晶圆扩膜机构
By combining wafer iron ring positioning and transmission mechanism with limiting components and high-precision support columns, the problem of chip instability after wafer expansion is solved, and horizontal positioning of the chip after wafer expansion is achieved, avoiding damage during the wafer removal process.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- ZHUZHOU CRRC TIMES SEMICON CO LTD
- Filing Date
- 2022-12-13
- Publication Date
- 2026-07-17
AI Technical Summary
Existing film expansion mechanisms cannot guarantee that the chips are level after wafer expansion, which makes the chips prone to edge chipping, breakage or sticking during wafer removal, and the transmission mechanism is not stable.
The wafer is positioned using a wafer iron ring. The outer ring of the film expansion is driven to descend by the first transmission mechanism and, together with the inner ring of the film expansion, holds the wafer thin film. The outer ring of the film expansion is kept horizontal by a limiting component. The inner ring is rotated by the second transmission mechanism to achieve dynamic balance support. High-precision planar support columns and limiting components are used to ensure that the wafer is horizontal after film expansion.
This effectively ensures that the chip is level after wafer expansion, avoiding edge chipping, breakage, or adhesion during wafer removal, and ensuring stable operation of the expansion process.
Smart Images
Figure CN116190300B_ABST