Circuit board

Abstract

A circuit board includes an insulating substrate layer, a ground layer, an insulating layer, an insulating via, a signal transmission layer and a polymer conductor. The ground layer is between the insulating layer and the insulating substrate layer. The signal transmission layer is on the side of the insulating layer opposite the ground layer. The insulating via extends through the signal transmission layer and the insulating layer and connects the ground layer. The polymer conductor is in the insulating via, with a portion electrically connected to the ground layer and another portion extending out of the insulating via. Thus, with the above architecture, not only is the manufacturing process simplified, the operation time is shortened, but also the manufacturing cost and material cost are saved.

Description

Technical Field

[0001] This invention relates to a circuit board, and more particularly to a circuit board containing a polymer conductor. Background Technology

[0002] Generally, in the circuit board manufacturing process, manufacturers create through-holes on the circuit board to facilitate subsequent electroplating processes, thereby forming conductive vias (VIA). Additionally, manufacturers solder metal pillars to the circuit board's pads to enhance noise reduction.

[0003] However, the above-mentioned process is not only quite complicated and increases the operation time, but also consumes a lot of manufacturing and material costs.

[0004] It is evident that the aforementioned technologies still have inconveniences and shortcomings, which are problems that the industry urgently needs to solve. Summary of the Invention

[0005] One object of the present invention is to provide a circuit board that solves the difficulties mentioned in the prior art.

[0006] One embodiment of the present invention provides a circuit board. The circuit board has a ground layer, an insulating via, and a polymer conductor. One end of the polymer conductor is inserted into the insulating via and electrically connected to the ground layer. The other end extends out of the insulating via.

[0007] According to one or more embodiments of the present invention, in the circuit board, each polymer conductor is formed by injecting molten material into these insulating perforations using an in-mold injection molding apparatus. Each insulating perforation does not contain electroplated material or metallic material connecting the first ground layer and the first signal transmission layer.

[0008] According to one or more embodiments of the present invention, in the circuit board, each polymer conductor is a linear column.

[0009] According to one or more embodiments of the present invention, in the circuit board, at least one of these insulating vias has a shape that is wider at the bottom and narrower at the top.

[0010] According to one or more embodiments of the present invention, the circuit board further includes a first bridging portion. The first bridging portion is located outside these insulating through-holes and simultaneously electrically connects these polymer conductors and covers these first signal metal films.

[0011] According to one or more embodiments of the present invention, in the circuit board, the first bridging portion is integrally formed with these polymer conductors.

[0012] According to one or more embodiments of the present invention, in the circuit board, the first bridging portion is an independent conductive element and electrically connects these polymer conductors.

[0013] According to one or more embodiments of the present invention, the circuit board further includes an isolation layer. The isolation layer is located between the first bridging portion and the first signal metal films, and the isolation layer is an air gap or an electrically insulating material.

[0014] According to one or more embodiments of the present invention, the circuit board further includes a second insulating layer, a second ground layer, and a second signal transmission layer. The second insulating layer is located on the side of the insulating substrate layer opposite to the first insulating layer. The second ground layer is disposed between the second insulating layer and the insulating substrate layer, and includes at least one second ground metal film. The second signal transmission layer is disposed on the side of the second insulating layer opposite to the insulating substrate layer, and includes a plurality of second signal metal films. Each insulating via further penetrates the first ground layer, the insulating substrate layer, the second ground layer, the second insulating layer, and the second signal transmission layer, and connects to the second ground layer. These polymer conductors are respectively located within the insulating vias, wherein a third portion of each polymer conductor is electrically connected to the second ground metal film, and a fourth portion of each polymer conductor protrudes from the surface of the second signal transmission layer.

[0015] According to one or more embodiments of the present invention, the circuit board further includes a second bridging portion. The second bridging portion is located outside these insulating through-holes, while electrically connecting these fourth portions of the polymer conductors and covering these second signal metal films.

[0016] Thus, through the above architecture, by filling the circuit board with a polymer conductor and connecting it to the ground layer within the circuit board, the conventional via (VIA) process for circuit boards can be replaced. This not only simplifies the manufacturing process and shortens operation time, but also saves on manufacturing and material costs.

[0017] The above description is only used to illustrate the problem to be solved by the present invention, the technical means to solve the problem, and the effects produced, etc. The specific details of the present invention will be described in detail in the following embodiments and related drawings. Attached Figure Description

[0018] To make the above and other objects, features, advantages and embodiments of the present invention more apparent and understandable, the accompanying drawings are described below:

[0019] Figure 1 This is a schematic diagram of a circuit board according to an embodiment of the present invention.

[0020] Figure 2 This is a schematic diagram of a circuit board according to an embodiment of the present invention.

[0021] Figure 3This is a schematic diagram of a circuit board according to an embodiment of the present invention.

[0022] Figure 4 This is a schematic diagram of a circuit board according to an embodiment of the present invention.

[0023] Figure 5 This is a schematic diagram of a circuit board according to an embodiment of the present invention.

[0024] Figure 6 This is a schematic diagram of a circuit board according to an embodiment of the present invention.

[0025] Figures 7A to 7E To make Figure 5 A continuous schematic diagram of the circuit board.

[0026] [Explanation of Key Component Symbols]

[0027] 10-15: Circuit board 100, 101: Layered structure

[0028] 110: Insulating substrate layer; 120: First ground layer

[0029] 121: First grounding metal film; 130: First insulating layer

[0030] 140: First signal transmission layer; 141: First signal metal film

[0031] 142: Surface 150: Second grounding layer

[0032] 151: Second grounding metal film; 160: Second insulating layer

[0033] 170: Second signal transmission layer; 171: Second signal metal film

[0034] 172: Surface 200, 201, 202: Insulation perforation

[0035] 300, 301, 302: Polymer conductors; 310, 311: First terminal

[0036] 320, 321: Second end; 331: Polymer elastic matrix

[0037] 332: Conductive particles; 341: Intermediate segment

[0038] 342: First terminal segment; 343: Second terminal segment

[0039] 400, 401: First bridging section; 410: Air gap space

[0040] 420: First isolation layer; 501: Second bridging section

[0041] 520: Second isolation layer; 600: Mold

[0042] 610: Feed inlet 620: Upper module

[0043] 630: Lower module; 640: Forming groove

[0044] 650: Molten material W, W1, W2: Width

[0045] X, Z: Axis Detailed Implementation

[0046] Several embodiments of the present invention will be disclosed below with reference to the accompanying drawings. For clarity, many practical details will be described in the following description. However, it should be understood that these practical details are not intended to limit the invention. That is, these practical details are not essential in the various embodiments of the invention. Furthermore, for the sake of simplicity, some conventional structures and elements will be illustrated in the drawings in a simple schematic manner.

[0047] Figure 1 This is a schematic diagram of a circuit board 10 according to an embodiment of the present invention. Figure 1 As shown, in this embodiment, the circuit board 10 includes a stacked structure 100, a plurality of insulating vias 200, and a plurality of polymer conductors 300. The stacked structure 100 includes an insulating substrate layer 110, a first ground layer 120, a first insulating layer 130, and a first signal transmission layer 140 stacked sequentially. In other words, the first ground layer 120 is located between the insulating substrate layer 110 and the first insulating layer 130, and the first signal transmission layer 140 is located on the side of the first insulating layer 130 opposite to the insulating substrate layer 110. More specifically, the first ground layer 120 is directly stacked between the insulating substrate layer 110 and the first insulating layer 130, and the first signal transmission layer 140 is located on the side of the first insulating layer 130 opposite to the insulating substrate layer 110. However, the present invention is not limited thereto.

[0048] In this embodiment, the insulating through-hole 200 is, for example, a blind hole on the laminated structure 100, sequentially penetrating the first signal transmission layer 140 and the first insulating layer 130 to connect to the first ground layer 120. The inner surface of each insulating through-hole 200 is not filled or coated with conductive metal material or electroplating material that connects to the first ground layer 120 and the polymer conductor 300; and in this embodiment, each insulating through-hole 200 does not contain any conductive metal material or electroplating material. In this embodiment, the insulating through-hole 200 extends vertically into the first signal transmission layer 140 and the first insulating layer 130; in other words, the axis (Z-axis) of the insulating through-hole 200 is perpendicular to the major axis (X-axis) of the first ground layer 120.

[0049] In addition, the first ground layer 120 includes at least one first ground metal film 121. The first signal transmission layer 140 includes a plurality of lines located on the first insulating layer 130, each line being, for example, a first signal metal film 141, and the first signal metal film 141 is located between these insulating perforations 200.

[0050] Furthermore, in this embodiment, the cross-section of each insulating perforation 200 is a linear cylinder; in other words, the cross-section of each insulating perforation 200 has a uniform diameter. Polymer conductors 300 are respectively located within these insulating perforations 200, and a portion of each polymer conductor 300 completely fills the insulating perforation 200.

[0051] Each polymer conductor 300 includes a first end 310 and a second end 320 opposite to each other. The first end 310 of the polymer conductor 300 is located within the insulating perforation 200 and electrically connected to the first grounding metal film 121 of the first grounding layer 120. The second end 320 of the polymer conductor 300 is located outside the insulating perforation 200 and protrudes from the insulating perforation 200 from the surface 142 of the first signal transmission layer 140 opposite to the first grounding layer 120. Furthermore, in this embodiment, the cross-section of the polymer conductor 300 is also a linear prism, that is, the width W of the first end 310 and the second end 320 of the polymer conductor 300 is equal.

[0052] Furthermore, in this embodiment, the polymer conductor 300 is conductive rubber; however, the present invention is not limited thereto, and in other embodiments, the polymer conductor 300 may also be conductive plastic or conductive silicone, etc.

[0053] In this embodiment, the polymer conductor 300 includes a polymer elastic body 331 and a plurality of conductive particles 332, which are distributed within the polymer elastic body 331. However, the present invention is not limited thereto.

[0054] Figure 2 This is a schematic diagram of a circuit board 11 according to an embodiment of the present invention. Figure 2 As shown, the circuit board 11 in this embodiment and Figure 1 The circuit board 10 is roughly the same, except that the cross-section of the insulating through-hole 201 does not have a consistent diameter. Instead, the insulating through-hole 201 is wider at the bottom and narrower at the top. The cross-section of the polymer conductor 301 that fills the insulating through-hole 201 is also wider at the bottom and narrower at the top. In other words, the width W1 of the first end 311 of the polymer conductor 301 is greater than the width W2 of the second end 321. For example, the cross-section of the polymer conductor 301 is inverted T-shaped.

[0055] It should be understood that since the width W1 of the first end 311 of the polymer conductor 301 is greater than the width W2 of the second end 321, it helps the first end 311 of the polymer conductor 301 to engage within the first insulating layer 130, making it difficult for the polymer conductor 301 to detach from the stacked structure 100.

[0056] Figure 3 This is a schematic diagram of a circuit board 12 according to an embodiment of the present invention. Figure 3 As shown, the circuit board 12 in this embodiment and Figure 2 The circuit board 12 is substantially the same as the circuit board 11, except that the circuit board 12 further includes a first bridging portion 400. The first bridging portion 400 is located outside the insulating through-holes 201 and covers the first signal metal film 141 of the first signal transmission layer 140. The first bridging portion 400 also connects the second ends 321 of the polymer conductors 301, such that the first bridging portion 400, the polymer conductors 301, and the stacked structure 100 (e.g., the first signal transmission layer 140) together define at least one air gap space 410. The air gap space 410 is located between the first bridging portion 400 and the first signal transmission layer 140, physically separating the first bridging portion 400 and the first signal transmission layer 140, so as to serve as an insulating layer capable of electrically isolating the first bridging portion 400 and the first signal transmission layer 140 and a channel for air to carry away heat.

[0057] Furthermore, the first bridging portion 400 is an independent conductive element, such as a conductive sheet, conductive plate, or conductive film made of a material different from that of the polymer conductor 301; or, the first bridging portion 400 is not integrally formed with the polymer conductor 301. The material of the first bridging portion 400 is, for example, a conductive metal (such as copper or aluminum) or a conductive non-metal (such as graphite or conductive rubber).

[0058] Figure 4 This is a schematic diagram of a circuit board 13 according to an embodiment of the present invention. Figure 4 As shown, the circuit board 13 in this embodiment and Figure 3 The circuit board 12 is largely the same, except that the feature between the first bridging portion 400 and the first signal transmission layer 140 is not the aforementioned air gap space 410, but a solid first isolation layer 420. In other words, this first isolation layer 420 is located between the first bridging portion 400 and the first signal transmission layer 140, and can support the first bridging portion 400, protect the first signal metal film 141, and electrically isolate the first bridging portion 400 and the first signal transmission layer 140. The first isolation layer 420 is an electrically insulating material, such as insulating glue or insulating varnish.

[0059] Furthermore, in this embodiment, the first isolation layer 420 fills the air gap space 410 between the first bridging portion 400 and the first signal transmission layer 140 (see reference). Figure 3 ), and directly contact the surfaces of the first bridging portion 400, each polymer conductor 301 and the stacked structure 100 (e.g., the first signal transmission layer 140).

[0060] Figure 5 This is a schematic diagram of a circuit board 14 according to an embodiment of the present invention. Figure 5 As shown, the circuit board 14 in this embodiment and Figure 3 The circuit board 13 is largely the same, except that the material of the first bridging portion 401 is the same as that of the polymer conductor 301, and the first bridging portion 401 and the polymer conductor 301 are integrally formed, making the first bridging portion 401 and these polymer conductors 301 the same object. For example, the material of the first bridging portion 401 is conductive rubber, and the space between the first bridging portion 401 and the first signal transmission layer 140 is not limited to an air gap or an electrically insulating material.

[0061] Figure 6 This is a schematic diagram of a circuit board 15 according to an embodiment of the present invention. Figure 6 As shown, the circuit board 15 in this embodiment and Figure 5 The circuit board 14 is substantially the same, except that the stacked structure 101 further includes a second ground layer 150, a second insulating layer 160, and a second signal transmission layer 170. The second ground layer 150, the second insulating layer 160, and the second signal transmission layer 170 are sequentially stacked on the side of the insulating substrate layer 110 opposite to the first ground layer 120. More specifically, the second insulating layer 160 is located on the side of the insulating substrate layer 110 opposite to the first insulating layer 130, and the second ground layer 150 is disposed between the second insulating layer 160 and the insulating substrate layer 110. The second signal transmission layer 170 is disposed on the side of the second insulating layer 160 opposite to the insulating substrate layer 110; however, the present invention is not limited thereto.

[0062] In this embodiment, each insulating through-hole 202 is, for example, a through-hole on the stacked structure 101, sequentially penetrating the first signal transmission layer 140, the first insulating layer 130, the first ground layer 120, the insulating substrate layer 110, the second ground layer 150, the second insulating layer 160, and the second signal transmission layer 170, to respectively connect the first ground layer 120 and the second ground layer 150. In this embodiment, the insulating through-hole 202 extends vertically into the first signal transmission layer 140, the first insulating layer 130, the first ground layer 120, the insulating substrate layer 110, the second ground layer 150, the second insulating layer 160, and the second signal transmission layer 170. In other words, the axis (Z-axis) of the insulating through-hole 202 is perpendicular to the major axis (X-axis) of the second ground layer 150.

[0063] Furthermore, the second ground layer 150 includes at least one second ground metal film 151. The second signal transmission layer 170 includes a plurality of lines located on the second insulating layer 160, each line being, for example, a second signal metal film 171, and the second signal metal film 171 is located between these insulating perforations 202.

[0064] Each polymer conductor 302 includes a middle segment 341, a first end segment 342, and a second end segment 343. The first end segment 342 and the second end segment 343 are opposite to each other, and the middle segment 341 connects these two end segments. The middle segment 341 is located inside the insulating perforation 202 and is electrically connected to the first grounding metal film 121 of the first grounding layer 120 and the second grounding metal film 151 of the second grounding layer 150. The first end segment 342 is located outside the insulating perforation 202 and protrudes from the insulating perforation 202 onto the surface 142 of the first signal transmission layer 140 opposite to the first grounding layer 120. The second end segment 343 is located outside the insulating perforation 202 and protrudes from the insulating perforation 202 onto the surface 172 of the second signal transmission layer 170 opposite to the second grounding layer 150.

[0065] Furthermore, in this embodiment, the middle section 341 of the polymer conductor 302 is also a straight column, that is, it has a consistent width W. The first bridging portion 401 is located outside these insulating perforations 202 and simultaneously connects the first end sections 342 of these polymer conductors 302, and covers the first signal metal film 141 of the first signal transmission layer 140.

[0066] The circuit board 15 further includes a second bridging portion 501 and a second insulating layer 520. The second bridging portion 501 is located outside the insulating vias 202 and simultaneously connects the second end segments 343 of the polymer conductors 302, and covers the second signal metal film 171 of the second signal transmission layer 170. The second insulating layer 520 is located between the second bridging portion 501 and the second signal transmission layer 170, and can support the second bridging portion 501 and electrically isolate the second bridging portion 501 and the second signal transmission layer 170. The second insulating layer 520 is, for example, an electrically insulating material. In this embodiment, the second insulating layer 520 fills the space between the second bridging portion 501 and the second signal transmission layer 170, and directly contacts the surfaces of the second bridging portion 501, each polymer conductor 302, and the laminated structure 100 (e.g., the second signal transmission layer 170).

[0067] The materials of the first bridging portion 401 and the second bridging portion 501 are the same as those of the polymer conductor 302, and the first bridging portion 401, the second bridging portion 501 and the polymer conductor 302 are integrally formed, so that the first bridging portion 401, the second bridging portion 501 and these polymer conductors 302 are all the same object.

[0068] Figures 7A to 7E This is a schematic diagram of the circuit board manufacturing process. The manufacturer performs the following steps sequentially according to the circuit board manufacturing process. First, as... Figure 7A As shown, a stacked structure 100 is obtained, wherein the surface of the stacked structure 100 has the aforementioned insulating through-hole 201, the insulating through-hole 201 having a shape that is wider at the bottom and narrower at the top, and the aforementioned first signal metal film 141 has been formed on the surface of the stacked structure 100; however, the present invention is not limited thereto; next, as Figure 7B As shown, the first isolation layer 420 is formed on the surface of the laminated structure 100 and directly covers the first signal metal film 141 and the laminated structure 100 (e.g., the first signal transmission layer 140); then, as Figure 7C and Figure 7D As shown, the laminated structure 100 with a first isolation layer 420 is placed between the upper module 620 and the lower module 630 of the mold 600 of the in-mold injection molding equipment. Figure 7C ), and close the upper module 620 and the lower module 630 together. Figure 7D ); then, as Figure 7E As shown, molten material 650 is injected from the feed port 610 of mold 600 into the forming groove 640 within mold 600, so that the molten material 650 fills the insulating perforations 201 and the forming groove 640 within the laminated structure 100; then, after the mold 600 has cooled and the demolding process is completed, the manufacturer can separate the circuit board 14 from the mold 600 to obtain the desired product. Figure 5 The circuit board 14, wherein the cooled molten material 650 forms the aforementioned polymer conductor 301 on the laminated structure 100.

[0069] It should be understood that this invention is not limited to the polymer conductor being manufactured solely using the aforementioned in-mold injection molding equipment; the above process is for illustrative purposes only. Furthermore, in other embodiments, the polymer conductor may also be inserted through insulating perforations and then fused together with the ground layer using a high-temperature device. Additionally, the insulating perforations are not limited to being formed by drilling or etching; they may also be formed by openings on different layers.

[0070] Thus, through the above architecture, by filling the circuit board with a polymer conductor and connecting it to the ground layer within the circuit board, the conventional via (VIA) process for circuit boards can be replaced. This not only simplifies the manufacturing process and shortens operation time, but also saves on manufacturing and material costs.

[0071] Finally, the embodiments disclosed above are not intended to limit the present invention. Any modifications and refinements made by those skilled in the art without departing from the spirit and scope of the present invention are protected under this invention. Therefore, the scope of protection of this invention shall be determined by the claims.

Claims

1. A circuit board, characterized in that, Include: First insulating layer; Insulating substrate layer; A first grounding layer is disposed between the first insulating layer and the insulating substrate layer, and the first grounding layer includes at least one first grounding metal film; A first signal transmission layer is disposed on one side of the first insulating layer opposite to the insulating substrate layer, and the first signal transmission layer includes a plurality of first signal metal films; Multiple insulating through-holes, each of which penetrates the first signal transmission layer and the first insulating layer and is connected to the first ground layer; as well as Multiple polymer conductors are located within the multiple insulating perforations. The first portion of each of the plurality of polymer conductors is electrically connected to the first grounded metal film, and the second portion of each of the plurality of polymer conductors protrudes from the surface of the first signal transmission layer.

2. The circuit board according to claim 1, characterized in that, Each of the plurality of polymer conductors is made by injecting molten material into the plurality of insulating perforations through an in-mold injection molding device, wherein each of the plurality of insulating perforations does not contain electroplated material or metal material that connects the first ground layer and the first signal transmission layer.

3. The circuit board according to claim 1, characterized in that, Each of the plurality of polymer conductors is a linear column.

4. The circuit board according to claim 1, characterized in that, At least one of the plurality of insulating perforations is wider at the bottom and narrower at the top.

5. The circuit board according to claim 1, characterized in that, Further includes: The first bridging portion is located outside the plurality of insulating perforations and simultaneously electrically connects the plurality of polymer conductors and covers the plurality of first signal metal films.

6. The circuit board according to claim 5, characterized in that, The first bridging portion is integrally formed with the plurality of polymer conductors.

7. The circuit board according to claim 5, characterized in that, The first bridging portion is an independent conductive element and is electrically connected to the plurality of polymer conductors.

8. The circuit board according to claim 5, characterized in that, Further includes: An isolation layer is located between the first bridging portion and the plurality of first signal metal films, wherein the isolation layer is an air gap space or an electrically insulating material.

9. The circuit board according to claim 1, characterized in that, Further includes: The second insulating layer is located on the side of the insulating substrate layer opposite to the first insulating layer; A second grounding layer is disposed between the second insulating layer and the insulating substrate layer, and the second grounding layer includes at least one second grounding metal film; and A second signal transmission layer is disposed on the side of the second insulating layer opposite to the insulating substrate layer, and the second signal transmission layer includes a plurality of second signal metal films. Each of the plurality of insulating perforations further penetrates the first ground layer, the insulating substrate layer, the second ground layer, the second insulating layer and the second signal transmission layer, and is connected to the second ground layer. The plurality of polymer conductors are respectively located in the plurality of insulating perforations. The third portion of each of the plurality of polymer conductors is electrically connected to the second ground metal film, and the fourth portion of each of the plurality of polymer conductors protrudes from the surface of the second signal transmission layer.

10. The circuit board according to claim 9, characterized in that, Further includes: The second bridging portion is located outside the plurality of insulating perforations, and simultaneously electrically connects the plurality of fourth portions of the plurality of polymer conductors, and covers the plurality of second signal metal films.

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