A thin-surface copper HDI pulse-filled blind via system
By alternating between high-pressure and low-pressure spray devices, the problems of low CuO generation efficiency in blind holes of HDI boards and uneven copper plating thickness on the outer surface were solved. This achieved sufficient CuO deposition in blind holes and reduced copper plating thickness on the outer surface, thereby improving copper filling efficiency and reducing costs.
CN116209177BActive Publication Date: 2026-05-26ZHUHAI CUIHE ELECTRONIC TECHNOLOGY CO LTD
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- ZHUHAI CUIHE ELECTRONIC TECHNOLOGY CO LTD
- Filing Date
- 2022-09-05
- Publication Date
- 2026-05-26
Smart Images
Figure CN116209177B_ABST
Abstract
This invention provides an HDI pulse-filled blind via system for thin-surface copper, comprising an electroplating tank, a chemical chamber, a ferric ion reduction device, a high-pressure spray device, and a low-pressure spray device. The ferric ion reduction device is connected to the high-pressure spray device. The outputs of both the high-pressure and low-pressure spray devices are located within the electroplating tank, and their inputs are connected to the chemical chamber. Through the coordinated operation of the high-pressure spray device and the ferric ion reduction device, the Cu... 0 It can fully deposit within blind vias and form a metal lattice under the action of a light-reflecting agent, improving the quality and efficiency of copper filling in blind vias. A low-pressure spraying device is used to... 0 Reducing the deposition thickness on the outer surface of a high-density interconnect board, i.e., reducing the copper plating thickness on that outer surface, not only saves on copper consumption costs but also greatly improves the yield of subsequent processes.
Need to check novelty before this filing date? Find Prior Art