Display panel, preparation method thereof and display device

Abstract

The application discloses a display panel and a preparation method thereof and a display device. The display panel comprises: a driving module comprising a first substrate; a driving circuit layer arranged on one side of the first substrate; a conductive column arranged on a side of the driving circuit layer away from the first substrate; and a connecting layer arranged in a first opening. The chip module comprises a second substrate; a packaged chip layer arranged on one side of the second substrate; a bonding conductive layer arranged on a side of the packaged chip layer away from the second substrate, comprising a plurality of bonding electrodes; and a transition layer arranged on a side of the bonding conductive layer away from the packaged chip layer. The transition layer has a recess portion corresponding to the position of the conductive column. The transition layer is bonded to the connecting layer. The recess portion is used for accommodating the conductive column. Each conductive column is electrically connected to the chip through one bonding electrode. The scheme can effectively improve the problems of misalignment, warping, electrode short circuit and the like caused by inaccurate alignment between the chip electrode and the conductive column, and improves the yield of the display panel.

Description

Technical Field

[0001] This invention relates to the field of display technology, and more particularly to a display panel, its manufacturing method, and a display device. Background Technology

[0002] Micro LED (Micro Light Emitting Diode) refers to an LED device with pixels spaced at the micrometer level. As a next-generation display technology, Micro LED displays offer advantages such as small size, wide color gamut, high brightness, and long lifespan. Furthermore, they feature low operating voltage, high luminous efficiency, fast response speed, stable and reliable performance, and a wide operating temperature range, effectively meeting various needs and representing the mainstream development direction of future micro-display technology.

[0003] Existing Micro LED display panels are prone to problems such as bonding misalignment, chip warping, and electrode short circuits during manufacturing, which can lead to defects such as dark spots, chip detachment, and uneven display, thus affecting the yield of the display panels. Summary of the Invention

[0004] This invention provides a display panel and its manufacturing method, as well as a display device, which can effectively improve problems such as misalignment, warping, and electrode short circuits caused by inaccurate alignment between chip electrodes and conductive pillars, thereby improving the yield of the display panel.

[0005] In a first aspect, embodiments of the present invention provide a display panel, including: a driving module and a chip module;

[0006] The driving module includes: a first substrate; a driving circuit layer disposed on one side of the first substrate; a plurality of spaced conductive pillars disposed on the side of the driving circuit layer away from the first substrate, wherein any adjacent conductive pillars have a first opening; and a connection layer disposed within the first opening.

[0007] The chip module includes: a second substrate; a packaged chip layer disposed on one side of the second substrate, the packaged chip layer including a packaged structure and a chip; a bonding conductive layer disposed on the side of the packaged chip layer away from the second substrate, the bonding conductive layer including a plurality of independent bonding electrodes, the bonding electrodes having a planar structure, one bonding electrode being electrically connected to one electrode of a chip; and a transition layer disposed on the side of the bonding conductive layer away from the packaged chip layer.

[0008] The transition layer has a recess at the position of the conductive pillar. The transition layer and the connecting layer are bonded together. The recess is used to accommodate the conductive pillar. Each conductive pillar is electrically connected to the chip through a bonding electrode.

[0009] The display panel described above may optionally have a second opening between any adjacent bonding electrodes; the chip module also includes:

[0010] A protective layer is installed inside the second opening.

[0011] In the display panel shown above, optionally, the sum of the thicknesses of the transition layer and the connecting layer is equal to the thickness of the conductive pillar.

[0012] Secondly, embodiments of the present invention also provide a display device, which includes a display panel having any of the features described in the first aspect.

[0013] Thirdly, embodiments of the present invention also provide a method for manufacturing a display panel, comprising:

[0014] A driving module and a chip module are formed separately. The driving module includes: a first substrate; a driving circuit layer disposed on one side of the first substrate; a plurality of spaced conductive pillars disposed on the side of the driving circuit layer away from the first substrate, with a first opening between any adjacent conductive pillars; and a connection layer disposed within the first opening. The chip module includes: a second substrate; a packaged chip layer disposed on one side of the second substrate, the packaged chip layer including a package structure and a chip; a bonding conductive layer disposed on the side of the packaged chip layer away from the second substrate, the bonding conductive layer including a plurality of independent bonding electrodes, the bonding electrodes having a planar structure, one bonding electrode being electrically connected to one electrode of a chip; and a transition layer disposed on the side of the bonding conductive layer away from the packaged chip layer.

[0015] The connection layer of the drive module and the transition layer of the chip module are bonded together, and each conductive post is electrically connected to the chip through a bonding electrode.

[0016] Optionally, the above method for manufacturing a display panel may include forming a driving module, comprising:

[0017] A driving circuit layer is formed on one side of the first substrate.

[0018] A first conductive material layer is formed on the side of the driving circuit layer away from the first substrate, and a patterning process is performed on the first conductive material layer to form a plurality of spaced conductive pillars, with a first opening between any adjacent conductive pillars.

[0019] A connecting layer is formed within the first opening, the thickness of which is less than the thickness of the conductive post.

[0020] Optionally, the above method for manufacturing a display panel may include forming a chip module, comprising:

[0021] A transition material layer is formed on the auxiliary substrate.

[0022] A second conductive material layer is formed on the side of the transition material layer away from the auxiliary substrate.

[0023] A packaged chip layer is formed on the side of the second conductive material layer away from the transition material layer;

[0024] A second substrate is formed on the side of the packaged chip layer away from the second conductive material layer;

[0025] Remove the auxiliary substrate and perform a first patterning process on the transition material layer and the second conductive material layer to form a bonded conductive layer;

[0026] A second patterning process is performed on the transition material layer to form a transition layer. The transition layer has recesses at the positions corresponding to the conductive pillars. These recesses are used to accommodate the conductive pillars when the connecting layer and the transition layer are bonded.

[0027] In the above method for fabricating the display panel, optionally, a second opening is provided between any adjacent bonding electrodes, and the chip module further includes a protective layer;

[0028] Before performing the second patterning process on the transition material layer, the following steps are also included:

[0029] A protective layer is formed inside the second opening.

[0030] Optionally, the above method for fabricating a display panel may further include, after bonding the connection layer of the driving module and the transition layer of the chip module:

[0031] Remove the first substrate and / or the second substrate.

[0032] Optionally, the above method for fabricating a display panel may further include, after bonding the connection layer of the driving module and the transition layer of the chip module:

[0033] Remove the first substrate and / or the second substrate.

[0034] This invention provides a display panel and its fabrication method, as well as a display device. By designing a driving module and a chip module, the driving module includes a first substrate, a driving circuit layer, conductive pillars, and a connection layer. The chip module includes a second substrate, an encapsulated chip layer, a bonding conductive layer, and a transition layer. The connection layer of the driving module and the transition layer of the chip module are then bonded together. Each conductive pillar is electrically connected to the chip of the encapsulated chip layer via a bonding electrode. Because the bonding electrode has a planar structure, it effectively improves problems such as misalignment, warping, and electrode short circuits caused by inaccurate alignment between the chip electrode and the conductive pillar, thus improving the yield of the display panel. Simultaneously, the conductive pillars are jointly encapsulated by the transition layer and the connection layer, preventing oxidation or morphological changes and ensuring effective bonding. Attached Figure Description

[0035] Figure 1 This is a cross-sectional structural diagram of a display panel provided in an embodiment of the present invention;

[0036] Figure 2 This is a schematic diagram of the structure of a display device provided in an embodiment of the present invention;

[0037] Figure 3 This is a schematic flowchart of a method for manufacturing a display panel according to an embodiment of the present invention;

[0038] Figure 4 This is a schematic flowchart of a method for preparing a drive module according to an embodiment of the present invention;

[0039] Figure 5 This is a schematic diagram illustrating the fabrication of a drive module according to an embodiment of the present invention;

[0040] Figure 6 This is a schematic flowchart of a chip module fabrication method provided in an embodiment of the present invention;

[0041] Figure 7 This is a schematic diagram illustrating the fabrication of a chip module according to an embodiment of the present invention;

[0042] Figure 8 This is a schematic flowchart of another chip module fabrication method provided in an embodiment of the present invention;

[0043] Figure 9 This is a schematic diagram illustrating the fabrication of another chip module provided in an embodiment of the present invention;

[0044] Figure 10 This is a flowchart illustrating the fabrication process of a display panel according to an embodiment of the present invention;

[0045] Figure 11 This is a schematic flowchart of another method for preparing a display panel provided in an embodiment of the present invention. Detailed Implementation

[0046] The present invention will now be described in further detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and not intended to limit it. Furthermore, it should be noted that, for ease of description, the accompanying drawings show only the parts relevant to the present invention, and not all of the structures.

[0047] Furthermore, the accompanying drawings and descriptions of the embodiments are illustrative rather than restrictive. The same reference numerals denote the same elements throughout the specification. Additionally, for ease of understanding and description, the thicknesses of some layers, films, panels, regions, etc., may be exaggerated in the drawings. It is also understood that when an element such as a layer, film, region, or substrate is referred to as being "on" another element, the element may be directly on the other element or there may be an intermediate element present. Furthermore, "on" means positioning the element on or below another element, but does not inherently mean positioning it on top of another element according to the direction of gravity. For ease of understanding, elements are always drawn on top of other elements in the accompanying drawings of this invention.

[0048] In addition, unless explicitly stated otherwise, the words “including” and variations such as “contains” or “has” will be understood to imply the inclusion of the element, but not to exclude any other element.

[0049] It should also be noted that, in the embodiments of the present invention, "and / or" refers to any and all combinations including one or more of the related listed items. Various components are described using terms such as "first," "second," etc., in the embodiments of the present invention, but these components should not be limited by these terms. These terms are only used to distinguish one component from another. Furthermore, unless the context clearly indicates otherwise, the singular forms "a," "an," and "the ()" are also intended to include the plural forms.

[0050] When an embodiment can be implemented differently, the specific process sequence may be performed differently than the described sequence. For example, two consecutively described processes may be performed substantially at the same time or in the reverse order of their description.

[0051] Existing Micro LED display panel fabrication involves first sequentially preparing the driving circuit and conductive pillars, then mass-transferring and bonding the R / G / B three-color Micro LEDs in three stages (also known as bonding) to obtain the Micro LED display panel. However, in existing structures and processes, the columnar structure of the chip electrodes and conductive pillars makes alignment difficult, easily leading to bonding misalignment, chip warping, and electrode short circuits. This results in defects such as dark spots, chip detachment, and uneven display in the Micro LED display panel, affecting the yield. Furthermore, repeated heating during multiple bonding processes can easily cause oxidation or morphological changes in the conductive pillars, affecting the bonding effect. This invention provides a display panel, its fabrication method, and a display device that effectively improves the problems of misalignment, warping, and electrode short circuits caused by inaccurate alignment between the chip electrodes and conductive pillars, thereby improving the yield of the display panel.

[0052] The structure, technical effects, and manufacturing methods of the display panel are described in detail below.

[0053] Furthermore, the following embodiments of the present invention are all described using a Micro LED display panel as an example, that is, the chip in the display panel is a Micro LED chip. It is understood that, in addition to Micro LED display panels, the display panel can also be any of the following display panels: Organic Light-Emitting Diode (OLED) display panel, electronic paper, QLED (Quantum Dot Light Emitting Diodes) display panel, etc. The present invention does not specifically limit it in this regard.

[0054] Figure 1 A cross-sectional structural diagram of a display panel according to an embodiment of the present invention is shown. Figure 1 As shown, the display panel includes a driver module and a chip module.

[0055] The driving module includes: a first substrate 100; a driving circuit layer 101 disposed on one side of the first substrate 100; a plurality of spaced conductive pillars 102 disposed on the side of the driving circuit layer 101 away from the first substrate 100, wherein any adjacent conductive pillars have a first opening; and a connection layer 103 disposed within the first opening. Specifically, the thickness of the connection layer 103 is less than the thickness of the conductive pillars 102.

[0056] The chip module includes: a second substrate 204; a packaged chip layer 203 disposed on one side of the second substrate 204, the packaged chip layer 203 including a packaged structure and Micro LED chips of at least three colors; a bonding conductive layer 202 disposed on the side of the packaged chip layer 203 away from the second substrate 204, the bonding conductive layer 202 including a plurality of independent bonding electrodes, one bonding electrode 202 being electrically connected to one electrode of a Micro LED chip; and a transition layer 201 disposed on the side of the bonding conductive layer 202 away from the packaged chip layer 203.

[0057] The transition layer 201 has a recess corresponding to the position of the conductive post 102. The transition layer 201 is bonded to the connecting layer 103. The recess is used to accommodate the conductive post 102, which facilitates the smooth bonding of the transition layer 201 and the connecting layer 103. Each conductive post 102 is electrically connected to the Micro LED chip of the encapsulation chip layer 203 through a bonding electrode. The transition layer 201 and the connecting layer 103 together encapsulate the conductive post 102.

[0058] In one embodiment, the sum of the thicknesses of the transition layer 201 and the connecting layer 103 is equal to the thickness of the conductive pillar 102.

[0059] In one embodiment, a second opening is provided between any adjacent bonding electrodes; the chip module further includes a protective layer 205 disposed within the second opening. The protective layer 205 can protect the exposed bonding electrodes, achieving complete insulation between the bonding electrodes, while avoiding the risk of oxidation and corrosion of the bonding electrodes.

[0060] This invention designs a driving module and a chip module. The driving module includes a first substrate, a driving circuit layer, conductive pillars, and a connection layer. The chip module includes a second substrate, a packaged chip layer, a bonding conductive layer, and a transition layer. The connection layer of the driving module and the transition layer of the chip module are then bonded together. Each conductive pillar is electrically connected to the Micro LED chip in the packaged chip layer via a bonding electrode. Because the bonding electrode has a planar structure, it effectively improves problems such as misalignment, warping, and electrode short circuits caused by inaccurate alignment between the chip electrode and the conductive pillar, thereby improving the yield of the display panel. At the same time, the conductive pillars are jointly wrapped by the transition layer and the connection layer, which prevents oxidation or morphological changes of the conductive pillars and ensures the bonding effect.

[0061] Figure 2 A schematic diagram of the structure of a display device provided in an embodiment of the present invention is shown, as follows: Figure 2 As shown, the display device includes a display panel 70 provided in any embodiment of the present invention.

[0062] The display device provided in this embodiment of the invention can be applied in smart wearable devices (such as smart bracelets and smartwatches), as well as in devices such as smartphones, tablets, and displays.

[0063] Figure 3 This diagram illustrates a process flow of a method for fabricating a display panel according to an embodiment of the present invention. This method is used to fabricate... Figure 1 The display panel shown is as follows: Figure 3 As shown, the method for manufacturing the display panel may include steps S101-S102.

[0064] S101. A driving module and a chip module are formed respectively. The driving module includes: a first substrate; a driving circuit layer disposed on one side of the first substrate; a plurality of spaced conductive pillars disposed on the side of the driving circuit layer away from the first substrate, with a first opening between any adjacent conductive pillars; and a connection layer disposed within the first opening. The chip module includes: a second substrate; a packaged chip layer disposed on one side of the second substrate, the packaged chip layer including a package structure and a micro light-emitting diode (Micro LED) chip; a bonding conductive layer disposed on the side of the packaged chip layer away from the second substrate, the bonding conductive layer including a plurality of independent bonding electrodes, one bonding electrode being electrically connected to one electrode of a Micro LED chip; and a transition layer disposed on the side of the bonding conductive layer away from the packaged chip layer.

[0065] In step S101, the processes of "forming the driver module" and "forming the chip module" are independent of each other. That is, the driver module can be formed first and then the chip module; or the chip module can be formed first and then the driver module; or the processes of "forming the driver module" and "forming the chip module" can be executed in parallel to improve production efficiency.

[0066] In one possible implementation of the driving module, Figure 4 This diagram illustrates a process flow chart of a method for fabricating a drive module according to an embodiment of the present invention. Figure 5 A schematic diagram illustrating the fabrication of a drive module according to an embodiment of the present invention is shown. Specifically, as shown... Figure 4 As shown, the method for manufacturing the drive module may include steps S201-S204:

[0067] S201. A driving circuit layer is formed on one side of the first substrate.

[0068] refer to Figure 5 As shown in (a), the first substrate 100 may be formed of polymer materials such as polyimide (PI), polycarbonate (PC), polyethersulfone (PES), polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polyaryl compound (PAR), or glass fiber reinforced plastic (FRP).

[0069] The driving circuit layer 101 may include various functional film layers associated with the pixel driving circuit in the display panel. For example, the pixel driving circuit may include thin film transistors, storage capacitors, and other circuit elements known to those skilled in the art.

[0070] S202, A first conductive material layer is formed on the side of the driving circuit layer away from the first substrate.

[0071] refer to Figure 5As shown in (b), the material of the first conductive material layer 102' can be any metal or metal alloy with conductive properties, such as aluminum (Al).

[0072] S203. Perform a patterning process on the first conductive material layer to form multiple spaced conductive pillars.

[0073] refer to Figure 5 As shown in (c), a patterning process is performed on the first conductive material layer 102' to form a plurality of spaced conductive pillars 102, with a first opening between any adjacent conductive pillars 102.

[0074] Optionally, the spacing between adjacent conductive pillars 102 is equal, thus ensuring that the display pixels are evenly arranged.

[0075] S204. A connecting layer is formed inside the first opening, the thickness of which is less than the thickness of the conductive post.

[0076] refer to Figure 5 As shown in (d), any adjacent conductive pillars 102 have a first opening, that is, multiple spaced conductive pillars 102 define the first opening, and a connecting layer 103 is formed within the first opening. The thickness of the connecting layer 103 is less than the thickness of the conductive pillars 102. The material of the connecting layer 103 can be an organic material and / or an inorganic material with a certain degree of viscosity, for subsequent connection with the chip module.

[0077] In one possible implementation of forming a chip module Figure 6 The diagram shows a flow chart of a chip module fabrication method provided by an embodiment of the present invention. Figure 7 This diagram illustrates the fabrication process of a chip module according to an embodiment of the present invention. Specifically, as shown... Figure 6 As shown, the method for fabricating a chip module may include steps S301-S307:

[0078] S301. A transition material layer is formed on the auxiliary substrate.

[0079] refer to Figure 7 As shown in (a), the auxiliary substrate 200 can be a glass substrate, and the transition material layer 201' can be made of organic materials (such as PI) and / or inorganic materials (such as silicon nitride or silicon oxide). The transition material layer 201' is required to be separable from the auxiliary substrate 200 through processing.

[0080] S302, A second conductive material layer is formed on the side of the transition material layer away from the auxiliary substrate.

[0081] refer to Figure 7As shown in (b), the material of the second conductive material layer 202' can be any metal or metal alloy with conductive properties, such as aluminum (Al).

[0082] Optionally, the material of the first conductive material layer 102' is the same as the material of the second conductive material layer 202'.

[0083] S303, A packaged chip layer is formed on the side of the second conductive material layer away from the transition material layer.

[0084] refer to Figure 7 As shown in (c), the encapsulation chip layer 203 includes an encapsulation structure and Micro LED chips of at least three colors. In this embodiment of the invention, the Micro LED chips are not limited to emitting red (R), green (G), and blue (B) light, but can also emit other colors of light, such as white, yellow, cyan, or pink.

[0085] from Figure 7 As can be seen in (c), since the second conductive material layer 202' has a planar structure, it is beneficial to the transfer bonding of the Micro LED chip, avoids the dark spots caused by chip warping or misalignment, and ensures the electrical connection between the chip electrode and the second conductive material layer 202'.

[0086] It should be noted that, in this invention, the transfer bonding of the Micro LED chip can be completed using conventional processes.

[0087] S304. A second substrate is formed on the side of the packaged chip layer away from the second conductive material layer.

[0088] refer to Figure 7 As shown in (d), the second substrate 204 can be formed of polymer materials such as polyimide (PI), polycarbonate (PC), polyethersulfone (PES), polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polyaryl compound (PAR), or glass fiber reinforced plastic (FRP).

[0089] S305, Remove the auxiliary substrate.

[0090] refer to Figure 7 As shown in (e), after removing the auxiliary substrate 200, the entire structure is flipped over to facilitate subsequent processes.

[0091] S306. Perform the first patterning process on the transition material layer and the second conductive material layer to form a bonded conductive layer.

[0092] refer to Figure 7 As shown in (f), a first patterning process is performed on the transition material layer 201' and the second conductive material layer 202' to form a bonded conductive layer 202.

[0093] In step S306, the useless second conductive material layer 202' between the two electrodes of the Micro LED chip and between chips is removed, forming multiple independent bonding electrodes. Each bonding electrode is electrically connected to one electrode of a Micro LED chip, ensuring that the chip can work normally on its own.

[0094] This invention employs a process opposite to conventional processes, performing chip transfer and bonding on the second conductive material layer 202', followed by patterning of the second conductive material layer 202'. This effectively avoids short circuits between the anode and cathode of the chip in conventional processes, thereby improving product yield.

[0095] S307. Perform a second patterning process on the transition material layer to form a transition layer. The transition layer has a recess at the position of the conductive pillar. The recess is used to accommodate the conductive pillar when the connecting layer and the transition layer are bonded.

[0096] refer to Figure 7 As shown in (g), a second patterning process is performed on the transition material layer 201' to form the transition layer 201. The transition layer 201 has a recess at the position corresponding to the conductive pillar 102. The recess is used to accommodate the conductive pillar 102 when the connecting layer 103 and the transition layer 201 are bonded, ensuring that the drive module and the chip module can be smoothly aligned. The transition layer 201 also protects the underlying film layer from damage.

[0097] In another possible implementation of the chip module, the chip module further includes a protective layer. Accordingly, Figure 8 This diagram illustrates a flow chart of another chip module fabrication method provided in an embodiment of the present invention. Figure 9 This diagram illustrates the fabrication of another chip module provided in an embodiment of the present invention. Specifically, as shown... Figure 8 As shown, the method for fabricating a chip module may include steps S401-S408:

[0098] S401. A transition material layer is formed on the auxiliary substrate.

[0099] refer to Figure 9 As shown in (a), the auxiliary substrate 200 can be a glass substrate, and the transition material layer 201' can be made of organic materials (such as PI) and / or inorganic materials (such as silicon nitride or silicon oxide). The transition material layer 201' is required to be separable from the auxiliary substrate 200 through processing.

[0100] S402, A second conductive material layer is formed on the side of the transition material layer away from the auxiliary substrate.

[0101] refer to Figure 9As shown in (b), the material of the second conductive material layer 202' can be any metal or metal alloy with conductive properties, such as aluminum (Al).

[0102] S403, A packaged chip layer is formed on the side of the second conductive material layer away from the transition material layer.

[0103] refer to Figure 9 As shown in (c), the encapsulation chip layer 203 includes an encapsulation structure and Micro LED chips of at least three colors. In this embodiment of the invention, the Micro LED chips are not limited to emitting red (R), green (G), and blue (B) light, but can also emit other colors of light, such as white, yellow, cyan, or pink.

[0104] from Figure 9 As can be seen in (c), since the second conductive material layer 202' has a planar structure, it is beneficial to the transfer bonding of the Micro LED chip, avoids the dark spots caused by chip warping or misalignment, and ensures the electrical connection between the chip electrode and the second conductive material layer 202'.

[0105] It should be noted that, in this invention, the transfer bonding of the Micro LED chip can be completed using conventional processes.

[0106] S404. A second substrate is formed on the side of the packaged chip layer away from the second conductive material layer.

[0107] refer to Figure 9 As shown in (d), the second substrate 204 can be formed of polymer materials such as polyimide (PI), polycarbonate (PC), polyethersulfone (PES), polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polyaryl compound (PAR), or glass fiber reinforced plastic (FRP).

[0108] S405, Remove the auxiliary substrate.

[0109] refer to Figure 9 As shown in (e), after removing the auxiliary substrate 200, the entire structure is flipped over to facilitate subsequent processes.

[0110] S406. Perform the first patterning process on the transition material layer and the second conductive material layer to form a bonded conductive layer.

[0111] refer to Figure 9 As shown in (f), a first patterning process is performed on the transition material layer 201' and the second conductive material layer 202' to form a bonded conductive layer 202.

[0112] In step S406, the useless second conductive material layer 202' between the two electrodes of the Micro LED chip and between chips is removed, forming multiple independent bonding electrodes. Each bonding electrode is electrically connected to one electrode of a Micro LED chip, ensuring that the chip can work normally on its own.

[0113] This invention employs a process opposite to conventional processes, performing chip transfer and bonding on the second conductive material layer 202', followed by patterning of the second conductive material layer 202'. This effectively avoids short circuits between the anode and cathode of the chip in conventional processes, thereby improving product yield.

[0114] S407, A protective layer is formed inside the second opening.

[0115] refer to Figure 9 As shown in (g), there is a second opening between any adjacent bonding electrodes, that is, multiple independent bonding electrodes define the second opening, and a protective layer 205 is formed in the second opening. The protective layer 205 can protect the exposed bonding electrodes, achieve complete insulation between the bonding electrodes, and avoid the risk of the bonding electrodes being oxidized or corroded.

[0116] The material of the protective layer 205 can be an organic material and / or an inorganic material with a certain degree of adhesion, which can further increase the adhesion between the subsequent drive module and the chip module.

[0117] S408. Perform a second patterning process on the transition material layer to form a transition layer. The transition layer has a recess at the position of the conductive pillar. The recess is used to accommodate the conductive pillar when the connecting layer and the transition layer are bonded.

[0118] refer to Figure 9 As shown in (h), a second patterning process is performed on the transition material layer 201' to form the transition layer 201. The transition layer 201 has a recess at the position corresponding to the conductive pillar 102. The recess is used to accommodate the conductive pillar 102 when the connecting layer 103 and the transition layer 201 are bonded, ensuring that the drive module and the chip module can be smoothly aligned. The transition layer 201 also protects the underlying film layer from damage.

[0119] S102, Bond the connection layer of the driving module and the transition layer of the chip module together, and electrically connect each conductive post to the Micro LED chip through a bonding electrode.

[0120] Figure 10 A flowchart illustrating the fabrication process of a display panel according to an embodiment of the present invention is shown. Figure 10 As shown, the drive module and chip module formed by the above process are joined together, and the connection layer 103 of the drive module and the transition layer 201 of the chip module are bonded by temperature or light curing to form a display panel.

[0121] refer to Figure 10 As can be seen, each conductive post 102 is electrically connected to the Micro LED chip of the encapsulated chip layer 203 through a bonding electrode. Since the bonding electrode has a planar structure, it effectively improves the problems of misalignment, warping, and electrode short circuit caused by inaccurate alignment between the chip electrode and the conductive post 102, thereby improving the yield of the display panel. At the same time, the conductive post 102 is wrapped by the transition layer 201 and the connecting layer 103, which avoids oxidation or morphological changes of the conductive post 102 and ensures the bonding effect.

[0122] In one embodiment, the thicknesses of the transition layer 201 and the connection layer 103 can be designed and allocated according to the thickness of the conductive post 102. After the connection layer 103 of the driving module and the transition layer 201 of the chip module are bonded, the sum of the thicknesses of the transition layer 201 and the connection layer 103 is equal to the thickness of the conductive post 102.

[0123] In one embodiment, the material of the conductive post 102 is the same as the material of the bonding conductive layer 202, which can improve the signal uniformity of the product and ensure the electrical performance of the display panel.

[0124] In one embodiment, the protective layer 205 is made of the same material as the connecting layer 103, which can further increase the adhesion between the drive module and the chip module.

[0125] Based on the above embodiments, Figure 11 The diagram illustrates a flow chart of another method for manufacturing a display panel according to an embodiment of the present invention, as shown below. Figure 11 As shown, after step S102 is completed, step S103 may also be included.

[0126] S103, Remove the first substrate and / or the second substrate.

[0127] The first substrate 100 and / or the second substrate 204 can be removed according to actual needs to achieve a thinner and lighter display panel.

[0128] This invention provides a method for fabricating a display panel, comprising: forming a driving module and a chip module, wherein the driving module includes: a first substrate; a driving circuit layer disposed on one side of the first substrate; a plurality of spaced conductive pillars disposed on the side of the driving circuit layer away from the first substrate, wherein any adjacent conductive pillars have a first opening; and a connection layer disposed within the first opening. The chip module includes: a second substrate; an encapsulation chip layer disposed on one side of the second substrate, the encapsulation chip layer including an encapsulation structure and a micro light-emitting diode (Micro LED) chip; a bonding conductive layer disposed on the side of the encapsulation chip layer away from the second substrate, the bonding conductive layer including a plurality of independent bonding electrodes, one bonding electrode being electrically connected to an electrode of a Micro LED chip; and a transition layer disposed on the side of the bonding conductive layer away from the encapsulation chip layer; and bonding the connection layer of the driving module and the transition layer of the chip module, wherein each conductive pillar is electrically connected to the Micro LED chip through a bonding electrode. By designing the driving module and the chip module, the driving module includes a first substrate, a driving circuit layer, conductive pillars, and a connection layer. The chip module includes a second substrate, a packaged chip layer, a bonding conductive layer, and a transition layer. The connection layer of the driving module and the transition layer of the chip module are then bonded together. Each conductive pillar is electrically connected to the Micro LED chip in the packaged chip layer through a bonding electrode. Since the bonding electrode has a planar structure, it effectively improves problems such as misalignment, warping, and electrode short circuits caused by inaccurate alignment between the chip electrode and the conductive pillar, thereby improving the yield of the display panel. At the same time, the conductive pillar is jointly wrapped by the transition layer and the connection layer, which avoids oxidation or morphological changes of the conductive pillar and ensures the bonding effect.

[0129] Note that the above description is merely a preferred embodiment of the present invention and the technical principles employed. Those skilled in the art will understand that the present invention is not limited to the specific embodiments described herein, and various obvious changes, readjustments, and substitutions can be made without departing from the scope of protection of the present invention. Therefore, although the present invention has been described in detail through the above embodiments, the present invention is not limited to the above embodiments, and may include many other equivalent embodiments without departing from the concept of the present invention, the scope of which is determined by the scope of the appended claims.

Claims

1. A display panel, characterized by, include: Driver modules and chip modules; The driving module includes: a first substrate; a driving circuit layer disposed on one side of the first substrate; a plurality of spaced conductive pillars disposed on the side of the driving circuit layer away from the first substrate, wherein any adjacent conductive pillars have a first opening; and a connection layer disposed within the first opening. The chip module includes: a second substrate; a packaged chip layer disposed on one side of the second substrate, the packaged chip layer including a packaged structure and a chip; a bonding conductive layer disposed on the side of the packaged chip layer away from the second substrate, the bonding conductive layer including a plurality of independent bonding electrodes, the bonding electrodes having a planar structure, one of the bonding electrodes being electrically connected to one electrode of one of the chips; and a transition layer disposed on the side of the bonding conductive layer away from the packaged chip layer. The transition layer has a recessed portion corresponding to the position of the conductive pillar. The transition layer is bonded to the connecting layer. The recessed portion is used to accommodate the conductive pillar. Each conductive pillar is electrically connected to the chip through a bonding electrode.

2. The display panel of claim 1, wherein, A second opening is provided between any two adjacent bonding electrodes; the chip module further includes: A protective layer is provided within the second opening.

3. The display panel according to claim 1 or 2, characterized in that, The sum of the thicknesses of the transition layer and the connecting layer is equal to the thickness of the conductive pillar.

4. A display device, characterized in that, Includes the display panel as described in any one of claims 1-3.

5. A method for manufacturing a display panel, characterized in that, include: A driving module and a chip module are formed respectively. The driving module includes: a first substrate; a driving circuit layer disposed on one side of the first substrate; a plurality of spaced conductive pillars disposed on the side of the driving circuit layer away from the first substrate, with a first opening between any adjacent conductive pillars; and a connection layer disposed within the first opening. The chip module includes: a second substrate; a packaged chip layer disposed on one side of the second substrate, the packaged chip layer including a package structure and a chip; a bonding conductive layer disposed on the side of the packaged chip layer away from the second substrate, the bonding conductive layer including a plurality of independent bonding electrodes, the bonding electrodes having a planar structure, one of the bonding electrodes being electrically connected to one electrode of one of the chips; and a transition layer disposed on the side of the bonding conductive layer away from the packaged chip layer. The connection layer of the driving module and the transition layer of the chip module are bonded together, and each conductive post is electrically connected to the chip through a bonding electrode.

6. The method for manufacturing a display panel according to claim 5, characterized in that, The forming drive module includes: The driving circuit layer is formed on one side of the first substrate. A first conductive material layer is formed on the side of the driving circuit layer away from the first substrate, and a patterning process is performed on the first conductive material layer to form a plurality of spaced conductive pillars, with a first opening between any adjacent conductive pillars. The connecting layer is formed within the first opening, and the thickness of the connecting layer is less than the thickness of the conductive post.

7. The method for manufacturing a display panel according to claim 5, characterized in that, The chip module is formed by: A transition material layer is formed on the auxiliary substrate. A second conductive material layer is formed on the side of the transition material layer away from the auxiliary substrate. The encapsulation chip layer is formed on the side of the second conductive material layer away from the transition material layer; The second substrate is formed on the side of the packaged chip layer away from the second conductive material layer; The auxiliary substrate is removed, and a first patterning process is performed on the transition material layer and the second conductive material layer to form the bonding conductive layer; A second patterning process is performed on the transition material layer to form the transition layer. The transition layer has a recessed portion corresponding to the position of the conductive pillar. The recessed portion is used to accommodate the conductive pillar when the connecting layer and the transition layer are bonded.

8. The method for manufacturing a display panel according to claim 7, characterized in that, A second opening is provided between any two adjacent bonding electrodes, and the chip module further includes a protective layer; Before performing the second patterning process on the transition material layer, the process also includes: The protective layer is formed within the second opening.

9. The method for manufacturing a display panel according to claim 5, characterized in that, After bonding the connection layer of the driver module and the transition layer of the chip module, the method further includes: Remove the first substrate and / or the second substrate.

10. The method for manufacturing a display panel according to claim 8, characterized in that, The material of the conductive pillar is the same as the material of the bonding conductive layer; the material of the protective layer is the same as the material of the connecting layer.

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