Capacitor package structure and method of manufacturing the same
CN116190122BActive Publication Date: 2026-10-27SHANGHAI SUNSHINE TECH CO LTD
Patent Information
- Application Number
- CN202310161246.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2023-02-24
- Publication Date
- 2026-10-27
- Estimated Expiration
- 2043-02-24
AI Technical Summary
Technical Problem
[0005]鉴于以上所述现有技术的缺点，本发明的目的在于提供一种电容器封装结构及其制备方法，用以解决现有技术的硅基电容器的寄生电阻大、封装尺寸大、可靠性差的问题
Benefits of technology
[0024]本发明的制备方法先将芯片电容器进行塑封，再进行开孔，可以大大减小封装的尺寸，使得封装后的尺寸和芯片电容器的尺寸基本保持一致，并且可以满足各种通用尺寸的规格要求，而且，通过本发明的封装结构大大提高芯片电容器的可靠性；本发明的制备方法通过扇出金属引线，缩短了信号传输路径，也减小了寄生电阻等参数，并且避免了打线工艺过程中的悬浮引线，可靠性也可以得到进一步的提高；本发明的制备方法成本低，无需开模，制造工艺具有很好的灵活性；本发明的封装结构简化了芯片电容器后续的使用步骤，使其更加便捷，并且兼具芯片电容器性能优异的特点。
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Figure CN116190122B_ABST
Abstract
The application provides a capacitor packaging structure and a preparation method thereof. The preparation method comprises the following steps: providing a substrate and a chip capacitor, and mounting the chip capacitor on the substrate; forming a first plastic sealing layer on the substrate and the chip capacitor, the height of the first plastic sealing layer is higher than that of the chip capacitor, and a packaging structure is formed; forming an opening on the packaging structure; forming a fan-out metal lead in the opening; forming a second plastic sealing layer on the packaging structure, and the height of the second plastic sealing layer is higher than that of the fan-out metal lead. The chip capacitor is first plastic sealed, and then the opening is formed, so that the size of the packaging can be reduced, the size of the packaging is basically consistent with that of the chip capacitor, the specification requirements of various general sizes are met, the reliability of the chip capacitor can be improved, the signal transmission path is shortened through the fan-out metal lead, the parasitic resistance and other parameters are reduced, the suspended lead in the wire bonding process is avoided, and the reliability can be further improved.
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Citation Information
Patent Citations
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