Circuit board structure and display device
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- BOE TECHNOLOGY GROUP CO LTD
- Filing Date
- 2021-09-27
- Publication Date
- 2026-07-07
AI Technical Summary
When combining double-layer FPC with multi-layer FPC, the electromagnetic shielding layer is prone to breakage at the connection point, resulting in a reduction in the electromagnetic shielding performance of electronic products.
A filler portion is filled at the circuit board connection, with its extension direction aligned with the corner portion, and the thickness of the cross section increases as the distance from the second circuit board decreases, forming a transition bridge. An electromagnetic shielding layer covers the circuit board and the filler portion, providing support to prevent breakage.
It improves electromagnetic shielding performance, prevents the electromagnetic shielding layer from breaking due to height differences, and ensures the electromagnetic shielding effect.
Smart Images

Figure CN116194871B_ABST