一种用于超低轮廓铜箔微细粗化处理的添加剂及其使用方法
By using titanium sulfate, sodium thiazolinyl dithiopropane sulfonate, and fatty amine polyoxyethylene ether as additives on the surface of copper foil, the problems of high signal transmission loss and insufficient adhesion of HVLP copper foil in high-frequency and high-speed circuit boards are solved, achieving the effect of low roughness and high peel strength.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- LINGBAO WASON COPPER FOIL
- Filing Date
- 2023-01-10
- Publication Date
- 2026-07-17
AI Technical Summary
The existing roughening treatment of HVLP copper foil cannot simultaneously meet the requirements of low signal transmission loss and adhesion to the resin substrate in high-frequency and high-speed circuit boards, resulting in high signal transmission loss or insufficient adhesion.
Using titanium sulfate, sodium thiazolinyl dithiopropane sulfonate (SH110), and fatty amine polyoxyethylene ether (AEO) as additives, a uniform and dense coarsening layer is formed on the surface of copper foil through a specific electroplating process, which refines the grains and improves adhesion.
This method achieves low surface roughness of copper foil in high-frequency and high-speed circuit boards while maintaining good adhesion to the resin substrate, significantly reducing signal transmission loss and improving peel strength.
Smart Images
Figure CN116162976B_ABST