Semiconductor cantilever support horizontal bed lying type welding process

Abstract

The application relates to a semiconductor cantilever support horizontal lying type welding process, which comprises the following steps: 1) positioning of the semiconductor cantilever support; and 2) welding of the semiconductor cantilever support. The application adopts a horizontal lying mode to accurately position various components of a product, and forms relative restrictions in XYZ three axial directions, so that the deformation rate of welding is reduced. Meanwhile, the cantilever and the mounting plate are welded first, then the deformation amount is corrected through the rib plate forming a triangle, and the end cap is sealed and the inner support is arranged, so that the deformation rate of welding is further reduced, so that the product after welding meets the requirements of the levelness and the perpendicularity.

Description

Technical Field

[0001] This invention belongs to the field of special device welding technology, specifically relating to a horizontal welding process for semiconductor cantilever brackets. Background Technology

[0002] As is well known, for welding some special workpieces, once a cantilever is provided, the perpendicularity requirement between the cantilever and the mounting reference surface is very high. Even after effective positioning, it is difficult to guarantee the form and position tolerance of the cantilever due to shrinkage or deformation caused by welding. If effective correction cannot be achieved during the welding process, it will be difficult for the welded product to meet the required quality.

[0003] Semiconductor cantilever brackets have two cantilever arms, which not only have verticality issues, but also parallelism issues between the two cantilever arms. Summary of the Invention

[0004] The technical problem to be solved by the present invention is to overcome the shortcomings of the prior art and provide a novel semiconductor cantilever support bed-laying welding process.

[0005] To solve the above technical problems, the present invention adopts the following technical solution: A bed-mounted flat welding process for a semiconductor cantilever support, the semiconductor cantilever support comprising a mounting plate, two cantilever arms located on both sides of the mounting plate and extending along a direction perpendicular to the mounting plate, and ribs, wherein the cantilever arms are square hollow tubes, and the process includes the following steps: 1) Positioning of the semiconductor cantilever bracket A horizontally positioned bed-type welding positioning device is used to position the cantilever and mounting plate at the welding point in the X, Y, and Z coordinate system. The mounting plate is erected at the head of the bed, and the two cantilever arms are symmetrically distributed on both sides of the bed along the center line of the bed, and are horizontally mounted on the bed and foot of the bed respectively. The head, bed, and foot of the bed are respectively constrained in the X, Y, and Z axes, and the top surface of the cantilever arms is flush with and exposed outside the bed. 2) Welding of semiconductor cantilever brackets First, an end cap is inserted into the end of the square hollow tube away from the mounting plate. Then, a robot is used to weld the cantilever end to the mounting plate. After the two cantilever arms are welded, the rib plates are welded to their respective angles. The rib plates include diagonal braces located on the upper and lower sides of the cantilever arms, with both ends welded flush to the cantilever arms and the mounting plates. The diagonal braces, cantilever arms, and mounting plates form a right triangle.

[0006] Preferably, in step 1), the welding positioning device includes a bed base plate, a headstock located at the head of the bed, a support mold base located at the bed body and the foot of the bed, and a pressing mold base located between the support mold bases, wherein the bed base plate, the headstock, the support mold bases, and the pressing mold bases cooperate to complete the positioning of the cantilever and the mounting plate.

[0007] Furthermore, there are two sets of support mold bases: one set is located at the foot of the bed and is called the foot of the bed support mold base, and the other set is located on the bed and is called the bed support mold base. The distance between the foot of the bed support mold base and the bed support mold base is L1, and the distance between the bed support mold base and the headboard is L2, where L1 > L2.

[0008] According to a specific embodiment and preferred aspect of the present invention, the tail end of the cantilever extends out of the end-of-bed frame support mold base, and the length of the extension is M1, the length abutting between the mounting plate and the bed frame support mold base is M2, and the length located between the end-of-bed frame support mold base and the bed frame support mold base is M3, wherein M1 < M2 < M3, and M3 = L1 ≥ 2M2; L2 = M2 + H, where H is the thickness of the mounting plate; M2 ≥ 5M1.

[0009] Preferably, the tailstock support mold base and the bed support mold base have the same structure, both including a pad support mold located on the bed base plate and extending along the Y-axis, and four partition modules installed on the pad support mold. The four partition modules are arranged in pairs on the Y-axis and form two frame slots. The length of each frame slot on the Y-axis and Z-axis is equal to the width and height of the cantilever, respectively. The two cantilever arms are respectively matched and installed in the frame slots, and the top surface of each cantilever arm is flush with the top surface of the partition module.

[0010] In some specific embodiments, the two frame slots are symmetrically arranged about the center line of the bed base. The lower pressing mold base includes a clamping rod extending along the Y-axis and an adjusting bolt that moves up and down along the Z-axis and is mounted on the bed base. The adjusting bolt passes through the middle of the clamping rod, and the center line of the bed base and the center line of the adjusting bolt are perpendicular and coplanar. And / or, the bottom surface of the clamping rod is horizontal, and the top surface is arched upward from both ends and symmetrically arranged about the middle. When clamping, the bottom surface of the clamping rod is in contact with the top surface of the cantilever, and the two ends of the clamping rod protrude symmetrically from the opposite outer sides of the two cantilever.

[0011] According to another specific embodiment and preferred aspect of the present invention, the headboard includes a headboard upright plate vertically disposed on the bed base plate, a first limiting block and a second limiting block disposed on the grid surface of the headboard upright plate and forming a mounting groove in the Y-axis direction equal to the width of the mounting plate, wherein the first limiting block and the second limiting block are symmetrically arranged about the Z-axis.

[0012] Preferably, a right-angled trapezoidal rib is provided on the back of the headboard, wherein it is fixed to the bed base from the right-angled waist and fixed to the back of the headboard from the bottom edge.

[0013] Preferably, the first limiting block and the second limiting block are located at the middle height position of the mounting plate along the Z-axis direction.

[0014] In addition, in step 2), after the ribs are welded, the ribs on both sides are fixed and welded together using a crossbar along the Y-axis.

[0015] In some specific embodiments, the crossbar consists of an upper bar and a lower bar, wherein the lower bar is welded first, and then the upper bar is welded; and / or, the end cap includes a cap body and an inner core, wherein the inner core matches the inner wall of the square hollow tube, and the inserted length is at least 1 / 3 of the cantilever length.

[0016] Due to the implementation of the above technical solutions, the present invention has the following advantages compared with the prior art: This invention employs a supine position to precisely align the various components of the product and creates relative constraints along the XYZ axes, reducing the deformation rate during welding. Simultaneously, the cantilever and mounting plate are welded first, and then the deformation is corrected by forming triangular ribs. End caps and internal supports are then added to further reduce the deformation rate during welding, thereby ensuring that the welded product meets the requirements for horizontality and verticality. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the welding positioning device for the semiconductor cantilever bracket of this application; Figure 2 for Figure 1 Front view diagram; Figure 3 for Figure 2 A partial sectional view; Among them: 1. Semiconductor cantilever bracket; 10. Mounting plate; 11. Cantilever; 12. Rib plate; 13. Crossbar; 2. Welding positioning device; 20. Bed base plate; 21. Headboard; 210. Headboard upright; 211. First limiting block; 212. Second limiting block; 213. Right-angled trapezoidal rib plate; 22. Frame support mold base; 220. Foot frame support mold base; 221. Bed frame support mold base; a. Pad support mold; b. Divider module; c. Frame groove; 23. Lower pressing mold base; 230. Clamping rod; 231. Adjusting bolt; 3. End cap; 30. Cover body; 31. Inner core; Detailed Implementation

[0018] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, a detailed description of specific embodiments of this application is provided below. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0019] In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating orientation or positional relationship, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0020] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0021] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0022] In this application, unless otherwise expressly specified and limited, "above" or "below" a second feature can mean that the first and second features are in direct contact, or that they are in indirect contact through an intermediate medium. Furthermore, "above," "over," and "on top" of a second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" a second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature. It should be noted that when an element is referred to as "fixed to" or "set on" another element, it can be directly on the other element or there may be an intermediate element present. When an element is considered to be "connected" to another element, it can be directly connected to the other element or there may be an intermediate element present. The terms "vertical," "horizontal," "above," "below," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only possible embodiments.

[0023] like Figure 1 As shown, the semiconductor cantilever bracket horizontal flat welding process of this embodiment involves a semiconductor cantilever bracket 1 including a mounting plate 10, two cantilever 11 located on both sides of the mounting plate 10 and extending along a direction perpendicular to the mounting plate 10, and a rib plate 12, wherein the cantilever 11 is a square hollow tube.

[0024] In this example, a horizontally set bed-type welding positioning device is used to position the cantilever 11 and the mounting plate 10 at the welding point in the X, Y, and Z coordinate system. The mounting plate 10 is erected at the head of the bed, and the two cantilever 11 are symmetrically distributed on both sides of the bed with respect to the center line of the bed. They are horizontally mounted on the bed body and the foot of the bed, respectively. The head, bed body, and foot of the bed are respectively constrained in the X, Y, and Z axes, and the top surface of the cantilever is flush with and exposed outside the bed body.

[0025] Specifically, the welding positioning device 2 is bed-shaped, with the mounting plate 10 vertically installed at the head of the bed, the cantilever 11 horizontally extending to the foot of the bed and mounted on the bed body and foot of the bed, and the rib plate 12 located on the upper and lower sides of the cantilever 11.

[0026] The welding positioning device 2 includes a bed base plate 20, a headstock 21 located at the head of the bed, a support mold base 22 located at the bed and foot of the bed, and a lower pressure mold base 23 located between the support mold bases 22. It should be noted that the lower pressure mold base 23 is located between the support mold bases 22, and its layout is mainly based on the length of the cantilever 11, which not only simplifies the structure but also meets the needs of welding the cantilever surface.

[0027] In other words, the bed base plate 20, headboard 21, support mold base 22, and pressing mold base 23 work together to position the cantilever 11 and mounting plate 10 at the weld joint in the X, Y, and Z coordinate systems.

[0028] To illustrate more clearly, the structural layout of this embodiment is defined with the length, width, and height of the bed as the X, Y, and Z axes, respectively. The support mold bases 22 are distributed at intervals along the X-axis, and the pressing mold bases 23 correspond one-to-one with the support mold bases 22 and are distributed at intervals along the X-axis.

[0029] There are two sets of support mold bases 22: one set located at the foot of the bed and called the footboard support mold base 220, and the other set located on the bed and called the bed frame support mold base 221. The distance between the footboard support mold base 220 and the bed frame support mold base 221 is L1, and the distance between the bed frame support mold base 221 and the headboard seat 21 is L2, where L1 > L2. In this way, the support mold bases can be arranged in a general layout with relative positions, and the relative positions of the pressing mold base and the headboard seat are also completed.

[0030] The cantilever 11 is a square hollow tube, with the tail end of the cantilever 11 extending out of the tailstock support mold base 220, and the end end is also provided with a sealing cap 3.

[0031] Specifically, the length of the cantilever 11 extending beyond the end of the bed frame support mold base 220 is M1, the length abutting between the mounting plate 10 and the bed frame support mold base 221 is M2, and the length between the end of the bed frame support mold base 220 and the bed frame support mold base 221 is M3, where M1 < M2 < M3. Based on the above support mold base layout, the cantilever is divided and positioned along its length.

[0032] In this example, M3 = L1 ≥ 2M2; L2 = M2 + H, where H is the thickness of the mounting plate; M2 ≥ 5M1. Based on these parameters and the length of the cantilever, the distance relationship between the headstock, bed frame support mold base, and tailstock support mold base can be determined. This optimal layout reduces the deformation rate during welding and further improves the verticality and horizontality requirements after welding.

[0033] The tailstock support mold base 220 and the bed support mold base 221 have the same structure, both including a support mold a located on the bed base plate 20 and extending along the Y-axis, and four partition modules b installed on the support mold a. The four partition modules b are arranged in pairs along the Y-axis, forming two support slots c. The length of each support slot c along the Y-axis and Z-axis is equal to the width and height of the cantilever 11, respectively. The two cantilever 11s are respectively matched and installed in the support slots c, and the top surface of each cantilever 11 is flush with the top surface of the partition module b. That is to say, the support slots enable the cantilever to move in the Z-axis and Y-axis directions. At the same time, the top surface of the partition module is flush with the top surface of the cantilever, further improving the flatness of the cantilever surface welding and reducing the probability of deformation.

[0034] The two support slots c are symmetrically arranged about the center line of the bed base plate 20. In this way, the parallelism is effectively controlled with the center line as a reference, and the principle of two points determining a straight line is adopted to ensure the straightness of the cantilever 11 and reduce the welding deformation rate.

[0035] The lower pressure mold base 23 includes a clamping rod 230 extending along the Y-axis and an adjusting bolt 231 that moves up and down along the Z-axis and is mounted on the bed base plate 20. The adjusting bolt 231 passes through the middle of the clamping rod 230, and the center line of the bed base plate 20 and the center line of the adjusting bolt 231 are perpendicular and coplanar. This results in a relatively balanced clamping force.

[0036] The bottom surface of the clamping rod 230 is horizontal, and the top surface is arched upwards from both ends, symmetrically arranged about the middle. During clamping, the bottom surface of the clamping rod 230 is in contact with the top surface of the cantilever 11, and the two ends of the clamping rod 230 protrude symmetrically from the opposite outer sides of the two cantilever 11, ensuring that a relatively balanced clamping force is applied.

[0037] The headboard 21 includes a headboard upright 210 vertically mounted on the bed base plate 20, a first limiting block 211 and a second limiting block 212 mounted on the grid surface of the headboard upright 210 and forming a mounting groove in the Y-axis direction with a width equal to that of the mounting plate 10. The first limiting block 211 and the second limiting block 212 are symmetrically arranged about the Z-axis, and the first limiting block 211 and the second limiting block 212 are located at the middle of the height formed by the mounting plate in the Z-axis direction.

[0038] A right-angled trapezoidal rib 213 is provided on the back of the headboard 210, which is fixed to the bed base 20 from the right-angle waist and fixed to the back of the headboard 210 from the bottom edge.

[0039] In this example, there are three right-angled trapezoidal ribs 213, which are evenly spaced along the Y-axis.

[0040] In summary, the welding process in this embodiment is as follows: 1) Positioning of the semiconductor cantilever bracket A horizontally positioned bed-type welding positioning device is used to position the cantilever and mounting plate at the welding point in the X, Y, and Z coordinate system. The mounting plate is erected at the head of the bed, and the two cantilever arms are symmetrically distributed on both sides of the bed along the center line of the bed, and are horizontally mounted on the bed and foot of the bed respectively. The head, bed, and foot of the bed are respectively constrained in the X, Y, and Z axes, and the top surface of the cantilever arms is flush with and exposed outside the bed. 2) Welding of semiconductor cantilever brackets First, an end cap is inserted into the end of the square hollow tube away from the mounting plate. Then, a robot is used to weld the cantilever end to the mounting plate. After the two cantilever arms are welded, the rib plates are welded to their respective angles. The rib plates include diagonal braces located on the upper and lower sides of the cantilever arms, with both ends welded flush to the cantilever arms and the mounting plates. The diagonal braces, cantilever arms, and mounting plates form a right triangle.

[0041] Meanwhile, in step 2), after the welding of the rib plate 12 is completed, the two rib plates are fixedly welded using the crossbar 13 along the Y-axis direction.

[0042] The crossbar 13 consists of an upper bar and a lower bar. The lower bar is welded first, followed by the upper bar.

[0043] Combination Figure 3 As shown, the end cap 3 includes a cap body 30 and an inner core 31, wherein the inner core 31 matches the inner wall of the square hollow tube, and the inserted length is 1 / 3 of the length of the cantilever 11. At this time, the main function of the end cap 3 and the inner core 31 is to reduce the deformation rate of each surface when welding the circumferential surface of the cantilever, so as to meet the requirements of flatness welding.

[0044] In summary, this embodiment has the following advantages: 1. The product components are precisely aligned by lying flat on a bed, and relative constraints are formed in the XYZ three axes to reduce the deformation rate during welding. At the same time, the cantilever and mounting plate are welded first, and then the deformation is corrected by forming triangular ribs. End caps and internal supports are then installed to further reduce the deformation rate during welding, thereby ensuring that the product meets the requirements for horizontality and verticality after welding.

[0045] 2. Based on actual parameters and the length of the cantilever, the distance relationship between the headstock, bed frame support mold base, and tailstock support mold base can be determined. This optimal layout reduces the welding deformation rate and further improves the verticality and horizontality requirements after welding.

[0046] 3. The slot allows the cantilever to move in the Z and Y axes. At the same time, the top surface of the partition module is flush with the top surface of the cantilever, further improving the flatness of the cantilever surface welding and reducing the probability of deformation. The parallelism is effectively controlled with the center line as the reference, and the principle of two points determining a straight line is adopted to ensure the straightness of the cantilever and reduce the welding deformation rate.

[0047] 4. The position and angle between the cantilever and the mounting plate during welding will not generate stress during the welding process, thus preventing workpiece deformation; at the same time, the bed shape facilitates the rapid assembly and welding of various components; in addition, the clamping mode not only creates a limiting force in the Z-axis direction, but also does not affect the welding operation on the cantilever frame surface.

[0048] 5. The end cap design adopted can reduce the deformation rate of each surface when welding the circumferential surface of the cantilever, so as to meet the requirements of flatness welding.

[0049] The present invention has been described in detail above, with the aim of enabling those skilled in the art to understand and implement the invention. However, this description should not be construed as limiting the scope of protection of the invention. All equivalent changes or modifications made in accordance with the spirit and essence of the invention should be included within the scope of protection of the invention.

Claims

1. A bed-mounted flat welding process for a semiconductor cantilever support, the semiconductor cantilever support comprising a mounting plate, two cantilever arms located on both sides of the mounting plate and extending along a direction perpendicular to the mounting plate, and ribs, wherein the cantilever arms are square hollow tubes, characterized in that: It includes the following steps: 1) Positioning of the semiconductor cantilever bracket A horizontally positioned bed-type welding positioning device is used to position the cantilever and mounting plate at the welding point in the X, Y, and Z coordinate system. The mounting plate is erected at the head of the bed, and the two cantilever arms are symmetrically distributed on both sides of the bed along the centerline of the bed, and are horizontally mounted on the bed and foot of the bed, respectively. The head, bed, and foot of the bed are constrained along the X, Y, and Z axes, and the top surfaces of the cantilever arms are flush with and exposed outside the bed. The welding positioning device includes a bed base plate, a headstock at the head of the bed, a support mold base at the bed and foot of the bed, and a pressing mold base between the support mold bases. There are two sets of support mold bases: one set at the foot of the bed and the other set at the bed. The tail support mold base and the bed support mold base have the same structure, both including a pad mold on the bed base plate extending along the Y-axis, and four partition modules mounted on the pad mold. The four partition modules are arranged in pairs along the Y-axis. Two frame slots are formed, with the length of each slot on the Y-axis and Z-axis equal to the width and height of the cantilever, respectively. The two cantilever arms are respectively matched and installed in the frame slots, and the top surface of each cantilever arm is flush with the top surface of the partition module; the headboard includes a headboard upright plate vertically set on the bed base plate, a first limiting block and a second limiting block set on the grid surface of the headboard upright plate and forming an installation slot in the Y-axis direction equal to the width of the mounting plate; the distance between the tailstock support mold base and the bed frame support mold base. Let L1 be the distance between the bed frame support and the headstock, and L2 be the distance between them. L1 > L2. The tail end of the cantilever extends out of the bed frame support with a length of M1. The length of the cantilever that abuts against the mounting plate and the bed frame support is M2. The length of the cantilever that lies between the bed frame support and the headstock support is M3. M1 < M2 < M3, and M3 = L1 ≥ 2M2. L2 = M2 + H, where H is the thickness of the mounting plate, and M2 ≥ 5M1. 2) Welding of semiconductor cantilever brackets First, an end cap is inserted into the end of the square hollow tube furthest from the mounting plate. Then, a robot is used to weld the cantilever end to the mounting plate. After welding the two cantilever arms, the rib plates are welded at angles. The end cap includes a cap body and an inner core. The inner core matches the inner wall of the square hollow tube, and the inserted length is at least 1 / 3 of the cantilever length. The rib plates include diagonal braces located on the upper and lower sides of the cantilever, with both ends welded flush to the cantilever and the mounting plate. The diagonal braces, cantilever, and mounting plate form a right triangle.

2. The semiconductor cantilever support bed-mounted flat welding process according to claim 1, characterized in that: In step 1), the bed base, headboard, support mold base, and lower pressure mold base work together to position the cantilever and mounting plate.

3. The semiconductor cantilever support bed-mounted flat welding process according to claim 1, characterized in that: The two frame slots are symmetrically arranged about the center line of the bed base. The lower pressing mold base includes a clamping rod extending along the Y-axis and an adjusting bolt that moves up and down along the Z-axis and is mounted on the bed base. The adjusting bolt passes through the middle of the clamping rod. The center line of the bed base and the center line of the adjusting bolt are perpendicular and coplanar.

4. The semiconductor cantilever support bed-mounted flat welding process according to claim 3, characterized in that: The bottom surface of the clamping rod is horizontal, and the top surface is arched upward from both ends and symmetrically arranged about the middle. When clamping, the bottom surface of the clamping rod is in contact with the top surface of the cantilever, and the two ends of the clamping rod protrude symmetrically from the opposite outer sides of the two cantilever.

5. The semiconductor cantilever support bed-mounted flat welding process according to claim 1, characterized in that: The first limiting block and the second limiting block are symmetrically arranged about the Z-axis.

6. The semiconductor cantilever support bed-mounted flat welding process according to claim 5, characterized in that: A right-angled trapezoidal rib is provided on the back of the headboard, which is fixed to the bed base from the right angle and fixed to the back of the headboard from the bottom edge.

7. The semiconductor cantilever support bed-mounted flat welding process according to claim 6, characterized in that: The first and second limiting blocks are located at the midpoint of the mounting plate along the Z-axis.

8. The semiconductor cantilever support bed-mounted flat welding process according to claim 1, characterized in that: In step 2), after the ribs are welded, the ribs on both sides are fixed and welded together using a crossbar along the Y-axis.

9. The semiconductor cantilever support bed-mounted flat welding process according to claim 8, characterized in that: The crossbar consists of an upper bar and a lower bar, with the lower bar being welded first, followed by the upper bar.

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