Electronic device including an antenna and a partition

Abstract

An electronic device including an antenna and a split portion is provided. The electronic device includes a conductive case, a printed circuit board disposed in an inner space of the conductive case and including a wireless communication module, a conductive plate on which the printed circuit board is disposed, a split portion for splitting at least a portion of the conductive case, an opening disposed between the conductive case and the conductive plate, an antenna formed via the split portion and the opening, and a non-conductive member for filling at least a portion of the split portion and the opening. A distance between end surfaces of the antenna and the conductive plate facing each other is configured to vary.

Description

Technical Field

[0001] Various embodiments of this disclosure relate to electronic devices including antennas and segmented sections. Background Technology

[0002] The use of portable electronic devices, such as smartphones, is increasing, and these devices are being given a variety of functions.

[0003] Electronic devices can send telephone calls and various data to another electronic device via wireless communication, and receive telephone calls and various data from another electronic device.

[0004] An electronic device may include at least one antenna to enable wireless communication with another electronic device. Summary of the Invention

[0005] Technical issues

[0006] In electronic devices such as smartphones, at least a portion of the housing that forms the external shape may include a conductive material (e.g., metal).

[0007] At least a portion of the housing, including a conductive material, can be used as an antenna radiator for performing wireless communication. For example, the housing can be divided by at least one segment (e.g., a slit) to serve as multiple antennas.

[0008] At least a portion of the housing (e.g., side member) used as an antenna should be spaced at a predetermined distance from the conductive plate (e.g., bracket or support member) inside the electronic device to ensure antenna performance.

[0009] The end faces between at least a portion of the housing and the conductive plate can be formed into a symmetrical structure, and the radiation loss may increase as the distance between the end faces decreases.

[0010] To ensure the antenna performance of the electronic device, the device may be susceptible to external impacts when multiple segments are formed in the housing.

[0011] Various embodiments of this disclosure can provide an electronic device that maintains the radiation performance of an antenna while maintaining the rigidity of the housing.

[0012] Solution to the problem

[0013] According to one aspect of this disclosure, an electronic device is provided. The electronic device includes: a conductive housing; a printed circuit board disposed within the interior space of the conductive housing and including a wireless communication module; a conductive plate with the printed circuit board disposed thereon; a partition configured to separate at least a portion of the conductive housing; an opening disposed between the conductive housing and the conductive plate; an antenna formed through the partition and the opening; and a non-conductive member configured to fill at least a portion of the opening and the partition, wherein the distance between the opposing surfaces of the end face of the antenna and the end face of the conductive plate can be configured to vary.

[0014] According to another aspect of this disclosure, an electronic device is provided. The electronic device includes: a conductive housing; a partition configured to separate at least a portion of the conductive housing; an opening disposed between the conductive housing and a conductive plate; an antenna formed through the partition and the opening; a non-conductive member configured to fill at least a portion of the opening and the partition; a display disposed on a first surface of the conductive plate; a printed circuit board disposed on a second surface of the conductive plate and including a wireless communication module; and a rear plate configured to cover the rear surface of the printed circuit board, wherein the distance between the opposing surfaces of the end faces of the antenna and the end faces of the conductive plate can be configured to vary.

[0015] Beneficial effects of the invention

[0016] According to various embodiments of this disclosure, by making the distance between the facing surfaces of the antenna and the conductive plate (e.g., bracket or support member) disposed adjacent to the partition formed in the side of the housing non-constant and reducing the area in which the antenna and the conductive plate face each other, an electronic device that maintains the radiation performance of the antenna while maintaining the rigidity of the housing can be provided. Attached Figure Description

[0017] Figure 1 This is a block diagram of an electronic device in a network environment according to an embodiment of the present disclosure;

[0018] Figure 2a This is a perspective view showing the front surface of an electronic device according to an embodiment of the present disclosure;

[0019] Figure 2b This illustrates an embodiment according to the present disclosure. Figure 2a A perspective view of the rear surface of the electronic device;

[0020] Figure 3 This is an exploded perspective view showing an electronic device according to an embodiment of the present disclosure;

[0021] Figure 4 This is a schematic diagram illustrating a partial structure of an electronic device including an antenna and a segment according to an embodiment of the present disclosure;

[0022] Figure 5 This is an illustrative representation of an embodiment according to the present disclosure. Figure 4 An enlarged view of part A;

[0023] Figure 6 This is an illustrative representation of an embodiment according to the present disclosure. Figure 4 A cross-sectional view of a partial structure of the electronic device shown;

[0024] Figure 7 This is a cross-sectional view schematically illustrating the construction of an embodiment of the antenna end face and the conductive plate end face of an electronic device according to an embodiment of the present disclosure.

[0025] Figure 8 This is a cross-sectional view schematically illustrating the construction of the end face of the antenna and the end face of the conductive plate of an electronic device according to one embodiment of the present disclosure, and another embodiment thereof.

[0026] Figure 9 This is a cross-sectional view schematically illustrating the construction of the end face of the antenna and the end face of the conductive plate of an electronic device according to one embodiment of the present disclosure, and another embodiment thereof.

[0027] Figure 10 This is a cross-sectional view schematically illustrating the construction of the end face of the antenna and the end face of the conductive plate of an electronic device according to one embodiment of the present disclosure, and another embodiment thereof.

[0028] Figure 11a and Figure 11b These are diagrams illustrating the electric field distribution of an electronic device according to a comparative embodiment and the electric field distribution of an electronic device according to various embodiments of the present disclosure; and

[0029] Figure 12 It is a graph comparing the radiation efficiency of an electronic device according to a comparative embodiment and the radiation efficiency of an electronic device according to an embodiment of the present disclosure. Detailed Implementation

[0030] Figure 1 This is a block diagram illustrating an electronic device 101 in a network environment 100 according to an embodiment of the present disclosure. (Refer to...) Figure 1In network environment 100, electronic device 101 can communicate with electronic device 102 via a first network 198 (e.g., a short-range wireless communication network), or with electronic device 104 or server 108 via a second network 199 (e.g., a long-range wireless communication network). According to an embodiment, electronic device 101 can communicate with electronic device 104 via server 108. According to an embodiment, electronic device 101 may include a processor 120, memory 130, input module 150, sound output module 155, display module 160, audio module 170, sensor module 176, interface 177, haptic module 179, camera module 180, power management module 188, battery 189, communication module 190, user identification module (SIM) 196, or antenna module 197. In some embodiments, at least one of these components (e.g., display module 160 or camera module 180) may be omitted from electronic device 101, or one or more other components may be added to electronic device 101. In some embodiments, some of the components may be implemented as a single integrated circuit. For example, the sensor module 176 (e.g., a fingerprint sensor, an iris sensor, or an illuminance sensor) may be implemented as embedded in the display module 160 (e.g., a display).

[0031] Processor 120 may run software (e.g., program 140) to control at least one other component (e.g., hardware or software component) of electronic device 101 connected to processor 120, and may perform various data processing or calculations. According to one embodiment, as at least part of the data processing or calculation, processor 120 may load commands or data received from another component (e.g., sensor module 176 or communication module 190) into volatile memory 132, process the commands or data stored in volatile memory 132, and store the resulting data in non-volatile memory 134. According to an embodiment, processor 120 may include a main processor 121 (e.g., central processing unit (CPU) or application processor (AP)) and an auxiliary processor 123 (e.g., graphics processing unit (GPU), image signal processor (ISP), sensor hub processor, or communication processor (CP)) that is operationally independent of or combined with the main processor 121. Additionally or alternatively, auxiliary processor 123 may be adapted to consume less power than main processor 121, or adapted for a specific function. The auxiliary processor 123 can be implemented separately from the main processor 121, or it can be implemented as part of the main processor 121.

[0032] When the main processor 121 is inactive (e.g., in sleep) state, the auxiliary processor 123 (rather than the main processor 121) can control at least some of the functions or states associated with at least one component of the electronic device 101 (e.g., display module 160, sensor module 176, or communication module 190), or when the main processor 121 is active (e.g., running an application), the auxiliary processor 123 can work with the main processor 121 to control at least some of the functions or states associated with at least one component of the electronic device 101 (e.g., display module 160, sensor module 176, or communication module 190). According to one embodiment, the auxiliary processor 123 (e.g., an image signal processor or a communication processor) may be implemented as part of another component (e.g., camera module 180 or communication module 190) functionally associated with the auxiliary processor 123. According to one embodiment, the auxiliary processor 123 (e.g., a neural processing unit) may include hardware structures specified for processing artificial intelligence models. The artificial intelligence models can be generated through machine learning. Such learning can be performed, for example, by an electronic device 101 performing artificial intelligence or via a separate server (e.g., server 108). The learning algorithm can include, but is not limited to, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning. The artificial intelligence model can include multiple layers of artificial neural networks. The artificial neural network can be a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of these, but is not limited thereto. In addition to the hardware architecture, the artificial intelligence model can (additionally or optionally) include a software architecture.

[0033] Memory 130 may store various data used by at least one component of electronic device 101 (e.g., processor 120 or sensor module 176). The various data may include, for example, software (e.g., program 140) and input or output data for commands associated with it. Memory 130 may include volatile memory 132 or non-volatile memory 134.

[0034] The program 140 may be stored as software in the memory 130, and the program 140 may include, for example, an operating system (OS) 142, middleware 144, or application 146.

[0035] Input module 150 can receive commands or data from outside the electronic device 101 (e.g., a user) that will be used by other components of the electronic device 101 (e.g., processor 120). Input module 150 may include, for example, a microphone, mouse, or keyboard.

[0036] The sound output module 155 can output sound signals to the outside of the electronic device 101. The sound output module 155 may include, for example, a speaker or a receiver. The speaker can be used for general purposes such as playing multimedia or playing records, and the receiver can be used for incoming calls. According to an embodiment, the receiver may be implemented separately from the speaker or as part of the speaker.

[0037] Display module 160 can visually provide information to the outside of electronic device 101 (e.g., to a user). Display module 160 may include, for example, a display, a holographic device, or a projector, and control circuitry for controlling a respective one of the display, holographic device, and projector. According to an embodiment, display module 160 may include touch circuitry adapted to detect touch or sensor circuitry (e.g., a pressure sensor) adapted to measure the intensity of the force caused by touch.

[0038] The audio module 170 can convert sound into electrical signals and vice versa. According to an embodiment, the audio module 170 can obtain sound via the input module 150, or output sound via the sound output module 155 or headphones of an external electronic device (e.g., electronic device 102) that is directly (e.g., wired) or wirelessly connected to the electronic device 101.

[0039] Sensor module 176 can detect the operating state of electronic device 101 (e.g., power or temperature) or the environmental state outside electronic device 101 (e.g., user state), and then generate an electrical signal or data value corresponding to the detected state. According to embodiments, sensor module 176 may include, for example, a gesture sensor, gyroscope sensor, atmospheric pressure sensor, magnetic sensor, accelerometer, grip sensor, proximity sensor, color sensor, infrared (IR) sensor, biometric sensor, temperature sensor, humidity sensor, or illuminance sensor.

[0040] Interface 177 may support one or more specific protocols used to enable electronic device 101 to connect directly (e.g., wired) or wirelessly to external electronic devices (e.g., electronic device 102). According to embodiments, interface 177 may include, for example, a High Definition Multimedia Interface (HDMI), a Universal Serial Bus (USB) interface, a Secure Digital Card (SD) interface, or an audio interface.

[0041] Connection end 178 may include a connector, through which electronic device 101 can be physically connected to an external electronic device (e.g., electronic device 102). According to embodiments, connection end 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0042] The tactile module 179 can convert electrical signals into mechanical stimuli (e.g., vibration or motion) or electrical stimuli that can be recognized by a user through his touch or kinesthesia. According to embodiments, the tactile module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulator.

[0043] Camera module 180 can capture still or moving images. According to an embodiment, camera module 180 may include one or more lenses, an image sensor, an image signal processor, or a flash.

[0044] The power management module 188 manages the power supply to the electronic device 101. According to an embodiment, the power management module 188 may be implemented as at least part of, for example, a power management integrated circuit (PMIC).

[0045] Battery 189 can power at least one component of electronic device 101. According to an embodiment, battery 189 may include, for example, a non-rechargeable primary battery, a rechargeable rechargeable battery, or a fuel cell.

[0046] Communication module 190 can support the establishment of a direct (e.g., wired) or wireless communication channel between electronic device 101 and external electronic devices (e.g., electronic device 102, electronic device 104, or server 108), and perform communication via the established communication channel. Communication module 190 may include one or more communication processors capable of operating independently of processor 120 (e.g., application processor (AP)) and support direct (e.g., wired) or wireless communication. According to embodiments, communication module 190 may include wireless communication module 192 (e.g., cellular communication module, short-range wireless communication module, or Global Navigation Satellite System (GNSS) communication module) or wired communication module 194 (e.g., local area network (LAN) communication module or power line communication (PLC) module). One of these communication modules can communicate with an external electronic device via a first network 198 (e.g., a short-range communication network such as Bluetooth, Wi-Fi Direct, or Infrared Data Association (IrDA)) or a second network 199 (e.g., a long-range communication network such as a traditional cellular network, a fifth-generation (5G) network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or a wide area network (WAN))). These various types of communication modules can be implemented as a single component (e.g., a single chip) or as multiple components separate from each other (e.g., multiple chips). The wireless communication module 192 can identify and verify the electronic device 101 in the communication network (such as the first network 198 or the second network 199) using user information (e.g., the International Mobile Subscriber Identity (IMSI)) stored in the user identification module 196.

[0047] Wireless communication module 192 can support 5G networks beyond fourth-generation (4G) networks and next-generation communication technologies, such as new radio (NR) access technologies. NR access technologies can support enhanced mobile broadband (eMBB), massive machine-type communications (mMTC), or ultra-reliable low-latency communications (URLLC). Wireless communication module 192 can support high-frequency bands (e.g., millimeter-wave bands) to achieve, for example, high data transmission rates. Wireless communication module 192 can support various technologies used to ensure performance in high-frequency bands, such as, for example, beamforming, massive MIMO, full-dimensional MIMO (FD-MIMO), array antennas, analog beamforming, or massive antennas. Wireless communication module 192 can support various requirements specified in electronic device 101, external electronic devices (e.g., electronic device 104), or network systems (e.g., second network 199). According to one embodiment, the wireless communication module 192 may support peak data rates (e.g., 20 Gbps or higher) for implementing eMBB, lost coverage (e.g., 164 dB or lower) for implementing mMTC, or U-plane latency (e.g., 0.5 ms or less for each of the downlink (DL) and uplink (UL), or 1 ms or less round trip) for implementing URLLC.

[0048] Antenna module 197 can transmit or receive signals or power to or from the outside of electronic device 101 (e.g., external electronic device). According to one embodiment, antenna module 197 may include an antenna comprising a radiating element composed of conductive material or conductive patterns formed in or on a substrate (e.g., a printed circuit board (PCB)). According to one embodiment, antenna module 197 may include multiple antennas (e.g., an array antenna). In such a case, at least one antenna suitable for a communication scheme used in a communication network (such as a first network 198 or a second network 199) can be selected, for example, by communication module 190 (e.g., wireless communication module 192) from the multiple antennas. Signals or power can then be transmitted or received between communication module 190 and external electronic device via the selected at least one antenna. According to one embodiment, additional components besides the radiating element (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as part of antenna module 197.

[0049] Antenna module 197 can transmit or receive signals or power to or from the outside of electronic device 101 (e.g., external electronic device). According to embodiments, antenna module 197 may include one or more antennas, and therefore, at least one antenna suitable for a communication scheme used in a communication network (such as a first network 198 or a second network 199) can be selected by, for example, communication module 190 (e.g., wireless communication module 192). Signals or power can then be transmitted or received between communication module 190 and external electronic device via the selected at least one antenna.

[0050] At least some of the aforementioned components can be interconnected and communicate signals (e.g., commands or data) between them via an inter-peripheral communication scheme (e.g., bus, general purpose input / output (GPIO), serial peripheral interface (SPI), or mobile industrial processor interface (MIPI)).

[0051] According to an embodiment, commands or data can be sent or received between electronic device 101 and external electronic device 104 via server 108 connected to a second network 199. Each of electronic device 102 and electronic device 104 can be a device of the same type as electronic device 101, or a device of a different type. According to an embodiment, all or some operations that would be performed on electronic device 101 can be performed on one or more of external electronic devices 102, external electronic devices 104, or server 108. For example, if electronic device 101 is required to automatically perform a function or service, or is required to perform a function or service in response to a request from a user or another device, electronic device 101 may request the one or more external electronic devices to perform at least a portion of the function or service, instead of running the function or service, or electronic device 101 may request the one or more external electronic devices to perform at least a portion of the function or service in addition to running the function or service. Upon receiving the request, the one or more external electronic devices may perform at least a portion of the requested function or service, or perform additional functions or services related to the request, and transmit the result of the execution to electronic device 101. Electronic device 101 may provide the result as at least a partial response to the request, either with further processing or without further processing. For this purpose, technologies such as cloud computing, distributed computing, or client-server computing may be used.

[0052] Figure 2a This is a perspective view showing the front surface of an electronic device according to an embodiment of the present disclosure. Figure 2b This illustrates an embodiment according to the present disclosure. Figure 2aA perspective view of the rear surface of the electronic device.

[0053] Reference Figure 2a and Figure 2b An electronic device 200 according to one embodiment may include a housing 210, the housing 210 including a first surface (or front surface) 210A, a second surface (or rear surface) 210B, and a side surface 210C surrounding the space between the first surface 210A and the second surface 210B. In another embodiment (not shown), the housing may represent a structure formed on... Figure 2a and Figure 2b The diagram shows a portion of the structure of a first surface 210A, a second surface 210B, and a side surface 210C. According to one embodiment, the first surface 210A may be formed from a front panel 202, at least a portion of which is substantially transparent (e.g., a glass or polymer panel including various coatings). The second surface 210B may be formed from a substantially opaque rear panel 211. The rear panel 211 may be made of coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the above materials. The side surface 210C may be formed from a side frame structure (or “side member”) 218 ​​that connects the front panel 202 and the rear panel 211 and includes metal and / or polymer. In some embodiments, the rear panel 211 and the side frame structure 218 may be integrally formed and may include the same material (e.g., a metallic material such as aluminum).

[0054] In the illustrated embodiment, the front panel 202 may include two first regions 210D at both ends of the long side of the front panel 202, such that the two first regions 210D bend from the first surface 210A toward the rear panel 211 and extend seamlessly. In the illustrated embodiment (see...) Figure 2b In the device 202, the rear panel 211 may include two second regions 210E at both ends of its long side, such that the two second regions 210E bend from the second surface 210B toward the front panel 202 and extend seamlessly. In some embodiments, the front panel 202 (or the rear panel 211) may include only one of the first region 210D (or the second region 210E). In another embodiment, a portion of the first region 210D or the second region 210E may not be included. In the above embodiments, when viewed from the side surface of the electronic device 200, the side frame structure 218 may have a first thickness (or width) on the portion of the side surface that does not include the first region 210D or the second region 210E as described above, and may have a second thickness less than the first thickness on the portion of the side surface that includes the first region 210D or the second region 210E.

[0055] According to one embodiment, the electronic device 200 may include at least one of the following: a display 201, audio modules 203, 207 and 214, sensor modules 204, 216 and 219, camera modules 205, 212 and 213, a key input device 217, a light-emitting element 206, and connector holes 208 and 209. In some embodiments, at least one component of the electronic device 200 (e.g., the key input device 217 or the light-emitting element 206) may be omitted, or the electronic device 200 may additionally include other components.

[0056] For example, the display 201 may be exposed through a corresponding portion of the front panel 202. In some embodiments, at least a portion of the display 201 may be exposed through the front panel 202, which forms a first region 210D of the side surface 210C and a first surface 210A. In some embodiments, the display 201 may have corners formed with a shape substantially the same as the shape of the adjacent outer periphery of the front panel 202. In another embodiment (not shown), to increase the exposed area of ​​the display 201, the spacing between the outer periphery of the display 201 and the outer periphery of the front panel 202 may be formed to be substantially the same.

[0057] In another embodiment (not shown), a recess or opening may be formed in a portion of the screen display area of ​​the display 201, and at least one of the audio module 214, sensor module 204, camera module 205, and light-emitting element 206 may be included in and aligned with the recess or opening. In another embodiment (not shown), at least one of the audio module 214, sensor module 204, camera module 205, fingerprint sensor 216, and light-emitting element 206 may be included on the rear surface of the screen display area of ​​the display 201. In another embodiment (not shown), the display 201 may be coupled to, or arranged adjacent to, a touch sensing circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and / or a digital converter capable of detecting a magnetic field type stylus. In some embodiments, at least a portion of the sensor modules 204 and 219 and / or at least a portion of the key input device 217 may be arranged in a first region 210D and / or a second region 210E.

[0058] Audio modules 203, 207, and 214 may include a microphone hole 203 and speaker holes 207 and 214. A microphone for acquiring external sound may be arranged in the microphone hole 203, and in some embodiments, multiple microphones may be arranged therein to enable the sensing of the direction of sound. Speaker holes 207 and 214 may include an external speaker hole 207 and a voice receiver hole 214. In some embodiments, speaker holes 207 and 214 and microphone hole 203 may be implemented as a single hole, or may include a speaker (e.g., a piezoelectric speaker) without speaker holes 207 and 214.

[0059] Sensor modules 204, 216, and 219 can generate electrical signals or data values ​​corresponding to the internal operating conditions of the electronic device 200 or its external environmental conditions. Sensor modules 204, 216, and 219 may include, for example, a first sensor module 204 (e.g., a proximity sensor) and / or a second sensor module (not shown) (e.g., a fingerprint sensor) disposed on a first surface 210A of the housing 210 and / or a third sensor module 219 (e.g., an HRM sensor) and / or a fourth sensor module 216 (e.g., a fingerprint sensor) disposed on a second surface 210B of the housing 210. The fingerprint sensor may be disposed not only on the first surface 210A of the housing 210 (e.g., a display 201) but also on its second surface 210B. The electronic device 200 may also include sensor modules not shown, such as at least one of a gesture sensor, gyroscope sensor, atmospheric pressure sensor, magnetic sensor, accelerometer, grip sensor, color sensor, infrared (IR) sensor, biometric sensor, temperature sensor, humidity sensor, or illuminance sensor 204.

[0060] Camera modules 205, 212, and 213 may include a first camera device 205 disposed on a first surface 210A of the electronic device 200, a second camera device 212 disposed on a second surface 210B thereon, and / or a flash 213. Camera devices 205 and 212 may include a single lens or multiple lenses, an image sensor, and / or an image signal processor. The flash 213 may include, for example, a light-emitting diode or a xenon lamp. In some embodiments, two or more lenses (infrared camera, wide-angle lens, and telephoto lens) and an image sensor may be disposed on a single surface of the electronic device 200.

[0061] Key input device 217 may be disposed on side surface 210C of housing 210. In another embodiment, electronic device 200 may not include some or all of the key input device 217 described above, and the key input device 217 (not included) may be implemented on display 201 in another type (such as soft keys). In some embodiments, key input device may include sensor module 216 disposed on second surface 210B of housing 210.

[0062] The light-emitting element 206 may, for example, be disposed on the first surface 210A of the housing 210. The light-emitting element 206 may, for example, provide information about the status of the electronic device 200 in terms of light type. In another embodiment, the light-emitting element 206 may, for example, provide a light source that interacts with the operation of the camera module 205. The light-emitting element 206 may include, for example, LEDs, IR LEDs, and xenon lamps.

[0063] Connector holes 208 and 209 may include a first connector hole 208 and / or a second connector hole (e.g., a headphone jack) 209, wherein the first connector hole 208 is capable of accommodating a connector (e.g., a USB connector) for sending power and / or data to / receiving power and / or data from an external electronic device, and the second connector hole 209 is capable of accommodating a connector for sending audio signals to / receiving audio signals from an external electronic device.

[0064] Figure 3 This is an exploded perspective view showing an electronic device according to an embodiment of the present disclosure.

[0065] Reference Figure 3 The electronic device 300 may include a side bezel structure 310, a first support member 311 (e.g., a bracket), a front panel 320, a display 330, a printed circuit board 340, a battery 350, a second support member 360 (e.g., a rear cover), an antenna 370, and a rear panel 380. In some embodiments, at least one of the components of the electronic device 300 (e.g., the first support member 311 or the second support member 360) may be omitted, or the electronic device 300 may also include other components. At least one of the components of the electronic device 300 may be combined with... Figure 1 , Figure 2a and Figure 2b At least one of the constituent elements of the electronic device 101 or 200 is the same or similar, and repeated descriptions thereof will be omitted here.

[0066] The first support member 311 may be disposed inside the electronic device 300 and connected to the side bezel structure 310, or may be integrally formed with the side bezel structure 310. The first support member 311 may be made of, for example, metallic and / or non-metallic (e.g., polymer) materials. The display 330 may be coupled to one surface of the first support member 311, and the printed circuit board 340 may be coupled to its other surface. A processor, memory, and / or interface may be mounted on the printed circuit board 340. The processor may include one or more of, for example, a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor central processor, or a communication processor.

[0067] The memory may include, for example, volatile memory or non-volatile memory.

[0068] The interface may include, for example, a High Definition Multimedia Interface (HDMI), a Universal Serial Bus (USB) interface, an SD card interface, and / or an audio interface. This interface may, for example, electrically or physically connect the electronic device 300 to an external electronic device, and may include a USB connector, an SD card / MMC connector, or an audio connector.

[0069] Battery 350 is a means for supplying power to at least one component of electronic device 300, and may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. At least a portion of battery 350 may be arranged, for example, on a plane substantially the same as printed circuit board 340. Battery 350 may be integrally arranged within electronic device 300, or may be arranged such that it can be attached to / removed from electronic device 300.

[0070] Antenna 370 may be disposed between rear panel 380 and battery 350. Antenna 370 may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and / or a magnetically secure transmission (MST) antenna. For example, antenna 370 may perform near field communication with an external device or may wirelessly send / receive power required for charging. In another embodiment, the antenna structure may be formed by a portion or combination of side frame structure 310 and / or first support member 311.

[0071] The electronic device according to various embodiments can be one of a variety of types of electronic devices. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. According to embodiments of this disclosure, the electronic device is not limited to those described above.

[0072] It should be understood that the various embodiments of this disclosure and the terminology used therein are not intended to limit the technical features set forth herein to the specific embodiments, but rather to include various changes, equivalents, or substitutions to the respective embodiments. In the description of the drawings, similar reference numerals may be used to refer to similar or related elements. It will be understood that nouns in the singular form corresponding to terms may include one or more things unless the relevant context clearly indicates otherwise. As used herein, each of the phrases such as “A or B,” “at least one of A and B,” “at least one of A or B,” “A, B, or C,” “at least one of A, B, and C,” and “at least one of A, B, or C” may include all possible combinations of the items enumerated together with the corresponding phrase among the plurality of phrases. As used herein, terms such as “first” and “second” or “first” and “second” may be used to simply distinguish one component from another and do not limit the components in other respects (e.g., importance or order). It will be understood that, whether the terms “operably” or “communically” are used or not, if an element (e.g., a first element) is referred to as “combined with another element (e.g., a second element),” “combined to another element (e.g., a second element),” “connected to another element (e.g., a second element),” or “attached to another element (e.g., a second element)”, it means that the first element can be directly (e.g., wiredly) connected to the second element, wirelessly connected to the second element, or connected to the second element via a third element.

[0073] As used herein, the term "module" can include a unit implemented in hardware, software, or firmware, and is used interchangeably with other terms (e.g., "logic," "logic block," "part," or "circuit"). A module can be a single integrated component adapted to perform one or more functions, or the smallest unit or part of such a single integrated component. For example, according to embodiments of this disclosure, a module can be implemented in the form of an application-specific integrated circuit (ASIC).

[0074] Figure 4 This is a schematic diagram illustrating a partial structure of an electronic device including an antenna and a segment according to an embodiment of the present disclosure. Figure 5 This illustrates an embodiment according to the present disclosure. Figure 4 An enlarged view of part A.

[0075] Figure 4 The electronic device 400 may include via Figure 1 Electronic device 101 Figure 2a and Figure 2b Electronic devices 200 and / or Figure 3 The electronic device 300 describes the components.

[0076] Reference Figure 4 The electronic device 400 according to various embodiments of the present disclosure may include a front panel (e.g., Figure 2a Front panel 202 or Figure 3 The front panel 320 (not shown), and the rear panel facing the opposite direction to the front panel (e.g., Figure 2b The back panel 211 or Figure 3 The rear panel 380 (not shown), and the side members 405 surrounding the internal space between the front panel and the rear panel.

[0077] According to one embodiment, the side member 405 may constitute the housing of the electronic device 400 (e.g., Figure 2a The housing 210). Side member 405 may include Figure 2a Side member 218 or Figure 3 Side member 310.

[0078] According to one embodiment, the side member 405 (e.g., a conductive housing) may be at least partially made of a conductive material (e.g., a metal). At least a portion of the side member 405 may serve as an antenna radiator. The side member 405 may be a side frame structure comprising metal (e.g., aluminum or aluminum alloy) and / or polymer (e.g., Figure 2a Side frame structure 218 or Figure 3 The side frame structure 310 is formed. The side member 405 can be manufactured by die casting and includes a conductive material such as aluminum.

[0079] According to one embodiment, the side member 405 (e.g., a conductive housing) may include: a first antenna 410 having a first length; a second antenna 420 extending vertically from the first antenna 410 and having a second length longer than the first length; a third antenna 430 extending from the second antenna 420 in a direction substantially parallel to the first antenna 410 and having a length substantially the same as the first length; a fourth antenna 440 extending from the third antenna 430 in a direction substantially parallel to the second antenna 420 and having a length substantially the same as the second length; and / or a fifth antenna 450 extending partially parallel to the first antenna 410 and extending vertically from the fourth antenna 440 and having a third length. According to various embodiments, the length of the third antenna 430 may be the same as or different from the length of the first antenna 410. The length of the fourth antenna 440 may be the same as or different from the length of the second antenna 420.

[0080] According to various embodiments, the first antenna 410 to the fifth antenna 450 can be used as antenna radiators for transmitting and receiving wireless signals. The first antenna 410 to the fifth antenna 450 can operate in a first to a fifth frequency band. For example, the first to fifth frequency bands may include sub-6 GHz bands (e.g., approximately 3.3 GHz to 3.8 GHz) and / or legacy bands (e.g., low-frequency, mid-frequency, and / or high-frequency bands). The first to fifth frequency bands are not limited to the examples described above and can transmit and receive signals from other frequency bands.

[0081] According to one embodiment, the first antenna 410 and the second antenna 420 may be separated by a first partition 415 (e.g., a slit). The first partition 415 may be formed between the first antenna 410 and the second antenna 420. The first partition 415 can physically separate the first antenna 410 and the second antenna 420 from each other. The first partition 415 may be filled with a non-conductive member (e.g., Figure 5 (Non-conductive component 550).

[0082] According to various embodiments, the first antenna 410 may include a switching section 412, a feeding section 414, and / or a grounding section 416. The switching section 412, the feeding section 414, and / or the grounding section 416 may be disposed on the inner surface of the first antenna 410. The switching section 412 may be disposed adjacent to the first segment 415. The grounding section 416 may be disposed adjacent to the fifth segment 455. The feeding section 414 may be disposed between the switching section 412 and the grounding section 416. The switching section 412 may switch the frequency band of the first antenna 410. The feeding section 414 may supply power to a wireless communication module (e.g., Figure 1 The wireless communication module 192 transmits and receives wireless signals from it. The grounding part 416 can ground the first antenna 410.

[0083] According to one embodiment, the second antenna 420 and the third antenna 430 may be separated by a second partition 425 (e.g., a slit). The second partition 425 may be formed between the second antenna 420 and the third antenna 430. The second partition 425 can physically separate the second antenna 420 and the third antenna 430 from each other. The second partition 425 may be filled with a non-conductive member.

[0084] According to one embodiment, the third antenna 430 and the fourth antenna 440 may be separated by a third partition 435 (e.g., a slit). The third partition 435 may be formed between the third antenna 430 and the fourth antenna 440. The third partition 435 can physically separate the third antenna 430 and the fourth antenna 440 from each other. The third partition 435 may be filled with a non-conductive member.

[0085] According to one embodiment, the fourth antenna 440 and the fifth antenna 450 may be separated by a fourth partition 445 (e.g., a slit). The fourth partition 445 may be formed between the fourth antenna 440 and the fifth antenna 450. The fourth partition 445 can physically separate the fourth antenna 440 and the fifth antenna 450 from each other. The fourth partition 445 may be filled with a non-conductive member.

[0086] According to one embodiment, the first antenna 410 and the fifth antenna 450 may be separated by a fifth partition 455 (e.g., a slit). The fifth partition 455 may be formed between the first antenna 410 and the fifth antenna 450. The fifth partition 455 can physically separate the first antenna 410 and the fifth antenna 450 from each other. The fifth partition 455 may be filled with a non-conductive member.

[0087] According to one embodiment, the above-mentioned non-conductive component (e.g., Figure 5 The non-conductive component 550 may be located in at least a portion of the internal space of the electronic device 400 (e.g., opening 401). The non-conductive component 550 can prevent foreign objects from entering the electronic device 400 from the outside.

[0088] According to various embodiments, non-conductive components (e.g., [missing information]) are filled in the first to fifth partitions 415 to 455. Figure 5 The non-conductive component 550 may include a dielectric (e.g., an insulating) material, which includes at least one of polycarbonate, polyimide, plastic, polymer, or ceramic.

[0089] According to one embodiment, the electronic device 400 may be included in a housing (e.g., Figure 2a The printed circuit board 460 (e.g., in the internal space of the housing 210) is located in the internal space of the housing 210. Figure 3 The printed circuit board 460 may include a first printed circuit board 461 (e.g., a motherboard) and a second printed circuit board 463 (e.g., a daughterboard) spaced apart from the first printed circuit board 461.

[0090] According to various embodiments, the printed circuit board 460 (e.g., a first printed circuit board 461 or a second printed circuit board 463) may include at least one wireless communication module (e.g., Figure 1 The wireless communication module 192). First antennas 410 to 450 can be electrically connected to at least one wireless communication module. First antennas 410 to 450 can be electrically connected to a printed circuit board 460. First printed circuit board 461 and second printed circuit board 463 can be electrically connected via a connecting member (not shown). The connecting member may include an RF coaxial cable or a flexible printed circuit board.

[0091] According to one embodiment, battery 465 (e.g., Figure 1 Battery 189 or Figure 3 The battery 350 may be disposed between the first printed circuit board 461 and the second printed circuit board 463. The battery 465 may be configured not to overlap with the first printed circuit board 461 and / or the second printed circuit board 463. The battery 465 may be configured to at least partially overlap with the first printed circuit board 461 and / or the second printed circuit board 463.

[0092] According to one embodiment, one surface (e.g., upper or lower portion) of the printed circuit board 460 may be disposed on the conductive plate 470 (e.g., Figure 3 At the first support member 311 or bracket). The conductive plate 470 can be electrically connected to the printed circuit board 460 to perform a grounding function. The conductive plate 470 can dissipate heat sources on the printed circuit board 460 (e.g., Figure 1 The heat generated in the processor 120 and memory 130. The display (e.g., Figure 2a The monitor 201 or Figure 3 The display 330 can be connected to a first surface of the conductive plate 470, and the printed circuit board 460 can be connected to a second surface of the conductive plate 470. The conductive plate 470 can physically support the printed circuit board 460 and the display (e.g., ...). Figure 6 (The monitor is 610).

[0093] According to various embodiments, at least a portion of the conductive plate 470 may be configured to be adjacent to the first antenna 410 to the fifth antenna 450. At least a portion of the conductive plate 470 may be connected to at least a portion of the first antenna 410 to the fifth antenna 450. The conductive plate 470 may be at least partially made of a conductive material (e.g., metal) and / or a non-metallic material (e.g., polymer). The conductive plate 470 may be made of, for example, a magnesium alloy. The conductive plate 470 may include at least one through-hole and / or a metal shell. The conductive plate 470 may be formed by molding.

[0094] According to various embodiments, an opening 401 may be at least partially formed between the conductive plate 470 and the side member 405 (e.g., a conductive housing). The conductive plate 470 may be made of the same material as the side member 405. The conductive plate 470 may also be made of a different material than the side member 405. The conductive plate 470 may be connected to the ground portion 416 of the first antenna 410, for example, by ultrasonic welding or soldering.

[0095] Reference Figure 4 and Figure 5 At least a portion of the conductive plate 470 may be near the first segment 415 (e.g., Figure 4Part A) is configured to be adjacent to the first antenna 410. The first antenna 410 may be formed by a first segment 415, a fifth segment 455, and an opening 401. The non-conductive member 550 may be filled in at least a portion of the first segment 415, the fifth segment 455, and the opening 401.

[0096] According to one embodiment, the end face 510 of the first antenna 410 and the end face 570 of the conductive plate 470 can be positioned at a predetermined distance. The facing surfaces of at least a portion of the end faces 570 of the first antenna 410 and the conductive plate 470 can be formed in an asymmetrical shape. The distance between the facing surfaces of the end faces 510 of the first antenna 410 and the conductive plate 470 can be non-constant. Each of the end faces 510 of the first antenna 410 and the conductive plate 470 can be formed, for example, in a stepped and / or uneven shape, such that the facing area is minimized. A non-conductive member 550 (e.g., polycarbonate) can fill the space (e.g., opening 401) between the end faces 510 of the first antenna 410 and the end faces 570 of the conductive plate 470.

[0097] According to various embodiments, at least a portion of the end face 510 of the first antenna 410 may be cut. The end face 510 of the first antenna 410 may include at least one stepped portion 515 (e.g., a stepped portion). At least a portion of the end face 570 of the conductive plate 470 may be cut. The end face 570 of the conductive plate 470 may include at least one stepped portion 575 (e.g., a stepped portion).

[0098] According to various embodiments, since at least one stepped portion 515 (e.g., a stepped portion) is formed at the end face 510 of the first antenna 410 and at least one stepped portion 575 (e.g., a stepped portion) is formed at the end face 570 of the conductive plate 470, the facing area of ​​the end face 510 of the first antenna 410 and the end face 570 of the conductive plate 470 can be reduced. In this case, an appropriate distance can be maintained between the first antenna 410 and the conductive plate 470, and the radiation loss of the first antenna 410 can be reduced.

[0099] According to various embodiments, since the non-conductive member 550 is filled in at least one stepped portion 515 formed at the end face 510 of the first antenna 410 and at least one stepped portion 575 formed at the end face 570 of the conductive plate 470, the mechanical strength due to external impact can be increased.

[0100] Figure 6 This is an illustrative representation of an embodiment according to the present disclosure. Figure 4 A cross-sectional view of a partial structure of the electronic device shown.

[0101] exist Figure 6 In the description, the same reference numerals can be assigned to... Figure 4 and Figure 5 The components of the embodiment of the electronic device 400 shown herein are the same, and repeated descriptions of their functions may be omitted.

[0102] Reference Figure 6 Electronic device 400 according to various embodiments of the present disclosure may include a first antenna 410, a conductive plate 470, a display 610, a printed circuit board 460, a reinforcing member 620, a camera 615 and / or a rear plate 630.

[0103] According to one embodiment, the first antenna 410 (hereinafter referred to as antenna 410) may have an end face 510 adjacent to the first partition 415 (hereinafter referred to as partition 415). At least a portion of the end face 510 of the antenna 410 may be cut to form a stepped portion (e.g., Figure 5 The stepped portion 515). The end face 510 of the antenna 410 may include at least one raised surface and / or recessed surface.

[0104] According to one embodiment, at least a portion of the end face 570 of the conductive plate 470 can be disposed at a predetermined distance on the facing surface of the end face 510 of the antenna 410. At least a portion of the end face 570 of the conductive plate 470 can be cut to form a stepped portion (e.g., Figure 5 The stepped portion 575). The end face 570 of the conductive plate 470 may include at least one raised surface and / or recessed surface. The facing surfaces of the end face 510 of the antenna 410 and at least a portion of the end face 570 of the conductive plate 470 may be formed in an asymmetrical shape. The distance between the facing surfaces of the end face 510 of the antenna 410 and the end face 570 of the conductive plate 470 may be formed as non-constant. The separation space (e.g., opening 401) between the end face 510 of the antenna 410 and the end face 570 of the conductive plate 470 may be filled with a non-conductive member 550 (e.g., polycarbonate).

[0105] According to various embodiments, the adjacent portions (e.g., portion a) between the end face 510 of the antenna 410 and the end face 570 of the conductive plate 470 can be provided with a gap of approximately 0.9 mm to 1.9 mm, for example. The portions (e.g., portion b) between a recessed surface formed in at least a portion of the end face 510 of the antenna 410 and a raised surface formed in at least a portion of the end face 570 of the conductive plate 470 can be provided with a gap of approximately 1.7 mm to 2.7 mm, for example. The portions (e.g., portion c) between a recessed surface formed in at least a portion of the end face 510 of the antenna 410 and a recessed surface formed in at least a portion of the end face 570 of the conductive plate 470 can be provided with a gap of approximately 2.1 mm to 3.1 mm, for example.

[0106] According to one embodiment, a display 610 may be disposed on at least a portion of the first surface of the conductive plate 470. The display 610 may be coupled to the first surface of the conductive plate 470. The display 610 may be coupled to the conductive plate 470 and a non-conductive component 550.

[0107] According to various embodiments, the display 610 may include Figure 1 Display module 160 Figure 2a The monitor 201 or Figure 3 At least one of the displays 330. The display 610 can display information input by the user or information to be provided to the user in the electronic device 400. The display 610 can perform input and display functions.

[0108] According to one embodiment, a printed circuit board 460 may be disposed on at least a portion of the second surface of a conductive plate 470. A first surface of the printed circuit board 460 may be coupled to the second surface of the conductive plate 470. The printed circuit board 460 may be at least partially electrically connected to the conductive plate 470, which may perform the grounding (GND) function of the antenna 410. The printed circuit board 460 may include at least one hole. Camera 615 (e.g., Figure 1 The camera module 180 can be mounted through at least one hole formed in the printed circuit board 460.

[0109] According to one embodiment, a first surface of the reinforcing member 620 may be disposed on a second surface of the printed circuit board 460. The reinforcing member 620 may be made of a material substantially the same as that of the non-conductive member 550 (e.g., a dielectric). At least a portion of the reinforcing member 620 may be coupled to at least a portion of the end face 510 of the antenna 410. The reinforcing member 620 may increase the supporting force between the end face 510 of the antenna 410 and the conductive plate 470. The reinforcing member 620 may fill at least a portion of the internal space (e.g., opening 401) of the electronic device 400.

[0110] According to one embodiment, a rear plate 630 may be disposed on a first surface of the reinforcing member 620. At least a portion of the rear plate 630 may be attached to at least a portion of the end face 510 of the antenna 410. The rear plate 630 may be attached to the rear surface of the electronic device 400. The rear plate 630 may be made of a material such as tempered glass, plastic, or aluminum oxide.

[0111] Figure 7 This is a cross-sectional view schematically illustrating the construction of an embodiment of the end face of the antenna and the end face of the conductive plate of an electronic device according to an embodiment of the present disclosure.

[0112] In the following description of the accompanying drawings, the same reference numerals may be assigned to those described above. Figures 4 to 6 The components of the embodiment of the electronic device 400 shown are the same, and repeated descriptions of their functions may be omitted.

[0113] Reference Figure 7 According to various embodiments of the present disclosure, the end face 510 of the first antenna 410 (hereinafter referred to as antenna 410) and the end face 570 of the conductive plate 470 can be provided with a predetermined gap. The facing surfaces of the end face 510 of the antenna 410 and the end face 570 of the conductive plate 470 can be formed in an asymmetrical shape. The distance between the facing surfaces of the end face 510 of the antenna 410 and the end face 570 of the conductive plate 470 can be non-constant. A non-conductive member 550 can be filled between the end face 510 of the antenna 410 and the end face 570 of the conductive plate 470.

[0114] According to one embodiment, the protrusion 712 can be formed in the antenna 410 by a cutting region 714, in which at least a portion of the end face 510 is cut. The cutting region 714 can be formed by cutting the lower part of the end face 510 of the antenna 410. The protrusion 712 can be formed in the upper part of the end face 510 of the antenna 410. The cutting region 714 of the end face 510 of the antenna 410 can be cut into a rectangular shape. The protrusion 712 of the end face 510 of the antenna 410 can have a rectangular shape.

[0115] According to one embodiment, the protrusion 722 can be formed in the conductive plate 470 by a cutting region 724, in which at least a portion of the end face 570 is cut. The cutting region 724 can be formed by cutting the upper part of the end face 570 of the conductive plate 470. The protrusion 722 can be formed in the lower part of the end face 570 of the conductive plate 470. The cutting region 724 of the end face 570 of the conductive plate 470 can be cut into a rectangular shape. The protrusion 722 of the end face 570 of the conductive plate 470 can have a rectangular shape.

[0116] According to one embodiment, the protrusion 712 formed on the end face 510 of the antenna 410 can face the cut area 724 cut from the end face 570 of the conductive plate 470. The cut area 714 cut from the end face 510 of the antenna 410 can face the protrusion 722 formed on the end face 570 of the conductive plate 470.

[0117] According to various embodiments, the gap between the end face of the protrusion 712 formed on the end face 510 of the antenna 410 and the end face of the cut area 724 cut from the end face 570 of the conductive plate 470 (e.g., Figure 7Point d) can be the gap between the end face of the cut area 714 cut from the end face 510 of the antenna 410 and the end face of the protrusion 722 formed on the end face 570 of the conductive plate 470 (e.g., Figure 7 Point e) is basically the same.

[0118] According to various embodiments, while maintaining a predetermined gap between the antenna 410 and the conductive plate 470, the area of ​​the end faces 510 and 570 facing each other can be reduced.

[0119] Figure 8 This is a cross-sectional view schematically illustrating the construction of the end face of the antenna and the end face of the conductive plate of an electronic device according to one embodiment of the present disclosure, and another embodiment thereof.

[0120] According to one embodiment, the protrusion 812 can be formed in the antenna 410 by a cutting region 814, in which at least a portion of the end face 510 is cut. The cutting region 814 can be formed by cutting the upper part of the end face 510 of the antenna 410. The protrusion 812 can be formed in the lower part of the end face 510 of the antenna 410.

[0121] According to one embodiment, the protrusion 822 can be formed in the conductive plate 470 by a cutting region 824, in which at least a portion of the end face 570 is cut. The cutting region 824 can be formed by cutting the lower part of the end face 570 of the conductive plate 470. The protrusion 822 can be formed in the upper part of the end face 570 of the conductive plate 470.

[0122] According to one embodiment, the cut area 814 formed on the end face 510 of the antenna 410 can face the protrusion 822 formed on the end face 570 of the conductive plate 470. The protrusion 812 formed on the end face 510 of the antenna 410 can face the cut area 824 cut from the end face 570 of the conductive plate 470.

[0123] According to various embodiments, the gap between the end face of the cut region 814 cut from the end face 510 of the antenna 410 and the end face of the protrusion 822 formed on the end face 570 of the conductive plate 470 (e.g., Figure 8 Point f) can be the gap between the end face of the protrusion 812 formed on the end face 510 of the antenna 410 and the end face of the cut area 824 cut from the end face 570 of the conductive plate 470 (e.g., Figure 8 The points g) are basically the same.

[0124] Figure 9 This is a cross-sectional view schematically illustrating the construction of the end face of the antenna and the end face of the conductive plate of an electronic device according to one embodiment of the present disclosure, in another embodiment.

[0125] According to one embodiment, a first protrusion 911 and a second protrusion 915 can be formed in the antenna 410 through a cutting region 913, in which at least a portion of the end face 510 is cut. The cutting region 913 can be formed by cutting the middle portion of the end face 510 of the antenna 410. The first protrusion 911 can be formed in the upper part of the end face 510 of the antenna 410. The second protrusion 915 can be formed in the lower part of the end face 510 of the antenna 410.

[0126] According to one embodiment, the protrusion 923 can be formed in the conductive plate 470 through a first cutting region 921 and a second cutting region 925, in which at least a portion of the end face 570 is cut. The first cutting region 921 can be formed by cutting the upper part of the end face 570 of the conductive plate 470. The second cutting region 925 can be formed by cutting the lower part of the end face 570 of the conductive plate 470. The protrusion 923 can be formed in the middle portion of the end face 570 of the conductive plate 470.

[0127] According to one embodiment, a first protrusion 911 formed on the end face 510 of the antenna 410 may face a first cut area 921 cut from the end face 570 of the conductive plate 470. A cut area 913 cut from the end face 510 of the antenna 410 may face a protrusion 923 formed on the end face 570 of the conductive plate 470. A second protrusion 915 formed on the end face 510 of the antenna 410 may face a second cut area 925 cut from the end face 570 of the conductive plate 470.

[0128] According to various embodiments, the gap between the end face of the first protrusion 911 formed on the end face 510 of the antenna 410 and the end face of the first cut area 921 cut from the end face 570 of the conductive plate 470 (e.g., Figure 9 The point h) can be the gap between the end face of the cut area 913 cut from the end face 510 of the antenna 410 and the end face of the protrusion 923 formed on the end face 570 of the conductive plate 470 (e.g., Figure 9 Point i) is essentially the same. The gap between the end face of the first protrusion 911 formed on the end face 510 of the antenna 410 and the end face of the first cut area 921 cut from the end face 570 of the conductive plate 470 (e.g., Figure 9 The point h) can be the gap between the end face of the second protrusion 915 formed on the end face 510 of the antenna 410 and the end face of the second cut area 925 cut from the end face 570 of the conductive plate 470 (e.g., Figure 9 The points j) are basically the same.

[0129] According to various embodiments, the structure of the end face 510 of the antenna 410 can be changed to the structure of the end face 570 of the conductive plate 470. For example, a first protrusion 911, a cut area 913, and a second protrusion 915 formed on the end face 510 of the antenna 410 can be formed on the end face 570 of the conductive plate 470. A first cut area 921, a protrusion 923, and a second cut area 925 formed on the end face 570 of the conductive plate 470 can be formed on the end face 510 of the antenna 410.

[0130] Figure 10 This is a cross-sectional view schematically illustrating the construction of the end face of the antenna and the end face of the conductive plate of an electronic device according to one embodiment of the present disclosure, and another embodiment thereof.

[0131] According to one embodiment, the antenna 410 may include a cut region 1010, in which at least a portion of the end face 510 is cut in a triangular shape. The end face 510 of the antenna 410 may include a sloped surface that slopes downwards.

[0132] According to one embodiment, the conductive plate 470 may include a cut region 1020, in which at least a portion of the end face 570 is cut in a triangular shape. The end face 570 of the conductive plate 470 may include an inclined surface sloping downwards.

[0133] According to one embodiment, the inclined surface formed on the end face 510 of the antenna 410 can face the inclined surface formed on the end face 570 of the conductive plate 470.

[0134] According to various embodiments, the gap between the upper point of the inclined surface formed on the end face 510 of the antenna 410 and the upper point of the inclined surface formed on the end face 570 of the conductive plate 470 (e.g., Figure 10 The gap between point k and the lower point of the inclined surface formed on the end face 510 of the antenna 410 and the lower point of the inclined surface formed on the end face 570 of the conductive plate 470 (e.g., Figure 10 The points l) are basically the same.

[0135] According to various embodiments, the end face 510 of the antenna 410 and the end face 570 of the conductive plate 470 are not limited to those described above. Figures 7 to 10 And it can be modified in various forms.

[0136] Figure 11a and Figure 11b This is a diagram illustrating the electric field distribution of an electronic device according to a comparative embodiment and the electric field distribution of an electronic device according to various embodiments of the present disclosure.

[0137] Figure 11aThe electric field distribution of an electronic device according to a comparative embodiment is shown. The electronic device has a surface-symmetrical shape in which the end face of the antenna 1101 and the end face of the conductive plate 1105 face each other.

[0138] Reference Figure 11a In the electronic device according to the comparative embodiment, when the opposing surfaces of the end faces of the antenna 1101 and the conductive plate 1105 are symmetrical, a strong electric field can be identified between the antenna 1101 and the conductive plate 1105. In the electronic device according to the comparative embodiment, the radiation loss between the antenna 1101 and the conductive plate 1105 may increase due to this strong electric field.

[0139] Figure 11b The electric field distribution of an electronic device 400 according to various embodiments of the present disclosure is shown. The electronic device 400 has an asymmetrical shape in which the end face 510 of the antenna 410 and the end face 570 of the conductive plate 470 face each other.

[0140] Reference Figure 11b In the electronic device 400 according to various embodiments of the present disclosure, when the distance between the opposing surfaces of the end face 510 of the antenna 410 and the end face 570 of the conductive plate 470 is not constant, it can be identified that the electric field formed between the antenna 410 and the conductive plate 470 is weaker than that of the electronic device according to the comparative embodiment. The electronic device 400 according to various embodiments of the present disclosure can reduce radiation loss between the antenna 410 and the conductive plate 470.

[0141] Figure 12 It is a graph comparing the radiation efficiency of an electronic device according to a comparative embodiment and the radiation efficiency of an electronic device according to an embodiment of the present disclosure.

[0142] According to various embodiments, the electronic device according to the comparative embodiments may have a shape in which the opposing surfaces of the end faces of the antenna 1101 and the conductive plate 1105 are symmetrical. However, in the electronic device 400 according to various embodiments of the present disclosure, the distance between the opposing surfaces of the end faces 510 of the antenna 410 and the end faces 570 of the conductive plate 470 may be varied.

[0143] Reference Figure 12 Compared to the radiation efficiency G1 of the electronic device according to the comparative embodiment, it can be identified that the radiation efficiency G2 of the electronic device 400 according to various embodiments of the present disclosure is improved by about 1 dB or more from a frequency band of, for example, about 700 MHz or greater.

[0144] In the foregoing description, this disclosure has been described in accordance with various embodiments thereof. However, any changes and modifications made by those skilled in the art to which this disclosure pertains without departing from the technical spirit of this disclosure are also part of this disclosure.

Claims

1. An electronic device comprising: Conductive housing; A printed circuit board is disposed within the internal space of the conductive housing and includes a wireless communication module; A conductive plate, wherein the printed circuit board is disposed on the conductive plate; A dividing section, configured to separate at least a portion of the conductive housing; An opening is provided between the conductive housing and the conductive plate; as well as The antenna is formed by the segmented portion. At least a portion between the segment and the opening is filled with a non-conductive component. The antenna end face includes a stepped shape formed by cutting at least a portion of the antenna end face, the stepped shape including at least one first protruding portion and a first cut area. The end face of the conductive plate includes a stepped shape formed by cutting at least a portion of the end face of the conductive plate. The stepped shape includes at least one second protruding portion and at least one second cutting area. Wherein, at least one first protrusion on the end face of the antenna faces at least one second cut area on the end face of the conductive plate, and Wherein, the first cut area of ​​the end face of the antenna faces at least one second protrusion portion of the end face of the conductive plate.

2. The electronic device of claim 1, wherein the non-conductive component is configured to fill the space between the antenna and the conductive plate.

3. The electronic device as claimed in claim 1, At least one of the switching section, the feeding section, or the grounding section is disposed on the inner surface of the antenna, and The grounding portion of the antenna is configured to be connected to at least a portion of the conductive plate.

4. The electronic device of claim 1, wherein at least a portion of the conductive plate is configured to be electrically connected to the printed circuit board and perform a grounding function.

5. An electronic device comprising: Conductive housing; A dividing section, configured to separate at least a portion of the conductive housing; An opening is formed between the conductive housing and the conductive plate; The antenna is formed through the segment and the opening; A non-conductive component is configured to fill at least a portion of the opening and the segment; A display is disposed on the first surface of the conductive plate; A printed circuit board disposed on the second surface of the conductive plate and including a wireless communication module; as well as A rear plate, configured to cover the rear surface of the printed circuit board. The antenna end face includes a stepped shape formed by cutting at least a portion of the antenna end face, the stepped shape including at least one first protruding portion and a first cut area. The conductive plate's end face includes a stepped shape formed by cutting at least a portion of the conductive plate's end face. This stepped shape includes at least one second protruding portion and at least one second cut area. Wherein, at least one first protrusion on the end face of the antenna faces at least one second cut area on the end face of the conductive plate, and Wherein, the first cut area of ​​the end face of the antenna faces at least one second protrusion portion of the end face of the conductive plate.

6. The electronic device of claim 5, wherein the reinforcing member is included between the printed circuit board and the rear plate, the reinforcing member being non-conductive, and At least a portion of the reinforcing member is configured to be coupled to at least a portion of the end face of the antenna.

7. The electronic device of claim 5, wherein the non-conductive component is filled between the antenna and the conductive plate.

8. The electronic device of claim 5, wherein at least one of the switching section, the power supply section, or the grounding section is disposed on the inner surface of the antenna, and The grounding portion of the antenna is configured to be connected to at least a portion of the conductive plate.

9. The electronic device of claim 5, wherein at least a portion of the conductive plate is configured to be electrically connected to the printed circuit board and perform a grounding function.

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