Method for manufacturing display panel, display panel and electronic device

Abstract

The method for manufacturing a display panel, the display panel and the electronic device provided by the embodiments of the present application first form a barrier layer on an interlayer insulating layer. When the touch insulating layer is etched by slotting, the barrier layer can protect the interlayer insulating layer from being etched, thereby avoiding the risk of exposure of the metal wiring under the interlayer insulating layer. In this way, the precision requirement for the control of the etching depth in the slotting process can be reduced, thereby reducing the risk of display panel defects caused by etching too shallow or too deep in the slotting etching.

Description

Technical Field

[0001] This application relates to the field of display device manufacturing, and more specifically, to a method for manufacturing a display panel, the display panel, and an electronic device. Background Technology

[0002] To reduce the bottom bezel of display panels, some display panels employ COP (Chip On Pi) packaging, dividing the display panel into a display section and a bonding section. The integrated circuit chip is mounted on the bonding section and can be folded to the back of the display section along with the bonding section. To prevent defects such as peeling from the bonding section from spreading to the display section and affecting its normal display, some COP-packaged display panels incorporate film grooves in the bonding section without affecting electrical signal transmission. These grooves prevent peeling and other defects from occurring. However, the inventors discovered that improper control of the groove depth can affect the display panel's display performance. Summary of the Invention

[0003] To overcome the aforementioned shortcomings in the prior art, the purpose of this application is to provide a method for manufacturing a display panel, the method comprising:

[0004] Provide a flexible substrate;

[0005] A first array metal layer and / or a second array metal layer are formed on one side of the flexible substrate;

[0006] An interlayer insulating layer is formed on the side of the first array metal layer and / or the second array metal layer away from the flexible substrate;

[0007] A barrier layer is formed on the side of the interlayer insulating layer away from the flexible substrate;

[0008] A touch-sensitive insulating layer is formed on the side of the barrier layer and the interlayer insulating layer away from the flexible substrate;

[0009] The touch insulating layer is etched to form a groove that exposes at least a portion of the barrier layer; the orthographic projection of the groove on the flexible substrate lies within the orthographic projection of the barrier layer on the flexible substrate;

[0010] The barrier layer is removed by etching through the groove.

[0011] Therefore, when grooving the touch insulating layer, the barrier layer can protect the interlayer insulating layer from being etched, avoiding the risk of exposing the metal traces beneath the interlayer insulating layer. This reduces the precision required for etching depth control during the grooving process, thereby minimizing the risk of display panel defects caused by grooving that is too shallow or too deep.

[0012] In one possible implementation, the material of the barrier layer includes metal; the step of etching the barrier layer through the groove includes:

[0013] A touch metal layer is formed on the side of the touch insulating layer away from the flexible substrate;

[0014] While patterning the touch metal layer, the barrier layer is etched through the slots.

[0015] Thus, by removing the barrier layer when patterning the touch metal layer in the touch film layer of the display panel, excessive process steps can be avoided when removing the barrier layer.

[0016] In one possible implementation, the step of forming a barrier layer on the side of the interlayer insulating layer away from the flexible substrate includes:

[0017] A third or fourth array metal layer is formed on the side of the interlayer insulating layer away from the flexible substrate as the barrier layer; the third or fourth array metal layer is also used to form the data or power traces of the display panel.

[0018] Therefore, using the third or fourth array metal layer as the barrier layer can avoid adding too many process steps when setting the barrier layer.

[0019] In one possible implementation, the touch metal layer includes a first touch metal layer and a second touch metal layer; prior to the step of forming a touch insulating layer on the side of the barrier layer and the interlayer insulating layer away from the flexible substrate, the method further includes:

[0020] A first touch metal layer is formed on the side of the interlayer insulating layer away from the flexible substrate, and the orthographic projection of the first touch metal layer on the flexible substrate does not coincide with the orthographic projection of the barrier layer on the flexible substrate.

[0021] The step of forming a touch insulating layer on the side of the barrier layer and the interlayer insulating layer away from the flexible substrate includes:

[0022] The touch insulating layer is formed on the side of the barrier layer and the first touch metal layer away from the flexible substrate;

[0023] The step of forming a touch metal layer on the side of the touch insulating layer away from the flexible substrate includes:

[0024] A second touch metal layer is formed on the side of the touch insulating layer away from the flexible substrate.

[0025] In one possible implementation, the display panel includes a display portion, a bonding portion, and a connecting portion located between the display portion and the bonding portion; the step of forming a barrier layer on the side of the interlayer insulating layer away from the flexible substrate includes:

[0026] A barrier layer is formed on the bonding portion on the side of the interlayer insulating layer away from the flexible substrate.

[0027] In one possible implementation, the bonding portion includes a chip placement area; the step of forming a barrier layer on the bonding portion located on the side of the interlayer insulating layer away from the flexible substrate includes:

[0028] A metal layer is formed on the side of the interlayer insulating layer away from the flexible substrate, and the metal layer is etched to form the barrier layer located on the side of the chip setting area near the display portion and on the side of the chip setting area away from the display portion.

[0029] This prevents poor film peeling at the bonding area from spreading to both sides.

[0030] In one possible implementation, the bonding portion further includes a chip output region and a chip input region, the chip output region being located on the side of the chip mounting region closer to the display region, and the chip input region being located on the side of the chip mounting region farther from the display region; the step of etching the metal layer to form the barrier layer located on the side of the chip mounting region closer to the display region and the side of the chip mounting region farther from the display region includes:

[0031] The metal layer is etched to form the barrier layer between the chip setting area and the chip output area, and the barrier layer is also formed between the chip setting area and the chip input area.

[0032] This prevents poor film peeling from the bonding area from spreading to the chip input and output areas.

[0033] In one possible implementation, the display portion, the connecting portion, and the bonding portion are arranged sequentially along a first direction, and the barrier layer and the slot extend along a second direction, which is perpendicular to the first direction.

[0034] Another object of this application is to provide a display panel manufactured by the manufacturing method of the display panel provided in this application.

[0035] In one possible implementation, the touch insulating layer at the slot location forms an undercut structure, wherein the width of the slot on the side closer to the flexible substrate is greater than the width on the side farther from the flexible substrate.

[0036] Another object of this application is to provide an electronic device, which includes the display panel provided in this application.

[0037] Compared with the prior art, this application has the following beneficial effects:

[0038] The display panel manufacturing method, display panel, and electronic device provided in this application first form a barrier layer on the interlayer insulating layer. During the grooving etching of the touch insulating layer, the barrier layer protects the interlayer insulating layer from etching, preventing the risk of exposed metal traces beneath the interlayer insulating layer. This reduces the precision requirements for etching depth control during the grooving process, thereby minimizing the risk of display panel defects caused by excessively shallow or deep etching. Attached Figure Description

[0039] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0040] Figure 1 This is one of the schematic diagrams of a display panel in the prior art;

[0041] Figure 2 This is a second schematic diagram of a display panel in the prior art;

[0042] Figure 3 This is the third schematic diagram of a display panel in the prior art;

[0043] Figure 4 This is the fourth schematic diagram of a display panel in the prior art;

[0044] Figure 5 This is the fifth schematic diagram of a display panel in the prior art;

[0045] Figure 6 This is a flowchart illustrating the steps of the manufacturing method for the display panel provided in this embodiment;

[0046] Figure 7 This is one of the schematic diagrams illustrating the manufacturing process of the display panel provided in this embodiment;

[0047] Figure 8 This is the second schematic diagram of the manufacturing process of the display panel provided in this embodiment;

[0048] Figure 9 This is the third schematic diagram illustrating the manufacturing process of the display panel provided in this embodiment;

[0049] Figure 10 This is the fourth schematic diagram illustrating the manufacturing process of the display panel provided in this embodiment;

[0050] Figure 11 Fifth schematic diagram of the manufacturing process of the display panel provided in this embodiment;

[0051] Figure 12 This is the sixth schematic diagram illustrating the manufacturing process of the display panel provided in this embodiment;

[0052] Figure 13 This is the seventh schematic diagram illustrating the manufacturing process of the display panel provided in this embodiment;

[0053] Figure 14 This is the eighth schematic diagram illustrating the manufacturing process of the display panel provided in this embodiment;

[0054] Figure 15 This is the ninth schematic diagram of the manufacturing process of the display panel provided in this embodiment. Detailed Implementation

[0055] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. The components of the embodiments of this application described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0056] Therefore, the following detailed description of the embodiments of this application provided in the accompanying drawings is not intended to limit the scope of the claimed application, but merely to illustrate selected embodiments of the application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

[0057] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0058] In the description of this application, it should be noted that the terms "center," "upper," "lower," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product of the invention is in use. They are used only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application. In addition, the terms "first," "second," and "third," etc., are used only to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0059] It should be noted that, where there is no conflict, different features in the embodiments of this application can be combined with each other.

[0060] Please see Figure 1 Some display panels using COP packaging include a display section 11, a bonding section 12, and a connection section 13 between the display section 11 and the bonding section 12. In order to prevent defects such as possible film peeling in the bonding section 12 from spreading to the display section 11, a slot 21 is provided in the bonding section 12.

[0061] Specifically, please refer to Figure 2 , Figure 2 for Figure 1 The cross-sectional view along direction AA shown indicates that, in this type of display panel, the film structure at the location requiring the slot 21 typically includes a flexible substrate 110, a carrier layer 120 on the flexible substrate 110, a first array metal layer 210 on the carrier layer 120, a capacitor dielectric layer 130 on the first array metal layer 210, a second array metal layer 220 on the capacitor dielectric layer 130, an interlayer insulating layer 140 on the second array metal layer 220, a touch insulating layer 310 on the interlayer insulating layer 140, and a touch metal layer 320 on the touch insulating layer 310. Please refer to... Figure 3 The slot 21 usually needs to cut off the touch insulation layer 310 to prevent the spread of defects such as film peeling of the bonding part 12.

[0062] However, precisely controlling the etching depth when etching the touch insulating layer 310 is quite difficult. Etching too shallowly or too deeply may fail to effectively prevent the spread of defects or affect the normal display of the display panel. For example, please refer to... Figure 4 If the etching is too shallow, it may not be able to completely sever certain film layers (such as the touch insulating layer 310), thus failing to effectively prevent the spread of defects such as film peeling. For example, please refer to... Figure 5Since both the touch insulating layer 310 and the interlayer insulating layer 140 are inorganic insulating materials, and the interlayer insulating layer 140 has certain undulations in the distribution of the traces in the first array metal layer 210 and the second array metal layer 220 below it, if the etching of the touch insulating layer 310 is too deep, the interlayer insulating layer 140 that should originally cover the first array metal layer 210 or the second array metal layer 220 may be etched along with the touch insulating layer 310, exposing the first array metal layer 210 or the second array metal layer 220, which in turn causes bright lines to appear on the display panel.

[0063] In view of this, this embodiment provides a method for manufacturing a display panel, a display panel, and an electronic device, which can reduce the difficulty of precisely controlling the etching depth in such slotting, thereby reducing the risk of defects in the display panel caused by excessively shallow or deep slotting etching. The solution provided in this embodiment will be described in detail below.

[0064] Please refer to Figure 6 , Figure 6 This embodiment provides a flowchart illustrating a method for manufacturing a display panel, which may include the following steps.

[0065] Step S110: Provide a flexible substrate 110.

[0066] In this embodiment, the flexible substrate 110 can be a polyimide (PI) substrate.

[0067] In step S120, a first array metal layer 210 and / or a second array metal layer 220 are formed on one side of the flexible substrate 110.

[0068] In this embodiment, the flexible substrate 110 includes a carrier layer 120, which may include a buffer layer, a gate insulating layer, and other film layers. Then, a first array metal layer 210 and / or a second array metal layer 220 are formed by metal sputtering and patterning processes. The first array metal layer 210 and the second array metal layer 220 can be electrically isolated from each other by a capacitor dielectric layer 130.

[0069] Step S130: An interlayer insulating layer 140 is formed on the side of the first array metal layer 210 and / or the second array metal layer 220 away from the flexible substrate 110.

[0070] In this embodiment, the interlayer insulation layer 140 can be an inorganic material insulation layer formed using a chemical vapor deposition process. Please refer to... Figure 7 Steps S110 to S130 can form the following: Figure 7 The structure shown.

[0071] In step S140, a barrier layer 410 is formed on the side of the interlayer insulating layer 140 away from the flexible substrate 110.

[0072] In this embodiment, please refer to Figure 8 A barrier layer 410 can be formed at the location where a groove 21 needs to be formed on the interlayer insulating layer 140. For example, the barrier layer 410 can be formed by metal sputtering and patterning processes.

[0073] In step S150, a touch insulating layer 310 is formed on the side of the barrier layer 410 and the interlayer insulating layer 140 away from the flexible substrate 110.

[0074] In this embodiment, please refer to Figure 9 In the process of forming the touch film layer of the display panel, the touch insulating layer 310 can be formed on the side of the barrier layer 410 and the interlayer insulating layer 140 away from the flexible substrate 110.

[0075] In step S160, the touch insulating layer 310 is etched to form a groove 21 that exposes at least a portion of the barrier layer 410.

[0076] In this embodiment, please refer to Figure 10 The touch insulating layer 310 can be etched at the location where the groove 21 needs to be formed, thereby exposing the barrier layer 410 covered by the touch insulating layer 310. The orthographic projection of the groove 21 on the flexible substrate 110 lies within the orthographic projection of the barrier layer 410 on the flexible substrate 110. That is, during the etching process of the touch insulating layer 310, the orthographic projection of the etching opening on the flexible substrate 110 lies within the orthographic projection of the barrier layer 410 on the flexible substrate 110. Thus, due to the obstruction of the barrier layer 410, the etching of the touch insulating layer 310 will not etch into the interlayer insulating layer 140 beneath the barrier layer 410, thereby avoiding the exposure of the first array metal layer 210 and / or the second array metal layer 220 during etching. This greatly improves the tolerance of etching the groove 21 of the touch insulating layer 310 and reduces the etching difficulty.

[0077] In this embodiment, in step S160, to improve the fault tolerance, the edge of the barrier layer 410 away from the flexible substrate 110 can be kept covered by the insulating layer 310 after etching (e.g., Figure 10 As shown in the figure, this avoids affecting the interlayer insulating layer 140 during etching and slotting.

[0078] Step S170: The barrier layer 410 is etched through the groove 21 to remove the barrier layer 410.

[0079] In this embodiment, please refer to Figure 11 After etching the groove 21 of the touch insulating layer 310, the barrier layer 410 can be removed by etching.

[0080] Based on the above design, in the manufacturing method of the display panel provided in this application embodiment, a barrier layer 410 is first formed on the interlayer insulating layer 140. When the touch insulating layer 310 is etched by slotting 21, the barrier layer 410 can protect the interlayer insulating layer 140 from being etched, avoiding the risk of exposure of the metal traces under the interlayer insulating layer 140. In this way, the precision requirement for etching depth control during slotting 21 can be reduced, thereby reducing the risk of defective display panels caused by etching the slots 21 too shallowly or too deeply.

[0081] In one possible implementation, the material of the barrier layer 410 may include metal, and the barrier layer 410 may be removed when patterning the touch metal layer 320 in the touch film layer of the display panel, thus avoiding adding too many process steps when removing the barrier layer 410.

[0082] Specifically, please refer to Figure 12 In step S170, a touch metal layer 320 may be formed on the side of the touch insulating layer 310 away from the flexible substrate 110, and then please refer to... Figure 13 While patterning the touch metal layer 320, the barrier layer 410 is etched through the slot 21.

[0083] Furthermore, in this embodiment, in step S140, a third array metal layer or a fourth array metal layer can be formed on the side of the interlayer insulating layer 140 away from the flexible substrate 110 as the barrier layer 410. The third array metal layer or the fourth array metal layer is also used to form the data or power traces of the display panel. That is, in this embodiment, the third array metal layer or the fourth array metal layer on the flexible substrate 110 of the display panel can be used as the barrier layer 410. Thus, using the third array metal layer or the fourth array metal layer as the barrier layer avoids adding excessive process steps when setting the barrier layer.

[0084] In one example, the first array metal layer can be used to form the gate electrode, scan signal line Vscan, capacitor lower electrode, etc. in the display panel; the second array metal layer can be used to form the capacitor upper electrode, control signal line EM, reference voltage signal line Vref in the display panel; and the third and fourth array metal layers can be used to form the power supply voltage signal trace Vdd, data voltage signal trace, etc. Vdata in the display panel.

[0085] Further, in this embodiment, the touch metal layer 320 of the display panel may include a first touch metal layer 320 and a second touch metal layer 320. Specifically, before step S150, the first touch metal layer 320 may be formed on the side of the interlayer insulating layer 140 away from the flexible substrate 110, and the orthographic projection of the first touch metal layer 320 on the flexible substrate 110 does not coincide with the orthographic projection of the barrier layer 410 on the flexible substrate 110. Then, in step S150, the touch insulating layer 310 may be formed on the side of the first touch metal layer 320 and the barrier layer 410 away from the flexible substrate 110. After etching the groove 21 of the touch insulating layer 310, the second touch metal layer 320 may be formed on the side of the touch insulating layer 310 away from the flexible substrate 110, and then the barrier layer 410 may be removed while patterning the second touch metal layer 320 is being etched.

[0086] It is understandable that during the etching of the groove 21 in step S160, the orthogonal projection of the etched opening on the flexible substrate 110 lies within the orthogonal projection of the barrier layer 410 on the flexible substrate 110. After etching is completed, the edge of the barrier layer 410 away from the flexible substrate 110 will be covered by the touch insulating layer 310. Then, after removing the barrier layer 410 by etching in step S170, the touch insulating layer 310 at the location of the groove 21 will form an undercut structure, such as... Figure 11 As shown, in the undercut structure, the width of the slot on the side closer to the flexible substrate 110 is greater than the width on the side farther from the flexible substrate 110.

[0087] In one possible implementation, please refer to Figure 14 The display panel includes a display portion 11, a bonding portion 12, and a connecting portion 13 located between the display portion 11 and the bonding portion 12. The bonding portion 12 is used to mount an integrated circuit chip 30. When the connecting portion 13 is bent, the integrated circuit chip 30 is folded to the back of the display portion 11 along with the bonding portion 12. In this embodiment, in step S140, a barrier layer 410 can be formed on the bonding portion 12 on the side of the interlayer insulating layer 140 away from the flexible substrate 110. In step S160, the location for etching the touch insulating layer 310 is also located on the bonding portion 12.

[0088] Further, please refer to Figure 15In this embodiment, the bonding portion 12 includes a chip mounting area 22 for mounting an integrated circuit chip 30. The display panel can have two slots 21; specifically, the two slots 21 can be located on the side of the chip mounting area 22 furthest from the display portion 11 and on the side of the chip mounting area 22 closest to the display portion 11, respectively. This prevents poor film peeling of the bonding portion 12 from propagating to both sides.

[0089] Therefore, in step S140, a metal layer can be formed on the side of the interlayer insulating layer 140 away from the flexible substrate 110, and then the metal layer can be etched to form the barrier layer 410 located on the side of the chip setting area 22 near the display portion 11 and the side of the chip setting area 22 away from the display portion 11.

[0090] Furthermore, please refer to again Figure 15 The bonding portion 12 further includes a chip output area 23 and a chip input area 24. When the display panel is not folded, the chip output area 23 is located on the side of the chip placement area 22 closer to the display portion 11, and the chip input area 24 is located on the side of the chip placement area 22 away from the display portion 11. A metal layer can be formed on the side of the interlayer insulating layer 140 away from the flexible substrate 110, and the metal layer can be etched to form the barrier layer 410 between the chip placement area 22 and the chip output area 23, and also between the chip placement area 22 and the chip input area 21.

[0091] In this embodiment, the display portion 11, the connecting portion 13, and the bonding portion 12 are arranged sequentially along a first direction, and the barrier layer 410 and the slot 21 extend along a second direction, which is perpendicular to the first direction.

[0092] This embodiment also provides a display panel, which is manufactured by the manufacturing method of the display panel provided in this embodiment.

[0093] Furthermore, the touch insulating layer 310 at the location of the slot 21 in the display panel forms an undercut structure, wherein the width of the slot 21 on the side closer to the flexible substrate 110 is greater than the width on the side farther from the flexible substrate 110.

[0094] This embodiment also provides an electronic device, which includes the display panel provided in this embodiment.

[0095] In summary, the manufacturing method, display panel, and electronic device provided in this application first form a barrier layer on the interlayer insulating layer. During the grooving etching of the touch insulating layer, the barrier layer protects the interlayer insulating layer from etching, thus avoiding the risk of exposed metal traces beneath the interlayer insulating layer. This reduces the precision requirements for etching depth control during the grooving process, thereby minimizing the risk of display panel defects caused by excessively shallow or deep etching.

[0096] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0097] The embodiments described above are merely illustrative of several implementations of the present invention, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the invention patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of the present invention, and these all fall within the protection scope of the present invention. Therefore, the protection scope of this invention patent should be determined by the appended claims.

Claims

1. A method for manufacturing a display panel, characterized in that, The method includes: Provide a flexible substrate; A first array metal layer and / or a second array metal layer are formed on one side of the flexible substrate; An interlayer insulating layer is formed on the side of the first array metal layer and / or the second array metal layer away from the flexible substrate; A barrier layer is formed on the side of the interlayer insulating layer away from the flexible substrate; A touch-sensitive insulating layer is formed on the side of the barrier layer and the interlayer insulating layer away from the flexible substrate; The touch insulating layer is etched to form a groove that exposes at least a portion of the barrier layer; the orthographic projection of the groove on the flexible substrate lies within the orthographic projection of the barrier layer on the flexible substrate; The barrier layer is removed by etching through the groove. The display panel includes a display portion, a bonding portion, and a connecting portion located between the display portion and the bonding portion; the step of forming a barrier layer on the side of the interlayer insulating layer away from the flexible substrate includes: A barrier layer is formed on the bonding portion on the side of the interlayer insulating layer away from the flexible substrate.

2. The method according to claim 1, characterized in that, The material of the barrier layer includes metal; the step of etching the barrier layer through the groove includes: A touch metal layer is formed on the side of the touch insulating layer away from the flexible substrate; While patterning the touch metal layer, the barrier layer is etched through the slots.

3. The method according to claim 2, characterized in that, The step of forming a barrier layer on the side of the interlayer insulating layer away from the flexible substrate includes: A third or fourth array metal layer is formed on the side of the interlayer insulating layer away from the flexible substrate as the barrier layer; the third or fourth array metal layer is also used to form the data or power traces of the display panel.

4. The method according to claim 2, characterized in that, The touch-sensitive metal layer includes a first touch-sensitive metal layer and a second touch-sensitive metal layer; prior to the step of forming a touch-sensitive insulating layer on the side of the barrier layer and the interlayer insulating layer away from the flexible substrate, the method further includes: A first touch metal layer is formed on the side of the interlayer insulating layer away from the flexible substrate, and the orthographic projection of the first touch metal layer on the flexible substrate does not coincide with the orthographic projection of the barrier layer on the flexible substrate. The step of forming a touch insulating layer on the side of the barrier layer and the interlayer insulating layer away from the flexible substrate includes: The touch insulating layer is formed on the side of the barrier layer and the first touch metal layer away from the flexible substrate; The step of forming a touch metal layer on the side of the touch insulating layer away from the flexible substrate includes: A second touch metal layer is formed on the side of the touch insulating layer away from the flexible substrate.

5. The method according to claim 1, characterized in that, The bonding portion includes a chip placement area; the step of forming a barrier layer on the bonding portion located on the side of the interlayer insulating layer away from the flexible substrate includes: A metal layer is formed on the side of the interlayer insulating layer away from the flexible substrate, and the metal layer is etched to form the barrier layer located on the side of the chip setting area near the display portion and on the side of the chip setting area away from the display portion.

6. The method according to claim 5, characterized in that, The bonding portion further includes a chip output area and a chip input area, the chip output area being located on the side of the chip placement area closer to the display portion, and the chip input area being located on the side of the chip placement area away from the display portion; the step of etching the metal layer to form the barrier layer located on the side of the chip placement area closer to the display portion and the side of the chip placement area away from the display portion includes: The metal layer is etched to form the barrier layer between the chip setting area and the chip output area, and the barrier layer is also formed between the chip setting area and the chip input area.

7. The method according to claim 1, characterized in that, The display portion, the connecting portion, and the bonding portion are arranged sequentially along a first direction, and the barrier layer and the slot extend along a second direction, which is perpendicular to the first direction.

8. A display panel, characterized in that, The display panel is manufactured by the method described in any one of claims 1-7.

9. The display panel according to claim 8, characterized in that, The touch insulating layer at the slotted location forms an undercut structure, in which the width of the slot on the side closer to the flexible substrate is greater than the width on the side farther from the flexible substrate.

10. An electronic device, characterized in that, The electronic device includes the display panel as described in claim 8.

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