Contact module for contacting a photovoltaic chip

Abstract

The invention relates to a contact module comprising an optical module (1) and an electronic module (2), the optical module (1) containing an optical block (1.1) made of glass, wherein the optical block (1.1) is connected to the electronic module (2) by means of an adhesive joint or the optical module (1) has a mounting plate (1.2) which is detachably attached to the electronic module (2) and connected to the optical block (1.1) by means of an adhesive joint. The adhesive joint is established by means of at least three cylindrical pins (5) which are each attached with a first end face (5.1) to the optical block (1.1) by means of an adhesive (9) and bonded in a through-hole (7) in a carrier plate (2.1) or in the mounting plate (1.2).

Description

Technical Field

[0001] This invention relates to a contact module for testing optoelectronic chips, such as patent document WO 2019 / 029765 A1.

[0002] This invention belongs to the field of chip testing and evaluation at the wafer level, wherein the chip contains photonic integrated circuits, also known as PIC (Photonic Integrated Circuit). Unlike traditional chips containing purely electrical integrated circuits, also known as IC (Integrated Circuit), PIC integrates optical functions in addition to circuitry. Background Technology

[0003] In IC manufacturing, for example using CMOS technology, testing and measurement are performed at each manufacturing step for both process monitoring and quality control. The established test is the electrical wafer-level test (Wafer Level Test) after wafer fabrication. Here, functional and non-functional chips (Known Good Dies - KGD) are measured and recorded in the wafer diagram to determine yield. When the wafer is separated into individual chips, the non-functional chips are selected. The test equipment required for wafer-level testing takes the form of a wafer detector and a wafer tester, with associated contact modules (probe cards). The contact modules connect the device-side interface (input / output terminals) of the wafer tester to the individual chip interfaces (input / output terminals) of the wafer fixed on the wafer tester. Contact modules are generally designed to contact only one chip, but can also be designed to contact multiple chips simultaneously. It is not necessary for the chip to be contacted to still be in the wafer assembly structure. To contact multiple chips of the wafer simultaneously or sequentially, the chips only need to have defined positions that are relatively fixed to each other. Both prior art contact modules and the contact modules according to the present invention provide this flexibility.

[0004] For decades, test equipment for testing purely electronic chips (semiconductor chips with ICs) has been optimized and diversified to identify a large number of diverse ICs at high throughput, thereby optimizing costs.

[0005] PICs are typically manufactured using the same established semiconductor processes, such as CMOS technology. Previously, PIC production volumes were much lower than IC production volumes. This led to a situation where only process characteristic testing was performed at the semiconductor factory, not PIC functional testing. Determining functional characteristics is the responsibility of the end customer and is usually performed on the chip after it has been cut. The testing equipment used employs independent electrical contact modules and optical contact modules.

[0006] Wafer-level testing of a chip requires optical coupling and decoupling at the chip level, typically using an integrated grating coupler as the coupling point. The grating coupler can be a functional component within the chip or a sacrificial structure on the wafer (e.g., in a scratch or on an adjacent chip).

[0007] The aforementioned patent document US 2006 / 0109015 A1 discloses a photoelectric contact module (probe module) for testing a chip (DUT) with photoelectric input / output terminals, comprising a contact plate (probe substrate) and a redistribution plate (redistribution substrate). The contact module provides an interface between the test equipment (ATE) and the DUT, implemented using electrical contacts (electric probes), optical contacts (optical probes), optical elements, and combinations thereof, to route signals to / from the DUT and redistribute these signals for the test equipment interface.

[0008] The modular design of the contact module is achieved by dividing it into a contact plate and a redistribution plate. Its advantage is that the contact plate can be replaced if the electrical contacts are damaged, while the redistribution plate, which is more expensive than the photoelectric distribution network, can continue to be used.

[0009] Regarding optical input / output terminals (optical interfaces), it is disclosed that they are created using optical elements located on the contact plate and / or redistribution plate, suitable for various coupling mechanisms such as free radiation, quasi-free radiation, or waveguides. Diffraction and refractive elements are specified as suitable optical elements for this purpose. It is also noted that photodetectors or light sources can be directly positioned at the interface with the DUT, thus representing the optical input or output terminal on the contact plate.

[0010] According to the embodiment in the aforementioned patent document US 2006 / 0109015 A1, optical signal lines and electrical signal lines (optical distribution network and electrical distribution network) are implemented on a separate redistribution board. It is proposed that the electrical signal from the DUT is routed to an edge region of the contact plate, such that the electrical signal is coupled above this edge region to a first redistribution board disposed above the contact plate. This allows an opening to be formed in the first redistribution board, which only redistributes electrical signals, through which the optical signal is guided to a separate second redistribution board disposed above it.

[0011] In summary, the aforementioned patent document US 2006 / 0109015 A1 illustrates several concepts, such as a contact module, which is divided into a contact plate and a redistribution plate, for example, due to wear of the mechanical contacts used for electrical signal transmission, and may also be equipped with optical signal lines. However, this overlooks the fact that the possible tolerances of the electrical input / output terminals of the contact module and the mechanical contacts of the DUT cannot be transferred to the optical input / output terminals.

[0012] Although transmitting the same electrical signal over the electrical interface requires mechanical contact between the pins on the contact module and the contact plate (contact pad) on the DUT, which is guaranteed within a relatively large positional tolerance of a few micrometers in all three spatial directions, the quality of optical signal transmission is already affected by a much smaller deviation (in the submicrometer range) between the optical interface and its target position.

[0013] Patent document WO 2019 / 029765 A1 discloses a contact module that is insensitive to optical interface position tolerances. As with the contact module according to the invention and another contact module in the prior art, the contact module described herein is arranged between a wafer platform (e.g., a wafer detector on which a wafer with a chip under test is mounted) and test equipment (for generating and evaluating optical and electrical signals). The contact module establishes signaling connections between the various optical and electrical interfaces of the chip under test and the optical and electrical interfaces of the test equipment specified by the instrument. These interfaces are electrical or optical input / output terminals from which electrical or optical signals are coupled or decoupled and routed to / from the chip under test via electrical or optical signal lines.

[0014] The electrical interfaces of the contact module (all formed by the tips of the probes) and the electrical interfaces of the optoelectronic chip under test (all formed by electrical contact plates) make mechanical contact to transmit electrical signals. As described in the prior art, reliable electrical contacts require larger tolerance limits compared to optical contacts.

[0015] Referring also to the aforementioned patent document WO 2019 / 029765 A1, the contact module includes an electronic module with an electrical interface and an optical module with an optical interface. The optical module is attached to the electronic module in a defined manner via a mechanical interface, thereby positioning the electrical interface and the optical interface in defined relative positions.

[0016] Compared to monolithic contact modules, the advantage lies particularly in the fact that electrical and optical signal lines can be manufactured independently using different manufacturing methods, and can be fabricated on substrates made of different materials. To allow all interfaces (whether optical or electrical) to form a common arrangement that can be calibrated relative to the optoelectronic chip under test, the optical and electrical blocks are fixedly arranged in a calibrable manner.

[0017] In an advantageous embodiment of the contact module, the optical block is advantageously designed in terms of its size and geometry (including through holes or openings) such that all the pins present on the electronic module can make contact with the chip 2 by passing over the optical block, around the optical block, and / or, if necessary, through the openings formed therein. This allows the entire optical interface to be integrated into a single monolithic optical block.

[0018] In the embodiment of the contact module described in the aforementioned patent document WO 2019 / 029765 A1, the electronic module corresponds in its technical design to a conventional contact module for purely electronic chips. It includes a printed circuit board, a set of pins (here designed as cantilever pins, for example), and a carrier plate on which a mechanical interface for testing equipment is located. Electrical contact is achieved via the electronic module through physical contact between the pins and the chip's electrical contact pads.

[0019] The optical module consists of an optical block with optical signal lines (each signal line is in the form of a waveguide, and each waveguide has an integrated reflector in front of it), an optical fiber frame with V-grooves, and glass fibers and single-fiber or multi-fiber connectors. The waveguides are fabricated using laser direct writing, and the reflectors are fabricated using laser-assisted etching. As a result, the waveguides are formed from locally confined modified substrates due to laser energy input, characterized particularly by localized changes in refractive index relative to the substrate. The reflectors are formed by the interface of etched grooves in the substrate. The optical block substrate is glass, preferably boron float glass, with a thickness ranging from several hundred micrometers to several millimeters, preferably 0.5 mm to 1 mm. Optical contact occurs without direct contact with the chip, through the gap between the chip and the contact module. Using the fabrication methods of the reflectors and waveguides, high-precision optical interfaces that are both relative to each other and to the mechanical interface can be fabricated on the optical block. Furthermore, the reflectors and waveguides can be freely positioned within the substrate.

[0020] Preferably, the optical module is connected to the electronic module by, for example, attachment to a carrier plate present in the electronic module via three fixing points. In the manufacture of the electronic module, for example, cantilever pins are used as styluses, the Z-height of which is typically referenced to the clamping point of the contact module, fixing it to the wafer platform. When a metal frame is used as the carrier plate, such reference points are located on the metal frame, and the fixing points of the optical module are precisely integrated into the metal frame. Thus, the optical module can be assembled precisely in a planar parallel manner relative to the reference layer at the stylus tip by being bonded to the fixing points in the Z-direction. Due to the short working distance, the planar parallel assembly of the optical module and the electronic module also prevents the optical module from colliding with the chip during contact in operation. Alternatively, the optical module can be directly attached to a printed circuit board as an alternative to attachment to the carrier plate.

[0021] The aforementioned patent document WO 2019 / 029765 A1 only discloses that the mechanical interface between the optical block and the electronic module is indirectly connected to each other by an adhesive, but does not provide more precise information. Therefore, it is suggested that an adhesive be introduced between the planar mechanical interfaces. Summary of the Invention

[0022] The purpose of this invention is to propose a contact module in which the mechanical interface between the optical block and the electronic module or between the optical block and the mounting plate connected to the electronic module adopts a novel and cost-effective design, so that the optical block can be freely positioned relative to the electronic module in all six degrees of freedom to the calibration position, and then precisely and permanently fixed in this calibration position.

[0023] Another objective of this invention is to provide an assembly method for assembling all six adjustable light blocks into an electronic module or a mounting plate connected to the electronic module, so that the light blocks can be easily and precisely fixed to the alignment position.

[0024] To achieve the aforementioned purpose of the contact module, the present invention provides a contact module comprising: an optical module including a light block made of glass, the light block having an optical interface arrangement on an optical interface layer; and an electronic module including a carrier plate, a printed circuit board, and a pin holder, wherein the tips of the pin arrangement form an electrical interface arrangement on an electrical interface layer, wherein the optical module and the electronic module are arranged opposite to each other such that the optical interface arrangement and the electrical interface arrangement form mutually defined calibration positions with respect to all six degrees of freedom of the Cartesian coordinate system.

[0025] The key point of this invention is that, according to a first alternative, the optical block is permanently connected to a carrier plate by at least three cylindrical pins; or, according to a second alternative, the optical module has a mounting plate, and the optical block is permanently connected to the mounting plate by at least three cylindrical pins. Each cylindrical pin is attached to the optical block with its first end face using adhesive. The carrier plate or mounting plate has through holes arranged parallel to each other, and each cylindrical pin is connected to the carrier plate or mounting plate within the through holes using adhesive.

[0026] For advantageous embodiments, see dependent claims 2 to 6.

[0027] To achieve the above-mentioned objective, the present invention provides a contact module assembly method, the contact module comprising: an optical module including a light block made of glass, the light block having an optical interface arrangement on an optical interface layer; and an electronic module including a carrier plate, a printed circuit board, and a pin holder, wherein the tips of the pin arrangement form an electrical interface arrangement on an electrical interface layer, wherein the optical module and the electronic module are arranged opposite to each other, such that the optical interface arrangement and the electrical interface arrangement mutually define calibration positions.

[0028] According to the first alternative, the optical interface arrangement is first aligned with the electrical interface arrangement, and then the optical block is permanently connected to the carrier plate by the adhesive part according to the invention.

[0029] According to the second alternative, the mounting plate included in the optical module is first connected to the carrier plate in a reusable relative position via a detachable connector. Then, the optical interface arrangement is aligned with the electrical interface arrangement, and the optical block is permanently connected to the mounting plate via an adhesive part according to the invention.

[0030] The key point of this invention is to establish the adhesive portion in the two alternative solutions described above. This is achieved by introducing at least three parallel through holes into a carrier plate or mounting plate, and guiding at least three cylindrical pins through one of the through holes until they all stop at the light block. The first end face of the cylindrical pins facing the light block is pre-coated with adhesive so that they adhere to the light block. The cylindrical pins are adhered to the carrier plate or mounting plate during or after being guided through the through holes. Attached Figure Description

[0031] The present invention will now be described in detail with reference to the embodiments and accompanying drawings. In the figures:

[0032] Figure 1a and Figure 1b A top view and a cross-sectional view of the contact module according to the first alternative are shown, wherein the optical block of the optical module is connected to the carrier plate of the electronic module by an adhesive portion;

[0033] Figure 2a and Figure 2b A top view and a cross-sectional view of the contact module according to the second alternative are shown, wherein the light block is connected to the mounting plate of the optical module by an adhesive portion;

[0034] Figure 3a A first embodiment of the adhesive portion according to the present invention is shown;

[0035] Figure 3b A second embodiment of the adhesive portion according to the present invention is shown;

[0036] Figure 4a and Figure 4b A first embodiment of the contact module and detachable connection according to the second alternative is shown. Detailed Implementation

[0037] like Figure 1a and Figure 1b As shown, the contact module according to the present invention has an optical module 1 and an electronic module 2. The optical module 1 includes a light block 1.1 made of glass, which is located in the optical interface layer E. opt It has optical interface arrangement S opt Electronic module 2 includes a carrier board 2.1, a printed circuit board 2.2, and a pin holder 2.3, wherein the pin tips of the contact pin arrangement 2.3.1 are located on the electrical interface layer E. ele The upper electrical interface arrangement S ele The carrier plate 2.1 and the pin holder 2.3 are fixedly connected to each other or represent an integral unit. The optical module 1 and the electronic module 2 are arranged opposite each other such that the optical interface is arranged as S. opt Electrical interface layout S eleThe calibration positions are mutually defined for all six degrees of freedom of the Cartesian coordinate system. The optical block 1.1 is fixed to the calibration positions by an adhesive component. According to a first alternative to the contact module of the present invention, see... Figure 1a and Figure 1b The calibration position can be directly fixed between the optical block 1.1 and the electronic module 2. For this purpose, the carrier plate 2.1 forms a mechanical foundation through the adhesive part according to the invention; or according to the second alternative, see Figure 2a and Figure 2b The carrier plate 2.1 can be indirectly fixed between the light block 1.1 and the mounting plate 1.2 included in the optical module 1 as appropriate by means of the adhesive part according to the invention. It is connected to the electronic module 2, or more precisely to the carrier plate 2.1, by means of a repeatable and detachable connection.

[0038] The key point of this invention is that an adhesive joint is indirectly established between the light block 1.1 and the mounting plate 1.2, or between the light block 1.1 and the support plate 2.1, using at least three cylindrical pins 5. For example... Figure 3a and Figure 3b As can be seen more clearly, the cylindrical pins 5 are all attached to the light block 1.1 with the first end face 5.1 by the adhesive 9. There are through holes 7 in the support plate 2.1 or the mounting plate 1.2, and the cylindrical pins 5 are fixed to the support plate 2.1 or the mounting plate 1.2 in the through holes 7 by the adhesive 9.

[0039] In one embodiment, the cylindrical pin 5 and the through hole 7 are sized to match each other, such that each second end face 5.2 protrudes from the through hole 7, thereby holding the cylindrical pin 5 during assembly until they both abut against the light block 1.1. See here for further details. Figure 3a Apply adhesive 9 to the protruding outer peripheral surface of the cylindrical pin 5.

[0040] In another implementation scheme, such as Figure 3b As shown, the second end face 5.2 of the cylindrical pin 5 is arranged inward in one of the through holes 7, and the free volume flowing out of the through hole 7 is filled with adhesive 9.

[0041] In the case where the optical block 1.1 is bonded to the mounting plate 1.2 according to the present invention, advantageously, the mounting plate 1.2 and the carrier plate 2.1 are connected by a removable connection, which ensures repeated establishment of the optical interface arrangement S. opt Electrical interface layout S ele The calibration bit.

[0042] Figure 4a and Figure 4bA first embodiment of the detachable connection is shown, but the adhesive portion according to the invention is omitted here. Three protrusions 1.2.1.1 defining the mounting layer are provided on the front side 1.2.1 of the mounting plate, abutting against the mounting surface 2.1.1 of the support plate 2.1, thereby fixing the relative position of the mounting plate 1.2 relative to the support plate 2.1 in the z, x, and y directions of the Cartesian coordinate system. Three locating pins 2.1.2 parallel to the mounting layer are provided on the outer periphery 1.2.2 of the mounting plate. Two of the locating pins 2.1.2 are perpendicular to each other and abut against the stop pins 1.2.2.1 located on the support plate 2.1, respectively. This fixes the relative position of the mounting plate 1.2 relative to the support plate 2.1 in the x and y directions. The third locating pin 2.1.2 abuts against another stop pin 1.2.2.1 on the support plate 2.1, thereby fixing the relative position of the mounting plate 1.2 relative to the support plate 2.1 in the z direction. Even when the mounting plate 1.2 is repeatedly mounted to the support plate 2.1, the mounting plate 1.2 will maintain the same relative position to the support plate 2.1. To allow the stop pin 1.2.2.1 to abut against the locating pin 2.1.2, for example, the pressure unit 8 can be temporarily placed on the support plate 2.1. To fix the relative position, the mounting plate 1.2 is connected to the support plate 2.1 via at least one screw connection 2.1.3.

[0043] Figure 2a and Figure 2b A second embodiment of the detachable connector is shown.

[0044] Here, similar to the first embodiment, the relative positions of the mounting plate 1.2 with respect to the carrier plate 2.1 in the x, y, and z directions are also determined by three-point support. Unlike the first embodiment, the mounting plate 1.2 has two curved structures 4 penetrating the mounting plate 1.2, which are formed, for example, by electro-etching. On the carrier plate 2.1, two clamping pins 3 are perpendicular to the mounting surface 2.1.1 and fixedly connected to the carrier plate 2.1. They can be directly or indirectly connected to the carrier plate, for example, on the needle holder 2.3, which is advantageously made of ceramic. To establish a detachable connection between the mounting plate 1.2 and the carrier plate 2.1, the two clamping pins 3 are respectively clamped in one of the curved structures 4. In this case, the first clamping pin of the two clamping pins 3 is circumferentially clamped within the first curved structure of the two curved structures 4 via its side surface, thus fixing the relative position of the mounting plate 1.2 with respect to the carrier plate 2.1 in the x and y directions. Advantageously, the first curved structure of the two curved structures 4 is in the form of a clamp. The second clamping pin of the two clamping pins 3 is tangentially clamped in the second bending structure of the two bending structures 4 via its side surface, thereby fixing the relative position of the mounting plate 1.2 with respect to the bearing plate 2.1 in the z-direction. In order to clamp the bending structures 4 onto the respective clamping pins 3, the dimensions of the bending structures 4 can be set such that their openings in the stress-free state are smaller than the cross-section of the clamping pins 3, thereby tensioning and clamping the clamping pins 3 before or during insertion.

[0045] Advantageously, the dimensions of the bending structures 4 are set such that their respective openings are larger than the cross-section of the clamping pin 3, and the bending structures 4 are only tensioned to clamp the clamping pin 3 after it has been inserted. As shown, this can be advantageously accomplished by threaded pins 6. To ensure a fixed relative position, the mounting plate 1.2 is advantageously connected to the carrier plate 2.1 by at least one threaded connection 2.1.3.

[0046] The method for assembling the contact module according to the present invention is described in detail below. Similar to the prior art, the optical module 1 and the electronic module 2 are arranged opposite each other at the end of calibration and assembly, such that the optical interface arrangement S... opt Electrical interface layout S ele The calibration positions are mutually constrained across all six degrees of freedom.

[0047] A contact module consisting of an optical module 1 and an electronic module 2 is assembled using the method according to the present invention. The optical module 1 includes a light block 1.1 made of glass, which is located in the optical interface layer E. opt It has optical interface arrangement S opt Electronic module 2 includes a carrier board 2.1, a printed circuit board 2.2, and a needle holder 2.3. The needle holder 2.3 contains contact pins arranged in 2.3.1 with their tips on the electrical interface layer E. opt The upper electrical interface arrangement S eleOptical module 1 and electronic module 2 are arranged opposite each other such that the optical interface is arranged in S... opt Electrical interface layout S ele Mutually defined calibration bits.

[0048] The above method can be applied to both a first alternative for assembling the contact module, in which the optical module 1 is fixedly connected to the electronic module 2 by adhesive bonding, and a second alternative for assembling the contact module, in which the optical module 1 is detachably connected to the electronic module 2. In the second alternative, the optical module 1 additionally has a mounting plate 1.2. An optical block 1.1 is arranged on the mounting plate 1.2 and fixedly connected to it by adhesive bonding. The mounting plate 1.2 and the optical module 1 are detachably connected to the electronic module 2.

[0049] In the first alternative scenario, the optical interface will be arranged in S... opt Electrical interface layout S ele Phase calibration is performed, and then the light block 1.1 is fixedly connected to the carrier plate 2.1 via adhesive.

[0050] In the second alternative configuration, firstly, the mounting plate 1.2 of the optical module 1 is connected to the carrier plate 2.1 of the electronic module 2 in a reversibly establishable relative position via a detachable connector. Subsequently, the optical interface S is arranged... opt Electrical interface layout S ele Phase calibration is performed, and then the light block 1.1 is permanently attached to the mounting plate 1.2 via adhesive.

[0051] The focus of this invention is the implementation scheme of the adhesive part.

[0052] To establish the adhesive portion according to the invention, at least three parallel through holes 7 are pre-introduced in the support plate 2.1 or mounting plate 1.2. In the case of exactly three through holes 7, these through holes are arranged in a triangular pattern. The through holes 7 are used to later receive the cylindrical pin 5, through which the adhesive portion is established as an indirect bond.

[0053] Before establishing an adhesive joint between the optical block 1.1 and the carrier plate 2.1 or mounting plate 1.2, the optical block 1.1 is oriented such that the optical interface arrangement S opt Electrical interface layout S ele Phase alignment. This establishes the relative position of the light block 1.1 with respect to the carrier plate 2.1 or the mounting plate 1.2, and fixes it in all six degrees of freedom via adhesive joints.

[0054] At least three cylindrical pins 5 are guided through one of the through holes 7 until they all come to rest against the light block 1.1. Adhesive 9 is pre-applied to the first end face 5.1 of the cylindrical pin 5 facing the light block 1.1, so that the cylindrical pin 5 is bonded to the light block 1.1. The cylindrical pin 5 is bonded to the carrier plate 2.1 or the mounting plate 1.2 during or after being guided through the through hole 7.

[0055] In order to make the cylindrical pin 5 adhere when it is guided through the through hole 7, adhesive 9 is applied in advance to the outer peripheral surface of the cylindrical pin 5 facing the second end face 5.2 or to the through hole 7.

[0056] To obtain a defined adhesive surface for the cylindrical pin 5, the dimensions of the cylindrical pin 5 and the through hole 7 are advantageously matched so that the second end face 5.1 is located within the through hole 7. The remaining free volume in the through hole 7 is then covered with adhesive 9.

[0057] If the light block 1.1 is parallel to the carrier plate 2.1 or mounting plate 1.2 in the calibrated relative position, all cylindrical pins 5 are adhered to the through holes 7 at the same depth. This does not change for different relative positions in the x, y, z directions, or about the z direction. Tilts about the x or y direction are compensated by the cylindrical pins 5 being arranged in the through holes on the light block at approximately the same depth. Unlike many adhesives in the prior art, it is not necessary to compensate for the tilt by the amount of adhesive 9 used. Using equal amounts of adhesive at each point of connection has the advantage that the behavior of adhesive 9 (e.g., shrinkage during curing) is the same in all cases, thus the calibrated relative position can be fixed with high precision.

[0058] List of reference numerals

[0059] 1 Optical Module

[0060] 1.1 Light Block

[0061] 1.2 Mounting Plate

[0062] 1.2.1 Front of mounting plate

[0063] 1.2.1.1 Protrusion

[0064] 1.2.2 Outer periphery of the mounting plate

[0065] 1.2.2.1 Stop pin

[0066] 2 Electronic Modules

[0067] 2.1 Support plate

[0068] 2.1.1 Mounting surface

[0069] 2.1.2 Locating pin

[0070] 2.2 Printed Circuit Board

[0071] 2.3 Needle holder

[0072] 2.3.1 Stimulus

[0073] 3 Clamping pins

[0074] 4. Bending structure

[0075] 5 cylindrical pins

[0076] 5.1 First end face of the cylindrical pin

[0077] 5.2 Second end face of the cylindrical pin

[0078] 6 Threaded pins

[0079] 7 Through holes

[0080] 8 Pressure Units

[0081] 9. Adhesives

[0082] S opt optical interface

[0083] S ele Electrical interface

[0084] E opt (Contact module) Optical interface layer

[0085] E ele (Contact module) Electrical interface layer

Claims

1. A contact module, comprising: An optical module (1) comprising a light block (1.1) made of glass, the light block (1.1) being located in the optical interface layer (E). opt It has an optical interface arrangement (S) opt );as well as The electronic module (2) includes a carrier board (2.1), a printed circuit board (2.2), and a pin holder (2.3), wherein the tips of the contact pins arranged (2.3.1) are located on the electrical interface layer (E). ele Electrical interface arrangement (S) is formed on the surface. ele ), The optical module (1) and the electronic module (2) are arranged opposite to each other, such that the optical interface arrangement (S) opt ) and the electrical interface arrangement (S ele Regarding the calibration positions of all six degrees of freedom of the Cartesian coordinate system, Its features are, The optical block (1.1) is permanently connected to the carrier plate (2.1) by at least three cylindrical pins (5) extending along the z-direction, or the optical module (1) has a mounting plate (1.2) and the optical block (1.1) is permanently connected to the mounting plate (1.2) by at least three cylindrical pins (5) extending along the z-direction, wherein each cylindrical pin (5) is attached to the upper surface of the optical block (1.1) in the z-direction by an adhesive (9) with its first end face (5.1), and there are through holes (7) arranged parallel to each other and extending along the z-direction in the carrier plate (2.1) or the mounting plate (1.2), and each cylindrical pin (5) is connected to the carrier plate (2.1) or the mounting plate (1.2) by an adhesive (9) in the through holes (7).

2. The contact module according to claim 1, characterized in that, The second end face (5.2) of each cylindrical pin, which is opposite to the first end face (5.1), is arranged inward in one of the through holes (7), and the free volume left above the through hole (7) is filled with adhesive (9).

3. The contact module according to claim 1 or 2, characterized in that, The mounting plate (1.2) and the carrier plate (2.1) are connected by a removable connector, wherein the removable connector ensures that the optical interface arrangement (S) is repeatedly established. opt ) and the electrical interface arrangement (S ele The calibration bit.

4. The contact module according to claim 3, characterized in that, The mounting plate has three protrusions (1.2.1.1) on its front side (1.2.1). Each protrusion (1.2.1.1) defines a mounting layer parallel to the xy-plane and protrudes in the z-direction. Each protrusion (1.2.1.1) abuts against the mounting surface (2.1.1) of the support plate (2.1) in the z-direction. The mounting surface (2.1.1) is parallel to the xy-plane, fixing the relative position of the mounting plate (1.2) with respect to the support plate (2.1) in the z, x, and y directions of the Cartesian coordinate system. The outer periphery of the mounting plate (1.2)... 2) Three positioning pins (1.2.2.1) are provided parallel to the mounting layer, wherein two positioning pins (1.2.2.1) are perpendicular to each other and respectively abut against the stop pins (2.1.2) on the support plate (2.1), so that the relative position of the mounting plate (1.2) with respect to the support plate (2.1) in the x and y directions is fixed, and the third positioning pin (1.2.2.1) abuts against another stop pin (2.1.2) on the support plate (2.1), so that the relative position of the mounting plate (1.2) with respect to the support plate (2.1) in the z direction is fixed.

5. The contact module according to claim 3, characterized in that, The mounting plate (1.2.1) has three protrusions (1.2.1.1) on its front side. Each protrusion (1.2.1.1) defines a mounting layer parallel to the xy plane and protrudes in the z direction. The protrusions (1.2.1.1) abut against the mounting surface (2.1.1) of the support plate (2.1) in the z direction, thereby fixing the relative position of the mounting plate (1.2) with respect to the support plate (2.1) in the z, x, and y directions of the Cartesian coordinate system. Furthermore, two curved joints are formed in the mounting plate (1.2) that penetrate the mounting plate (1.2). Structure (4), wherein a first clamping pin (3) attached to the support plate (2.1) is circumferentially clamped within the first bending structure (4) of the two bending structures via its side surface, thereby fixing the relative position of the mounting plate (1.2) with respect to the support plate (2.1) in the x and y directions, and a second clamping pin (3) attached to the support plate (2.1) is tangentially clamped within the second bending structure (4) of the bending structures via its side surface, thereby fixing the relative position of the mounting plate (1.2) with respect to the support plate (2.1) in the z direction.

6. The contact module according to claim 5, characterized in that, The first bending structure (4) is in the form of a pipe clamp, and the first clamping pin (3) is self-centeringly clamped in the pipe clamp.

7. A method for assembling a contact module, the contact module comprising: An optical module (1) comprising a light block (1.1) made of glass, the light block (1.1) being located in the optical interface layer (E). opt It has an optical interface arrangement (S) opt The optical interface layer (E) opt Parallel to the xy plane in the Cartesian coordinate system; and Electronic module (2) includes a carrier plate (2.1), a printed circuit board (2.2) disposed on the carrier plate (2.1), and a needle holder (2.3) disposed on the printed circuit board (2.2), the needle holder (2.3) having a contact pin arrangement (2.3.1) with needle tips, wherein the needle tips of the contact pin arrangement (2.3.1) are at the electrical interface layer (E ele Electrical interface arrangement (S) is formed on the surface. ele ), wherein the electrical interface layer (E) ele Parallel to the xy plane in the Cartesian coordinate system and lower than the optical interface layer (E) in the z direction. opt ), The optical module (1) and the electronic module (2) are arranged opposite to each other, such that the optical interface arrangement and the electrical interface arrangement form mutually defined calibration positions. Its features are, First, arrange the optical interface (S) opt ) and the electrical interface arrangement (S ele Phase calibration is performed, and then the light block (1.1) is permanently attached to the carrier plate (2.1) via an adhesive joint, or The mounting plate (1.2) is connected to the carrier plate (2.1) in a reversibly establishable relative position via a detachable connector, and then the optical interface arrangement (S) is installed. opt ) and the electrical interface arrangement (S ele Phase calibration is performed, and then the optical block (1.1) is permanently attached to the mounting plate (1.2) via an adhesive joint. The adhesive portion in the two alternative schemes is established by introducing at least three parallel through holes (7) extending along the z-direction into the support plate (2.1) or the mounting plate (1.2). At least three cylindrical pins (5) extending in the z-direction are guided through one of the through holes (7) until they all stop at the light block (1.1), wherein the first end face (5.1) of the cylindrical pin facing the light block (1.1) is pre-coated with adhesive (9), and the cylindrical pins (5) are bonded during or after being guided through the through holes (7).

Images