mK or higher at 20°C, and more preferably 250 W / mK or higher at 20°C. The front frame component and / or the rear frame component may be made of a material with an electrical conductivity and / or thermal conductivity greater than that of conventionally used steel.

[0043] In one embodiment, the front frame component and / or the rear frame component is coated with a polymeric or similar material. The coating may be made of plastic, particularly a thermoplastic fluoropolymer. The coating may be made of Halal, perfluoroalkoxyalkanes, or similar materials. The coating protects the front frame component and / or the rear frame component from chemical corrosion.

[0044] In one embodiment, the electroplating frame unit further includes a locking unit disposed on the front plate and / or the rear plate to lock the front frame component relative to the rear frame component. The locking unit can be understood as a second locking element in addition to the first locking element formed by the reduced pressure between the front and rear frame components described above. In other words, the locking unit can form an additional locking mechanism besides the reduced pressure or vacuum. It can be a backup in case the reduced pressure or vacuum fails. The first and second locking elements can together form a preferred automatic double-locking mechanism. The locking unit or second locking element can be based on a reduced pressure or vacuum container, (electro)magnetic force, mechanical clamping force, or other technology that can secure the substrate in place when the first locking element cannot secure the two frame components together by the reduced pressure between the front and rear frame components.

[0045] In one embodiment, the electroplating frame unit further includes a conveying device. The combination of the electroplating frame unit and the conveying device can also be understood as an electroplating frame system. The conveying device or Bernoulli device can be configured to hold the substrate without contact, meaning it can hold the substrate without touching it. "Without contact" can be understood as holding or supporting the substrate without touching or making contact with it. "Without contact" and "without touching or making contact" can be understood as substantially without contact and substantially without touching or making contact with the substrate. Specific or sensitive parts or functional structures or the maximum area of ​​the substrate are not touched. However, the substrate may be touched at edges, corners, or specific designated (excluded) areas or small areas. The conveying device can contact and hold the substrate in a passive manner (e.g., with feet) or an active manner (e.g., with clamps). This is to protect the surface of the substrate and the functional structures provided on the substrate surface. The conveying device can hold the substrate, specifically, it can fix the substrate to prevent it from sliding, such as laterally. The conveying device can also straighten a curved substrate, meaning it can make a curved substrate smoother or flatter. The conveying device is movable relative to the front plate and / or the rear plate to move the substrate relative to the electroplating frame formed by the front and rear plates. The conveying device may be configured to move, convey, or transport the substrate within the electroplating frame, specifically within a cavity formed by the front and rear plates of the electroplating frame. The conveying device can move in a lateral (horizontal) direction along the width of the electroplating frame and / or substrate perpendicular to its longitudinal extension. The conveying device can move in a first (X) lateral (horizontal) direction and a second (Y) lateral (horizontal) direction perpendicular to the longitudinal extension of the electroplating frame and / or substrate.

[0046] In one embodiment, the electroplating frame unit further includes a transfer arm configured to contact and hold the substrate, specifically, to contact and hold the substrate only at predetermined holding locations, such as so-called exclusion areas outside functional structures or other sensitive parts of the substrate surface. The combination of the electroplating frame unit and the transfer arm can also be understood as an electroplating frame system. The predetermined holding locations of the substrate can be located at the edges and / or corners of the substrate. The transfer arm or robotic arm can hold the substrate using, for example, a vacuum end actuator, a magnetic gripper, a mechanical clamp, or similar means. The transfer arm can move relative to the front plate and / or the rear plate to move the substrate relative to the electroplating frame (front and rear plates together). The transfer device can be used to move, transfer, or transport the substrate into and / or out of the electroplating frame, specifically into and / or out of the open cavity formed by the front and rear plates of the electroplating frame. The transfer arm can move in a linear (vertical) direction along the longitudinal extension of the electroplating frame and / or the substrate.

[0047] The combination of the conveying arm and the non-contact conveying device can be configured to bring the substrate into or near the electroplating frame via the conveying arm, which grips and holds the substrate at at least one suitable pre-defined holding location (exclusion area). The conveying arm can then be configured to transfer or hand over the substrate to the conveying device, which can hold the substrate non-contactly, even without contacting areas of functional structures or other sensitive parts of the substrate surface. The conveying arm and / or the conveying device can be configured to bring the substrate into the open electroplating frame formed by the front and rear plates. The conveying device can be configured to move and adjust the substrate within the electroplating frame. The conveying device can be configured to hold the substrate until the electroplating frame holds it by applied suction, after which the conveying device can be configured to release the substrate. The conveying device and the conveying arm can then be moved back to their resting positions.

[0048] In other words, the substrate can first be held and moved by using a transfer arm to hold it at a pre-set holding point. Then, the substrate can be gripped without contact on any, even functional or sensitive, part of its surface by a transfer device. Once the transfer device has gripped the substrate, the transfer arm can release the pre-set holding point. The transfer device can then move the substrate into the electroplating frame. The pre-set holding point of the substrate can now be freely gripped by the electroplating frame. The transfer device can release the substrate surface immediately after the electroplating frame has gripped it. Therefore, the substrate can be transported and moved without damaging the functional structures and other sensitive parts of the substrate surface.

[0049] In one embodiment, the electroplating frame unit further includes a control unit for controlling the movement of the conveying device and the conveying arm, as well as the fastening and / or releasing of the conveying device and the conveying arm onto the substrate. The control unit may be further configured to control the fastening and / or releasing of the electroplating frame onto the substrate.

[0050] According to this disclosure, an electroplating system for holding a substrate during chemical and / or electrolytic surface treatment of the substrate is also proposed. The electroplating system includes an electroplating frame unit and a substrate as described above. The substrate is fixed between a front frame component and a rear frame component of the electroplating frame unit.

[0051] According to this disclosure, a method for assembling an electroplating frame unit for holding a substrate during chemical and / or electrolytic surface treatment of the substrate is also provided. The method for assembling the electroplating frame unit includes, but is not limited to, the following steps:

[0052] - Provides a front panel with a front frame component surrounding a front recessed component.

[0053] - Provides a rear panel with a rear frame component.

[0054] - Insert a base between the front frame component and the rear frame component to secure the base (30) between the front frame component and the rear frame component, and

[0055] - Reduce the internal pressure between the front frame component and the rear frame component to below the ambient pressure to attach the front frame component to the rear frame component.

[0056] A novel method for assembling electroplated frame units allows for the assembly of electroplated frame units with improved mechanical stability, specifically, the electroplated frame units applying uniform and defined forces to the substrate. This provides highly reliable electrical contact on the substrate, particularly on at least one front and / or back side, enabling very uniform electroplating after assembly.

[0057] The new method of assembling electroplated frame units can eliminate or at least significantly reduce the side effects of electroplating on electrical contacts, thereby enabling the substrate to be electroplated stably in subsequent processing.

[0058] The electroplating frame unit assembled using the novel method described above can be rinsed and dried very easily, efficiently and effectively without increasing rinsing and drying time and / or leaving dry residues (such as water stains) on the substrate surface (especially in the corners, edges and gaps of the material).

[0059] In one embodiment, a method for assembling an electroplating frame unit includes providing an internal pressure relief source disposed within the electroplating frame unit. In another embodiment, the method for assembling the electroplating frame unit includes providing a vacuum connection line configured to connect to an external pressure relief source disposed outside the electroplating frame unit.

[0060] In one embodiment, a method for assembling an electroplated frame unit includes providing electrical contact members on a front frame member and / or a rear frame member for electrical contact with a substrate. The electrical contact members may include electrical contacts pressed onto the substrate. The electrical contact members may extend from the front frame member to the front recessed member. The electrical contact members may also extend from the rear frame member to the rear recessed member. In one embodiment, the electrical contact members are finger-shaped. The electrical contact members of the front frame member may be displaced relative to the electrical contact members of the rear frame member.

[0061] In one embodiment, a method for assembling an electroplated frame unit includes providing a sealing unit at the front frame component and / or the rear frame component to seal the front frame component relative to the rear frame component.

[0062] In one embodiment, a method for assembling an electroplated frame unit includes providing a locking unit on the front plate and / or the rear plate to lock the front frame component relative to the rear frame component.

[0063] In one embodiment, a method for assembling an electroplating frame unit includes holding and / or moving the substrate toward the electroplating frame unit by a transfer arm that contacts at least one predetermined holding portion of the substrate. In one embodiment, a method for assembling an electroplating frame unit includes non-contact holding and / or moving the substrate within the electroplating frame unit by contacting, for example, any, even functional or sensitive, portion of the substrate surface using a transfer device. In one embodiment, a method for assembling an electroplating frame unit includes immediately releasing the transfer arm and the predetermined holding portion once the transfer device has gripped the substrate. In one embodiment, a method for assembling an electroplating frame unit includes holding and / or contacting the substrate by the electroplating frame, preferably at a predetermined holding portion of the substrate. In one embodiment, a method for assembling an electroplating frame unit includes immediately releasing the transfer device when the electroplating frame has gripped the substrate.

[0064] It is understood that the apparatus and methods described in the independent claims have similar and / or identical preferred embodiments, particularly as defined in the dependent claims. It should be further understood that the preferred embodiments of this disclosure can also be any combination of the dependent claims and the corresponding independent claims.

[0065] These and other aspects of this disclosure will become apparent and will be elucidated from the embodiments described below. Attached Figure Description

[0066] Exemplary embodiments of this disclosure will now be described with reference to the accompanying drawings:

[0067] Figure 1 According to this disclosure, embodiments of an electroplating system for holding a substrate in a chemical and / or electrolytic surface treatment of the substrate are illustrated schematically and exemplary.

[0068] Figure 2 According to this disclosure, details of an embodiment of an electroplating frame unit for holding a substrate during chemical and / or electrolytic surface treatment of the substrate are illustrated schematically and exemplary.

[0069] Figure 3a According to this disclosure, a top view of an embodiment of an electroplating system for holding a substrate in a chemical and / or electrolytic surface treatment of the substrate is shown schematically and exemplary.

[0070] Figure 3b It shows Figure 3a The side view of the electroplating system shown.

[0071] Figure 4 According to this disclosure, a cross-sectional view of an electroplating frame unit for holding a substrate in a chemical and / or electrolytic surface treatment of the substrate is shown schematically and exemplary.

[0072] Figure 5 According to this disclosure, another cross-sectional view of an electroplating frame unit for holding a substrate in a chemical and / or electrolytic surface treatment of the substrate is shown schematically and exemplary.

[0073] Figure 6 According to this disclosure, embodiments of an electroplating system for holding a substrate in a chemical and / or electrolytic surface treatment of the substrate are illustrated schematically and exemplary.

[0074] Figure 7 An embodiment of a transfer device or Bernoulli device for contactless holding of a substrate is illustrated schematically and exemplary. Detailed Implementation

[0075] Figure 1 According to this disclosure, embodiments of an electroplating system for holding the substrate 30 in a chemical and / or electrolytic surface treatment of the substrate 30 are illustrated schematically and exemplary. Figure 1 An exploded view of the electroplating system is shown. The electroplating system includes a substrate 30 and an electroplating frame unit 10 as described in this disclosure for holding the substrate 30 during chemical and / or electrolytic surface treatments.

[0076] The electroplating frame unit 10 includes a front plate 11, a rear plate 14, and a vacuum unit 17.

[0077] The front panel 11 includes a front frame component 12 surrounding the front recess component 13.

[0078] The rear plate 14 includes a rear frame member 15 surrounding the rear recess member 16.

[0079] The front frame component 12 and the rear frame component 15 are interconnected to hold the base 30 between the front frame component 12 and the rear frame component 15. The front frame component 12 and the rear frame component 15 are not fixed to each other during assembly; they are merely in contact with each other.

[0080] The vacuum unit 17 is configured to reduce the internal pressure between the front frame member 12 and the rear frame member 15 to below ambient pressure in order to attach the front frame member 12 to the rear frame member 15. In this embodiment, the vacuum unit 17 is at least a suction pump. The internal pressure is the pressure inside the cavity or chamber formed and surrounded by the front frame member 12 and the rear frame member 15. The ambient pressure in this embodiment is atmospheric pressure.

[0081] In this embodiment, the vacuum unit 17 includes an internal pressure reduction source disposed within the electroplating frame unit 10 and at the rear plate 14. The vacuum unit 17 also includes a vacuum connection line 18, which is connected to an external pressure reduction source (not shown) disposed outside the electroplating frame unit 10.

[0082] The substrate 30 is held between the front frame member 12 and the rear frame member 15 of the electroplating frame unit 10. The pressure difference between the internal pressure and the ambient pressure can generate a suction force between the front frame member 12 and the rear frame member 15. This suction force, in turn, can attach the front frame member 12 relative to the rear frame member 15 to mechanically hold and electrically contact the substrate 30 between the front frame member 12 and the rear frame member 15.

[0083] The electroplating frame unit 10 includes a sealing unit 20. In this embodiment, the sealing unit 20 is disposed on the rear frame component 15 to seal the front frame component 12 and the rear frame component 15 relative to each other, thereby preventing the electrical contacts from being electroplated due to the influence of the electrolyte. In this embodiment, the sealing unit 20 includes two sealing rings.

[0084] Figure 2 According to this disclosure, details of an embodiment of an electroplating frame unit 10 for holding the substrate 30 during chemical and / or electrolytic surface treatment of the substrate 30 are illustrated schematically and exemplary. Figure 1 and Figure 2 As shown, the electroplating frame unit 10 includes a plurality of electrical contact members 19 disposed at the front frame member 12 and the rear frame member 15 for electrical contact with the substrate 30. The electrical contact members 19 extend from the front frame member 12 to the front recess member 13 or the rear recess member 16. The electrical contact members 19 are finger-shaped, meaning that each electrical contact member 19 has a longitudinal extension greater than the width of the electrical contact member 19 perpendicular to its longitudinal extension. The longitudinal extensions of the electrical contact members 19 mounted to the front frame member 12 extend in the opposite direction to the longitudinal extensions of the electrical contact members 19 mounted to the rear frame member 15. Figure 2 As can be seen in the top view shown, the electrical contact 19 mounted to the front frame component 12 intersects with the electrical contact 19 mounted to the rear frame component 15. Furthermore, the electrical contact 19 at the front frame component 12 and the electrical contact 19 mounted at the rear frame component 15 originate at different positions and are displaced or offset relative to each other.

[0085] Figure 3a According to this disclosure, a top view of an embodiment of an electroplating system for holding the substrate 30 in a chemical and / or electrolytic surface treatment of the substrate 30 is shown schematically and exemplary. Figure 3b It shows Figure 3a A side view of the electroplating system shown. (See attached image.) Figure 1 As shown, the electroplating system includes a substrate 30 and an electroplating frame unit 10. The electroplating frame unit 10 includes a front plate 11, a rear plate 14, and a vacuum unit. The front plate 11 includes a front frame member 12 surrounding a front recessed member 13. The rear plate 14 includes a rear frame member 15 surrounding a rear recessed member 16. In this embodiment, the vacuum unit includes a vacuum connection line 18, which is connected to an external pressure reduction source (not shown) located outside the electroplating frame unit 10.

[0086] The front frame component 12 and the rear frame component 15 are in contact with each other when assembled. The pressure difference between the internal pressure and the ambient pressure generates a suction force between the front frame component 12 and the rear frame component 15. This suction force, in turn, can fix the front frame component 12 relative to the rear frame component 15 to mechanically hold and electrically contact the substrate 30 between the front frame component 12 and the rear frame component 15.

[0087] Figure 4 and Figure 5According to this disclosure, a cross-sectional view of an embodiment of an electroplating frame unit 10 for holding a substrate during chemical and / or electrolytic surface treatment of the substrate is shown schematically and exemplary. The electrical contact member 19 is spring-loaded.

[0088] Figure 6 According to this disclosure, an overall three-dimensional view of an embodiment of an electroplating system for holding a substrate 30 during chemical and / or electrolytic surface treatment of the substrate 30 is schematically and exemplaryly shown. The electroplating system includes a transfer device 25 or a Bernoulli device for non-contact holding the substrate 30 without contact, thereby protecting the surface of the substrate 30 and its functional structures. The transfer device 25 can transfer the substrate 30 within an electroplating frame, which can be understood as a chamber formed by a front plate 11 and a rear plate 14 of an electroplating frame unit 10. The transfer device 25 can move at least in the lateral (horizontal) direction along a longitudinal extension perpendicular to the electroplating frame unit 10 and / or the width of the electroplating frame unit 10 and / or the substrate 30.

[0089] The electroplating system further includes a transfer arm 24 for contacting and holding the substrate 30 through a predetermined holding portion of the substrate 30, the predetermined holding portion of the substrate 30 being located outside functional structures or other sensitive parts on the substrate surface. The transfer arm or robotic arm may hold the substrate 30 by, for example, a vacuum end actuator or similar means. The transfer arm 24 is movable relative to the front plate 11 and / or the rear plate 14 to move the substrate 30 relative to the front plate 11 and / or the rear plate 14. The transfer device 25 may move the substrate 30 into and / or out of the electroplating frame, which can be understood as a chamber formed by the front plate 11 and the rear plate 14 of the electroplating frame unit 10. The transfer arm 24 may move linearly (vertically) along the longitudinal extension of the electroplating frame unit 10 and / or the substrate 30.

[0090] The combination of the conveying arm 24 and the non-contact conveying device 25 allows the substrate 30 to be brought near the electroplating frame via the conveying arm 24, which grips and holds the substrate 30 at a suitable preset holding position. The conveying arm 24 can then transfer the substrate 30 to the conveying device 25, which can even non-contactly hold the substrate 30 in areas of functional structures or other sensitive parts of the substrate surface. The conveying device 25 can be inserted into and adjust the substrate 30 within an open electroplating frame. The conveying device 25 can hold the substrate 30 until the electroplating frame is closed to hold the substrate 30 by applied suction, after which the conveying device 25 can be released and moved back to its initial or stationary position.

[0091] Figure 7An embodiment of a conveying device 25 or a Bernoulli device for contactless holding of a substrate is illustrated schematically and exemplary. The substrate 30 is held by a lifting force L or suction force provided by air pressure A or airflow passing through the conveying device 25.

[0092] It should be noted that the embodiments of this disclosure are described with reference to different subject matters. Specifically, some embodiments are described with reference to method-type claims, while others are described with reference to apparatus-type claims. However, those skilled in the art will recognize from the foregoing and following description that, unless otherwise stated, any combination of features relating to different subject matters is to be considered, in addition to any combination of features belonging to one subject matter, as disclosed with this application. However, all features can be combined to provide more synergistic effects than a simple superposition of features.

[0093] While this disclosure has been detailed and described in the accompanying drawings and foregoing description, such description should be considered illustrative or exemplary, not restrictive. This disclosure is not limited to the disclosed embodiments. Other variations of the disclosed embodiments can be understood and implemented by those skilled in the art through a study of the drawings, the disclosure, and the dependent claims.

[0094] In the claims, the word "comprising" does not exclude other elements or steps, and the indefinite terms "an" or "a" do not exclude multiple. A processor or other unit can perform the functions of several items re-referenced in the claims. The mere fact that certain measures are re-referenced in mutually different dependent claims does not indicate that a combination of these measures cannot be used to exert an advantage. Any references in the claims should not be construed as limiting the scope of protection.

Claims

1. An electroplating frame unit (10) for retaining a substrate (30) during chemical and / or electrolytic surface treatment of a substrate (30), comprising: -Front plate (11), -Back panel (14). -Vacuum unit (17), and - Electrical contact components (19). The front panel (11) includes a front frame member (12) surrounding the front recess member (13). The rear panel (14) includes a rear frame component (15). The front frame component (12) and the rear frame component (15) are interconnected to secure the base (30) between the front frame component (12) and the rear frame component (15), and The vacuum unit (17) is configured to reduce the internal pressure between the front frame member (12) and the rear frame member (15) to below the ambient pressure in order to attach the front frame member (12) to the rear frame member (15). The electrical contact component (19) is disposed on the front frame component (12) and the rear frame component (15) to make electrical contact with the substrate (30).

2. The electroplating frame unit (10) according to claim 1, wherein the vacuum unit (17) includes an internal pressure reduction source or a vacuum connection line (18) disposed within the electroplating frame unit (10), the vacuum connection line (18) being configured to connect to an external pressure reduction source disposed outside the electroplating frame unit (10).

3. The electroplated frame unit (10) according to any of the preceding claims, wherein the rear frame member (15) surrounds the rear recess member (16).

4. The electroplated frame unit (10) according to claim 3, wherein the electrical contact member (19) extends from the front frame member (12) to the front recess member (13) and / or from the rear frame member (15) to the rear recess member (16).

5. The electroplating frame unit (10) according to claim 1 or 4, wherein the electrical contact component (19) is finger-shaped.

6. The electroplating frame unit (10) according to claim 5, wherein the finger-shaped electrical contact member (19) of the front frame member (12) has a first direction and the finger-shaped electrical contact member (19) of the rear frame member (15) has a second direction; wherein the first direction and the second direction intersect such that, when viewed from a top view, the finger-shaped electrical contact member (19) of the front frame member (12) and the finger-shaped electrical contact member (19) of the rear frame member (15) intersect each other, the top view being a top view of the front plate (11) or the rear plate (14), parallel to the longitudinal axis of the front plate (11) and the rear plate (14).

7. The electroplating frame unit (10) according to claim 1, wherein the electrical contact member (19) located at the front frame member (12) is displaced relative to the electrical contact member (19) located at the rear frame member (15).

8. The electroplating frame unit (10) according to claim 1, wherein the electrical contact component (19) is spring-loaded.

9. The electroplating frame unit (10) according to claim 1 further includes a sealing unit (20) disposed at the front frame member (12) and / or the rear frame member (15) to seal the front frame member (12) relative to the rear frame member (15).

10. The electroplated frame unit (10) according to claim 1, wherein the total thickness of the front frame component (12) and the rear frame component (15) is 15 mm or less.

11. The electroplated frame unit (10) according to claim 1, wherein the front frame component (12) and / or the rear frame component (15) are made of a material having a yield strength of 500 MPa or less, 2 10 6 Made of materials with electrical conductivity of S / m and greater, and / or thermal conductivity of 65 W / mK and greater.

12. The electroplating frame unit (10) according to claim 1 further includes a locking unit disposed at the front plate (11) and / or the rear plate (14) to lock the front frame member (12) relative to the rear frame member (15).

13. The electroplating frame unit (10) according to claim 1 further includes a conveying device (25) for non-contact holding of the substrate (30), the conveying device (25) being movable relative to the front plate (11) and / or the rear plate (14) to move the substrate (30) relative to the electroplating frame unit (10).

14. The electroplating frame unit (10) according to claim 1 further includes a transfer arm (24) for touching and holding a predetermined holding portion of the substrate (30), the transfer arm (24) being movable relative to the front plate (11) and / or the rear plate (14) to move the substrate (30) relative to the electroplating frame unit (10).

15. A method of assembling the electroplated frame unit (10) of claim 1 for holding the substrate (30) during chemical and / or electrolytic surface treatment of the substrate (30), comprising: - Provide a front panel (11) with a front frame component (12) having a surrounding front recess component (13). - Provide a rear plate (14) with a rear frame component (15). - A base (30) is inserted between the front frame component (12) and the rear frame component (15) to secure the base (30) between the front frame component (12) and the rear frame component (15), and - Reduce the internal pressure between the front frame component (12) and the rear frame component (15) to below the ambient pressure to attach the front frame component (12) to the rear frame component (15). The electrical contact component (19) of the electroplated frame unit (10) is disposed on the front frame component (12) and the rear frame component (15) to make electrical contact with the substrate (30).

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