LGA package device batch tin soldering tool

Abstract

The application discloses a kind of LGA package device batch tinning tool, applied to reflow soldering device tinning.The tinning tool includes the box body of rectangle, operating platform and lifting mechanism, operating platform is movably arranged in box body by lifting mechanism, and can move up and down along the Z axis of box body;Operating platform is provided with several clamping slot mechanisms with adjustable bayonet specification, and the device to be tinned is clamped in the bayonet of clamping slot mechanism;It also includes screen plate fixing frame, tray and tin brushing screen plate, the tray is detachably inserted in clamping slot mechanism, to carry the bottom of the device to be tinned;Tin brushing screen plate is fixed on the top of box body by screen plate fixing frame, to tin the device to be tinned.The application solves the problems of low efficiency, poor adaptability and other problems of traditional tool tin brushing, can complete the tin brushing operation of various external dimensions of LGA package device, greatly improves production efficiency, saves production cost;After tin brushing, the device is taken out using tray, avoids scratching device shell, destroying pad solder paste and other risks.

Description

Technical Field

[0001] This invention relates to the field of tinning technology for reflow soldering devices, and in particular to an operating fixture for batch tinning of LGA packaged devices. Background Technology

[0002] LGA packaged devices are widely used in the assembly of printed circuit boards for aerospace products, and the issue of removing gold from the bottom pads before soldering has attracted much attention. During reflow soldering, the tin-lead alloy and the metal coating of the gold-plated pads can form brittle intermetallic compounds, resulting in "gold brittleness," which can lead to solder joint failure. Therefore, the pads need to be tinned and de-goldened before soldering to ensure soldering reliability.

[0003] Traditional methods for soldering and removing gold from LGA packaged devices include soldering iron soldering and vacuum reflow soldering. Soldering iron soldering has drawbacks such as inconvenience, high temperature, and potential device damage. Therefore, vacuum reflow soldering is currently the most commonly used soldering method. Since different LGA device sizes vary, conventional soldering operations involve custom-made soldering fixtures for each device. However, this method has poor applicability; even slight changes to the device package require custom-made fixtures, and only one device can be soldered at a time, resulting in low efficiency, high production costs, and wasted production resources.

[0004] Therefore, designing convenient and efficient mass soldering fixtures for LGA packaged devices has become a key issue that needs to be addressed. Summary of the Invention

[0005] To address the aforementioned shortcomings in the prior art, this invention provides a batch soldering fixture for LGA packaged devices.

[0006] To achieve the above objectives, the present invention adopts the following technical solution:

[0007] This invention provides a batch soldering fixture for LGA packaged devices, applied to soldering reflow soldering devices. It includes a rectangular housing, an operating table, and a lifting mechanism. The operating table is movably mounted within the housing via the lifting mechanism and can move up and down along the Z-axis of the housing. The operating table is equipped with several adjustable slot mechanisms, into which the devices to be soldered are secured. It also includes a stencil holder, a tray, and a soldering stencil. The tray is detachably inserted into the slot mechanisms to support the bottom of the devices to be soldered. The soldering stencil is fixed to the top of the housing via the stencil holder for soldering the devices.

[0008] In some embodiments, the housing includes four side plates and a bottom plate, a support frame is fixedly installed on the bottom plate, a lower limit plate for lowering the operating platform is fixed on the top of the support frame, and the lifting mechanism is installed on the support frame.

[0009] In some embodiments, the lifting mechanism includes a drive shaft, a handle, a transmission gear set, a lead screw, and a nut; the drive shaft is mounted on the support frame, with one end extending to the outside of the support frame and the other end extending to the outside of the housing; the transmission gear set includes a driving gear and a driven gear, the driving gear is fixed on both sides of the drive shaft, the driven gear is fixed on the bottom end of the lead screw, and the driven gear is meshed with the driving gear at a 90-degree angle; the nut is fixed to both ends of the operating table and screwed to the lead screw; the handle is fixed to the drive shaft extending to the outside of the housing.

[0010] In some embodiments, an upper limit block is provided at the top of the lead screw.

[0011] In some embodiments, five inverted T-shaped slides are arranged side by side on the operating table, and five sets of locking mechanisms are respectively arranged in each slide. Each locking mechanism includes a fixed locking slot, a movable locking slot, a spring, and a slider. The fixed locking slot is fixed in the middle of the slide. The movable locking slots are located on both sides of the fixed locking slot to form two diamond-shaped locking openings on both sides of the fixed locking slot. The slider is slidably disposed in the slide and connected to the bottom of the movable locking slot. One end of the spring abuts against the end of the slide and the other end abuts against the slider. There is a gap between the bottom of the fixed locking slot and the movable locking slot and the top surface of the operating table to allow the tray to enter and exit.

[0012] In some embodiments, the number of trays is two, which are respectively set at the two bayonet positions, and the length of the tray is not less than the distance between the first and last slides.

[0013] In some embodiments, a retraction plate is further included, wherein five notches for engaging with the movable slot are sequentially provided on the retraction plate; a retraction plate fixing groove is provided at both ends of the operating table, and a locking part for engaging with the retraction plate fixing groove is provided at both ends of the retraction plate.

[0014] In some embodiments, the fixing slot includes a fixing base, a fixing neck, and a V-shaped fixing clip portion. The fixing neck is vertically disposed on both sides of the fixing base, and the V-shaped fixing clip portion is disposed at the end of the fixing neck.

[0015] In some embodiments, the movable card slot includes a movable base, a movable neck, and a V-shaped movable card portion. The movable neck is vertically disposed on one side of the middle of the movable base, and the V-shaped movable card portion is disposed at the end of the movable neck. The card slot specifications are adapted to the movable neck specifications.

[0016] In some embodiments, the stencil fixing frame includes a first bracket and a second bracket. The first bracket is provided with a lower positioning pin and an upper positioning pin at its four corners. The lower positioning pin passes through the upper positioning groove on the top of the housing. The upper positioning pin passes through the lower positioning groove of the solder stencil. The first bracket and the second bracket are connected by screws, and the solder stencil is fixed between the first bracket and the second bracket.

[0017] Compared with the prior art, the present invention has the following advantages:

[0018] The LGA packaged device batch soldering fixture provided by this invention solves the problems of low soldering efficiency and poor adaptability of traditional fixtures by setting an adjustable slot mechanism. It can complete the soldering operation of LGA packaged devices of various shapes and sizes, greatly improving production efficiency and saving production costs. By setting several slot mechanisms on the operating table, multiple devices can be soldered at one time, improving production efficiency. After soldering, the device is removed from the tray and transferred to the next process, eliminating the need to use tweezers or other tools to remove the device from the traditional fixture, and avoiding the risks of scratching the device shell and damaging the solder paste on the pads. The soldering fixture of this invention can be widely used in the field of reflow soldering device soldering. Attached Figure Description

[0019] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0020] Figure 1 A schematic diagram of a three-dimensional structure of a batch soldering fixture for LGA packaged devices provided in an embodiment of the present invention;

[0021] Figure 2 A three-dimensional structural diagram of a batch soldering fixture for LGA packaged devices with the side panel of the housing removed, provided in an embodiment of the present invention;

[0022] Figure 3 A top view of a batch soldering fixture for LGA packaged devices provided in an embodiment of the present invention;

[0023] Figure 4 A front sectional view of a batch soldering fixture for LGA packaged devices provided in an embodiment of the present invention;

[0024] Figure 5 An exploded view of the operating table, removal board, and tray in a batch soldering fixture for LGA packaged devices provided in an embodiment of the present invention;

[0025] Figure 6 This is a three-dimensional structural diagram of a single slot mechanism in a batch soldering fixture for LGA packaged devices provided in an embodiment of the present invention;

[0026] Figure 7 This is a three-dimensional structural diagram of a single slot mechanism in a batch soldering fixture for LGA packaged devices after being opened, provided by an embodiment of the present invention.

[0027] Figure 8 This is an exploded view of the stencil fixing bracket in a batch soldering fixture for LGA packaged devices provided in an embodiment of the present invention.

[0028] The components are as follows: 1. Housing; 101. Support frame; 102. Lower limit plate; 103. Upper positioning groove; 2. Lifting mechanism; 201. Handle; 202. Drive shaft; 203. Drive gear; 204. Driven gear; 205. Lead screw; 206. Upper limit block; 3. Operating table; 301. Nut; 303. Tray; 304. Removal plate; 305. Removal plate fixing groove; 4. Slot mechanism; 401. Fixed slot; 402. Moving slot; 403. Slider; 404. Spring; 5. Mesh plate fixing frame; 501. First bracket; 502. Lower positioning pin; 503. Upper positioning pin; 504. Fixed threaded hole; 505. Second bracket; 506. Through hole. Detailed Implementation

[0029] Exemplary embodiments will be described more fully below with reference to the accompanying drawings; however, these exemplary embodiments may be embodied in different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that the invention will be thorough and complete, and that those skilled in the art will fully understand the scope of the invention.

[0030] Where there is no conflict, the embodiments of the present invention and the features thereof can be combined with each other.

[0031] As used herein, the term “and / or” includes any and all combinations of one or more related enumerated entries.

[0032] The terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the invention. The singular forms “a” and “the” used herein are also intended to include the plural forms unless the context clearly indicates otherwise. It will also be understood that when the terms “comprising” and / or “made of” are used in this specification, the presence of the stated features, integrals, steps, operations, elements, and / or components is specified, but the presence or addition of one or more other features, integrals, steps, operations, elements, components, and / or groups thereof is not excluded.

[0033] Unless otherwise specified, all terms used herein (including technical and scientific terms) have the same meaning as commonly understood by one of ordinary skill in the art. It will also be understood that terms such as those defined in commonly used dictionaries should be understood to have the meaning consistent with their meaning in the context of the relevant art and the invention, and will not be understood to have an idealized or overly formal meaning unless expressly so defined herein.

[0034] To enable the soldering of LGA packaged devices of various sizes, this invention provides a batch soldering fixture for LGA packaged devices. To enable those skilled in the art to better understand the technical solution, the batch soldering fixture for LGA packaged devices provided by this invention will be described in detail below with reference to the accompanying drawings.

[0035] like Figure 1 , Figure 5 and Figure 8 As shown, the LGA packaged device batch soldering fixture includes a rectangular box 1, an operating table 3, and a lifting mechanism 2. The lifting mechanism 2 is located inside the box 1, and the operating table 3 is movably positioned inside the box 1 via the lifting mechanism 2. That is, the lifting mechanism 2 can drive the operating table 3 to move up and down along the Z-axis of the box 1, thereby raising and lowering relative to the stencil fixing frame 5 at the top of the box 1. The operating table 3 is provided with several adjustable slot mechanisms 4, and the devices to be soldered are fixed in the slots of the slot mechanisms 4. It also includes a stencil fixing frame 5, a tray 303, and a soldering stencil. The tray 303 is detachably inserted into the slot mechanism 4 to support the bottom of the device to be soldered. The soldering stencil is fixed to the top of the box 1 via the stencil fixing frame 5 to solder the device.

[0036] The LGA packaged device batch soldering fixture provided by this invention solves the problems of low soldering efficiency and poor adaptability of traditional fixtures by setting an adjustable slot mechanism 4. It can complete the soldering operation of LGA packaged devices of various shapes and sizes, greatly improving production efficiency and saving production costs. By setting several slot mechanisms 4 on the operating table 3, multiple devices can be soldered at one time, improving production efficiency. After soldering, the device is removed using the tray 303 and transferred to the next process, eliminating the need to use tweezers or other tools to remove the device from the traditional fixture, avoiding the risks of scratching the device shell and damaging the solder paste on the pads. The soldering fixture of this invention can be widely used in the field of reflow soldering device soldering.

[0037] like Figure 1 and Figure 4As shown, specifically, the housing 1 includes four side plates and a bottom plate. A support frame 101 is fixedly installed on the bottom plate. A lower limit plate 102 for lowering the operating platform 3 is fixed on the top of the support frame 101. The lifting mechanism 2 is installed on the support frame 101. It should be noted that one end of the lifting mechanism 2 should be located below the lower limit plate 102, and the other end should be located above the lower limit plate 102 and connected to the operating platform 3. This ensures that when the operating platform 3 is driven down, it can be limited by the lower limit plate 102 when it reaches the lower limit plate 102, thus preventing the operating platform 3 from moving beyond its range.

[0038] The top four corners of the box body 1 are provided with upper positioning grooves 103 for installation with the mesh plate fixing frame 5.

[0039] like Figure 1 , Figure 2 , Figure 3 and Figure 4 As shown, in some embodiments, the lifting mechanism 2 is a lifting device with turbine drive and screw drive, including a drive shaft 202, a handle 201, a transmission gear set, a screw 205, and a nut; the drive shaft 202 is mounted on the support frame 101, with one end extending to the outside of the support frame 101 and the other end extending to the outside of the housing 1; the transmission gear set includes a driving gear 203 and a driven gear 204, the driving gear 203 is fixed on both sides of the drive shaft 202 and can rotate under the drive of the drive shaft 202, the driven gear 204 is fixed at the bottom end of the screw 205, and the driven gear 204 is meshed with the driving gear 203 at a 90-degree angle; the nut 301 is fixed at both ends of the operating table 3 and screwed to the screw 205. Using the screw drive principle, the nut 301 can drive the operating table 3 to move up and down along the Z-axis on the screw 205, and the handle 201 is fixed on the drive shaft 202 that extends to the outside of the housing 1.

[0040] To prevent the control panel 3 from moving beyond its range when it is raised, such as Figure 1 , Figure 2 and Figure 4 As shown, an upper limit block 206 is provided at the top of the lead screw 205. The upper limit block 206 and the lower limit plate 102 determine the movable range of the operating table 3.

[0041] In some embodiments, such as Figures 1-5As shown, five inverted T-shaped slides are arranged side by side on the operating table 3. Five sets of slotting mechanisms 4 are respectively installed in each slide, and each slotting mechanism 4 has two slots, thus arranging 10 slots on the operating table 3, enabling simultaneous soldering of 10 components. The slotting mechanism 4 includes a fixed slot 401, a movable slot 402, a spring 404, and a slider 403. The fixed slot 401 is fixed in the middle of the slide. The movable slots 402 are located on both sides of the fixed slot, respectively, to secure the fixed slot. Two diamond-shaped notches are formed on both sides of the fixed slot. The slider 403 is slidably disposed in the slide groove and connected to the bottom of the movable slot 402. One end of the spring 404 abuts against the end of the slide groove and the other end abuts against the slider 403, so that the movable slot 402 and the fixed slot 401 clamp the device under the action of the elastic force. The movable slot 402 can move left and right along the X-axis under the action of the slider 403. There is a gap between the bottom of the fixed slot 401 and the movable slot 402 and the top surface of the operating table 3 for the tray 303 to enter and exit.

[0042] In some embodiments, there are two trays 303, which are respectively set at two bayonet positions, and the length of the tray 303 is not less than the distance between the first and last slides, so that one tray 303 can support all the components to be soldered on the bayonet in the five slides side by side.

[0043] In some embodiments, such as Figure 5 As shown, it also includes a retractable plate 304 for moving the movable slot 402. The retractable plate 304 is provided with five notches for engaging with the movable slot 402. The two ends of the operating table 3 are respectively provided with retractable plate fixing grooves 305 for fixing the retractable plate 304. The two ends of the retractable plate 304 are respectively provided with engaging parts for engaging with the retractable plate fixing grooves 305.

[0044] In some embodiments, such as Figure 5 and Figure 6 As shown, it should be noted that Figure 6 The fixing slot 401 in the figure is only half shown. The other half is a mirror image of the half shown in the figure. The fixing slot 401 includes a fixing base, a fixing neck and a V-shaped fixing clip. The fixing neck is vertically arranged on both sides of the fixing base, and the V-shaped fixing clip is arranged at the end of the fixing neck.

[0045] In some embodiments, such as Figure 6 and Figure 7 As shown, the movable card slot 402 includes a movable base, a movable neck, and a V-shaped movable card part. The movable neck is vertically disposed on one side of the middle of the movable base, and the V-shaped movable card part is disposed at the end of the movable neck. The card slot specifications are adapted to the movable neck specifications.

[0046] In some embodiments, such as Figure 8As shown, the stencil fixing frame 5 includes a first bracket 501 and a second bracket 505. The first bracket 501 has lower positioning pins 502 and upper positioning pins 503 at its four corners. Ideally, the lower positioning pins 502 and upper positioning pins 503 can be an integral structure. The upper positioning pins 503 and lower positioning pins 502 are respectively used for the precise assembly of the stencil, the second bracket, and the stencil fixing frame, as well as the precise assembly of the stencil fixing frame and the housing 1. The lower positioning pin 502 passes through the upper positioning groove 103 on the top of the housing 1; the upper positioning pin 503 passes through... Inside the lower positioning groove of the solder stencil; the first bracket 501 and the second bracket 505 are connected by screws. Specifically, the first bracket 501 and the second bracket 505 are respectively provided with a fixing threaded hole 504 and a through hole 506. The solder stencil can be fixed between the first bracket and the second bracket using screws. Specifically, the screw passes through the through hole 506 and is screwed into the fixing threaded hole 504, thereby realizing the connection between the first bracket 501 and the second bracket 505, and the solder stencil is fixed between the first bracket 501 and the second bracket 505.

[0047] like Figure 1 As shown, before operation, crank the handle 201 to raise the operating table 3 to its highest position, insert the two trays 303 between the operating table 3 and the fixed slot 401 and the movable slot 402, and position them at the bottom of the slot. Use the pull plate 304 to pry open all ten movable slots 402 together, and then lock the pull plate 304 into the pull plate fixing slot 305 on the side of the operating table 3. Place the component to be soldered against the edge of the V-shaped fixing clip of the fixing slot 401 and on the tray 303. Gently release the release plate 304. The spring 404 pushes the moving slot 402 to move, clamping the component in the slot between the moving slot 402 and the fixing slot 401. Position the soldering stencil that matches the component on the first bracket 501 using the four upper positioning pins 503. Press the second bracket 505 onto the soldering stencil and screw in the four fixing threaded holes 504 on the first bracket 501 with appropriate screws to fix the soldering stencil between the first bracket 501 and the second bracket 505.

[0048] Then, crank handle 201 to lower the operating platform 3 into the housing 1. The stencil holder 5 is placed on the housing 1 by precisely engaging the four lower positioning pins 502 with the upper positioning slots 103. Crank handle 201 to slowly raise the operating platform 3 until the component pads are tightly fitted with the solder stencil fixed to the stencil holder 5.

[0049] At this point, the conditions for manual soldering are met. After the operation is completed, crank handle 201 to lower the operating table 3 into the housing 1. After removing the stencil holder 5, raise the operating table 3 to its highest position. Use the release plate 304 to pry open all ten movable slots 402 together, and then lock the release plate 304 into the release plate fixing slot 305 on the side of the operating table 3. Remove the tray 303 containing the components and proceed to the next process. Place the tray containing the components at the reflow oven inlet. After reflow soldering, the components are soldered.

[0050] Example embodiments have been disclosed herein, and while specific terminology has been used, it is for general illustrative purposes only and should not be construed as limiting. In some embodiments, it will be apparent to those skilled in the art that features, characteristics, and / or elements described in connection with particular embodiments may be used alone, or in combination with features, characteristics, and / or elements described in connection with other embodiments, unless otherwise expressly indicated. Therefore, those skilled in the art will understand that various changes in form and detail may be made without departing from the scope of the invention as set forth by the appended claims.

Claims

1. A batch soldering fixture for LGA packaged devices, characterized in that, This device, used for tinning reflow soldering components, includes a rectangular housing, an operating table, and a lifting mechanism. The operating table is movably mounted within the housing via the lifting mechanism and can move up and down along the Z-axis of the housing. The operating table has several adjustable slots for holding the components to be tinned. It also includes a stencil holder, a tray, and a tinning stencil. The tray is detachably inserted into the slots to support the bottom of the components. The tinning stencil is fixed to the top of the housing via the stencil holder for tinning the components. Five inverted T-shaped slides are arranged side by side on the operating table. Five sets of locking mechanisms are respectively installed in each slide. Each locking mechanism includes a fixed locking slot, a movable locking slot, a spring, and a slider. The fixed locking slot is fixed in the middle of the slide. The movable locking slots are located on both sides of the fixed locking slot, forming two diamond-shaped openings on each side. The slider is slidably disposed within the slide and connected to the bottom of the movable locking slot. One end of the spring abuts against the end of the slide, and the other end abuts against the slider. A gap is left between the bottom of the fixed and movable locking slots and the top surface of the operating table to allow the tray to enter and exit. It also includes a retraction plate, which has five notches arranged in sequence for engaging with the movable slot; the two ends of the operating table are respectively provided with retraction plate fixing slots, and the two ends of the retraction plate are respectively provided with engaging parts for engaging with the retraction plate fixing slots.

2. The batch soldering fixture for LGA packaged devices according to claim 1, characterized in that, The housing includes four side plates and a bottom plate. A support frame is fixedly installed on the bottom plate. A lower limit plate for lowering the operating platform is fixed on the top of the support frame. The lifting mechanism is installed on the support frame.

3. The batch soldering fixture for LGA packaged devices according to claim 2, characterized in that, The lifting mechanism includes a drive shaft, a handle, a drive gear set, a lead screw, and a nut; The drive shaft is mounted on the support frame, with one end extending to the outside of the support frame and the other end extending to the outside of the housing; the transmission gear set includes a driving gear and a driven gear, the driving gear is fixed on both sides of the drive shaft, the driven gear is fixed on the bottom end of the lead screw, and the driven gear is meshed with the driving gear at a 90-degree angle; the nut is fixed at both ends of the operating table and screwed to the lead screw; the handle is fixed on the drive shaft extending to the outside of the housing.

4. The batch soldering fixture for LGA packaged devices according to claim 3, characterized in that, An upper limit block is provided at the top of the lead screw.

5. The batch soldering fixture for LGA packaged devices according to claim 1, characterized in that, The number of trays is two, which are respectively set at the two bayonet positions, and the length of the tray is not less than the distance between the first and last slides.

6. The batch soldering fixture for LGA packaged devices according to claim 1, characterized in that, The fixing slot includes a fixing base, a fixing neck, and a V-shaped fixing clip. The fixing neck is vertically disposed on both sides of the fixing base, and the V-shaped fixing clip is disposed at the end of the fixing neck.

7. The batch soldering fixture for LGA packaged devices according to claim 6, characterized in that, The movable slot includes a movable base, a movable neck, and a V-shaped movable locking part. The movable neck is vertically disposed on one side of the middle of the movable base, and the V-shaped movable locking part is disposed at the end of the movable neck. The slot specifications are adapted to the movable neck specifications.

8. The batch soldering fixture for LGA packaged devices according to claim 1, characterized in that, The stencil fixing frame includes a first bracket and a second bracket. The first bracket is provided with a lower positioning pin and an upper positioning pin at its four corners. The lower positioning pin passes through the upper positioning groove on the top of the housing. The upper positioning pin passes through the lower positioning groove of the tin-brushing stencil. The first bracket and the second bracket are connected by screws, and the tin-brushing stencil is fixed between the first bracket and the second bracket.

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