Apparatus for manufacturing segmented encoder strips

Abstract

This invention relates to a manufacturing apparatus for producing electronic components, comprising a processing device for processing printed circuit boards in a working area of ​​the manufacturing apparatus, a conveying device for conveying the printed circuit boards into and out of the working area, and a position measuring system for determining the position of the processing device within the manufacturing apparatus. The position measuring system includes a first encoder bar with an encoder pattern and a first sensor for detecting the encoder pattern of the first encoder bar to determine the position of the processing device relative to the working area. The first encoder bar is divided into a plurality of encoder bar segments arranged linearly and sequentially in a first row, each encoder bar segment having a bar base segment with an encoder pattern segment. The first sensor is configured to detect the encoder pattern of the first encoder bar.

Description

Technical Field

[0001] This invention relates to a manufacturing apparatus for producing electronic components. The apparatus includes a processing device for processing printed circuit boards in a work area of ​​the manufacturing apparatus, a conveying device for transporting the printed circuit boards into and out of the work area, and a position measuring system for determining the position of the processing device within the manufacturing apparatus. The position measuring system includes a first encoder strip with an encoder pattern and a first sensor for detecting the encoder pattern to determine the position of the processing device relative to the work area. Background Technology

[0002] Some manufacturing apparatuses are known, such as circuit board manufacturing apparatuses for manufacturing circuit boards with printed wires or assembly apparatuses for assembling electronic components onto circuit boards, wherein the position of the processing device of the manufacturing apparatus relative to the machine wall of the manufacturing apparatus can be determined by a position measurement system.

[0003] Known position measuring devices have encoder strips with encoder patterns that can be detected by sensors. The encoder strip is fixedly arranged on the machine wall of a manufacturing apparatus, while the sensor is held on the machining element of the manufacturing apparatus and can move with it. For particularly high accuracy in determining the position of the machining element within the manufacturing apparatus, both high resolution of the sensor and high precision of the encoder strip are required. Manufacturing such encoder strips becomes more complex and costly as the length and precision of the encoder strip increase. Summary of the Invention

[0004] Therefore, the object of the present invention is to eliminate, or at least partially eliminate, the aforementioned disadvantages in manufacturing apparatuses for producing electronic components. In particular, the object of the present invention is to provide a manufacturing apparatus for producing electronic components that can be manufactured in a simple and cost-effective manner and ensures high accuracy in determining the position of the processing equipment.

[0005] The aforementioned task is solved by the claims. Therefore, this task is solved by a manufacturing apparatus for manufacturing electronic components having the features of independent claim 1. Further features and details of the invention are derived from the dependent claims, the description, and the drawings.

[0006] According to the present invention, this task is solved by a manufacturing apparatus for manufacturing electronic components. The manufacturing apparatus includes a processing device for processing printed circuit boards in a working area of ​​the manufacturing apparatus, a conveying device for conveying the printed circuit boards into and out of the working area, and a position measuring system for determining the position of the processing device within the manufacturing apparatus. The position measuring system includes a first encoder strip with an encoder pattern and a first sensor for detecting the encoder pattern of the first encoder strip to determine the position of the processing device relative to the working area. According to the present invention, the first encoder strip is divided into a plurality of encoder strip segments arranged linearly and sequentially in a first row, each encoder strip segment having a strip base segment with an encoder pattern segment. The first sensor is configured to detect the encoder pattern of the first encoder strip.

[0007] The manufacturing apparatus is configured to manufacture electronic components. Within the scope of this invention, the manufacture of electronic components is understood, for example, as arranging printed wires on a printed circuit board or assembling electronic components, such as semiconductor components, resistors, or the like, onto a circuit board. The manufacturing apparatus is preferably configured as an automated production machine.

[0008] The processing apparatus is configured to process printed circuit boards (PCBs) within the working area of ​​a manufacturing apparatus. For this purpose, the processing apparatus is configured to be linearly movable relative to the working area. Through this linear movement of the processing apparatus relative to the working area, the processing apparatus can move relative to the PCB disposed within the working area, thereby allowing the PCB to be processed by means of the processing apparatus. Alternatively or additionally, the working area can be configured to be movable relative to the processing apparatus. Preferably, the processing apparatus is capable of linear movement along a first direction and the working area is capable of movement along a second direction transverse to, and preferably perpendicular to, the first direction.

[0009] The conveyor is configured to transport printed circuit boards into a work area. Furthermore, the conveyor is configured to transport the printed circuit boards out of the work area. Preferably, the conveyor has a belt conveyor, particularly a double-belt conveyor. More preferably, the conveyor has a holding device for holding the circuit board in a fixed position within the work area.

[0010] A position measurement system is configured to determine the position of a processing device within a manufacturing apparatus. Alternatively or additionally, the position measurement system may be configured to determine the position of a circuit board within the manufacturing apparatus. Therefore, the position measurement system is preferably configured to determine the relative position of the processing device with respect to a printed circuit board. To determine the position of the processing device relative to a work area, the position measurement system has a first encoder strip with an encoder pattern and a first sensor for detecting the encoder pattern of the first encoder strip. The first sensor is preferably held on the processing device. The movement of the processing device relative to the manufacturing apparatus is described in particular below, wherein this can also be understood, alternatively or additionally, as the movement of the circuit board relative to the processing device.

[0011] The encoder strip is composed of multiple encoder strip segments. Each encoder strip segment has a strip base segment with an encoder pattern segment. Preferably, the encoder strip segment is plate-shaped with a rectangular base surface and has a first transverse edge and a second transverse edge opposite to the first transverse edge. The longitudinal extension range of the encoder strip segment is preferably 10 mm to 30 mm, particularly preferably about 15 mm. The transverse extension range of the encoder strip segment is preferably between 5 mm and 20 mm, particularly preferably about 10 mm. The longitudinal extension range of the encoder pattern segment is preferably defined by the first transverse edge and the second transverse edge, respectively. The encoder strip segments are arranged linearly in a first row. Preferably, the encoder strip segments are arranged such that adjacent encoder strip segments contact each other, particularly planarly, at their end sides or linearly, at their transverse edges. The encoder strip segments are preferably arranged on the machine wall of the manufacturing apparatus. The encoder pattern can be constructed, for example, as an incremental encoder pattern.

[0012] The manufacturing apparatus according to the invention has the advantage over conventional manufacturing apparatuses in that the encoder strip is provided by simple means and in a cost-effective manner. Segmented encoder strips can be manufactured with significantly less effort than integrally formed encoder strips. This reduces the manufacturing cost and expense of the manufacturing apparatus. Furthermore, segmented encoder strips offer the advantage that individual damaged or worn encoder strip segments can be easily replaced without replacing the entire encoder strip. Therefore, maintenance costs are reduced. Finally, separate encoder strip segments have the advantage that thermal expansion only affects individual encoder strip segments and does not accumulate along the extended length of the encoder strip. Therefore, the accuracy of the position measurement system can be improved.

[0013] According to a preferred embodiment of the invention, the manufacturing apparatus may include a position measurement system having a second encoder strip with an encoder pattern, wherein the second encoder strip is divided into a plurality of encoder strip segments arranged linearly and sequentially, separately from each other, in a second row extending parallel to the first row. Furthermore, the position measurement system has a second sensor configured to detect the encoder pattern of the second encoder strip. The first and second sensors are arranged such that the encoder pattern can be detected by means of the first and / or second sensors at each permissible single-axis relative position of the processing device within the working area of ​​the manufacturing apparatus. A single-axis relative position is understood as a relative position achievable by means of single-axis movement, i.e., movement along a straight line. Within the scope of the invention, a permissible relative position is understood as a relative position achievable during the normal operation of the manufacturing apparatus. According to this preferred embodiment of the invention, the position measurement system has two encoder strips, which are preferably arranged parallel to each other. Preferably, the encoder strip segments of the first row contact the encoder strip segments of the second row, such that only a narrow longitudinal seam is formed between these encoder strip segments. The first and second sensors are arranged on the processing device and thus can move with it. Furthermore, the first and second sensors are arranged such that the encoder pattern can always be detected by at least one of the sensors at every position along the encoder strip in the processing device. This prevents both sensors from simultaneously facing the transverse seam between the two encoder strip segments. Additionally, there are relative positions in which the encoder pattern can be detected by multiple sensors. This redundancy allows for the determination of sensor failure, thermal expansion, encoder strip damage, or similar conditions. The advantage of this is that improved and reliable position determination is ensured using simple means and in a cost-effective manner. Furthermore, by arranging the encoder strip segments and sensors, the thermal expansion of the encoder strip segments can be detected and taken into account in accurate position determination.

[0014] According to the invention, additional encoder strips can be provided, preferably arranged in a separate row parallel to the first row. In this way, position determination is improved when the processing device has a large movement path that is transverse to the longitudinal extension of the encoder strips.

[0015] According to a preferred embodiment of the invention, the encoder strip segments are arranged on the machine wall of the manufacturing apparatus such that the dividing seams between two encoder strip segments in the first row are staggered relative to the dividing seams between two encoder strip segments in the second row. In this case, it is preferable that the first and second sensors are arranged at the same height in the longitudinal direction of the encoder strip or staggered from each other by the segment lengths of the encoder strip segments. This has the advantage of ensuring improved and reliable positioning using simple means and in a cost-effective manner.

[0016] More preferably, the position measurement system has a third sensor, which is arranged between the first and second sensors in a direction extending transversely to the first row. The first, second, and third sensors are arranged such that the encoder pattern can be detected by means of the first and / or second and / or third sensors at each permissible biaxial relative position of the processing device within the working area of ​​the manufacturing apparatus. The biaxial relative position can be understood as a relative position achievable by means of a biaxial movement, i.e., movement on a plane, such as a vertically formed XY plane. The X direction here corresponds to the longitudinal extension of the encoder strip, and the Y direction corresponds to the height extension of the encoder strip. The first, second, and third sensors are arranged on the processing device and can therefore move with it. Furthermore, the first, second, and third sensors are arranged such that the encoder pattern can always be detected by means of at least one of the sensors at each position of the processing device along and transversely to the encoder strip. This prevents all three sensors from simultaneously facing the seam between two encoder strip segments, such as a transverse or longitudinal seam. The advantage of this is that it ensures improved and reliable location determination using simple means and in a cost-effective manner.

[0017] In a particularly preferred embodiment of the invention, the position measurement system has a fourth sensor spaced apart from the first sensor in the extending direction of the first row for detecting the encoder pattern of the first row. The first and fourth sensors are arranged such that the encoder pattern can be detected by means of the first and / or the fourth sensor in each permissible single-axis relative position within the working area of ​​the processing apparatus inside the manufacturing apparatus. In this case, the second encoder strip arranged in the second row is optional. The arrangement of the sensors ensures that the encoder pattern can be detected by means of at least one of the sensors in each relative position. This has the advantage of ensuring improved and reliable position determination using simple means and in a cost-effective manner.

[0018] Preferably, the encoder pattern is constructed as an absolute encoder pattern. An absolute encoder pattern has a unique configuration at each location, allowing each position along the encoder path to be precisely defined by the encoder pattern. Therefore, the position of a location can be easily determined by a single detection of the encoder pattern at that location. According to the invention, the first encoder pattern can be constructed identically to the second encoder pattern. Alternatively, the first and second encoder patterns can also be constructed differently. In incremental encoder patterns, direct position determination is not feasible because position determination can only be achieved throughout the entire process of the machining apparatus by driving towards a reference point and scanning the encoder pattern. This has the advantage of ensuring improved and reliable position determination using simple means and in a cost-effective manner.

[0019] According to a preferred embodiment of the present invention, the strip base segments of the encoder strip have a coefficient of thermal expansion of less than 5 x 10⁻⁶. -6 K -1 The material is either made of or composed of such materials. Preferred materials are glass, particularly glass with reduced thermal expansion. Preferred materials include, for example, Jena glass, quartz glass, and microcrystalline glass. This has the advantage of providing encoder strip segments with exceptionally high thermal stability and low thermal expansion in a simple and cost-effective manner, thereby ensuring improved and reliable position determination.

[0020] Particularly preferably, the encoder pattern segments of the encoder strip base segments and the encoder pattern segments of the encoder strip segments have different resolutions. Preferably, the encoder pattern segments have relatively high resolution in the working area, in the sections where processing can be performed on the PCB, and relatively low resolution in the working area, in the sections where only conveying can be performed using the PCB. High resolution allows for high positioning accuracy, while lower resolution reduces positioning accuracy. This has the advantage of reducing the manufacturing cost of the position measurement system and consequently the manufacturing apparatus using simple means and cost-effective methods, while ensuring particularly high positioning accuracy in the relevant sections of the working area.

[0021] According to a preferred embodiment of the invention, the encoder strip segment is fixed to the machine wall of the manufacturing apparatus via only one connecting region, wherein the longitudinal extension of the connecting region is less than half the longitudinal extension of the encoder strip segment. Particularly preferably, the longitudinal extension of the connecting region is less than one-quarter the longitudinal extension of the encoder strip segment. Therefore, in the encoder strip segment, only a first portion of the encoder strip segment remains on the machine wall, while a second portion is loosely disposed on the machine wall. This fixation is not problematic due to the rigid construction of the encoder strip segment. This takes into account the different coefficients of thermal expansion of the machine wall and the encoder strip segment, in order to avoid stress in the encoder strip segment due to the thermal expansion of the machine wall. The connecting region is preferably configured as a point, a line, or similar arrangement. This has the advantage of improving the thermal load capacity of the manufacturing apparatus by simple means and in a cost-effective manner.

[0022] According to a preferred embodiment of the invention, the manufacturing apparatus is configured as a circuit board manufacturing apparatus for manufacturing printed circuit boards with printed conductors. Here, the processing apparatus is configured as a printed conductor generating apparatus for generating printed conductors on the printed circuit board. Alternatively, according to the invention, the manufacturing apparatus can be configured as an assembly apparatus, particularly an automated assembly machine, for assembling electronic components onto a printed circuit board. In this case, the processing apparatus is configured as an assembly head for assembling electronic components onto a printed circuit board. Such a production apparatus requires particularly high positioning accuracy, reaching the nanometer range. Due to this high precision, the manufacturing apparatus according to the invention is particularly suitable for this application. Attached Figure Description

[0023] The manufacturing apparatus according to the present invention will now be described in detail with reference to the accompanying drawings. The following figures are schematically shown:

[0024] Figure 1 A manufacturing apparatus according to a preferred embodiment of the present invention is shown in a side view.

[0025] Figure 2 A position measurement system according to a preferred first embodiment of the present invention is shown in a side view.

[0026] Figure 3 A position measurement system according to a preferred second embodiment of the present invention is shown in a side view.

[0027] Figure 4 A position measurement system according to a preferred third embodiment of the present invention is shown in a side view, and

[0028] Figure 5 The encoder strip segment according to the invention is shown in a side view.

[0029] Explanation of reference numerals in the attached figures:

[0030] 1 Manufacturing apparatus

[0031] 2 Processing equipment

[0032] 3 work areas

[0033] 4 Conveying device

[0034] 5 Position Measurement System

[0035] 6 First encoder strip

[0036] 7 First Sensor

[0037] 8 First row

[0038] 9 encoder strip segmentation

[0039] 10 Second encoder strip

[0040] 11 Second row

[0041] 12 Second Sensor

[0042] 13 Machine wall section

[0043] 14 dividing seams

[0044] 15 Third Sensor

[0045] 16 Fourth Sensor

[0046] 17 Connecting Areas

[0047] 18 Assembly Unit

[0048] 19 Assembly Head

[0049] 20 electronic components

[0050] 21 Third encoder strip

[0051] 22 Third row

[0052] L Printed circuit board (PCB).

[0053] Components with the same function and mode of operation Figures 1 to 5 The same reference numerals are used for each of the attached figures. Detailed Implementation

[0054] exist Figure 1 The manufacturing apparatus 1 according to a preferred embodiment of the present invention is schematically shown in a side view. The manufacturing apparatus 1 is configured as an assembly device 18 for assembling electronic components 20 for a circuit board L. The electronic components 20 are provided on a substrate wound on wheels, wherein a wheel is provided for each different electronic component 20.

[0055] The manufacturing apparatus 1 has a processing device 2 movably arranged in the working area 3 of the manufacturing apparatus, the processing device being configured as an assembly head 19. Electronic components 20 can be picked up by the assembly head 19 and arranged on a circuit board L, for example by insertion, and fixed, for example by soldering. To provide the circuit board L in the working area 3 and to further transport the circuit board L from the working area 3, the manufacturing apparatus 1 has a conveying device 4.

[0056] To determine the position of the processing device 2 in the working area 3, the manufacturing apparatus 1 includes a position measurement system 5 having a first encoder bar 6 arranged in a first row 8 and a second encoder bar 10 arranged parallel to the first row 8 in a second row 11. The first encoder bar 6 and the second encoder bar 10 are each composed of multiple encoder bar segments 9, which are fixed to the machine wall 13 of the manufacturing apparatus 1. Encoder pattern segments, which are not recognizable in this view, are constructed on the encoder bar segments 9. A first sensor 7 for scanning the first encoder bar 6 and a second sensor 12 for scanning the second encoder bar 10 are arranged on the processing device 2. Therefore, the position of the processing device 2 in the working area 3 can be reliably determined.

[0057] Figure 2 A position measurement system 5 according to a preferred first embodiment of the present invention is schematically shown in a side view. The position measurement system 5, for example, corresponds to... Figure 1 The position measurement system 5 is shown in the figure. Encoder bar segments 9 are each fixed to the machine wall 13 via a connecting area 17. A dividing seam 14 is constructed between the encoder bar segments 9 of the first row 8. A similar dividing seam 14 is constructed between the encoder bar segments 9 of the second row 11, the dividing seams being staggered from the dividing seam 14 of the first row 8. The first sensor 7 and the second sensor 12 are arranged on the same vertical line, such that the encoder pattern can be detected by means of the first sensor 7 and / or the second sensor 12 at each position of the processing device 2 in the working area 3. This means that at each position, the first sensor 7 and / or the second sensor 12 are not aligned with one of the dividing seams 14.

[0058] exist Figure 3The position measurement system 5 according to a preferred second embodiment of the invention is schematically shown in a side view. The position measurement system 5 corresponds to the position measurement system 5 according to the first embodiment of the invention and additionally includes a third encoder strip 21 arranged in the third row 22 below the second row 11. The third encoder strip 21 is composed of a plurality of encoder strip segments 9. Furthermore, the position measurement system 5 has a third sensor 15 arranged vertically between the first sensor 7 and the second sensor 12. The first sensor 7 and the second sensor 12 are arranged on the same vertical line, and the third sensor 15 is arranged offset from the first sensor 7 in the longitudinal direction of the first encoder strip 6. The first sensor 7, the second sensor 12, and the third sensor 15 are arranged such that the encoder pattern can be detected on a two-dimensional moving surface at any position of the processing device 2 in the working area 3 by means of the first sensor 7 and / or the second sensor 12 and / or the third sensor 15. This means that at each position, the first sensor 7 and / or the second sensor 12 and / or the third sensor 15 are not aligned with one of the dividing seams 14.

[0059] Figure 4 A position measurement system 5 according to a preferred third embodiment of the invention is schematically shown in a side view. The position measurement system 5 has only a first encoder strip 6, a first sensor 7, and a fourth sensor 16. The first sensor 7 and the fourth sensor 16 are arranged at the same vertical height but at different longitudinal positions such that the encoder pattern can be detected by means of the first sensor 7 and / or the fourth sensor 16 at each position of the processing device 2 in the working area 3. This means that at each position, the first sensor 7 and / or the fourth sensor 16 are not aligned with one of the dividing seams 14.

[0060] exist Figure 5 The diagram schematically illustrates, in a side view, an encoder strip segment 9 according to the invention. Encoder pattern segments are constructed on this encoder strip segment 9, which can be detected by means of a sensor. The encoder pattern segments are constructed as absolute encoder pattern segments and are therefore preferably unique within the range of the position measurement system 5. By arranging multiple encoder strip segments 9 in a row, an encoder strip and an encoder pattern can be formed from the encoder pattern segments.

Claims

1. A manufacturing apparatus (1) for producing electronic components, comprising a processing device (2) for processing a printed circuit board (L) in a working area (3) of the manufacturing apparatus (1), a conveying device (4) for conveying the printed circuit board (L) into and out of the working area (3), and a position measuring system (5) for determining the position of the processing device (2) within the manufacturing apparatus (1), wherein the position measuring system (5) includes a first encoder bar (6) with an encoder pattern and a first sensor (7) for detecting the encoder pattern of the first encoder bar (6) to determine the position of the processing device (2) relative to the working area (3). Its features are, The first encoder strip (6) is divided into a plurality of encoder strip segments (9) arranged linearly and sequentially in a first row (8), wherein each encoder strip segment (9) has a strip base segment with an encoder pattern segment, wherein the first sensor (7) is configured to detect the encoder pattern of the first encoder strip (6).

2. The manufacturing apparatus (1) according to claim 1. Its features are, The position measurement system (5) has a second encoder strip (10) with an encoder pattern, wherein the second encoder strip (10) is divided into a plurality of encoder strip segments (9) arranged sequentially and separately from each other in a second row (11) extending parallel to the first row (8), wherein the position measurement system (5) has a second sensor (12), wherein the second sensor (12) is configured to detect the encoder pattern of the second encoder strip (10), wherein the first sensor (7) and the second sensor (12) are arranged such that the encoder pattern can be detected by means of the first sensor (7) and / or the second sensor (12) at each relative position within the permissible manufacturing device (1) in the working area (3) by movement along a single axis of the processing device (2).

3. The manufacturing apparatus (1) according to claim 2. Its features are, The encoder strip segments (9) are arranged on the machine wall (13) of the manufacturing apparatus (1) such that the dividing seam (14) between the two encoder strip segments (9) of the first row (8) is staggered relative to the dividing seam (14) between the two encoder strip segments (9) of the second row (11).

4. The manufacturing apparatus (1) according to claim 2. Its features are, The position measurement system (5) has a third sensor (15) which is arranged between the first sensor (7) and the second sensor (12) along a direction extending laterally to the first row (8). The first sensor (7), the second sensor (12) and the third sensor (15) are arranged such that the encoder pattern can be detected by means of the first sensor (7) and / or the second sensor (12) and / or the third sensor (15) at each relative position within the permissible manufacturing apparatus (1) in the working area (3) by movement along the two axes of the processing apparatus (2).

5. The manufacturing apparatus (1) according to claim 1. Its features are, The position measurement system (5) has a fourth sensor (16) arranged at a distance from the first sensor (7) along the extension direction of the first row (8) for detecting the encoder pattern of the first row (8), wherein the first sensor (7) and the fourth sensor (16) are arranged such that the encoder pattern can be detected by means of the first sensor (7) and / or the fourth sensor (16) at each relative position within the permissible manufacturing apparatus (1) in the working area (3) by movement along a single axis of the processing apparatus (2).

6. The manufacturing apparatus (1) according to claim 1. Its features are, The encoder pattern has a unique configuration at each location, such that each position along the encoder path is precisely defined by the encoder pattern.

7. The manufacturing apparatus (1) according to claim 1. Its features are, The strip base segment of the encoder strip segment (9) has a material or consists of a material with a coefficient of thermal expansion below 5x10 -6 K -1 -6 A / m / K.

8. The manufacturing apparatus (1) according to claim 1. Its features are, The encoder pattern segments of the encoder strip segments (9) have different resolutions.

9. The manufacturing apparatus (1) according to claim 1. Its features are, Each encoder strip segment (9) is fixed to the machine wall of the manufacturing apparatus by only one connecting area, wherein the longitudinal extension of the connecting area is less than half the longitudinal extension of the encoder strip segment (9).

10. The manufacturing apparatus (1) according to any one of claims 1 to 9. Its features are, The manufacturing apparatus (1) is configured as a circuit board manufacturing apparatus for manufacturing a printed circuit board (L) with printed wires, and the processing apparatus is configured as a printed wire generating apparatus for generating printed wires on the printed circuit board (L), or the manufacturing apparatus (1) is configured as an assembly apparatus (18) and the processing apparatus is configured as an assembly head (19) for assembling electronic components (20) onto the printed circuit board (L).

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