Audio device with flexible circuit for capacitive interface

Abstract

Various aspects of the present disclosure include audio devices having capacitive sensing interfaces along compound curved walls. Some aspects of the present disclosure relate to wearable audio devices having a capacitive sensing interface and a flexible printed circuit board (PCB) for detecting touch commands at the interface. In some cases, the flexible PCB has at least one slit for conforming to a compound curve of the wall. In additional implementations, an inner surface of the wall is faceted, and the flexible PCB conforms to the facets in the wall.

Description

[0001] Priority Statement

[0002] This application claims priority to U.S. Patent Application No. 16 / 919,634, filed July 2, 2020, the entire contents of which are incorporated herein by reference. Technical Field

[0003] This disclosure relates generally to audio devices. More specifically, this disclosure relates to capacitive sensing interfaces having a composite curved shape in audio devices. Background Technology

[0004] Audio devices (such as wearable audio devices like earbuds) can include composite curved surfaces. Under certain form factors, integrating capacitive sensing interfaces along these composite curved surfaces is advantageous. However, conventional capacitive sensing interfaces employ circuitry comprising a planar flexible printed circuit board (PCB). Securing the planar flexible PCB to the composite curved surface introduces stress within the flexible PCB, impacting performance and potentially causing the interface to malfunction. Summary of the Invention

[0005] All examples and features mentioned below can be combined in any technically possible way.

[0006] Various embodiments of this disclosure include audio devices having capacitive sensing interfaces. Various specific embodiments of the invention include audio devices having capacitive sensing interfaces integrated into a wall having a composite curved shape.

[0007] In some specific aspects, an audio device includes: a housing having a set of walls, wherein at least one of the walls has a composite curved shape including an outer surface and an inner surface each having a composite curve; and a capacitive sensing interface integrated with the wall having the composite curved shape, the capacitive sensing interface including: a contact surface for receiving a touch command at the outer surface of the wall; and a flexible printed circuit board (PCB) located below the contact surface for detecting the touch command at the contact surface, wherein the flexible PCB extends along the inner surface of the wall and includes at least one slit, the at least one slit enabling the flexible PCB to conform to the composite curve of the inner surface.

[0008] In other specific aspects, an audio device includes: a housing having a set of walls, wherein at least one of the walls has a composite curved shape including an outer surface and an inner surface, wherein the inner surface includes different facets connected by a set of joints; and a capacitive sensing interface integrated with the wall having the composite curved shape, the capacitive sensing interface including: a contact surface for receiving a touch command at the outer surface of the wall; and a flexible printed circuit board (PCB) located below the contact surface for detecting the touch command at the contact surface, wherein the flexible PCB extends along the inner surface of the wall.

[0009] Specific implementations may include one of the following features, or any combination thereof.

[0010] In some respects, each slit partially separates a segment of the flexible PCB.

[0011] In some cases, the at least one slit includes at least two slits that partially separate at least three sections of the flexible PCB.

[0012] In a specific implementation, the at least one slit allows the flexible PCB to conform to the composite curve of the inner surface without interference between adjacent sections of the flexible PCB.

[0013] In some cases, each slit has an aspect ratio of at least 1:1.

[0014] In some implementations, the audio device further includes: an acoustic transducer having an acoustic radiating surface for providing audio output; and a controller coupled to the acoustic transducer and the flexible PCB, the controller being configured to control the audio output from the acoustic transducer based on commands received at the capacitive sensing interface.

[0015] In one particular aspect, the capacitive sensing interface includes a capacitive touch interface for detecting touch commands from a human user.

[0016] In some specific implementations, the composite curve of the inner surface includes a convex composite curve or a concave composite curve.

[0017] In some cases, the audio device includes wearable audio devices, which include at least one of the following: headphones, earphones, audio glasses, body-worn speakers, or audio jewelry.

[0018] In a particular aspect, the wall has a substantially constant thickness along the longest dimension of the capacitive sensing interface.

[0019] In some specific implementations, the audio device further includes an adhesive that couples the flexible PCB to the inner surface of the wall.

[0020] In some respects, the set of joints includes at least two joints of at least three facets connecting the inner surface.

[0021] In some cases, each facet has a non-uniform thickness along its length, such that a portion of each facet is thinner near the junction with an adjacent facet than the rest of the facet.

[0022] In a specific implementation, this set of joints allows the flexible PCB to conform to the inner surface without interference between adjacent portions of the flexible PCB.

[0023] In some cases, audio devices also include an adhesive that couples the flexible PCB to the inner surface of the wall, wherein each facet in the facet has approximately equal surface area.

[0024] In some aspects, the audio device further includes: an acoustic transducer having an acoustic radiating surface for providing audio output; and a controller coupled to the acoustic transducer and the flexible PCB, the controller being configured to control the audio output from the acoustic transducer based on commands received at the capacitive sensing interface, wherein the capacitive sensing interface includes a capacitive touch interface for detecting touch commands from a human user.

[0025] In a specific implementation, the composite curve of the outer surface includes a concave composite curve.

[0026] In some cases, the inner surface also includes at least one curved section adjacent to at least one of the facets.

[0027] In some respects, the flexible PCB has at least one slit that allows the flexible PCB to conform to the inner surface with facets.

[0028] Two or more features described in this disclosure, including those described in the content section of this invention, may be combined to form specific embodiments not specifically described herein.

[0029] Details of one or more specific embodiments are set forth in the accompanying drawings and the following description. Other features, objects, and advantages will be apparent from the specification, drawings, and claims. Attached Figure Description

[0030] Figure 1 It is a schematic diagram based on various specific implementations of audio devices.

[0031] Figure 2 It is a schematic diagram of additional audio devices according to various specific implementations.

[0032] Figure 3 It is a schematic diagram of another audio device based on various specific implementations.

[0033] Figure 4 It is a system diagram that shows the implementation details according to various specific methods. Figures 1 to 3 The electronic components within the audio equipment and the connected capacitive sensing interface.

[0034] Figure 5 This is a first cross-sectional view of the wall and flexible printed circuit board (PCB) of an audio device according to various specific implementations.

[0035] Figure 6 yes Figure 5 The second cross-sectional view of the audio device wall and the flexible PCB.

[0036] Figure 7 It is a plan view of a flexible PCB based on various specific implementations.

[0037] Figure 8 This is a first cross-sectional view of the audio device wall and flexible printed circuit board (PCB) according to various additional specific implementations.

[0038] Figure 9 yes Figure 8 The second cross-sectional view of the audio device wall and the flexible PCB.

[0039] Figure 10 It is a plan view of an audio device with facets based on various specific implementations.

[0040] Figure 11 It is a plan view of the audio device wall, including facets and simple curved surfaces, according to various specific implementations.

[0041] It should be noted that the accompanying drawings for various specific embodiments are not necessarily drawn to scale. The drawings are intended only to illustrate typical aspects of this disclosure and should not be construed as limiting the scope of the invention. In the drawings, similar numbers denote similar elements between figures. Detailed Implementation

[0042] As described herein, various aspects of this disclosure generally relate to audio devices having a capacitive sensing interface along a composite curved wall. More specifically, aspects of this disclosure relate to wearable audio devices having a capacitive sensing interface and a flexible printed circuit board (PCB) for detecting touch commands at the interface. In some cases, the flexible PCB has at least one slit for conforming to the composite curve of the wall. In an additional embodiment, the inner surface of the wall has facets, and the flexible PCB conforms to these facets.

[0043] For illustrative purposes, the components usually labeled in the accompanying drawings are considered to be substantially equivalent, and redundant discussion of those components is omitted for clarity.

[0044] The aspects and specific embodiments disclosed herein are applicable to a variety of speaker systems, such as audio devices and wearable audio devices. Audio devices may include fixed and / or portable speakers, speakers integrated into other systems (e.g., automotive audio systems), and / or speaker networks. In some cases, wearable audio devices may take various form factors, such as headphones (whether on or off the ear), headsets, watches, glasses, audio accessories or apparel (e.g., audio caps, audio visors, audio jewelry), neck-worn speakers, shoulder-worn speakers, body-worn speakers, etc. Some specific aspects disclosed are particularly applicable to personal (wearable) audio devices, such as in-ear headphones (also known as earbuds), glasses, or other head-worn audio devices. It should be noted that while specific embodiments of speaker systems primarily serving the purpose of acoustically outputting audio are presented in some degree of detail, such presentation of specific embodiments is intended to facilitate understanding by providing examples and should not be construed as limiting the scope of this disclosure or the scope of the claims.

[0045] Wearable audio devices, as described in various specific embodiments, may include features present in one or more other wearable electronic devices such as smart glasses, smartwatches, etc. These wearable audio devices may include additional hardware components, such as one or more cameras, location tracking devices, microphones, etc., and are capable of voice recognition, visual recognition, and other smart device functions. The description of wearable audio devices included herein is not intended to exclude these additional functions in such devices.

[0046] As noted in this article, conventional capacitive sensing interfaces employ circuitry that includes a planar flexible printed circuit board (PCB). Securing the planar flexible PCB to a composite curved surface (i.e., a surface curved in both the X and Y directions) can introduce stress within the flexible PCB and cause it to detach from the device wall. These issues can lead to reduced sensitivity at the interface and, in some cases, interface failure.

[0047] Compared to conventional devices, various embodiments include audio devices with a flexible PCB having at least one slit to allow the PCB to conform to the composite curve of the inner surface of the device wall. In additional embodiments, the inner surface of the device wall has facets to allow the PCB to conform to that surface. In some cases, the inner surface has facets, and the PCB includes at least one slit to allow the PCB to conform to the facetted surface of the device wall.

[0048] Figures 1 to 3 Examples of audio devices that can be combined with teaching content in various specific implementations are shown. These examples are not intended to be limiting.

[0049] Figure 1 This is a schematic diagram of a first exemplary audio device 10. In this example, the audio device 10 is an audio headset 20 having at least one earbud (or in-ear headphone) 30. Two earbuds 30 are shown in this example. Although the earbuds 30 are shown in a “true” wireless configuration (i.e., there is no tether between the earbuds 30), the audio headset 20 may also include a tethered wireless configuration (whereby the earbuds 30 are connected to a playback device via a wire with a wireless connection) or a wired configuration (whereby at least one of the earbuds 30 has a wired connection to the playback device). Each earbud 30 is shown as including a body 40, which may include a shell formed of one or more plastics or composite materials. The body 40 may include a mouthpiece 50 for insertion into a user’s ear canal opening, a support member 60 for holding the mouthpiece 50 in a stationary position within the user’s ear, and an outer housing 65 for housing electronics 70, which includes components of a capacitive sensing interface 80 (e.g., a capacitive touch interface). In some cases, individual or repeated groups of electronic devices 70 are included in portions of earplug 30, such as each respective earplug 30. However, some components described herein can also exist in a singular form.

[0050] Figure 2 An additional exemplary audio device 10, including audio glasses 210, is shown. As shown, the audio glasses 210 may include a frame 220 having a lens region 230 and a pair of arms 240 extending from the lens region 230. Like conventional eyeglasses, the lens region 230 and arms 240 are designed to rest on a user's head. The lens region 230 may include a set of lenses 250, which may include prescription lenses, non-prescription lenses, and / or filter lenses, and a nose bridge 260 (which may include padding) for resting on the user's nose. The arms 240 may include curved profiles 265 for resting on the user's respective ears. Depending on a particular embodiment, electronics 70 and other components for controlling the audio glasses 210 are contained within the frame 220 (or substantially contained within the frame such that components can extend beyond the boundaries of the frame). Electronics 70 may include portions of a capacitive sensing interface 80, as described with respect to the audio device 10 herein. In some cases, individual or repeated groups of electronic devices 70 are included in portions of the frame, such as in each of the corresponding arms 240 in frame 220. However, some components described herein can also be present in a singular form.

[0051] Figure 3Another audio device 10 is shown, which includes an over-ear headphone 310. The headphone 310 may include a pair of earcups 320 configured to fit over a user's ears either non-contactly or in contact. A headband 330 spans between the pair of earcups 320 and is configured to rest on the user's head (e.g., across the top of the head or around the head). In some embodiments, the headband 330 may include a head pad 340. Depending on a particular embodiment, electronics 70 and other components for controlling the headphone 310 are stored within one or both earcups 320. The electronics 70 may include portions of a capacitive sensing interface 80, as described with respect to the wearable audio device 10 herein. It should be understood that the various wearable audio devices described herein may utilize features of various embodiments, and references are made to... Figures 1 to 3 The wearable audio device 10 shown and described is merely exemplary.

[0052] Figure 4 It is shown (at least partially) included in the audio device 10 (e.g., such as...) Figures 1 to 3 The diagram shows a sample electronic device 70 and components of a capacitive sensing interface 80. It should be understood that one or more components in electronic device 70 may be implemented as hardware and / or software, and such components may be connected by any conventional means (e.g., hardwired and / or wireless connections). It should also be understood that any component described as being connected or coupled to audio device 10 or another component in other systems disclosed according to a specific implementation may communicate using any conventional hardwired connections and / or additional communication protocols. In some cases, the communication protocol may include Wi-Fi protocols using wireless local area networks (LANs), communication protocols such as IEEE 802.11b / g, cellular network-based protocols (e.g., third-, fourth-, or fifth-generation (3G, 4G, 5G cellular networks), or one of several Internet of Things (IoT) protocols, such as Bluetooth, BLE Bluetooth, ZigBee (mesh LAN), Z-wave (sub-GHz mesh network), 6LoWPAN (lightweight IP protocol), LTE protocol, RFID, ultrasonic audio protocols, etc. In various specific implementations, the separately housed components in the audio device 10 are configured to communicate using one or more conventional wireless transceivers.

[0053] like Figure 4 As shown, it is included in the audio headphones 20 ( Figure 1The electronics 70 within the device may include a transducer 410 and a power supply 420. In some embodiments (optionally depicted in dashed lines), the electronics 70 may also include an inertial measurement unit (IMU) 430 for detecting movement of the wearable audio device 10 and enabling specific control functions. In various embodiments, the power supply 420 is connected to the transducer 410 and may also be connected to the IMU 430. Each of the transducer 410, the power supply 420, and the inertial measurement unit 90 is connected to a controller 440, which is configured to perform control functions according to the various embodiments described herein. The electronics 70 may include other components not specifically shown in the figures, such as communication components (e.g., a wireless transceiver (WT)) configured to communicate with one or more other electronic devices connected via one or more wireless networks (e.g., a local Wi-Fi network, Bluetooth connection, or radio frequency (RF) connection), and amplification and signal processing components. It should be understood that these components or their functional equivalents may be connected to or form part of the controller 440.

[0054] Transducer 410 may include at least one electroacoustic transducer for generating an acoustic output that enters or approaches a user's ear. In some specific embodiments (e.g., in...), Figure 2 In the example of audio glasses, each transducer 410 may include a dipole speaker with a sound driver or radiator that emits frontal sound radiation from its front side and rearal sound radiation from its rear side. The dipole speaker may be built into the housing, frame, or enclosure of the audio device 10 and may be configured for a specific form factor of the audio device 10.

[0055] IMU 430 may include a microelectromechanical system (MEMS) device incorporating a multi-axis accelerometer, gyroscope, and / or magnetometer. It should be understood that additional or alternative sensors may perform the functions of IMU 430, such as optical-based tracking systems, accelerometers, magnetometers, gyroscopes, or radar as described herein for detecting movement. IMU 430 may be configured to detect changes in the physical position / orientation of audio device 10 and provide updated sensor data to controller 440 to indicate changes in the position / orientation of audio device 10. However, it should be understood that electronics 70 may also include one or more optical or visual detection systems located at audio device 10 or another connected device, configured to detect the orientation of audio device 10.

[0056] The power supply 420 for the transducers 410 may be locally supplied (e.g., with a battery located near each transducer 410), or a single battery may transmit power via wiring (not shown) passing through the frame or housing of the audio device 10, for example, depending on the form factor of the particular wearable audio device 10. Depending on various specific implementations, the power supply 420 may be used to control the operation of the transducers 410.

[0057] Controller 440 may include conventional hardware and / or software components for executing program instructions or code according to the procedures described herein. For example, controller 440 may include one or more processors, memory, communication paths between components, and / or one or more logic engines for executing program code. Controller 440 may be coupled to other components in electronics 70 via any conventional wireless and / or hardwired connection, which allows controller 440 to send or receive signals to and control the operation of those components.

[0058] The controller 440 is shown coupled to a printed circuit board (PCB) 450, which in turn is coupled to a capacitive sensing interface 80. Figures 1 to 3 Coupling. In some cases, components of PCB 450 and / or capacitive sensing interface 80 are enclosed in a common housing with electronics 70; however, in other implementations, these components may be physically separated by one or more separators. Controller 440 is configured to receive touch-based commands from capacitive sensing interface 80 to control the operation of audio device 10. For example, a user may provide touch commands at capacitive sensing interface 80 to turn audio device 10 on or off, switch between playback sources, switch tracks or clips within playback sources, switch playback option menus, etc.

[0059] Figure 5 and Figure 6 Two distinct exemplary cross-sectional depictions are shown of a wall 500 (e.g., an outer wall in the housing of any audio device 10 shown and described herein) through which a capacitive sensing interface 80 extends. The wall 500 has an inner surface 510 and an outer surface 520. The capacitive sensing interface 80 has a sensing surface 530 (e.g., a contact surface) along the outer surface 520 of the wall 500. In some specific embodiments, the wall 500 includes a composite curved surface such that the outer surface 520 of the wall 500 is curved (or arc-shaped) in both the X and Y directions. In some cases, as described herein, the inner surface 510 also has a composite curved shape. This example is in... Figure 5 and Figure 6 As shown, in which, for example, wall 500 has a substantially constant thickness (T) along the longest dimension of interface 80. w However, in other specific implementations (such as...) Figure 8 and Figure 9 As shown), the inner surface has small facets, which increases the wall thickness (T). w’ ) varies along its longest dimension. Although in Figure 5 and Figure 6 The concave composite curve is shown, but it should be understood that in various specific implementations, the inner surface 510 may have a convex composite curved shape.

[0060] Continue to refer to Figure 5 and Figure 6 The capacitive sensing interface 80 is integrated with wall 500, enabling the reception of one or more commands (e.g., touch commands) at sensing surface 530. As is known in the art, when a user (e.g., a user's finger) touches the contact surface of a capacitive touch interface (e.g., sensing surface 530 of capacitive sensing interface 80), it forms a simple parallel-plate capacitor. The digital value of this parallel-plate capacitor is measured and used to detect the presence at a specific electrode and / or movement across the electrode (such as in a swipe motion). In various specific embodiments, the capacitive sensing interface 80 includes a plurality of electrodes 540 beneath the capacitive sensing surface 530, for example, to detect touch and / or swipe commands at interface 80. Electrodes 540 may include sensor pads connected to controller 440 via a flexible PCB 450 through one or more through-holes and / or traces (not shown). Electrodes 540 may be surrounded by a grounding hatch 550 or otherwise isolated.

[0061] As described herein, in various embodiments, the flexible PCB 450 extends along the inner surface 510 of the wall 500. In these cases, the flexible PCB 450 can be coupled to the inner surface 510 using an adhesive (e.g., a conventional adhesive used in electronic device manufacturing). In some embodiments, the configuration of the flexible PCB 450 allows the PCB 450 to adhere effectively to the inner surface 510 without requiring a high-strength adhesive (e.g., a very high-strength bond, or VHB).

[0062] like Figure 5 and Figure 6 As shown, the flexible PCB 450 includes at least one slit 560 that allows the flexible PCB 450 to conform to the composite curve of the inner surface 510. Figure 7 A plan view of the flexible PCB 450 is shown, further illustrating a segment 570 at least partially separated by slits 560 (wherein the separating slits are indicated by a, b, c, d, etc.). In some cases, the slits 560 extend from one or more edges 580 of the PCB 450, for example, as an opening on one edge of the edges 580. Figure 7In the example shown, the flexible PCB 450 has two slits 560 on each edge 580, which partially separate the three segments 570. However, it should be understood that any number of slits 560, greater than one, can be used to separate corresponding segments 570 in the PCB 450. In some cases, the slits 560 are evenly spaced on one or more edges of the edge 580, such that any two slits 560 in a group of three or more slits 560 are separated by an equal space measured along the edge 580. In some cases, the slits 560 are equidistant from the corners 590 between the edges 580. In other embodiments, the slits 560 are equidistant from the corners 590 and from each other, such that the spacing between adjacent slits 560 is equal to the spacing between a slit 560 and the nearest corner 590. In other cases, the slits 560 are closer together than each slit 560 is spaced apart from the corner 590, such that the spacing between the slits 560 is not equal to the spacing with the nearest corner 590.

[0063] In some cases, each slit 560 has an aspect ratio of at least 1:1 (length measured inward from edge 580 and width measured parallel to inner surface 510). In some additional embodiments, each slit 560 has an aspect ratio of at least 2:1 or at least 3:1. In some embodiments, the aspect ratio of each slit 560 is proportional to the thickness of the PCB 450, such that a thicker PCB 450 achieves a larger aspect ratio for each slit 560.

[0064] In various specific implementations, the slits 560 extend only partially through the flexible PCB 450 in the X and Y directions. That is, each slit 560 extends only a portion of the length or width of the flexible PCB 450. In some cases, such as... Figure 7 As shown, each slit 560 extends fully through the PCB 450 in the Z direction (or depth direction, denoted as entering and exiting the page). However, in other specific embodiments, each slit 560 extends only partially through the PCB 450 in the Z direction. Once coupled to the inner surface 510 of the wall 500, the PCB 450 is configured to flex at the slit 560 to conform to the inner surface 510. In certain cases, the slit 560 allows the PCB 450 to conform to the composite curve of the inner surface 510 without interference between adjacent portions 570. That is, contrary to conventional configurations, the PCB 450 is constructed to flex and conform to the composite curve of the inner surface 510 without inducing mechanical stress on the PCB 450 and its circuitry. Additionally, because the slit 560 relieves tension in the PCB 450, the PCB 450 is coupled (e.g., adhered) to the inner surface 510 more effectively than conventional methods.

[0065] In additional specific implementations, for example, such as Figure 8 and Figure 9 As shown, the wall 500A of the audio device 10 is shown having an inner surface 510A, which includes facets 600 connected by a set of joints 610. In some embodiments, at least one joint 610 separates at least two facets 600. In a particular example, the wall 500A includes at least three facets 600 separated by at least two joints 610. In these cases, the facets 600 are planar or approximately (e.g., within limits such as a few percent or less of measurement error) planar and are angularly positioned relative to each other due to the joints 610. In some example embodiments, each facet of the facets 600 has approximately equal surface areas. However, in other embodiments, one or more facets 600 have surface areas different from the remaining facets of the facets 600.

[0066] Depending on the specific implementation, the joint 610 allows the inner surface 510A to approximate a contour line, for example, to approximately trace the complex curved shape of the outer surface 520. The joint 610 may include a slot or track extending fully through the wall 500A in the longitudinal or transverse direction. In other cases, the joint 610 is simply an interface between adjacent facets 600, having a minimal or negligible width or depth relative to the surface of the facet 600. In some cases, such as... Figure 10 As shown in the plan view of wall 500A, inner surface 510A may include a grid or matrix of joints 610 that enable wall 500A to approximate a composite curve (e.g., approximate curves in two different directions). In a further embodiment, each facet 600 has a non-uniform thickness along its length, such that a portion of each facet 600 is thinner near the joint 610 with an adjacent facet than the remainder of the facet 600. That is, in addition to the joint 610, wall 500A may also include tapered faces 600 that thin as they approach the joint 610, which further enables wall 500A to approximate a composite curve.

[0067] In certain specific implementations, such as Figure 9 and Figure 10 As shown, the flexible PCB 450 is coupled (e.g., adhered) to the inner surface 510A, for example, at facet 600. According to a particular embodiment, the flexible PCB 450, including a slit 560, is configured to mate with the inner surface 510A, for example, where a segment 570 of the PCB 450 corresponds to facet 600 of the inner surface 510A. In these cases, one or more of the joints 610 may be aligned with the slit 560 in the PCB 450, thereby further enhancing the bonding between the PCB 450 and the inner surface 510A of the wall 500A.

[0068] In any case, wall 500A improves coupling with PCB 450 or PCB 650, thereby reducing mechanical stress from this coupling compared to conventional configurations. The facet-shaped wall 500A also enables coupling with different PCBs and / or other circuits, while reducing mechanical stress at the interface 80 between those circuit components and the interface.

[0069] Figure 11 Additional embodiments of the wall 500B as viewed from the inner surface 510B are shown, according to various additional embodiments. In these cases, the inner surface 510B has at least one section with a simple curved shape, i.e., a section that curves only in one of the X or Y directions. Figure 11 In the exemplary depiction, the inner surface 510B includes a set of facets 600, and adjacent to the facets 600 is a simple curved section 620. In this example, the simple curved section 620 is understood to be curved outward (recessed) along the X-axis. However, in other specific embodiments, the facets 600 may extend longitudinally in the X-direction and the adjacent curved section 620 may be curved along the Y-axis (e.g., outward). In these cases, the joint 610 may be connected to the PCB (e.g., Figure 7 The slit 560 in the PCB 450 is aligned. In other cases, the joint 610 is aligned with the PCB mounted to the inner surface 510B (e.g., Figure 7 One or more slits 560 in the PCB 450 are misaligned.

[0070] The functions or portions thereof described herein, and their various modifications (hereinafter referred to as "functions") may be implemented at least in part by computer program products, such as computer programs tangibly implemented in an information carrier, such as one or more non-transitory machine-readable media, for performing or controlling the operation of one or more data processing devices, such as programmable processors, computers, multiple computers and / or programmable logic components.

[0071] Computer programs can be written in any programming language, including compiled or interpreted languages, and can be deployed in any form, including as standalone programs or as modules, components, subroutines, or other units suitable for use in a computing environment. Computer programs can be deployed on a single computer, distributed across one or more sites, or executed on multiple computers interconnected via a network.

[0072] The actions associated with implementing all or part of the functionality can be performed by one or more programmable processors executing one or more computer programs to perform the functions of the calibration process. All or part of the functionality can be implemented as special-purpose logic circuitry, such as FPGAs and / or ASICs (Application-Specific Integrated Circuits). Processors suitable for executing computer programs include, for example, both general-purpose microprocessors and special-purpose microprocessors, as well as any one or more processors of any type of digital computer. Generally, the processor will receive instructions and data from read-only memory or random access memory, or both. The components of a computer include a processor for executing instructions and one or more memory devices for storing instructions and data.

[0073] The components in the diagram are shown and described as discrete components. These components can be implemented as one or more analog or digital circuits. Alternatively, or otherwise, they can be implemented using one or more microprocessors that execute software instructions. The software instructions may include digital signal processing instructions. Operations can be performed by analog circuits or by a microprocessor executing software that performs equivalent analog operations. Signal lines can be implemented as discrete analog or digital signal lines, discrete digital signal lines with appropriate signal processing capable of handling individual signals, and / or components of wireless communication systems.

[0074] When a process is represented or implied in a block diagram, steps can be performed by one or more elements. Steps can be performed together or at different times. Elements performing activities can be physically identical or close to each other, or they can be physically separated. A single element can perform actions from more than one block. Audio signals can be encoded or unencoded and can be transmitted in digital or analog form. In some cases, conventional audio signal processing equipment and operations are omitted from the diagram.

[0075] In various embodiments, components described as "coupled" to each other may be joined along one or more interfaces. In some embodiments, these interfaces may include joints between different components, and in others, these interfaces may include solid and / or integrally formed interconnects. That is, in some cases, components "coupled" to each other may be formed simultaneously to define a single continuous member. However, in other embodiments, these coupled components may be formed as separate members and subsequently joined by known processes (e.g., welding, fastening, ultrasonic welding, bonding). In various embodiments, electronic components described as "coupled" may be linked via conventional hardwires and / or wireless devices, enabling these electronic components to transmit data to each other. Additionally, sub-components within a given component may be considered to be linked via conventional paths, which may not necessarily be shown.

[0076] Other embodiments not specifically described herein are also within the scope of the following claims. Elements of the different embodiments described herein can be combined to form other embodiments not specifically set forth above. Some elements can be removed from the structures described herein without adversely affecting their operation. Furthermore, various independent elements can be combined into one or more individual elements to perform the functions described herein.

Claims

1. An audio device, the audio device comprising: An outer casing, the outer casing comprising a set of walls, wherein at least one of the walls has a compound bending shape, the compound bending shape comprising an outer surface and an inner surface each having a compound curve; and A capacitive sensing interface, integrated with the wall having the composite curved shape, the capacitive sensing interface comprising: A contact surface for receiving a touch command at the outer surface of the wall; and A flexible printed circuit board (PCB) located below a contact surface for detecting a touch command at the contact surface, wherein the flexible PCB extends along the inner surface of the wall and includes at least one slit, the at least one slit enabling the flexible PCB to conform to the composite curve of the inner surface.

2. The audio device of claim 1, wherein each of the at least one slit partially separates a segment of the flexible PCB.

3. The audio device of claim 2, wherein the at least one slit comprises at least two slits that partially separate at least three segments of the flexible PCB.

4. The audio device of claim 2, wherein the at least one slit allows the flexible PCB to conform to the composite curve of the inner surface without interference between adjacent segments of the flexible PCB.

5. The audio device of claim 1, wherein each slit has an aspect ratio of at least 1:

1.

6. The audio device according to claim 1, further comprising: A sound transducer, the sound transducer including a sound radiating surface for providing audio output; and A controller coupled to the acoustic transducer and the flexible PCB, the controller being configured to control the audio output from the acoustic transducer based on commands received at the capacitive sensing interface.

7. The audio device of claim 1, wherein the capacitive sensing interface includes a capacitive touch interface for detecting the touch command from a human user.

8. The audio device according to claim 1, wherein the composite curve of the inner surface comprises a convex composite curve or a concave composite curve.

9. The audio device of claim 1, wherein the audio device includes a wearable audio device, the wearable audio device comprising at least one of: headphones, audio glasses, a body-worn speaker, or audio jewelry.

10. The audio device of claim 1, wherein the wall has a substantially constant thickness along the longest dimension of the capacitive sensing interface.

11. The audio device of claim 1, further comprising an adhesive coupling the flexible PCB to the inner surface of the wall.

12. An audio device, the audio device comprising: A housing, the housing comprising a set of walls, wherein at least one of the walls has a composite curved shape comprising an outer surface and an inner surface, wherein the inner surface comprises different facets connected by a set of joints; and A capacitive sensing interface, integrated with the wall having the composite curved shape, the capacitive sensing interface comprising: A contact surface for receiving a touch command at the outer surface of the wall; and A flexible printed circuit board (PCB) located below the contact surface for detecting the touch command at the contact surface, wherein the flexible PCB extends along the inner surface of the wall.

13. The audio device of claim 12, wherein the set of joints includes at least two joints connecting at least three facets of the inner surface.

14. The audio device of claim 12, wherein each facet has a non-uniform thickness along its length, such that a portion of each facet is thinner near its junction with an adjacent facet than the remainder of the facet.

15. The audio device of claim 12, wherein the set of joints allows the flexible PCB to conform to the inner surface without interference between adjacent sections of the flexible PCB.

16. The audio device of claim 12, further comprising an adhesive coupling the flexible PCB to the inner surface of the wall, wherein each of the facets has approximately equal surface areas.

17. The audio device of claim 12, further comprising: A sound transducer, the sound transducer including a sound radiating surface for providing audio output; and A controller, coupled to the acoustic transducer and the flexible PCB, is configured to control the audio output from the acoustic transducer based on commands received at the capacitive sensing interface. The capacitive sensing interface includes a capacitive touch interface for detecting the touch commands from a human user.

18. The audio device of claim 12, wherein the composite curve of the outer surface comprises a concave composite curve, and wherein the inner surface further comprises at least one curved segment adjacent to at least one of the facets.

19. The audio device of claim 12, wherein the audio device includes a wearable audio device, the wearable audio device comprising at least one of: headphones, audio glasses, a body-worn speaker, or audio jewelry.

20. The audio device of claim 12, wherein the flexible PCB includes at least one slit, the at least one slit enabling the flexible PCB to conform to the inner surface.

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