Compact dra antenna module

Abstract

The application discloses a compact DRA antenna module, which comprises a substrate assembly and a dielectric resonator arranged on the substrate assembly, wherein the dielectric resonator comprises four connecting parts and four identical DRA units, the DRA unit is an eighth of a spherical body, a gap is formed between two adjacent DRA units, the four gaps form a cross slot, the bottom ends of two adjacent DRA units are connected through the connecting part, and the four connecting parts and the four DRA units are integrally formed in an integrated structure. The DRA antenna module has the advantages that the structure is compact, the overall volume is small, the four DRA units are integrated through the connecting part, the dielectric resonator only needs to be installed once as a whole, the alignment error generated in the installation process of the DRA unit is greatly reduced, the antenna performance of the DRA antenna module is guaranteed, the dielectric resonator itself can be used as the packaging of a radio frequency chip, the volume of the DRA antenna module is further reduced, and the DRA antenna module can cover the N257 frequency band in 5G.

Description

Technical Field

[0001] This invention relates to the field of antenna technology, and in particular to a compact DRA antenna module. Background Technology

[0002] As a global focus of research and development, 5G technology development and standardization have become industry consensus. At the 22nd meeting of ITU-R-WP5D in June 2015, the International Telecommunication Union (ITU) clearly defined three main application scenarios for 5G: enhanced mobile broadband, massive machine-type communications, and ultra-reliable low-latency communications. These three application scenarios correspond to different key indicators. In the enhanced mobile broadband scenario, the peak user speed is 20Gbps, and the minimum user experience rate is 100Mbps. The high carrier frequency and large bandwidth characteristics unique to millimeter waves are the main means to achieve the ultra-high data transmission rates of 5G. Furthermore, the space reserved for 5G antennas in future mobile phones is limited, necessitating the design of miniaturized antenna modules.

[0003] Dielectric resonator antennas made of ceramic bodies offer significant advantages due to their high manufacturing precision, small size, and lower cost in the millimeter-wave band. Conventional 5G terminal millimeter-wave antenna designs typically have 1×4 elements. If a DRA (dielectric resonator antenna) design is used, four discrete dielectric resonators are required for installation, and the bonding and fixing of these resonators must be repeated four times. This design method results in significant discrepancies between simulated and actual antenna performance. If the antenna is designed as a single unit, the installation of the four elements only requires one step, reducing uncertainties and facilitating mass production. Therefore, a four-element integrated dielectric resonator antenna module is urgently needed. Summary of the Invention

[0004] The technical problem solved by this invention is to provide a compact DRA antenna module that is easy to mass-produce.

[0005] To solve the above-mentioned technical problems, the technical solution adopted by the present invention is as follows: a compact DRA antenna module, including a substrate assembly and a dielectric resonator disposed on the substrate assembly. The dielectric resonator includes four connecting parts and four identical DRA units. The DRA unit is an eighth-spherical body. A gap is formed between two adjacent DRA units. The four gaps form a cross-shaped gap. The bottom ends of two adjacent DRA units are connected through the connecting parts. The four connecting parts and the four DRA units are integrally formed into a single structure.

[0006] The beneficial effects of this invention are as follows: the DRA antenna module has a compact structure and small overall size; the four DRA units are integrated through the connecting part, so that the dielectric resonator only needs to be installed once, which greatly reduces the alignment error generated during the installation of the DRA units and helps to ensure the antenna performance of the DRA antenna module; moreover, the dielectric resonator itself can be used as a package for RF chips, which helps to further reduce the size of the DRA antenna module; this DRA antenna module can cover the N257 frequency band in 5G. Attached Figure Description

[0007] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0008] Figure 1 This is a schematic diagram of the structure of the compact DRA antenna module according to Embodiment 1 of the present invention;

[0009] Figure 2 This is a structural schematic diagram of the compact DRA antenna module according to another embodiment of the present invention;

[0010] Figure 3 This is a schematic diagram of the dielectric resonator in the compact DRA antenna module according to Embodiment 1 of the present invention;

[0011] Figure 4 This is a schematic diagram of the substrate assembly in the compact DRA antenna module according to Embodiment 1 of the present invention;

[0012] Figure 5 This is an S-parameter diagram of the compact DRA antenna module according to Embodiment 1 of the present invention.

[0013] Explanation of icon numbers:

[0014] 1. Dielectric substrate; 11. Ground layer; 12. Curved microstrip line; 13. First low-frequency line; 14. Second low-frequency line; 15. Matching microstrip line;

[0015] 2. Radio frequency chip;

[0016] 3. Power supply chip;

[0017] 4. Digital chips;

[0018] 5. Dielectric resonator; 51. DRA unit; 52. Connection part;

[0019] 6. Cross-shaped gap;

[0020] 7. Filling medium component. Detailed Implementation

[0021] The objectives, features, and advantages of this invention will be further explained in conjunction with the embodiments and with reference to the accompanying drawings.

[0022] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present invention.

[0023] It should be noted that if the embodiments of the present invention involve directional indicators such as up, down, left, right, front, back, etc., the directional indicators are only used to explain the relative positional relationship and movement of the components in a specific posture as shown in the attached figure. If the specific posture changes, the directional indicators will also change accordingly.

[0024] Furthermore, if the embodiments of the present invention involve descriptions such as "first" or "second," such descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "second" may explicitly or implicitly include at least one of that feature.

[0025] Furthermore, if the meaning of "and / or" appears throughout the text, it refers to three parallel solutions. For example, "and / or" includes solution 1, solution 2, and solution 3, which simultaneously satisfy the above conditions. Additionally, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed by this invention.

[0026] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0027] Example 1

[0028] Please refer to Figures 1 to 5 Embodiment 1 of the present invention is as follows: Figures 1 to 4 As shown, a compact DRA antenna module includes a substrate assembly and a dielectric resonator 5 disposed on the substrate assembly. The substrate assembly includes a dielectric substrate 1, an RF chip 2, a power chip 3, and a digital chip 4. The dielectric substrate 1 has a ground layer 11. The top surface of the dielectric substrate 1 has an arc-shaped microstrip line 12. The bottom surface of the dielectric substrate 1 has a conductive line and a matching microstrip line 15. The RF chip 2 is disposed on the top surface of the dielectric substrate 1 and is covered inside the dielectric resonator 5. The RF chip 2 and the power chip 3 are respectively disposed on the top surface of the dielectric substrate 1. The RF chip 2 is connected to the power chip 3 and the RF chip 2 respectively through the conductive line. The arc-shaped microstrip line 12 is connected to the RF chip 2 through the matching microstrip line 15. The arc-shaped microstrip line 12 is used to feed the dielectric resonator 5.

[0029] The dielectric resonator 5 includes four connecting portions 52 and four identical DRA units 51. Each DRA unit 51 is an eighth of a sphere, with gaps between adjacent DRA units 51 forming a cross-shaped slot 6. The bottom ends of adjacent DRA units 51 are connected via the connecting portions 52. Four arc-shaped microstrip lines 12 contact the DRA units 51, providing power. Each arc-shaped microstrip line 12 corresponds one-to-one with a DRA unit 51, with gaps between adjacent arc-shaped microstrip lines 12 corresponding to the connecting portions 52. The four connecting portions 52 and the four DRA units 51 are integrally formed, meaning that when manufacturing the dielectric resonator 5, only the cross-shaped slot 6 needs to be cut into a shell structure that meets the dimensional requirements. In this embodiment, the dielectric constant of the DRA unit 51 is 8, and correspondingly, the dielectric constant of the connecting portions 52 is also 8. It is easy to understand that, from a certain perspective, the term "eighth-spherical body" refers to a solid structural component formed by thickening an eighth-spherical surface.

[0030] In addition, the four DRA units 51 form a 2×2 array, which makes the DRA antenna module structure more compact. Compared with the existing 1×4 linear array, it can not only achieve higher gain, but also has the advantage of low profile.

[0031] Please combine Figure 1 , Figure 2 and Figure 4It should be noted that the conductive lines include a first low-frequency line 13 and a second low-frequency line 14. The first low-frequency line 13 and the second low-frequency line 14 are not interconnected. The RF chip 2 is connected to the power chip 3 through the first low-frequency line 13, and the RF chip 2 is connected to the digital chip 4 through the second low-frequency line 14. There are four matching microstrip lines 15, and the four matching microstrip lines 15 are connected to the four arc-shaped microstrip lines 12 in a one-to-one correspondence. In addition, achieving interlayer conductivity of the circuit board through metallized holes, metal pillars, etc. is a conventional technical means in the field of circuit board technology. The RF chip 2 can be connected to the conductive lines / matching microstrip lines 15 through metallized holes, etc.

[0032] like Figures 1 to 3 As shown, optionally, the compact DRA antenna module further includes a filling dielectric 7, which abuts against the DRA unit 51, fills the cross-shaped gap 6, and can seal the cross-shaped gap 6. The filling dielectric 7 and the dielectric resonator 5 form a complete housing structure, which can prevent dust, moisture, etc. from entering the cavity of the dielectric resonator 5, effectively protecting the RF chip 2 and completing the packaging of the RF chip 2.

[0033] The filling medium 7 is made of plastic. In order to reduce the weight of the compact DRA antenna module and control the manufacturing cost of the DRA antenna module, in this embodiment, the filling medium 7 is made of foam plastic and the dielectric constant of the filling medium 7 is 2 to 3.

[0034] Please combine Figure 1 and Figure 4 Optionally, the dielectric resonator 5 is clamped and fixed between the power chip 3 and the digital chip 4. This eliminates the need for a fixing structure to fix the dielectric resonator 5 to the dielectric substrate 1, further facilitating the assembly and production of the compact DRA antenna module and improving production efficiency. Specifically, when the dielectric resonator 5 is fixed using the above-described fixing method, the connecting portion 52 abuts against the power chip 3 / digital chip 4. More specifically, the outer surface of the connecting portion 52 can be planar, thus forming a contact plane against the power chip 3 / digital chip 4, achieving surface contact with the power chip 3 / digital chip 4, thereby allowing the power chip 3 and the digital chip 4 to more stably clamp and fix the dielectric resonator 5. Of course, in other embodiments, fixing structures such as fastening screws can also be used to fix the dielectric resonator 5 to the dielectric substrate 1.

[0035] Please combine Figure 1 and Figure 3As a specific embodiment, in this embodiment, the inner radius of the eighth spherical surface is 4.6 mm, and the outer radius of the eighth spherical surface is 5 mm.

[0036] Figure 5 The figure shows the S-parameters of the compact DRA antenna module in this embodiment. It can be seen from the figure that the compact DRA antenna module covers 25.5-29.5GHz and can be used in the 5G millimeter wave N257 band.

[0037] The above are merely optional embodiments of the present invention and do not limit the patent scope of the present invention. Any equivalent structural transformations made using the contents of the present invention specification and drawings under the inventive concept of the present invention, or direct / indirect applications in other related technical fields, are included within the patent protection scope of the present invention.

Claims

1. A compact DRA antenna module, comprising a substrate assembly and a dielectric resonator disposed on the substrate assembly, characterized in that: The dielectric resonator includes four connecting parts and four identical DRA units. Each DRA unit is an eighth of a sphere. A gap is formed between two adjacent DRA units. The four gaps form a cross-shaped gap. The bottom ends of two adjacent DRA units are connected through the connecting parts. The four connecting parts and the four DRA units are integrally formed into a single structure. The substrate assembly includes a dielectric substrate, and the top surface of the dielectric substrate is provided with four arc-shaped microstrip lines. The four arc-shaped microstrip lines are in contact with the four DRA units one by one to realize the power supply of the DRA units. A gap is formed between two adjacent arc-shaped microstrip lines, and the gap corresponds to the connecting portion.

2. The compact DRA antenna module according to claim 1, characterized in that: It also includes a filling medium that fills the cross-shaped gap.

3. The compact DRA antenna module according to claim 2, characterized in that: The filling medium is made of plastic.

4. The compact DRA antenna module according to claim 2, characterized in that: The dielectric constant of the filling dielectric element is 2 to 3.

5. The compact DRA antenna module according to claim 1, characterized in that: The dielectric constant of the DRA unit is 8.

6. The compact DRA antenna module according to claim 1, characterized in that: The inner radius of the 1 / 8 spherical surface is 4.6 mm, and the outer radius of the 1 / 8 spherical surface is 5 mm.

7. The compact DRA antenna module according to claim 1, characterized in that: The substrate assembly includes an RF chip, a power chip, and a digital chip. A ground layer is provided in the dielectric substrate. Conductive lines and matching microstrip lines are provided on the bottom surface of the dielectric substrate. The RF chip is disposed on the top surface of the dielectric substrate and covered inside the dielectric resonator. The RF chip and the power chip are respectively disposed on the top surface of the dielectric substrate. The RF chip is connected to the power chip and the RF chip respectively through the conductive lines. The arc-shaped microstrip line is connected to the RF chip through the matching microstrip line.

8. The compact DRA antenna module according to claim 7, characterized in that: The dielectric resonator is clamped and fixed between the power chip and the digital chip.

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