A high-voltage high-power quick electrical connection device

Abstract

The application discloses a high-voltage and high-power quick electric connection device, which comprises a plug structure and a socket structure. The plug structure comprises an insulating shell and a copper bar assembly. The insulating shell is provided with an insulating frame, and the copper bar assembly forms a quick plug-pull type interface with the insulating frame. The socket structure comprises a conductive part, an outer peripheral insulating part and a mounting rack. At least one of the insulating frame and the mounting rack is provided with a clamping groove, and the other is provided with a clamping part. The clamping groove and the clamping part are matched and clamped to limit the displacement of the quick plug-pull type interface relative to the socket structure in the direction perpendicular to the plugging direction. The high-voltage and high-power quick electric connection device provided by the application can limit the damage in the insulating shell when the power semiconductor module explodes, avoid damaging the quick plug-pull type interface, reduce the explosion probability, improve the electric connection reliability, thereby avoiding the damage of the socket structure and the chain damage. Meanwhile, the positioning accuracy can be improved, the high insulation capacity, good electrical performance and small size and light weight can be realized.

Description

Technical Field

[0001] This application relates to the field of power connector technology, and more specifically, to a high-voltage, high-power, fast electrical connection device. Background Technology

[0002] As a core component of high-voltage, high-power converter systems, power semiconductor modules (such as IGBTs) are increasingly focused on integration and convenience. Integrated power semiconductor modules with quick-plug connection capabilities offer advantages such as greater convenience, miniaturization, and lightweight design for converter systems. As a critical energy transmission node, the reliability, electrical performance, and insulation capabilities of quick-connect devices are of paramount importance.

[0003] In existing technologies, electrical connection devices generally include a plug structure and a socket structure for interlocking connections. For example, the socket structure is directly mounted on the electromechanical equipment, while the plug structure is mounted on one side of a power semiconductor module with a substrate chip. When the power semiconductor module explodes, it releases a large amount of energy, damaging the plug structure and causing significant deformation and displacement of the plug structure relative to the socket structure, thus damaging the socket structure. This can lead to a chain reaction of short circuits, insulation failures, and mechanical damage to other electromechanical equipment.

[0004] In addition, existing technologies also have problems such as weak current carrying capacity of single-contact electrical connections and low long-term reliability; low positional accuracy between positioning and limiting devices and conductive parts, making it difficult to achieve fast and accurate insertion and removal; and inability to simultaneously achieve high insulation capacity and miniaturization and lightweight.

[0005] In summary, how to prevent damage to the socket structure in the event of an explosion in a high-voltage, high-power, high-speed electrical connection device is a problem that urgently needs to be solved by those skilled in the art. Summary of the Invention

[0006] In view of this, the purpose of this application is to provide a high-voltage, high-power, fast electrical connection device, including a plug structure and a socket structure. The quick-plug interface of the plug structure and the mounting bracket of the socket structure are engaged through a slot and a snap-fit ​​part. In the event of an explosion of the power semiconductor module or a significant displacement tendency of the quick-plug interface relative to the socket structure, the movement of the quick-plug interface relative to the socket structure can be restricted, thus preventing damage to the socket structure. Furthermore, it improves current carrying capacity and long-term reliability, reduces the probability of explosion, improves positioning accuracy, achieves high insulation capability, and realizes excellent electrical performance, as well as miniaturization and weight reduction.

[0007] To achieve the above objectives, this application provides the following technical solution:

[0008] A high-voltage, high-power, fast electrical connection device includes a plug structure and a socket structure.

[0009] The plug structure includes:

[0010] An insulating housing, with an insulating frame fixedly installed on its outer side;

[0011] A copper busbar assembly, one end of which is fixed inside the insulating housing along its length, and the other end of which extends outward from the insulating housing into the insulating frame;

[0012] The copper busbar assembly located within the insulating frame forms a quick-plug interface with the insulating frame;

[0013] The socket structure includes:

[0014] The conductive part is used for electrical connection with the copper busbar assembly;

[0015] An outer peripheral insulating portion, which wraps around the outer periphery of the conductive portion;

[0016] The mounting bracket is fixedly disposed relative to the outer peripheral insulating portion;

[0017] At least one of the insulating frame and the mounting bracket is provided with a slot, and the other is provided with a snap-fit ​​part. The slot and the snap-fit ​​part engage to guide and position the quick-plug interface and limit the displacement of the quick-plug interface relative to the socket structure in the direction perpendicular to the plugging direction.

[0018] Optionally, the snap-fit ​​portion is a limiting protrusion disposed on the outside of the insulating frame, and the snap-fit ​​groove is a limiting groove disposed on the mounting bracket and cooperating with the limiting protrusion.

[0019] Optionally, the limiting protrusion, the insulating frame, and the insulating shell are integrally formed.

[0020] Optionally, all copper busbar assemblies are integrally injection molded into the insulating housing.

[0021] Optionally, the number of the limiting protrusions is at least two, and the limiting protrusions are symmetrically arranged on both sides of the width direction of the insulating frame.

[0022] Optionally, along the insertion direction of the quick-plug interface and the socket structure, from the side near the outer end face of the insulating frame to the side near the insulating housing, the cross-sectional size of the limiting protrusion gradually increases.

[0023] Optionally, the high-voltage, high-power, fast electrical connection device includes a power semiconductor module, the power semiconductor module is provided with a substrate chip, and the insulating housing serves as the outer shell of the power semiconductor module, encapsulating the substrate chip within the power semiconductor module.

[0024] Optionally, the snap-fit ​​portion and the slot are fitted with a clearance along the height direction of the insulating frame.

[0025] Optionally, the copper busbar assembly includes a first copper busbar and a second copper busbar stacked on top of each other;

[0026] The first copper busbar includes a first extension section located within the insulating housing, a second extension section located within the insulating frame, and a first bent section connecting the first extension section and the second extension section.

[0027] The second copper busbar includes a third extension section located within the insulating housing, a fourth extension section located within the insulating frame, and a second bent section connecting the third extension section and the fourth extension section.

[0028] Optionally, the first extension segment, the second extension segment, the third extension segment, and the fourth extension segment are all parallel to the substrate chip.

[0029] Optionally, the distance between the first extension segment and the third extension segment is less than the distance between the second extension segment and the fourth extension segment;

[0030] Furthermore, both the first bending segment and the second bending segment are either inclined or vertically arranged.

[0031] Optionally, the copper busbar assembly includes a first copper busbar and a second copper busbar stacked on top of each other, and the insulating frame has a U-shaped structure. The first copper busbar and the second copper busbar are respectively located in the upper U-shaped structure and the lower U-shaped structure of the insulating frame.

[0032] Optionally, the outer peripheral insulating portion is provided with an insulating skirt and a protective frame that wraps around the outer periphery of the corresponding conductive portion in the circumferential direction. The insulating skirt protrudes circumferentially along the outer edge of the outer peripheral insulating portion, and a H-shaped insulating groove that mates with the insulating frame is formed between the insulating skirt and the protective frame.

[0033] Optionally, the copper busbar assembly is provided with a copper busbar that can conduct electricity on both its upper and lower surfaces, and the conductive part is a conductive block that is provided corresponding to the copper busbar;

[0034] The conductive block is provided with a slot for inserting the corresponding copper busbar. The slot is provided with a first spring contacting the upper surface of the copper busbar and a second spring contacting the lower surface of the copper busbar assembly, and the first spring contact and the second spring contact are arranged opposite to each other.

[0035] Optionally, the first spring and the second spring can be an integral structure or a separate structure.

[0036] During the use of the high-voltage, high-power, fast electrical connection device provided in this application, the quick-plug interface in the plug structure is engaged with the socket structure. When the plug structure is subjected to a large external force impact or the plug structure has a large displacement tendency relative to the socket structure in the direction perpendicular to the engagement, the engagement of the slot and the engaging part can limit the displacement of the quick-plug interface relative to the socket structure in the direction perpendicular to the engagement, thus preventing the quick-plug interface from having a large displacement relative to the socket structure. In addition, since the copper busbar assembly is fixed inside the insulating housing, the part of the copper busbar assembly located inside the insulating housing will undergo a certain deformation with the insulating housing. However, the copper busbar assembly has low hardness, and when deformed, it will form a bend near the connection between the insulating housing and the insulating frame, without affecting the copper busbar assembly located inside the insulating frame.

[0037] Compared to existing technologies, the high-voltage, high-power, fast electrical connection device provided in this application can prevent damage to the socket structure caused by the large displacement of the quick-plug interface relative to the socket structure when the plug structure is subjected to a large external impact or when the plug structure has a large displacement tendency relative to the socket structure in the direction perpendicular to the insertion direction. It confines the damage caused by the external impact within the insulating shell, avoiding damage to the quick-plug interface. This avoids the chain reaction of damage to the socket structure and other electromechanical equipment such as short circuits, insulation failures, and mechanical damage caused by damage to the quick-plug interface. Only the damaged plug structure needs to be replaced, thus reducing maintenance costs.

[0038] In addition, the copper busbar assembly and conductive part in the high-voltage, high-power, fast electrical connection device in this application adopt a double-sided electrical connection method, and the insulation frame is set as a H-shaped structure, which improves the current carrying capacity and long-term reliability, reduces the probability of power semiconductor module explosion, improves positioning accuracy, achieves high insulation capacity, and realizes good electrical performance as well as miniaturization and weight reduction. Attached Figure Description

[0039] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only embodiments of this application. For those skilled in the art, other drawings can be obtained based on the provided drawings without creative effort.

[0040] Figure 1 A schematic diagram of a specific embodiment of the plug structure provided in this application;

[0041] Figure 2 for Figure 1 A cross-sectional view of the plug structure;

[0042] Figure 3This is a cross-sectional schematic diagram of a specific embodiment of the plug structure and socket structure provided in this application after they are mated together along the mating direction.

[0043] Figure 4 A partial cross-sectional schematic diagram of a specific embodiment of the plug and socket structures provided in this application after they are engaged and mated, perpendicular to the engagement direction;

[0044] Figure 5 A schematic diagram of the deformation of the high-voltage, high-power, fast electrical connection device provided in this application during an explosion when no slot or locking part is provided;

[0045] Figure 6 A schematic diagram of the deformation during an explosion when the high-voltage, high-power, fast electrical connection device provided in this application is equipped with a slot and a snap-fit ​​part.

[0046] Figure 1-6 middle:

[0047] 1 is the base, 2 is the substrate chip, 3 is the insulating shell, 31 is the insulating frame, 311 is the horizontal skirt, 312 is the middle insulating rib, 313 is the vertical skirt, 32 is the limiting protrusion, 33 is the insulating side frame, 34 is the first copper busbar, 341 is the second extension section, 342 is the first extension section, 35 is the second copper busbar, 351 is the fourth extension section, 352 is the third extension section, 4 is the socket structure, 41 is the outer peripheral insulating part, 42 is the first conductive block, 421 is the first spring, 422 is the second spring, 5 is the mounting bracket, 51 is the limiting groove, 61 is the vertical creepage path, 62 is the creepage path between copper busbars, 63 is the horizontal creepage path, and 71 is the electrical clearance between conductors. Detailed Implementation

[0048] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0049] The core of this application is to provide a high-voltage, high-power, fast electrical connection device. When the plug structure and socket structure are engaged, the slot and the engaging part engage. When the plug structure is subjected to a large external impact or when the plug structure has a large displacement tendency relative to the socket structure in the direction perpendicular to the engagement, the device can limit the displacement of the fast-plug interface relative to the socket structure in the direction perpendicular to the engagement. The displacement in the direction perpendicular to the engagement mentioned here mainly refers to the displacement along the height direction of the insulating frame. This confines the damage caused by external impact or explosion within the insulating shell, avoiding damage to the fast-plug interface and socket structure.

[0050] Furthermore, the copper busbar assembly and the conductive parts in the socket structure of the high-voltage, high-power, fast electrical connection device provided in this application are electrically connected on both sides. This provides strong current carrying capacity and reduces stress and bending deformation of the copper busbar assembly, thereby extending the lifespan of the power semiconductor module and the high-voltage, high-power, fast electrical connection device, and reducing the probability of explosion. Moreover, in the event of an explosion or significant vibration and impact to the power semiconductor module, each pair of conductors in the plug and socket structures can ensure at least one contact surface remains electrically connected, effectively reducing the probability of contact surface burn-out due to poor contact, open circuits, etc.

[0051] The combined effect described above avoids damage to the socket structure or other chain reactions caused by damage to the quick-plug interface. Only the plug structure needs to be replaced, which improves the reliability of high-voltage, high-power, fast electrical connection devices and the entire electrical system, and reduces the workload of troubleshooting, disassembly and replacement.

[0052] It should be noted that the plug structure and power semiconductor module mentioned in this application are generally independently set up and are relatively lightweight, making the replacement process relatively convenient. The socket structure is generally connected to the main device or is directly integrated with the main device. Once the socket structure is damaged, it will affect the normal operation of the main device or even cause damage to the main device. Therefore, the repair and replacement process of the socket structure is inconvenient and costly.

[0053] Please refer to Figures 1 to 6 .

[0054] This specific embodiment discloses a high-voltage, high-power, fast electrical connection device, including a plug structure and a socket structure 4.

[0055] The plug structure includes:

[0056] An insulating housing 3, with an insulating frame 31 fixedly installed on its outer side;

[0057] The copper busbar assembly has one end fixed inside the insulating housing 3 along its length, and the other end extends outward from the insulating housing 3 into the insulating frame 31. The copper busbar assembly located inside the insulating frame 31 forms a quick-plug interface with the insulating frame 31.

[0058] Socket structure 4 includes:

[0059] Conductive parts, used for electrical connection with copper busbar assembly;

[0060] The outer peripheral insulating portion 41 is wrapped around the outer periphery of the conductive portion;

[0061] Mounting bracket 5 is fixedly disposed relative to the outer peripheral insulating part 41;

[0062] At least one of the insulating frame 31 and the mounting bracket 5 is provided with a slot, and the other is provided with a snap-fit ​​part. The slot and the snap-fit ​​part engage to guide and position the quick-plug interface and limit the displacement of the quick-plug interface relative to the socket structure 4 in the direction perpendicular to the insertion direction.

[0063] like Figure 1 As shown, the insulating housing 3 is provided with an insulating side frame 33, which is mounted above the substrate 1 and serves as the outer shell of the power semiconductor module. A substrate chip 2 is disposed within the cavity formed by the substrate 1 and the insulating side frame 33. The copper busbar assembly includes a first copper busbar 34 and a second copper busbar 35, both of which are connected to the substrate chip 2. Specifically, pins for connecting to the substrate chip 2 can be provided on both the first copper busbar 34 and the second copper busbar 35.

[0064] The slot and the snap-fit ​​part can automatically snap into place after the quick-plug interface and the socket structure 4 are engaged. Alternatively, a locking structure can be set to lock the relative position of the quick-plug interface and the socket structure 4 after they are engaged. The specific method depends on the actual situation and will not be elaborated here.

[0065] During the use of the high-voltage, high-power, fast electrical connection device provided in this specific embodiment, the quick-plug interface in the plug structure is inserted into the socket structure 4. When the plug structure is subjected to a large external force impact or the plug structure has a large displacement tendency relative to the socket structure 4 in the direction perpendicular to the insertion direction, the engagement of the slot and the engaging part can limit the displacement of the quick-plug interface relative to the socket structure 4 in the direction perpendicular to the insertion direction. In addition, since the copper busbar assembly is fixed in the insulating housing 3, the part of the copper busbar assembly located in the insulating housing 3 will undergo a certain deformation with the insulating housing 3. However, the copper busbar assembly has low hardness, and the copper busbar assembly in the insulating frame 31 is encased in injection molding, and the displacement of the insulating frame 31 is limited. When deformed, a bend will be formed near the connection between the insulating housing 3 and the insulating frame 31, which will not affect the copper busbar assembly located in the insulating frame 31.

[0066] It should be noted that the significant external impact on the plug structure can come from the internal impact force generated when the power semiconductor module explodes, or from other external impact forces acting directly or indirectly on the plug structure, depending on the specific circumstances.

[0067] Compared to existing technologies, the high-voltage, high-power, fast electrical connection device provided in this specific embodiment can prevent damage to the socket structure 4 caused by the large displacement of the quick-plug interface relative to the socket structure 4 when the plug structure is subjected to a large external impact or when the plug structure has a large displacement tendency relative to the socket structure 4 in the direction perpendicular to the insertion direction. It confines the damage caused by the explosion within the insulating shell 3, avoiding damage to the quick-plug interface. This prevents damage to the socket structure 4 or other chain damage caused by damage to the quick-plug interface. Only the damaged plug structure needs to be replaced, reducing maintenance costs.

[0068] Based on the above embodiments, the snap-fit ​​part can be configured as a limiting protrusion 32 located on the outside of the insulating frame 31, and the snap-fit ​​groove can be a limiting groove 51 provided on the mounting bracket 5 and cooperating with the limiting protrusion 32.

[0069] In actual setup, the limiting protrusion 32 can be set on the upper and lower outer surfaces of the insulating frame 31, or on the left and right outer surfaces. However, in the setup process, factors such as strength and space at the setting position need to be considered.

[0070] The matching method of the limiting groove 51 and the limiting protrusion 32 makes the engagement process of the quick-plug interface and the socket structure 4 convenient and simple to operate.

[0071] It should be noted that the number of limiting protrusions 32 and limiting grooves 51 can be two or more, depending on the actual situation.

[0072] In one specific embodiment, such as Figure 4 As shown, the outer peripheral insulating part 41 wraps around the outer periphery of the conductive part, and the mounting bracket 5 is fixedly set relative to the outer peripheral insulating part 41. Specifically, the mounting bracket 5 can be installed and fixed to the electrical equipment, and the setting of the mounting bracket 5 has certain positional accuracy requirements with various related interfaces.

[0073] like Figure 1 As shown, the limiting protrusion 32 is positioned at a certain distance from the outer end of the insulating frame 31. During the process of the quick-plug interface engaging with the socket structure 4, the quick-plug interface gradually penetrates into the socket structure 4. The limiting protrusion 32 does not engage with the outer peripheral insulating part 41, but instead directly engages with the limiting groove 51 on the mounting bracket 5.

[0074] Of course, if there is enough space in the outer peripheral insulating part 41 and the accuracy between the outer peripheral insulating part 41 and the relevant interface can be guaranteed, the limiting groove 51 can also be set in the outer peripheral insulating part 41, depending on the actual situation.

[0075] Because the mounting bracket 5 has high strength, the limiting groove 51 is set on the mounting bracket 5, which can improve the restriction on the vertical displacement of the quick-plug interface relative to the socket structure 4, and further reduce the damage to the socket structure 4 when the plug structure is subjected to a large external force impact or when the quick-plug interface is rapidly displaced relative to the socket structure 4.

[0076] Preferably, the limiting protrusion 32, the insulating frame 31, and the insulating shell 3 can be integrally injection molded, with the copper busbar assembly integrally injection molded and encased within the insulating shell 3. This improves the structural strength of the plug structure, enhances its ability to withstand explosive impacts, and improves processing precision, thus maintaining the consistency of the plug structure. Furthermore, the first copper busbar 34 and the second copper busbar 35 are integrally injection molded and encased within the insulating shell 3. Compared to the existing technology where the quick-connect interface is located on a low-inductance busbar and then assembled with the shell, this design reduces errors caused by multiple assembly steps and improves positioning accuracy. This design not only provides high-precision guiding and positioning for quick insertion, ensuring good electrical connection performance, but also, due to the higher precision, the assembly gap between the limiting protrusion 32 and the limiting groove 51 is easier to control, thus achieving a smaller displacement during an explosion. Moreover, the integral injection molding eliminates additional mounting components and space, significantly reducing the overall size.

[0077] In one specific embodiment, the number of limiting protrusions 32 is at least two, and the limiting protrusions 32 are symmetrically arranged on both sides of the insulating frame 31 in the width direction, such as... Figure 1 As shown, the insertion direction of the quick-plug interface and the socket structure 4 gradually increases from the side near the outer end face of the insulating frame 31 to the side near the insulating housing 3, and the cross-sectional size of the limiting protrusion 32 gradually increases.

[0078] During the insertion process of the quick-plug interface and socket structure 4, the relatively large opening of the limiting groove 51 facilitates the entry of the limiting protrusion 32. Initially, the cross-section near the outer end face of the insulating frame 31 is smaller. As the insertion deepens, the cross-section gradually increases, eventually achieving a precise fit with the limiting groove 51. This provides excellent guidance and positioning, enabling blind insertion. Simultaneously, the gradually tightening fit reduces impact during insertion, improving lifespan and convenience.

[0079] Specifically, along the mating direction, the limiting protrusion 32 can be set as a multi-segment structure of different sizes, with adjacent segments connected by inclined surfaces or arc surfaces; of course, along the mating direction, the limiting protrusion 32 can also be set as a conical structure, depending on the actual situation.

[0080] like Figure 4As shown, the cross-section of the limiting protrusion 32 in the plane perpendicular to the mating direction is rectangular. Of course, depending on the actual situation, the cross-section of the limiting protrusion 32 in the plane perpendicular to the mating direction can also be set to other shapes, which will not be elaborated here.

[0081] Preferably, the limiting protrusion 32 is located at the middle position in the height direction of the insulating frame 31.

[0082] It should be noted that the height direction of the insulating frame 31 mentioned in this application document is in the direction of... Figure 1 At the angle shown, in the direction of the vertical skirt edge 313, the width direction of the insulating frame 31 mentioned in this application is in Figure 1 The direction of the horizontal skirt edge 311 at the angle shown.

[0083] In one specific embodiment, along the height direction of the insulating frame 31, the snap-fit ​​part and the slot are fitted with a gap. The gap fit can ensure that the limiting protrusion 32 and the limiting groove 51 can be smoothly inserted and removed. At the same time, the gap here is relatively small, only a micro gap. During the process of the quick-plug interface moving rapidly in the vertical direction relative to the socket structure 4 or the power semiconductor module exploding, the displacement of the quick-plug interface relative to the socket structure 4 can be limited to a very small range, so as to avoid damage to the socket structure 4 or other chain damage caused by damage to the quick-plug interface.

[0084] Based on the above embodiments, the copper busbar assembly can include a first copper busbar 34 and a second copper busbar 35 stacked on top of each other;

[0085] The first copper busbar 34 includes a first extension section 342 located inside the insulating housing 3, a second extension section 341 located inside the insulating frame 31, and a first bent section connecting the first extension section 342 and the second extension section 341.

[0086] The second copper busbar 35 includes a third extension 352 located within the insulating housing 3, a fourth extension 351 located within the insulating frame 31, and a second bent section connecting the third extension 352 and the fourth extension 351.

[0087] The first copper busbar 34 and the second copper busbar 35 are tightly stacked on top of each other, which can achieve good low inductance performance. The stacking extends to the second extension section 341 and the fourth extension section 351. Due to the compact insulation structure at the interface, good low inductance performance can still be maintained even when the two are close to each other.

[0088] This solution involves injection molding the first copper busbar 34 and the second copper busbar 35 into the insulating housing 3 and connecting them to the substrate chip. This eliminates the need for a low-inductance busbar in the power semiconductor module, thereby eliminating the problems of material quantity, large size, pollution, and complex process caused by multiple materials, and improving its power density, production efficiency, and reliability.

[0089] Furthermore, the insulating frame 31 at the interface is an integral sealed structure, eliminating the gaps caused by the assembly of the low-inductance busbar and the insulating housing 3. This can eliminate the risk of glue leakage during the potting process of the power semiconductor module, and also avoid the need for additional sealing structures.

[0090] The insulating frame 31 and the insulating side frame 33 are an integral structure. There are no gaps generated during the assembly process in the square cavity formed by the insulating shell 3 and the substrate 1. This can eliminate the risk of glue leakage caused by the plug structure during the potting process of the power semiconductor module, and also avoid the need to set up an additional sealing structure.

[0091] Preferably, the first extension segment 342, the second extension segment 341, the third extension segment 352 and the fourth extension segment 351 are all parallel to the substrate chip 2, and the distance between the first extension segment 342 and the third extension segment 352 is less than the distance between the second extension segment 341 and the fourth extension segment 351; and the first bending segment and the second bending segment are both inclined or vertically arranged.

[0092] like Figure 2 As shown, the portions of the first copper busbar 34 and the second copper busbar 35 enclosed within the insulating housing 3 are provided with Z-shaped bends, and the first and second bend sections are symmetrically arranged in the vertical direction to reduce the electrical performance difference between the first copper busbar 34 and the second copper busbar 35, which is beneficial to improving the current sharing and other electrical characteristics in the high-voltage, high-power, fast electrical connection device; of course, the first and second bend sections can also be other shapes or bends at other angles, depending on the actual situation.

[0093] The design of the first and second bending sections can achieve buffering and stress relief, reducing the impact force transmitted from the interface to the substrate chip 2 during plugging and unplugging applications, and at the same time reducing the impact force transmitted from the inside to the interface when the power semiconductor module explodes.

[0094] In addition, both the first and second bending sections are enclosed within the insulating shell 3, so that multiple planes in the first and second bending sections abut against the insulating shell 3, offsetting the forces in multiple directions at the quick-plug interface, further ensuring that the impact force during the plugging and unplugging process will not be transmitted to the substrate chip 2, and eliminating the impact force transmitted from the inside to the interface during the explosion of the power semiconductor module.

[0095] In addition, the first bent section and the second bent section are injection-molded inside the insulating housing 3. Compared with the case where only a plane copper bar is injection-molded inside the insulating housing 3, the bonding strength and locking effect of the injection-molded package are better. Moreover, when the first copper bar 34 and the second copper bar 35 are in operation, their temperature will change, and stress will be generated between the copper bars and the insulating housing 3 due to the inconsistent material properties. Since the first bent section and the second bent section are both wrapped in the insulating housing 3, compared with the arrangement without bent sections, the bonding force of the injection-molded package can be more stable without looseness, which meets the requirement of long service life. At the same time, it is conducive to stress release during the injection molding process and ensures precision.

[0096] In a specific embodiment, the copper bar assembly comprises a first copper bar 34 and a second copper bar 35 arranged in an upper and lower stacked manner, the insulating frame 31 is of a Japanese-character (Chinese "ri") shaped structure, and the first copper bar 34 and the second copper bar 35 are respectively located in the upper square-frame structure and the lower square-frame structure of the insulating frame 31 body. The peripheral insulating part 41 is provided with an insulating skirt and a protective frame wrapped around the periphery of the corresponding conductive part in the circumferential direction. The insulating skirt is protruded along the circumferential direction of the outer edge of the peripheral insulating part 41, and a Japanese-character shaped insulating groove matched with the insulating frame 31 is formed between the insulating skirt and the protective frame.

[0097] The insulating frame 31 is configured as a Japanese-character shaped structure, so that an integrated closed insulating cavity is formed around each pair of conductors (such as the first copper bar 34 and the first conductive block 42), realizing fully enclosed gapless insulation with no shortcoming in insulation path. The insulation path herein includes electrical clearance and creepage distance. In addition, it ensures high insulation between the inside of the insulating housing 3 and between the copper bar assembly and the external environment, reduces the peripheral insulation distance, is conducive to miniaturization of the plug structure, and reduces the design and production difficulty of peripheral components.

[0098] The arrangement of the Japanese-character shaped insulating frame 31 makes full use of the dimension of the conductive part itself in the depth direction. In combination with the integrated Japanese-character shaped insulating groove, the horizontal and vertical insulation dimensions are converted into the dimension in the depth direction of the insulating groove. The horizontal direction mentioned herein refers to Figure 1 the dimension in the width direction herein, and the vertical direction refers to Figure 1 the dimension in the height direction herein. The beneficial effects of the specific embodiment of the Japanese-character shaped insulating groove combined with the protective frame and the insulating skirt are as follows:

[0099] In applications where the horizontal dimension is limited, the horizontal insulation distance is converted into the depth dimension, so the width of the conductive part is retained as much as possible, and the current-carrying capacity is enhanced.

[0100] In the vertical spatial direction, compared with the prior art solution that requires multiple creepage grooves to be provided, no extra vertical dimension is required to accommodate the multiple creepage grooves. Tight stacking can be achieved between the first copper bar 34 and the second copper bar 35 in the plug structure, resulting in good low inductance performance; between the first conductive block 42 and the second conductive block, it can also be realized Figure 3 The vertically stacked layers provide excellent low-sensitivity performance.

[0101] This specific embodiment utilizes the depth dimension of the conductive part itself, achieving not only miniaturization of the high-voltage, high-power, fast electrical connection device and ensuring high insulation creepage internally, but also high insulation creepage between the conductor and the external environment, reducing the peripheral insulation distance. This facilitates the miniaturization of the overall system and reduces the design and manufacturing difficulty of peripheral components.

[0102] like Figure 1 As shown, in the un-interlocked state, due to the arrangement of the H-shaped insulating frame 31, a [structure / structure] is formed. Figure 1 The creepage distance shown includes: taking the first copper busbar 34 as an example, along the root of the second extension section 341 which is wrapped by injection molding, the inner side of the insulating frame 31, and the transverse skirt 311, a vertical creepage path 61 is formed between the conductor and the external environment.

[0103] The root, which is wrapped by injection molding along the second extension 341 and the fourth extension 351, the inner side of the insulating frame 31, and the middle insulating rib 312 form a creepage path 62 between conductors.

[0104] Taking the second copper busbar 35 as an example, a transverse creepage path 63 is formed between the conductor and the external environment along the root of the fourth extension section 351 which is wrapped by injection molding, the inner side of the insulating frame 31, and the vertical skirt 313.

[0105] In the plug-in state of the quick-plug interface and socket structure 4, the electrical clearance between conductors and between conductors and the external environment is further enhanced based on the above creepage distance.

[0106] like Figure 3 As shown, after mating, due to the obstruction of the intermediate insulating rib 312, the electrical clearance between the second extension segment 341 and the fourth extension segment 351 changes from the vertical height difference between them to the path shown by the electrical clearance 71 between conductors, thus significantly increasing the clearance. The same applies to the electrical clearances between all conductors and the external environment, which will not be individually labeled here. Furthermore, it can be understood that the electrical clearances between all conductors and between conductors and the external environment can be increased to a level comparable to the corresponding creepage distance, thus achieving electrical clearances far exceeding standard requirements.

[0107] In another specific embodiment, the copper busbar assembly is provided with a copper busbar that can conduct electricity on both the upper and lower surfaces, and the conductive part is a conductive block corresponding to the copper busbar; the conductive block is provided with a slot for inserting the corresponding copper busbar, and a first spring piece 421 for contacting the upper surface of the copper busbar and a second spring piece 422 for contacting the lower surface of the copper busbar assembly are provided in the slot, and the first spring piece 421 and the second spring piece 422 are arranged opposite to each other.

[0108] The copper busbar assembly includes a first copper busbar 34 and a second copper busbar 35, and the conductive blocks include a first conductive block 42 corresponding to the first copper busbar 34 and a second conductive block corresponding to the second copper busbar 35, such as Figure 3 As shown, each of the first conductive block 42 and the second conductive block is provided with two spring pieces. The first conductive block 42 is provided with a first spring piece 421 and a second spring piece 422 that are arranged vertically opposite each other.

[0109] The first spring 421 and the second spring 422 can be an integral structure or a separate structure, depending on the actual situation.

[0110] Compared to the single-sided contact method in the existing technology, the double-sided contact method doubles the contact area of ​​the conductors on both sides of the plug and socket for the same conductive block width, greatly improving the current carrying capacity. This can result in a lower temperature rise under rated operating conditions, which is beneficial to extending the life of the power semiconductor module and electrical connection device. In addition, during use, when there is a large upward or downward displacement between the plug structure and the socket structure 4 (such as large vibration, impact, or damage to the power semiconductor module), the first spring 421 and the second spring 422 are respectively located on the upper and lower surfaces of the slot. The first copper busbar 34 and the second copper busbar 35 can both ensure that at least one contact surface is conductively connected to the spring of the conductive block, avoiding poor contact or even open circuit, and also greatly reducing the probability of contact surface burn-out. Figure 3 The upper and lower contact surfaces of the first copper busbar 34 and the second copper busbar 35 shown are both subjected to the clamping force of the first spring piece 421 and the second spring piece 422 of the conductive block. The clamping forces of the first spring piece 421 and the second spring piece 422 cancel each other out, reducing the stress and bending deformation of the copper busbar and ensuring long-term contact reliability.

[0111] Furthermore, both the first spring piece 421 and the second spring piece 422 are installed in the slots of the conductive block. Compared with the prior art that only uses spring pieces without a conductive block, the first spring piece 421 and the second spring piece 422 in this specific embodiment have better strength and are less prone to failures such as overall bending and displacement of the spring pieces or opening (i.e., the first spring piece 421 and the second spring piece 422 cannot be clamped). The contact area between the first spring piece 421, the second spring piece 422 and the conductive block is increased, and the current can be transmitted to the conductive block along the arc-shaped sides of the contact position, improving the current carrying capacity.

[0112] In this specific embodiment, the aforementioned improvements in reliability and lifespan not only enhance the performance of the power semiconductor module but also reduce the likelihood of the power semiconductor module exploding due to electrical connection failures or instability.

[0113] In the process of using a high-voltage, high-power, fast electrical connection device without a card slot and a card connector, the other structures of the high-voltage, high-power, fast electrical connection device are the same as those in this application, such as... Figure 5As shown, the substrate chip 2 accumulated a large amount of energy, which was released at the moment the power semiconductor module exploded, causing the substrate 1 to be subjected to a downward impact force, such as... Figure 5 The direction indicated by arrow C; the insulating shell 3, the first copper busbar 34, and the second copper busbar 35 are subjected to an upward impact force, as shown by the arrow. Figure 5 The direction indicated by arrow A; however, since the base 1 is usually a mounting fastener, its position generally remains unchanged in practice. The insulating shell 3, the first copper busbar 34, and the second copper busbar 35 generate... Figure 5 The overall upward displacement indicated by arrow A separates it from the base 1, and the first extension segment 342 and the third extension segment 352 generate... Figure 5 The upward arching deformation is indicated by arrow B. The aforementioned overall displacement results in... Figure 3 In the plug-in structure shown, permanent deformation and burning of the first spring 421 and the second spring 422, the first conductive block 42 and the second conductive block, the second extension section 341 and the fourth extension section 351 can even simultaneously damage the outer peripheral insulation part 41 of the socket structure 4 and the insulation frame 31 of the plug structure, leading to a fatal and irreparable failure of the electrical connection. In this case, not only the plug structure needs to be replaced, but the socket structure 4 also needs to be replaced. The socket structure 4 is usually fixed inside the converter cabinet, making disassembly and assembly inconvenient, and its damage can lead to a chain reaction of short circuits, insulation failures, and mechanical damage to other electrical components.

[0114] When using the high-voltage, high-power, fast electrical connection device provided in this application, and the high-voltage, high-power, fast electrical connection device is provided with a slot and a snap-fit ​​part, since the limiting protrusion 32, the insulating shell 3, the first copper busbar 34, and the second copper busbar 35 are all integrally injection molded, when the base 1 is fixedly installed, the limiting protrusion 32 cooperates with the limiting groove 51 in the mounting bracket 5, which can limit the vertical displacement of the fast plug-in interface relative to the socket structure 4. In the event of an explosion of the power semiconductor module or a large displacement tendency of the plug structure relative to the socket structure 4, due to the restriction of the cooperation between the limiting protrusion 32 and the limiting groove 51, the insulating shell 3, the second extension 341, and the fourth extension 351 only produce a small displacement, which is less than the elastic contact compression range allowed by the first spring 421 and the second spring 422, thus only forming a small displacement. Figure 6 The obvious deformation of the first extension segment 342 and the third extension segment 352 in the direction indicated by arrow A, wherein the deformation of the first extension segment 342 and the second copper busbar 35 is significantly greater than that of the second extension segment 352. Figure 5In the case shown, the deformation of the first extension section 342 and the second copper busbar 35 may even lead to breakage. However, during the use of the high-voltage, high-power, fast electrical connection device provided in this application, the damage caused by the impact of an explosion or rapid movement is limited to the portions of the first copper busbar 34 and the second copper busbar 35 located within the insulating housing 3, i.e., limited to the first extension section 342 and the third extension section 352. It will not affect the second extension section 341 and the fourth extension section 351, thus avoiding damage to the socket structure 4 and its chain reaction. Only the plug structure needs to be replaced, which significantly improves the reliability of the high-voltage, high-power, fast electrical connection device and the electrical system, and reduces the workload of troubleshooting and plug replacement.

[0115] The terms "first" and "second" in the first copper busbar 34 and the second copper busbar 35, the second extension segment 341 and the fourth extension segment 351, the first extension segment 342 and the third extension segment 352, the first conductive block 42 and the second conductive block, the first spring 421 and the second spring 422 mentioned in this application are only for distinguishing different positions and do not indicate any order.

[0116] The various embodiments in this specification are described in a progressive manner, with each embodiment focusing on its differences from other embodiments. Similar or identical parts between embodiments can be referred to interchangeably. Any combination of all embodiments provided in this application is within the protection scope of this invention and will not be elaborated upon here.

[0117] The high-voltage, high-power, fast electrical connection device provided in this application has been described in detail above. Specific examples have been used to illustrate the principles and implementation methods of this application. The descriptions of the embodiments above are merely for the purpose of helping to understand the method and core ideas of this application. It should be noted that those skilled in the art can make various improvements and modifications to this application without departing from its principles, and these improvements and modifications also fall within the protection scope of the claims of this application.

Claims

1. A high-voltage, high-power, fast electrical connection device, comprising a plug structure and a socket structure (4), characterized in that, The plug structure includes: An insulating housing (3) has an insulating frame (31) fixed on its outer side. The copper busbar assembly has one end fixed inside the insulating housing (3) along its length, and the other end extending outward from the insulating housing (3) into the insulating frame (31); The copper busbar assembly located within the insulating frame (31) forms a quick-plug interface with the insulating frame (31); The socket structure (4) includes: The conductive part is used for electrical connection with the copper busbar assembly; An outer peripheral insulating portion (41) is wrapped around the outer periphery of the conductive portion; Mounting bracket (5) is fixedly disposed relative to the outer peripheral insulating part (41); At least one of the insulating frame (31) and the mounting bracket (5) is provided with a slot, and the other is provided with a snap-fit ​​part. The slot and the snap-fit ​​part are engaged to guide and position the quick-plug interface and limit the displacement of the quick-plug interface relative to the socket structure (4) in the direction perpendicular to the insertion direction. The snap-fit ​​part is a limiting protrusion (32) provided on the outside of the insulating frame (31), and the slot is a limiting groove (51) provided on the mounting bracket (5) and cooperating with the limiting protrusion (32). The limiting protrusion (32) is positioned at a distance from the outer end of the insulating frame (31).

2. The high-voltage, high-power, fast electrical connection device according to claim 1, characterized in that, The limiting protrusion (32), the insulating frame (31), and the insulating shell (3) are integrally formed.

3. The high-voltage, high-power, fast electrical connection device according to claim 2, characterized in that, The copper busbar components are all integrally injection molded into the insulating housing (3).

4. The high-voltage, high-power, fast electrical connection device according to claim 1, characterized in that, The number of the limiting protrusions (32) is at least two, and the limiting protrusions (32) are symmetrically arranged on both sides of the width direction of the insulating frame (31).

5. The high-voltage, high-power, fast electrical connection device according to claim 4, characterized in that, Along the insertion direction of the quick-plug interface and the socket structure (4), from the side near the outer end face of the insulating frame (31) to the side near the insulating housing (3), the cross-sectional size of the limiting protrusion (32) gradually increases.

6. The high-voltage, high-power, fast electrical connection device according to any one of claims 1-5, characterized in that, The high-voltage, high-power, fast electrical connection device includes a power semiconductor module, which is provided with a substrate chip (2). The insulating shell (3) serves as the outer shell of the power semiconductor module and encapsulates the substrate chip (2) within the power semiconductor module.

7. The high-voltage, high-power, fast electrical connection device according to any one of claims 1-5, characterized in that, Along the height direction of the insulating frame (31), the snap-fit ​​portion is fitted with the slot with a clearance.

8. The high-voltage, high-power, fast electrical connection device according to claim 6, characterized in that, The copper busbar assembly includes a first copper busbar (34) and a second copper busbar (35) stacked on top of each other. The first copper busbar (34) includes a first extension section (342) located inside the insulating housing (3), a second extension section (341) located inside the insulating frame (31), and a first bent section connecting the first extension section (342) and the second extension section (341). The second copper busbar (35) includes a third extension (352) located within the insulating housing (3), a fourth extension (351) located within the insulating frame (31), and a second bent section connecting the third extension (352) and the fourth extension (351).

9. The high-voltage, high-power, fast electrical connection device according to claim 8, characterized in that, The first extension segment (342), the second extension segment (341), the third extension segment (352) and the fourth extension segment (351) are all parallel to the substrate chip (2).

10. The high-voltage, high-power, fast electrical connection device according to claim 9, characterized in that, The distance between the first extension segment (342) and the third extension segment (352) is less than the distance between the second extension segment (341) and the fourth extension segment (351); Furthermore, both the first bending segment and the second bending segment are either inclined or vertically arranged.

11. The high-voltage, high-power, fast electrical connection device according to any one of claims 2-5, characterized in that, The copper busbar assembly includes a first copper busbar (34) and a second copper busbar (35) stacked on top of each other. The insulating frame (31) has a scalloped shape. The first copper busbar (34) and the second copper busbar (35) are located in the upper scalloped shape and the lower scalloped shape of the insulating frame (31), respectively.

12. The high-voltage, high-power, fast electrical connection device according to claim 11, characterized in that, The outer peripheral insulating part (41) is provided with an insulating skirt and a protective frame that wraps around the outer periphery of the corresponding conductive part in the circumferential direction. The insulating skirt protrudes circumferentially along the outer edge of the outer peripheral insulating part (41), and a H-shaped insulating groove that cooperates with the insulating frame (31) is formed between the insulating skirt and the protective frame.

13. The high-voltage, high-power, fast electrical connection device according to any one of claims 1-5, characterized in that, The copper busbar assembly is provided with a copper busbar that is conductive on both its upper and lower surfaces, and the conductive part is a conductive block that is provided corresponding to the copper busbar; The conductive block is provided with a slot for inserting the corresponding copper busbar. The slot is provided with a first spring (421) for contacting the upper surface of the copper busbar and a second spring (422) for contacting the lower surface of the copper busbar assembly. The first spring (421) and the second spring (422) are arranged opposite to each other.

14. The high-voltage, high-power, fast electrical connection device according to claim 13, characterized in that, The first spring (421) and the second spring (422) are either an integral structure or a separate structure.

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