An automated high-power semiconductor laser beam shaping device and shaping method

Abstract

This invention relates to an automated high-power semiconductor laser spot shaping device and method. The device includes a cabinet, a laser mounting platform, a three-axis motion system, a linear slide, a lens support, a lens cutting assembly, a lens moving assembly, a spot sensing screen, and a control system. The spot sensing screen is located on the upper part of the cabinet. A worktable is located inside the cabinet. The three-axis motion system is located on one side of the worktable, and the lens cutting assembly is mounted on the three-axis motion system. A linear slide is located on the other side of the worktable, and the lens support is mounted on the linear slide. The lens moving assembly is mounted on the lens support. The laser mounting platform is located between the linear slide and the three-axis motion system. The linear slide, laser mounting platform, lens cutting assembly, lens moving assembly, and three-axis motion system are all connected to the control system. This invention has a simple structure, is easy to operate, has high precision, improves production qualification rate and production efficiency, and significantly improves the automation level of manufacturing enterprises.

Description

Technical Field

[0001] This invention relates to an automated high-power semiconductor laser spot shaping device and method, belonging to the technical field of laser spot shaping equipment. Background Technology

[0002] Currently, semiconductor lasers are widely used in laser communication, optical storage, laser cosmetic procedures, laser lighting, and radar. Due to the diverse applications of semiconductor lasers, customers are placing higher demands on the laser's beam characteristics. Existing beam shaping procedures involve fixing the laser to a base, the lens to a fixture, and the fixture to a moving platform. The platform is then manually moved to position the lens directly above the laser bar, and the fast axis is compressed to adjust the beam. However, with the increasing demand for high-power lasers and the growing number of laser bars, this method of shaping each bar individually can no longer meet production speed requirements and impacts work efficiency.

[0003] Chinese patent document CN104375273B discloses a high-power semiconductor laser beam shaping device. The structure comprises a chip placement platform and a probe energizing device connected as a single unit via a quick-fixing device. The semiconductor laser chip is placed on the chip placement platform, and the quick-fixing device presses down to bring the probe of the probe energizing device into contact with the semiconductor laser chip's electrodes, thus energizing the chip. A multi-lens cutting device is mounted on a sliding track of a six-dimensional precision adjustment frame. Multiple microlenses are installed on the multi-lens cutting device, each microlens being horizontal to the beam sagitta direction of the semiconductor laser chip. The light emission center of the semiconductor laser chip, the center of the lens, and the probe center of the beam analyzer are on the same horizontal line. This device adjusts the beam spot by individually adjusting each laser chip and microlens, but its efficiency is low when applied to multi-chip laser products. Summary of the Invention

[0004] To address the shortcomings of existing technologies, this invention provides an automated high-power semiconductor laser spot shaping device that can fully meet the requirements for laser shaping, improve production qualification rate and production efficiency, and significantly enhance the automation level of manufacturing enterprises.

[0005] The present invention also provides a shaping method for the above-mentioned automated high-power semiconductor laser spot shaping equipment.

[0006] The technical solution of the present invention is as follows:

[0007] An automated high-power semiconductor laser spot shaping device includes a cabinet, a laser mounting stage, a three-axis motion system, a linear slide, a lens holder, a lens cutting assembly, a lens moving assembly, a spot sensing screen, and a control system.

[0008] The upper part of the cabinet is equipped with a light spot sensing screen, and the cabinet contains a worktable. A three-axis motion system is installed on one side of the worktable, and a lens cutting component is installed on the three-axis motion system. A linear slide is installed on the other side of the worktable, and a lens bracket is installed on the linear slide. A lens moving component is installed on the lens bracket. A laser mounting platform is installed between the linear slide and the three-axis motion system. The linear slide, laser mounting platform, lens cutting component, lens moving component, and three-axis motion system are all connected to the control system.

[0009] Preferably, the lens moving assembly includes a linear motor (the linear motor is a conventional application motor, including a linear motor primary and a linear motor secondary), the lens holder is provided with the linear motor primary, the linear motor secondary is provided with the linear motor primary, and the linear motor secondary is provided with the lens clamp.

[0010] In a further preferred embodiment, the linear motor has at least one secondary winding, the specific number of which is determined according to the number of lenses. Multiple secondary windings can move linearly on the primary winding. Each lens is connected to a separate linear motor secondary winding through a lens clamp. The control system drives the linear motor secondary winding to move, thereby moving the lens.

[0011] Preferably, the lens clamp is an arc-shaped pneumatic clamp with air holes connected to a vacuum pump, which adsorbs the lens through vacuum negative pressure.

[0012] Preferably, the laser mounting stage includes a laser fixture, a water-cooled plate, and a height adjustment platform. The height adjustment platform is mounted on the workbench, and a water-cooled plate is mounted on the height adjustment platform. The laser fixtures are existing fixtures that hold the laser using pneumatic grippers.

[0013] Preferably, the lens cutting assembly includes a cutting platform, a lens cutting blade, and a cylinder. The cylinder is located on one side of the cutting platform and is connected to the lens cutting blade. The lens cutting blade passes through the cutting platform and is driven by the cylinder to cut the lens.

[0014] In a further preferred embodiment, an ultraviolet lamp light source is provided at the bottom of the cutting platform, and a dispensing needle is provided on the other side of the cutting platform. The dispensing needle is connected to an electromagnetic pneumatic valve, and the amount of glue dispensed by the dispensing needle is controlled by controlling the opening and closing of the electromagnetic pneumatic valve.

[0015] The shaping method of the above-mentioned automated high-power semiconductor laser spot shaping equipment has the following operation steps:

[0016] (1) Place the laser to be tested on the laser mounting table, clamp the laser with the laser fixture, and turn on the power.

[0017] (2) The linear slide moves the lens support to directly above the laser, and the shape of the light spot is obtained on the light spot sensing screen. The control system compares the set light spot shape with the actual light spot shape, and then drives the linear motor to move the lens to the target position, and then verifies the light spot shape.

[0018] (3) After successful verification, the three-axis motion system drives the dispensing needle to move to both sides of the laser. The dispensing needle dispenses glue to bond the lens and the laser. Then the UV light source moves above the laser to bake the UV glue and cure it.

[0019] (4) The three-axis motion system moves the lens cutting blade to the set position, drives the lens cutting blade to move downward, cuts the lens, and completes the shaping.

[0020] The beneficial effects of this invention are as follows:

[0021] 1. This invention moves the lens to directly above the laser to be tested using a linear slide. For high-power doba strip products, multiple lenses can be moved to the target position simultaneously, greatly improving work efficiency and ensuring the consistency of the shape of the shaping spot for products of the same type.

[0022] 2. This invention controls the amount of adhesive dispensed from the dispensing needle by controlling the opening and closing of the electromagnetic pneumatic valve, resulting in a moderate amount of adhesive and uniform application. At the same time, an ultraviolet lamp is used to cure the adhesive simultaneously, avoiding the impact of internal stress caused by inconsistent curing time and improving work efficiency.

[0023] 3. This invention uses a lens cutting blade to cut the lens simultaneously, resulting in lenses of uniform length and an attractive appearance.

[0024] 4. The present invention has a simple structure, is easy to operate, and has high precision. At the same time, the functions of each module are highly integrated and highly automated, and it can be applied to the mass production of lasers. Attached Figure Description

[0025] Figure 1 This is a three-dimensional structural diagram of the present invention;

[0026] Figure 2 This is a front view structural diagram of the present invention;

[0027] Figure 3 This is a schematic diagram of the workbench structure of the present invention;

[0028] Figure 4 This is a schematic diagram of the laser mounting stage structure of the present invention;

[0029] Figure 5 This is a schematic diagram of the lens cutting assembly structure of the present invention;

[0030] The components are as follows: 1. Cabinet; 2. Workbench; 3. Spot sensing screen; 4. Linear slide; 5. Lens bracket; 6. Lens moving assembly; 7. Lens cutting assembly; 8. Three-axis motion system; 9. Laser mounting platform; 10. Linear motor primary; 11. Lens; 12. Lens clamp; 13. Linear motor secondary; 14. Laser; 15. Water-cooled plate; 16. Height adjustment platform; 17. Laser clamp; 18. Dispensing needle; 19. Ultraviolet lamp light source; 20. Lens cutting blade. Detailed Implementation

[0031] The present invention will be further described below with reference to the embodiments and accompanying drawings, but is not limited thereto.

[0032] Example 1:

[0033] like Figure 1-5 As shown, this embodiment provides an automated high-power semiconductor laser spot shaping device, including a cabinet 1, a laser mounting platform 9, a three-axis motion system 8, a linear slide 4, a lens bracket 5, a lens cutting assembly 7, a lens moving assembly 6, a spot sensing screen 3, and a control system.

[0034] A light spot sensing screen 3 is installed on the upper part of the cabinet 1. A workbench 2 is installed inside the cabinet 1. A three-axis motion system 8 is installed on one side of the workbench 2. A lens cutting component 7 is installed on the three-axis motion system 8. A linear slide 4 is installed on the other side of the workbench 2. A lens bracket 5 is installed on the linear slide 4. A lens moving component 6 is installed on the lens bracket 5. A laser mounting platform 9 is installed between the linear slide 4 and the three-axis motion system 8. The linear slide 4, the laser mounting platform 9, the lens cutting component 7, the lens moving component 6, and the three-axis motion system 8 are all connected to the control system.

[0035] The lens moving assembly 6 includes a linear motor (the linear motor is a conventional application motor, including a linear motor primary and a linear motor secondary), a linear motor primary 10 is provided on the lens bracket 5, a linear motor secondary 13 is provided on the linear motor primary 10, and a lens clamp 12 is provided on the linear motor secondary 13.

[0036] Nine linear motor secondarys 13 are provided, and the nine secondarys can move linearly on the primary. Each lens 11 is connected to a separate linear motor secondary through a lens clamp 12. The control system drives the linear motor secondary to move, thereby moving the lens 11.

[0037] The laser mounting platform 9 includes a laser fixture 17, a water-cooled plate 15, and a height adjustment platform 16. The height adjustment platform 16 is mounted on the workbench 2, and the water-cooled plate 15 is mounted on the height adjustment platform 16. The laser fixture 17 is symmetrically arranged on the water-cooled plate 15. The laser fixture is an existing fixture that holds the laser using a pneumatic gripper. The height adjustment platform 16 is an existing height adjustment device that can adjust the height of the laser to meet the needs of lasers of different heights and sizes. The laser is in direct contact with the water-cooled plate, which can dissipate the heat generated by the laser in a timely manner.

[0038] The lens cutting assembly 7 includes a cutting platform, a lens cutting blade 20, and a cylinder. A cylinder is provided on one side of the cutting platform, and the lens cutting blade 20 is connected to the cylinder. The lens cutting blade 20 passes through the cutting platform, and the lens cutting blade is driven by the cylinder to cut the lens.

[0039] An ultraviolet lamp light source 19 is installed at the bottom of the cutting platform, and a dispensing needle 18 is installed on the other side of the cutting platform. The dispensing needle 18 is connected to an electromagnetic pneumatic valve, and the amount of glue dispensed by the dispensing needle is controlled by controlling the opening and closing of the electromagnetic pneumatic valve.

[0040] The shaping method of the above-mentioned automated high-power semiconductor laser spot shaping equipment has the following operation steps:

[0041] (1) Place the laser to be tested 14 on the laser mounting table 9, clamp the laser 14 with the laser clamp 17, and turn on the power.

[0042] (2) The linear slide 4 drives the lens support 5 to move directly above the laser 14, and the light spot shape is obtained on the light spot sensing screen 3. The control system compares the set light spot shape with the actual light spot shape, and then drives the linear motor to move the lens to the target position, and then verifies the light spot shape.

[0043] (3) After successful verification, the three-axis motion system 8 drives the dispensing needle 18 to move to both sides of the laser 14. The dispensing needle dispenses glue to bond the lens 11 to the laser 14. Then the ultraviolet light source moves above the laser to bake the ultraviolet glue and cure it.

[0044] (4) The three-axis motion system 8 moves the lens cutting blade 20 to the set position, drives the lens cutting blade to move downward, cuts the lens 11, and completes the shaping.

[0045] Example 2:

[0046] An automated high-power semiconductor laser spot shaping device has the structure described in Example 1, except that a linear motor secondary 13 is provided, and the lens clamp 12 is an arc-shaped pneumatic clamp with air holes connected to a vacuum pump, which adsorbs the lens through vacuum negative pressure.

Claims

1. A method for shaping a spot in an automated high-power semiconductor laser, characterized in that, The equipment includes a cabinet, a laser mounting platform, a three-axis motion system, a linear slide, a lens bracket, a lens cutting assembly, a lens moving assembly, a spot sensing screen, and a control system. The upper part of the cabinet is equipped with a light spot sensing screen, and the cabinet is equipped with a worktable. A three-axis motion system is set on one side of the worktable, and a lens cutting component is set on the three-axis motion system. A linear slide is set on the other side of the worktable, and a lens bracket is set on the linear slide. A lens moving component is set on the lens bracket. A laser mounting platform is set between the linear slide and the three-axis motion system. The linear slide, laser mounting platform, lens cutting component, lens moving component and three-axis motion system are all connected to the control system. The lens moving assembly includes a linear motor, a primary of the linear motor is provided on the lens support, a secondary of the linear motor is provided on the primary of the linear motor, and a lens clamp is provided on the secondary of the linear motor. The laser mounting table includes a laser fixture, a water-cooled plate, and a height adjustment platform. The height adjustment platform is set on the workbench, and a water-cooled plate is set on the height adjustment platform. Laser fixtures are symmetrically arranged on the water-cooled plate. The lens cutting assembly includes a cutting platform, a lens cutting blade, and a cylinder. A cylinder is installed on one side of the cutting platform, and the cylinder is connected to the lens cutting blade, which penetrates the cutting platform. The bottom of the cutting platform is equipped with an ultraviolet lamp source, and the other side of the cutting platform is equipped with a glue dispensing needle, which is connected to an electromagnetic pneumatic valve. The shaping method of the above-mentioned automated high-power semiconductor laser spot shaping equipment has the following operation steps: (1) Place the laser to be tested on the laser mounting table, clamp the laser with the laser fixture, and turn on the power. (2) The linear slide moves the lens support to directly above the laser, and the shape of the light spot is obtained on the light spot sensing screen. The control system compares the set light spot shape with the actual light spot shape, and then drives the linear motor to move the lens to the target position, and then checks the light spot shape. (3) After successful verification, the three-axis motion system drives the dispensing needle to move to both sides of the laser. The dispensing needle dispenses glue to bond the lens and the laser. Then the UV light source moves above the laser to bake the UV glue and cure it. (4) The three-axis motion system moves the lens cutting blade to the set position, drives the lens cutting blade to move downward, cuts the lens, and completes the shaping.

2. The beam shaping method of the automated high-power semiconductor laser beam shaping equipment as described in claim 1, characterized in that, The linear motor has at least one secondary winding, the specific number of which is determined by the number of lenses.

3. The beam shaping method of the automated high-power semiconductor laser beam shaping equipment as described in claim 2, characterized in that, The lens clamp is an arc-shaped pneumatic clamp with air holes connected to a vacuum pump.

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