A silicon carbide module package structure, a manufacturing apparatus, and a manufacturing method

Abstract

The application discloses a silicon carbide module packaging structure, a preparation device and a preparation method, and comprises the following steps: S1, blanking: conveying the packaging box to the mounting plate through the conveying line for mounting; S2, die punching: conveying the material after mounting to the die punching station through the conveying line, and performing forming processing on the material below through the die punching mechanism; S3, surface treatment: conveying the processed material to the grinding machine station through the conveying line, and performing surface deburring and polishing; S4, installing the chip: placing the control board in the packaging box through the clamp; S5, glue filling and packaging: filling glue into the packaging box, and covering the packaging plate on the packaging box through the clamp; and S6, drying: air cooling and drying the packaged silicon carbide module, and rapidly condensing the filled glue; the control board in the module is clamped and mounted in the fixing cylinder in the packaging box, and is fixed through the filled glue, so that the silicon carbide module can work in a high-power or high-temperature environment.

Description

Technical Field

[0001] This invention relates to the field of silicon carbide power device manufacturing, and in particular to a silicon carbide module packaging structure, preparation apparatus and preparation method. Background Technology

[0002] Power semiconductor devices are widely used in computers, industrial control, automotive electronics, locomotive traction, steel smelting, high-power power supplies, power systems and other fields. In addition to ensuring the normal operation of these devices, power devices can also play an effective role in energy saving and are indispensable in developing a low-carbon economy, energy conservation and emission reduction, and controlling climate change.

[0003] Patent CN 102148169 A discloses a packaging method and a silicon carbide power module. The method involves welding an aluminum nitride isolation layer onto a molybdenum plate, placing a silicon carbide chip into the space of the aluminum nitride isolation layer, and welding it to the molybdenum plate. A molybdenum block is welded onto the silicon carbide chip, with a pre-drilled gate lead slot on the block. Leads are placed in the gate lead slot, welded in place, collected, and led out. The molybdenum plate, silicon nitride isolation layer, and silicon carbide chip are integrally cast with epoxy resin, and a base, housing, and cap are installed for encapsulation. This allows the power module to operate under high power and high temperature conditions. However, this welding process only addresses the heat dissipation of the welded portion of the silicon carbide chip and does not further address the temperature dissipation and high-temperature resistance of the entire encapsulated silicon carbide module. Summary of the Invention

[0004] This invention addresses the shortcomings of existing silicon carbide module packaging structures and manufacturing processes in meeting the requirements of high-power and high-temperature applications of silicon carbide modules. It presents a silicon carbide module packaging structure, manufacturing apparatus, and manufacturing method specifically designed for this purpose.

[0005] To achieve the above objectives, the present invention adopts the following technical solution: a method for preparing a silicon carbide module, comprising:

[0006] S1: Unloading: The packaging box is conveyed to the mounting plate via a conveyor line for installation;

[0007] S2: Stamping Die: The installed material is transported to the stamping die station by the conveyor line, and the stamping die mechanism shapes the material below.

[0008] S3: Surface treatment: The conveyor line transports the processed material to the mill station for surface deburring and polishing;

[0009] S4: Chip Installation: The control board is clamped and placed inside the package using a fixture;

[0010] S5: Potting and encapsulation: Potting glue into the encapsulation box and using a clamp to cover the encapsulation board on the encapsulation box;

[0011] S6: Drying: The encapsulated silicon carbide module is air-cooled and dried, while the potting compound is rapidly solidified.

[0012] As a further description of the above technical solution: step S2 also includes:

[0013] S21: The conveyor line is equipped with an adjustable opening and closing buckle. The position of each packaging box is calibrated by mechanical positioning, and the interior of the packaging box is processed by a punching machine.

[0014] As a further description of the above technical solution: step S5 also includes:

[0015] S51: Apply adhesive to the encapsulation box using the dispensing head, thereby securing the control board inside the encapsulation box.

[0016] S52: The control board is gripped by a clamp, and the connection terminals on the control board and the through slot on the encapsulation board are aligned by a positioning mechanism on one side. After alignment, the clamp places the encapsulation board on the encapsulation box, so that the wiring terminals extend outward from the through slot.

[0017] It also includes a silicon carbide module fabrication apparatus, said fabrication apparatus being used in the fabrication method described in any one of the above technical solutions, comprising:

[0018] A conveying device is used to transport the packaging box to the top of the mounting plate for installation;

[0019] The stamping mechanism positions the conveyed mounting plate and stamps the interior of the packaging box.

[0020] The grinding mill is used to polish the formed packaging box and remove excess burrs generated during stamping.

[0021] After polishing, the control board is clamped and placed inside the packaging box using a fixture.

[0022] The dispensing head dispenses adhesive into the interior of the encapsulation box and uses the clamps to hold the encapsulation plate and mount it onto the encapsulation box.

[0023] A fan, located on one side of the preparation device, is used to air-cool and dry the encapsulated silicon carbide module and to rapidly solidify the potting compound.

[0024] It also includes a silicon carbide module packaging structure, comprising: a mounting plate;

[0025] The mounting plate is provided with positioning holes and connection holes, and the encapsulation box is installed on the mounting plate through the connection holes.

[0026] A packaging plate is provided above the packaging box, forming a volume cavity with the packaging box, and a control plate is placed inside the volume cavity;

[0027] A limiting groove is provided on the top side wall of the packaging box. The packaging plate is adapted to the shape of the packaging box and is placed on the limiting groove to limit the position of the packaging plate.

[0028] As a further description of the above technical solution: a rectangular fixing cylinder is provided on the bottom inner side of the packaging box, and the fixing cylinder is placed vertically at the bottom of the packaging box.

[0029] As a further description of the above technical solution: the area of ​​the fixed cylinder is adapted to that of the control plate, so that the control plate is placed inside the fixed cylinder.

[0030] As a further description of the above technical solution: the packaging board has several through slots, and the control board has several connecting terminals welded on it. The connecting terminals extend outward from the through slots to the outside of the packaging board.

[0031] As a further description of the above technical solution: a limiting post is provided on the inner side of the packaging plate, the limiting post is integrally connected with the packaging plate, the limiting post extends downward and is located above the control plate, thereby limiting the displacement of the control plate.

[0032] As a further description of the above technical solution: the encapsulation plate has seven through slots, four of which are set on one side of the encapsulation plate as wiring terminals and are arranged in pairs at equal intervals, and the other three are set in the middle of the encapsulation plate so that the connection contact end face can extend outward.

[0033] The above technical solution has the following advantages or beneficial effects:

[0034] 1. In this application, the silicon carbide chips are arranged in a parallel and symmetrical manner on the control board, which has good current distribution. The control board is installed in the fixing cylinder inside the package box by snap-fit ​​and is fixed by potting glue, so that the silicon carbide module can work in high power or high temperature environment. Attached Figure Description

[0035] Figure 1 This is a flowchart of a silicon carbide module preparation method proposed in this invention;

[0036] Figure 2 This is a flowchart of the silicon carbide module preparation method proposed in this invention;

[0037] Figure 3 This is a flowchart of the silicon carbide module preparation method proposed in this invention;

[0038] Figure 4 This is a three-dimensional view of the internal structure of the silicon carbide module packaging structure proposed in this invention;

[0039] Figure 5 This is a top view of the silicon carbide module packaging structure proposed in this invention;

[0040] Figure 6 This is a side view of the silicon carbide module packaging structure proposed in this invention;

[0041] Figure 7 This is a schematic diagram of the internal structure of the silicon carbide module packaging structure proposed in this invention;

[0042] Figure 8 This is a schematic diagram of the internal circuit connection of the silicon carbide module proposed in this invention.

[0043] Legend:

[0044] 1. Mounting plate; 2. Encapsulation box; 3. Encapsulation board; 4. Control board. Detailed Implementation

[0045] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0046] Reference Figures 1-8 One embodiment of the present invention provides a method for preparing a silicon carbide module, comprising:

[0047] S1: Unloading: The packaging box is conveyed to the mounting plate via a conveyor line for installation;

[0048] S2: Stamping Die: The installed material is transported to the stamping die station by the conveyor line, and the stamping die mechanism shapes the material below.

[0049] S3: Surface treatment: The conveyor line transports the processed material to the mill station for surface deburring and polishing;

[0050] S4: Chip Installation: The control board is clamped and placed inside the package using a fixture;

[0051] S5: Potting and encapsulation: Potting glue into the encapsulation box and using a clamp to cover the encapsulation board on the encapsulation box;

[0052] S6: Drying: The encapsulated silicon carbide module is air-cooled and dried, while the potting compound is rapidly solidified.

[0053] In this embodiment, the encapsulation box 2 is conveyed to the mounting plate 1 via a conveyor line. The mounting plate 1 has threaded holes at its bottom, and the encapsulation box 2 also has threaded holes at its bottom that match the mounting plate 1. The mounting plate 1 and the encapsulation box 2 are connected by bolts. The mounting plate 1 is made of stainless steel, and the encapsulation box 2 is made of a polymer, specifically plastic. The assembled mounting plate 1 and encapsulation box 2 are conveyed to a die-cutting machine for processing. The die-cutting machine punches the inside of the encapsulation box 2 to create a fixed cylinder. The fixed cylinder is rectangular and is used to hold the silicon carbide control board. After the die-cutting is completed, surface treatment is performed. Burrs generated during the die-cutting process are removed by a grinding drill, and the encapsulation box 2 is chamfered. After surface treatment, it enters the installation station. The welded control board 4 is placed in the fixed cylinder using a fixture, and then it enters the potting and encapsulation station to pot and fix the control board 4. This also serves as a buffer and shock absorber. After the potting is completed, the encapsulation plate 3 is installed on top of the encapsulation box 2 and air-dried to fix the encapsulation structure.

[0054] Reference Figure 2 Furthermore, step S2 also includes:

[0055] S21: The conveyor line is equipped with an adjustable opening and closing buckle. The position of each packaging box is calibrated by mechanical positioning, and the interior of the packaging box is processed by a punching machine.

[0056] In this embodiment, a convex slider is provided on one side of the conveyor line. After the packaging box 2 is inserted, the slider is pushed to rotate, causing the front buckle to rotate and block the mounting plate 1, thereby fixing the position of the mounting plate 1 and the packaging box 2.

[0057] Reference Figure 3 Step S5 further includes:

[0058] S51: Apply adhesive to the encapsulation box using the dispensing head, thereby securing the control board inside the encapsulation box.

[0059] S52: The control board is gripped by a clamp, and the connection terminals on the control board and the through slot on the encapsulation board are aligned by a positioning mechanism on one side. After alignment, the clamp places the encapsulation board on the encapsulation box, so that the wiring terminals extend outward from the through slot.

[0060] In this embodiment, a fixing adhesive, which can be epoxy resin, is injected into the encapsulation box 2 through a dispensing head to fix the internal control board 4. After fixing, the control board 4 is clamped by a fixture, and a positioning mechanism aligns the wiring terminals on the control board 4 with the through slots on the encapsulation board 3, allowing the wiring terminals to extend outward from the through slots. This facilitates connection with external systems.

[0061] The present invention also includes an embodiment of a silicon carbide module fabrication apparatus, wherein the fabrication apparatus is used in the fabrication method described in any one of the above technical solutions, comprising:

[0062] A conveying device is used to transport the packaging box to the top of the mounting plate for installation;

[0063] The stamping mechanism positions the conveyed mounting plate and stamps the interior of the packaging box.

[0064] The grinding mill is used to polish the formed packaging box and remove excess burrs generated during stamping.

[0065] After polishing, the control board is clamped and placed inside the packaging box using a fixture.

[0066] The dispensing head dispenses adhesive into the interior of the encapsulation box and uses the clamps to hold the encapsulation plate and mount it onto the encapsulation box.

[0067] A fan, located on one side of the preparation device, is used to air-cool and dry the encapsulated silicon carbide module and to rapidly solidify the potting compound.

[0068] In this embodiment, the encapsulation box 2 is conveyed to the top of the mounting plate 1 via a conveyor line. The bottom of the mounting plate 1 is provided with threaded holes, and the bottom of the encapsulation box 2 is also provided with threaded holes that match the mounting plate 1. The mounting plate 1 and the encapsulation box 2 are connected by bolts. The assembled mounting plate 1 and the encapsulation box 2 are then conveyed to a die-cutting machine for processing. The die-cutting machine punches the inside of the encapsulation box 2 to create a fixed cylinder. The fixed cylinder is rectangular and is used to hold the silicon carbide control board. After the die-cutting is completed, surface treatment is performed. The burrs generated during the die-cutting process are removed by a grinding drill, and the encapsulation box 2 is chamfered to achieve a burr removal and polishing process. After the surface treatment is completed, the encapsulation box 2 enters the installation station. The control board 4 is placed inside the fixed cylinder by a fixture, and then enters the potting and encapsulation station. The inside of the fixed cylinder is potted with glue by a potting head to fix the control board 4. After the glue is injected, the encapsulation plate 3 is installed on top of the encapsulation box 2 by a fixture. The encapsulation plate 3 is then air-dried by a fan on one side to allow the glue to solidify quickly and fix the encapsulation structure.

[0069] Reference Figures 4-6 The present invention also provides an embodiment of a silicon carbide module packaging structure.

[0070] Includes: mounting plate 1; mounting plate 1 has positioning holes and connecting holes on its top, through which encapsulation box 2 is installed on top of mounting plate 1; encapsulation plate 3 is provided on top of encapsulation box 2, forming a volume cavity with encapsulation box 2, and a control plate 4 is placed in the volume cavity; a limiting groove is provided on the top side wall of encapsulation box 2, the shape of encapsulation plate 3 is adapted to encapsulation box 2, and encapsulation plate 3 is placed on the limiting groove to limit the encapsulation plate 3.

[0071] The mounting plate 1 is provided with connection holes, which are connected and fixed by bolts to the threaded holes on the encapsulation box 2. The encapsulation box 2 and the encapsulation plate 3 cooperate to form a solvent cavity, which can place the control board 4 inside the volume cavity. The control board 4 is then encapsulated by a potting process, so that the control board 4 can be fixed in the volume cavity.

[0072] Referring to the attached diagram, a rectangular fixing cylinder is provided on the bottom inner side of the packaging box 2. The fixing cylinder is placed vertically at the bottom of the packaging box 2. The area of ​​the fixing cylinder is adapted to that of the control board 4, so that the control board 4 is placed inside the fixing cylinder.

[0073] In this embodiment, the packaging box 2 is formed into a fixed cylinder by a punching die, so that the control board 4 can be placed in the fixed cylinder to prevent the control board from shifting. Positioning cylinders are provided on both sides of the packaging box 2 for position calibration and positioning.

[0074] Specifically, a limiting post is provided on the inner side of the encapsulation plate 3. The limiting post is integrally connected with the encapsulation plate 3. The limiting post extends downward and is located above the control plate 4 to limit the displacement of the control plate 4.

[0075] Referring to the attached drawings, the encapsulation plate 3 has several through slots, and the control plate 4 has several connecting terminals welded on it. The connecting terminals extend outward from the through slots to the outside of the encapsulation plate 3. The encapsulation plate 3 has seven through slots, four of which are set on one side of the encapsulation plate 3 as wiring terminals, arranged in pairs at equal intervals, and the other three are set in the middle of the encapsulation plate 3, so that the connection contact end face can extend outward.

[0076] Finally, it should be noted that the above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A method for preparing a silicon carbide module, characterized in that, include: S1: Unloading: The packaging box is conveyed to the mounting plate via a conveyor line for installation; S2: Stamping Die: The installed material is transported to the stamping die station by the conveyor line, and the stamping die mechanism shapes the material below. S3: Surface treatment: The conveyor line transports the processed material to the mill station for surface deburring and polishing; S4: Chip Installation: The control board is clamped and placed inside the package using a fixture; S5: Potting and encapsulation: Potting glue into the encapsulation box and using a clamp to cover the encapsulation board on the encapsulation box; S6: Drying: The encapsulated silicon carbide module is air-cooled and dried at the same time the potting adhesive is quickly solidified. Step S2 further includes: S21: The conveyor line is equipped with an adjustable opening and closing buckle. The position of each packaging box is calibrated by mechanical positioning. The inside of the packaging box is processed by a punching machine to produce a fixed cylinder. The fixed cylinder is rectangular and is used to place the silicon carbide control board. The control board is installed in the fixed cylinder inside the packaging box by snap-fit. Step S5 further includes: S51: Apply adhesive to the encapsulation box using the dispensing head, thereby securing the control board inside the encapsulation box. S52: The control board is gripped by a clamp, and the connection terminals on the control board and the through slot on the encapsulation board are aligned by a positioning mechanism on one side. After alignment, the clamp places the encapsulation board on the encapsulation box, so that the wiring terminals extend outward from the through slot.

2. A silicon carbide module fabrication apparatus, characterized in that, The preparation apparatus is used in the preparation method according to claim 1, comprising: A conveying device is used to transport the packaging box to the top of the mounting plate for installation; The conveyor line is equipped with adjustable latches, and the position of each packaging box is calibrated through mechanical positioning. The stamping mechanism positions the conveyed mounting plate and stamps the interior of the packaging box. The inside of the packaging box is processed by a punching machine to produce a fixed cylinder. The fixed cylinder is rectangular and is used to hold the silicon carbide control board. The control board is installed in the fixed cylinder inside the packaging box by snap-fit. The grinding mill is used to polish the formed packaging box and remove excess burrs generated during stamping. After polishing, the control board is clamped and placed inside the packaging box using a fixture. The dispensing head dispenses adhesive into the interior of the encapsulation box and uses the clamps to hold the encapsulation plate and mount it onto the encapsulation box. The adhesive is injected into the encapsulation box using a dispensing head, and the control board inside the encapsulation box is then fixed in place. The control board is gripped by a fixture, and the connection terminals on the control board are aligned with the through slots on the encapsulation board by a positioning mechanism on one side. After alignment, the fixture places the encapsulation board on the encapsulation box, so that the wiring terminals extend outward from the through slots. A fan is installed on one side of the preparation device to air-cool and dry the encapsulated silicon carbide module and to rapidly solidify the potting adhesive. The silicon carbide module includes: Mounting plate (1); The mounting plate (1) is provided with positioning holes and connecting holes, and the encapsulation box (2) is installed on the mounting plate (1) through the connecting holes. A packaging plate (3) is provided above the packaging box (2), forming a volume cavity with the packaging box (2), and a control plate (4) is placed inside the volume cavity. A limiting groove is provided on the top side wall of the packaging box (2). The shape of the packaging plate (3) is adapted to the shape of the packaging box (2), and the packaging plate (3) is placed on the limiting groove to limit the packaging plate (3).

3. The silicon carbide module fabrication apparatus according to claim 2, characterized in that: The bottom inner side of the packaging box (2) is provided with a rectangular fixing cylinder, which is placed vertically at the bottom of the packaging box (2).

4. The silicon carbide module fabrication apparatus according to claim 3, characterized in that: The area of ​​the fixed cylinder is adapted to that of the control plate (4), so that the control plate (4) is placed inside the fixed cylinder.

5. The silicon carbide module fabrication apparatus according to claim 2, characterized in that: The encapsulation plate (3) has several through slots, and the control plate (4) has several connecting terminals welded on it. The connecting terminals extend outward from the through slots to the outside of the encapsulation plate (3).

6. The silicon carbide module fabrication apparatus according to claim 2, characterized in that: The inner side of the encapsulation plate (3) is provided with a limiting post. The limiting post is integrally connected with the encapsulation plate (3). The limiting post extends downward and is located above the control plate (4) to limit the displacement of the control plate (4).

7. The silicon carbide module fabrication apparatus according to claim 2, characterized in that: The encapsulation plate (3) has seven through slots, four of which are set as wiring terminals on one side of the encapsulation plate (3) and arranged in pairs at equal intervals. The other three are set in the middle of the encapsulation plate (3) so that the connection contact end face can extend outward.

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