Method and system for controlling the position of a product in a furnace tube

Abstract

The application provides a control method for product placement position in a furnace tube. The product placement position is divided in a reaction cavity of the provided furnace tube, and a forbidden placement position is set in the product placement position. The placement position of the target product in the furnace tube is compared with the set forbidden placement position by using a precise control system for product placement position in the furnace tube to determine whether the placement position of the target product in the furnace tube meets the process operation requirements. Therefore, the control method and control system for product placement position in the furnace tube can effectively solve the problems that the product is not placed in the expected position due to the factors such as the sequence of the lot entering the furnace tube controlled by human, the shortage of the number of wafers in the lot, the different starting positions of the lot placement and the like, and further cause the serious consequences such as the great loss of product yield or even the scrapping of the product.

Description

Technical Field

[0001] This invention relates to semiconductor manufacturing processes, and particularly to a method and system for controlling the placement of products in a furnace tube. Background Technology

[0002] In semiconductor manufacturing, many steps must be performed at high temperatures, such as the thermal oxidation process for growing oxide layers. These heat treatment methods typically involve placing the wafer in a waferboard and feeding it into the reaction chamber. Vertical furnaces are widely used due to their small footprint and high processing efficiency. Vertical furnaces usually employ vertical furnace tubes as the carrier for wafer or chip transport and processing. Common furnace tube materials are quartz or silicon carbide, suitable for heat treatment processes in different temperature zones. For example, Low Pressure Chemical Vapor Deposition (LPCVD) is a semiconductor heat treatment process widely used at high temperatures for depositing silicon oxide, nitride, and polycrystalline silicon films. In LPCVD vertical furnace tubes, a certain number of wafers are placed from top to bottom on boats with fixed spacing and placed into the reaction chamber for deposition.

[0003] However, the batch furnace tube manufacturing process can cause variations in the electrical or physical properties of wafers placed in different positions due to the loading effect. Therefore, for furnace tube operations, due to differences in process characteristics and different product processing windows, it is often necessary to restrict the placement of specific products in the furnace tube to meet process requirements.

[0004] During furnace tube operation, wafer unit products (Lots) are placed on the furnace tube from top to bottom according to the order they enter the machine, thus defining the Lot positions from top to bottom as P1, P2, P3, P4, P5, and P6. In current technology, controlling the position of a specific Lot in the furnace tube is achieved manually during the receiving process by controlling the order in which the Lots enter the furnace tube. However, this method is often affected by factors such as a shortage of wafers within the Lot and different initial Lot placement positions, resulting in products not being placed in the desired positions, leading to serious consequences such as reduced product yield or even scrap. Summary of the Invention

[0005] The purpose of this invention is to provide a method and system for controlling the placement of products in a furnace tube, in order to solve the problem that the current method of manually controlling the order in which wafer batches with control requirements enter the furnace tube is often affected by factors such as the shortage of wafers in the lot and the different starting positions of the lot placement, resulting in products not being placed in the expected position, which in turn leads to serious consequences such as loss of product yield or even scrap.

[0006] In a first aspect, to solve the above-mentioned technical problems, the present invention provides a method for controlling the placement position of products in a furnace tube, comprising the following steps:

[0007] A furnace tube is provided, and the reaction chamber of the furnace tube is divided into N product placement positions, and a prohibited placement zone is set in the product placement positions;

[0008] Based on a preset control position calculation strategy, the expected position of the wafer batch lot with control requirements contained in the target product to be processed is calculated in the furnace tube.

[0009] Based on the expected position of the wafer batch lot with control requirements in the furnace tube and the prohibited placement position, confirm whether the placement position of the target product to be processed in the furnace tube meets the process operation requirements.

[0010] Furthermore, the reaction chamber of the furnace tube is defined as slot1-slotn from top to bottom to form N product placement positions in the furnace tube reaction chamber, where n is the total number of wafers included in the products that can be placed in the furnace tube in a full batch operation, and the value of n can be in the range of 1-200.

[0011] Furthermore, the step of setting prohibited placement locations in the product placement area may include:

[0012] Obtain the number of wafers in a full batch of the target product and the preset placement method of the target product, and set prohibited placement positions among the N product placement positions according to the product requirements of the target product.

[0013] Furthermore, the pre-positioning method may include: starting from the top, bottom, or middle position of the reaction chamber of the furnace tube.

[0014] Furthermore, the step of calculating the expected position of the wafer batch lot with control requirements contained in the target product to be processed within the furnace tube, based on a preset control position calculation strategy, may include:

[0015] Based on the dispatching sequence of the target product, the number of wafer batches / lots included, the number of wafers contained in each wafer batch / lot, and the preset placement method of the target product, the product placement position of each wafer batch / lot with control requirements in the furnace tube is calculated for each of the multiple wafer batches / lots with control requirements contained in the target wafer.

[0016] Furthermore, the wafer batches in any preset placement method of the furnace tube are defined as 1lot, 2lots, 3lots, 4lots, 5lots, and 6lots, respectively. The number of wafers of the target product to be processed that can be placed at the placement positions of 1lot, 2lots, 3lots, 4lots, 5lots, and 6lots of the wafer batch are w1, w2, w3, w4, w5, and w6, respectively. The calculation method for determining the position of a lot in the furnace tube based on the preset placement method is that the sum of w1 to w6 is ≤ n.

[0017] Furthermore, the step of confirming whether the placement of the target product to be processed in the furnace tube meets the process requirements may include:

[0018] The expected position of the wafer batch lot with control requirements in the furnace tube is compared with the set prohibited placement position. If the two overlap, it is determined that the placement position of the target product to be processed in the furnace tube does not meet the process operation requirements.

[0019] Furthermore, after determining whether the placement of the target product to be processed in the furnace tube meets the process requirements, the control method may further include:

[0020] An early warning is issued to indicate that dispatching has failed, and the dispatching order of the target product is adjusted. Then, the process returns to the step of calculating the product placement position of the wafer batches with control requirements in the furnace tube based on the dispatching order of the target product, the number of wafer batches included, the number of wafers included in each wafer batch, and the preset placement method of the target product.

[0021] Furthermore, prior to the step of dividing the reaction chamber of the furnace tube into N product placement positions, the control method further includes:

[0022] Determine whether the multiple wafer batch lots contained in the target product include wafer batch lots with control requirements;

[0023] If the reaction chamber of the furnace tube is included, the step of dividing the reaction chamber into N product placement positions is executed; otherwise, the dispatch is successful and the target product is processed.

[0024] Secondly, based on the method for controlling the product placement position in the furnace tube as described above, the present invention also provides a control system for the product placement position in the furnace tube, which may specifically include the following modules:

[0025] The partitioning module is used to divide the reaction chamber of a provided furnace tube into N product placement positions, and to set prohibited placement positions among the product placement positions;

[0026] The expected position calculation module is used to calculate the expected position of the wafer batch lot with control requirements contained in the target product to be processed within the furnace tube based on a preset control position calculation strategy.

[0027] The placement position determination module is used to confirm whether the placement position of the target product to be processed in the furnace tube meets the process operation requirements, based on the expected position of the wafer batch lot with control requirements in the furnace tube and the prohibited placement position.

[0028] Thirdly, based on the control method and control system for the product placement position in the furnace tube as described above, the present invention also provides an electronic device, including a processor, a communication interface, a memory, and a communication bus, wherein the processor, the communication interface, and the memory communicate with each other through the communication bus.

[0029] Memory, used to store computer programs;

[0030] The processor, when executing a program stored in a memory, implements the steps of the method for controlling the placement of products in the furnace tube as described in any one of claims 1 to 9.

[0031] Compared with the prior art, the technical solution of the present invention has at least one of the following beneficial effects:

[0032] In the present invention, a method for controlling the product placement position in a furnace tube is proposed. First, the reaction chamber of the furnace tube is divided into N product placement positions, and prohibited placement positions are set in the product placement positions. Next, based on a preset control position calculation strategy, the expected position of the wafer batch lot with control requirements contained in the target product to be processed is calculated in the furnace tube. Finally, based on the expected position of the wafer batch lot with control requirements in the furnace tube and the prohibited placement positions, it is confirmed whether the placement position of the target product to be processed in the furnace tube meets the process operation requirements.

[0033] Because this invention employs a precise control system for product placement within the furnace tube to confirm the full batch number of wafers for the target product and the preset placement method (starting from the top, bottom, or middle position of the furnace tube's reaction chamber), and compares the placement of the target product in the furnace tube with the set prohibited placement positions based on the adopted placement method, it determines whether the placement of the target product in the furnace tube meets the process requirements by judging whether the two overlap. If not, the control system adjusts the lot dispatching sequence and re-dispatches the lot until there is no overlap before the process can be executed. Therefore, the method and control system for controlling the product placement in the furnace tube provided by this invention can effectively solve the problems of current wafer batches with controllable positions, where the order of lot entry into the furnace tube is manually controlled, the number of wafers in the lot is insufficient, and the starting position of the lot placement is different. These factors can cause products to not be placed in the desired position, resulting in significant product yield losses or even scrap. Attached Figure Description

[0034] Figure 1 This is a flowchart illustrating a method for controlling the product placement position in a furnace tube according to an embodiment of the present invention.

[0035] Figure 2 This is a schematic diagram of the prohibited placement position in the furnace tube according to one embodiment of the present invention.

[0036] Among them, the appendix Figure 2 The markings are as follows:

[0037] 100 - Furnace tube; P1-P6 - Batch;

[0038] Slot1, Slot26, Slot51, Slot76, Slot101, Slot126, Slot150: Placement position numbers. Detailed Implementation

[0039] As described in the background section, many steps in semiconductor manufacturing must be performed at high temperatures, such as the thermal oxidation process for growing oxide layers. These heat treatment methods typically involve placing the wafer in a waferboard and feeding it into the reaction chamber. Vertical furnaces are widely used due to their small footprint and high processing efficiency. Vertical furnaces typically use vertical furnace tubes as the carrier for wafer or chip transfer and processing. Common furnace tube materials are quartz or silicon carbide, suitable for heat treatment processes in different temperature zones. For example, Low Pressure Chemical Vapor Deposition (LPCVD) is a semiconductor heat treatment process widely used for depositing silicon oxide, nitride, and polycrystalline silicon films at high temperatures. In LPCVD vertical furnace tubes, a certain number of wafers are placed from top to bottom on boats with fixed spacing and placed into the reaction chamber for deposition.

[0040] However, the batch furnace tube manufacturing process can cause variations in the electrical or physical properties of wafers placed in different positions due to the loading effect. Therefore, for furnace tube operations, due to differences in process characteristics and different product processing windows, it is often necessary to restrict the placement of specific products in the furnace tube to meet process requirements.

[0041] During furnace tube operation, wafer unit products (Lots) are placed on the furnace tube from top to bottom according to the order they enter the machine, thus defining the Lot positions from top to bottom as P1, P2, P3, P4, P5, and P6. In current technology, controlling the position of a specific Lot in the furnace tube is achieved manually during the receiving process by controlling the order in which the Lots enter the furnace tube. However, this method is often affected by factors such as a shortage of wafers within the Lot and different initial Lot placement positions, resulting in products not being placed in the desired positions, leading to serious consequences such as reduced product yield or even scrap.

[0042] Therefore, the purpose of this invention is to provide a method and system for controlling the placement position of products in a furnace tube, so as to solve the problem that the current method of manually controlling the order in which the lot of wafer batches with control requirements enters the furnace tube is achieved by manually controlling the order in which the lot enters the furnace tube. However, this method is often affected by factors such as the shortage of wafers in the lot and the different starting positions of the lot placement, resulting in products not being placed in the expected position, which leads to serious consequences such as loss of product yield or even scrap.

[0043] For example, refer to Figure 1 As shown, the method for controlling the product placement position in a furnace tube includes the following steps:

[0044] Step S100: Provide a furnace tube, divide the reaction chamber of the furnace tube into N product placement positions, and set prohibited placement positions among the product placement positions;

[0045] Step S200: Based on the preset control position calculation strategy, calculate the expected position of the wafer batch lot with control requirements contained in the target product to be processed in the furnace tube.

[0046] Step S300: Based on the expected position of the wafer batch lot with control requirements in the furnace tube and the prohibited placement position, confirm whether the placement position of the target product to be processed in the furnace tube meets the process operation requirements.

[0047] The following detailed description, in conjunction with the accompanying drawings and specific embodiments, provides a method and system for controlling the placement of products in a furnace tube according to the present invention. The advantages and features of the present invention will become clearer from the following description. It should be noted that the accompanying drawings are all in a very simplified form and use non-precise proportions, and are only used to facilitate and clarify the illustration of the embodiments of the present invention. Many specific details are set forth in the following description to provide a thorough understanding of the present invention; however, the present invention may be implemented in other ways different from those described herein, and therefore the present invention is not limited to the specific embodiments disclosed below.

[0048] The method for controlling the product placement position in the furnace tube provided by this invention will be described in detail below. For details, please refer to... Figure 2 As shown, Figure 2 This is a schematic diagram of the furnace tube structure in one embodiment of the present invention; wherein, the method for controlling the product placement position in the furnace tube may include the following steps:

[0049] Example 1:

[0050] In step S100, it is determined whether the multiple wafer batch lots included in the target product include wafer batch lots with control requirements. For example, in this embodiment, the multiple wafer batch lots included in the target product include wafer batch lots with control requirements.

[0051] In step S200, please refer to the following for details. Figure 2 A furnace tube is provided, and the reaction chamber of the furnace tube is used to place the target wafer products to be processed. The reaction chamber of the furnace tube is divided into N product placement positions. For example, in this embodiment, the reaction chamber of the furnace tube is defined as slot1-slotn from top to bottom to form N product placement positions in the reaction chamber of the furnace tube, where n is the total number of wafers included in the products that can be placed in the furnace tube in a full batch, and the value of n ranges from 1 to 200.

[0052] In step S300, continue to refer to Figure 2 Based on a preset control position calculation strategy, the expected positions of wafer batches with control requirements within the furnace tube of the target product to be processed are calculated. For example, in this embodiment, based on the processing order of the target product, the number of wafer batches within it, the number of wafers contained in each wafer batch, and the preset placement method of the target product, the product placement positions of the multiple wafer batches with control requirements within the furnace tube of the target wafer are calculated respectively.

[0053] In step S400, continue to refer to Figure 2 The method obtains the number of wafers in a full batch of the target product and the preset placement method of the target product. For example, in this embodiment, the preset placement method includes placing wafers starting from the top, bottom, or middle position of the reaction chamber of the furnace tube. For example, the full batch of wafers that can be placed in any preset placement method of the furnace tube is defined as 1 lot, 2 lots, 3 lots, 4 lots, 5 lots, and 6 lots, respectively. The number of target product wafers to be processed that can be placed at the placement positions of 1 lot, 2 lots, 3 lots, 4 lots, 5 lots, and 6 lots of the full batch of wafers are w1, w2, w3, w4, w5, and w6, respectively; and the calculation method for determining the position of a lot in the furnace tube based on the preset placement method is w1 + w2 + w3 + w4 + w5 + w6 ≤ n. For example, when the full batch size of the wafer batch is 1 lot, 2 lots, 3 lots, 4 lots, 5 lots, or 6 lots, and the total number of wafers placed is between 1 and 200, the placement position of the product in the furnace tube can be calculated using the method described above. Specifically, the calculation method for the full batch number of wafers in the furnace tube, based on three preset placement methods (starting from the top, bottom, or middle position of the reaction chamber of the furnace tube), is shown in Table 1.

[0054] Table 1. Calculation method for determining the position of the lot in the furnace tube based on the placement method.

[0055]

[0056] In step S500, continue to refer to Figure 2 Prohibited placement areas are set among the product placement locations. Specifically, based on the product requirements of the target product, prohibited placement areas are set among the N product placement locations. For example, in this embodiment, the prohibited placement areas are slots 51-100.

[0057] In step S600, based on the expected position of the wafer batch lot with control requirements within the furnace tube and the prohibited placement position, it is determined whether the placement position of the target product to be processed within the furnace tube meets the process operation requirements. For example, in this embodiment, the expected position of the wafer batch lot with control requirements within the furnace tube is compared with the set prohibited placement position. If the two overlap, it is determined that the placement position of the target product to be processed within the furnace tube does not meet the process operation requirements. For example, in this embodiment, the two overlap after comparison, therefore the placement position of the target product to be processed within the furnace tube does not meet the process operation requirements.

[0058] In step S700, if the expected position of the wafer batch lot with control requirements in the furnace tube overlaps with the set prohibited placement position after comparison, the system issues an early warning to indicate that the dispatching is unsuccessful. The dispatching order of the target product is adjusted, and the process returns to step S200. The step of calculating the product placement position of the wafer batch lot with control requirements in the furnace tube for each wafer batch lot with control requirements based on the dispatching order of the target product, the number of wafer batch lots included, the number of wafers included in each wafer batch lot, and the preset placement method of the target product is re-executed. This process continues until the comparison between the two intervals does not overlap and the process operation requirements are met. Finally, the operation is performed on the target product.

[0059] Example 2:

[0060] In this embodiment, steps S100-S500 are the same as steps S100-S500 in embodiment 1.

[0061] Specifically, in step S100, it is determined whether the multiple wafer batch lots included in the target product include wafer batch lots with control requirements. For example, in this embodiment, the multiple wafer batch lots included in the target product include wafer batch lots with control requirements.

[0062] In step S200, please refer to the following for details. Figure 2 A furnace tube is provided, and the reaction chamber of the furnace tube is used to place the target wafer products to be processed. The reaction chamber of the furnace tube is divided into N product placement positions. For example, in this embodiment, the reaction chamber of the furnace tube is defined as slot1-slotn from top to bottom to form N product placement positions in the reaction chamber of the furnace tube, where n is the total number of wafers included in the products that can be placed in the furnace tube in a full batch, and the value of n ranges from 1 to 200.

[0063] In step S300, continue to refer to Figure 2 Based on a preset control position calculation strategy, the expected positions of wafer batches with control requirements within the furnace tube of the target product to be processed are calculated. For example, in this embodiment, based on the processing order of the target product, the number of wafer batches within it, the number of wafers contained in each wafer batch, and the preset placement method of the target product, the product placement positions of the multiple wafer batches with control requirements within the furnace tube of the target wafer are calculated respectively.

[0064] In step S400, continue to refer to Figure 2 The method obtains the full batch number of wafers for the target product and the preset placement method of the target product. For example, in this embodiment, the preset placement method includes placing wafers starting from the top, bottom, or middle position of the furnace tube's reaction chamber. For example, the full batch number of wafers that can be placed in any preset placement method in the furnace tube's reaction chamber is defined as 1 lot, 2 lots, 3 lots, 4 lots, 5 lots, and 6 lots, respectively. The number of target product wafers to be processed that can be placed in wafer batches 1 lot, 2 lots, 3 lots, 4 lots, 5 lots, and 6 lots are w1, w2, w3, w4, w5, and w6, respectively; and w1 + w2 + w3 + w4 + w5 + w6 ≤ n. For example, when the full batch number of wafers is 1 lot, 2 lots, 3 lots, 4 lots, 5 lots, or 6 lots, and the total number of wafers placed is between 1 and 200, the placement position of the product in the furnace tube can be calculated according to the above method.

[0065] In step S500, continue to refer to Figure 2 Prohibited placement areas are set among the product placement locations. Specifically, based on the product requirements of the target product, prohibited placement areas are set among the N product placement locations. For example, in this embodiment, the prohibited placement areas are slots 51-100.

[0066] In step S600, based on the expected position of the wafer batch lot with control requirements within the furnace tube and the prohibited placement position, it is determined whether the placement position of the target product to be processed within the furnace tube meets the process operation requirements. For example, in this embodiment, the expected position of the wafer batch lot with control requirements within the furnace tube is compared with the set prohibited placement position. If the two overlap, it is determined that the placement position of the target product to be processed within the furnace tube does not meet the process operation requirements. For example, in this embodiment, the two do not overlap after comparison, that is, the placement position of the target product to be processed within the furnace tube meets the process operation requirements. Therefore, the operation is performed on the target product.

[0067] Example 3:

[0068] In step S100, it is determined whether the multiple wafer batch lots included in the target product include wafer batch lots with control requirements. For example, in this embodiment, the multiple wafer batch lots included in the target product do not include wafer batch lots with control requirements.

[0069] In step S200, a furnace tube is provided, and the reaction chamber of the furnace tube is used to place the target wafer products to be processed. The reaction chamber of the furnace tube is divided into N product placement positions. For example, in this embodiment, the reaction chamber of the furnace tube is defined by slots from top to bottom as slot1-slotn, forming N product placement positions in the furnace tube reaction chamber, where n is the total number of wafers included in the products that can be placed in the furnace tube in a full batch, and the value of n ranges from 1 to 200.

[0070] In step S300, the target product is assigned a task and the operation is performed on the target product.

[0071] Furthermore, based on the provided method for controlling the product placement position in a furnace tube, this invention also provides a control system for the product placement position in a furnace tube. Specifically, the control system includes a division module, a expected position calculation module, and a placement position determination module. For example, in this embodiment, the division module is used to divide the reaction chamber of a furnace tube into N product placement positions and set prohibited placement positions within these positions. The expected position calculation module is used to calculate the expected position of the wafer batch lot with control requirements within the furnace tube, which is included in the target product to be processed, based on a preset control position calculation strategy. The placement position determination module is used to confirm whether the placement position of the target product in the furnace tube meets the process operation requirements based on the expected position of the wafer batch lot with control requirements within the furnace tube and the prohibited placement positions. In this embodiment, the method and control system for controlling the product placement position in a furnace tube are combined to confirm the placement position and prohibited placement positions of the target product, and the system determines whether the placement position and prohibited placement positions overlap. This avoids the serious consequences of products not being placed in the expected position due to manually controlling the order in which the lot enters the furnace tube, resulting in significant product yield loss or even scrapping.

[0072] Based on the above, the present invention also provides a control system for the placement of products in a furnace tube, specifically, which may include: a division module, a expected position calculation module, and a placement position determination module; wherein,

[0073] The division module is specifically used to divide the reaction chamber of a provided furnace tube into N product placement positions, and to set prohibited placement positions in the product placement positions.

[0074] The expected position calculation module is specifically used to calculate the expected position of the wafer batch lot with control requirements contained in the target product to be processed within the furnace tube based on a preset control position calculation strategy.

[0075] The placement position determination module is specifically used to confirm whether the placement position of the target product to be processed in the furnace tube meets the process operation requirements based on the expected position of the wafer batch lot with control requirements in the furnace tube and the prohibited placement position.

[0076] In summary, the present invention proposes a method for controlling the product placement position in a furnace tube. First, the reaction chamber of the furnace tube is divided into N product placement positions, and prohibited placement positions are set among these positions. Next, based on a preset control position calculation strategy, the expected position of the wafer batch lot with control requirements contained in the target product to be processed is calculated within the furnace tube. Finally, based on the expected position of the wafer batch lot with control requirements within the furnace tube and the prohibited placement positions, it is confirmed whether the placement position of the target product to be processed within the furnace tube meets the process operation requirements. This invention employs a precise control system for product placement within the furnace tube to confirm the full batch size of the target product and the preset placement method (top, bottom, or middle) of the target product within the furnace tube's reaction chamber. The system compares the target product's placement within the furnace tube with a pre-defined prohibited placement position based on the chosen placement method. By determining if there is overlap, the system confirms whether the target product's placement meets process requirements. If not, the system adjusts the lot dispatching sequence and re-dispatches the lot until there is no overlap before proceeding with the process. Therefore, the product placement control method and control system provided by this invention effectively solves the problems of current wafer batches with strict control requirements, where the order of lot entry into the furnace tube is manually controlled, and factors such as insufficient wafer count within the lot and different starting positions of the lot placement cause products to be placed in the desired position, resulting in significant yield losses or even scrap.

[0077] Furthermore, embodiments of the present invention also provide an electronic device, including a processor, a communication interface, a memory, and a communication bus, wherein the processor, the communication interface, and the memory communicate with each other via the communication bus.

[0078] Memory, used to store computer programs;

[0079] When the processor executes the program stored in the memory, it implements the method steps of the method for controlling the placement position of products in a furnace tube as described in the embodiments of the present invention.

[0080] In addition, other implementations of the method steps of a method for controlling the placement position of products in a furnace tube by the processor executing a program stored in the memory are the same as those mentioned in the aforementioned method embodiment section, and will not be repeated here.

[0081] The communication bus mentioned in the control terminal above can be a Peripheral Component Interconnect (PCI) bus or an Extended Industry Standard Architecture (EISA) bus, etc. This communication bus can be divided into address bus, data bus, control bus, etc. For ease of illustration, only one thick line is used to represent it in the diagram, but this does not indicate that there is only one bus or one type of bus.

[0082] The communication interface is used for communication between the aforementioned electronic devices and other devices.

[0083] The memory may include random access memory (RAM) or non-volatile memory (NVM), such as at least one disk storage device. Optionally, the memory may also be at least one storage device located remotely from the aforementioned processor.

[0084] The processors mentioned above can be general-purpose processors, including central processing units (CPUs), network processors (NPs), etc.; they can also be digital signal processors (DSPs), application-specific integrated circuits (ASICs), field-programmable gate arrays (FPGAs), or other programmable logic devices, discrete gate or transistor logic devices, or discrete hardware components.

[0085] In another embodiment of the present invention, a computer-readable storage medium is also provided, which stores instructions that, when executed on a computer, cause the computer to perform a method for controlling the placement of products in a furnace tube as described in any of the above embodiments.

[0086] In the above embodiments, implementation can be achieved entirely or partially through software, hardware, firmware, or any combination thereof. When implemented using software, it can be implemented entirely or partially in the form of a computer program product. The computer program product includes one or more computer instructions. When the computer program instructions are loaded and executed on a computer, all or part of the processes or functions described in the embodiments of the present invention are generated. The computer can be a general-purpose computer, a special-purpose computer, a computer network, or other programmable device. The computer instructions can be stored in a computer-readable storage medium or transmitted from one computer-readable storage medium to another. For example, the computer instructions can be transmitted from one website, computer, server, or data center to another website, computer, server, or data center via wired (e.g., coaxial cable, fiber optic, digital subscriber line (DSL)) or wireless (e.g., infrared, wireless, microwave, etc.) means. The computer-readable storage medium can be any available medium that a computer can access or a data storage device such as a server or data center that integrates one or more available media. The available medium can be a magnetic medium (e.g., floppy disk, hard disk, magnetic tape), an optical medium (e.g., DVD), or a semiconductor medium (e.g., solid state disk (SSD)).

[0087] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0088] The various embodiments in this specification are described in a related manner. Similar or identical parts between embodiments can be referred to mutually. Each embodiment focuses on describing the differences from other embodiments. In particular, the embodiments of apparatus, electronic devices, and computer-readable storage media are basically similar to the method embodiments, and therefore the descriptions are relatively simple; relevant parts can be referred to the descriptions of the method embodiments.

[0089] The above description is merely a preferred embodiment of the present invention and is not intended to limit the scope of protection of the present invention. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention are included within the scope of protection of the present invention.

Claims

1. A method for controlling the product placement position in a furnace tube, characterized in that, It should include at least the following steps: A furnace tube is provided, and the reaction chamber of the furnace tube is divided into N product placement positions; Determine whether the multiple wafer batch lots contained in the target product include wafer batch lots with control requirements; if so, set a prohibited placement position in the product placement position. Based on a preset card control position calculation strategy, the expected position of the wafer batch lot with card control requirements contained in the target product to be processed is calculated in the furnace tube. Based on the expected position and the prohibited placement position of the wafer batch lot with control requirements in the furnace tube, confirm whether the placement position of the target product to be processed in the furnace tube meets the process operation requirements. The step of setting prohibited placement locations in the product placement area includes: Obtain the full batch number of wafers of the target product and the preset placement method of the target product, and set prohibited placement positions among the N product placement positions in the furnace tube reaction chamber according to the product requirements of the target product; Based on a preset control position calculation strategy, the step of calculating the expected position of the wafer batch lot with control requirements contained in the target product to be processed within the furnace tube includes: Based on the dispatching order of the target product, the number of wafer batches included, the number of wafers included in each wafer batch, and the preset placement method of the target product, the product placement position of each wafer batch with control requirements in the furnace tube is calculated for each of the multiple wafer batches with control requirements included in the target product. If not included, a message will be displayed indicating successful work assignment, and operations will be performed on the target product.

2. The method for controlling the product placement position in the furnace tube as described in claim 1, characterized in that, The reaction chamber of the furnace tube is defined as slot1-slotn from top to bottom to form N product placement positions in the furnace tube reaction chamber, where n is the total number of wafers included in the products that can be placed in the furnace tube in a full batch operation, and the value of n ranges from 1 to 200.

3. The method for controlling the product placement position in the furnace tube as described in claim 1, characterized in that, The pre-positioning method includes: starting from the top, bottom, or middle position of the reaction chamber of the furnace tube.

4. The method for controlling the product placement position in the furnace tube as described in claim 1, characterized in that, The wafer batches in any of the preset placement methods of the furnace tube are defined as 1 lot, 2 lots, 3 lots, 4 lots, 5 lots, and 6 lots, respectively. The number of wafers of the target product to be processed that can be placed at the placement positions of 1 lot, 2 lots, 3 lots, 4 lots, 5 lots, and 6 lots in the wafer batch are w1, w2, w3, w4, w5, and w6, respectively. The calculation method for determining the position of the lot in the furnace tube based on the preset placement method is that the sum of w1 to w6 is ≤ n.

5. The method for controlling the product placement position in the furnace tube as described in claim 1, characterized in that, The steps for confirming whether the placement of the target product to be processed in the furnace tube meets the process requirements include: The expected position of the wafer batch lot with control requirements in the furnace tube is compared with the set prohibited placement position. If the two overlap, it is determined that the placement position of the target product to be processed in the furnace tube does not meet the process operation requirements.

6. The method for controlling the product placement position in the furnace tube as described in claim 5, characterized in that, After determining whether the placement of the target product to be processed in the furnace tube meets the process requirements, the control method further includes: An early warning is issued to indicate that dispatching has failed, and the dispatching order of the target product is adjusted. Then, the process returns to the step of calculating the product placement position of the wafer batches with control requirements in the furnace tube based on the dispatching order of the target product, the number of wafer batches lot, the number of wafers contained in each wafer batch lot, and the preset placement method of the target product.

7. A control system for the placement of products in a furnace tube, characterized in that, include: The partitioning module is used to divide the reaction chamber of a provided furnace tube into N product placement positions and set prohibited placement positions in the product placement positions. The expected position calculation module is used to calculate the expected position of the wafer batch lot with control requirements contained in the target product to be processed within the furnace tube based on a preset control position calculation strategy. The placement position determination module is used to determine whether the placement position of the target product to be processed in the furnace tube meets the process operation requirements based on the expected position of the wafer batch lot with control requirements in the furnace tube and the prohibited placement position. The module division is specifically used for: If it is determined that among the multiple wafer batches included in the target product, there are wafer batches with control requirements, then the number of full batch wafers of the target product and the preset placement method of the target product are obtained, and according to the product requirements of the target product, prohibited placement positions are set among the N product placement positions in the furnace tube reaction chamber. The expected location calculation module is specifically used for: Based on the dispatching sequence of the target product, the number of wafer batches / lots included, the number of wafers contained in each wafer batch / lot, and the preset placement method of the target product, the product placement position of each wafer batch / lot with control requirements in the furnace tube is calculated for each of the multiple wafer batches / lots with control requirements included in the target product.

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