Die bonding apparatus and die bonding method

Abstract

This invention provides a die bonding apparatus and a die bonding method. The die bonding apparatus includes: a platform unit on which a wafer comprising dies of multiple grades is placed; a transport track including first end regions and second end regions on both sides and a bonding region between the first end regions and the second end regions to provide a substrate transport path; a plurality of substrate transport units including a plurality of substrate transport modules that transport substrates along the transport track; and a bonding unit that picks up dies from the wafer and bonds the picked-up dies to corresponding substrates according to their grades, wherein cassette units storing substrates corresponding to different die grades are respectively disposed in the first end regions and the second end regions, and the substrate transport modules supply substrates from each cassette unit to the bonding region.

Description

Technical Field

[0001] This invention relates to a die bonding method and a die bonding apparatus. Background Technology

[0002] Typically, semiconductor devices can be formed on a silicon wafer, which serves as a semiconductor substrate, by repeatedly performing a series of manufacturing processes. Semiconductor devices formed as described above can be diced by a slicing process and bonded to the substrate by a die bonding process.

[0003] An apparatus for performing a die bonding process may include a platform for supporting a wafer divided into multiple dies; a substrate transfer unit for transferring a substrate to a bonding area disposed adjacent to the platform; and a bonding unit for picking up the dies according to a recipe and bonding them to the substrate.

[0004] On the other hand, electrical characteristics can be checked on the bare wafer using a probe station or similar inspection device before the slicing process is performed, and the bare wafer can be assigned multiple grades based on the results of the inspection process.

[0005] Traditional die bonding equipment primarily uses only high-grade dies. Therefore, it generally has dedicated bonding areas for the two highest grades, while Grade 1 and Grade 2 dies are manufactured into semiconductor devices through bonding processes, and dies of lower grades are discarded.

[0006] However, recently, when manufacturing multi-chip semiconductor devices by stacking multiple dies on a substrate according to a specific process, relatively low-grade dies can still be used. Therefore, according to conventional die bonding devices, there is a problem of die loss on the wafer because usable good dies from the low-grade dies are also discarded. Summary of the Invention

[0007] Therefore, the object of the present invention is to provide a die bonding apparatus and a die bonding method that can reduce die loss by bonding good dies of grades that were not previously bonded.

[0008] In addition, the present invention aims to provide a die bonding apparatus and a die bonding method that can improve the productivity of the bonding process.

[0009] In addition, the present invention aims to provide a die bonding apparatus and a die bonding method capable of refining high-grade dies.

[0010] The objectives of this invention are not limited to those described above, and other objectives and advantages of this invention not mentioned may be understood from the following description.

[0011] One embodiment of the present invention provides a die bonding apparatus, comprising: a platform unit on which a wafer having a plurality of dies graded according to quality is placed; a transport track providing a substrate transport path including a first end region and a second end region on both sides and a bonding region between the first end region and the second end region; a plurality of substrate transport modules transporting substrates along the transport track and moving back and forth between one of the first end region and the second end region and the bonding region; a plurality of cassette units including a loading cassette for supplying the substrates to the bonding region and an unloading cassette for retrieving the substrates from the bonding region; and a bonding unit picking up dies from the wafer and bonding the picked-up dies to corresponding substrates according to their grade.

[0012] In one embodiment, the plurality of cassette units may include: a first cassette unit disposed in the first end region and storing a first substrate; and a second cassette unit disposed in the second end region and storing a second substrate, wherein bare wafers of different grades are bonded to the first substrate and the second substrate.

[0013] In one embodiment, the plurality of substrate transfer modules may include: a first substrate transfer module for transferring the first substrate; and a second substrate transfer module for transferring the second substrate.

[0014] In one embodiment, the first substrate transfer module may include: a first substrate loading module for supplying the first substrate from the loading cassette of the first cassette unit to the bonding area; and a first substrate unloading module for recovering the first substrate after the bonding process is completed to the unloading cassette of the first cassette unit. The second substrate transfer module may include: a second substrate loading module for supplying the second substrate from the loading cassette of the second cassette unit to the bonding area; and a second substrate unloading module for recovering the second substrate after the bonding process is completed to the unloading cassette of the second cassette unit.

[0015] In one embodiment, the moving rails of the first substrate loading module and the moving rails of the first substrate unloading module may be separated by a certain height, and the moving rails of the second substrate loading module and the moving rails of the second substrate unloading module may be separated by a certain height.

[0016] In one embodiment, the transfer track may be provided in a multi-layered configuration as a loading track for supplying the first substrate and the second substrate to the bonding region and an unloading track for recovering the first substrate and the second substrate that have completed the bonding process in the bonding region.

[0017] In one embodiment, the plurality of substrate transfer modules may include: a first loading module for transferring a first substrate along the loading track; a second loading module for transferring a second substrate along the loading track; a first unloading module for transferring the first substrate along the unloading track; and a second unloading module for transferring the second substrate along the unloading track.

[0018] In one embodiment, each substrate transfer module included in the plurality of substrate transfer modules may be controlled independently.

[0019] In one embodiment, the loading and unloading containers of each of the container units may be provided in a stacked configuration.

[0020] In one embodiment, the bonding unit may include: a first bonding head for bonding a die of a grade corresponding to a substrate supplied from the first end region to the substrate; a second bonding head for bonding a die of a grade corresponding to a substrate supplied from the second end region to the substrate; a first head drive unit for moving the first bonding head in both vertical and horizontal directions; and a second head drive unit for moving the second bonding head in both vertical and horizontal directions.

[0021] According to an embodiment of the present invention, a die bonding apparatus may be provided, comprising: a platform unit on which a wafer having a plurality of dies graded according to quality is placed; a first transport track and a second transport track providing a substrate transport path including a first end region and a second end region on both sides and a bonding region between the first end region and the second end region; a plurality of substrate transport modules transporting the substrate along the first transport track or the second transport track and moving back and forth between one of the first end region and the second end region and the bonding region; a plurality of cassette units including a loading cassette for supplying the substrate to the bonding region and an unloading cassette for retrieving the substrate from the bonding region; and a bonding unit picking up dies from the wafer and bonding the picked-up dies to the corresponding substrates according to their grade.

[0022] In one embodiment, the plurality of cassette units may include: a first cassette unit disposed at a first end region of the first transport track and storing a first substrate; a second cassette unit disposed at a second end region of the first transport track and storing a second substrate; a third cassette unit disposed at a first end region of the second transport track and storing a third substrate; and a fourth cassette unit disposed at a second end region of the second transport track and storing a fourth substrate, wherein bare wafers of different grades are bonded to the first substrate, the second substrate, the third substrate, and the fourth substrate.

[0023] In one embodiment, the plurality of substrate transfer modules may include: a first substrate transfer module for transferring the first substrate; a second substrate transfer module for transferring the second substrate; a third substrate transfer module for transferring the third substrate; and a fourth substrate transfer module for transferring the fourth substrate.

[0024] In one embodiment, each of the substrate transfer modules may include: a substrate loading module for supplying each substrate from the loading cassette of each of the cassette units to the bonding area; and a substrate unloading module for recovering each substrate after the bonding process is completed to the unloading cassette of each of the cassette units.

[0025] In one embodiment, the moving rails of each substrate loading module and the moving rails of each substrate unloading module may be separated by a certain height.

[0026] In one embodiment, the first transfer track may be provided in a multi-layered structure as a first loading track for supplying the first substrate and the second substrate to the bonding region and a first unloading track for recovering the first substrate and the second substrate that have completed the bonding process in the bonding region. The second transfer track may be provided in a multi-layered structure as a second loading track for supplying the third substrate and the fourth substrate to the bonding region and a second unloading track for recovering the third substrate and the fourth substrate that have completed the bonding process in the bonding region.

[0027] In one embodiment, each substrate transfer module included in the plurality of substrate transfer modules may be controlled independently.

[0028] In one embodiment, the loading boxes and unloading boxes may be provided in a stacked configuration.

[0029] In one embodiment, the bonding unit may include: a first bonding head for bonding a die of a grade corresponding to a substrate supplied from the first end region to the substrate; a second bonding head for bonding a die of a grade corresponding to a substrate supplied from the second end region to the substrate; a first head drive unit for moving the first bonding head in both vertical and horizontal directions; and a second head drive unit for moving the second bonding head in both vertical and horizontal directions.

[0030] An embodiment of the present invention provides a die bonding method, comprising: a step of obtaining grade information related to the quality of each die located on a wafer; a step of picking up a die from the wafer; a bonding step of bonding the die to a substrate corresponding to the grade of the picked die; and a substrate conveying step of conveying the substrate to a bonding area where the bonding step is performed, the substrate conveying step conveying substrates corresponding to different grades to each other back and forth from both ends of a conveying track to the bonding area.

[0031] In one embodiment, the substrate transfer step may include: supplying the substrate to the bonding area; and retrieving the substrate after completing the bonding step.

[0032] According to embodiments of the present invention, the classification of bare wafers can be further refined.

[0033] In addition, by performing binding on more levels of bare dies than before, die wear can be minimized.

[0034] The effects of the present invention are not limited to those mentioned above. Other effects not mentioned can be clearly understood by those skilled in the art from the following description. Attached Figure Description

[0035] Figures 1 to 3 A schematic structure of a die bonding apparatus to which the present invention can be applied is shown.

[0036] Figure 4 This is a diagram illustrating the substrate transfer unit according to a second embodiment of the present invention.

[0037] Figure 5 This is for illustrating the substrate transfer unit according to the third embodiment of the present invention.

[0038] Figure 6 An example of a hierarchy diagram showing the hierarchy of dies located on a wafer is shown.

[0039] Figure 7 An example of a die bonding method applicable according to the present invention is shown.

[0040] (Explanation of reference numerals in the attached diagram)

[0041] 10: Wafers

[0042] 20: Nude Film

[0043] 42, 44, 46, 48: Material box unit

[0044] 100: Die-binding device

[0045] 110: Platform Unit

[0046] 118: Raw chip top-out unit

[0047] 120 (122, 124): Substrate transfer unit

[0048] 1221, 1241: Teleportation Tracks

[0049] 1222, 1224, 1242, 1244: Substrate transfer module

[0050] 130: Binding Unit Detailed Implementation

[0051] Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings, so that those skilled in the art to which this invention pertains can readily implement it. The present invention can be implemented in various different ways and is not limited to the embodiments described herein.

[0052] To clearly illustrate the invention, irrelevant parts have been omitted, and the same or similar components are marked with the same reference numerals throughout the specification.

[0053] Furthermore, in multiple embodiments, the same reference numerals are used to describe only representative embodiments of the constituent elements having the same structure, while in other embodiments only structures different from the representative embodiments are described.

[0054] In the specification as a whole, when a part is described as being "connected (or combined)" with other parts, it not only refers to "direct connection (or combination)" but also includes cases where other components are placed in between for "indirect connection (or combination)". Furthermore, when a part is described as "including" a constituent element, unless otherwise stated otherwise, it means that other constituent elements may be included, rather than excluding them.

[0055] Unless otherwise defined, all terms used herein, including technical or scientific terms, shall have the same meaning as commonly understood by one of ordinary knowledge in the art to which this invention pertains. Terms such as those defined in commonly used dictionaries shall be interpreted as having the same meaning as in the relevant technical context, and shall not be ideally or excessively interpreted as having a formal meaning unless expressly defined in this application.

[0056] Figures 1 to 3 A schematic structure of a die bonding apparatus to which the present invention can be applied is shown. Figure 1 as well as Figure 2 The structure of the die bonding device 100 is shown. Figure 3 The schematic structure of the die ejection device is shown.

[0057] The die bonding apparatus 100 according to the present invention can be used to perform a bonding process that bonds dies of various grades to a substrate. In particular, the die bonding apparatus 100 can be used to classify and bond dies according to grade by bonding them to different substrates.

[0058] As an example, the die bonding device 100 can be used to bond a die 20 onto a substrate S (e.g., PCB (Printed Circuit Board), lead frame) in a die bonding process for manufacturing a semiconductor package.

[0059] The die bonding apparatus 100 according to an embodiment of the present invention may include a platform unit 110 on which a wafer 10 including an individual die 20 is placed, at least one substrate transfer unit 120 for transferring substrates corresponding to different grades to a bonding area, and a bonding unit 130 for performing a bonding process on the substrates transferred to the bonding area based on the die grade.

[0060] The wafer 10 may include dies 20 having multiple grades, which can be assigned based on electrical characteristic checks of each die. For example, the dies 20 may be assigned grades from 1 to 8, where dies from grades 1 to 4 or 5 can be used as good dies. The wafer 10 may be provided attached to a slicing tape 12, which may be mounted on a generally circular ring-shaped mounting bracket 14.

[0061] The die bonding apparatus 100 may include a loading port 102 for loading a cassette 50 containing a plurality of wafers 10. The loading port 102 may be configured adjacent to the platform unit 110, and a wafer transfer unit 104 may be used to transfer wafers 10 from the cassette 50 loaded in the loading port 102 to the platform unit 110. The wafer transfer unit 104 may move along a guide rail 106 configured between the cassette 50 and the platform unit 110, and the wafer transfer unit 104 may remove wafers 10 from the cassette 50 and load them onto the platform unit 110.

[0062] like Figure 3 As shown, the platform unit 110 may include a support ring 112 supporting the edge portion of the slicing tape 12, a chuck 114 holding the mounting bracket 14, and a chassis 116 on which the support ring 112 and the chuck 114 are mounted and has an opening below the wafer 10. Below the platform unit 110, a die ejection unit 118 for selectively separating the die 20 from the slicing tape 12 may be configured. The platform unit 110 and the die ejection unit 118 may be configured to move separately via different drive units for selectively separating the die 20 from the slicing tape 12.

[0063] The clamp 114 can move the mounting bracket 14 downward while the cutting tape 12 is supported by the support ring 112, thereby extending the cutting tape 12 and increasing the spacing between the bare films 20.

[0064] The die 20 separated by the die ejection unit 118 can be picked up by the bonding unit 130 disposed above the platform unit 110. The bonding unit 130 can pick up the die 20 and bond it to the corresponding substrate S based on the grade of the picked die.

[0065] The substrate transfer unit 120 may include a first end region and a second end region corresponding to its two ends, and a bonding region between the first end region and the second end region, thereby including a transfer track providing a substrate transfer path and a plurality of substrate transfer modules for transferring substrates along the transfer track. Although not shown in detail, bonding platforms on which substrates provided from the first end region and the second end region are respectively placed may be configured in the bonding region. The die bonding device 100 may include at least one substrate transfer unit 120.

[0066] Alternatively, cassette units can be configured in the first and second end regions, each containing substrates corresponding to different die grades. Each cassette unit includes a loading cassette for loading substrates onto a transport track and an unloading cassette for unloading substrates from the transport track. Only dies of the same grade can be bonded to substrates supplied from a single cassette unit. Loading and unloading cassettes containing the same substrates can be arranged side-by-side in the same region. Alternatively, loading and unloading cassettes can be configured in a stacked structure.

[0067] The substrate S can be removed from the loading cassette and conveyed to the bonding area. After the bonding process is completed, it can be conveyed to and stored in the unloading cassette located in the same end area as the loading cassette. Although not shown in detail, a loading component for loading substrates from the loading cassette onto the conveyor track and an unloading component for unloading substrates from the conveyor track into the unloading cassette can be provided between the cassette unit and the conveyor track. Substrate conveying on the conveyor track can be performed by a substrate conveying module. The substrate conveying module can supply substrates from each cassette unit to the bonding area, and after the bonding process is completed, the substrate is returned from the bonding area to the cassette unit.

[0068] In one embodiment, the die bonding apparatus 100 can perform bonding processes on four different die grades, including a first substrate transfer unit 122 and a second substrate transfer unit 124. For example, the four different die grades can be divided into a first grade, a second grade, a third grade, and a fourth grade. Through the die bonding apparatus 100, the first grade die is bonded to the first substrate S1, the second grade die is bonded to the second substrate S2, the third grade die is bonded to the third substrate S3, and the fourth grade die is bonded to the fourth substrate S4.

[0069] Reference Figure 1 The first substrate transfer unit 122 may include a first transfer track 1221, a first substrate transfer module 1222 that transfers substrates along the first transfer track 1221, and a second substrate transfer module 1224.

[0070] Alternatively, a first cassette unit 42 storing multiple first substrates S1 may be disposed in the first end region of the first conveying track 1221, and a second cassette unit 44 storing multiple second substrates S2 may be disposed in the second end region of the first conveying track 1221. Each cassette unit may include a loading cassette for supplying substrates to the bonding region and an unloading cassette for recovering substrates from the bonding region.

[0071] The first substrate transfer module 1222 can transfer the first substrate S1 taken from the loading cassette of the first cassette unit 42 to the bonding area, and transfer the first substrate S1 that has completed the bonding process to the unloading cassette of the first cassette unit 42. That is, the first substrate transfer module 1222 can travel back and forth along the first transfer track 1221 between the first end area and the bonding area.

[0072] The second substrate transfer module 1224 can transfer the second substrate S2 taken from the loading cassette of the second cassette unit 44 to the bonding area, and transfer the second substrate S2 that has completed the bonding process to the unloading cassette of the second cassette unit 44. That is, the second substrate transfer module 1224 can travel back and forth along the first transfer track 1221 between the second end area and the bonding area.

[0073] Each substrate transfer module may include a support member for supporting the substrate and a drive unit for moving the support member. As an example, the support member may be provided in the form of a clamp for holding the substrate.

[0074] In addition, each substrate transmission module can be controlled independently.

[0075] The second substrate transfer unit 124 can be arranged parallel to the first substrate transfer unit 122. Specifically, the second substrate transfer unit 124 can be arranged side by side with the first substrate transfer unit 122 spaced apart in the Y-axis direction.

[0076] The second substrate transfer unit 124 may include a second transfer track 1241, a third substrate transfer module 1242 and a fourth substrate transfer module 1244 that transfer substrates along the second transfer track 1241.

[0077] Alternatively, a third cassette unit 46 storing multiple third substrates S3 may be disposed in the first end region of the second conveying track 1241, and a fourth cassette unit 48 storing multiple fourth substrates S4 may be disposed in the second end region of the second conveying track 1241. Each cassette unit may include a loading cassette for supplying substrates to the bonding region and an unloading cassette for recovering substrates from the bonding region.

[0078] The third substrate transfer module 1242 can transfer the third substrate S3 taken from the loading cassette of the third cassette unit 46 to the bonding area, and transfer the third substrate S3 after the bonding process is completed to the unloading cassette of the third cassette unit 46. That is, the third substrate transfer module 1242 can travel back and forth along the second transfer track 1241 between the first end area and the bonding area.

[0079] The fourth substrate transfer module 1244 can transfer the fourth substrate S4 taken from the loading cassette of the fourth cassette unit 48 to the bonding area, and transfer the fourth substrate S4 after the bonding process is completed to the unloading cassette of the fourth cassette unit 48. That is, the fourth substrate transfer module 1244 can travel back and forth along the second transfer track 1241 between the second end area and the bonding area.

[0080] Each substrate transfer module may include a support member for supporting the substrate and a drive unit for moving the support member. As an example, the support member may be provided in the form of a clamp for holding the substrate.

[0081] In addition, each substrate transmission module can be controlled independently.

[0082] The bonding unit 130 may include a first bonding head 1322 and a second bonding head 1342 for picking up and bonding the die 20 on the wafer 10 to the substrate S, a first head drive 1324 for moving the first bonding head 1322 in the vertical and horizontal directions, and a second head drive 1344 for moving the second bonding head 1342 in the vertical and horizontal directions.

[0083] The first bonding head 1322 can bond a die of a corresponding grade to a substrate S supplied from the first end region. In one embodiment of the invention, the first bonding head 1322 can bond a die of a corresponding grade to substrates supplied from the first cassette unit 42 and the third cassette unit 46 disposed in the first end region. That is, the first bonding head 1322 can bond a die of grade 1 corresponding to the first substrate S1 to the first substrate S1 or a die of grade 3 corresponding to the third substrate S3 to the third substrate S3.

[0084] The second bonding head 1342 can bond corresponding grade dies to the substrate S supplied from the second end region. In one embodiment of the invention, the second bonding head 1342 can bond corresponding grade dies to substrates supplied from the second cassette unit 44 and the fourth cassette unit 48 disposed in the second end region. That is, the second bonding head 1342 can bond a grade 2 die corresponding to the second substrate S2 to the second substrate S2, or bond a grade 4 die corresponding to the fourth substrate S4 to the fourth substrate S4.

[0085] The first head drive unit 1324 may include a vertical drive unit that moves the first binding head 1322 in the vertical direction and a horizontal drive unit that moves the first binding head 1322 in the horizontal direction (e.g., the Y-axis direction).

[0086] The second head drive unit 1344 may include a vertical drive unit that moves the second binding head 1342 in the vertical direction and a horizontal drive unit that moves the second binding head 1342 in the horizontal direction (e.g., the Y-axis direction).

[0087] Although not illustrated in detail, the bonding unit 130 may include a bonding tool for picking up the die 20 using vacuum pressure and a heater for heating the die 20.

[0088] On the other hand, such as Figure 2 As shown, the bonding unit 130 may also include a first picker 150 and a second picker 160 for picking up the bare die 20 on the wafer 10, a first die stage 152 for placing the bare die 20 picked up by the first picker 150, and a second die stage 162 for placing the bare die 20 picked up by the second picker 160.

[0089] The first pick-up device 150 can pick up dies of a grade corresponding to the substrate S supplied from the first end region. In one embodiment of the invention, the first pick-up device 150 can pick up dies of a grade corresponding to the substrates supplied from the first cassette unit 42 and the third cassette unit 46 disposed in the first end region. That is, the first pick-up device 150 can pick up a die of grade 1 corresponding to the first substrate S1 or a die of grade 3 corresponding to the third substrate S3 and place it on the first die stage 152. The dies placed on the first die stage 152 can be picked up by the first bonding head 1322 and bonded to the first substrate S1 or the third substrate S3.

[0090] The second pick-up device 160 can pick up dies of a grade corresponding to the substrate S supplied from the second end region. In one embodiment of the invention, the second pick-up device 160 can pick up dies of a grade corresponding to the substrates supplied from the second cassette unit 44 and the fourth cassette unit 48 disposed in the second end region. That is, the second pick-up device 160 can pick up a die of grade 2 corresponding to the second substrate S2 or a die of grade 4 corresponding to the fourth substrate S4 and place it on the second die stage 162. The dies placed on the second die stage 162 can be picked up by the second bonding head 1342 and bonded to the second substrate S2 or the fourth substrate S4.

[0091] On the other hand, above each bonding platform, a camera can be configured to capture images of the physical marks on the substrate 30 and the area where the die 20 is to be bonded, in order to adjust the position of the substrate 30, i.e., to align it.

[0092] The following describes, with reference to the example described above, a structure providing two substrate transfer modules in a transfer track. According to this structure, the loading and unloading of substrates corresponding to a certain grade on the transfer track is performed by one substrate transfer module. Another embodiment for shortening the process time of the die bonding apparatus 100 can be provided.

[0093] Figure 4 This is a diagram illustrating the transport track according to a second embodiment of the present invention. Figure 4 To avoid complexity, the minimum structural elements required for explanation are enlarged and shown in summary.

[0094] The difference between the second embodiment and the first embodiment is that a substrate loading transfer module and a substrate unloading transfer module are respectively arranged on a transfer track. That is, each substrate transfer module may include a substrate loading module that supplies substrates from the loading cassettes of each cassette unit to the bonding area, and a substrate unloading module that recovers substrates that have completed the bonding process from the bonding area back to the unloading cassettes of each cassette unit. In this case, the substrate loading and unloading modules of each substrate transfer module can be configured to move along tracks at different heights on the transfer track. That is, the moving tracks of the substrate loading and unloading modules of each substrate transfer module can be separated by a certain height. Preferably, this certain height is above a height at which the substrate loading and unloading modules of each substrate transfer module do not interfere with each other.

[0095] To illustrate this, let's take an example of loading and unloading the first substrate S1.

[0096] As explained above, a first loading cassette 421 and a first unloading cassette 422 can be configured in the first end region of the first conveying track 1221. A first substrate loading module 1222a, which supplies the first substrate S1 from the first loading cassette 421 to the bonding area, and a first substrate unloading module 1222b, which retrieves the first substrate S1, after the bonding process is completed, from the bonding area back to the first unloading cassette 422, can be configured on the first conveying track 1221. The first substrate loading module 1222a can be configured to move along the trajectory P1 at a height of h1, and the first substrate unloading module 1222b can move along the trajectory P2 at a height h2, which is higher than h1.

[0097] That is, in the second embodiment, on a single transport track, two substrate transport modules are set up for loading (supply) and two for unloading (recycling) of a single substrate. Since both types of substrates are loaded and unloaded on a single transport track, four substrate transport modules can be set up.

[0098] As an example, the substrate transfer module according to the second embodiment of the present invention may include a first substrate transfer module and a third substrate transfer module that travel back and forth between a first end region and a bonding region, and a second substrate transfer module and a fourth substrate transfer module that travel back and forth between a second end region and a bonding region.

[0099] The first substrate transfer module 1222 may include a first substrate loading module 1222a that supplies the first substrate S1 from the first end region (loading cassette 421 of the first cassette unit 42) to the bonding region, and a first substrate unloading module 1222b that returns the first substrate S1, after completing the bonding process, to the first end region (unloading cassette 422 of the first cassette unit 42). The second substrate transfer module 1224 may include a second substrate loading module that supplies the second substrate S2 from the second end region (loading cassette of the second cassette unit 44) to the bonding region, and a second substrate S2 that returns the second substrate S2, after completing the bonding process, to the second end region (unloading cassette of the second cassette unit 44). The second substrate unloading module and the third substrate transfer module 1242 include a third substrate loading module that supplies the third substrate S3 from the first end region (the loading cassette of the third cassette unit 46) to the bonding region and a third substrate unloading module that returns the third substrate S3, after the bonding process is completed, to the first end region (the unloading cassette of the third cassette unit 46). The fourth substrate transfer module 1244 includes a fourth substrate loading module that supplies the fourth substrate S4 from the second end region (the loading cassette of the fourth cassette unit 48) to the bonding region and a fourth substrate unloading module that returns the fourth substrate S4, after the bonding process is completed, to the second end region (the unloading cassette of the fourth cassette unit 48). The moving rails of the substrate loading modules and the moving rails of the substrate unloading modules included in each substrate transfer module can be separated by a certain height. In this case, the certain height is preferably a height that prevents the substrate loading modules and the substrate unloading modules from interfering with each other.

[0100] At this time, at least one of the substrate loading module and substrate unloading module can be configured to lift and transfer the substrate that has completed the bonding process from the substrate loading module to the substrate unloading module.

[0101] The height of the moving rails for the substrate loading module and the substrate unloading module can be configured to be the opposite of those described above, thereby allowing for changes in the positions of the loading and unloading boxes. Furthermore, the spacing between the moving rails of each substrate transfer module can be adjusted along lines that do not interfere with each other.

[0102] The structure is otherwise identical to that of Embodiment 1 described above, so the description is omitted.

[0103] Figure 5 This is a diagram illustrating the transport track according to a third embodiment of the present invention. Figure 5 In order to avoid complexity, the minimum structure required for explanation is enlarged and shown in summary.

[0104] The difference between the third embodiment and the first embodiment lies in the provision of a multi-layered transfer track. Specifically, a transfer track can be provided as a stacked loading track and unloading track. The loading track can be a track for supplying substrates from a first and second end region of the transfer track to a bonding region, and the unloading track can be a track for recovering substrates that have completed the bonding process from the bonding region back to either the first or second end region of the transfer track. Alternatively, loading cassettes containing different substrates can be arranged at both ends (the first and second end regions) of the loading track, and unloading cassettes containing different substrates can be arranged at both ends of the unloading track.

[0105] To illustrate this, let's take an example of loading and unloading the first substrate S1.

[0106] The first transfer track 1221 may include a first loading track 1221a for loading a substrate and a first unloading track 1221b for unloading a substrate. For example, the first loading track 1221a may be provided as an upper track, and the first unloading track 1221b as a lower track. A first loading hopper 421 may be disposed at one end of the loading track 1221a, and a first unloading hopper 422 may be disposed at one end of the unloading track 1221b. A first substrate loading module 1222a may be provided on the loading track 1221a to supply the first substrate S1 from the first loading hopper 421 to the bonding area, and a first substrate unloading module 1222b may be provided on the unloading track 1221b to retrieve the first substrate S1, after the bonding process has been completed, from the bonding area back to the first unloading hopper 422.

[0107] That is, in the third embodiment, a multi-layered structure is configured such that a transfer track includes a loading track and an unloading track, and the substrate transfer module for a substrate is divided into two for loading (supply) and two for unloading (recycling). Therefore, each substrate transfer module according to the third embodiment of the present invention may include a loading module for transferring each substrate along the loading track and an unloading module for transferring each substrate along the unloading track. Each substrate transfer module can be provided to move back and forth between a first end region or a second end region and a bonding region.

[0108] As an example, the first substrate transfer unit 122 may include a first loading track 1221a, a first unloading track 1221b, a first substrate transfer module 1222, and a second substrate transfer module 1224. The first substrate transfer module 1222 may include a first substrate loading module 1222a disposed on the first loading track 1221a and transferring the first substrate S1, and a first substrate unloading module 1222b disposed on the first unloading track 1221b and transferring the first substrate S1 after the bonding process. The second substrate transfer module 1224 may include a second loading module disposed on the first loading track 1221a and transferring the second substrate S2, and a second unloading module disposed on the first unloading track 1221b and transferring the second substrate S2 after the bonding process.

[0109] Additionally, the second substrate transfer unit 124 may include a second loading track, a second unloading track, a third substrate transfer module 1242, and a fourth substrate transfer module 1244. The third substrate transfer module 1242 may include a third loading module disposed on the second loading track and transferring the third substrate S3, and a third unloading module disposed on the second unloading track and transferring the third substrate S3 after the bonding process has been completed. The fourth substrate transfer module 1244 may include a fourth loading module disposed on the second loading track and transferring the fourth substrate S4, and a fourth unloading module disposed on the second unloading track and transferring the fourth substrate S4 after the bonding process has been completed.

[0110] At this point, the substrate transfer unit may also include a transfer component (not shown) for transferring the substrate from the loading track to the unloading track. The transfer component (not shown) may be capable of moving up and down between the loading track and the unloading track. Additionally, each substrate transfer module may be configured to move identically along the trajectory P1 at a height of h1.

[0111] The positions of the loading track for loading (supplying) substrates and the unloading track for unloading (reclaiming) substrates can be set to be the opposite of those described above. Therefore, the positions of the loading and unloading boxes can also be configured to be opposite. Furthermore, the heights of each substrate transfer module can still be configured differently.

[0112] The structure is otherwise identical to that of Embodiment 1 described above, so the description is omitted.

[0113] On the other hand, the die bonding apparatus 100 of the present invention may further include a control unit (not shown) for controlling the bonding unit 130. The control unit (not shown) may control the bonding unit 130 to acquire grade information related to the quality of each die 20 located on the wafer 10, pick up the die 20 from the wafer 10, confirm the supply position of the substrate corresponding to the grade of the picked die 20, and bond the die 20 to the substrate corresponding to the grade of the picked die 20.

[0114] Figure 6 An example of a hierarchy diagram showing the hierarchy of the die 20 located on wafer 10 is shown. (Refer to...) Figure 6 Circuits are formed in the regions of each die 20 by processing the wafer 10, and the grade of each die 20 is determined by electrical testing (EDS (Electrical Die Sorting) process). For example, the grades of the dies 20 can be divided into 4, which can be named Bin1, Bin2, Bin3, and Bin4 in order of high quality.

[0115] The levels of each die 20 located on wafer 10 can be as follows: Figure 6 Such a hierarchical diagram is stored on the upper-level control server and can be used as needed. For example, if it is set to bind the bare dies 20 corresponding to the Bin1, Bin2, Bin3, and Bin4 levels, it can be set to discard bare dies 20 with other levels, and the binding unit 130 will only pick up the bare dies 20 corresponding to Bin1 to Bin4. On the other hand, Figure 5 The example shown for the grade of nude film 20 is divided into 4 levels, but nude film 20 can be divided into more than 4 levels.

[0116] The die bonding method according to the present invention includes the steps of obtaining grade information related to the quality of each die 20 located on wafer 10, picking up the die 20 from wafer 10, bonding the die 20 to a substrate corresponding to the grade of the picked die 20, and transferring the substrate to the bonding area where the bonding step is performed.

[0117] The substrate transfer step involves transporting substrates of different grades back and forth from both ends of a transfer track to a bonding area. Therefore, the substrate transfer step may include supplying substrates to the bonding area and then recovering the supplied substrates after completing the die bonding process. At least one transfer track may be provided, from which substrates of different die grades can be supplied.

[0118] Figure 7 This illustrates an application of graded bonding according to an embodiment of the present invention. As described above, a die bonding apparatus 100 according to an embodiment of the present invention can graded bond dies of various grades on a wafer 10 to a substrate S. This can be achieved by configuring cassette units for supplying and retrieval of different substrates at both ends of a transport track, with the transport tracks arranged parallel to each other, and a bonding area disposed in the central region of the transport track. Alternatively, substrates corresponding to different grades can be supplied from cassette units at both ends of the transport track to the bonding area, and each substrate having completed the bonding process can be retrieved from the bonding area back to its respective cassette unit.

[0119] Reference Figure 7 Alternatively, a first cassette unit 42 and a second cassette unit 44 may be respectively configured at both ends (first end region and second end region) of the first conveying track 1221, and a third cassette unit 46 and a fourth cassette unit 48 may be respectively configured at both ends (first end region and second end region) of the second conveying track 1241. Alternatively, the first substrate S1 supplied and retrieved from the first cassette unit 42 may be configured to bind a first-grade (Bin1) bare die 20, the second substrate S2 supplied and retrieved from the second cassette unit 44 may be configured to bind a second-grade (Bin2) bare die 20, the third substrate S3 supplied and retrieved from the third cassette unit 46 may be configured to bind a third-grade (Bin3) bare die 20, and the fourth substrate S4 supplied and retrieved from the fourth cassette unit 48 may be configured to bind a fourth-grade (Bin4) bare die 20.

[0120] Alternatively, the first substrate S1 supplied from the first cassette unit 42 to the first conveyor track 1221 may be bonded to a die corresponding to the first grade (Bin1), and the first substrate S1, having completed the bonding process, may be returned to and recycled back to the first cassette unit 42. Or, the second substrate S2 supplied from the second cassette unit 44 to the first conveyor track 1221 may be bonded to a die corresponding to the second grade (Bin2), and the second substrate S2, having completed the bonding process, may be returned to and recycled back to the second cassette unit 44. Therefore, the directions for supplying the first substrate S1 and the second substrate S2 are opposite to each other, and the directions for recycling the first substrate S1 and the second substrate S2 are also opposite to each other.

[0121] Alternatively, the third substrate S3 supplied from the third cassette unit 46 to the second transfer track 1241 may be bonded to a die corresponding to the third grade (Bin3), and the third substrate S3, having completed the bonding process, may be returned to and recycled back to the third cassette unit 46. Or, the fourth substrate S4 supplied from the fourth cassette unit 48 to the second transfer track 1241 may be bonded to a die corresponding to the fourth grade (Bin4), and the fourth substrate S4, having completed the bonding process, may be returned to and recycled back to the fourth cassette unit 48. Therefore, the directions for supplying the third substrate S3 and the fourth substrate S4 are opposite to each other, and the directions for recycling the third substrate S3 and the fourth substrate S4 are different.

[0122] That is, embodiments of the present invention can provide a method for assigning a grade to each of the different substrates supplied from respective cassette units located at both ends of a transport track, and for bonding the dies 20 at the locations of the graded substrates. Thus, the dies 20 on the wafer 10, which is provided in a state with a mixture of multiple grades, are bonded according to the grade, thereby making it easier to manage chip quality. Furthermore, by dividing the dies 20 into more grades than before, the number of discarded dies is reduced, thus reducing die loss.

[0123] The following example illustrates a die bonding apparatus that provides two substrate transport units to classify four grades of dies. The number of substrate transport units can be adjusted according to the number of dies to be separated. For example, a bonding apparatus with two substrate transport units can be configured such that one of the substrate transport units is configured to transport the substrate transport module back and forth between a first end region and a second end region, thereby classifying three grades of dies. Alternatively, a bonding apparatus with one substrate transport unit can be configured to classify two grades of dies.

[0124] This embodiment and the accompanying drawings are merely illustrative of a portion of the technical concept included in this invention. It is obvious that variations and specific embodiments that can be readily derived by those skilled in the art within the scope of the technical concept included in the specification and drawings of this invention are all included within the scope of the claims of this invention.

[0125] Therefore, the concept of the present invention should not be limited to the illustrated embodiments, not only to the appended claims, but also to all concepts that are equivalent or modified from the claims.

Claims

1. A die bonding device, comprising: A platform unit is a wafer on which multiple bare dies are arranged according to quality ratings. A transport track provides a substrate transport path including a first end region and a second end region on both sides, as well as a bonding region between the first end region and the second end region; Multiple substrate conveying modules convey substrates along the conveying track and move back and forth within a range from one of the first end region and the second end region to the bonding region; Multiple cartridge units, including a loading cartridge for supplying the substrate to the bonding area and an unloading cartridge for retrieving the substrate from the bonding area; as well as The bonding unit picks up bare dies from the wafer and bonds the picked-up dies to the corresponding substrates according to their grade. The plurality of material box units include: A first cassette unit is disposed in the first end region and stores the first substrate; and The second material box unit is disposed in the second end region and stores the second substrate. Different grades of bare dies are bonded to the first substrate and the second substrate. The plurality of substrate transfer modules include: A first substrate transfer module for transferring the first substrate; and The second substrate transfer module transfers the second substrate. The first substrate transmission module includes: A first substrate loading module supplies the first substrate from the loading cassette of the first cassette unit to the bonding area; and The first substrate unloading module retrieves the first substrate, after the bonding process has been completed, from the bonding area to the unloading cassette of the first cassette unit. The second substrate transmission module includes: The second substrate loading module supplies the second substrate from the loading cassette of the second cassette unit to the bonding area; and The second substrate unloading module retrieves the second substrate, after the bonding process has been completed, from the bonding area to the unloading cassette of the second cassette unit. The moving track of the first substrate loading module and the moving track of the first substrate unloading module are separated by a certain height. The moving track of the second substrate loading module and the moving track of the second substrate unloading module are separated by a certain height.

2. The die bonding device according to claim 1, wherein, The first substrate transfer module and the second substrate transfer module can be controlled independently.

3. The die bonding device according to claim 1, wherein, The loading and unloading containers of the first material box unit are provided in a stacked configuration. The loading and unloading boxes of the second material box unit are provided in a stacked configuration.

4. The die bonding apparatus according to claim 1, wherein, The binding unit includes: A first bonding head is used to bond a die of a grade corresponding to a first substrate supplied from the first end region to the substrate; The second bonding head is used to bond a die of a grade corresponding to the second substrate supplied from the second end region to the substrate; A first head drive unit causes the first binding head to move in both vertical and horizontal directions; and The second head drive unit causes the second binding head to move in the vertical and horizontal directions.

5. A die bonding device, comprising: A platform unit is a wafer on which multiple bare dies are arranged according to quality ratings. The first and second transport tracks provide a substrate transport path including a first end region and a second end region on both sides, as well as a bonding region between the first end region and the second end region. Multiple substrate conveying modules convey the substrate along the first conveying track or the second conveying track, and move back and forth in the interval from one of the first end region and the second end region to the bonding region; Multiple cartridge units, including a loading cartridge for supplying the substrate to the bonding area and an unloading cartridge for retrieving the substrate from the bonding area; as well as The bonding unit picks up bare dies from the wafer and bonds the picked-up dies to the corresponding substrates according to their grade. The plurality of material box units include: The first material box unit is disposed in the first end region of the first conveying track and stores the first substrate; The second material box unit is disposed in the second end region of the first conveying track and stores the second substrate; A third material box unit is disposed at the first end region of the second conveyor track and stores a third substrate; and The fourth material box unit is disposed at the second end region of the second conveyor track and stores the fourth substrate. Different grades of bare dies are bonded to the first substrate, the second substrate, the third substrate, and the fourth substrate. The plurality of substrate transfer modules include: The first substrate conveying module includes a first substrate loading module that supplies the first substrate from the first cassette unit to the bonding area, and a first substrate unloading module that recovers the first substrate, which has completed the bonding process, from the bonding area to the first cassette unit via a moving track that is a certain height separated from the moving track of the first substrate loading module. The second substrate conveying module includes a second substrate loading module that supplies the second substrate from the second cassette unit to the bonding area, and a second substrate unloading module that recovers the second substrate, which has completed the bonding process, from the bonding area to the second cassette unit via a moving track that is a certain height separated from the moving track of the second substrate loading module. The third substrate conveying module includes a third substrate loading module for supplying the third substrate from the third cassette unit to the bonding area, and a third substrate unloading module for recovering the third substrate, after bonding, from the bonding area back to the third cassette unit via a moving track spaced a certain height from the moving track of the third substrate loading module; and The fourth substrate conveying module includes a fourth substrate loading module that supplies the fourth substrate from the fourth cassette unit to the bonding area, and a fourth substrate unloading module that recovers the fourth substrate, after the bonding process is completed, from the bonding area back to the fourth cassette unit via a moving track that is separated from the moving track of the fourth substrate loading module by a certain height.

6. The die bonding apparatus according to claim 5, wherein, The first substrate transfer module, the second substrate transfer module, the third substrate transfer module, and the fourth substrate transfer module can be controlled independently.

7. The die bonding apparatus according to claim 5, wherein, The loading and unloading containers of the first material box unit are provided in a stacked configuration. The loading and unloading containers of the second container unit are provided in a stacked configuration. The loading and unloading containers of the third container unit are provided in a stacked configuration. The loading and unloading containers of the fourth container unit are provided in a stacked configuration.

8. The die bonding apparatus according to claim 5, wherein, The binding unit includes: A first bonding head is used to bond a die corresponding to the grade of a first substrate and a third substrate supplied from the first end region to the first substrate or the third substrate, respectively. The second bonding head is used to bond a die corresponding to the grade of the second substrate and the fourth substrate supplied from the second end region to the second substrate or the fourth substrate, respectively. A first head drive unit causes the first binding head to move in both vertical and horizontal directions; and The second head drive unit causes the second binding head to move in the vertical and horizontal directions.

9. A die bonding method, performed using the die bonding apparatus according to any one of claims 1 to 8, the die bonding method comprising: The steps for obtaining grade information related to the quality of each die located on the wafer; The step of picking up a bare die from the wafer; The bonding step of bonding the bare die to a substrate corresponding to the grade of the picked-up bare die; as well as A substrate transfer step that transfers the substrate to the bonding area where the bonding step is performed. The substrate transfer step involves transferring substrates of different grades to and from the two ends of the transfer track to the bonding area.

10. The die bonding method according to claim 9, wherein, The substrate transfer step includes: The step of supplying the substrate to the bonding region; and The step of recycling the substrate after completing the bonding step of the substrate.

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