display module

Abstract

A display module is disclosed. The display module can include a substrate, a plurality of inorganic light emitting diodes disposed in a plurality of loading slots formed on the substrate and having a first chip electrode and a second chip electrode, a first substrate electrode pad disposed on a bottom surface of each loading slot and electrically connected to the first chip electrode, a second substrate electrode pad electrically connected to the second chip electrode, and a third substrate electrode pad and a fourth substrate electrode pad disposed adjacent to the loading slots.

Description

Technical Field

[0001] This disclosure relates to a display module manufactured by a fluid self-assembly method. Background Technology

[0002] This disclosure relates to a fluid self-assembly method for transferring a light-emitting device in a fluid to a mounting location on a substrate. The fluid self-assembly method allows for the transfer of ultra-small self-emitting devices (e.g., micro-LEDs or nanowires) onto large-area substrates.

[0003] In the fluid self-assembly method, the substrate used can be provided with multiple mounting slots into which the light-emitting device is inserted. A pair of substrate electrode pads can be provided at the bottom of the mounting slots, and the anode and cathode electrodes of the light-emitting device can be connected to the pair of substrate electrode pads.

[0004] Faulty light-emitting devices that have been transferred to the substrate can be identified during the inspection process and removed from the mounting slot and replaced with normal light-emitting devices. However, if the pair of substrate electrode pads located at the bottom of the mounting slot are damaged when the faulty light-emitting device is separated from the mounting slot, it may be difficult to install the replacement light-emitting device. Summary of the Invention

[0005] Technical issues

[0006] One or more embodiments can at least solve the above-described problems and / or disadvantages and can at least provide the following advantages. Therefore, according to one aspect of this disclosure, a display module in which a faulty microLED has been transferred via fluid self-assembly can be repaired.

[0007] Technical solution

[0008] According to an embodiment of this disclosure, a display module includes: a substrate; a plurality of inorganic light-emitting diodes disposed in a plurality of mounting slots formed in the substrate, the plurality of inorganic light-emitting diodes including inorganic light-emitting diodes having a first chip electrode and a second chip electrode; a first substrate electrode pad and a second substrate electrode pad disposed at the bottom surface of the mounting slots in the plurality of mounting slots, the first substrate electrode pad being electrically coupled to a first chip electrode, and the second substrate electrode pad being electrically coupled to a second chip electrode; and a third substrate electrode pad and a fourth substrate electrode pad disposed around the mounting slots.

[0009] At least one of the third substrate electrode pad and the fourth substrate electrode pad extends along the sidewall of the mounting groove.

[0010] The third and fourth substrate electrode pads can be arranged symmetrically with respect to the center of the mounting slot.

[0011] The third and fourth substrate electrode pads can be arranged asymmetrically with respect to the center of the mounting slot.

[0012] The substrate may include an insulating layer disposed on the third substrate electrode pad and the fourth substrate electrode pad.

[0013] The third substrate electrode pad can be electrically coupled to the first chip electrode through the first conductor, and the fourth substrate electrode pad can be electrically coupled to the second chip electrode of the inorganic light-emitting diode through the second conductor.

[0014] A pillar can be disposed on the light-emitting surface of an inorganic light-emitting diode, and the pillar may include a magnetic layer.

[0015] The magnetic layer can be formed from germanium (Ge).

[0016] The column can be offset from the center of the luminescent surface.

[0017] The post can be positioned at a location corresponding to one of the first chip electrode and the second chip electrode.

[0018] The plurality of mounting slots includes another mounting slot adjacent to the said mounting slot.

[0019] A fifth substrate electrode pad and a sixth substrate electrode pad can be provided on the bottom surface of another mounting slot.

[0020] The first substrate electrode pad can be electrically coupled to the fifth substrate electrode pad, and the second substrate electrode pad can be electrically coupled to the sixth substrate electrode pad.

[0021] According to embodiments of this disclosure, a display module includes: a substrate; a thin-film transistor (TFT) layer disposed on the substrate, with a plurality of mounting slots disposed in the TFT layer; a plurality of inorganic light-emitting diodes (LEDs) disposed in the plurality of mounting slots, the plurality of inorganic LEDs including an inorganic LED having a first chip electrode and a second chip electrode; a first substrate electrode pad and a second substrate electrode pad disposed at the bottom surface of one of the mounting slots, the first substrate electrode pad being electrically coupled to the first chip electrode, and the second substrate electrode pad being electrically coupled to the second chip electrode; and a third substrate electrode pad and a fourth substrate electrode pad disposed on the sidewall of the mounting slot. The first substrate electrode pad and the third substrate electrode pad can be electrically coupled to a first electrode wiring disposed on the TFT layer, and the second substrate electrode pad and the fourth substrate electrode pad can be electrically coupled to a second electrode wiring disposed on the TFT layer.

[0022] The display module may also include an insulating layer covering the third substrate electrode pads and the fourth substrate electrode pads.

[0023] Another mounting slot among the multiple mounting slots may be adjacent to the mounting slot, and the fifth substrate electrode pad and the sixth substrate electrode pad may be disposed on the bottom surface of the other mounting slot.

[0024] The first substrate electrode pad can be electrically coupled to the fifth substrate electrode pad, and the second substrate electrode pad can be electrically coupled to the sixth substrate electrode pad.

[0025] According to an embodiment of the present disclosure, a display module includes: a substrate; a first substrate electrode pad and a second substrate electrode pad disposed in a first groove of the substrate; an inorganic light-emitting diode disposed in the first groove and electrically connected to the first substrate electrode pad and the second substrate electrode pad; a third substrate electrode pad disposed on the substrate and electrically connected to the first substrate electrode pad; and a fourth substrate electrode pad disposed on the substrate and electrically connected to the second substrate electrode pad.

[0026] The third substrate electrode pad can be disposed on the upper surface of the substrate and extend along the sidewall of the first groove.

[0027] The third substrate electrode pad can be disposed on the upper surface of the substrate and can extend along the sidewall of the first groove and the sidewall of the second groove adjacent to the first groove.

[0028] The display module may also include an insulating layer disposed in the first slot between the inorganic light-emitting diode and the third substrate electrode pad.

[0029] The display module may also include gate electrode wiring disposed in a second slot adjacent to the first slot.

[0030] The display module may also include common electrode wiring disposed in a third slot adjacent to the first slot.

[0031] The third substrate electrode pad and the fourth substrate electrode pad can be disposed in the fourth slot adjacent to the second slot.

[0032] The display module may also include an insulator that fills the fourth slot and covers the third substrate electrode pads and the fourth substrate electrode pads. Attached Figure Description

[0033] Figure 1 This is a perspective view showing the display module according to an embodiment;

[0034] Figure 2 It is shown that, according to an embodiment Figure 1 A magnified view of the pixel area of ​​the display module shown;

[0035] Figure 3 According to the embodiments along Figure 2 The cross-sectional view taken by line AA is shown;

[0036] Figure 4 This is a view showing the faulty light-emitting device separated from the mounting groove of the substrate according to an embodiment;

[0037] Figure 5 This is a view showing the insulating layer that has been partially removed from the sidewalls of the mounting grooves on the substrate of the third and fourth substrate electrode pads according to an embodiment.

[0038] Figure 6 This is a view showing an example of inserting a light-emitting device for repair into a mounting slot according to an embodiment;

[0039] Figure 7 This is a view showing an auxiliary mounting groove adjacent to the mounting groove of the substrate according to an embodiment;

[0040] Figure 8 This is a view showing a pair of electrode pads formed in a mounting groove on a substrate according to an embodiment;

[0041] Figure 9 This is a perspective view showing a light-emitting device according to an embodiment;

[0042] Figure 10 This illustrates the mounting groove of the substrate according to an embodiment. Figure 9 The cross-sectional view of the light-emitting device shown; and

[0043] Figure 11 According to the embodiments along Figure 10 The cross-sectional view of line BB is shown. Detailed Implementation

[0044] Various embodiments of the present disclosure will be described in more detail herein with reference to the accompanying drawings. Various modifications may be made to the embodiments described herein. Specific embodiments are illustrated in the drawings and described in detail in the specification. However, the specific embodiments described in the drawings are merely to aid in understanding the various embodiments. Therefore, the various embodiments are not intended to limit the scope of the present disclosure to the specific embodiments and should be construed as including all modifications, equivalents, and / or substitutions of the embodiments.

[0045] Various elements may be described using ordinal terms such as first, second, etc., but these elements are not limited to the terms mentioned above. The terms mentioned above may be used only to distinguish one element from another. Furthermore, expressions such as "at least one of..." modify the entire list of elements when preceding it, rather than modifying individual elements within the list. For example, the expression "at least one of a, b, and c" should be understood to include only a, only b, only c, both a and b, both a and c, both b and c, or all of a, b, and c.

[0046] It should be understood that terms such as “comprising” or “including” are used herein to indicate the presence of features, quantities, steps, operations, elements, components, or combinations thereof, without excluding the possibility of the presence or addition of one or more other features, quantities, steps, operations, elements, components, or combinations thereof. When an element is indicated as “coupled to” or “connected to” another element, it can be understood that the element is directly coupled to or connected to the other element or through other elements. On the other hand, when an element is indicated as “directly coupled to” or “directly connected to” another element, it can be understood that there are no other elements between the element and the other element.

[0047] In this disclosure, the expression "same" can mean not only a perfect match, but also includes taking into account the difference in the degree of processing error range.

[0048] In addition, in describing this disclosure, detailed descriptions of relevant known technologies will be omitted or reduced where it is determined that such detailed descriptions may unnecessarily obscure the main points of this disclosure.

[0049] In this disclosure, the display module can be a flat panel display panel including microLEDs, which are light-emitting diodes less than or equal to 100 μm. Display modules including microLEDs can provide better contrast, response time, and energy efficiency than liquid crystal display (LCD) panels that require backlighting. MicroLEDs can be formed from inorganic materials and can be brighter, have better luminous efficiency, and longer lifespan than organic light-emitting diodes (OLEDs). A microLED can be a semiconductor chip capable of self-illumination when powered and exhibiting fast response speed, low power consumption, and high brightness. Specifically, microLEDs exhibit higher efficiency in converting electricity into photons compared to LCDs or OLEDs. That is, microLEDs have higher "brightness per watt" compared to LCD or OLED displays. Therefore, microLEDs can be configured to exhibit the same brightness with approximately half the energy compared to larger LEDs (width, height, and depth exceeding 100 μm) or OLEDs. Furthermore, microLEDs can achieve high resolution, superior color, contrast, and brightness, accurately reproduce a wide range of colors, and provide a clear screen even outdoors. In addition, micro LEDs formed from inorganic materials are resistant to burn-in and generate little heat, thus providing a longer lifespan.

[0050] Micro LEDs can be vertical micro LEDs, in which a pair of electrodes (anode and cathode) are respectively disposed on the light-emitting surface and the opposite surface of the light-emitting surface. Micro LEDs can also be flip-chip micro LEDs, in which a pair of electrodes are disposed on the opposite surface of the light-emitting surface.

[0051] The microLED may include a post with a magnetic layer to facilitate insertion into a mounting slot by a magnetic field applied during fluid self-assembly. The post may protrude a predetermined length from the luminescent surface of the microLED. The magnetic layer included in the post may include a diamagnetic material (e.g., Ge) or a material with magnetic field properties (e.g., Cr, Mn, Fe, Co, Ni, Cu).

[0052] The substrate may include multiple pixel regions arranged in a matrix on the front surface. Multiple sub-pixels disposed in a pixel region can form a pixel. For example, a pixel region may include three sub-pixels. The three sub-pixels may be formed by micro-LEDs capable of representing red (R), green (G), and blue (B) colors, respectively.

[0053] The substrate can be configured such that a TFT layer on which a thin-film transistor (TFT) circuit is formed is disposed on the front surface, and a circuit configured to provide power to the TFT circuit and be electrically coupled to a separate control substrate can be disposed on the rear surface.

[0054] The substrate can be formed with multiple mounting slots, into which multiple micro-LEDs are mounted. At the bottom of each mounting slot, a pair of substrate electrode pads can be provided, and at the sidewalls and surrounding portions of each mounting slot, a pair of substrate electrode pads for repairing faulty micro-LEDs can be formed.

[0055] The substrate may also include an auxiliary mounting slot for mounting a repair microLED when using a faulty microLED without removing it from the mounting slot. The auxiliary mounting slot may have a pair of substrate electrode pads at its bottom. The auxiliary mounting slot may be filled with insulating material up to a height corresponding to the front surface of the substrate. The repair microLED can be mounted in the auxiliary mounting slot after the insulating material is removed.

[0056] The mounting groove and auxiliary mounting groove of the substrate can each be formed to correspond to the shape of the micro LED (e.g., cube, cuboid, circle, ellipse, etc.).

[0057] Multiple side surface wirings can be formed in the edge region of the substrate and spaced apart from each other. These side surface wirings can be configured such that one end is electrically coupled to multiple first connection pads formed in the edge region of the front surface of the substrate, and the other end is electrically coupled to multiple second connection pads formed in the edge region of the rear surface of the substrate. The multiple first connection pads can be coupled to TFT circuitry disposed on the TFT layer via wiring, and the multiple second connection pads can be coupled to driving circuitry disposed on the rear surface of the substrate via wiring.

[0058] The display module can be configured to achieve a frameless display module by forming multiple side surface wirings, minimizing the dummy area on the front surface of the substrate, and maximizing the active area, thereby increasing the mounting density of micro-LEDs relative to the display module. Therefore, a frameless display module can provide a large-format display device by coupling multiple display modules together. In this case, each display module can be formed such that the spacing between pixels of adjacent display modules is maintained at the same level as the spacing between pixels in a single display module by minimizing the dummy area of ​​adjacent display modules. Therefore, seams can be prevented at the coupling portions between the display modules.

[0059] Side surface wiring can be formed in multiple lines at corresponding edge regions corresponding to the two facing sides of the substrate, with a certain distance between them. However, the embodiments are not limited to this, and side surface wiring can also be formed in multiple lines at corresponding edge regions corresponding to the two adjacent sides of the substrate, with a certain distance between them. Furthermore, side surface wiring can be formed in multiple lines at a certain distance only in a single edge region corresponding to one side, or it can be formed in multiple lines at a certain distance between edge regions corresponding to three sides.

[0060] This display module can be installed as a single unit and applied to wearable devices, portable devices, handheld devices, and electronic products that require various displays or electric fields. It can also be used as a matrix type in multiple assembly arrangements for display devices such as personal computer (PC) monitors, high-resolution televisions (TVs), signage (or digital signage), electronic displays, etc.

[0061] Figure 1 This is a perspective view showing a display module according to an embodiment. Figure 2 yes Figure 1 The enlarged view of the pixel area of ​​the display module shown, and Figure 3 It is along Figure 2 The cross-sectional view shown is taken from line AA.

[0062] refer to Figure 1 and Figure 3 According to the embodiment, the display module 1 may include a substrate 10 and a plurality of light-emitting devices 100 mounted on the substrate 10.

[0063] The TFT layer 30, including the TFT circuit, can be disposed on the front surface of the substrate 10. The driver integrated circuit (IC) for controlling the TFT circuit can be disposed on the rear surface of the substrate 10.

[0064] The front surface of substrate 10 may include an active area for displaying images and a dummy area for not displaying images. The active area may be divided into multiple pixel areas 31, and multiple pixels are respectively disposed in the multiple pixel areas 31. The dummy area may be included in the edge area of ​​substrate 10.

[0065] The TFT circuit and driver IC can be electrically coupled through multiple VIA wirings formed in multiple VIA holes through the substrate 10, or through multiple side surface wirings formed along the edge region of the substrate 10. For example, the substrate 10 can be a glass substrate or a synthetic resin substrate. When the substrate 10 is a synthetic resin substrate, the TFT circuit and driver IC can be electrically coupled through VIA wirings. Furthermore, it is more difficult to form VIA holes through a glass substrate than through a synthetic resin substrate. Therefore, when the substrate 10 is a glass substrate, the TFT circuit and driver IC can be electrically coupled through side surface wirings.

[0066] The pixel driving method of the display module 1 according to the embodiment can be an active matrix (AM) driving method or a passive matrix (PM) driving method. The display module 1 may include a pattern of wiring that electrically connects each micro-LED according to the AM driving method or the PM driving method.

[0067] refer to Figure 2 Each pixel region 31 may be provided with micro-LEDs 100, 120, and 140 that act as multiple sub-pixels. Micro-LED 100 may be configured to emit red light, micro-LED 120 may be configured to emit green light, and micro-LED 140 may be configured to emit blue light. These micro-LEDs are arranged in a pixel region to form a pixel. Although it has been described that three sub-pixels form a pixel, the embodiments are not limited to this, and for example, two sub-pixels emitting different colors may form a pixel, or four sub-pixels emitting different colors may form a pixel.

[0068] The display module 1 can be configured to mount multiple micro-LEDs via a fluid self-assembly method. For this purpose, multiple mounting slots 41 into which the multiple micro-LEDs can be inserted are provided on the TFT layer 30 of the substrate 10.

[0069] refer to Figure 2 and Figure 3 For a single pixel region, at least two or more mounting slots 41 can be formed. For example, the number of mounting slots 41 provided in a pixel region can correspond to the number of micro-LEDs provided in a pixel region. Figure 2 As shown, three mounting slots can be provided so that three miniature LEDs 100, 120 and 140 can be mounted in a pixel area 31.

[0070] The mounting groove 41 can be formed by an insulating layer 40 formed on the TFT layer 30. The insulating layer 40 can be formed of organic or inorganic materials. A protective film 43 can be provided on the insulating layer 40.

[0071] The mounting groove 41 can be formed at a predetermined depth. The microLED 100 inserted into the mounting groove 41 can be configured such that the post 115 of the microLED 100 protrudes beyond the mounting groove 41. For example, the post 115 can extend vertically beyond the upper surface of the insulating layer 40.

[0072] The mounting groove 41 can be configured such that the first substrate electrode pad 51 and the second substrate electrode pad 52 are disposed at its bottom. In this case, the bottom of the mounting groove 41 can be the top surface of the TFT layer 30.

[0073] The first substrate electrode pad 51 can be connected to the first chip electrode 111 of the micro LED 100. Solder balls or solder paste can be applied to the first substrate electrode pad 51 to form electrical and physical connections. Therefore, the first substrate electrode pad 51 can be configured such that the first chip electrode 111 of the micro LED 100 is electrically and physically coupled to the first substrate electrode pad 51 via solder balls or solder paste.

[0074] The second substrate electrode pad 52 can be connected to the second chip electrode 112 of the micro LED 100. The second substrate electrode pad 52 can be electrically and physically coupled to the second chip electrode 112 of the micro LED 100 using the same connection method as the first substrate electrode pad 51.

[0075] The first substrate electrode pad 51 can be electrically coupled to, for example, the gate electrode wiring 53 disposed on the TFT layer 30. In this case, the second substrate electrode pad 52 can be electrically coupled to the common electrode wiring 54 disposed on the TFT layer 30.

[0076] Third substrate electrode pads 60 and fourth substrate electrode pads 70 corresponding to each mounting slot 41 can be formed on the substrate 10, so that the micro-LEDs used for repair can be electrically coupled. The third substrate electrode pads 60 and fourth substrate electrode pads 70 can be substrate electrode pads used for repair.

[0077] The third substrate electrode pad 60 can be formed on the insulating layer 40. The third substrate electrode pad 60 can be configured such that a first portion 61 is electrically coupled to the gate electrode wiring 53, a second portion 62 is disposed in the periphery of the mounting groove 41, and a third portion 63 extends from the second portion 62 to the sidewall of the mounting groove 41.

[0078] The second portion 62 and the third portion 63 of the third substrate electrode pad 60 can be selectively used depending on the type or form of the micro-LED being repaired. For example, the location of the first chip electrode of the micro-LED being repaired can be taken into account when using the second portion 62 or the third portion 63 of the third substrate electrode pad 60.

[0079] Similar to the third substrate electrode pad 60, the fourth substrate electrode pad 70 can be formed on the insulating layer 40. In this case, the fourth substrate electrode pad 70 can be symmetrically arranged with respect to the third substrate electrode pad 60 based on the center of the mounting groove 41.

[0080] The fourth substrate electrode pad 70 can be configured such that a first portion 71 is electrically coupled to a common electrode wiring 54, a second portion 72 is disposed in the periphery of the mounting groove 41, and a third portion 73 extends from the second portion 72 to the sidewall of the mounting groove 41.

[0081] Similar to the third substrate electrode pad 60, the fourth substrate electrode pad 70 can be configured such that the second portion 72 and the third portion 73 can be selectively used depending on the type or form of the microLED being repaired. For example, the second portion 72 or the third portion 73 of the fourth substrate electrode pad 70 can be used depending on the location of the second chip electrode of the microLED being repaired.

[0082] The third substrate electrode pad 60 and the fourth substrate electrode pad 70 may be covered by an insulating layer 80 to prevent unwanted electrical coupling with another electronic device when not in use.

[0083] When using the third substrate electrode pad 60 and the fourth substrate electrode pad 70 to connect the micro-LED for repair to the substrate 10, a portion of the insulating layer 80 can be removed to expose a portion of the third substrate electrode pad 60 and the fourth substrate electrode pad 70.

[0084] The micro-LED 100 can be a flip-chip micro-LED, wherein a p-type semiconductor layer 101, an active layer 102, and an n-type semiconductor layer 103 are stacked sequentially, and a first chip electrode 111 and a second chip electrode 112 are disposed at opposite surfaces 105 of the light-emitting surface 104. However, the micro-LED 100 is not limited to a flip-chip micro-LED and can also be a vertical micro-LED.

[0085] The microLED 100 may include a pillar 115 having a magnetic layer 116 to facilitate insertion of the microLED into the mounting slot 41 by a magnetic field applied to the substrate 10 during fluid self-assembly.

[0086] The post 115 may protrude a predetermined length from the light-emitting surface 104 of the micro LED 100. The magnetic layer included in the post 115 may include a diamagnetic material (diamagnetic; for example, Ge) or a material with magnetic field properties (for example, Cr, Mn, Fe, Co, Ni, Cu).

[0087] The pillar 115 can be located on the light-emitting surface 104 and configured to be biased towards one side of the light-emitting surface 104, such as... Figure 3 As shown. Therefore, since the first chip electrode 111 corresponds to the first substrate electrode pad 51 and the second chip electrode 112 corresponds to the second substrate electrode pad 52 by magnetic field arrangement during fluid self-assembly, the microLED 100 can be inserted into the mounting groove 41. Furthermore, the microLED 100 can be configured such that the light-emitting surface 104 is prevented from being inserted into the mounting groove 41 with its orientation facing the bottom of the mounting groove 41 by the pillar 115.

[0088] The post 115 can be removed from the microLED 100 by a separate process performed after the microLED 100 is installed into the mounting slot 41.

[0089] After multiple micro-LEDs have been transferred to the substrate 10, a hot pressing process can be performed. In this case, a metal bonding state can be formed, wherein the first chip electrode 111 and the second chip electrode 112 are fused to the first substrate electrode pad 51 and the second substrate electrode pad 52 respectively by heat applied thereto.

[0090] The process of replacing (i.e., replacing) a faulty microLED with a microLED for repair will be described below.

[0091] Figure 4 This is a view showing the faulty light-emitting device separated from the mounting groove of the substrate. Figure 5 This is a view showing the insulating layer that has been removed from a portion of the additional electrode pads located on the side surface of the mounting groove on the substrate, and Figure 6 This is a view showing an example where the light-emitting element for repair has been inserted into the mounting slot.

[0092] After transferring multiple microLEDs to substrate 10 using a fluid self-assembly method, it is possible to determine whether the microLEDs 100 are faulty.

[0093] For example, an electroluminescence (EL) test can be performed while electricity is being supplied to the substrate 10 to check for faulty microLEDs. In this case, the faulty microLEDs will not emit light.

[0094] refer to Figure 4When the faulty microLED 100 is removed from the mounting slot 41, the first substrate electrode pad 51 and the second substrate electrode pad 52 can be forcibly separated from the first chip electrode 111 and the second chip electrode 112 of the faulty microLED 100. In this regard, the surfaces 51a of the first substrate electrode pad 51 and 52a of the second substrate electrode pad 52 may be damaged, as the first chip electrode 111 and the second chip electrode 112 were previously bonded to the first substrate electrode pad 51 and the second substrate electrode pad 52, such as... Figure 4 As shown. Therefore, the first substrate electrode pad 51 and the second substrate electrode pad 52 of the mounting slot 41 may not be reusable.

[0095] Once the faulty micro-LED 100 has been removed, pretreatment can be performed to install a high-quality micro-LED 100a for repair.

[0096] refer to Figure 5 This exposes the third portions 63 and 73 of the third substrate electrode pad 60 and the fourth substrate electrode pad 70. Therefore, the portion of the insulating layer 80 covering the third portions 63 and 73 of the third substrate electrode pad 60 and the fourth substrate electrode pad 70 can be removed.

[0097] refer to Figure 6 The micro LED 100a used for repair can have a predetermined length, and the first chip electrode 111a and the second chip electrode 112a can be disposed at both ends.

[0098] Before inserting the micro-LED 100a for repair into the mounting slot 41, solder paste 113a and 114a can be applied to the third portions 63 and 73 of the removed insulating layer 80 of the third substrate electrode pad 60 and the fourth substrate electrode pad 70.

[0099] The micro LED 100a for repair can be inserted into the mounting slot 41 and can be configured such that the first chip electrode 111a and the second chip electrode 111b are electrically coupled to the third substrate electrode pad 60 and the fourth substrate electrode pad 70 respectively via solder paste 113a and 114a.

[0100] As described above, by providing the third substrate electrode pad 60 and the fourth substrate electrode pad 70 on the sidewall and surrounding portion of the mounting groove 41, the micro LED 100a for repair can be easily mounted onto the substrate 10.

[0101] Depending on the positions of the first chip electrode 111a and the second chip electrode 111b of the microLED used for repair, the second portions 62 and 72 or the third portions 63 and 73 of the third substrate electrode pad 60 and the fourth substrate electrode pad 70 can be selectively used. For example, since the first chip electrode 111a is located at the side of the microLED and the second chip electrode 111b is located at the light-emitting surface of the microLED, the portion of the insulating layer 80 covering the third portion 63 of the third substrate electrode pad 60 and the second portion 72 of the fourth substrate electrode pad 70 can be used.

[0102] Figure 7 This is a view showing an auxiliary mounting groove formed in the insulating layer adjacent to the mounting groove.

[0103] A display module 1 used in a large-format display (e.g., TV) can be configured such that the area of ​​each pixel region is sufficiently larger than the area of ​​the plurality of sub-pixels. For example, the area of ​​a pixel region can be at least three times or more larger than the area of ​​the plurality of sub-pixels. For example, the area of ​​a pixel comprising three sub-pixels can be three times larger than the area of ​​the three sub-pixels.

[0104] In this case, additional mounting slots 42 corresponding to each mounting slot 41 can also be provided on the substrate 10. The additional mounting slots 42 can be configured to be spaced apart from the mounting slots 41. The additional mounting slots 42 can be formed in the insulating layer 40.

[0105] The additional mounting slot 42 can be configured such that the fifth substrate electrode pad 56 and the sixth substrate electrode pad 57 are disposed at the bottom of the additional mounting slot 42. In this case, the fifth substrate electrode pad 56 can be electrically coupled to the gate electrode wiring 53, and the sixth substrate electrode pad 57 can be electrically coupled to the common electrode wiring 54.

[0106] The additional mounting slot 42 may be filled with an insulator 47. The insulator 47 may be formed with a tip that corresponds approximately to the tip of the insulating layer 80. By filling the additional mounting slot 42 with the insulator 47, the microLED can be inserted into the mounting slot 41 without being inserted into the additional mounting slot 42 during initial fluid self-assembly.

[0107] The third substrate electrode pad 60 and the fourth substrate electrode pad 70 may have a symmetrical pattern based on the center of the mounting groove 41. However, the embodiments are not limited to this, and the third substrate electrode pad 60 and the fourth substrate electrode pad 70 may have an asymmetrical pattern based on the center of the mounting groove 41.

[0108] The following describes an example of a third and fourth substrate electrode pads asymmetrically positioned based on the center of the mounting slot.

[0109] Figure 8This is a view showing another example of a pair of electrode pads formed in a mounting groove on a substrate. Figure 9 It shows that it can be inserted into Figure 8 A perspective view of the light-emitting device in the mounting groove of the substrate shown. Figure 10 This shows the mounting slot that has been inserted into the substrate. Figure 9 A cross-sectional view of an example of a light-emitting device is shown, and Figure 11 It is along Figure 10 The cross-sectional view of line BB is shown.

[0110] refer to Figure 8 The mounting groove 141 formed on the substrate can be roughly circular.

[0111] The mounting groove 141 can be configured such that the first substrate electrode pad 151 and the second substrate electrode pad 152 are disposed at its bottom. In this case, the bottom of the mounting groove 141 can be the top surface of the TFT layer.

[0112] The surrounding portion of the mounting groove 141 may be provided with a third substrate electrode pad 162 and a fourth substrate electrode pad 172. In this case, the third substrate electrode pad 162 and the fourth substrate electrode pad 172 may be configured to form approximately a right angle. The third substrate electrode pad 162 may be electrically coupled to the gate electrode wiring of the TFT layer, and the fourth substrate electrode pad 172 may be electrically coupled to the common electrode wiring of the TFT layer.

[0113] refer to Figure 9 The micro-LED 200 for repair, which can be inserted into the mounting slot 141, can be generally formed in a circular shape. The micro-LED 200 for repair can be configured such that a first chip electrode 211 and a second chip electrode 212 are disposed on the light-emitting surface. For example, the first chip electrode 211 can be disposed at the center of the light-emitting surface, and the second chip electrode 212 can be disposed spaced apart from the first chip electrode 211 to surround a portion of the outer periphery of the first chip electrode 211.

[0114] The microLED 200 for repair can be configured such that a p-type semiconductor layer 201, an active layer 202, and an n-type semiconductor layer 203 are sequentially stacked. A first chip electrode 211 can be coupled to the n-type semiconductor layer 203, and a second chip electrode can be coupled to the p-type semiconductor layer 201. An insulator 214 electrically isolates the first chip electrode 211 and the second chip electrode 212 from each other.

[0115] The micro-LED 200 for repair can be configured such that the diameter of the post 215 is smaller than the diameter of the first chip electrode 211, and can be disposed on the first chip electrode 211. The post 215 may include a magnetic layer 216 formed of a diamagnetic material (diamagnetic; for example, Ge) or a material with magnetic field properties (for example, Cr, Mn, Fe, Co, Ni, Cu).

[0116] refer to Figure 10 and Figure 11 When the first substrate electrode pad 151a and the second substrate electrode pad 152a formed at the bottom of the mounting groove 141 are damaged during the removal of a faulty microLED mounted to the mounting groove 141, the third substrate electrode pad 162 and the fourth substrate electrode pad 172 disposed in the surrounding portion of the mounting groove 141 can be used to mount the microLED 200 for repair in the mounting groove 141. For example, the mounting groove 141 can be formed in an insulating layer 140 disposed on a TFT layer 130 disposed on a substrate 110. A protective film 143 can be disposed on the insulating layer 140.

[0117] The micro-LED 200 for repair can be inserted into the mounting slot 141, such that the first chip electrode 211 is electrically coupled to the third substrate electrode pad 162 via the first coupling wiring 166, and the second chip electrode 212 is electrically coupled to the fourth substrate electrode pad 172 via the second coupling wiring 176. The first coupling wiring 166 and the second coupling wiring 176 can be configured to form a right angle.

[0118] The third substrate electrode pad 162 and the fourth substrate electrode pad 172 can be covered by an insulating layer. The insulating layer can be removed when the micro-LED 200 for repair is to be placed.

[0119] The embodiments have been described separately and individually, but each embodiment need not be implemented separately, and the configuration and operation of each embodiment can be implemented in combination with at least one other embodiment.

[0120] Although embodiments have been specifically shown and described, it will be understood that various changes in form and detail may be made therein without departing from the spirit and scope of the claims.

[0121] Industry applicability

[0122] This disclosure relates to a display module manufactured by a fluid self-assembly method.

Claims

1. A display module, comprising: substrate; Multiple inorganic light-emitting diodes are disposed in multiple mounting slots formed in the substrate, and the multiple inorganic light-emitting diodes include inorganic light-emitting diodes having a first chip electrode and a second chip electrode; A first substrate electrode pad and a second substrate electrode pad are disposed on the bottom surface of a mounting groove in one of the plurality of mounting grooves. The first substrate electrode pad is electrically coupled to the first chip electrode, and the second substrate electrode pad is electrically coupled to the second chip electrode. The third and fourth substrate electrode pads are disposed around the mounting groove, and Protective film, stacked on the plurality of mounting slots; Wherein, the first substrate electrode pad and the third substrate electrode pad are separated from each other by the protective film, and The second substrate electrode pad and the fourth substrate electrode pad are separated from each other by the protective film.

2. The display module according to claim 1, wherein, At least one of the third substrate electrode pad and the fourth substrate electrode pad extends along the sidewall of the mounting groove.

3. The display module according to claim 1, wherein, The third substrate electrode pad and the fourth substrate electrode pad are arranged symmetrically with respect to the center of the mounting groove.

4. The display module according to claim 1, wherein, The third substrate electrode pad and the fourth substrate electrode pad are arranged asymmetrically with respect to the center of the mounting groove.

5. The display module according to claim 1, wherein, The substrate includes an insulating layer disposed on the third substrate electrode pad and the fourth substrate electrode pad.

6. The display module according to claim 1, wherein, The third substrate electrode pad is electrically coupled to the first chip electrode through a first conductor, and The fourth substrate electrode pad is electrically coupled to the second chip electrode of the inorganic light-emitting diode through a second conductor.

7. The display module according to claim 1, wherein, The pillar is disposed on the light-emitting surface of the inorganic light-emitting diode, and The column includes a magnetic layer.

8. The display module according to claim 7, wherein, The magnetic layer is formed of germanium (Ge).

9. The display module according to claim 7, wherein, The column is offset from the center of the luminescent surface.

10. The display module according to claim 9, wherein, The post is positioned at a location corresponding to one of the first chip electrode and the second chip electrode.

11. The display module according to claim 1, wherein, The plurality of mounting slots includes another mounting slot adjacent to the mounting slot.

12. The display module according to claim 11, further comprising a fifth substrate electrode pad and a sixth substrate electrode pad disposed on the bottom surface of the other mounting groove. in, The first substrate electrode pad is electrically coupled to the fifth substrate electrode pad, and The second substrate electrode pad is electrically coupled to the sixth substrate electrode pad.

13. A display module, comprising: substrate; A thin-film transistor (TFT) layer is disposed on the substrate; Multiple mounting slots are disposed in the TFT layer; Multiple inorganic light-emitting diodes are disposed in the multiple mounting slots, and the multiple inorganic light-emitting diodes include inorganic light-emitting diodes having a first chip electrode and a second chip electrode; A first substrate electrode pad and a second substrate electrode pad are disposed on the bottom surface of a mounting groove in one of the plurality of mounting grooves. The first substrate electrode pad is electrically coupled to the first chip electrode, and the second substrate electrode pad is electrically coupled to the second chip electrode. The third and fourth substrate electrode pads are disposed on the sidewall of the mounting groove, and Protective film, stacked on the plurality of mounting slots; The first substrate electrode pad and the third substrate electrode pad are electrically coupled to the first electrode wiring disposed on the TFT layer. The second substrate electrode pad and the fourth substrate electrode pad are electrically coupled to the second electrode wiring disposed on the TFT layer. Wherein, the first substrate electrode pad and the third substrate electrode pad are separated from each other by the protective film, and The second substrate electrode pad and the fourth substrate electrode pad are separated from each other by the protective film.

14. The display module according to claim 13 further includes an insulating layer covering the third substrate electrode pad and the fourth substrate electrode pad.

15. The display module according to claim 13, wherein, Another mounting slot in the plurality of mounting slots is adjacent to the mounting slot, and The fifth substrate electrode pad and the sixth substrate electrode pad are disposed on the bottom surface of the other mounting groove.

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