Display substrate, manufacturing method thereof and display device

Abstract

A display substrate, a manufacturing method thereof and a display device. The display substrate comprises a substrate, a plurality of sub-pixels and a pixel partition structure on the substrate; the pixel partition structure is located between adjacent sub-pixels, at least one of a plurality of sub-function film layers in a light-emitting function layer is disconnected at a position where the pixel partition structure is located; the pixel partition structure comprises a first sub-pixel partition portion, a second sub-pixel partition portion and a third sub-pixel partition portion which are stacked in a direction perpendicular to the substrate; the second sub-pixel partition portion comprises a plurality of sub-partition layers which are stacked in the direction perpendicular to the substrate; the first sub-pixel partition portion has a first protruding portion which exceeds at least one sub-partition layer in an arrangement direction of adjacent two sub-pixels; and the third sub-pixel partition portion has a second protruding portion which exceeds at least one sub-partition layer in the arrangement direction of adjacent two sub-pixels. Thus, the display substrate can avoid crosstalk between adjacent sub-pixels.

Description

Technical Field

[0001] This disclosure relates to a display substrate, a method for manufacturing the same, and a display device. Background Technology

[0002] With the continuous development of display technology, organic light-emitting diode (OLED) display devices have become a research hotspot and technological development direction for major manufacturers due to their advantages such as wide color gamut, high contrast, thin and light design, self-illumination, and wide viewing angle.

[0003] Currently, organic light-emitting diode (OLED) displays are widely used in various electronic products, from small items like smart bracelets, smartwatches, smartphones, and tablets to large devices such as laptops, desktop computers, and televisions. Consequently, the market demand for active-matrix OLED displays is increasingly strong. Summary of the Invention

[0004] This disclosure provides a display substrate, a method for manufacturing the same, and a display device. The display substrate can prevent crosstalk between adjacent sub-pixels caused by a layer with higher conductivity among the multiple sub-functional layers by setting a partition structure between adjacent sub-pixels and ensuring that at least one of the multiple sub-functional film layers in the light-emitting functional layer is disconnected at the location of the pixel partition structure.

[0005] At least one embodiment of this disclosure provides a display substrate, comprising: a substrate; a plurality of sub-pixels located on the substrate, each sub-pixel including a light-emitting element, the light-emitting element including a light-emitting functional layer and a first electrode and a second electrode located on both sides of the light-emitting functional layer, the first electrode being located between the light-emitting functional layer and the substrate, the light-emitting functional layer including a plurality of sub-functional film layers; and a pixel separation structure located between adjacent sub-pixels, at least one of the plurality of sub-functional film layers in the light-emitting functional layer being disconnected at the location of the pixel separation structure, the pixel separation structure including a first electrode layer stacked along a direction perpendicular to the substrate. The sub-pixel partition includes a second sub-pixel partition and a third sub-pixel partition. The second sub-pixel partition is located on the side of the first sub-pixel partition away from the substrate. The third sub-pixel partition is located on the side of the second sub-pixel partition away from the first sub-pixel partition. The second sub-pixel partition includes a plurality of sub-partition layers stacked along a direction perpendicular to the substrate. The first sub-pixel partition has a first protrusion extending beyond at least one sub-partition layer in the arrangement direction of two adjacent sub-pixels. The third sub-pixel partition has a second protrusion extending beyond at least one sub-partition layer in the arrangement direction of two adjacent sub-pixels.

[0006] For example, in a display substrate provided in an embodiment of this disclosure, the orthographic projection of at least one of the sub-isolation layers on the substrate falls within the orthographic projections of the first sub-pixel isolation portion and the third sub-pixel isolation portion on the substrate.

[0007] For example, in a display substrate provided in an embodiment of this disclosure, the orthographic projection of the second sub-pixel partition portion on the substrate falls within the orthographic projections of the first sub-pixel partition portion and the third sub-pixel partition portion on the substrate.

[0008] For example, in a display substrate provided in an embodiment of this disclosure, the plurality of sub-separation layers of the second sub-pixel separation portion include a first sub-separation layer, a second sub-separation layer, and a third sub-separation layer stacked along a direction perpendicular to the substrate, wherein the orthographic projection of the second sub-separation layer on the substrate falls within the orthographic projections of the first sub-separation layer and the third sub-separation layer on the substrate, respectively.

[0009] For example, in a display substrate provided in one embodiment of this disclosure, the plurality of sub-functional layers include a charge generation layer and a first light-emitting layer and a second light-emitting layer located on both sides of the charge generation layer, wherein the charge generation layer is disconnected at the location of the pixel isolation structure.

[0010] For example, in a display substrate provided in an embodiment of this disclosure, in the arrangement direction of two adjacent sub-pixels, the average size of the second sub-pixel partition is smaller than the average size of the first sub-pixel partition and the average size of the third sub-pixel partition.

[0011] For example, in a display substrate provided in one embodiment of this disclosure, the material of the third sub-pixel partition includes a first metal, and the material of the second sub-pixel partition includes a second metal.

[0012] For example, in a display substrate provided in one embodiment of this disclosure, the material of the first sub-pixel partition includes the first metal, the first metal being titanium, and the second metal being aluminum.

[0013] For example, in a display substrate provided in one embodiment of this disclosure, the materials of the first sub-pixel partition and the third sub-pixel partition include a first inorganic non-metallic material, and the material of the second sub-pixel partition includes a second inorganic non-metallic material.

[0014] For example, in a display substrate provided in one embodiment of this disclosure, the first inorganic non-metallic material includes silicon oxide, and the second inorganic non-metallic material includes silicon nitride.

[0015] For example, in a display substrate provided in one embodiment of this disclosure, a plurality of pixel separation structures are provided between two adjacent sub-pixels.

[0016] For example, a display substrate provided in one embodiment of this disclosure further includes: a pixel defining layer located on the substrate, the pixel defining layer being partially located on the side of the first electrode away from the substrate, the pixel defining layer including a plurality of pixel openings, the plurality of pixel openings corresponding one-to-one with the plurality of sub-pixels to define the light-emitting areas of the plurality of sub-pixels, the pixel openings being configured to expose the first electrode, and the pixel blocking structure being located between adjacent pixel openings and on the side of the pixel defining layer away from the substrate.

[0017] For example, a display substrate provided in one embodiment of this disclosure further includes: a pixel defining layer located on the substrate, the pixel defining layer being partially located on the side of the first electrode away from the substrate, the pixel defining layer including a plurality of pixel openings and pixel spacing openings, the plurality of pixel openings corresponding one-to-one with the plurality of sub-pixels to define the light-emitting areas of the plurality of sub-pixels, the pixel openings being configured to expose the first electrode, the pixel spacing openings being located between adjacent first electrodes, and the pixel separation structure being at least partially located within the pixel spacing openings.

[0018] For example, a display substrate provided in one embodiment of this disclosure further includes: a planarization layer located between the substrate and the first electrode, wherein the pixel isolation structure is in direct contact with the planarization layer.

[0019] For example, a display substrate provided in one embodiment of this disclosure further includes: a planarization layer located between the substrate and the first electrode; and a protective structure located on the planarization layer and disposed in the same layer as the first electrode, wherein the pixel isolation structure is located on the side of the conductive structure away from the substrate and is in direct contact with the protective structure.

[0020] For example, a display substrate provided in one embodiment of this disclosure further includes: a pixel defining layer located on the substrate, the pixel defining layer being partially located on the side of the first electrode away from the substrate, the pixel defining layer including a plurality of pixel openings, the plurality of pixel openings corresponding one-to-one with the plurality of sub-pixels to define the light-emitting areas of the plurality of sub-pixels, the pixel openings being configured to expose the first electrode, and the pixel blocking structure being at least partially located in the pixel openings.

[0021] For example, in a display substrate provided in an embodiment of this disclosure, the pixel isolation structure is located at the edge of the first electrode, the surface of the pixel isolation structure away from the substrate is at least partially covered by the material of the first electrode, and the orthographic projection of the pixel isolation structure on the substrate at least partially overlaps with the orthographic projection of the pixel defining layer on the substrate.

[0022] For example, in a display substrate provided in an embodiment of this disclosure, the substrate includes a display area and a peripheral area surrounding the display area. The display area includes an opening area, and an opening partition structure is provided at the edge of the opening area. The cross-sectional structure of the opening partition structure is the same as the cross-sectional structure of the pixel partition structure, and the material of the opening partition structure is the same as the material of the pixel partition structure.

[0023] For example, in a display substrate provided in one embodiment of this disclosure, the second electrode is disconnected at the location of the partition structure.

[0024] At least one embodiment of this disclosure also provides a display device comprising the display substrate described in any of the preceding claims.

[0025] At least one embodiment of this disclosure also provides a method for manufacturing a display substrate, comprising: forming a plurality of first electrodes on a substrate; forming a pixel partition structure on the substrate; forming a light-emitting functional layer on the side of the pixel partition structure and the plurality of first electrodes away from the substrate, the light-emitting functional layer including a plurality of sub-functional layers; and forming a second electrode on the side of the light-emitting functional layer away from the substrate, the second electrode, the light-emitting functional layer, and the plurality of first electrodes forming a light-emitting element of a plurality of sub-pixels, the pixel spacer structure being located between adjacent sub-pixels, the pixel partition structure including a first sub-pixel partition portion and a second sub-pixel partition portion stacked thereon. The first sub-pixel partition has two sub-pixel partitions and a third sub-pixel partition. The second sub-pixel partition is located on the side of the first sub-pixel partition away from the substrate. The third sub-pixel partition is located on the side of the second sub-pixel partition away from the first sub-pixel partition. The second sub-pixel partition includes a plurality of sub-partition layers stacked in a direction perpendicular to the substrate. The first sub-pixel partition has a first protrusion extending beyond at least one sub-partition layer in the arrangement direction of two adjacent sub-pixels. The third sub-pixel partition has a second protrusion extending beyond at least one sub-partition layer in the arrangement direction of two adjacent sub-pixels.

[0026] For example, in a method for manufacturing a display substrate provided in an embodiment of this disclosure, the orthographic projection of at least one of the sub-isolation layers on the substrate falls within the orthographic projections of the first sub-pixel isolation portion and the third sub-pixel isolation portion on the substrate.

[0027] For example, in a method for manufacturing a display substrate provided in an embodiment of this disclosure, the orthographic projection of the second sub-pixel partition portion on the substrate falls within the orthographic projections of the first sub-pixel partition portion and the third sub-pixel partition portion on the substrate.

[0028] For example, in a method for manufacturing a display substrate provided in an embodiment of this disclosure, the plurality of sub-separation layers of the second sub-pixel separation portion includes a first sub-separation layer, a second sub-separation layer, and a third sub-separation layer stacked along a direction perpendicular to the substrate. The orthographic projection of the second sub-separation layer on the substrate falls within the orthographic projections of the first sub-separation layer and the third sub-separation layer on the substrate, respectively.

[0029] For example, in a method for manufacturing a display substrate provided in an embodiment of this disclosure, forming a partition structure on the substrate includes: before forming the plurality of first electrodes on the substrate, forming a stacked structure on the substrate, the stacked structure including a first sub-layer, a second sub-layer, and a third sub-layer stacked thereon; and etching the stacked structure to remove a portion of the second sub-layer, so that the stacked structure forms the pixel partition structure, the first sub-layer forming a first sub-pixel partition portion, the second sub-layer forming a second sub-pixel partition portion, and the third sub-layer forming a third sub-pixel partition portion.

[0030] For example, a method for manufacturing a display substrate provided in one embodiment of this disclosure further includes: before forming the plurality of first electrodes on the substrate, forming a stacked structure on the substrate, the stacked structure including a first sub-layer, a second sub-layer, and a third sub-layer stacked thereon; after forming the plurality of first electrodes on the substrate, forming a pixel defining layer on the stacked structure and the side of the first electrodes away from the substrate; patterning the pixel defining layer to form a plurality of pixel openings and pixel spacing openings on the pixel defining layer; and etching the stacked structure to remove a portion of the second sub-layer, such that the stacked structure forms the pixel separation structure, the first sub-layer forms a first sub-pixel separation portion, the second sub-layer forms a second sub-pixel separation portion, the third sub-layer forms a third sub-pixel separation portion, the plurality of pixel openings are correspondingly disposed with respect to the plurality of first electrodes and configured to expose the plurality of first electrodes, the pixel spacing openings are located between adjacent first electrodes, and the stacked structure is at least partially located within the pixel spacing openings.

[0031] For example, a method for manufacturing a display substrate provided in one embodiment of this disclosure further includes: before forming the plurality of first electrodes on the substrate, forming a stacked structure on the substrate, the stacked structure including a first sub-layer, a second sub-layer, and a third sub-layer stacked thereon; etching the stacked structure to remove a portion of the second sub-layer, so that the stacked structure forms the pixel isolation structure, the first sub-layer forming a first sub-pixel isolation portion, the second sub-layer forming a second sub-pixel isolation portion, and the third sub-layer forming a third sub-pixel isolation portion; after forming the plurality of first electrodes on the substrate, forming a pixel defining layer on the side of the stacked structure and the first electrodes away from the substrate; and patterning the pixel defining layer to form a plurality of pixel openings on the pixel defining layer, the plurality of pixel openings being disposed corresponding to the plurality of first electrodes and configured to expose the plurality of first electrodes, the pixel isolation structure being at least partially located in the pixel openings. Attached Figure Description

[0032] To more clearly illustrate the technical solutions of the embodiments of this disclosure, the accompanying drawings of the embodiments will be briefly described below. Obviously, the drawings described below only relate to some embodiments of this disclosure and are not intended to limit this disclosure.

[0033] Figure 1 This is a plan view of a display substrate provided according to an embodiment of the present disclosure;

[0034] Figure 2 A display substrate provided in one embodiment of this disclosure is along Figure 1 Schematic diagram of the cross section of the GH line;

[0035] Figure 3 This is a schematic diagram of a pixel separation structure in a display substrate provided in an embodiment of the present disclosure;

[0036] Figure 4 This is a schematic diagram of the structure of the light-emitting functional layer of a sub-pixel in a display substrate according to an embodiment of the present disclosure;

[0037] Figure 5 A cross-sectional schematic diagram of a display substrate provided in an embodiment of this disclosure;

[0038] Figure 6 A cross-sectional schematic diagram of another display substrate provided in an embodiment of this disclosure;

[0039] Figure 7 A cross-sectional schematic diagram of another display substrate provided in an embodiment of this disclosure;

[0040] Figure 8 A cross-sectional schematic diagram of another display substrate provided in an embodiment of this disclosure.

[0041] Figure 9 This is a plan view of a display substrate provided according to an embodiment of the present disclosure;

[0042] Figure 10 This is a schematic diagram of a display device provided according to an embodiment of the present disclosure;

[0043] Figures 11A-11F This is a schematic diagram illustrating the steps of providing a display substrate according to an embodiment of the present disclosure;

[0044] Figures 12A-12D This is a schematic diagram illustrating the steps of another display substrate provided in an embodiment of the present disclosure;

[0045] Figures 13A-13F This is a schematic diagram illustrating the steps of another display substrate provided in an embodiment of the present disclosure;

[0046] Figures 14A-14D This is a schematic diagram illustrating the steps of another display substrate provided in an embodiment of the present disclosure;

[0047] Figure 15 This is a schematic diagram of the structure of another display substrate provided in an embodiment of the present disclosure;

[0048] Figure 16 This is a partial cross-sectional structural schematic diagram of a display substrate provided according to another example of an embodiment of the present disclosure;

[0049] Figure 17A This is a partial cross-sectional structural schematic diagram of a display substrate provided according to another example of an embodiment of the present disclosure;

[0050] Figure 17B This is a partial cross-sectional structural schematic diagram of a display substrate provided according to another example of an embodiment of the present disclosure;

[0051] Figures 18A to 18D To form Figure 15 A schematic diagram of the manufacturing process of the display substrate preceding the display substrate shown.

[0052] Figure 19 A partial cross-sectional structural schematic diagram of a display substrate provided according to another example of an embodiment of this disclosure; and

[0053] Figures 20A to 20D To form Figure 19 A schematic diagram of the manufacturing process of the display substrate preceding the display substrate shown.

[0054] Figure 21 This is a partial cross-sectional structural schematic diagram of a display substrate provided according to another example of an embodiment of the present disclosure;

[0055] Figure 22This is a schematic diagram of the structure of another display substrate provided in an embodiment of the present disclosure;

[0056] Figure 23 This is a schematic diagram of the structure of another display substrate provided in an embodiment of the present disclosure;

[0057] Figure 24 This is a schematic diagram of the structure of another display substrate provided in an embodiment of the present disclosure;

[0058] Figure 25 This is a schematic diagram of the structure of another display substrate provided in an embodiment of the present disclosure;

[0059] Figures 26A-26C A schematic diagram illustrating the steps of another method for manufacturing a display substrate according to an embodiment of this disclosure;

[0060] Figure 27 This is a schematic diagram of the structure of another display substrate provided in an embodiment of the present disclosure;

[0061] Figures 28A-28D A schematic diagram illustrating the steps of another method for manufacturing a display substrate according to an embodiment of this disclosure;

[0062] Figure 29 This is a partial planar schematic diagram of a display substrate provided in an embodiment of the present disclosure;

[0063] Figure 30 This is a partial planar schematic diagram of a display substrate provided in an embodiment of the present disclosure;

[0064] Figure 31 This is a partial planar schematic diagram of a display substrate provided in an embodiment of the present disclosure;

[0065] Figure 32 This is a partial planar schematic diagram of a display substrate provided in an embodiment of the present disclosure;

[0066] Figure 33 This is a partial planar schematic diagram of a display substrate provided in an embodiment of the present disclosure;

[0067] Figure 34 This is a partial planar schematic diagram of a display substrate provided in an embodiment of the present disclosure;

[0068] Figure 35 This is a partial planar schematic diagram of a display substrate provided in an embodiment of the present disclosure;

[0069] Figure 36 This is a partial planar schematic diagram of a display substrate provided in an embodiment of the present disclosure;

[0070] Figure 37This is a partial planar schematic diagram of a display substrate provided in an embodiment of the present disclosure;

[0071] Figure 38 This is a partial planar schematic diagram of a display substrate provided in an embodiment of the present disclosure;

[0072] Figure 39 This is a plan view of a display substrate provided according to an embodiment of the present disclosure;

[0073] Figure 40 A display substrate provided in one embodiment of this disclosure is along Figure 39 A cross-sectional view along the AB direction;

[0074] Figure 41 A plan view of another display substrate provided in an embodiment of this disclosure;

[0075] Figure 42 A plan view of another display substrate provided in an embodiment of this disclosure;

[0076] Figure 43 A display substrate provided in one embodiment of this disclosure is along Figure 42 A cross-sectional view along the CD direction;

[0077] Figure 44 A plan view of another display substrate provided in an embodiment of this disclosure;

[0078] Figure 45 A plan view of another display substrate provided in an embodiment of this disclosure;

[0079] Figure 46 A plan view of another display substrate provided in an embodiment of this disclosure;

[0080] Figure 47 A plan view of another display substrate provided in an embodiment of this disclosure;

[0081] Figure 48 A plan view of another display substrate provided in an embodiment of this disclosure;

[0082] Figure 49 A plan view of another display substrate provided in an embodiment of this disclosure;

[0083] Figure 50 A plan view of another display substrate provided in an embodiment of this disclosure;

[0084] Figure 51 This is a partial cross-sectional schematic diagram of a display substrate provided in an embodiment of the present disclosure;

[0085] Figure 52This is a schematic diagram of a display device provided according to an embodiment of the present disclosure;

[0086] Figure 53 A plan view of another display substrate provided in an embodiment of this disclosure;

[0087] Figure 54 A display substrate provided in one embodiment of this disclosure is along Figure 53 Schematic diagram of the cross section of the EF line;

[0088] Figure 55A This is a partial cross-sectional schematic diagram of another display substrate provided in an embodiment of the present disclosure;

[0089] Figure 55B A cross-sectional electron microscope image of a display substrate provided in an embodiment of this disclosure; and

[0090] Figure 56 This is a schematic diagram of a display device provided according to an embodiment of the present disclosure. Detailed Implementation

[0091] To make the objectives, technical solutions, and advantages of the embodiments of this disclosure clearer, the technical solutions of the embodiments of this disclosure will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this disclosure. Based on the described embodiments of this disclosure, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this disclosure.

[0092] Unless otherwise defined, the technical or scientific terms used in this disclosure shall have the ordinary meaning understood by one of ordinary skill in the art to which this disclosure pertains. The terms “first,” “second,” and similar terms used in this disclosure do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Terms such as “comprising” or “including” mean that an element or object preceding the word encompasses the elements or objects listed following the word and their equivalents, without excluding other elements or objects.

[0093] The features such as "parallel," "perpendicular," and "identical" used in the embodiments of this disclosure include features in the strict sense of "parallel," "perpendicular," and "identical," as well as cases where "approximately parallel," "approximately perpendicular," and "approximately identical" include certain errors. Considering measurement and errors associated with the measurement of a specific quantity (e.g., limitations of the measurement system), they represent the acceptable deviation range for a specific value as determined by a person skilled in the art. For example, "approximately" can mean within one or more standard deviations, or within 10% or 5% of said value. Unless otherwise specified in the following embodiments of this disclosure, the quantity of a component is implied to mean that the component can be one or more, or can be understood as at least one. "At least one" means one or more, and "more" means at least two. In the embodiments of this disclosure, "same layer" refers to the relationship between multiple film layers formed from the same material after undergoing the same step (e.g., a patterning process). Here, "same layer" does not always mean that multiple film layers have the same thickness or that multiple film layers have the same height in a cross-sectional view.

[0094] With the continuous development of display technology, people's pursuit of display quality is also increasing. To further reduce power consumption and achieve high brightness, the single-layer light-emitting element in an OLED can be replaced with two layers, and a charge generation layer (CGL) can be added between the two layers to achieve a tandem EL design. Since a display device using a tandem EL design has two light-emitting layers, its brightness is approximately twice that of a single-layer design. Therefore, display devices using a tandem EL design have advantages such as long lifespan, low power consumption, and high brightness.

[0095] However, the inventors of this application have noticed that for high-resolution products, since the charge generation layer has strong conductivity and the light-emitting functional layers (here referring to the film layer including two light-emitting layers and the charge generation layer) of adjacent sub-pixels are connected, the charge generation layer is prone to crosstalk between adjacent sub-pixels, which seriously affects the display quality.

[0096] In this regard, the present disclosure provides a display substrate, a method for manufacturing the same, and a display device. The display substrate includes a substrate, a plurality of sub-pixels located on the substrate, and a pixel separation structure. Each sub-pixel includes a light-emitting element, which includes a light-emitting functional layer and a first electrode and a second electrode located on opposite sides of the light-emitting functional layer. The first electrode is located between the light-emitting functional layer and the substrate. The light-emitting functional layer includes a plurality of sub-functional film layers. The pixel separation structure is located between adjacent sub-pixels. At least one of the plurality of sub-functional film layers in the light-emitting functional layer is broken at the location of the pixel separation structure. The pixel separation structure includes a first sub-pixel separator stacked along a direction perpendicular to the substrate. The display substrate comprises a first sub-pixel partition, a second sub-pixel partition, and a third sub-pixel partition. The second sub-pixel partition is located on the side of the first sub-pixel partition away from the substrate, and the third sub-pixel partition is located on the side of the second sub-pixel partition away from the first sub-pixel partition. The second sub-pixel partition includes multiple sub-partition layers stacked along a direction perpendicular to the substrate. The first sub-pixel partition has a first protrusion extending beyond at least one sub-partition layer in the arrangement direction of two adjacent sub-pixels, and the third sub-pixel partition has a second protrusion extending beyond at least one sub-partition layer in the arrangement direction of two adjacent sub-pixels. Therefore, by providing partition structures between adjacent sub-pixels, and causing at least one of the multiple sub-functional films in the light-emitting functional layer to be disconnected at the location of the pixel partition structure, the display substrate avoids crosstalk between adjacent sub-pixels caused by films with higher conductivity among the multiple sub-functional films.

[0097] The display substrate, its manufacturing method, and the display device provided in the embodiments of this disclosure will now be described in detail with reference to the accompanying drawings.

[0098] At least one embodiment of this disclosure provides a display substrate. Figure 1 This is a plan view of a display substrate provided according to an embodiment of the present disclosure; Figure 2 A display substrate provided in one embodiment of this disclosure is along Figure 1 Schematic diagram of the cross section of the GH line; Figure 3 This is a schematic diagram of a pixel separation structure in a display substrate according to an embodiment of the present disclosure. It should be noted that... Figure 1 The entire display substrate is not shown; only a portion of the display substrate is shown. Figure 2 Not all the layer structures in the display substrate are shown; for the layer structures not shown, please refer to the prior art.

[0099] like Figure 1 and Figure 2As shown, the display substrate 100 includes a substrate 110 and a plurality of sub-pixels 200. The plurality of sub-pixels 200 are located on the substrate 110, and each sub-pixel 200 includes a light-emitting element 210. Each light-emitting element 210 includes a light-emitting functional layer 120 and a first electrode 131 and a second electrode 132 located on both sides of the light-emitting functional layer 120. The first electrode 131 is located between the light-emitting functional layer 120 and the substrate 110. The second electrode 132 is at least partially located on the side of the light-emitting functional layer 120 away from the first electrode 131; that is, the first electrode 131 and the second electrode 132 are located on opposite sides in a direction perpendicular to the light-emitting functional layer 120. The light-emitting functional layer 120 includes a plurality of sub-functional layers 1200. It should be noted that the aforementioned light-emitting functional layer does not only include the film layer that directly emits light, but also includes functional film layers for assisting light emission, such as hole transport layers and electron transport layers.

[0100] For example, the first electrode 131 can be the anode, and the second electrode 132 can be the cathode; multiple sub-pixels 200 can share the second electrode 132. For example, the cathode can be formed of a material with high conductivity and low work function; for example, the cathode can be made of a metallic material. For example, the anode can be formed of a transparent conductive material with a high work function.

[0101] like Figure 1 and Figure 2 As shown, the display substrate 100 further includes a pixel partition structure 140, which is located on the substrate 110 and between adjacent sub-pixels 200; at least one of the plurality of sub-functional film layers 1200 in the light-emitting functional layer 120 is disconnected at the location of the pixel partition structure 140. The pixel partition structure 140 includes a first sub-pixel partition portion 1401, a second sub-pixel partition portion 1402, and a third sub-pixel partition portion 1403 stacked along a direction perpendicular to the substrate 110. The second sub-pixel partition portion 1402 is located on the side of the first sub-pixel partition portion 1401 away from the substrate 110, and the third sub-pixel partition portion 1403 is located on the side of the second sub-pixel partition portion 1402 away from the first sub-pixel partition portion 1401.

[0102] like Figure 2 and Figure 3As shown, the second sub-pixel partition 1402 includes a plurality of sub-partition layers 14020 stacked along a direction perpendicular to the substrate. The first sub-pixel partition 1401 has a first protrusion 411 extending beyond the at least one sub-partition layer 14020 in the arrangement direction of two adjacent sub-pixels 200. The third sub-pixel partition 1403 has a second protrusion 412 extending beyond the at least one sub-partition layer 14020 in the arrangement direction of two adjacent sub-pixels 200. It should be noted that the above-mentioned arrangement direction may be the extension direction of the brightness center of adjacent sub-pixels; the brightness center of each sub-pixel may be the geometric center of the effective light-emitting area of ​​that sub-pixel. Of course, the embodiments of this disclosure include, but are not limited to, the brightness center of each sub-pixel may also be the location of the maximum light-emitting brightness of that sub-pixel. In addition, the aforementioned sub-separation layer may not be an actual layer structure, but rather a number of sub-parts with different sizes in the direction perpendicular to the substrate due to factors such as manufacturing process. In this case, in order to better describe the relationship between the second sub-pixel separation part and other sub-pixel separation parts, the aforementioned number of sub-parts with different sizes are divided into a number of sub-separation layers stacked in the direction perpendicular to the substrate.

[0103] In the display substrate provided in this embodiment, since the first sub-pixel partition has a first protrusion extending beyond at least one sub-partition layer in the arrangement direction of two adjacent sub-pixels, and the third sub-pixel partition has a second protrusion extending beyond at least one sub-partition layer in the arrangement direction of two adjacent sub-pixels, the pixel partition structure forms a concave structure on the side surface in the arrangement direction of two adjacent sub-pixels. This allows at least one sub-functional layer in the light-emitting functional layer subsequently formed on the pixel partition structure to be disconnected. Therefore, by providing the aforementioned pixel partition structure between adjacent sub-pixels, the display substrate can avoid crosstalk between adjacent sub-pixels caused by highly conductive sub-functional layers in the light-emitting functional layer.

[0104] On the other hand, because this display substrate can avoid crosstalk between adjacent sub-pixels through a pixel separation structure, it can increase pixel density while employing a dual-layer tandem EL design. Therefore, this display substrate has advantages such as long lifespan, low power consumption, high brightness, and high resolution.

[0105] In some examples, the term "adjacent subpixels" refers to two subpixels that are not separated by any other subpixels.

[0106] In some examples, such as Figure 2 and Figure 3 As shown, in the arrangement direction of two adjacent sub-pixels 200, the average size of the second sub-pixel partition 1402 is smaller than the average size of the first sub-pixel partition 1401 and the average size of the third sub-pixel partition 1403.

[0107] In some examples, such as Figure 2 and Figure 3 As shown, the orthographic projection of at least one sub-blocking layer 14020 on the substrate 110 falls within the orthographic projections of the first sub-pixel blocking portion 1401 and the third sub-pixel blocking portion 1403 on the substrate 110, respectively. Therefore, the pixel blocking structure forms a concave structure on the side surface in the arrangement direction of two adjacent sub-pixels, thereby allowing at least one sub-functional layer in the light-emitting functional layer subsequently formed on the pixel blocking structure to be disconnected.

[0108] In some examples, such as Figure 2 and Figure 3 As shown, the orthographic projection of the second sub-pixel partition 1402 on the substrate 110 falls within the orthographic projections of the first sub-pixel partition 1401 and the third sub-pixel partition 1403 on the substrate 110. Therefore, the entire second sub-pixel partition is concave inward relative to the first and third sub-pixel partitions. Consequently, the pixel partition structure forms a concave structure on the side of the adjacent sub-pixels in the arrangement direction, thereby allowing at least one sub-functional layer in the light-emitting functional layer subsequently formed on the pixel partition structure to be disconnected.

[0109] In some examples, such as Figure 2 and Figure 3 As shown, the second sub-pixel partition 1402 includes a plurality of sub-partition layers 14020, namely a first sub-partition layer 1402A, a second sub-partition layer 1402B, and a third sub-partition layer 1402C, which are stacked along a direction perpendicular to the substrate 110. The orthographic projection of the second sub-partition layer 1402B onto the substrate 110 falls within the orthographic projections of the first sub-partition layer 1402A and the third sub-partition layer 1402C onto the substrate 110. Therefore, the second sub-pixel partition also forms a concave structure on the side surface in the arrangement direction of adjacent sub-pixels.

[0110] In some examples, such as Figure 2 and Figure 3 As shown, the second sub-pixel partition 1402 has a concave side surface on the side surface in the arrangement direction of two adjacent sub-pixels.

[0111] In some examples, such as Figure 1 and Figure 2 As shown, the second electrode 132 is disconnected at the location of the pixel partition structure 140. However, embodiments of this disclosure include, but are not limited to, the second electrode is not disconnected at the location of the pixel partition structure. The disconnection or continuity of the second electrode at the location of the pixel partition structure can be determined by the height, depth, or other parameters of the pixel partition structure.

[0112] In some examples, such as Figure 2 As shown, the multiple sub-functional layers 1200 of the light-emitting functional layer 120 include a charge generation layer 129 and a first light-emitting layer 121 and a second light-emitting layer 122 on both sides in a direction perpendicular to the substrate 110; the charge generation layer 129 is disconnected at the location of the pixel isolation structure. Because the charge generation layer is disconnected at the location of the pixel isolation structure, by providing the aforementioned pixel isolation structure between adjacent sub-pixels, the display substrate can avoid crosstalk between adjacent sub-pixels caused by the highly conductive charge generation layer in the light-emitting functional layer. Furthermore, this display substrate can realize a tandem EL design, thus having advantages such as long lifespan, low power consumption, and high brightness. It should be noted that the charge generation layer is configured to generate, transport, and inject charge carriers.

[0113] In some examples, such as Figure 2 As shown, the first light-emitting layer 121 and the second light-emitting layer 122 in the light-emitting functional layer 120 are also disconnected at the location of the partition structure 140. However, embodiments of this disclosure include, but are not limited to, the first light-emitting layer and the second light-emitting layer in the light-emitting functional layer may not be disconnected at the location of the partition structure, but only the charge generation layer is disconnected at the location of the partition structure.

[0114] In some examples, the conductivity of the charge generation layer 129 is greater than that of the first light-emitting layer 121 and the second light-emitting layer 122, but less than that of the second electrode 132.

[0115] In some examples, such as Figure 2 As shown, the first light-emitting layer 121 is located on the side of the charge-generating layer 129 closest to the substrate 110; the second light-emitting layer 122 is located on the side of the charge-generating layer 129 furthest from the substrate 110. It should be noted that the light-emitting functional layer may also include other sub-functional layers besides the charge-generating layer, the first light-emitting layer, and the second light-emitting layer, such as a hole injection layer, a hole transport layer, an electron injection layer, and an electron transport layer.

[0116] In some examples, such as Figure 1 and Figure 2 As shown, the line connecting the brightness centers of two adjacent sub-pixels 200 passes through the pixel isolation structure 140. Because the charge generation layer has a smaller dimension and lower resistance in the direction of this line's extension, charge can easily transfer from one of the two adjacent sub-pixels through the charge generation layer along the extension direction of the line to the other. Therefore, by having the line connecting the brightness centers of two adjacent sub-pixels pass through the isolation structure, the display substrate effectively blocks the shortest path of charge propagation, thereby effectively avoiding crosstalk between adjacent sub-pixels.

[0117] In some examples, the material of the third sub-pixel partition 1403 includes a first metal, and the material of the second sub-pixel partition 1402 includes a second metal. Therefore, by utilizing the selectivity of the etching process, an etchant can be selected that etches only the second metal and not the first metal, resulting in the third sub-pixel partition having a second protrusion extending beyond at least one sub-partition layer in the arrangement direction of adjacent sub-pixels. It should be noted that because the sides of the second sub-pixel partition are etched to different degrees, multiple sub-partition layers of different sizes are formed.

[0118] In some examples, the material of the first sub-pixel partition 1401 includes a first metal. Thus, by an etching process, the first sub-pixel partition has a first protrusion extending beyond at least one sub-partition layer in the arrangement direction of two adjacent sub-pixels, thereby forming a concave structure located on the side of the pixel partition structure through the aforementioned etching process.

[0119] In some examples, the first metal is titanium and the second metal is aluminum. Of course, embodiments of this disclosure include, but are not limited to, other suitable metallic materials may be selected for the first and second metals. Furthermore, the pixel partition structure is not limited to being made of metallic materials; it may also be made of inorganic non-metallic materials.

[0120] In some examples, the materials of the first sub-pixel partition 1401 and the third sub-pixel partition 1403 include a first inorganic non-metallic material, and the material of the second sub-pixel partition 14022 includes a second inorganic non-metallic material. In this case, the selective etching process can also be utilized to selectively etch only the second micro-hole non-metallic material without etching the first inorganic non-metallic material. The etching process results in the first sub-pixel partition having a first protrusion extending beyond at least one sub-partition layer in the arrangement direction of two adjacent sub-pixels, and the third sub-pixel partition having a second protrusion extending beyond at least one sub-partition layer in the arrangement direction of two adjacent sub-pixels.

[0121] In some examples, the first inorganic non-metallic material includes silicon oxide, and the second inorganic non-metallic material includes silicon nitride. Of course, embodiments of this disclosure include, but are not limited to, other suitable inorganic non-metallic materials may also be used for the first and second inorganic non-metallic materials.

[0122] In some examples, such as Figure 1 and Figure 2As shown, the display substrate 100 further includes a pixel defining layer 150 located on the substrate 110; the pixel defining layer 150 is partially located on the side of the first electrode 131 away from the substrate 110; the pixel defining layer 150 includes a plurality of pixel openings 152 and pixel spacing openings 154; the plurality of pixel openings 152 correspond one-to-one with a plurality of sub-pixels 200 to define the effective light-emitting area of ​​the plurality of sub-pixels 200; the pixel openings 152 are configured to expose the first electrode 131 so that the first electrode 131 can contact the subsequently formed light-emitting functional layer 120. The pixel spacing openings 154 are located between adjacent first electrodes 131, and at least a portion of the partition structure 140 is located in the pixel spacing openings 154. Thus, the display substrate can avoid fabricating the partition structure on the pixel defining layer, thereby avoiding increasing the thickness of the display substrate. Of course, the embodiments of this disclosure include, but are not limited to, the pixel defining layer may not have the above-mentioned pixel spacing openings, so that the partition structure can be directly disposed on the pixel defining layer, or the partition structure can be fabricated using the pixel defining layer.

[0123] For example, the material of the pixel defining layer may include organic materials such as polyimide, acrylic, or polyethylene terephthalate.

[0124] In some examples, such as Figure 1 and Figure 2 As shown, the display substrate 100 also includes a planarization layer 180, which is located between the substrate 110 and the first electrode 131; the pixel isolation structure 140 is in direct contact with the planarization layer 180.

[0125] For example, the material of the planarization layer 180 can be an organic material, such as one or a combination of resin, acrylic or polyethylene terephthalate, polyimide, polyamide, polycarbonate, epoxy resin, etc.

[0126] In some examples, other film layers are disposed between the planarization layer 180 and the substrate 110. These other film layers may include gate insulating layers, interlayer insulating layers, various film layers in pixel circuits (such as thin film transistors, storage capacitors, etc.), data lines, gate lines, power signal lines, reset power signal lines, reset control signal lines, light emission control signal lines, and other film layers or structures.

[0127] Below, in conjunction with Figure 1 The planar layout design of the pixel separation structure provided in the embodiments of this disclosure will be described. It should be noted that... Figure 1 This is merely one example of the pixel partition structure provided in the embodiments of this disclosure; other suitable planar layout designs may also be used for the pixel partition structure.

[0128] like Figure 1As shown, the plurality of sub-pixels 200 include a plurality of first color sub-pixels 201, a plurality of second color sub-pixels 202 and a plurality of third color sub-pixels 203, and the pixel partition structure 140 includes a plurality of annular partition portions 1400, each pixel annular partition portion 1400 surrounding a first color sub-pixel 201, a second color sub-pixel 202 or a third color sub-pixel 203.

[0129] In this display substrate, since the pixel isolation structure includes multiple annular isolation portions, each annular isolation portion surrounds a first color sub-pixel, a second color sub-pixel, or a third color sub-pixel, the pixel isolation structure can achieve the isolation of most adjacent sub-pixels through simple annular isolation portions, thereby avoiding crosstalk between adjacent sub-pixels.

[0130] In some examples, such as Figure 1 As shown, the plurality of annular partitions 1400 include a plurality of first annular pixel partitions 141A and a plurality of second annular pixel partitions 142A. The plurality of first annular pixel partitions 141A are correspondingly disposed with a plurality of first color sub-pixels 201, and the plurality of second annular pixel partitions 142A are correspondingly disposed with a plurality of third color sub-pixels 203. Each first annular pixel partition 141A surrounds a first color sub-pixel 201, and each second annular pixel partition 142A surrounds a third color sub-pixel 203. Thus, the plurality of first annular pixel partitions 141A can separate the plurality of first color sub-pixels 201 from other adjacent sub-pixels, and the plurality of second annular pixel partitions 142A can separate the plurality of third color sub-pixels 203 from other adjacent sub-pixels. Therefore, the display substrate can effectively avoid crosstalk between adjacent sub-pixels.

[0131] In some examples, such as Figure 1 As shown, a plurality of first annular pixel partitions 141A and a plurality of second annular pixel partitions 142A are combined to form a mesh structure.

[0132] In some examples, such as Figure 1As shown, multiple first-color sub-pixels 201 and multiple third-color sub-pixels 203 are alternately arranged along a first direction and a second direction to form multiple first pixel rows 310 and multiple first pixel columns 320. Multiple second-color sub-pixels 202 are arrayed along the first direction and a second direction to form multiple second pixel rows 330 and multiple second pixel columns 340. The multiple first pixel rows 310 and multiple second pixel rows 330 are alternately arranged along the second direction and staggered from each other in the first direction. The multiple first pixel columns 320 and multiple second pixel columns 340 are alternately arranged along the first direction and staggered from each other in the second direction. Pixel separation structure 140 is located between adjacent first-color sub-pixels 201 and third-color sub-pixels 203, and / or, pixel separation structure 140 is located between adjacent second-color sub-pixels 202 and third-color sub-pixels 203, and / or, pixel separation structure 140 is located between adjacent first-color sub-pixels 201 and second-color sub-pixels 202.

[0133] In some examples, the luminous efficiency of the third color subpixel is less than that of the second color subpixel.

[0134] For example, the first color sub-pixel 201 is configured to emit red light, the second color sub-pixel 202 is configured to emit green light, and the third color sub-pixel 203 is configured to emit blue light. Of course, embodiments of this disclosure include, but are not limited to, these.

[0135] In some examples, such as Figure 1 As shown, the area of ​​the effective light-emitting region of the third color sub-pixel 203 projected onto the substrate 110 is larger than the area of ​​the effective light-emitting region of the first color sub-pixel 201 projected onto the substrate 110; the area of ​​the effective light-emitting region of the first color sub-pixel 201 projected onto the substrate 110 is larger than the area of ​​the effective light-emitting region of the second color sub-pixel 202 projected onto the substrate 110. Of course, this disclosure is not limited to this embodiment, and the area of ​​the effective light-emitting region of each sub-pixel can be set according to actual needs.

[0136] In some examples, such as Figure 1 As shown, the display substrate 100 also includes a spacer 170; the spacer 170 is located between the first color sub-pixel 201 and the third color sub-pixel 203. It should be noted that the spacer is used to support the vapor deposition mask for fabricating the above-mentioned light-emitting layer.

[0137] Figure 4 This is a schematic diagram illustrating the structure of a light-emitting functional layer of a sub-pixel in a display substrate according to an embodiment of this disclosure. It should be noted that... Figure 4To illustrate the layer structure of the light-emitting functional layer for three different colored subpixels, other structures between the different colored subpixels, such as pixel-limiting layers, pixel-separating structures, etc., are not shown.

[0138] like Figure 4 As shown, along a direction perpendicular to the substrate 110, the multiple sub-functional layers 1200 of the light-emitting functional layer 120 include a hole transport layer 124 matched with a first light-emitting layer of a different color, a first light-emitting layer 121 of a different color, a charge generation layer 129, a hole output layer 126 matched with a second light-emitting layer of a different color, a second light-emitting layer 122 of a different color, an electron transport layer 127, and an electron injection layer 128.

[0139] like Figure 4 As shown, the hole transport layer 124, matched with the first light-emitting layer of different colors, includes a red hole transport layer 124R, a green hole output layer 124G, and a blue hole output layer 124B; the first light-emitting layer 121 includes a first red light-emitting layer 121R, a first green light-emitting layer 121G, and a first blue light-emitting layer 121B respectively located on the red hole transport layer 124R, the green hole output layer 124G, and the blue hole output layer 124B. It should be noted that... Figure 4 The first red light-emitting layer 121R, the first green light-emitting layer 121G, and the first blue light-emitting layer 121B shown have the same thickness. However, the thicknesses of the first red light-emitting layer 121R, the first green light-emitting layer 121G, and the first blue light-emitting layer 121B can be the same or different, and their thicknesses can be set according to the actual situation.

[0140] like Figure 4 As shown, the hole transport layer 126, matched with the second light-emitting layers of different colors, includes a red hole transport layer 126R, a green hole output layer 126G, and a blue hole output layer 126B; the second light-emitting layer 122 includes a second red light-emitting layer 122R, a second green light-emitting layer 122G, and a second blue light-emitting layer 122B respectively located on the red hole transport layer 126R, the green hole output layer 126G, and the blue hole output layer 126B. It should be noted that... Figure 4 The second red light-emitting layer 122R, the second green light-emitting layer 122G, and the second blue light-emitting layer 122B shown have the same thickness. However, the thicknesses of the second red light-emitting layer 122R, the second green light-emitting layer 122G, and the second blue light-emitting layer 122B can be the same or different, and their thicknesses can be set according to the actual situation.

[0141] like Figure 4 As shown, along a direction perpendicular to the substrate 110, the plurality of sub-functional layers 1200 of the light-emitting functional layer 120 also include a hole blocking layer 125 located between the charge generation layer 129 and the first light-emitting layer 121.

[0142] like Figure 4 As shown, the charge generation layer 129 includes an n-type doped layer 129A for generating holes and a p-type doped layer 129B for generating electrons, which are stacked together. For example, the material of the charge generation layer 129 may include an n-type doped organic layer / p-type doped organic layer, such as BPhen:Cs / NPB:F4-TCNQ, Alq3:Li / NPB:FeCl3, TPBi:Li / NPB:FeCl3, and Alq3:Mg / m-MTDATA:F4-TCNQ. Of course, the embodiments of this disclosure include, but are not limited to, the material of the charge generation layer may also include an n-type doped organic layer / inorganic metal oxide, such as Alq3:Mg / WO3, Bphen:Li / MoO3, BCP:Li / V2O5, and BCP:Cs / V2O5; or an n-type doped organic layer / organic layer, such as Alq3:Li / HAT-CN; or an undoped material, such as F 16 CuPc / CuPc and Al / WO3 / Au.

[0143] For example, the materials for the first and second light-emitting layers can be selected from pyrene derivatives, anthracene derivatives, fluorene derivatives, perylene derivatives, styrene-amine derivatives, metal complexes, etc.

[0144] For example, the material of the hole injection layer may include oxides, such as molybdenum oxide, titanium oxide, vanadium oxide, rhenium oxide, ruthenium oxide, chromium oxide, zirconium oxide, hafnium oxide, tantalum oxide, silver oxide, tungsten oxide, and manganese oxide.

[0145] For example, the material of the hole injection layer may also include organic materials, such as hexacyanohexaazatriphenylene, 2,3,5,6-tetrafluoro-7,7,8,8-tetracyano-p-quinone dimethyl ether (F4TCNQ), and 1,2,3-tris[(cyano)(4-cyano-2,3,5,6-tetrafluorophenyl)methylene]cyclopropane.

[0146] For example, the material of the hole transport layer may include aromatic amines with hole transport properties, as well as dimethylfluorene or carbazole materials, such as: 4,4'-bis[N-(1-naphthyl)-N-phenylamino]biphenyl (NPB), N,N'-bis(3-methylphenyl)-N,N'-diphenyl-[1,1'-biphenyl]-4,4'-diamine (TPD), 4-phenyl-4'-(9-phenylfluorene-9-yl)triphenylamine (BAFLP), 4,4'-bis[N-(9,9-dimethylfluorene-2-yl)-N-phenylamino]biphenyl (DFLDPBi), 4,4'-bis(9-carbazolyl)biphenyl (CBP), and 9-phenyl-3-[4-(10-phenyl-9-anthrayl)phenyl]-9H-carbazole (PCzPA).

[0147] For example, the material of the electron transport layer may include aromatic heterocyclic compounds, such as benzimidazole derivatives, imidazole derivatives, pyrimidine derivatives, azine derivatives, quinoline derivatives, isoquinoline derivatives, phenanthroline derivatives, etc.

[0148] For example, the material of the electron injection layer can be an alkali metal or a metal and its compounds, such as lithium fluoride (LiF), ytterbium (Yb), magnesium (Mg), and calcium (Ca).

[0149] In some examples, the first electrode 131 may be made of a metallic material, such as any one or more of magnesium (Mg), silver (Ag), copper (Cu), aluminum (Al), titanium (Ti) and molybdenum (Mo), or an alloy of the above metals, such as aluminum-neodymium alloy (AlNd) or molybdenum-niobium alloy (MoNb). It may be a single-layer structure or a multi-layer composite structure, such as Ti / Al / Ti, or a stacked structure formed of metal and transparent conductive material, such as reflective materials such as ITO / Ag / ITO, Mo / AlNd / ITO, etc.

[0150] In some examples, the second electrode 132 may be made of any one or more of magnesium (Mg), silver (Ag), and aluminum (Al), or an alloy made of any one or more of the above metals, or a transparent conductive material, such as indium tin oxide (ITO), or a multilayer composite structure of metal and transparent conductive material.

[0151] In some examples, the substrate 110 may be made of one or more of the following materials: glass, polyimide, polycarbonate, polyacrylate, polyetherimide, and polyethersulfone, and this embodiment includes, but is not limited to, these materials.

[0152] In some examples, the substrate can be a rigid substrate or a flexible substrate. When the substrate is a flexible substrate, it may include a first flexible material layer, a first inorganic non-metallic material layer, a semiconductor layer, a second flexible material layer, and a second inorganic non-metallic material layer stacked sequentially. The first and second flexible material layers are made of materials such as polyimide (PI), polyethylene terephthalate (PET), or surface-treated polymer films. The first and second inorganic non-metallic material layers are made of materials such as silicon nitride (SiNx) or silicon oxide (SiOx) to improve the substrate's resistance to water and oxygen; these layers are also referred to as barrier layers. The semiconductor layer is made of amorphous silicon (a-Si).

[0153] For example, taking a substrate with a stacked structure of PI1 / Barrier1 / a-si / PI2 / Barrier2 as an example, the preparation process of this substrate includes: firstly, coating a layer of polyimide on a glass substrate, curing it into a film to form a first flexible (PI1) layer; then depositing a barrier film on the first flexible layer to form a first barrier (Barrier1) layer covering the first flexible layer; then depositing an amorphous silicon film on the first barrier layer to form an amorphous silicon (a-si) layer covering the first barrier layer; then coating another layer of polyimide on the amorphous silicon layer, curing it into a film to form a second flexible (PI2) layer; then depositing a barrier film on the second flexible layer to form a second barrier (Barrier2) layer covering the second flexible layer, and finally completing the preparation of the substrate.

[0154] Figure 5 This is a cross-sectional schematic diagram of a display substrate provided in one embodiment of this disclosure. Figure 5 As shown, the display substrate 100 also includes a planarization layer 180 located between the substrate 110 and the first electrode 131, and a pixel isolation structure 140 on the planarization layer 180. The pixel isolation structure 140 is directly in contact with the planarization layer 180. It should be noted that a protective structure can be formed below the pixel isolation structure to prevent the underlying planarization layer from being etched.

[0155] Figure 6 This is a cross-sectional schematic diagram of another display substrate provided in an embodiment of this disclosure. For example... Figure 6 As shown, in this display substrate 100, multiple pixel separation structures 140 are provided between two adjacent sub-pixels 200. Figure 6 As shown, two pixel separation structures 140 are provided between two adjacent sub-pixels 200. The embodiments of this disclosure include, but are not limited to, more pixel separation structures may be provided between two adjacent sub-pixels.

[0156] Figure 7 This is a cross-sectional schematic diagram of another display substrate provided in an embodiment of this disclosure. For example... Figure 7 As shown, the display substrate 100 further includes a pixel defining layer 150; the pixel defining layer 150 is located on the side of the first electrode 131 away from the substrate 110; the pixel defining layer 150 includes a plurality of pixel openings 152; the plurality of pixel openings 152 correspond one-to-one with a plurality of sub-pixels 200 to define the effective light-emitting area of ​​the plurality of sub-pixels 200; the pixel openings 152 are configured to expose the first electrode 131 so that the first electrode 131 can contact the subsequently formed light-emitting functional layer 120.

[0157] like Figure 7As shown, the pixel isolation structure 140 is located on the side of the pixel defining layer 150 away from the substrate 110; that is, the pixel isolation structure 140 is located on the pixel defining layer 150 between adjacent pixel openings 152. Thus, the display substrate can directly provide a pixel isolation structure on the pixel defining layer so that at least one sub-functional layer in the light-emitting functional layer is disconnected at the edge of the first electrode, thereby avoiding crosstalk between adjacent sub-pixels.

[0158] Figure 8 This is a cross-sectional schematic diagram of another display substrate provided in an embodiment of this disclosure. For example... Figure 8 As shown, the display substrate 100 also includes a pixel defining layer 150 located on the substrate 110; the pixel defining layer 150 is partially located on the side of the first electrode 131 away from the substrate 110; the pixel defining layer 150 includes a plurality of pixel openings 152; the plurality of pixel openings 152 correspond one-to-one with a plurality of sub-pixels 200 to define the effective light-emitting area of ​​the plurality of sub-pixels 200; the pixel openings 152 are configured to expose the first electrode 131 so that the first electrode 131 can contact the subsequently formed light-emitting functional layer 120.

[0159] like Figure 8 As shown, at least a portion of the pixel partition structure 140 is located within the pixel opening 152. Therefore, the display substrate can directly provide the pixel partition structure at the edge of the first electrode, causing at least one sub-functional layer in the light-emitting functional layer to be disconnected at the edge of the first electrode, thereby avoiding crosstalk between adjacent sub-pixels. Furthermore, since the pixel partition structure is directly disposed within the pixel opening, there is no need to provide additional spacing between adjacent sub-pixels for placing the pixel partition structure, thus increasing the pixel density of the display substrate.

[0160] In some examples, such as Figure 8 As shown, the pixel isolation structure 140 is located at the edge of the first electrode 131, and the surface of the pixel isolation structure 140 away from the substrate 110 is at least partially covered by the material of the first electrode 131. Therefore, this display substrate avoids crosstalk between adjacent sub-pixels and can improve pixel density while maximizing the area of ​​the effective display area of ​​each sub-pixel.

[0161] In some examples, such as Figure 8 As shown, the orthographic projection of the pixel partition structure 140 on the substrate 110 at least partially overlaps with the orthographic projection of the pixel defining layer 150 on the substrate 110. Therefore, this display substrate avoids crosstalk between adjacent sub-pixels and increases pixel density while maximizing the area of ​​the effective display region for each sub-pixel.

[0162] Figure 9 This is a planar schematic diagram of a display substrate provided according to an embodiment of the present disclosure. For example... Figure 9 As shown, the substrate 110 includes a display area 112 and a peripheral area 114 surrounding the display area 112. The display area 112 includes an opening area 116, and an opening partition structure 160 is provided at the edge of the opening area 116. The cross-sectional structure of the opening partition structure 160 is the same as the cross-sectional structure of the pixel partition structure 140; that is, the opening partition structure 160 also has multiple stacked opening partition portions, and the side of the opening partition structure has a concave structure. Therefore, the film layer with higher conductivity in the light-emitting functional layer can be disconnected at the opening partition structure at the edge of the opening area. It should be noted that no sub-pixels are provided in the opening area, and light is allowed to pass through. It should be noted that the cross-sectional structure of the opening partition structure can adopt the cross-sectional structure of the pixel partition structure provided in any of the above examples; for simplicity, the embodiments of this disclosure will not be described in detail here.

[0163] In some examples, the material of the aperture partition structure 160 is the same as the material of the pixel partition structure 140. It should be noted that the material of the aperture partition structure can be the same as the material of the pixel partition structure provided in any of the above examples; for the sake of brevity, this disclosure will not elaborate further.

[0164] At least one embodiment of this disclosure also provides a display device. Figure 10 This is a schematic diagram of a display device provided according to an embodiment of the present disclosure. Figure 10 As shown, the display device 500 also includes a display substrate 100. This display substrate avoids crosstalk between adjacent sub-pixels caused by the highly conductive charge generation layer by providing a partition structure between adjacent sub-pixels and disconnecting the charge generation layer in the light-emitting functional layer at the location of the partition structure. Therefore, the display device including this display substrate can also avoid crosstalk between adjacent sub-pixels, thus achieving higher product yield and higher display quality.

[0165] On the other hand, since the display substrate can increase pixel density while employing a dual-layer tandem EL design, display devices including this display substrate have advantages such as long lifespan, low power consumption, high brightness, and high resolution.

[0166] For example, the display device can be an organic light-emitting diode display device or other display device, as well as any product or component with display function, such as a television, digital camera, mobile phone, watch, tablet computer, laptop computer, or navigator that includes the display device. This embodiment is not limited to this.

[0167] At least one embodiment of this disclosure also provides a method for manufacturing a display substrate. The method for manufacturing the display substrate includes: forming a plurality of first electrodes on a substrate; forming a pixel partition structure on the substrate; forming a light-emitting functional layer on the side of the pixel partition structure and the plurality of first electrodes away from the substrate, the light-emitting functional layer including a plurality of sub-functional layers; and forming a second electrode on the side of the light-emitting functional layer away from the substrate, the second electrode, the light-emitting functional layer and the plurality of first electrodes forming a light-emitting element of a plurality of sub-pixels, the pixel spacer structure being located between adjacent sub-pixels, the pixel partition structure including a first sub-pixel partition portion, a second sub-pixel partition portion and a third sub-pixel partition portion stacked together, the second sub-pixel partition portion being located on the side of the first sub-pixel partition portion away from the substrate, the third sub-pixel partition portion being located on the side of the second sub-pixel partition portion away from the first sub-pixel partition portion, the second sub-pixel partition portion including a plurality of sub-partition layers stacked along a direction perpendicular to the substrate, the first sub-pixel partition portion having a first protrusion extending beyond at least one sub-partition layer in the arrangement direction of two adjacent sub-pixels, and the third sub-pixel partition portion having a second protrusion extending beyond at least one sub-partition layer in the arrangement direction of two adjacent sub-pixels.

[0168] In the display substrate manufacturing method provided in this embodiment, since the first sub-pixel partition has a first protrusion extending beyond at least one sub-partition layer in the arrangement direction of two adjacent sub-pixels, and the third sub-pixel partition has a second protrusion extending beyond at least one sub-partition layer in the arrangement direction of two adjacent sub-pixels, the pixel partition structure forms a concave structure on the side surface in the arrangement direction of two adjacent sub-pixels. This allows at least one sub-functional layer in the light-emitting functional layer subsequently formed on the pixel partition structure to be disconnected. Therefore, by providing the aforementioned pixel partition structure between adjacent sub-pixels, the display substrate manufactured by this method can avoid crosstalk between adjacent sub-pixels caused by highly conductive sub-functional layers in the light-emitting functional layer.

[0169] On the other hand, because the display substrate manufactured by this method can avoid crosstalk between adjacent sub-pixels through a pixel separation structure, the display substrate can increase pixel density while employing a dual-layer tandem EL design. Therefore, this display substrate has advantages such as long lifespan, low power consumption, high brightness, and high resolution.

[0170] In some examples, in the arrangement direction of two adjacent sub-pixels 200, the average size of the second sub-pixel partition 1402 is smaller than the average size of the first sub-pixel partition 1401 and the average size of the third sub-pixel partition 1403.

[0171] In some examples, the orthographic projection of at least one sub-blocking layer 14020 onto the substrate 110 falls within the orthographic projections of the first sub-pixel blocking portion 1401 and the third sub-pixel blocking portion 1403 onto the substrate 110, respectively. Consequently, the pixel blocking structure forms a concave structure on the side of the arrangement direction of two adjacent sub-pixels, thereby allowing at least one sub-functional layer in the subsequent light-emitting functional layers formed on the pixel blocking structure to be disconnected.

[0172] In some examples, the orthographic projection of the second sub-pixel partition 1402 onto the substrate 110 falls within the orthographic projections of the first sub-pixel partition 1401 and the third sub-pixel partition 1403 onto the substrate 110, respectively. Consequently, the entire second sub-pixel partition is concave relative to the first and third sub-pixel partitions, thus forming a concave structure on the side of the pixel partition structure in the arrangement direction of adjacent sub-pixels. This allows at least one sub-functional layer in the subsequent light-emitting functional layers formed on the pixel partition structure to be disconnected.

[0173] In some examples, the plurality of sub-separation layers 14020 of the second sub-pixel partition 1402 include a first sub-separation layer 1402A, a second sub-separation layer 1402B, and a third sub-separation layer 1402C stacked along a direction perpendicular to the substrate 110. The orthographic projection of the second sub-separation layer 1402B onto the substrate 110 falls within the orthographic projections of the first sub-separation layer 1402A and the third sub-separation layer 1402C onto the substrate 110, respectively. As a result, the second sub-pixel partition also forms a concave structure on the side surface in the arrangement direction of two adjacent sub-pixels.

[0174] In some examples, the second sub-pixel partition 1402 has a concave side surface on the side of the arrangement direction of two adjacent sub-pixels.

[0175] Figure 11A-11F This is a schematic diagram illustrating the steps of providing a display substrate according to an embodiment of this disclosure. For example... Figure 11A-11F As shown, the method for manufacturing this display substrate includes:

[0176] like Figure 11A As shown, before forming a plurality of first electrodes 131 on the substrate 110, a stacked structure 14 is formed on the substrate 110. The stacked structure 14 includes a first sub-layer 14A, a second sub-layer 14B and a third sub-layer 14C stacked together.

[0177] like Figure 11BAs shown, the stacked structure 14 is etched to remove part of the second sub-layer 14B, so that the stacked structure 14 forms a pixel partition structure 140, the first sub-layer 14A forms a first sub-pixel partition portion 1401, the second sub-layer 14B forms a second sub-pixel partition portion 1402, and the third sub-layer 14C forms a third sub-pixel partition portion 1403.

[0178] In the display substrate manufacturing method provided in this example, the entire pixel isolation structure is fabricated before the formation of the first electrode, thereby avoiding any adverse effects of the pixel isolation structure fabrication process on the formation of the first electrode.

[0179] For example, the materials of the first sub-layer 14A and the third sub-layer 14C include a first metal, and the material of the second sub-layer 14B includes a second metal. Therefore, by utilizing the selectivity of the etching process, an etchant can be selected that etches only the second metal and not the first metal. This etching process results in the first sub-pixel partition having a first protrusion extending beyond at least one sub-partition layer in the arrangement direction of two adjacent sub-pixels, and the third sub-pixel partition having a second protrusion extending beyond at least one sub-partition layer in the arrangement direction of two adjacent sub-pixels. It should be noted that because the sides of the second sub-pixel partition are etched to different degrees, multiple sub-partition layers of different sizes are formed.

[0180] In some examples, the first metal is titanium and the second metal is aluminum. Of course, embodiments of this disclosure include, but are not limited to, other suitable metallic materials may be selected for the first and second metals. Furthermore, the pixel partition structure is not limited to being made of metallic materials; it may also be made of inorganic non-metallic materials.

[0181] In some examples, the materials of the first sub-layer 14A and the third sub-layer 14C include a first inorganic non-metallic material, and the material of the second sub-layer 14B includes a second inorganic non-metallic material. In this case, the selective etching process can also be utilized to selectively etch only the second micro-orifice non-metallic material without etching the first inorganic non-metallic material. The etching process results in the first sub-pixel partition having a first protrusion extending beyond at least one sub-partition layer in the arrangement direction of two adjacent sub-pixels, and the third sub-pixel partition having a second protrusion extending beyond at least one sub-partition layer in the arrangement direction of two adjacent sub-pixels.

[0182] In some examples, the first inorganic non-metallic material includes silicon oxide, and the second inorganic non-metallic material includes silicon nitride. Of course, embodiments of this disclosure include, but are not limited to, other suitable inorganic non-metallic materials may also be used for the first and second inorganic non-metallic materials.

[0183] like Figure 11CAs shown, after forming the pixel separation structure 140, a first electrode 131 is formed on the substrate 110.

[0184] like Figure 11D As shown, a pixel defining layer 150 is formed on the side of the first electrode 131 and the pixel partition structure 140 away from the substrate 110. The pixel defining layer 150 includes a plurality of pixel openings 152 and pixel spacing openings 154. The plurality of pixel openings 152 correspond one-to-one with a plurality of sub-pixels 200 to define the effective light-emitting areas of the plurality of sub-pixels 200. The pixel openings 152 are configured to expose the first electrode 131 so that the first electrode 131 can contact the subsequently formed light-emitting functional layer 120. The pixel spacing openings 154 are located between adjacent first electrodes 131, and at least a portion of the partition structure 140 is located within the pixel spacing openings 154.

[0185] For example, the material of the pixel defining layer may include organic materials such as polyimide, acrylic, or polyethylene terephthalate.

[0186] like Figure 11E As shown, a light-emitting functional layer 120 is formed on the side of the pixel limiting layer 150 away from the substrate 110. The light-emitting functional layer 120 includes a plurality of sub-functional layers 1200. The plurality of sub-functional layers 1200 include a charge generation layer 129 and a first light-emitting layer 121 and a second light-emitting layer 122 on both sides in a direction perpendicular to the substrate 110. Since the pixel partition structure 140 forms a concave structure on the side of the arrangement direction of two adjacent sub-pixels, the charge generation layer 129 is broken at the location of the pixel partition structure 140.

[0187] like Figure 11F As shown, a second electrode 132 is formed on the side of the light-emitting functional layer 120 away from the substrate 110. It should be noted that the method for fabricating this display substrate is not limited to the steps described above, and may also include steps for forming other necessary film layers. For example, the method for fabricating this display substrate may also include steps for forming a planarization layer on the substrate and for forming film layers such as a gate insulating layer, an interlayer insulating layer, and a pixel circuit layer (e.g., including structures such as thin-film transistors and storage capacitors) between the substrate and the planarization layer.

[0188] For example, the material of the planarization layer can be an organic material, such as one or a combination of resin, acrylic, polyethylene terephthalate, polyimide, polyamide, polycarbonate, epoxy resin, etc.

[0189] Figure 12A-12D This is a schematic diagram illustrating the steps of providing a display substrate according to an embodiment of this disclosure. For example... Figure 12A-12D As shown, the method for manufacturing this display substrate includes:

[0190] like Figure 12A As shown, a plurality of first electrodes 131 are formed on the substrate 110. For example, the plurality of first electrodes 131 may be formed using the same film layer through the same patterning process.

[0191] like Figure 12B As shown, a stacked structure 14 is formed on one side of the substrate 110. The stacked structure 14 includes a first sublayer 14A, a second sublayer 14B, and a third sublayer 14C stacked together.

[0192] like Figure 12C As shown, the stacked structure 14 is etched to remove part of the second sub-layer 14B, so that the stacked structure 14 forms a pixel partition structure 140, the first sub-layer 14A forms a first sub-pixel partition portion 1401, the second sub-layer 14B forms a second sub-pixel partition portion 1402, and the third sub-layer 14C forms a third sub-pixel partition portion 1403.

[0193] In the display substrate manufacturing method provided in this example, the entire pixel isolation structure is fabricated before the formation of the first electrode, thereby avoiding any adverse effects of the pixel isolation structure fabrication process on the formation of the first electrode.

[0194] For example, the materials of the first sub-layer 14A and the third sub-layer 14C include a first metal, and the material of the second sub-layer 14B includes a second metal. Therefore, by utilizing the selectivity of the etching process, an etchant can be selected that etches only the second metal and not the first metal. This etching process results in the first sub-pixel partition having a first protrusion extending beyond at least one sub-partition layer in the arrangement direction of two adjacent sub-pixels, and the third sub-pixel partition having a second protrusion extending beyond at least one sub-partition layer in the arrangement direction of two adjacent sub-pixels. It should be noted that because the sides of the second sub-pixel partition are etched to different degrees, multiple sub-partition layers of different sizes are formed.

[0195] In some examples, the first metal is titanium and the second metal is aluminum. Of course, embodiments of this disclosure include, but are not limited to, other suitable metallic materials may be selected for the first and second metals. Furthermore, the pixel partition structure is not limited to being made of metallic materials; it may also be made of inorganic non-metallic materials.

[0196] In some examples, the materials of the first sub-layer 14A and the third sub-layer 14C include a first inorganic non-metallic material, and the material of the second sub-layer 14B includes a second inorganic non-metallic material. In this case, the selective etching process can also be utilized to selectively etch only the second micro-orifice non-metallic material without etching the first inorganic non-metallic material. The etching process results in the first sub-pixel partition having a first protrusion extending beyond at least one sub-partition layer in the arrangement direction of two adjacent sub-pixels, and the third sub-pixel partition having a second protrusion extending beyond at least one sub-partition layer in the arrangement direction of two adjacent sub-pixels.

[0197] In some examples, the first inorganic non-metallic material includes silicon oxide, and the second inorganic non-metallic material includes silicon nitride. Of course, embodiments of this disclosure include, but are not limited to, other suitable inorganic non-metallic materials may also be used for the first and second inorganic non-metallic materials.

[0198] like Figure 12D As shown, a pixel defining layer 150 is formed on the side of the first electrode 131 and the pixel partition structure 140 away from the substrate 110. The pixel defining layer 150 includes a plurality of pixel openings 152 and pixel spacing openings 154. The plurality of pixel openings 152 correspond one-to-one with a plurality of sub-pixels 200 to define the effective light-emitting areas of the plurality of sub-pixels 200. The pixel openings 152 are configured to expose the first electrode 131 so that the first electrode 131 can contact the subsequently formed light-emitting functional layer 120. The pixel spacing openings 154 are located between adjacent first electrodes 131, and at least a portion of the partition structure 140 is located within the pixel spacing openings 154.

[0199] For example, the material of the pixel defining layer may include organic materials such as polyimide, acrylic, or polyethylene terephthalate.

[0200] Figures 13A-13F This is a schematic diagram illustrating the steps of another display substrate provided in an embodiment of this disclosure. For example... Figures 13A-13F As shown, the method for manufacturing the display substrate further includes:

[0201] like Figure 13A As shown, before forming a plurality of first electrodes 131 on the substrate 110, a stacked structure 14 is formed on the substrate 110. The stacked structure 14 includes a first sub-layer 14A, a second sub-layer 14B and a third sub-layer 14C stacked together.

[0202] like Figure 13B As shown, a plurality of first electrodes 131 are formed on the substrate 110.

[0203] like Figure 13CAs shown, after forming a plurality of first electrodes 131 on the substrate 110, a pixel defining layer 150 is formed on the side of the stacked structure 14 and the first electrodes 131 away from the substrate 110, and the pixel defining layer 150 is patterned to form a plurality of pixel openings 152 and pixel spacing openings 154 on the pixel defining layer 150; the plurality of pixel openings 152 correspond one-to-one with a plurality of sub-pixels 200 to define the effective light-emitting area of ​​the plurality of sub-pixels 200; the pixel openings 152 are configured to expose the first electrodes 131 so that the first electrodes 131 can contact the subsequently formed light-emitting functional layer 120. The pixel spacing openings 154 are located between adjacent first electrodes 131, and at least a portion of the partition structure 140 is located in the pixel spacing openings 154.

[0204] like Figure 13D As shown, the stacked structure 14 is etched to remove part of the second sub-layer 14B, so that the stacked structure 14 forms a pixel partition structure 140, the first sub-layer 14A forms a first sub-pixel partition portion 1401, the second sub-layer 14B forms a second sub-pixel partition portion 1402, and the third sub-layer 14C forms a third sub-pixel partition portion 1403.

[0205] like Figure 13E As shown, a light-emitting functional layer 120 is formed on the side of the pixel limiting layer 150 away from the substrate 110. The light-emitting functional layer 120 includes a plurality of sub-functional layers 1200. The plurality of sub-functional layers 1200 include a charge generation layer 129 and a first light-emitting layer 121 and a second light-emitting layer 122 on both sides in a direction perpendicular to the substrate 110. Since the pixel partition structure 140 forms a concave structure on the side of the arrangement direction of two adjacent sub-pixels, the charge generation layer 129 is broken at the location of the pixel partition structure 140.

[0206] like Figure 13F As shown, a second electrode 132 is formed on the side of the light-emitting functional layer 120 away from the substrate 110.

[0207] Figures 14A-14D This is a schematic diagram illustrating the steps of another display substrate provided in an embodiment of this disclosure. For example... Figures 14A-14D As shown, the method for manufacturing the display substrate further includes:

[0208] like Figure 14A As shown, before forming a plurality of first electrodes 131 on the substrate 110, a stacked structure 14 is formed on the substrate 110. The stacked structure 14 includes a first sub-layer 14A, a second sub-layer 14B and a third sub-layer 14C stacked together.

[0209] like Figure 14BAs shown, the stacked structure 14 is etched to remove part of the second sub-layer 14B, so that the stacked structure 14 forms a pixel partition structure 140, the first sub-layer 14A forms a first sub-pixel partition portion 1401, the second sub-layer 14B forms a second sub-pixel partition portion 1402, and the third sub-layer 14C forms a third sub-pixel partition portion 1403.

[0210] like Figure 14C As shown, a plurality of first electrodes 131 are formed on the substrate 110.

[0211] like Figure 14D As shown, after forming a plurality of first electrodes 131 on the substrate 110, a pixel defining layer 150 is formed on the side of the pixel partition structure 140 and the first electrodes 131 away from the substrate 110; and the pixel defining layer 150 is patterned to form a plurality of pixel openings 152 on the pixel defining layer 150; the plurality of pixel openings 152 correspond one-to-one with a plurality of sub-pixels 200 to define the effective light-emitting area of ​​the plurality of sub-pixels 200; the pixel openings 152 are configured to expose the first electrodes 131 so that the first electrodes 131 can contact the subsequently formed light-emitting functional layer 120; at this time, the pixel partition structure 140 is at least partially located in the pixel openings 152. Thus, the display substrate can directly provide the pixel partition structure at the edge of the first electrode so that at least one sub-functional layer in the light-emitting functional layer is disconnected at the edge of the first electrode, thereby avoiding crosstalk between adjacent sub-pixels. In addition, since the pixel partition structure is directly provided in the pixel opening, there is no need to provide an additional spacing between adjacent sub-pixels for placing the pixel partition structure, so that the display substrate can improve the pixel density.

[0212] In some examples, such as Figure 14D As shown, the pixel isolation structure 140 is located at the edge of the first electrode 131, and the surface of the pixel isolation structure 140 away from the substrate 110 is at least partially covered by the material of the first electrode 131. Therefore, this display substrate avoids crosstalk between adjacent sub-pixels and can improve pixel density while maximizing the area of ​​the effective display area of ​​each sub-pixel.

[0213] In some examples, such as Figure 14D As shown, the orthographic projection of the pixel partition structure 140 on the substrate 110 at least partially overlaps with the orthographic projection of the pixel defining layer 150 on the substrate 110. Therefore, this display substrate avoids crosstalk between adjacent sub-pixels and increases pixel density while maximizing the area of ​​the effective display region for each sub-pixel.

[0214] One embodiment of this disclosure provides a display substrate. Figure 15 This is a partial cross-sectional schematic diagram of a display substrate provided in one embodiment of the present disclosure. For example... Figure 15As shown, the display substrate 100 includes a substrate 110 and a plurality of sub-pixels 200. The plurality of sub-pixels 200 are located on the substrate 110, and each sub-pixel 200 includes a light-emitting element 210. Each light-emitting element 210 includes a light-emitting functional layer 120 and a first electrode 131 and a second electrode 132 located on both sides of the light-emitting functional layer 120. The first electrode 131 is located between the light-emitting functional layer 120 and the substrate 110. The second electrode 132 is at least partially located on the side of the light-emitting functional layer 120 away from the first electrode 131; that is, the first electrode 131 and the second electrode 132 are located on opposite sides in a direction perpendicular to the light-emitting functional layer 120. The light-emitting functional layer 120 includes a plurality of sub-functional layers, including conductive sub-layers 129 with high conductivity. It should be noted that the aforementioned light-emitting functional layers do not only include film layers that directly emit light, but also include functional film layers for assisting light emission, such as hole transport layers and electron transport layers.

[0215] For example, the conductive sublayer 129 may be a charge generation layer. For example, the first electrode 131 may be an anode, and the second electrode 132 may be a cathode. For example, the cathode may be formed of a material with high conductivity and low work function; for example, the cathode may be made of a metallic material. For example, the anode may be formed of a transparent conductive material with a high work function.

[0216] like Figure 15 As shown, the display substrate 100 also includes a partition structure 140, which is located on the substrate 110 and between adjacent sub-pixels 200; the charge generation layer 129 in the light-emitting functional layer 120 is disconnected at the location of the partition structure 140. It should be noted that the above-mentioned "adjacent sub-pixels" means that no other sub-pixels are disposed between the two sub-pixels.

[0217] In the display substrate provided in this embodiment, by providing a partition structure between adjacent sub-pixels and disconnecting the charge generation layer in the light-emitting functional layer at the location of the partition structure, crosstalk between adjacent sub-pixels caused by the highly conductive charge generation layer is avoided. Furthermore, since this display substrate can avoid crosstalk between adjacent sub-pixels through the partition structure, it can increase pixel density while employing a tandem EL design. Therefore, this display substrate can have advantages such as long lifespan, low power consumption, high brightness, and high resolution.

[0218] In some examples, such as Figure 15 As shown, each partition structure 140 includes a first sub-partition structure 741 and a second sub-partition structure 742 stacked together; the first sub-partition structure 741 is located between the second sub-partition structure 742 and the substrate 110, and the material of the second sub-partition structure 742 includes inorganic non-metallic materials.

[0219] In some examples, such as Figure 15 As shown, along the arrangement direction of adjacent sub-pixels 200, the edge of the second sub-separation structure 742 in the separation structure 140 located between the adjacent sub-pixels 200 protrudes relative to the edge of the first sub-separation structure 741 to form a separation protrusion 7420. At least one of the plurality of sub-functional layers included in the light-emitting functional layer 120 is disconnected at the separation protrusion 7420. By providing a separation structure between adjacent sub-pixels in the display substrate, the present disclosure embodiment can make at least one layer of the light-emitting functional layer disconnected at the separation protrusion of the second sub-separation structure, which helps to reduce the probability of crosstalk between adjacent sub-pixels.

[0220] For example, such as Figure 15 As shown, the plurality of sub-pixels 200 may include two adjacent sub-pixels 200. For example, at least one edge of the second sub-partition structure 742 protrudes relative to the corresponding edge of the first sub-partition structure 741 to form at least one partition protrusion 7420.

[0221] For example, such as Figure 15 As shown, the two sides of the second sub-partition structure 742 protrude relative to the corresponding edges of the first sub-partition structure 741 to form two partition protrusions 7420.

[0222] Figure 15 The diagram schematically shows a partition structure 140 between two adjacent sub-pixels 200. The partition structure 140 includes two partition protrusions 7420, but is not limited thereto. Two or more partition structures can also be provided between two adjacent sub-pixels. Each partition structure includes at least one partition protrusion. By setting the number of partition structures and the number of partition protrusions, at least one sub-functional layer of the light-emitting functional layer can be disconnected by the partition structure.

[0223] For example, such as Figure 15 As shown, the orthographic projection of the surface of the first sub-partition structure 741 facing the second sub-partition structure 742 onto the substrate 110 is completely located on the orthographic projection of the surface of the second sub-partition structure 742 facing the substrate 110 onto the substrate 110. For example, the dimension of the second sub-partition structure 742 in the arrangement direction of adjacent sub-pixels is larger than the dimension of the surface of the first sub-partition structure 741 facing the second sub-partition structure 742 in the arrangement direction of adjacent sub-pixels.

[0224] For example, such as Figure 15 As shown, in the direction perpendicular to the substrate 110, the thickness of the first sub-partition structure 741 is greater than the thickness of the second sub-partition structure 742.

[0225] For example, such as Figure 15As shown, the light-emitting functional layer 120 may include a first light-emitting layer 121, a charge-generating layer (CGL) 129, and a second light-emitting layer 122 stacked together, with the charge-generating layer 129 located between the first light-emitting layer 121 and the second light-emitting layer 122. The charge-generating layer has strong conductivity, which enables the light-emitting functional layer to have advantages such as long lifespan, low power consumption, and high brightness. For example, compared to a light-emitting functional layer without a charge-generating layer, a sub-pixel can nearly double its brightness by incorporating a charge-generating layer within the light-emitting functional layer.

[0226] For example, in each sub-pixel 200, the light-emitting functional layer 120 may also include a hole injection layer (HIL), a hole transport layer (HTL), an electron transport layer (ETL), and an electron injection layer (EIL).

[0227] For example, the hole injection layer, hole transport layer, electron transport layer, electron injection layer, and charge generation layer are all shared film layers for multiple sub-pixels, and can be called common layers. For example, at least one sub-functional layer in the light-emitting functional layer that is disconnected at the partition protrusion can be at least one of the aforementioned common layers. By disconnecting at least one of the aforementioned common functional layers at the partition protrusion located between adjacent sub-pixels, it is beneficial to reduce the probability of crosstalk between adjacent sub-pixels.

[0228] For example, in the same sub-pixel 200, the first light-emitting layer 121 and the second light-emitting layer 122 can be light-emitting layers that emit the same color of light. For example, the first light-emitting layer 121 (or the second light-emitting layer 122) in a sub-pixel 200 that emits different colors of light emits different colors of light. Of course, the embodiments disclosed herein are not limited to this. For example, in the same sub-pixel 200, the first light-emitting layer 121 and the second light-emitting layer 122 can be light-emitting layers that emit different colors of light. By setting light-emitting layers that emit different colors of light in the same sub-pixel 200, the light emitted by the multiple light-emitting layers included in the sub-pixel 200 can be mixed into white light, and the color of the light emitted by each sub-pixel can be adjusted by setting a color filter layer.

[0229] For example, in adjacent sub-pixels 200, the light-emitting layers located on the same side of the charge generation layer 129 can be spaced apart from each other, or they can overlap or connect at the interval between two sub-pixels 200. This disclosure does not limit this.

[0230] For example, the material of the charge generation layer 129 can be the same as the material of the electron transport layer. For example, the material of the electron transport layer can include aromatic heterocyclic compounds, such as imidazole derivatives, imidazopyridine derivatives, benzimidazole-phenanthridine derivatives, and other imidazole derivatives; pyrimidine derivatives, triazine derivatives, and other azine derivatives; quinoline derivatives, isoquinoline derivatives, phenanthreneroline derivatives, and other compounds containing a nitrogen-containing six-membered ring structure (including compounds with phosphine oxide substituents on the heterocycle).

[0231] For example, the material of the charge generation layer 129 can be a material containing phospho groups or a material containing triazine.

[0232] For example, when there is no partition structure 140 between two adjacent sub-pixels 200, the common layers such as the charge generation layer 129 in the light-emitting functional layer 120 of the two adjacent sub-pixels 200 may be connected or be a whole film layer. For example, the charge generation layer 129 has a high conductivity. For display devices with high resolution, the high conductivity of the charge generation layer 129 can easily cause crosstalk between adjacent sub-pixels 200.

[0233] In the display substrate provided in this embodiment, by providing a partition structure with a partition protrusion between two adjacent sub-pixels, at least one layer of the light-emitting functional layer formed at the partition protrusion can be disconnected. At this time, at least one film layer (such as a charge generation layer) in the light-emitting functional layer of the two adjacent sub-pixels is spaced apart, which can increase the resistance of the light-emitting functional layer between the adjacent sub-pixels. This reduces the probability of crosstalk between the two adjacent sub-pixels without affecting the normal display of the sub-pixels.

[0234] For example, such as Figure 15 As shown, the material of the second sub-partition structure 742 may include any one or more of silicon nitride, silicon oxide, or silicon oxynitride.

[0235] For example, such as Figure 15 As shown, the second electrode 132 in the multiple sub-pixels 200 can be a common electrode shared by the multiple sub-pixels 200. When there is no partition structure 140 between two adjacent sub-pixels 200, the second electrode 132 is a whole film layer.

[0236] For example, such as Figure 15 As shown, the size of the partition protrusion 7420 can be in the range of 0.1-5 micrometers. For example, the size of the partition protrusion 7420 can be in the range of 0.2-2 micrometers.

[0237] For example, such as Figure 15As shown, along the direction perpendicular to the substrate 110, the ratio of the thickness of the partition structure 140 to the thickness of the light-emitting functional layer 120 is 0.8 to 1.2. For example, the ratio of the thickness of the partition structure 140 to the thickness of the light-emitting functional layer 120 is 0.9 to 1.1. For example, along the direction perpendicular to the substrate 110, the thickness of the second sub-partition structure 742 can be 100 to 10,000 angstroms. For example, the thickness of the second sub-partition structure 742 can be 200 to 1,500 angstroms. For example, along the direction perpendicular to the substrate 110, the thickness of the first sub-partition structure 741 can be 100 to 10,000 angstroms. For example, the thickness of the first sub-partition structure 741 can be 200 to 2,000 angstroms. An example of an embodiment of this disclosure is that the thickness of the partition structure can be set, for example, the ratio of the thickness of the partition structure to the thickness of the light-emitting functional layer can be set to 0.8 to 1.2, so that the light-emitting functional layer 120 is broken at the partition protrusion 7420 of the partition structure 140, while the second electrode 132 remains continuous and is not partitioned, thereby preventing crosstalk between adjacent sub-pixels. At the same time, the unpartitioned second electrode ensures the uniformity of the display.

[0238] For example, the thickness of the partition structure 140 can be 300 to 5000 angstroms. The above-mentioned thickness (300 to 5000 angstroms) of the partition structure 140 can ensure that the light-emitting functional layer 120 is necessarily broken at the edge of the partition structure, and whether the second electrode 132 is broken is further determined according to the thickness of the partition structure 140.

[0239] By setting the thickness of the partition structure and the size of the partition protrusion, the embodiments of this disclosure can achieve the breaking of at least one film layer of the light-emitting functional layer at the partition protrusion.

[0240] Figure 16 This is a partial cross-sectional structural diagram of a display substrate provided according to another example of an embodiment of the present disclosure. Figure 16 The display substrate in the example shown is Figure 15 The difference in the display substrates shown in the examples lies in the thickness of the partition structure. Figure 16 The thickness of the partition structure 140 in the display substrate shown is greater than Figure 15 The thickness of the partition structure 140 in the display substrate is shown, for example, as... Figure 16 As shown, by setting the thickness of the partition structure 140 to be relatively large (for example, the ratio of the thickness of the partition structure to the thickness of the light-emitting functional layer is greater than 1.5), the light-emitting functional layer and the second electrode are both disconnected at the partition protrusion of the partition structure.

[0241] For example, Figure 15The diagram schematically shows that all the film layers included in the light-emitting functional layer 120 are disconnected at the partition protrusion 7420 of the partition structure 140, while the second electrode 132 is not disconnected at the partition protrusion 7420 of the partition structure 140. However, this is not a limitation. In other examples, the thickness of the partition structure can be set such that a portion of the film layers in the light-emitting functional layer closer to the substrate is disconnected at the partition protrusion, while a portion of the film layers in the light-emitting functional layer farther from the substrate is not disconnected at the partition protrusion, and the second electrode is not disconnected at the partition protrusion.

[0242] For example, such as Figure 15 As shown, the material of the first sub-partition structure 741 includes organic materials.

[0243] For example, such as Figure 15 As shown, the display substrate also includes an organic layer 180 located between the second sub-partition structure 742 and the substrate 110. The organic layer 180 can serve as a planarization layer.

[0244] For example, such as Figure 15 As shown, the first sub-partition structure 741 is integrated with the organic layer 180. For example, the first sub-partition structure 741 may be a part of the organic layer 180. For example, the first sub-partition structure 741 may be a portion of the organic layer 180 that protrudes away from the substrate 110.

[0245] For example, such as Figure 15 As shown, the organic layer 180 includes a planarization (PLN) layer. For example, the material of the first sub-partition structure 741 includes a photoresist, a polyimide (PI) resin, an acrylic resin, a silicone compound, or a polyacrylic resin.

[0246] For example, such as Figure 15 As shown, the first cross-section of the first sub-partition structure 741, cut along the arrangement direction of the adjacent sub-pixels 200 and perpendicular to the plane of the substrate 110, includes a rectangle. For example, the first cross-section of the first sub-partition structure 741, cut along the arrangement direction of the adjacent sub-pixels 200 and perpendicular to the plane of the substrate 110, includes a trapezoid, wherein the angle between the side of the trapezoid and the base of the trapezoid near the substrate 110 is not greater than 90 degrees.

[0247] For example, such as Figure 15 As shown, the cross-section of the first sub-partition structure 741 can be trapezoidal, with the upper base of the trapezoid located on the side of the trapezoid away from the substrate 110, and the angle between the side of the trapezoid and the lower base not exceeding 90 degrees.

[0248] For example, such as Figure 15The length of the upper base of the trapezoidal cross-section of the first sub-partition structure 741 is less than the length of the side of the cross-section of the second sub-partition structure 742 closest to the substrate 110, so that the edge of the second sub-partition structure 742 forms an undercut structure with the edge of the upper base of the first sub-partition structure 741, that is, the edge of the second sub-partition structure 742 includes a partition protrusion 7420.

[0249] Figure 15 The diagram schematically shows that the side of the first sub-partition structure 741 is a straight edge, but it is not limited to this. In the actual process, the side of the first sub-partition structure 741 formed can also be a curved edge. For example, the curved edge bends away from the center of the first sub-partition structure 741, or the curved edge bends towards the center of the first sub-partition structure 741. In this case, the angle between the curved edge of the first sub-partition structure 741 and the lower base can refer to the angle between the tangent at the midpoint of the curved edge and the lower base, or it can refer to the angle between the tangent at the intersection of the curved edge and the lower base.

[0250] For example, such as Figure 15 As shown, the second cross-section of the second sub-partition structure 742, cut along the arrangement direction of adjacent sub-pixels 200 and perpendicular to the plane of the substrate 110, includes a rectangular or trapezoidal shape. For example, Figure 15 The second cross-section of the second sub-partition structure 742 is schematically shown to be rectangular. By setting the short side of the second cross-section of the second sub-partition structure 742 to have a right angle or approximately a right angle between it and the long side of the side closer to the substrate 110 (for example, approximately a right angle can mean that the difference between the angle between the two sides and 90 degrees is not greater than 10 degrees), it is beneficial for the light-emitting functional layer 120 to be disconnected at the edge of the second sub-partition structure 742.

[0251] For example, the second cross-section of the second sub-partition structure 742, cut along the arrangement direction of adjacent sub-pixels and perpendicular to the plane of the substrate 110, can be trapezoidal, with the angle between the side of the trapezoid and the base of the trapezoid away from the substrate 110 not less than 70 degrees. In this embodiment, the angle between the side of the second sub-partition structure 742 and the base of the trapezoid away from the substrate can be set such that the light-emitting functional layer 120 is interrupted at the edge of the second sub-partition structure 742.

[0252] For example, the shape of the second cross section of the second sub-partition structure 742 can be trapezoidal, and the length of the bottom side of the trapezoid away from the substrate 110 is less than the length of the bottom side of the trapezoid close to the substrate 110.

[0253] Figure 17A This is a partial cross-sectional structural diagram of a display substrate provided according to another example of an embodiment of the present disclosure. Figure 17A The display substrate shown is Figure 15The difference in the display substrates shown lies in the shape of the first cross-section of the first sub-partition structure 741, which is cut along the arrangement direction of adjacent sub-pixels 200 and perpendicular to the plane of the substrate 110. For example, as Figure 17A As shown, the shape of the first cross section of the first sub-partition structure 741 cut by the plane perpendicular to the substrate 110 can be rectangular, and the shape of the first cross section of the second sub-partition structure 742 cut by the plane perpendicular to the substrate 110 is also rectangular, which can facilitate the breaking of the light-emitting functional layer 120 at the edge of the partition structure 140.

[0254] Figure 17B This is a partial cross-sectional structural diagram of a display substrate provided according to another example of an embodiment of the present disclosure. Figure 17B The display substrate shown is Figure 17A The difference in the display substrates shown lies in the shape of the first cross-section of the first sub-partition structure 741, which is cut along the arrangement direction of adjacent sub-pixels 200 and perpendicular to the plane of the substrate 110. For example, as Figure 17B As shown, the shape of the first cross section of the first sub-partition structure 741 cut by the plane perpendicular to the substrate 110 can be trapezoidal, and the length of the bottom side of the trapezoid away from the substrate 110 is greater than the length of the bottom side of the trapezoid close to the substrate 110, which can facilitate the breaking of the light-emitting functional layer 120 at the edge of the partition structure 140.

[0255] For example, such as Figures 15 to 17B As shown, the first electrode 131 is in contact with the surface of the organic layer 180 away from the substrate 110. For example, the first electrode 131 can be an anode, and the second electrode 132 can be a cathode. For example, the cathode can be formed of a material with high conductivity and low work function; for example, the cathode can be made of a metallic material. For example, the anode can be formed of a transparent conductive material with a high work function.

[0256] For example, such as Figures 15 to 17BAs shown, the display substrate also includes a pixel defining layer 150 located on the side of the organic layer 180 away from the substrate 110. The pixel defining layer 150 includes a plurality of first openings 152, each of which corresponds to a plurality of sub-pixels 200 to define a light-emitting area of ​​the sub-pixels 200. The first openings 152 are configured to expose a first electrode 131. For example, at least a portion of the first electrode 131 is located between the pixel defining layer 150 and the substrate 110. For example, when a light-emitting functional layer 120 is formed in the first opening 152 of the pixel defining layer 150, the first electrode 131 and the second electrode 132 located on both sides of the light-emitting functional layer 120 can drive the light-emitting functional layer 120 in the first opening 152 to emit light. For example, the light-emitting area can refer to the area where the sub-pixel effectively emits light, and the shape of the light-emitting area refers to a two-dimensional shape. For example, the shape of the light-emitting area can be the same as the shape of the first opening 152 of the pixel defining layer 150.

[0257] For example, such as Figures 15 to 17B As shown, the portion of the pixel defining layer 150 other than the first opening 152 is the pixel defining part, and the material of the pixel defining part may include polyimide, acrylic or polyethylene terephthalate, etc.

[0258] For example, such as Figures 15 to 17B As shown, the pixel defining layer 150 also includes a plurality of second openings 154, which are configured to expose the partition structure 140. For example, a gap is provided between the partition structure 140 and the pixel defining portion of the pixel defining layer 150.

[0259] For example, such as Figures 15 to 17B As shown, the second sub-partition structure 742 includes at least one partition layer. For example, the second sub-partition structure 742 may include a single partition layer, the material of which may be silicon oxide or silicon nitride. For example, the second sub-partition structure 742 may include two partition layers, the materials of which are silicon oxide and silicon nitride, respectively. The embodiments disclosed herein are not limited thereto; the second sub-partition structure may include three or more partition layers, and the number of partition layers included in the second sub-partition structure can be set according to product requirements.

[0260] For example, such as Figures 15 to 17B As shown, along the direction perpendicular to the substrate 110, the thickness of the partition structure 140 is less than the thickness of the pixel defining portion.

[0261] For example, such as Figures 15 to 17BAs shown, the size of the partition protrusion 7420 along the direction parallel to the substrate 110 is not less than 0.01 micrometers. For example, the size of the partition protrusion 7420 along the direction parallel to the substrate 110 is not less than 0.1 micrometers. For example, the size of the partition protrusion 7420 along the direction parallel to the substrate 110 can be 0.01 to 5 micrometers. For example, the size of the partition protrusion 7420 along the direction parallel to the substrate 110 can be 0.05 to 4 micrometers. For example, the size of the partition protrusion 7420 along the direction parallel to the substrate 110 can be 0.1 to 2 micrometers.

[0262] For example, such as Figures 15 to 17B As shown, the second cross-section of the second sub-partition structure 742, cut along the arrangement direction of the adjacent sub-pixels 200 and perpendicular to the plane of the substrate 110, includes a rectangle or a trapezoid. For example, the second cross-section of the second sub-partition structure 742 is rectangular. By setting the short side of the second cross-section of the second sub-partition structure 742 to have a right angle or approximately a right angle with the long side of the side closer to the substrate 110 (for example, approximately a right angle can mean that the difference between the angle between the two sides and 90 degrees is not greater than 10 degrees), it is beneficial for the light-emitting functional layer 120 to be disconnected at the edge of the second sub-partition structure 742.

[0263] For example, the second cross-section of the second sub-partition structure 742 can be trapezoidal, with the angle between the side of the trapezoid and the base of the trapezoid near the substrate 110 being not less than 70 degrees. For example, the second cross-section can be trapezoidal, with the angle between the side of the trapezoid and the base of the trapezoid near the substrate 110 being not less than 90 degrees, so that the angle between the side of the second sub-partition structure 742 and the base of the trapezoid away from the substrate 110 is an acute angle, which can facilitate the breaking of the light-emitting functional layer 120 at the edge of the second sub-partition structure 742.

[0264] For example, the display substrate also includes a pixel circuit, and the first electrode 131 of the organic light-emitting element 210 can be connected to one of the source and drain electrodes of the thin-film transistor in the pixel circuit through a via penetrating the organic layer 180 and other film layers. For example, the pixel circuit also includes a storage capacitor. For example, a gate insulating layer, an interlayer insulating layer, various film layers in the pixel circuit, data lines, gate lines, power signal lines, reset power signal lines, reset control signal lines, light-emitting control signal lines, and other film layers or structures can also be disposed between the organic layer 180 and the substrate 110. For example, the film layer between the organic layer 180 and the substrate 110 can include one layer of power signal lines or two layers of power signal lines. For example, the surface of the organic layer 180 facing the substrate 110 can be in contact with the interlayer insulating layer.

[0265] For example, a spacer may be provided on the side of the pixel defining portion of the pixel defining layer 150 away from the substrate 110, and the spacer is configured to support the vapor deposition mask for forming the light-emitting layer.

[0266] For example, one embodiment of this disclosure provides a method for forming Figure 15 The method for manufacturing the display substrate shown includes forming a plurality of sub-pixels 200 on a substrate 110. The sub-pixels 200 include forming a first electrode 131, a light-emitting functional layer 120 and a second electrode 132 stacked in sequence in a direction perpendicular to the substrate 110; forming a first material layer on the substrate 110; forming a second material layer on the first material layer, the second material layer being an inorganic non-metallic material layer; and simultaneously patterning the first material layer and the second material layer to form a partition structure 140. Forming the partition structure 140 includes patterning a second material layer to form a second sub-partition structure 742, while the portion of the first material layer located directly below the second sub-partition structure 742 is etched to form a first sub-partition structure 741; along the arrangement direction of adjacent sub-pixels 200, the edge of the second sub-partition structure 742 in the partition structure 140 located between the adjacent sub-pixels 200 protrudes relative to the edge of the first sub-partition structure 741 to form a partition protrusion 7420; a light-emitting functional layer 120 is formed after the partition structure 140 is formed, the light-emitting functional layer 120 includes a plurality of film layers, at least one of the plurality of film layers being broken at the partition protrusion 7420.

[0267] For example, the second material layer is an organic material layer. Patterning the first material layer and the second material layer simultaneously to form the partition structure 140 includes: using a dry etching method to etch the second material layer so that while forming the second sub-partition structure 742, the portion of the organic material layer located directly below the second sub-partition structure 742 is dry etched to form the first sub-partition structure 741.

[0268] For example, Figures 18A to 18D To form Figure 15 The diagram shows a flowchart illustrating the manufacturing process of the display substrate preceding the display substrate shown. Figure 15 , Figures 18A to 18DAs shown, the method for manufacturing a display substrate includes: forming a plurality of sub-pixels 200 on a substrate 110, wherein forming a sub-pixel 200 includes sequentially forming a first electrode 131, a light-emitting functional layer 120, and a second electrode 132 in a direction perpendicular to the substrate 110; forming an organic material layer 020 (i.e., a first material layer) on the substrate 110; forming an inorganic non-metallic material layer 030 (i.e., a second material layer) on the organic material layer 020; while patterning the inorganic non-metallic material layer 030 to form a second sub-partition structure 742, a portion of the organic material layer 020 located directly below the second sub-partition structure 742 is etched to form the first sub-partition structure 741. The partition structure 140 includes a first sub-partition structure 741 and a second sub-partition structure 742. Along the arrangement direction of adjacent sub-pixels 200, the edge of the second sub-partition structure 742 in the partition structure 140 located between the adjacent sub-pixels 200 protrudes relative to the edge of the first sub-partition structure 741 to form a partition protrusion 7420. The light-emitting functional layer 120 is formed after the partition structure 140 is formed. The light-emitting functional layer 120 includes a plurality of film layers, at least one of which is broken at the partition protrusion 7420.

[0269] For example, such as Figure 15 and Figure 18A As shown, the method for fabricating a display substrate may include preparing a substrate 110 on a glass carrier. For example, the substrate 110 may be a flexible substrate. For example, forming the substrate 110 may include sequentially forming a first flexible material layer, a first inorganic material layer, a semiconductor layer, a second flexible material layer, and a second inorganic material layer on the glass carrier. The first flexible material layer and the second flexible material layer are made of materials such as polyimide (PI), polyethylene terephthalate (PET), or a surface-treated polymer soft film. The first inorganic material layer and the second inorganic material layer are made of materials such as silicon nitride (SiNx) or silicon oxide (SiOx) to improve the substrate's resistance to water and oxygen; the first inorganic material layer and the second inorganic material layer are also referred to as barrier layers.

[0270] For example, before forming the organic material layer 020, a driving structure layer for pixel circuits can be formed on the substrate 110. The driving structure layer includes multiple pixel circuits, each including multiple transistors and at least one storage capacitor. For example, the pixel circuits can employ a 2T1C, 3T1C, or 7T1C design. For example, forming the driving structure layer may include sequentially depositing a first insulating film and an active layer film on the substrate 110, patterning the active layer film using a patterning process to form a first insulating layer covering the entire substrate 110, and an active layer pattern disposed on the first insulating layer, the active layer pattern including at least an active layer. For example, sequentially depositing a second insulating film and a first metal film, patterning the first metal film using a patterning process to form a second insulating layer covering the active layer pattern, and a first gate metal layer pattern disposed on the second insulating layer, the first gate metal layer pattern including at least a gate electrode and a first capacitor electrode. For example, a third insulating film and a second metal film are deposited sequentially. The second metal film is patterned using a patterning process to form a third insulating layer covering the first gate metal layer, and a second gate metal layer pattern disposed on the third insulating layer. The second gate metal layer pattern includes at least a second capacitor electrode, the position of which corresponds to the position of the first capacitor electrode. Subsequently, a fourth insulating film is deposited and patterned using a patterning process to form a fourth insulating layer covering the second gate metal layer. At least two first vias are formed on the fourth insulating layer. The fourth, third, and second insulating layers within the two first vias are etched away, exposing the surface of the active layer of the active layer pattern. Subsequently, a third metal film is deposited and patterned using a patterning process to form a source / drain metal layer pattern on the fourth insulating layer. The source / drain metal layer pattern includes at least a source electrode and a drain electrode located in the display area. The source electrode and drain electrode can be connected to the active layer in the active layer pattern through the first vias, respectively.

[0271] For example, the first, second, third, and fourth insulating layers can be any one or more of silicon oxide (SiOx), silicon nitride (SiNx), and silicon oxynitride (SiON), and can be single-layer, multi-layer, or composite layers. The first insulating layer can be a buffer layer to improve the water and oxygen resistance of the substrate 110; the second and third insulating layers can be gate insulator (GI) layers; and the fourth insulating layer can be an interlayer dielectric (ILD) layer. The first, second, and third metal thin films are made of metallic materials, such as any one or more of silver (Ag), copper (Cu), aluminum (Al), titanium (Ti), and molybdenum (Mo), or alloys of the above metals, such as aluminum-neodymium alloy (AlNd) or molybdenum-niobium alloy (MoNb), and can be single-layer structures or multi-layer composite structures, such as Ti / Al / Ti. The active layer thin film uses one or more materials such as amorphous indium gallium zinc oxide (a-IGZO), zinc oxynitride (ZnON), indium zinc tin oxide (IZTO), amorphous silicon (a-Si), polycrystalline silicon (p-Si), hexathiophene, and polythiophene. That is, this disclosure is applicable to transistors manufactured based on oxide technology, silicon technology, and organic technology.

[0272] For example, such as Figure 18A and Figure 18B As shown, after the inorganic non-metallic material layer 030 is formed, the inorganic non-metallic material layer 030 is patterned. For example, patterning the inorganic non-metallic material layer 030 includes using a dry etching method to etch the inorganic non-metallic material layer 030 so that while forming the second sub-partition structure 742, the portion of the organic material layer 020 located directly below the second sub-partition structure 742 is dry etched to form the first sub-partition structure 741. For example, a mask can be used to block the inorganic non-metallic material layer 030 at the location where the second sub-partition structure 742 is to be formed, so that the inorganic non-metallic material layer 030 at other locations besides the location where the second sub-partition structure 742 is to be formed can be etched. During the dry etching process of the inorganic non-metallic material layer 030, the etching gas will etch the part of the organic material layer 020 that is not blocked by the mask, so that an organic material layer (i.e., the first sub-partition structure 741) of a certain thickness is retained directly below the inorganic non-metallic material layer (i.e. the second sub-partition structure 742) after etching, so that a protrusion located directly below the second sub-partition structure 742 is formed on the side of the organic material layer 020 away from the substrate 110, and this protrusion is the first sub-partition structure 741.

[0273] For example, such as Figure 18A and Figure 18BAs shown, during the dry etching process of the inorganic non-metallic material layer 030, the thickness of the organic material layer 020 etched can be 100 to 10,000 angstroms, and the thickness of the formed first sub-partition structure 741 can also be 100 to 10,000 angstroms. For example, during the dry etching process of the inorganic non-metallic material layer 030, the thickness of the organic material layer 020 etched can be 200 to 2,000 angstroms, and the thickness of the formed first sub-partition structure 741 can also be 200 to 2,000 angstroms.

[0274] For example, such as Figure 15 and Figure 18C As shown, after forming the partition structure 140, the first electrode 131 of the sub-pixel is patterned on the planarization layer 180. For example, the first electrode 131 is connected to the drain electrode of the transistor through a second via in the planarization layer 180.

[0275] For example, the first electrode 131 can be made of a metallic material, such as any one or more of magnesium (Mg), silver (Ag), copper (Cu), aluminum (Al), titanium (Ti) and molybdenum (Mo), or an alloy of the above metals, such as aluminum-neodymium alloy (AlNd) or molybdenum-niobium alloy (MoNb). It can be a single-layer structure or a multi-layer composite structure, such as Ti / Al / Ti, or a stacked structure formed by metal and transparent conductive material, such as reflective materials such as ITO / Ag / ITO, Mo / AlNd / ITO, etc.

[0276] For example, such as Figure 15 and Figure 18D As shown, after the first electrode 131 is formed, a pixel defining layer 150 can be formed. For example, a pixel defining film is coated on the substrate 110 on which the aforementioned pattern is formed, and the pixel defining layer 150 is formed by a masking, exposure, and development process. For example, the pixel defining layer 150 of the display area includes a plurality of pixel defining portions 158, and a first opening 152 or a second opening 154 is formed between adjacent pixel defining portions 401. The pixel defining film in the first opening 152 and the second opening 154 is developed away. The first opening 152 exposes at least a portion of the surface of the first electrode 131 of the plurality of sub-pixels, and the second opening 154 exposes the partition structure 140.

[0277] For example, after forming the pixel defining layer 150, spacers can be formed on the pixel defining portion. For example, an organic material thin film is coated on the substrate 110 on which the aforementioned pattern is formed, and spacers are formed by masking, exposure, and development processes. The spacers can serve as a support layer and are configured to support the FMM (high-precision mask) during the evaporation process.

[0278] For example, such as Figure 15As shown, after the spacer is formed, the light-emitting functional layer 120 and the second electrode 132 are formed sequentially. For example, the second electrode 132 can be a transparent cathode. The light-emitting functional layer 120 can emit light from the side away from the substrate 110 through the transparent cathode, achieving top emission. For example, the second electrode 132 can be made of any one or more of magnesium (Mg), silver (Ag), and aluminum (Al), or an alloy made of any one or more of the above metals, or a transparent conductive material, such as indium tin oxide (ITO), or a multilayer composite structure of metal and transparent conductive material.

[0279] For example, forming the light-emitting functional layer 120 may include: sequentially depositing a hole injection layer and a hole transport layer using an open mask; sequentially depositing a first light-emitting layer 131 emitting different colors of light, such as a blue light-emitting layer, a green light-emitting layer, and a red light-emitting layer, using an open mask; sequentially depositing an electron transport layer, a charge generation layer 133, and a hole transport layer using an open mask; sequentially depositing a second light-emitting layer 132 emitting different colors of light, such as a blue light-emitting layer, a green light-emitting layer, and a red light-emitting layer, using an open mask; and sequentially depositing an electron transport layer, a second electrode, and an optical coupling layer using an open mask. For example, the hole injection layer, hole transport layer, electron transport layer, charge generation layer, second electrode, and optical coupling layer are all common layers for multiple sub-pixels.

[0280] For example, such as Figure 15 As shown, the formed light-emitting functional layer 120 is broken at the partition protrusion 7420 of the partition structure 140, such that a portion of the light-emitting functional layer 120 located in the second opening 154 of the pixel limiting layer 150 is located on the partition structure 140 and another portion is located on the organic layer 180.

[0281] For example, after forming the second electrode 132, the method for manufacturing the display substrate further includes forming an encapsulation layer, which may include a first encapsulation layer, a second encapsulation layer, and a third encapsulation layer stacked together. The first encapsulation layer is made of an inorganic material and covers the second electrode 132 in the display area. The second encapsulation layer is made of an organic material. The third encapsulation layer is made of an inorganic material and covers the first and second encapsulation layers. However, this embodiment is not limited to this. For example, the encapsulation layer may also adopt a five-layer structure of inorganic / organic / inorganic / organic / inorganic.

[0282] For example, compared to a display substrate without a partition structure, the display substrate with a partition structure provided in this disclosure only requires one additional mask process, resulting in a lower impact on process capacity.

[0283] Figure 19 This is a partial cross-sectional structural diagram of a display substrate provided according to another example of an embodiment of the present disclosure. Figure 19The display substrate in the example shown is Figure 15 The difference in the display substrate shown in the example is that Figure 19 The material of the first sub-partition structure 741 in the display substrate shown includes inorganic non-metallic materials. Figure 19 The sub-pixel 200, substrate 110, and pixel limiting layer 150 in the display substrate shown can be connected with... Figures 15 to 17B The sub-pixel 200, substrate 110 and pixel limiting layer 150 in any of the examples shown have the same features, which will not be described again here.

[0284] For example, such as Figure 19 As shown, the material of the first sub-partition structure 741 is different from the material of the second sub-partition structure 742. For example, the material of the second sub-partition structure 742 may include any one or more of silicon nitride, silicon oxide, or silicon oxynitride, and the material of the first sub-partition structure 741 may also include any one or more of silicon nitride, silicon oxide, or silicon oxynitride, and the material of the first sub-partition structure 741 is different from the material of the second sub-partition structure 742.

[0285] For example, such as Figure 19 As shown, the plurality of sub-pixels 200 may include two adjacent sub-pixels 200 arranged along the arrangement direction of adjacent sub-pixels. For example, at least one edge of the second sub-partition structure 742 protrudes relative to a corresponding edge of the first sub-partition structure 741 to form at least one partition protrusion 7420. For example, as Figure 19 As shown, both sides of the second sub-partition structure 742 protrude relative to the corresponding edges of the first sub-partition structure 741 to form two partition protrusions 7420. For example, the two partition protrusions 7420 are arranged along the arrangement direction of adjacent sub-pixels.

[0286] For example, Figure 19 The diagram schematically shows a partition structure 140 between two adjacent sub-pixels 200. The partition structure 140 includes two partition protrusions 7420, but it is not limited to this. Two or more partition structures can be provided between two adjacent sub-pixels. Each partition structure includes at least one partition protrusion. By setting the number of partition structures and the number of partition protrusions, it is beneficial for at least one layer of the light-emitting functional layer to achieve a better disconnection effect.

[0287] For example, such as Figure 19 As shown, the orthographic projection of the surface of the first sub-partition structure 741 facing the second sub-partition structure 742 onto the substrate 110 is completely within the orthographic projection of the surface of the second sub-partition structure 742 facing the substrate 110 onto the substrate 110.

[0288] For example, such as Figure 19As shown, in the direction perpendicular to the substrate 110, the thickness of the first sub-partition structure 741 is greater than the thickness of the second sub-partition structure 742.

[0289] For example, such as Figure 19 As shown, in the direction perpendicular to the substrate 110, the thickness of the partition structure 140 is less than the thickness of the pixel defining portion 401. For example, a gap is provided between the partition structure 140 and the pixel defining portion 401.

[0290] For example, such as Figure 19 As shown, the surface of the organic layer 180 exposed by the second opening 154 of the pixel defining layer 150 on the side away from the substrate 110 can be a flat surface, that is, the surface of the organic layer 180 on the side away from the substrate 110 does not include protrusions.

[0291] For example, such as Figure 19 As shown, the first sub-partition structure 741 is disposed on the surface of the organic layer 180 away from the substrate 110.

[0292] For example, such as Figure 19 As shown, in the direction perpendicular to the substrate 110, the thickness of the second sub-blocking structure 742 is no greater than the thickness of the light-emitting functional layer 120. For example, the thickness of the second sub-blocking structure 742 can be 500 to 8000 angstroms.

[0293] For example, such as Figure 19 As shown, along the direction perpendicular to the substrate 110, the ratio of the thickness of the partition structure 140 to the thickness of the light-emitting functional layer 120 is 0.8 to 1.2. For example, the ratio of the thickness of the partition structure 140 to the thickness of the light-emitting functional layer 120 is 0.9 to 1.1. An example of an embodiment of this disclosure can be achieved by setting the thickness of the partition structure, for example, by setting the ratio of the thickness of the partition structure to the thickness of the light-emitting functional layer to 0.8 to 1.2, so that the light-emitting functional layer 120 is interrupted at the partition protrusion 7420 of the partition structure 140, while the second electrode 132 remains continuous and uninterrupted. This prevents crosstalk between adjacent sub-pixels, while ensuring the uniformity of the display by keeping the second electrode uninterrupted.

[0294] For example, Figure 19 The diagram schematically shows that all the film layers included in the light-emitting functional layer 120 are broken at the partition protrusion 7420 of the partition structure 140. However, it is not limited to this; a portion of the film layers of the light-emitting functional layer 120 may be broken at the partition protrusion 7420 of the partition structure 140, while another portion of the film layers may remain continuous at the partition protrusion 7420. The film layer broken at the partition protrusion 7420 can be considered as a misaligned film layer. By making the film layer misaligned at the partition protrusion 7420, it is beneficial to reduce the lateral crosstalk of the film layer.

[0295] certainly, Figure 19 The example shown is not limited to this; the thickness of the partition structure can also be set to be greater than the thickness of the light-emitting functional layer, so that both the light-emitting functional layer and the second electrode are disconnected at the edge of the partition structure.

[0296] For example, such as Figure 19 As shown, the first cross-section of the first sub-partition structure 741, taken along the arrangement direction of adjacent sub-pixels 200 and perpendicular to the substrate 110, includes a rectangle or a trapezoid. For example, the first cross-section is trapezoidal, and the length of the base side of the trapezoid away from the substrate 110 is greater than the length of the base side of the trapezoid near the substrate 110. For example, the angle between the side of the trapezoid and the base side of the trapezoid near the substrate 110 is not less than 70 degrees. For example, the size of the partition protrusion 7420 along the direction parallel to the substrate 110 is not less than 0.01 micrometers. For example, the size of the partition protrusion 7420 along the direction parallel to the substrate 110 is not less than 0.1 micrometers.

[0297] For example, such as Figure 19 As shown, the size of the partition protrusion 7420 can be in the range of 0.01 to 5 micrometers. For example, the angle between the side of the trapezoid and the bottom edge of the trapezoid near the substrate 110 is not less than 90 degrees. For example, the size of the partition protrusion 7420 can be in the range of 0.1 to 2 micrometers.

[0298] For example, the side of the first sub-partition structure 741 can be a straight edge or a curved edge. For example, the curved edge bends towards the side closer to the center of the first sub-partition structure 741. In this case, the angle between the curved edge of the first sub-partition structure 741 and the bottom edge near the substrate 110 can refer to the angle between the tangent at the midpoint of the curved edge and the bottom edge, or it can refer to the angle between the tangent at the intersection of the curved edge and the bottom edge and the bottom edge.

[0299] The embodiments disclosed herein can achieve the breaking of at least one film layer of the light-emitting functional layer at the partition protrusion by setting the thickness of the partition structure, the size of the partition protrusion, and the side angle of the first sub-partition structure.

[0300] For example, such as Figure 19 As shown, the second cross-section of the second sub-partition structure 742, cut along the arrangement direction of the adjacent sub-pixels 200 and perpendicular to the plane of the substrate 110, includes a rectangle or a trapezoid. For example, the second cross-section of the second sub-partition structure 742 is rectangular. By setting the short side of the second cross-section of the second sub-partition structure 742 to have a right angle or approximately a right angle with the long side of the side closer to the substrate 110 (for example, approximately a right angle can mean that the difference between the angle between the two sides and 90 degrees is not greater than 10 degrees), it is beneficial for the light-emitting functional layer 120 to be disconnected at the edge of the second sub-partition structure 742.

[0301] For example, the second cross-section of the second sub-partition structure 742 can be trapezoidal, with the angle between the side of the trapezoid and the base of the trapezoid near the substrate 110 being not less than 70 degrees. For example, the second cross-section can be trapezoidal, with the angle between the side of the trapezoid and the base of the trapezoid near the substrate 110 being not less than 90 degrees, so that the angle between the side of the second sub-partition structure 742 and the base of the trapezoid away from the substrate 110 is an acute angle, which can facilitate the breaking of the light-emitting functional layer 120 at the edge of the second sub-partition structure 742.

[0302] For example, Figure 19 The diagram schematically shows that the first sub-partition structure 741 includes a film layer and the second sub-partition structure 742 includes a film layer, but is not limited thereto. At least one of the first sub-partition structure 741 and the second sub-partition structure 742 may include multiple film layers, and at least the edge of the second sub-partition structure 742 protrudes relative to the edge of the first sub-partition structure 741 to form a partition protrusion for disconnecting at least one layer of the light-emitting functional layer.

[0303] When the side angle of the partition structure is large (such as the angle between the side of the first section and the bottom edge of the side closest to the substrate, and / or the angle between the side plate of the second section and the bottom edge of the side closest to the substrate), the overall thickness of the light-emitting functional layer is reduced, at least one film layer of the light-emitting functional layer located between adjacent sub-pixels is disconnected, which increases the resistance of the film layer and further reduces the crosstalk between adjacent sub-pixels.

[0304] For example, one embodiment of this disclosure provides a method for forming Figure 19 The method for manufacturing the display substrate shown includes forming a plurality of sub-pixels 200 on a substrate 110. The sub-pixels 200 include forming a first electrode 131, a light-emitting functional layer 120 and a second electrode 132 stacked in sequence in a direction perpendicular to the substrate 110; forming a first material layer on the substrate 110; forming a second material layer on the first material layer, the second material layer being an inorganic non-metallic material layer; and simultaneously patterning the first material layer and the second material layer to form a partition structure 140. Forming the partition structure 140 includes patterning a second material layer to form a second sub-partition structure 742, while the portion of the first material layer located directly below the second sub-partition structure 742 is etched to form a first sub-partition structure 741; along the arrangement direction of adjacent sub-pixels 200, the edge of the second sub-partition structure 742 in the partition structure 140 located between the adjacent sub-pixels 200 protrudes relative to the edge of the first sub-partition structure 741 to form a partition protrusion 7420; a light-emitting functional layer 120 is formed after the partition structure 140 is formed, the light-emitting functional layer 120 includes a plurality of film layers, at least one of the plurality of film layers being broken at the partition protrusion 7420.

[0305] For example, the second material layer is an inorganic material layer. Simultaneously patterning the first material layer and the second material layer to form the partition structure 140 includes: simultaneously etching the first material layer and the second material layer using etching solutions with different etching selectivity ratios for the first material layer and the second material layer, wherein the etching selectivity ratio of the etching solution for the first material layer is greater than the etching selectivity ratio of the etching solution for the second material layer, so that the edge of the first sub-partition structure 741 formed after the first material layer is etched is recessed relative to the edge of the second sub-partition structure 742 formed after the second material layer is etched to form an undercut structure.

[0306] For example, Figures 20A to 20D To form Figure 19 The diagram shows a flowchart illustrating the manufacturing process of the display substrate preceding the display substrate shown. Figure 19 , Figures 20A to 20D As shown, the method for manufacturing a display substrate includes: forming a plurality of sub-pixels 200 on a substrate 110, wherein forming a sub-pixel 200 includes sequentially forming a first electrode 131, a light-emitting functional layer 120, and a second electrode 132 in a direction perpendicular to the substrate 110; forming an organic material layer 180 on the substrate 110; forming an inorganic non-metallic material layer 030 on the organic material layer 180, the inorganic non-metallic material layer 030 including at least two film layers, such as film layer 031 (i.e., the first material layer) and film layer 032 (i.e., the second material layer); and patterning the inorganic non-metallic material layer 030 to form a partition structure 140. The partition structure 140 includes a first sub-partition structure 741 and a second sub-partition structure 742. The first sub-partition structure 741 is located between the second sub-partition structure 742 and the substrate 110. Along the arrangement direction of adjacent sub-pixels 200, the edge of the second sub-partition structure 742 in the partition structure 140 located between the adjacent sub-pixels 200 protrudes relative to the edge of the first sub-partition structure 741 to form a partition protrusion 7420. The light-emitting functional layer 120 is formed after the partition structure 140 is formed. The light-emitting functional layer 120 includes a plurality of film layers, at least one of which is broken at the partition protrusion 7420.

[0307] For example, forming Figure 19 The fabrication method of the substrate 110, sub-pixel 200, and pixel limiting layer 150 in the display substrate shown can be compared with... Figures 18A to 18D The fabrication methods for the substrate 110, sub-pixel 200, and pixel limiting layer 150 in the display substrate shown are the same, and will not be described again here.

[0308] For example, such as Figure 20A and Figure 20BAs shown, after the inorganic non-metallic material layer 030 is formed, it is patterned. For example, the inorganic non-metallic material layer 030 may include two film layers, such as a first inorganic non-metallic material layer 031 and a second inorganic non-metallic material layer 032. Patterning the inorganic non-metallic material layer 030 includes etching the two film layers included in the inorganic non-metallic material layer 030 using a wet etching process. The etching selectivity of the etching solution or etching gas for the first inorganic non-metallic material layer 031 is greater than that for the second inorganic non-metallic material layer 032, thereby causing the edge of the first sub-partition structure 741 formed by etching the first inorganic non-metallic material layer 031 to be recessed relative to the edge of the second sub-partition structure 742 formed by etching the second inorganic non-metallic material layer 032 to form an undercut structure, that is, to form a partition protrusion 7420.

[0309] For example, such as Figure 20C As shown, after forming the partition structure 140, the first electrode 131 of the organic light-emitting element 210, which forms a sub-pixel, is patterned on the planarization layer 180. The method and materials used to form the first electrode 131 in this example are comparable to... Figure 18C The method and materials used to form the first electrode 131 are the same as those shown, and will not be described again here.

[0310] For example, such as Figure 20D As shown, after forming the first electrode 131, a pixel defining layer 150 can be formed. The method and materials used to form the pixel defining layer 150 in this example are comparable to... Figure 18D The method and materials used to form the pixel-defining layer 150 shown are the same and will not be described again here. For example, the steps after forming the pixel-defining layer in this example can be the same as... Figure 15 The steps after the pixel definition layer is formed on the display substrate are the same, and will not be repeated here.

[0311] For example, Figure 21 This is a partial cross-sectional structural diagram of a display substrate provided according to another example of an embodiment of the present disclosure. Figure 21 The display substrate in the example shown is Figure 19 The difference in the display substrate in the example shown is that the partition structure 140 also includes a third sub-partition structure 743. Figure 21 The sub-pixel 200, substrate 110, and pixel limiting layer 150 in the display substrate shown can be connected with... Figures 15 to 17B as well as Figure 19 The sub-pixel 200, substrate 110 and pixel limiting layer 150 in any of the examples shown have the same features, which will not be described again here. Figure 21 The material, shape, and dimensional relationship between the first sub-partition structure 741 and the second sub-partition structure 742 in the display substrate shown can be compared with... Figure 5The first sub-partition structure 741 and the second sub-partition structure 742 in the display substrate have the same material, shape and size relationship, which will not be described again here.

[0312] For example, such as Figure 21 As shown, the third sub-partition structure 743 is located between the first sub-partition structure 741 and the substrate 110. Along the arrangement direction of the adjacent sub-pixels 200, the edge of the first sub-partition structure 741 in the partition structure 140 between the adjacent sub-pixels 200 protrudes relative to the edge of the third sub-partition structure 743, and the third sub-partition structure 743 and the organic layer 180 are an integrated structure.

[0313] For example, such as Figure 21 As shown, the third sub-partition structure 743 can be a portion of the organic layer 180. For example, the third sub-partition structure 743 can be a portion of the organic layer 180 that protrudes away from the substrate 110. For example, the first sub-partition structure 741 can be located on the portion of the organic layer 180 that protrudes away from the substrate 110.

[0314] For example, such as Figure 21 As shown, the material of the third sub-partition structure 743 includes photoresist, polyimide (PI) resin, acrylic resin, silicone compound, or polyacrylic resin.

[0315] For example, such as Figure 21 As shown, the thickness of the third sub-partition structure 743 can be 100 to 10,000 angstroms. For example, the thickness of the third sub-partition structure 743 can be 200 to 2,000 angstroms.

[0316] For example, the cross-section of the third sub-partition structure 743 cut along the arrangement direction of the adjacent sub-pixels 200 and perpendicular to the plane of the substrate 110 includes a rectangle. For example, the cross-section of the third sub-partition structure 743 cut along the arrangement direction of the adjacent sub-pixels 200 and perpendicular to the plane of the substrate 110 includes a trapezoid, wherein the angle between the side of the trapezoid and the base of the trapezoid near the substrate 110 is not greater than 90 degrees.

[0317] For example, such as Figure 21 As shown, the length of the upper base of the trapezoidal cross-section of the third sub-partition structure 743 is less than the length of the side of the cross-section of the first sub-partition structure 741 closest to the substrate 110.

[0318] For example, the side of the third sub-partition structure 743 can be a straight side or a curved side. For example, the curved side bends away from the center of the third sub-partition structure 743, or the curved side bends towards the center of the third sub-partition structure 743. In this case, the angle between the curved side of the third sub-partition structure 743 and the lower base can refer to the angle between the tangent at the midpoint of the curved side and the lower base, or it can refer to the angle between the tangent at the intersection of the curved side and the lower base.

[0319] For example, forming Figure 21 The partition structure and its formation are shown. Figure 19 The difference in the partition structure shown is that the inorganic non-metallic material layer 030 is etched by dry etching to form the first sub-partition structure 741 and the second sub-partition structure 742, while the portion of the organic material layer 180 located directly below the first sub-partition structure 741 is dry-etched to form the third sub-partition structure 743. For example, a mask can be used to shield the inorganic non-metallic material layer 030 at the location where the first sub-partition structure 741 and the second sub-partition structure 742 are to be formed, so that the inorganic non-metallic material layer 030 at other locations besides the location where the first sub-partition structure 741 and the second sub-partition structure 742 are to be formed can be etched. During the dry etching process of the inorganic non-metallic material layer 030, the etching gas will etch the part of the organic material layer 180 that is not shielded by the mask, so that an organic material layer (i.e., the third sub-partition structure 743) of a certain thickness is retained directly below the inorganic non-metallic material layer (i.e., the first sub-partition structure 741 and the second sub-partition structure 742) after etching. This results in a protrusion on the side of the organic material layer 180 away from the substrate 110, which is located directly below the first sub-partition structure 741 and the second sub-partition structure 742. This protrusion is the third sub-partition structure 743. This example is not limited to this. Alternatively, the first sub-partition structure 741 and the second sub-partition structure 742 can be formed first by wet etching, and then the third sub-partition structure 743 can be formed by dry etching; or the first sub-partition structure 741, the second sub-partition structure 742 and the third sub-partition structure 743 can be formed by dry etching followed by wet etching.

[0320] For example, such as Figure 20A and Figure 20B As shown, during the dry etching process of the inorganic non-metallic material layer 030, the thickness of the organic material layer 180 etched can be 100 to 10,000 angstroms, and the thickness of the formed third sub-partition structure 743 can also be 100 to 10,000 angstroms. For example, during the dry etching process of the inorganic non-metallic material layer 030, the thickness of the organic material layer 180 etched can be 200 to 2,000 angstroms, and the thickness of the formed third sub-partition structure 743 can also be 200 to 2,000 angstroms.

[0321] At least one embodiment of this disclosure also provides a display substrate. Figure 22 This is a schematic diagram of another display substrate provided in an embodiment of the present disclosure. Figure 22 As shown, the display substrate 100 includes a substrate 110 and a plurality of sub-pixels (not shown); the plurality of sub-pixels are located on the substrate 110, and each sub-pixel includes a light-emitting element; each light-emitting element includes a light-emitting functional layer and a first electrode 131 and a second electrode (not shown) located on both sides of the light-emitting functional layer, the first electrode 131 being located between the light-emitting functional layer and the substrate 110; the second electrode is at least partially located on the side of the light-emitting functional layer away from the first electrode 131. It should be noted that the specific structures of the sub-pixels, light-emitting elements, and light-emitting functional layers can be found in [reference needed]. Figure 1 and Figure 2 This will not be elaborated further here.

[0322] like Figure 22 As shown, the display substrate 100 further includes a pixel partition structure 140, which is located on the substrate 110 and between adjacent sub-pixels; at least one of the plurality of sub-functional film layers in the light-emitting functional layer is disconnected at the location of the pixel partition structure 140. The display substrate 100 also includes a pixel defining layer 150; the pixel defining layer 150 is partially located on the side of the first electrode 131 away from the substrate 110; the pixel defining layer 150 includes a plurality of pixel openings 152; the plurality of pixel openings 152 correspond one-to-one with a plurality of sub-pixels 200 to define the effective light-emitting area of ​​the plurality of sub-pixels 200; the pixel openings 152 are configured to expose the first electrode 131 so that the first electrode 131 can contact the subsequently formed light-emitting functional layer 120.

[0323] like Figure 22 As shown, the pixel isolation structure 140 includes a recessed structure 140C and a blocking portion 140S. The recessed structure 140C is located at the edge of the first electrode 131 and is recessed into the pixel defining layer 150. The blocking portion 140S is located on the side of the recess 140C away from the substrate 110 and is part of the pixel defining layer 150. Thus, the conductive sublayer of the light-emitting functional layer is disconnected at the location of the blocking portion. Therefore, by providing the above-described pixel isolation structure between adjacent sub-pixels, the display substrate can avoid crosstalk between adjacent sub-pixels caused by the highly conductive sub-functional layer in the light-emitting functional layer.

[0324] On the other hand, because this display substrate can avoid crosstalk between adjacent sub-pixels through a pixel separation structure, it can increase pixel density while employing a dual-layer tandem EL design. Therefore, this display substrate has advantages such as long lifespan, low power consumption, high brightness, and high resolution.

[0325] In some examples, such as Figure 22 As shown, the orthographic projection of the concave structure 140C on the substrate 110 overlaps with the orthographic projection of the shielding portion 140S on the substrate 110.

[0326] Figure 23 This is a schematic diagram of another display substrate provided in an embodiment of the present disclosure. Figure 23 As shown, the concave structure 140C includes a residual structure 140R located near the defining layer 150 of the concave structure 140.

[0327] In some examples, such as Figure 23 As shown, the material of the residual structure 140R includes metals, such as silver.

[0328] One embodiment of this disclosure also provides a display substrate. Figure 24 This is a schematic diagram of another display substrate provided in an embodiment of the present disclosure. Figure 24 The display substrate shown provides another pixel separation structure. For example... Figure 24 As shown, the display substrate 100 further includes a pixel defining layer 150 located on the substrate 110; the pixel defining layer 150 is partially located on the side of the first electrode 131 away from the substrate 110; the pixel defining layer 150 includes a plurality of pixel openings 152 and pixel spacing openings 154; the plurality of pixel openings 152 correspond one-to-one with a plurality of sub-pixels 200 to define the effective light-emitting area of ​​the plurality of sub-pixels 200; the pixel openings 152 are configured to expose the first electrode 131 so that the first electrode 131 can contact the subsequently formed light-emitting functional layer 120. The pixel spacing openings 154 are located between adjacent first electrodes 131, and at least a portion of the partition structure 140 is located within the pixel spacing openings 154.

[0329] like Figure 24 As shown, the pixel isolation structure 140 includes a recessed structure 140C and a blocking portion 140S. The recessed structure 140C is located at the edge of the pixel spacing opening 154 and is recessed into the pixel defining layer 150. For example, the recessed structure 140C may be recessed into the pixel defining layer 150 in a direction parallel to the substrate 110. The blocking portion 140S is located on the side of the recess 140C away from the substrate 110 and is part of the pixel defining layer 150. As a result, the conductive sublayer of the light-emitting functional layer is disconnected at the location of the blocking portion. Thus, by providing the above-described pixel isolation structure between adjacent sub-pixels, the display substrate can avoid crosstalk between adjacent sub-pixels caused by the highly conductive sub-functional layer in the light-emitting functional layer.

[0330] Figure 25 This is a schematic diagram of another display substrate provided in an embodiment of the present disclosure. Figure 25As shown, the concave structure 140C includes a residual structure 140R located near the defining layer 150 of the concave structure 140.

[0331] In some examples, such as Figure 25 As shown, the material of the residual structure 140R includes at least one of a metal, a metal oxide, and an organic compound; the metal may be silver, the metal oxide may be indium zinc oxide, and the organic compound may be a fluoropolymer.

[0332] In some examples, when the material of the residual structure 140 is a fluoropolymer, the planarization layer material includes photoresist, polyimide (PI) resin, acrylic resin, silicone compound, or polyacrylic acid resin. Therefore, the solvent for the planarization layer is primarily a non-fluorinated organic solvent. While these photoresists may contain small amounts of fluorine, they are not sufficiently soluble in fluorinated solutions or perfluorinated solvents. Therefore, their orthogonal properties (the solution and solvent do not react with each other) allow for the formation of the aforementioned pixel separation structure using an etching process.

[0333] For example, the aforementioned fluorinated polymer can be a photosensitive fluorinated polymer, which is a polymer similar to a negative photoresist. Compared to conventional photoresists, this polymer has a fluorine content of 40-70%, and must be dissolved in a perfluorinated solvent, such as HFE7100 or HFE7500. However, perfluorinated solvents cannot dissolve PLN (due to insufficient fluorine content), and the fluorinated polymer is also insoluble in PLN solvents. These two photoresists and their solvents are orthogonal.

[0334] For example, the chemical formula of the fluoropolymer mentioned above is shown below:

[0335]

[0336] In this context, R1 represents alkyl groups, H, etc., and R2 represents fluorine-containing groups.

[0337] Figures 26A-26C This is a schematic diagram illustrating the steps of another method for manufacturing a display substrate according to an embodiment of the present disclosure. The method for manufacturing the display substrate includes:

[0338] like Figure 26A As shown, a first electrode 131 and a sacrificial structure 430 are formed on the side of the planarization layer 180 away from the substrate 110. It should be noted that the aforementioned residual structure may be part of the sacrificial structure.

[0339] like Figure 26BAs shown, a pixel defining layer 150 is formed on the side of the first electrode 131 and the sacrificial structure 430 away from the substrate 110. The pixel defining layer 150 includes a plurality of pixel openings 152 and pixel spacing openings 154; the plurality of pixel openings 152 are disposed one-to-one with a plurality of first electrodes 131; the pixel openings 152 are configured to expose the first electrodes 131 so that the first electrodes 131 can contact the subsequently formed light-emitting functional layer 120. The pixel spacing openings 154 are located between adjacent first electrodes 131, and the sacrificial structure 430 is partially exposed by the pixel spacing openings 154.

[0340] like Figure 26C As shown, the display substrate is etched using the pixel limiting layer 150 as a mask to remove the sacrificial structure 430, thereby forming the aforementioned pixel separation structure 140.

[0341] Figure 27 This is a schematic diagram of another display substrate provided in an embodiment of the present disclosure. Figure 27 As shown, the display substrate 100 also includes a protective structure 240 located on the planarization layer 180 and disposed in the same layer as the first electrode 131; the pixel isolation structure 140 is disposed on the side of the protective structure 240 away from the substrate 110 and located at the edge of the protective structure 240. Thus, the protective structure 240 can protect the planarization layer 180 during the etching process used to fabricate the pixel isolation structure 140, preventing the planarization layer 180 from being etched.

[0342] In some examples, such as Figure 27 As shown, the display substrate 100 also includes a light-emitting functional layer 120 and a second electrode 132; the light-emitting functional layer 120 is located on the side of the first electrode 131, pixel limiting layer 150, and protective structure 240 away from the substrate 110. Due to the effect of the pixel blocking structure 140, the light-emitting functional layer 120 will be broken at the location of the pixel blocking structure 140, forming a break; at this time, the subsequently formed second electrode 132 can be connected to the protective structure 240 through the break, and the protective structure 240 can act as an auxiliary electrode.

[0343] In this display substrate, the second electrode is a shared electrode for multiple sub-pixels to provide cathode signals to multiple sub-pixels; even if part of the second electrode in the entire display substrate is disconnected due to pixel isolation structure or other reasons, the protective structure, as an auxiliary electrode, can connect the disconnected part of the second electrode to other parts.

[0344] Figures 28A-28D This is a schematic diagram illustrating the steps of another method for manufacturing a display substrate according to an embodiment of the present disclosure. The method for manufacturing the display substrate includes:

[0345] like Figure 28AAs shown, a first electrode 131, a protective structure 240, and a sacrificial structure 430 are formed on the side of the planarization layer 180 away from the substrate 110. The protective structure 240 is disposed in the same layer as the first electrode 131. The material of the protective structure 240 is the same as that of the first electrode 131, but the material of the protective structure 240 is different from that of the sacrificial structure 430.

[0346] like Figure 28B As shown, a pixel defining layer 150 is formed on the side of the first electrode 131 and the sacrificial structure 430 away from the substrate 110. The pixel defining layer 150 includes a plurality of pixel openings 152 and pixel spacing openings 154; the plurality of pixel openings 152 are disposed one-to-one with a plurality of first electrodes 131; the pixel openings 152 are configured to expose the first electrodes 131 so that the first electrodes 131 can contact the subsequently formed light-emitting functional layer 120. The pixel spacing openings 154 are located between adjacent first electrodes 131, and the sacrificial structure 430 is partially exposed by the pixel spacing openings 154.

[0347] like Figure 28C As shown, the display substrate is etched using the pixel limiting layer 150 as a mask to remove the sacrificial structure 430, thereby forming the pixel separation structure 140 described above.

[0348] like Figure 28D As shown, a light-emitting functional layer 120 and a second electrode 132 are formed on the side of the first electrode 131, the pixel defining layer 150, and the protective structure 240 away from the substrate 110. Due to the effect of the pixel blocking structure 140, the light-emitting functional layer 120 will be broken at the location of the pixel blocking structure 140, forming a break; at this time, the subsequently formed second electrode 132 can be connected to the protective structure 240 through the break, and the protective structure 240 can act as an auxiliary electrode.

[0349] In this display substrate, the second electrode is a shared electrode for multiple sub-pixels to provide cathode signals to multiple sub-pixels; even if part of the second electrode in the entire display substrate is disconnected due to pixel isolation structure or other reasons, the protective structure, as an auxiliary electrode, can connect the disconnected part of the second electrode to other parts.

[0350] Figure 29 This is a partial planar schematic diagram of a display substrate provided according to an embodiment of the present disclosure. For example... Figure 29As shown, the plurality of sub-pixels 200 includes a plurality of first-color sub-pixels 201, a plurality of second-color sub-pixels 202, and a plurality of third-color sub-pixels 203; the third-color sub-pixels 203, the second-color sub-pixels 202, and the first-color sub-pixels 201 are arranged sequentially along a first direction X to form a pixel group 350; the plurality of pixel groups 350 are arranged along the first direction X to form a pixel row 330; the plurality of pixel rows 330 are arranged along a second direction Y to form an array. At this time, the pixel partition structure 140 is disposed between the first-color sub-pixels 201 and the second-color sub-pixels 202.

[0351] For example, the first color sub-pixel can be a red sub-pixel and is configured to emit red light; the second color sub-pixel can be a green sub-pixel and is configured to emit green light; and the third color sub-pixel can be a blue sub-pixel and is configured to emit blue light.

[0352] When this display substrate is in operation, the red and blue subpixels have small parasitic capacitances and are relatively easy to emit light; while the green subpixels have large parasitic capacitances and are not easy to emit light. Furthermore, from the perspective of organic light-emitting devices, the red subpixel has the narrowest bandgap and requires the least energy, making it most susceptible to crosstalk voltage. Therefore, crosstalk between subpixels mostly occurs between the red and green subpixels. Thus, by placing a pixel isolation structure between the red and green subpixels, this display substrate can effectively avoid crosstalk between them. Additionally, this display substrate does not place pixel isolation structures between the red and blue subpixels, nor between the blue and green subpixels, thereby reducing aperture ratio loss.

[0353] Figure 30 This is a partial planar schematic diagram of a display substrate provided according to an embodiment of the present disclosure. For example... Figure 30 As shown, the plurality of sub-pixels 200 includes a plurality of first-color sub-pixels 201, a plurality of second-color sub-pixels 202, and a plurality of third-color sub-pixels 203; the third-color sub-pixels 203, the second-color sub-pixels 202, and the first-color sub-pixels 201 are arranged sequentially along a first direction X to form a pixel group 350; the plurality of pixel groups 350 are arranged along the first direction X to form a pixel row 330; the plurality of pixel rows 330 are arranged along a second direction Y to form an array. In this case, the pixel separation structure 140 can be disposed not only between the first-color sub-pixels 201 and the second-color sub-pixels 202, but also between the second-color sub-pixels 202 and the third-color sub-pixels 203. Therefore, the display substrate can effectively avoid crosstalk between sub-pixels.

[0354] In some examples, such as Figure 30As shown, the area occupied by the pixel partition structure 140 between the second color sub-pixel 202 and the third color sub-pixel 203 (the area of ​​the pixel partition structure projected onto the substrate) is larger than the area occupied by the pixel partition structure 140 between the first color sub-pixel 201 and the second color sub-pixel 202. Therefore, this display substrate effectively avoids crosstalk between sub-pixels while reducing the area occupied by the pixel partition structure between the first color sub-pixel and the second color sub-pixel, and by not providing a pixel partition structure between the first color sub-pixel and the third color sub-pixel, thus reducing the loss in aperture ratio.

[0355] In some examples, such as Figure 30 As shown, the pixel partition structure 140 between the second color sub-pixel 202 and the third color sub-pixel 203 has a larger dimension in the second direction than the pixel partition structure 140 between the first color sub-pixel 201 and the second color sub-pixel 202 in the second direction. Therefore, the display substrate can reduce the area occupied by the pixel partition structure between the first color sub-pixel and the second color sub-pixel by reducing the dimension of the pixel partition structure 140 in the second direction.

[0356] For example, the first color sub-pixel can be a red sub-pixel and is configured to emit red light; the second color sub-pixel can be a green sub-pixel and is configured to emit green light; and the third color sub-pixel can be a blue sub-pixel and is configured to emit blue light.

[0357] Figure 31 This is a partial planar schematic diagram of a display substrate provided according to an embodiment of the present disclosure. For example... Figure 31 As shown, the plurality of sub-pixels 200 includes a plurality of first-color sub-pixels 201, a plurality of second-color sub-pixels 202, and a plurality of third-color sub-pixels 203; the third-color sub-pixels 203, the second-color sub-pixels 202, and the first-color sub-pixels 201 are arranged sequentially along a first direction X to form a pixel group 350; the plurality of pixel groups 350 are arranged along the first direction X to form a pixel row 330; the plurality of pixel rows 330 are arranged along a second direction Y to form an array. In this case, the pixel separation structure 140 can be disposed not only between the first-color sub-pixels 201 and the second-color sub-pixels 202, but also between the second-color sub-pixels 202 and the third-color sub-pixels 203. Therefore, the display substrate can effectively avoid crosstalk between sub-pixels.

[0358] In some examples, such as Figure 31As shown, the area occupied by the pixel partition structure 140 between the second color sub-pixel 202 and the third color sub-pixel 203 (the area of ​​the pixel partition structure projected onto the substrate) is larger than the area occupied by the pixel partition structure 140 between the first color sub-pixel 201 and the second color sub-pixel 202. Therefore, this display substrate effectively avoids crosstalk between sub-pixels while reducing the area occupied by the pixel partition structure between the first color sub-pixel and the second color sub-pixel, and by not providing a pixel partition structure between the first color sub-pixel and the third color sub-pixel, thus reducing the loss in aperture ratio.

[0359] In some examples, such as Figure 31 As shown, the pixel partition structure 140 between the second color sub-pixel 202 and the third color sub-pixel 203 has a larger dimension in the second direction than the pixel partition structure 140 between the first color sub-pixel 201 and the second color sub-pixel 202 in the second direction. Furthermore, the pixel partition structure 140 between the second color sub-pixel 202 and the third color sub-pixel 203 has a larger dimension in the first direction than the pixel partition structure 140 between the first color sub-pixel 201 and the second color sub-pixel 202 in the first direction. Therefore, the display substrate can reduce the area occupied by the pixel partition structure between the first color sub-pixel and the second color sub-pixel by reducing the dimensions of the pixel partition structure 140 in both the first and second directions.

[0360] For example, the first color sub-pixel can be a red sub-pixel and is configured to emit red light; the second color sub-pixel can be a green sub-pixel and is configured to emit green light; and the third color sub-pixel can be a blue sub-pixel and is configured to emit blue light.

[0361] Figure 32 This is a partial planar schematic diagram of a display substrate provided according to an embodiment of the present disclosure. For example... Figure 32 As shown, the plurality of sub-pixels 200 includes a plurality of first-color sub-pixels 201, a plurality of second-color sub-pixels 202, and a plurality of third-color sub-pixels 203. The third-color sub-pixels 203, second-color sub-pixels 202, and first-color sub-pixels 201 are arranged sequentially along a first direction X to form a pixel group 350. At this time, the pixel separation structure 140 can be set around the second-color sub-pixels 202. Therefore, the pixel separation structure 140 can separate the second-color sub-pixels 202 from other sub-pixels, thereby avoiding crosstalk between the second-color sub-pixels and adjacent sub-pixels. It should be noted that, although... Figure 32 The first annular partition shown is configured around only one second color sub-pixel, but embodiments of this disclosure include, but are not limited to, the first annular partition may also surround two or more second color sub-pixels.

[0362] Figure 33This is a partial planar schematic diagram of a display substrate provided according to an embodiment of the present disclosure. For example... Figure 32 As shown, the plurality of sub-pixels 200 includes a plurality of first-color sub-pixels 201, a plurality of second-color sub-pixels 202, and a plurality of third-color sub-pixels 203. The third-color sub-pixels 203, second-color sub-pixels 202, and first-color sub-pixels 201 are arranged sequentially along a first direction X to form a pixel group 350. At this time, the pixel partition structure 140 may be set at least partially around the second-color sub-pixels 202. Thus, the pixel partition structure 140 can separate the second-color sub-pixels 202 from other sub-pixels, thereby avoiding crosstalk between the second-color sub-pixels and adjacent sub-pixels.

[0363] In some examples, such as Figure 33 As shown, the pixel partition structure 140 includes two L-shaped sub-parts that surround the second color sub-pixel 202.

[0364] Figure 34 This is a partial planar schematic diagram of a display substrate provided according to an embodiment of the present disclosure. For example... Figure 34 As shown, the plurality of sub-pixels 200 includes a plurality of first-color sub-pixels 201, a plurality of second-color sub-pixels 202, and a plurality of third-color sub-pixels 203; the second-color sub-pixels 202 and the first-color sub-pixels 201 are arranged along a second direction Y to form a sub-pixel pair, and the third-color sub-pixels 203 are arranged alternately with the sub-pixel pair along a first direction. In this case, the pixel partition structure 140 can be at least partially disposed around the second-color sub-pixels 202, and disposed between the first-color sub-pixels 201 and the second-color sub-pixels 202, and between the second-color sub-pixels 202 and the third-color sub-pixels 203. Therefore, this pixel partition structure can effectively avoid crosstalk between sub-pixels and reduce the loss of aperture ratio.

[0365] In some examples, such as Figure 34 As shown, the orthographic projection of the pixel partition structure 140 onto the substrate is L-shaped, with the two sides of the L-shape located between the first color sub-pixel 201 and the second color sub-pixel 202, and between the second color sub-pixel 202 and the third color sub-pixel 203, respectively.

[0366] Figure 35 This is a partial planar schematic diagram of a display substrate provided according to an embodiment of the present disclosure. For example... Figure 35As shown, the plurality of sub-pixels 200 includes a plurality of first-color sub-pixels 201, a plurality of second-color sub-pixels 202, and a plurality of third-color sub-pixels 203; the second-color sub-pixels 202 and the first-color sub-pixels 201 are arranged along a second direction Y to form a sub-pixel pair, and the third-color sub-pixels 203 are arranged alternately with the sub-pixel pair along a first direction. At this time, a pixel separation structure 140 is disposed between the first-color sub-pixels 201 and the second-color sub-pixels 202, between the second-color sub-pixels 202 and the third-color sub-pixels 203, and between the first-color sub-pixels 201 and the third-color sub-pixels 203. Therefore, this pixel separation structure can effectively avoid crosstalk between sub-pixels.

[0367] In some examples, such as Figure 35 As shown, the pixel partition structure 140 includes three strip-shaped portions 140P, which are respectively disposed between the first color sub-pixel 201 and the second color sub-pixel 202, between the second color sub-pixel 202 and the third color sub-pixel 203, and between the first color sub-pixel 201 and the third color sub-pixel 203.

[0368] Figure 36 This is a partial planar schematic diagram of a display substrate provided according to an embodiment of the present disclosure. For example... Figure 36 As shown, the plurality of sub-pixels 200 includes a plurality of first-color sub-pixels 201, a plurality of second-color sub-pixels 202, and a plurality of third-color sub-pixels 203; the second-color sub-pixels 202 and the first-color sub-pixels 201 are arranged along a second direction Y to form a sub-pixel pair, and the third-color sub-pixels 203 are arranged alternately with the sub-pixel pair along a first direction. At this time, a pixel partition structure 140 is disposed between the first-color sub-pixels 201 and the second-color sub-pixels 202, and between the second-color sub-pixels 202 and the third-color sub-pixels 203. Therefore, this pixel partition structure can effectively avoid crosstalk between sub-pixels and reduce the loss of aperture ratio.

[0369] In some examples, such as Figure 36 As shown, the pixel partition structure 140 includes two strip-shaped portions, which are respectively disposed between the first color sub-pixel 201 and the second color sub-pixel 202 and between the second color sub-pixel 202 and the third color sub-pixel 203.

[0370] Figure 37 This is a partial planar schematic diagram of a display substrate provided according to an embodiment of the present disclosure. For example... Figure 37As shown, the plurality of sub-pixels 200 includes a plurality of first-color sub-pixels 201, a plurality of second-color sub-pixels 202, and a plurality of third-color sub-pixels 203; the second-color sub-pixels 202 and the first-color sub-pixels 201 are arranged along a second direction Y to form a sub-pixel pair, and the third-color sub-pixels 203 are arranged alternately with the sub-pixel pair along a first direction. At this time, a pixel separation structure 140 is disposed between the first-color sub-pixels 201 and the second-color sub-pixels 202, between the second-color sub-pixels 202 and the third-color sub-pixels 203, and between the first-color sub-pixels 201 and the third-color sub-pixels 203. Therefore, this pixel separation structure can effectively avoid crosstalk between sub-pixels.

[0371] In some examples, such as Figure 37 As shown, the pixel separation structure 140 includes three strip-shaped portions 140P, which are respectively disposed between the first color sub-pixel 201 and the second color sub-pixel 202, between the second color sub-pixel 202 and the third color sub-pixel 203, and between the first color sub-pixel 201 and the third color sub-pixel 203; and each strip-shaped portion 140P may include multiple notches 140N to form a channel that ensures the connection of the second electrode.

[0372] Figure 38 This is a partial planar schematic diagram of a display substrate provided according to an embodiment of the present disclosure. For example... Figure 38 As shown, the plurality of sub-pixels 200 includes a plurality of first color sub-pixels 201, a plurality of second color sub-pixels 202, and a plurality of third color sub-pixels 203; with the first color sub-pixel 201 as the center, four second color sub-pixels 202 are arranged along the diagonal of the first color sub-pixel 201; the four first color sub-pixels 201 are respectively arranged on the side of the four second color sub-pixels 202 away from the first color sub-pixel 201 located at the center, to form an X-shaped structure; the four third color sub-pixels 203 are arranged in the four regions divided by the X-shaped structure. At this time, the pixel partition structure 140 is arranged between the first color sub-pixels 201 and the second color sub-pixels 202. Thus, this pixel partition structure can effectively avoid crosstalk between sub-pixels and reduce the loss of aperture ratio.

[0373] In some examples, such as Figure 38 As shown, the orthographic projection of the first color sub-pixel 201 onto the substrate can be rectangular, the orthographic projection of the second color sub-pixel 202 onto the substrate can be rectangular, and the orthographic projection of the third color sub-pixel 203 onto the substrate can be fan-shaped.

[0374] One embodiment of this disclosure provides a display substrate. Figure 39 This is a plan view of a display substrate provided according to an embodiment of the present disclosure; Figure 40A display substrate provided in one embodiment of this disclosure is along Figure 39 A cross-sectional view along the AB direction.

[0375] like Figure 39 and Figure 40 As shown, the display substrate 100 includes a substrate 110 and a plurality of sub-pixels 200. The plurality of sub-pixels 200 are located on the substrate 110, and each sub-pixel 200 includes a light-emitting element 210. Each light-emitting element 210 includes a light-emitting functional layer 120 and a first electrode 131 and a second electrode 132 located on both sides of the light-emitting functional layer 120. The first electrode 131 is located between the light-emitting functional layer 120 and the substrate 110. The second electrode 132 is at least partially located on the side of the light-emitting functional layer 120 away from the first electrode 131; that is, the first electrode 131 and the second electrode 132 are located on opposite sides in a direction perpendicular to the light-emitting functional layer 120. The light-emitting functional layer 120 includes a plurality of sub-functional layers, including conductive sub-layers 129 with high conductivity. It should be noted that the aforementioned light-emitting functional layers do not only include film layers that directly emit light, but also include functional film layers for assisting light emission, such as hole transport layers and electron transport layers.

[0376] For example, the conductive sublayer 129 may be a charge generation layer. For example, the first electrode 131 may be an anode, and the second electrode 132 may be a cathode. For example, the cathode may be formed of a material with high conductivity and low work function; for example, the cathode may be made of a metallic material. For example, the anode may be formed of a transparent conductive material with a high work function.

[0377] like Figure 39 and Figure 40 As shown, the display substrate 100 also includes a partition structure 140, which is located on the substrate 110 and between adjacent sub-pixels 200; the charge generation layer 129 in the light-emitting functional layer 120 is broken at the location of the partition structure 140. It should be noted that the charge generation layer in the light-emitting functional layer is a discontinuous structure or a non-integral structure at the broken position.

[0378] In the display substrate provided in this embodiment, by providing a partition structure between adjacent sub-pixels and disconnecting the charge generation layer in the light-emitting functional layer at the location of the partition structure, crosstalk between adjacent sub-pixels caused by the highly conductive charge generation layer is avoided. Furthermore, since this display substrate can avoid crosstalk between adjacent sub-pixels through the partition structure, it can increase pixel density while employing a tandem EL design. Therefore, this display substrate can have advantages such as long lifespan, low power consumption, high brightness, and high resolution.

[0379] In some examples, "adjacent subpixels" means that no other subpixels are set between two subpixels.

[0380] In some examples, such as Figure 39 and Figure 40 As shown, the line connecting the brightness centers of two adjacent sub-pixels 200 passes through the partition structure 140. Because the charge generation layer has a smaller dimension and lower resistance in the direction of this line's extension, charge can easily transfer from one of the two adjacent sub-pixels through the charge generation layer along the extension direction of the line to the other. Therefore, by allowing the line to pass through the partition structure, the display substrate effectively blocks the shortest path of charge propagation, thereby effectively avoiding crosstalk between adjacent sub-pixels. It should be noted that the brightness center of each sub-pixel can be the geometric center of its effective light-emitting area. Of course, embodiments of this disclosure include, but are not limited to, the brightness center of each sub-pixel can also be the location of the sub-pixel's maximum luminance.

[0381] In some examples, such as Figure 39 and Figure 40 As shown, the display substrate 100 further includes a pixel defining layer 150 located on the substrate 110; the pixel defining layer 150 is partially located on the side of the first electrode 131 away from the substrate 110; the pixel defining layer 150 includes a plurality of pixel openings 152 and pixel spacing openings 154; the plurality of pixel openings 152 correspond one-to-one with a plurality of sub-pixels 200 to define the effective light-emitting area of ​​the plurality of sub-pixels 200; the pixel openings 152 are configured to expose the first electrode 131 so that the first electrode 131 can contact the subsequently formed light-emitting functional layer 120. The pixel spacing openings 154 are located between adjacent first electrodes 131, and at least a portion of the partition structure 140 is located in the pixel spacing openings 154. Thus, the display substrate can avoid fabricating the partition structure on the pixel defining layer, thereby avoiding increasing the thickness of the display substrate. Of course, the embodiments of this disclosure include, but are not limited to, the pixel defining layer may not have the above-mentioned pixel spacing openings, so that the partition structure can be directly disposed on the pixel defining layer, or the partition structure can be fabricated using the pixel defining layer.

[0382] For example, the material of the pixel defining layer may include organic materials such as polyimide, acrylic, or polyethylene terephthalate.

[0383] In some examples, such as Figure 40As shown, the partition structure 140 can be a partition post; in this case, the partition structure 140 includes a first partition portion 1405 and a second partition portion 1406 stacked together. The first partition portion 1405 is located on the side of the second partition portion 1406 near the substrate 110; the second partition portion 1406 has a protrusion 1407 extending beyond the first partition portion 1405 in the arrangement direction of two adjacent sub-pixels 200, and the conductive sublayer 129 of the light-emitting functional layer 120 is disconnected at the protrusion 1407. Thus, this partition structure can disconnect the conductive sublayer of the light-emitting functional layer. It should be noted that the partition structure provided in this embodiment is not limited to the form of the partition post described above. Other structures that can disconnect the conductive sublayer of the light-emitting functional layer can also be used; in addition, the arrangement direction described above can be the extension direction of the line connecting the brightness centers of two adjacent sub-pixels.

[0384] In some examples, such as Figure 40 As shown, multiple sub-pixels 200 share a second electrode 132, and the second electrode 132 is disconnected at the location of the partition structure 140. However, embodiments of this disclosure include, but are not limited to, the second electrode may not be disconnected at the location of the partition structure.

[0385] In some examples, such as Figure 40 As shown, the light-emitting functional layer 120 includes a first light-emitting layer 121 and a second light-emitting layer 122 located on both sides of the conductive sublayer 129 in a direction perpendicular to the substrate 110. The conductive sublayer 129 is a charge generation layer. Thus, the display substrate can realize a dual-layer light-emitting (Tandem EL) design, and therefore has the advantages of long lifespan, low power consumption, and high brightness.

[0386] In some examples, such as Figure 40 As shown, the first light-emitting layer 121 and the second light-emitting layer 122 in the light-emitting functional layer 120 are also disconnected at the location of the partition structure 140. However, embodiments of this disclosure include, but are not limited to, the first light-emitting layer and the second light-emitting layer in the light-emitting functional layer may not be disconnected at the location of the partition structure, but only the electronic layer is disconnected at the location of the partition structure.

[0387] In some examples, the conductivity of the conductive sublayer 129 is greater than that of the first light-emitting layer 121 and the second light-emitting layer 122, but less than that of the second electrode 132.

[0388] For example, such as Figure 40 As shown, the first light-emitting layer 121 is located on the side of the conductive sublayer 129 closer to the substrate 110; the second light-emitting layer 122 is located on the side of the conductive sublayer 129 away from the substrate 110.

[0389] It should be noted that the light-emitting functional layer may also include other sub-functional layers besides the conductive layer, the first light-emitting layer and the second light-emitting layer, such as the hole injection layer, the hole transport layer, the electron injection layer and the electron transport layer.

[0390] For example, the materials for the first and second light-emitting layers can be selected from pyrene derivatives, anthracene derivatives, fluorene derivatives, perylene derivatives, styrene-amine derivatives, metal complexes, etc.

[0391] For example, the material of the hole injection layer may include oxides, such as molybdenum oxide, titanium oxide, vanadium oxide, rhenium oxide, ruthenium oxide, chromium oxide, zirconium oxide, hafnium oxide, tantalum oxide, silver oxide, tungsten oxide, and manganese oxide.

[0392] For example, the material of the hole injection layer may also include organic materials, such as hexacyanohexaazatriphenylene, 2,3,5,6-tetrafluoro-7,7,8,8-tetracyano-p-quinone dimethyl ether (F4TCNQ), and 1,2,3-tris[(cyano)(4-cyano-2,3,5,6-tetrafluorophenyl)methylene]cyclopropane.

[0393] For example, the material of the hole transport layer may include aromatic amines with hole transport properties, as well as dimethylfluorene or carbazole materials, such as: 4,4'-bis[N-(1-naphthyl)-N-phenylamino]biphenyl (NPB), N,N'-bis(3-methylphenyl)-N,N'-diphenyl-[1,1'-biphenyl]-4,4'-diamine (TPD), 4-phenyl-4'-(9-phenylfluorene-9-yl)triphenylamine (BAFLP), 4,4'-bis[N-(9,9-dimethylfluorene-2-yl)-N-phenylamino]biphenyl (DFLDPBi), 4,4'-bis(9-carbazolyl)biphenyl (CBP), and 9-phenyl-3-[4-(10-phenyl-9-anthrayl)phenyl]-9H-carbazole (PCzPA).

[0394] For example, the material of the electron transport layer may include aromatic heterocyclic compounds, such as benzimidazole derivatives, imidazole derivatives, pyrimidine derivatives, azine derivatives, quinoline derivatives, isoquinoline derivatives, phenanthroline derivatives, etc.

[0395] For example, the material of the electron injection layer can be an alkali metal or a metal and its compounds, such as lithium fluoride (LiF), ytterbium (Yb), magnesium (Mg), and calcium (Ca).

[0396] In some examples, the first electrode 131 may be made of a metallic material, such as any one or more of magnesium (Mg), silver (Ag), copper (Cu), aluminum (Al), titanium (Ti) and molybdenum (Mo), or an alloy of the above metals, such as aluminum-neodymium alloy (AlNd) or molybdenum-niobium alloy (MoNb). It may be a single-layer structure or a multi-layer composite structure, such as Ti / Al / Ti, or a stacked structure formed of metal and transparent conductive material, such as reflective materials such as ITO / Ag / ITO, Mo / AlNd / ITO, etc.

[0397] In some examples, the second electrode 132 may be made of any one or more of magnesium (Mg), silver (Ag), and aluminum (Al), or an alloy made of any one or more of the above metals, or a transparent conductive material, such as indium tin oxide (ITO), or a multilayer composite structure of metal and transparent conductive material.

[0398] In some examples, the charge generation layer 129 can be configured to generate, transport, and inject charge carriers. For example, the material of the charge generation layer 129 may include n-type doped organic / inorganic metal oxides such as Alq3:Mg / WO3, Bphen:Li / MoO3, BCP:Li / V2O5, and BCP:Cs / V2O5; or n-type doped organic / organic layers such as Alq3:Li / HAT-CN; or n-type doped organic / p-type doped organic layers such as BPhen:Cs / NPB:F4-TCNQ, Alq3:Li / NPB:FeCl3, TPBi:Li / NPB:FeCl3, and Alq3:Mg / m-MTDATA:F4-TCNQ; or undoped, such as F... 16 CuPc / CuPc and Al / WO3 / Au.

[0399] In some examples, the substrate 110 may be made of one or more of the following materials: glass, polyimide, polycarbonate, polyacrylate, polyetherimide, and polyethersulfone, and this embodiment includes, but is not limited to, these materials.

[0400] In some examples, the substrate can be a rigid substrate or a flexible substrate. When the substrate is a flexible substrate, it may include a first flexible material layer, a first inorganic material layer, a semiconductor layer, a second flexible material layer, and a second inorganic material layer stacked sequentially. The first and second flexible material layers are made of materials such as polyimide (PI), polyethylene terephthalate (PET), or surface-treated polymer films. The first and second inorganic material layers are made of materials such as silicon nitride (SiNx) or silicon oxide (SiOx) to improve the substrate's resistance to water and oxygen; these first and second inorganic material layers are also referred to as barrier layers. The semiconductor layer is made of amorphous silicon (a-Si).

[0401] For example, taking a substrate with a stacked structure of PI1 / Barrier1 / a-si / PI2 / Barrier2 as an example, the preparation process of this substrate includes: firstly, coating a layer of polyimide on a glass substrate, curing it into a film to form a first flexible (PI1) layer; then depositing a barrier film on the first flexible layer to form a first barrier (Barrier1) layer covering the first flexible layer; then depositing an amorphous silicon film on the first barrier layer to form an amorphous silicon (a-si) layer covering the first barrier layer; then coating another layer of polyimide on the amorphous silicon layer, curing it into a film to form a second flexible (PI2) layer; then depositing a barrier film on the second flexible layer to form a second barrier (Barrier2) layer covering the second flexible layer, and finally completing the preparation of the substrate.

[0402] In some examples, such as Figure 39 As shown, the plurality of sub-pixels 200 includes a plurality of first-color sub-pixels 201, a plurality of second-color sub-pixels 202, and a plurality of third-color sub-pixels 203; the partition structure 140 includes a plurality of first annular partition portions 141, each first annular partition portion 141 being disposed around at least one second-color sub-pixel 202. Thus, the charge generation layer 129 in the light-emitting functional layer 120 can be disconnected at the first annular partition portion 141, and the first annular partition portion 141 can separate the second-color sub-pixel 202 from other sub-pixels, thereby avoiding crosstalk between the second-color sub-pixel and adjacent sub-pixels. It should be noted that, although... Figure 40 The first annular partition shown is configured around only one second color sub-pixel, but embodiments of this disclosure include, but are not limited to, the first annular partition may also surround two or more second color sub-pixels.

[0403] For example, such as Figure 39As shown, each first annular partition 141 is arranged around a second color sub-pixel 202. Thus, the charge generation layer 129 in the light-emitting functional layer 120 can be disconnected by the first annular partition 141, which can separate each second color sub-pixel 202 from other sub-pixels.

[0404] For example, such as Figure 39 As shown, in the display substrate 100, the number of second color sub-pixels 202 is greater than the number of first color sub-pixels 201; or, the number of second color sub-pixels 202 is greater than the number of third color sub-pixels 203; or, the number of second color sub-pixels 202 is greater than both the number of first color sub-pixels 201 and the number of third color sub-pixels 203. Therefore, by providing a first annular partition 141 on the outer side of the second color sub-pixels 202, most adjacent sub-pixels on the display substrate can be separated, thereby effectively avoiding crosstalk between adjacent sub-pixels.

[0405] For example, such as Figure 39 As shown, in the display substrate 100, the number of second color sub-pixels 202 is approximately twice the number of first color sub-pixels 201 or third color sub-pixels 203.

[0406] In some examples, such as Figure 39 As shown, the partition structure 140 also includes a plurality of first strip partition portions 144 and a plurality of second strip partition portions 145; each first strip partition portion 144 extends along a first direction, and each second strip partition portion 145 extends along a second direction; the first strip partition portions 144 connect two adjacent first annular partition portions 141 in the first direction, and the second strip partition portions 145 connect two adjacent first annular partition portions 141 in the second direction. The plurality of first strip partition portions 144 and the plurality of second strip partition portions 145 connect the plurality of first annular partition portions 141 to form a plurality of first grid structures 161 and a plurality of second grid structures 162 in the area outside the plurality of first annular partition portions 141, the first grid structure 161 being disposed around a first color sub-pixel 201, and the second grid structure 162 being disposed around a third color sub-pixel 203. Therefore, the first strip-shaped partition can separate adjacent first color sub-pixels and third color sub-pixels in the second direction, so that the charge generation layer in the light-emitting functional layer is broken at the location of the first strip-shaped partition, thereby effectively avoiding crosstalk between adjacent first color sub-pixels and third color sub-pixels in the second direction; the second strip-shaped partition can separate adjacent first color sub-pixels and third color sub-pixels in the first direction, so that the charge generation layer in the light-emitting functional layer is broken at the location of the second strip-shaped partition, thereby effectively avoiding crosstalk between adjacent first color sub-pixels and third color sub-pixels in the first direction.

[0407] For example, the first direction and the second direction intersect, or the first direction and the second direction are perpendicular to each other.

[0408] In some examples, such as Figure 39 As shown, the display substrate 100 also includes spacers 170; a plurality of first strip-shaped partitions 144 and a plurality of second strip-shaped partitions 145 connect a plurality of first annular partitions 141 to form a plurality of third grid structures 163. The third grid structures 163 are arranged around an adjacent first color sub-pixel 201 and a third color sub-pixel 203. The spacers 170 are located within the third grid structures 163 and between the first color sub-pixel 201 and the third color sub-pixel 203. Thus, when the space within the first and second grid structures is insufficient to place the spacers, the aforementioned third grid structures can provide sufficient space for the spacers. In addition, since the spacers have a certain height and are located between the first color sub-pixels and the third color sub-pixels in the third grid structure, the spacers can also prevent crosstalk between the first color sub-pixels and the third color sub-pixels in the third grid structure. It should be noted that the spacers are used to support the vapor deposition mask for fabricating the aforementioned light-emitting layer.

[0409] In some examples, such as Figure 39 As shown, a plurality of first color sub-pixels 201 and a plurality of third color sub-pixels 203 are alternately arranged along a first direction and a second direction to form a plurality of first pixel rows 310 and a plurality of first pixel columns 320. A plurality of second color sub-pixels 202 are arrayed along the first direction and a second direction to form a plurality of second pixel rows 330 and a plurality of second pixel columns 340. The plurality of first pixel rows 310 and the plurality of second pixel rows 330 are alternately arranged along the second direction and staggered from each other in the first direction. The plurality of first pixel columns 320 and the plurality of second pixel columns 340 are alternately arranged along the first direction and staggered from each other in the second direction. A partition structure 140 is located between adjacent first color sub-pixels 201 and third color sub-pixels 203, and / or, a partition structure 140 is located between adjacent second color sub-pixels 202 and third color sub-pixels 203, and / or, a partition structure 140 is located between adjacent first color sub-pixels 201 and second color sub-pixels 202.

[0410] In some examples, the luminous efficiency of the third color subpixel is less than that of the second color subpixel.

[0411] For example, the first color sub-pixel 201 is configured to emit red light, the second color sub-pixel 202 is configured to emit green light, and the third color sub-pixel 203 is configured to emit blue light. Of course, embodiments of this disclosure include, but are not limited to, these.

[0412] In some examples, such as Figure 39 As shown, the orthographic projection of the effective light-emitting area of ​​the first color sub-pixel 201 onto the substrate 110 includes a rounded rectangle; the orthographic projection of the effective light-emitting area of ​​the second color sub-pixel 202 onto the substrate 110 includes a rounded rectangle; and the orthographic projection of the effective light-emitting area of ​​the third color sub-pixel 203 onto the substrate 110 includes a rounded rectangle. It should be noted that the aforementioned effective light-emitting area can be roughly defined by the pixel opening corresponding to the sub-pixel.

[0413] In some examples, such as Figure 39 As shown, the shape of the effective light-emitting area of ​​the third color sub-pixel 203 projected onto the substrate 110 includes multiple rounded corners, including a first rounded corner 2031, whose radius of curvature is larger than that of the other rounded corners. Because the first rounded corner 2031 has a larger radius of curvature, it occupies less space, allowing the spacer 170 to be placed near it, thus fully utilizing the area on the display substrate and increasing pixel density. In this case, the first rounded corner 2031 is the rounded corner with the smallest distance from the first color sub-pixel 201 among the multiple rounded corners of the third color sub-pixel 203.

[0414] In some examples, such as Figure 39 As shown, the orthographic projection of the spacer 170 on the substrate 110 is located on the line connecting the midpoint of the first rounded corner portion 2031 and the brightness center of the first color sub-pixel 201.

[0415] In some examples, such as Figure 39 As shown, the shape of the orthographic projection of the effective light-emitting area of ​​the third color sub-pixel 203 onto the substrate 110 includes multiple rounded corners, including a first rounded corner 2031 and a second rounded corner 2032. The radius of the arc of the first rounded corner 2031 is greater than the radius of the arc of the second rounded corner 2031. Furthermore, the shape of the orthographic projection of the effective light-emitting area of ​​the third color sub-pixel 203 onto the substrate 110 is axially symmetrical about the line connecting the first rounded corner 2031 and the second rounded corner 2032.

[0416] Figure 41 This is a plan view of another display substrate provided in an embodiment of the present disclosure. Figure 41As shown, the first annular partition 141 includes at least one notch 1410. When the first annular partition is provided outside the second color sub-pixel, not only will the charge generation layer in the light-emitting functional layer break at the first annular partition, but the second electrode above the light-emitting functional layer may also break at the location of the first annular partition, thereby preventing the cathode signal from being transmitted to the second color sub-pixel. Therefore, by providing at least one notch on the first annular partition, the display substrate can prevent the first annular partition from completely isolating the second color sub-pixel, thereby avoiding the phenomenon that the cathode signal cannot be transmitted.

[0417] In some examples, such as Figure 41 As shown, the second color sub-pixel 202 is surrounded by two first color sub-pixels 201 and two third color sub-pixels 203. At this time, the first annular partition 141 includes four notches 1410, respectively located between the second color sub-pixel 202 and four adjacent sub-pixels 200. Thus, by setting the aforementioned notches, the second electrode or cathode between the second color sub-pixel and the four surrounding sub-pixels is not disconnected, thereby facilitating the transmission of cathode signals. It should be noted that although the first annular partition has the aforementioned notches, the relatively small size of the notches greatly increases the resistance of the conductive sublayer (e.g., the charge generation layer) at the notch location, effectively hindering current flow and thus effectively avoiding crosstalk between adjacent sub-pixels. Furthermore, since the conductivity of the second electrode is greater than that of the conductive sublayer, and multiple sub-pixels share the second electrode, multiple conductive channels exist; therefore, even if the size of the notches is relatively small, it will not hinder the transmission of cathode signals.

[0418] In some examples, such as Figure 41 As shown, the first electrode 131 of the second color sub-pixel 202 includes an electrode connection portion 1312. The orthographic projection of the electrode connection portion 1312 on the substrate 110 at least partially overlaps with the orthographic projection of the notch 1410 of the first annular partition portion 141 on the substrate 110. Therefore, the display substrate can utilize the location of the notch in the first annular partition portion to set the electrode connection portion, thereby making the sub-pixel layout more compact and increasing pixel density. It should be noted that the brightness center of each sub-pixel can be the geometric center of the effective light-emitting area of ​​that sub-pixel. Of course, embodiments of this disclosure include, but are not limited to, the brightness center of each sub-pixel can also be the location of the maximum luminous brightness of that sub-pixel.

[0419] In some examples, such as Figure 41As shown, the first electrode 131 of the first color sub-pixel 201 also includes an electrode connection portion 1312, and the first electrode 131 of the third color sub-pixel 203 also includes an electrode connection portion 1312; the orthographic projection of the electrode connection portions 1312 of the first color sub-pixel 201 and the third color sub-pixel 203 on the substrate 110 also at least partially overlaps with the orthographic projection of the notch 1410 of the first annular partition portion 141 on the substrate 110. Therefore, the display substrate can further utilize the location of the notch in the first annular partition portion to set the electrode connection portions of the first color sub-pixel and the third color sub-pixel, thereby making the sub-pixel layout more compact and increasing the pixel density.

[0420] In some examples, such as Figure 41 As shown, the partition structure 140 also includes a plurality of first strip partition portions 144 and a plurality of second strip partition portions 145; each first strip partition portion 144 extends along a first direction, and each second strip partition portion 145 extends along a second direction; the first strip partition portions 144 connect two adjacent first annular partition portions 141 in the first direction, and the second strip partition portions 145 connect two adjacent first annular partition portions 141 in the second direction. The plurality of first strip partition portions 144 and the plurality of second strip partition portions 145 connect the plurality of first annular partition portions 141 to form a plurality of first grid structures 161 and a plurality of second grid structures 162 in the area outside the plurality of first annular partition portions 141, the first grid structure 161 being disposed around a first color sub-pixel 201, and the second grid structure 162 being disposed around a third color sub-pixel 203. Therefore, the first strip-shaped partition can separate adjacent first color sub-pixels and third color sub-pixels in the second direction, so that the charge generation layer in the light-emitting functional layer is broken at the location of the first strip-shaped partition, thereby effectively avoiding crosstalk between adjacent first color sub-pixels and third color sub-pixels in the second direction; the second strip-shaped partition can separate adjacent first color sub-pixels and third color sub-pixels in the first direction, so that the charge generation layer in the light-emitting functional layer is broken at the location of the second strip-shaped partition, thereby effectively avoiding crosstalk between adjacent first color sub-pixels and third color sub-pixels in the first direction.

[0421] For example, the first direction and the second direction intersect, or the first direction and the second direction are perpendicular to each other.

[0422] In some examples, such as Figure 41 As shown, the notch 1410 of the first annular partition 141 also serves as a notch for the first grid structure 161 and a notch for the second grid structure 162. Therefore, the second electrode of the first color sub-pixel 201 located in the first grid structure 161 and the second electrode of the third color sub-pixel 203 located in the second grid structure 162 will not be completely disconnected, thus facilitating the transmission of the cathode signal.

[0423] In some examples, such as Figure 41 As shown, the display substrate 100 also includes a spacer 170; the spacer 170 is located within the first grid structure 161 and between the first color sub-pixel 201 and the third color sub-pixel 203. When there is enough space in the first grid structure to place the spacer, the spacer can be placed directly in the first grid structure. It should be noted that the embodiments of this disclosure include, but are not limited to, the spacer may also be located within the second grid structure; in addition, the above-mentioned "within the grid structure" refers to the space surrounded by the grid structure, not the grid structure itself.

[0424] Figure 42 This is a plan view of another display substrate provided in an embodiment of the present disclosure. Figure 42 As shown, the plurality of sub-pixels 200 include a plurality of first color sub-pixels 201, a plurality of second color sub-pixels 202, and a plurality of third color sub-pixels 203; the partition structure 140 includes a plurality of first annular partition portions 141, a plurality of second annular partition portions 142, and a plurality of third annular partition portions 143; each first annular partition portion 141 is disposed around a second color sub-pixel 202; each second annular partition portion 142 is disposed around a first color sub-pixel 201; and each third annular partition portion 143 is disposed around a third color sub-pixel 203.

[0425] exist Figure 42 In the display substrate shown, the charge generation layer 129 in the light-emitting functional layer 120 can be disconnected by the first annular partition 141, the second annular partition 142, and the third annular partition 143. The first annular partition 141 can separate the second color sub-pixel 202 from other sub-pixels, thereby avoiding crosstalk between the second color sub-pixel and adjacent sub-pixels; the second annular partition 142 can separate the first color sub-pixel 201 from other sub-pixels, thereby avoiding crosstalk between the first color sub-pixel and adjacent sub-pixels; and the third annular partition 143 can separate the third color sub-pixel 203 from other sub-pixels, thereby avoiding crosstalk between the second color sub-pixel and adjacent sub-pixels.

[0426] Figure 43 A display substrate provided in one embodiment of this disclosure is along Figure 42 A cross-sectional view along the CD direction. (See diagram.) Figure 43As shown, the partition structure 140 between the first color sub-pixel 201 and the second color sub-pixel 202 includes a portion of a first annular partition 141 and a portion of a second annular partition 142. In this case, the portion of the first annular partition 141 can serve as the first sub-partition structure 140A of the partition structure 140, and the portion of the second annular partition 142 can serve as the second sub-partition structure 140B of the partition structure 140. The first sub-partition structure 140A and the second sub-partition structure 140B are sequentially arranged in the arrangement direction of adjacent sub-pixels 200. When the charge generation layer in the light-emitting functional layer is not disconnected or completely disconnected at the location of the first sub-partition structure, the charge generation layer in the light-emitting functional layer can be disconnected at the location of the second sub-partition structure. Therefore, by sequentially arranging the first sub-partition structure and the second sub-partition structure in the arrangement direction of adjacent sub-pixels, the display substrate can better ensure that the charge generation layer in the light-emitting functional layer is disconnected at the location of the partition structure, thereby further avoiding crosstalk between adjacent sub-pixels caused by the highly conductive charge generation layer. Of course, the embodiments disclosed herein include, but are not limited to, when the spacing between adjacent sub-pixels is small, only one sub-segmentation structure may be set.

[0427] In some examples, such as Figure 42 As shown, the first annular partition 141 and the second annular partition 142 are both complete annular structures without notches; while the third annular partition 143 includes a notch 1430, and the two ends of the notch 1430 of the third annular partition 143 are respectively connected to two adjacent first annular partitions 141 in the first direction or the second direction. Therefore, when the pixel density of the display substrate is high, and the partition structure includes the aforementioned first annular partition, second annular partition, and third annular partition, the spacing between adjacent annular partitions may be insufficient to provide spacers. In this case, by providing a notch in the third annular partition, spacers can be provided at the location of the notch in the display substrate. Furthermore, since the two ends of the notch in the third annular partition are respectively connected to two adjacent first annular partitions in the first direction or the second direction, the display substrate can better avoid crosstalk between adjacent sub-pixels.

[0428] It should be noted that, although Figure 42 The third annular partition portion of the display substrate shown has a notch, but embodiments of this disclosure include, but are not limited to, the third annular partition portion may also be a complete annular structure. Furthermore, when the first, second, or third annular partition portions are complete annular structures, the conductive layer in the light-emitting functional layer can be disconnected at the location of the annular partition structure by controlling the height, depth, or other parameters of the annular partition structure, while the second electrode remains connected at the location of the annular partition structure.

[0429] In some examples, such as Figure 42 As shown, the shape of the orthographic projection of the effective light-emitting area of ​​the first color sub-pixel 201 onto the substrate 110 includes a rounded rectangle; the shape of the orthographic projection of the effective light-emitting area of ​​the second color sub-pixel 202 onto the substrate 110 includes a rounded rectangle; and the shape of the orthographic projection of the effective light-emitting area of ​​the third color sub-pixel 203 onto the substrate 110 includes a rounded rectangle.

[0430] In some examples, such as Figure 42 As shown, the shape of the effective light-emitting area of ​​the third color sub-pixel 203 projected onto the substrate 110 includes multiple rounded corners, including a first rounded corner 2031, whose radius of curvature is larger than that of the other rounded corners. Because the first rounded corner 2031 has a larger radius of curvature, it occupies less space. Therefore, the notch 1430 of the third annular partition 143 can be positioned near the first rounded corner 2031, and the spacer 170 is also positioned correspondingly near the first rounded corner 2031. This allows for full utilization of the area on the display substrate, increasing pixel density. In this case, the first rounded corner 2031 is the rounded corner with the smallest distance from the first color sub-pixel 201 among the multiple rounded corners of the third color sub-pixel 203.

[0431] In some examples, such as Figure 42 As shown, the orthographic projection of the spacer 170 on the substrate 110 is located on the line connecting the midpoint of the first rounded corner portion 2031 and the brightness center of the first color sub-pixel 201.

[0432] In some examples, such as Figure 42 As shown, the shape of the orthographic projection of the effective light-emitting area of ​​the third color sub-pixel 203 onto the substrate 110 includes multiple rounded corners, including a first rounded corner 2031 and a second rounded corner 2032. The radius of the arc of the first rounded corner 2031 is greater than the radius of the arc of the second rounded corner 2031. Furthermore, the shape of the orthographic projection of the effective light-emitting area of ​​the third color sub-pixel 203 onto the substrate 110 is axially symmetrical about the line connecting the first rounded corner 2031 and the second rounded corner 2032.

[0433] In some examples, such as Figure 42 As shown, the shape of the effective light-emitting area of ​​the first color sub-pixel 201 projected onto the substrate 110 also includes multiple rounded corners, and the radii of these rounded corners are equal.

[0434] In some examples, such as Figure 42 As shown, the shape of the effective light-emitting area of ​​the second color sub-pixel 202 projected onto the substrate 110 also includes multiple rounded corners, and the radii of these rounded corners are equal.

[0435] In some examples, such as Figure 42 As shown, the area of ​​the effective light-emitting region of the third color sub-pixel 203 projected onto the substrate 110 is larger than the area of ​​the effective light-emitting region of the first color sub-pixel 201 projected onto the substrate 110; the area of ​​the effective light-emitting region of the first color sub-pixel 201 projected onto the substrate 110 is larger than the area of ​​the effective light-emitting region of the second color sub-pixel 202 projected onto the substrate 110. Of course, this disclosure is not limited to this embodiment, and the area of ​​the effective light-emitting region of each sub-pixel can be set according to actual needs.

[0436] In some examples, such as Figure 42 As shown, a plurality of first color sub-pixels 201 and a plurality of third color sub-pixels 203 are alternately arranged along a first direction and a second direction to form a plurality of first pixel rows 310 and a plurality of first pixel columns 320. A plurality of second color sub-pixels 202 are arrayed along the first direction and a second direction to form a plurality of second pixel rows 330 and a plurality of second pixel columns 340. The plurality of first pixel rows 310 and the plurality of second pixel rows 330 are alternately arranged along the second direction and staggered from each other in the first direction. The plurality of first pixel columns 320 and the plurality of second pixel columns 340 are alternately arranged along the first direction and staggered from each other in the second direction. A partition structure 140 is located between adjacent first color sub-pixels 201 and third color sub-pixels 203, and / or, a partition structure 140 is located between adjacent second color sub-pixels 202 and third color sub-pixels 203, and / or, a partition structure 140 is located between adjacent first color sub-pixels 201 and second color sub-pixels 202.

[0437] In some examples, the luminous efficiency of the third color subpixel is less than that of the second color subpixel.

[0438] For example, the first color sub-pixel 201 is configured to emit red light, the second color sub-pixel 202 is configured to emit green light, and the third color sub-pixel 203 is configured to emit blue light. Of course, embodiments of this disclosure include, but are not limited to, these.

[0439] Figure 44 This is a plan view of another display substrate provided in an embodiment of the present disclosure. Figure 44As shown, the plurality of sub-pixels 200 include a plurality of first color sub-pixels 201, a plurality of second color sub-pixels 202, and a plurality of third color sub-pixels 203; the plurality of first color sub-pixels 201 and the plurality of third color sub-pixels 203 are alternately arranged along a first direction and a second direction to form a plurality of first pixel rows 310 and a plurality of first pixel columns 320; the plurality of second color sub-pixels 202 are arrayed along the first direction and a second direction to form a plurality of second pixel rows 330 and a plurality of second pixel columns 340; the plurality of first pixel rows 310 and the plurality of second pixel rows 330 are alternately arranged along the second direction and staggered from each other in the first direction; the plurality of first pixel columns 320 and the plurality of second pixel columns 340 are alternately arranged along the first direction and staggered from each other in the second direction. The partition structure 140 includes a plurality of first annular partition portions 141, a plurality of second annular partition portions 142, and a plurality of third annular partition portions 143; each first annular partition portion 141 is disposed around a second color sub-pixel 202; each second annular partition portion 142 is disposed around a first color sub-pixel 201; and each third annular partition portion 143 is disposed around a third color sub-pixel 203.

[0440] exist Figure 44 In the display substrate shown, the charge generation layer 129 in the light-emitting functional layer 120 can be disconnected by the first annular partition 141, the second annular partition 142, and the third annular partition 143. The first annular partition 141 can separate the second color sub-pixel 202 from other sub-pixels, thereby avoiding crosstalk between the second color sub-pixel and adjacent sub-pixels; the second annular partition 142 can separate the first color sub-pixel 201 from other sub-pixels, thereby avoiding crosstalk between the first color sub-pixel and adjacent sub-pixels; and the third annular partition 143 can separate the third color sub-pixel 203 from other sub-pixels, thereby avoiding crosstalk between the second color sub-pixel and adjacent sub-pixels.

[0441] In some examples, such as Figure 44 As shown, the first annular partition 141 includes at least one notch 1410, the second annular partition 142 includes at least one notch 1420, and the third annular partition 143 includes at least one notch 1430. When the second electrode above the light-emitting functional layer is likely to break at the location of the first, second, and third annular partitions, by providing at least one notch on the first annular partition, at least one notch on the second annular partition, and at least one notch on the third annular partition, the display substrate can avoid the first, second, and third annular partitions completely isolating the sub-pixels, thereby preventing the cathode signal from being unable to be transmitted.

[0442] In some examples, such as Figure 44As shown, the gaps of any two adjacent annular partitions in the first annular partition 141, the second annular partition 142, and the third annular partition 143 are staggered to ensure that there is at least a partition structure between two adjacent sub-pixels, thereby effectively avoiding crosstalk between adjacent sub-pixels.

[0443] In some examples, such as Figure 44 As shown, between adjacent first color sub-pixels 201 and second color sub-pixels 202, the shortest path for charge to propagate from the first color sub-pixel 201 to the second color sub-pixel 202 is located at the center line connecting the effective light-emitting areas of the first color sub-pixel 201 and the effective light-emitting areas of the second color sub-pixel 202. To effectively avoid crosstalk between the first color sub-pixels 201 and the second color sub-pixels 202, a partition structure needs to be provided on the center line connecting the effective light-emitting areas of the first color sub-pixel 201 and the second color sub-pixel 202. Therefore, the notch 1410 of the first annular partition 141 on the outer side of the second color sub-pixel 202 and the notch 1420 of the second annular partition 142 on the outer side of the first color sub-pixel 201 cannot simultaneously be located on the center line connecting the effective light-emitting areas of the first color sub-pixel 201 and the effective light-emitting areas of the second color sub-pixel 202. It should be noted that when the charge cannot propagate from the first color sub-pixel 201 to the second color sub-pixel 202 along the shortest path, and at least needs to bypass the first annular partition 141 or the second annular partition 142, the charge propagation path is longer and the resistance of the charge generation layer in the light-emitting functional layer is larger, which can also effectively avoid crosstalk between adjacent sub-pixels.

[0444] For example, such as Figure 44 As shown, between the adjacent first color sub-pixels 201 and second color sub-pixels 202, the notch 1420 of the second annular partition 142 is spaced apart from the center line connecting the effective light-emitting areas of the first color sub-pixel 201 and the effective light-emitting areas of the second color sub-pixel 202. That is, the notch 1420 of the second annular partition 142 is not located on the center line connecting the effective light-emitting areas of the first color sub-pixel 201 and the effective light-emitting areas of the second color sub-pixel 202.

[0445] In some examples, such as Figure 44As shown, similarly, to effectively avoid crosstalk between the adjacent third color sub-pixel 203 and second color sub-pixel 202, a partition structure is also required on the center line connecting the effective light-emitting areas of the third color sub-pixel 203 and the effective light-emitting areas of the second color sub-pixel 202. Therefore, the notch 1410 of the first annular partition 141 on the outer side of the third color sub-pixel 202 and the notch 1430 of the third annular partition 143 on the outer side of the third color sub-pixel 203 cannot simultaneously be located on the center line connecting the effective light-emitting areas of the third color sub-pixel 203 and the effective light-emitting areas of the second color sub-pixel 202.

[0446] For example, such as Figure 44 As shown, between the adjacent third color sub-pixel 203 and second color sub-pixel 202, the notch 1420 of the second annular partition 142 is spaced apart from the center line connecting the effective light-emitting areas of the third color sub-pixel 203 and the effective light-emitting areas of the second color sub-pixel 202. That is, the notch 1420 of the second annular partition 142 is not located on the center line connecting the effective light-emitting areas of the third color sub-pixel 203 and the effective light-emitting areas of the second color sub-pixel 202.

[0447] In some examples, such as Figure 44 As shown, in the first annular partition portion 141 and the second annular partition portion 142 which are arranged adjacent to each other in the third direction Z, the gap 1410 of the first annular partition portion 141 that is closest to the second annular partition portion 142 and the gap 1420 of the second annular partition portion 142 that is closest to the first annular partition portion 141 are offset in the third direction.

[0448] It should be noted that the third direction intersects with the first direction and the second direction respectively, and the intersection with the first direction and the second direction is located on the same plane; for example, the third direction can be the extension direction of the line connecting the center of the effective light-emitting area of ​​the first color sub-pixel and the center of the effective light-emitting area of ​​the second color sub-pixel.

[0449] In some examples, such as Figure 44 As shown, in the first annular partition portion 141 and the third annular partition portion 143 that are adjacent to each other in the third direction Z, the gap 1410 of at least one gap 1410 of the first annular partition portion 141 that is closest to the third annular partition portion 143 and the gap 1430 of at least one gap 1430 of the third annular partition portion 143 that is closest to the first annular partition portion 141 are also offset in the third direction Z.

[0450] In some examples, such as Figure 44As shown, the orthographic projection of the effective light-emitting area of ​​the second color sub-pixel 202 onto the substrate 110 includes a rounded rectangle with four rounded corners. The first annular partition 141 includes four notches 1410, and these four notches 1410 correspond to the four rounded corners of the effective light-emitting area of ​​the second color sub-pixel 202. The orthographic projection of the effective light-emitting area of ​​the first color sub-pixel 201 onto the substrate includes a rounded rectangle with four sides. The second annular partition 142 includes four notches 1420, and these four notches 1420 correspond to the four sides of the effective light-emitting area of ​​the first color sub-pixel 201. The orthographic projection of the effective light-emitting area of ​​the first color sub-pixel 203 onto the substrate includes a rounded rectangle with four sides. The third annular partition 143 includes four notches 1430, and these four notches 1430 correspond to the four sides of the effective light-emitting area of ​​the third color sub-pixel 203. With this configuration, the display substrate can ensure that the notches of the annular partitions on the outer sides of two adjacent sub-pixels are staggered, thereby ensuring that there is at least a partition structure between two adjacent sub-pixels.

[0451] In some examples, such as Figure 44 As shown, the display substrate 100 also includes a spacer 170; in this case, the annular partition near the spacer 170 is different from the annular partitions at other locations. The spacer 170 is surrounded by a first color sub-pixel 201, two second color sub-pixels 202, and a third color sub-pixel 203; the first color sub-pixel 201 and the third color sub-pixel 203 are respectively disposed on both sides of the spacer 170 along the second direction Y; the two second color sub-pixels 202 are respectively disposed on both sides of the spacer 170 along the first direction X.

[0452] In some examples, such as Figure 44 As shown, the second annular partition 142 on the outer side of the first color sub-pixel 201 includes a spacer notch 1425 near the spacer 170, and the third annular partition 143 on the outer side of the third color sub-pixel 203 includes a spacer notch 1435 near the spacer 170. Therefore, the display substrate can provide sufficient space for placing the spacers. Furthermore, since the spacers themselves also have a certain insulating function, the aforementioned spacer notches will not cause crosstalk between the first and third color sub-pixels.

[0453] In some examples, such as Figure 44 As shown, since the second annular partition 142 is provided with the aforementioned spacer gap 1425, and the third annular partition 143 is provided with the aforementioned spacer gap 1435; the two first annular partitions 141 located on both sides of the spacer 170 do not have gaps near the spacer 170, thereby effectively avoiding crosstalk between adjacent sub-pixels.

[0454] In some examples, such as Figure 44 As shown, the dimension of the spacer 170 in the second direction Y is larger than the dimension of the spacer 170 in the first direction X.

[0455] For example, such as Figure 44 As shown, the shape of the effective light-emitting area of ​​the third color sub-pixel 203 projected onto the substrate 110 includes multiple rounded corners, including a first rounded corner 2031, whose radius of curvature is larger than that of the other rounded corners. Because the first rounded corner 2031 has a larger radius of curvature, it occupies less space. Therefore, the spacer notch 1435 can be positioned near the first rounded corner 2031, thereby fully utilizing the area on the display substrate and increasing pixel density. In this case, the first rounded corner 2031 is the rounded corner with the smallest distance from the first color sub-pixel 201 among the multiple rounded corners of the third color sub-pixel 203.

[0456] In some examples, such as Figure 44 As shown, the shape of the orthographic projection of the effective light-emitting area of ​​the third color sub-pixel 203 onto the substrate 110 includes multiple rounded corners, including a first rounded corner 2031 and a second rounded corner 2032. The radius of the arc of the first rounded corner 2031 is greater than the radius of the arc of the second rounded corner 2031. Furthermore, the shape of the orthographic projection of the effective light-emitting area of ​​the third color sub-pixel 203 onto the substrate 110 is axially symmetrical about the line connecting the first rounded corner 2031 and the second rounded corner 2032.

[0457] Figure 45 This is a plan view of another display substrate provided in an embodiment of the present disclosure. Figure 45 As shown, Figure 45 The display substrate and shown Figure 44 The display substrates shown employ the same pixel arrangement. In this case, the partition structure 140 includes a plurality of first annular partition portions 141, a plurality of second annular partition portions 142, and a plurality of third annular partition portions 143; each first annular partition portion 141 is disposed around a second color sub-pixel 202; each second annular partition portion 142 is disposed around a first color sub-pixel 201; and each third annular partition portion 143 is disposed around a third color sub-pixel 203, thereby avoiding crosstalk between the second color sub-pixel and adjacent sub-pixels.

[0458] In some examples, such as Figure 45As shown, the first annular partition 141 includes at least one notch 1410, the second annular partition 142 includes at least one notch 1420, and the third annular partition 143 includes at least one notch 1430. Furthermore, the notches of any two adjacent annular partitions in the first, second, and third annular partitions 141, 142, and 143 are staggered to ensure that at least one partition structure exists between adjacent sub-pixels, thereby effectively avoiding crosstalk between adjacent sub-pixels.

[0459] In some examples, such as Figure 45 As shown, between the adjacent first color sub-pixels 201 and second color sub-pixels 202, the notch 1410 of the first annular partition 141 is spaced apart from the center line connecting the effective light-emitting areas of the first color sub-pixel 201 and the effective light-emitting areas of the second color sub-pixel 202. That is, the notch 1410 of the first annular partition 141 is not located on the center line connecting the effective light-emitting areas of the first color sub-pixel 201 and the effective light-emitting areas of the second color sub-pixel 202.

[0460] In some examples, such as Figure 45 As shown, between the adjacent third color sub-pixel 203 and second color sub-pixel 202, the notch 1430 of the third annular partition 143 is spaced apart from the center line connecting the effective light-emitting areas of the third color sub-pixel 203 and the effective light-emitting areas of the second color sub-pixel 202. In other words, the notch 1430 of the third annular partition 143 is not located on the center line connecting the effective light-emitting areas of the third color sub-pixel 203 and the effective light-emitting areas of the second color sub-pixel 202.

[0461] In some examples, such as Figure 45As shown, the orthographic projection of the effective light-emitting area of ​​the second color sub-pixel 202 onto the substrate 110 includes a rounded rectangle with four sides. The first annular partition 141 includes four notches 1410, and these four notches 1410 correspond to the four sides of the effective light-emitting area of ​​the second color sub-pixel 202. The orthographic projection of the effective light-emitting area of ​​the first color sub-pixel 201 onto the substrate includes a rounded rectangle with four rounded corners. The second annular partition 142 includes four notches 1420, and these four notches 1420 correspond to the four rounded corners of the effective light-emitting area of ​​the first color sub-pixel 201. The orthographic projection of the effective light-emitting area of ​​the first color sub-pixel 203 onto the substrate includes a rounded rectangle with four rounded corners. The third annular partition 143 includes four notches 1430, and these four notches 1430 correspond to the four rounded corners of the effective light-emitting area of ​​the third color sub-pixel 203. With this configuration, the display substrate can ensure that the notches of the annular partitions on the outer sides of two adjacent sub-pixels are staggered, thereby ensuring that there is at least a partition structure between two adjacent sub-pixels.

[0462] In some examples, such as Figure 45 As shown, the display substrate 100 also includes a spacer 170; in this case, the annular partition near the spacer 170 is different from the annular partitions at other locations. The spacer 170 is surrounded by a first color sub-pixel 201, two second color sub-pixels 202, and a third color sub-pixel 203; the first color sub-pixel 201 and the third color sub-pixel 203 are respectively disposed on both sides of the spacer 170 along the second direction Y; the two second color sub-pixels 202 are respectively disposed on both sides of the spacer 170 along the first direction X.

[0463] In some examples, such as Figure 45As shown, the second annular partition 142 outside the first color sub-pixel 201, near the spacer 170, includes a spacer notch 1425. No partition structure is provided at the location of the spacer notch 1425. The spacer notch 1425 extends from the gap between the first color sub-pixel 201 and one second color sub-pixel 202, through the gap between the first color sub-pixel 201 and the spacer 170, and to the gap between the first color sub-pixel 201 and another second color sub-pixel 202. In other words, the second annular partition 142 outside the first color sub-pixel 201 near the spacer includes two strip-shaped partitions. The third annular partition 143 on the outer side of the third color sub-pixel 203, near the spacer 170, includes a spacer notch 1435. No partition structure is provided at the location of the spacer notch 1435. The spacer notch 1435 extends from the gap between the third color sub-pixel 203 and one second color sub-pixel 202, through the gap between the third color sub-pixel 203 and the spacer 170, and to the gap between the third color sub-pixel 203 and another second color sub-pixel 202. In other words, the third annular partition 143 on the outer side of the third color sub-pixel 203 near the spacer only includes two strip-shaped partitions. Therefore, the display substrate can provide sufficient space for placing the spacer. Furthermore, since the spacer itself also has a certain partitioning function, the aforementioned spacer notch will not cause crosstalk between the first color sub-pixel and the third color sub-pixel.

[0464] In some examples, such as Figure 45 As shown, since the second annular partition 142 is provided with the aforementioned spacer gap 1425, and the third annular partition 143 is provided with the aforementioned spacer gap 1435; the two first annular partitions 141 located on both sides of the spacer 170 do not have gaps near the spacer 170, thereby effectively avoiding crosstalk between adjacent sub-pixels.

[0465] In some examples, such as Figure 45 As shown, the dimension of the spacer 170 in the second direction Y is larger than the dimension of the spacer 170 in the first direction X.

[0466] Figure 46 This is a plan view of another display substrate provided in an embodiment of the present disclosure. Figure 46 As shown, the plurality of sub-pixels 200 include a plurality of first color sub-pixels 201, a plurality of second color sub-pixels 202, and a plurality of third color sub-pixels 203; the partition structure 140 includes a third strip partition portion 147 and a fourth strip partition portion 148; the third strip partition portion 147 is located between adjacent first color sub-pixels 201 and second color sub-pixels 202; the fourth strip partition portion 148 is located between adjacent third color sub-pixels 203 and second color sub-pixels 202.

[0467] In some examples, such as Figure 46 As shown, the extension direction of the third strip-shaped partition 147 is perpendicular to the line connecting the center of the effective light-emitting area of ​​the adjacent first color sub-pixel 201 and the effective light-emitting area of ​​the second color sub-pixel 202; the extension direction of the fourth strip-shaped partition 148 is perpendicular to the line connecting the center of the effective light-emitting area of ​​the adjacent third color sub-pixel 203 and the effective light-emitting area of ​​the second color sub-pixel 202.

[0468] In some examples, such as Figure 46 As shown, the orthographic projection of the effective light-emitting area of ​​the first color sub-pixel 201 onto the substrate 110 is a rounded rectangle, and the dimension (i.e., length) of the third strip-shaped partition portion 147 in its extension direction is 0.8-1 times the side length of the effective light-emitting area of ​​the first color sub-pixel 201.

[0469] In some examples, such as Figure 46 As shown, the orthographic projection of the effective light-emitting area of ​​the third color sub-pixel 201 onto the substrate 110 is a rounded rectangle, and the dimension (i.e., length) of the fourth strip-shaped partition portion 148 in its extension direction is 0.8-1 times the side length of the effective light-emitting area of ​​the third color sub-pixel 203.

[0470] In some examples, such as Figure 46 As shown, the display substrate 100 also includes a spacer 170; in this case, the partition structure near the spacer 170 is different from the partition structure at other locations. The spacer 170 is surrounded by a first color sub-pixel 201, two second color sub-pixels 202, and a third color sub-pixel 203; the first color sub-pixel 201 and the third color sub-pixel 203 are respectively disposed on both sides of the spacer 170 along the second direction Y; the two second color sub-pixels 202 are respectively disposed on both sides of the spacer 170 along the first direction X.

[0471] In some examples, such as Figure 46 As shown, the partition structure 140 includes an arc-shaped partition portion 149, which is located between the second color sub-pixel 202 and the spacer 170. Furthermore, the arc-shaped partition portion 149 extends from the gap between the second color sub-pixel 202 and the third color sub-pixel 203 to the gap between the second color sub-pixel 202 and the first color sub-pixel 201. That is, one end of the arc-shaped partition portion 149 is located between the second color sub-pixel 202 and the third color sub-pixel 203, serving as a fourth strip-shaped partition portion 148; the other end of the arc-shaped partition portion 149 is located between the second color sub-pixel 202 and the first color sub-pixel 201, serving as a third strip-shaped partition portion 147; and the middle portion of the arc-shaped partition portion 149 is located between the second color sub-pixel 202 and the spacer 170.

[0472] Figure 47 This is a plan view of another display substrate provided in an embodiment of the present disclosure. Figure 47 As shown, the plurality of sub-pixels 200 include a plurality of first color sub-pixels 201, a plurality of second color sub-pixels 202, and a plurality of third color sub-pixels 203; the partition structure 140 includes a plurality of first annular partition portions 141, a plurality of second annular partition portions 142, and a plurality of third annular partition portions 143; each first annular partition portion 141 is arranged around two adjacent second color sub-pixels 202; each second annular partition portion 142 is arranged around one first color sub-pixel 201; and each third annular partition portion 143 is arranged around one third color sub-pixel 203. Therefore, the charge generation layer 129 in the light-emitting functional layer 120 can be disconnected by the first annular partition 141, the second annular partition 142, and the third annular partition 143. The first annular partition 141 can separate two adjacent second color sub-pixels 202 from other sub-pixels, thereby avoiding crosstalk between the second color sub-pixels and adjacent sub-pixels; the first annular partition 141 can separate the first color sub-pixel 201 from other sub-pixels, thereby avoiding crosstalk between the first color sub-pixel and adjacent sub-pixels; the third annular partition 143 can separate the third color sub-pixel 203 from other sub-pixels, thereby avoiding crosstalk between the second color sub-pixels and adjacent sub-pixels.

[0473] In some examples, such as Figure 47 As shown, there are two annular partitions between any two adjacent sub-pixels 200, which can further avoid crosstalk between adjacent sub-pixels.

[0474] In some examples, such as Figure 47 As shown, multiple sub-pixels 200 are divided into multiple sub-pixel groups 350. Each sub-pixel group 350 includes a first-color sub-pixel 201, two second-color sub-pixels 202, and a third-color sub-pixel 203. In each sub-pixel group 350, the first-color sub-pixel 201 and the third-color sub-pixel 203 are arranged along a first direction, and the two second-color sub-pixels 202 are arranged adjacent to each other in a second direction, located between the first-color sub-pixel 201 and the third-color sub-pixel 203. It should be noted that the concept of pixel groups described above is only used to describe the pixel arrangement structure of multiple sub-pixels, and does not limit a pixel group to displaying a single pixel or to being driven by the same grid line.

[0475] For example, such as Figure 47 As shown, the four sub-pixels within the dashed box 360 can be driven by the same gate line. Of course, embodiments of this disclosure include, but are not limited to, this, and the driving of the sub-pixels can be configured according to actual needs.

[0476] Figure 48 This is a plan view of another display substrate provided in an embodiment of the present disclosure. Figure 48 As shown, the plurality of sub-pixels 200 include a plurality of first color sub-pixels 201, a plurality of second color sub-pixels 202, and a plurality of third color sub-pixels 203. The partition structure 140 includes a plurality of first annular partition portions 141, a plurality of second annular partition portions 142, and a plurality of third annular partition portions 143; each first annular partition portion 141 is disposed around two adjacent second color sub-pixels 202; each second annular partition portion 142 is disposed around one first color sub-pixel 201; and each third annular partition portion 143 is disposed around one third color sub-pixel 203. Therefore, the charge generation layer 129 in the light-emitting functional layer 120 can be disconnected at the first annular partition 141, the second annular partition 142, and the third annular partition 143. The first annular partition 141 can separate two adjacent second color sub-pixels 202 from other sub-pixels, thereby avoiding crosstalk between the second color sub-pixels and adjacent sub-pixels; the first annular partition 141 can separate the first color sub-pixel 201 from other sub-pixels, thereby avoiding crosstalk between the first color sub-pixel and adjacent sub-pixels; the third annular partition 143 can separate the third color sub-pixel 203 from other sub-pixels, thereby avoiding crosstalk between the second color sub-pixels and adjacent sub-pixels.

[0477] In some examples, such as Figure 48 As shown, any two adjacent annular partitions among the plurality of first annular partitions 141, the plurality of second annular partitions 142, and the plurality of third annular partitions 143 share a partition edge. Therefore, only one partition structure is provided between two adjacent sub-pixels, thereby reducing the width of the gap between two adjacent sub-pixels and increasing pixel density.

[0478] Figure 49 This is a plan view of another display substrate provided in an embodiment of the present disclosure. Figure 49 As shown, the plurality of sub-pixels 200 include a plurality of first color sub-pixels 201, a plurality of second color sub-pixels 202, and a plurality of third color sub-pixels 203; the partition structure 140 includes a plurality of first annular partition portions 141 and a plurality of second annular partition portions 142, each first annular partition portion 141 being disposed around a second color sub-pixel 202, and each second annular partition portion 142 being disposed around a first color sub-pixel 201.

[0479] In some examples, such as Figure 49As shown, the partition structure 140 includes a plurality of first annular partition portions 141, a plurality of second annular partition portions 142, and a plurality of third annular partition portions 143; each first annular partition portion 141 is disposed around a second color sub-pixel 202; each second annular partition portion 142 is disposed around a first color sub-pixel 201; and each third annular partition portion 143 is disposed around a third color sub-pixel 203. Therefore, the charge generation layer 129 in the light-emitting functional layer 120 can be disconnected by the first annular partition 141, the second annular partition 142, and the third annular partition 143. The first annular partition 141 can separate the second color sub-pixel 202 from other sub-pixels, thereby avoiding crosstalk between the second color sub-pixel and adjacent sub-pixels; the first annular partition 141 can separate the first color sub-pixel 201 from other sub-pixels, thereby avoiding crosstalk between the first color sub-pixel and adjacent sub-pixels; the third annular partition 143 can separate the third color sub-pixel 203 from other sub-pixels, thereby avoiding crosstalk between the second color sub-pixel and adjacent sub-pixels.

[0480] In some examples, such as Figure 49 As shown, there are two annular partitions between any two adjacent sub-pixels 200, which can further avoid crosstalk between adjacent sub-pixels.

[0481] In some examples, such as Figure 49 As shown, multiple sub-pixels 200 are divided into multiple sub-pixel groups 350. Each sub-pixel group 350 includes a first color sub-pixel 201, a second color sub-pixel 202, and a third color sub-pixel 203. In each sub-pixel group 350, the first color sub-pixel 201 or the second color sub-pixel 202 and the third color sub-pixel 203 are arranged along a first direction, and the first color sub-pixel 201 and the second color sub-pixel 202 are arranged along a second direction.

[0482] Figure 50 This is a plan view of another display substrate provided in an embodiment of the present disclosure. Figure 50As shown, the plurality of sub-pixels 200 include a plurality of first color sub-pixels 201, a plurality of second color sub-pixels 202, and a plurality of third color sub-pixels 203; the partition structure 140 includes a plurality of first annular partition portions 141 and a plurality of second annular partition portions 142; the plurality of first annular partition portions 141 are configured in a one-to-one correspondence with the plurality of second color sub-pixels 202, and each first annular partition portion 141 is configured around one of the second color sub-pixels 202; the plurality of second annular partition portions 142 are configured in a one-to-one correspondence with the plurality of first color sub-pixels 201, and each second annular partition portion 142 is configured around one of the first color sub-pixels 201. Therefore, the charge generation layer 129 in the light-emitting functional layer 120 can be disconnected by the first annular partition 141, the second annular partition 142, and the third annular partition 143. The first annular partition 141 can separate the second color sub-pixel 202 from other sub-pixels, thereby avoiding crosstalk between the second color sub-pixel and adjacent sub-pixels; the first annular partition 141 can separate the first color sub-pixel 201 from other sub-pixels, thereby avoiding crosstalk between the first color sub-pixel and adjacent sub-pixels; the third annular partition 143 can separate the third color sub-pixel 203 from other sub-pixels, thereby avoiding crosstalk between the second color sub-pixel and adjacent sub-pixels.

[0483] In some examples, such as Figure 50 As shown, multiple sub-pixels 200 are divided into multiple sub-pixel groups 350. Each sub-pixel group 350 includes a first color sub-pixel 201, a second color sub-pixel 202, and a third color sub-pixel 203. In each sub-pixel group 350, the first color sub-pixel 201 or the second color sub-pixel 202 and the third color sub-pixel 203 are arranged along a first direction, and the first color sub-pixel 201 and the second color sub-pixel 202 are arranged along a second direction.

[0484] In some examples, such as Figure 50As shown, the first annular partition 141 includes at least one notch 1410, and the second annular partition 142 includes at least one notch 1420; at this time, the partition structure 140 also includes a plurality of L-shaped partitions 146, and the plurality of L-shaped partitions 146 are arranged in a one-to-one correspondence with a plurality of third color sub-pixels 203, and each L-shaped partition 146 is arranged around a third color sub-pixel 203. In each pixel group 350, the L-shaped partition 146 is directly opposite to the gap 1410 on the first annular partition 141 near the third color sub-pixel 203 and the gap 1420 on the second annular partition 142 near the third color sub-pixel 203; that is, the orthographic projection of the L-shaped partition 146 on the reference line extending along the second direction Y overlaps with the orthographic projection of the gap 1410 on the first annular partition 141 near the third color sub-pixel 203 on the reference line and the orthographic projection of the gap 1420 on the second annular partition 142 near the third color sub-pixel 203 on the reference line.

[0485] Figure 51 This is a partial cross-sectional schematic diagram of a display substrate provided in one embodiment of this disclosure. Figure 51 As shown, the partition structure 140 includes a groove 1401 and a blocking portion 1402; the blocking portion 1402 is located at the edge of the groove 1401 and protrudes into the groove 1401 to form a protrusion 1403 that covers part of the opening of the groove 1401, and the conductive layer 129 of the light-emitting functional layer 120 is broken at the protrusion 1403 of the blocking portion 1402.

[0486] For example, such as Figure 51 As shown, the blocking portion 1402 protrudes into the groove 1401 relative to the edge of the groove 1401 to form a protrusion 1403; at this time, the protrusion 1403 of the blocking portion 1402 is suspended, and the protrusion 1403 blocks the edge portion of the opening of the groove 1401.

[0487] In some examples, such as Figure 51 As shown, the groove 1401 has a blocking part 1402 on each of the two edges of the arrangement direction of the two adjacent sub-pixels 200.

[0488] In some examples, such as Figure 51 As shown, the second electrode 132 is disconnected at the location of the partition structure 140.

[0489] In some examples, such as Figure 51 As shown, the display substrate 100 also includes a planarization layer 180; a groove 1401 is disposed within the planarization layer 180; the portion of the shielding portion 1402 other than the protrusion 1403 may be located between the planarization layer 180 and the pixel defining layer 150.

[0490] For example, the ratio of the size of the protrusion 1403 protruding into the groove 1401 of the blocking portion 1402 to the size of the blocking portion 1402 can be 0.1-0.5. For example, the ratio of the size of the protrusion 310 protruding into the groove 1401 of the blocking portion 1402 to the size of the blocking portion 1402 can be 0.2-0.4. For example, the size of the protrusion 1403 protruding into the groove 1401 of the blocking portion 1402 is not less than 0.1 micrometers. For example, the size of the protrusion 1403 protruding into the groove 1401 of the blocking portion 1402 is not less than 0.2 micrometers.

[0491] For example, the distance between two occlusion portions 1402 located between adjacent sub-pixels can be 2 to 15 micrometers. For example, the distance between two occlusion portions 1402 located between adjacent sub-pixels can be 5 to 10 micrometers. For example, the distance between two occlusion portions 1402 located between adjacent sub-pixels can be 3 to 7 micrometers. For example, the distance between two occlusion portions 1402 located between adjacent sub-pixels can be 4 to 12 micrometers.

[0492] For example, such as Figure 51 As shown, the portion of the shielding portion 1402, excluding the protrusion 1403, is attached to the surface of the planarization layer 180 away from the substrate 110.

[0493] For example, the material of the shielding portion 1402 can be the same as that of the first electrode 131, and it can be located in the same film layer. Therefore, the shielding portion 1402 can be formed together with the patterned first electrode 131, thereby saving on masking processes. Of course, embodiments of this disclosure include, but are not limited to, this; the shielding portion can also be made of other materials, such as inorganic materials.

[0494] For example, the material of the planarization layer 180 can be an organic material, such as one or a combination of resin, acrylic or polyethylene terephthalate, polyimide, polyamide, polycarbonate, epoxy resin, etc.

[0495] In some examples, other film layers are disposed between the planarization layer 180 and the substrate 110. These other film layers may include gate insulating layers, interlayer insulating layers, various film layers in pixel circuits (such as thin film transistors, storage capacitors, etc.), data lines, gate lines, power signal lines, reset power signal lines, reset control signal lines, light emission control signal lines, and other film layers or structures.

[0496] At least one embodiment of this disclosure also provides a display device. Figure 52 This is a schematic diagram of a display device provided according to an embodiment of the present disclosure. Figure 52As shown, the display device 500 also includes a display substrate 100. This display substrate avoids crosstalk between adjacent sub-pixels caused by the highly conductive charge generation layer by providing a partition structure between adjacent sub-pixels and disconnecting the charge generation layer in the light-emitting functional layer at the location of the partition structure. Therefore, the display device including this display substrate can also avoid crosstalk between adjacent sub-pixels, thus achieving higher product yield and higher display quality.

[0497] On the other hand, since the display substrate can increase pixel density while employing a dual-layer tandem EL design, display devices including this display substrate have advantages such as long lifespan, low power consumption, high brightness, and high resolution.

[0498] For example, the display device can be an organic light-emitting diode display device or other display device, as well as any product or component with display function, such as a television, digital camera, mobile phone, watch, tablet computer, laptop computer, or navigator that includes the display device. This embodiment is not limited to this.

[0499] In order to better ensure the continuity of the second electrode while effectively isolating the charge generation layers of adjacent sub-pixels, an embodiment of this disclosure also proposes another display substrate. Figure 53 A plan view of another display substrate provided in an embodiment of this disclosure; Figure 54 A display substrate provided in one embodiment of this disclosure is along Figure 53 A cross-sectional view of the EF line.

[0500] like Figure 53 and Figure 54 As shown, the display substrate 100 includes a substrate 110 and a plurality of sub-pixels 200 located on the substrate 110; the plurality of sub-pixels 200 are arrayed on the substrate 110, and each sub-pixel 200 includes a light-emitting element 210 and a pixel driving circuit 250 for driving the light-emitting element 210 to emit light. Each light-emitting element 210 includes a light-emitting functional layer, a first electrode, and a second electrode; the light-emitting functional layer may include a plurality of sub-functional layers, and the plurality of sub-functional layers may include a charge generation layer with high conductivity. It should be noted that the cross-sectional structure of the light-emitting element can be found in [reference needed]. Figure 2 The relevant descriptions will not be repeated here.

[0501] For example, the pixel driving circuit 250 can be electrically connected to the first electrode 131 in the correspondingly configured light-emitting element 210, thereby driving the light-emitting element 210 to emit light. The first electrode 131 can be an anode, and the second electrode 132 can be a cathode; multiple sub-pixels 200 can share a second electrode 132, that is, multiple sub-pixels 200 can share a cathode.

[0502] For example, the cathode can be formed of a material with high conductivity and low work function; for example, the cathode can be made of a metallic material. For example, the anode can be formed of a transparent conductive material with a high work function.

[0503] like Figure 53 and Figure 54 As shown, the display substrate 100 also includes a partition structure 140, which is located on the substrate 110 and between adjacent sub-pixels 200; thereby, the charge generation layer 129 in the light-emitting functional layer 120 is broken at the location of the partition structure 140. The plurality of sub-pixels 200 include a plurality of first-color sub-pixels 201, a plurality of second-color sub-pixels 202, and a plurality of third-color sub-pixels 203. The partition structure 140 includes a plurality of annular partition portions 1400, each annular partition portion 1400 surrounding one of a first-color sub-pixel 201, a second-color sub-pixel 202, and a third-color sub-pixel 203; that is, each annular partition portion 1400 surrounds one of a first-color sub-pixel 201, a second-color sub-pixel 202, or a third-color sub-pixel 203. Furthermore, the aforementioned annular partition portions can be closed rings or open rings, such as rings including at least one notch.

[0504] In the display substrate provided in this embodiment, by providing a partition structure between adjacent sub-pixels and disconnecting the charge generation layer in the light-emitting functional layer at the location of the partition structure, crosstalk between adjacent sub-pixels caused by the highly conductive charge generation layer is avoided. Furthermore, since the partition structure includes multiple annular partition portions, each surrounding a first color sub-pixel, a second color sub-pixel, or a third color sub-pixel, this partition structure can achieve the isolation of most adjacent sub-pixels with simple annular partition portions, thereby avoiding crosstalk between adjacent sub-pixels. On the other hand, since this display substrate can avoid crosstalk between adjacent sub-pixels through the partition structure, it can increase pixel density while employing a tandem EL design. Therefore, this display substrate has advantages such as long lifespan, low power consumption, high brightness, and high resolution.

[0505] In some examples, such as Figure 53 and Figure 54As shown, in the display substrate 100, the number of second color sub-pixels 202 is greater than the number of first color sub-pixels 201; or, the number of second color sub-pixels 202 is greater than the number of third color sub-pixels 203; or, the number of second color sub-pixels 202 is greater than both the number of first color sub-pixels 201 and the number of third color sub-pixels 203. Therefore, by providing a first annular pixel partition 141A outside the relatively small number of first color sub-pixels 201 and a second annular pixel partition 142B outside the relatively small number of third color sub-pixels 203, most adjacent sub-pixels on the display substrate can be separated, thereby effectively avoiding crosstalk between adjacent sub-pixels.

[0506] In some examples, such as Figure 53 and Figure 54 As shown, in the display substrate 100, the number of second color sub-pixels 202 is approximately twice the number of first color sub-pixels 201 or third color sub-pixels 203.

[0507] In some examples, such as Figure 53 and Figure 54 As shown, partition structure 140 also does not need to be configured as follows. Figure 1 The strip-shaped partition shown can also separate adjacent first color sub-pixels and third color sub-pixels.

[0508] In some examples, the light-emitting functional layer includes a first light-emitting layer and a second light-emitting layer located on either side of the conductive sublayer in a direction perpendicular to the substrate, wherein the conductive sublayer is a charge-generating layer. Thus, this display substrate can realize a dual-layer light-emitting (Tandem EL) design, thereby offering advantages such as long lifespan, low power consumption, and high brightness. It should be noted that the cross-sectional structure of the light-emitting functional layer can be found in [reference needed]. Figure 40 The relevant explanations will not be repeated here.

[0509] In some examples, the conductivity of the conductive sublayer is greater than that of the first light-emitting layer and the second light-emitting layer, but less than that of the second electrode.

[0510] In some examples, such as Figure 53 and 54 As shown, the first light-emitting layer 121 is located on the side of the conductive sublayer 129 closer to the substrate 110; the second light-emitting layer 122 is located on the side of the conductive sublayer 129 away from the substrate 110.

[0511] In some examples, such as Figure 53 and Figure 54As shown, the plurality of annular partitions 1400 include a plurality of first annular pixel partitions 141A and a plurality of second annular pixel partitions 142A. The plurality of first annular pixel partitions 141A are correspondingly disposed with a plurality of first color sub-pixels 201, and the plurality of second annular pixel partitions 142A are correspondingly disposed with a plurality of third color sub-pixels 203. Each first annular pixel partition 141A surrounds a first color sub-pixel 201, and each second annular pixel partition 142A surrounds a third color sub-pixel 203. Thus, the plurality of first annular pixel partitions 141A can separate the plurality of first color sub-pixels 201 from other adjacent sub-pixels, and the plurality of second annular pixel partitions 142A can separate the plurality of third color sub-pixels 203 from other adjacent sub-pixels. Therefore, the display substrate can effectively avoid crosstalk between adjacent sub-pixels.

[0512] In some examples, such as Figure 53 and Figure 54 As shown, the partition structure 140 between adjacent first color sub-pixels 201 and second color sub-pixels 202 includes only a first annular pixel partition portion 141A, and the partition structure 140 between adjacent third color sub-pixels 203 and second color sub-pixels 202 includes only a second annular pixel partition portion 142A. In this case, an annular partition structure is not required around the second color sub-pixels, and the second electrode can be continuously disposed around the second color sub-pixels. Therefore, the display substrate can effectively isolate the charge generation layers of adjacent sub-pixels while maximizing the continuity of the second electrode through the aforementioned partition structure, thereby facilitating the transmission of cathode signals.

[0513] In some examples, such as Figure 53 and Figure 54 As shown, the first annular pixel partition 141A includes a notch 1410A, which is located on the extension of the diagonal of the effective light-emitting area of ​​the first color sub-pixel 201. The first electrode 131 of the first color sub-pixel 201 includes a first main body 1311A and a first connecting part 1311B. The first connecting part 1311B is connected to the first main body 1311A and is configured to be connected to the pixel driving circuit 250. The first connecting part 1311B is located at the position of the notch 1410A of the first annular pixel partition 141A.

[0514] In this configuration, the notch in the first annular pixel partition can be used to form a first connecting portion, which is connected to the corresponding pixel driving circuit. When the pixel density of the display substrate is high and the sub-pixels are closely arranged, the space between the opposite edges of the effective light-emitting areas of adjacent sub-pixels is small, while the space between the opposite corners of the effective light-emitting areas of adjacent sub-pixels is large. By setting the notch in the first annular pixel partition on the extension line of the diagonal of the effective light-emitting area of ​​the first color sub-pixel, the display substrate can make full use of the space between the opposite corners of the effective light-emitting areas of adjacent sub-pixels. On the other hand, the display substrate can increase the pixel arrangement density while avoiding crosstalk between adjacent sub-pixels through the above-described configuration.

[0515] In some examples, such as Figure 53 and Figure 54 As shown, the first connecting part 1311B is located on the extension line of the diagonal of the first main body part 1311A, that is, the first connecting part 1311B protrudes outward from one corner of the first main body part 1311A.

[0516] In some examples, such as Figure 53 As shown, the first gap 1410A array is arranged to form a first gap row and a first gap column along the first direction X and the second direction Y; the first gap row extends along the first direction and the first gap column extends along the second direction; the second gap 1420A array is arranged to form a second gap row and a second gap column along the first direction X and the second direction Y; the first gap row extends along the first direction X and the first gap column extends along the second direction Y; the first gap row and the second gap row are approximately parallel, and the first gap column and the second gap column are approximately parallel.

[0517] In some examples, such as Figure 53 As shown, the first gap row is located between the first color sub-pixel 201 and the third color sub-pixel 203, and the second gap row is located between the first color sub-pixel 201 and the third color sub-pixel 203.

[0518] In some examples, such as Figure 53 and Figure 54 As shown, the shape of the first main body portion 1311A projected onto the substrate 110 includes a rounded rectangle, and the first connecting portion 1311B protrudes outward from one rounded corner of the first main body portion 1311A along the extension direction of the diagonal of the rounded rectangle.

[0519] In some examples, such as Figure 53 and Figure 54As shown, the second annular pixel partition 142A includes a notch 1420A, which is located on the extension of the diagonal of the effective light-emitting area of ​​the third color sub-pixel 203. The first electrode 131 of the third color sub-pixel 203 includes a second main body 1312A and a second connecting part 1312B. The second connecting part 1312B is connected to the second main body 1312A and is configured to be connected to the pixel driving circuit 250. The first connecting part 1312B is located at the position of the notch 1420A of the first annular pixel partition 142A.

[0520] In this case, the notch in the second annular pixel partition can be used to set a second connecting portion, which is used to connect to the corresponding pixel driving circuit. When the pixel density of the display substrate is high and the sub-pixels are arranged closely, the space between the opposite edges of the effective light-emitting areas of adjacent sub-pixels is small, while the space between the opposite corners of the effective light-emitting areas of adjacent sub-pixels is large. By setting the notch in the second annular pixel partition on the extension line of the diagonal of the effective light-emitting area of ​​the third color sub-pixel, the display substrate can make full use of the space between the opposite corners of the effective light-emitting areas of adjacent sub-pixels. On the other hand, the display substrate can increase the pixel arrangement density while avoiding crosstalk between adjacent sub-pixels through the above-described setting.

[0521] In some examples, such as Figure 53 and Figure 54 As shown, the second connecting portion 1312B is located on the extension line of the diagonal of the second main body portion 1312A, that is, the second connecting portion 1312B protrudes outward from one corner of the second main body portion 1312A.

[0522] In some examples, such as Figure 53 and Figure 54 As shown, the shape of the second main body portion 1312A projected onto the substrate 110 includes a rounded rectangle, and the second connecting portion 1312B protrudes outward from one rounded corner of the second main body portion 1312A along the extension direction of the diagonal of the rounded rectangle.

[0523] In some examples, such as Figure 53 and Figure 54 As shown, the direction in which the first connecting portion 1311B protrudes from the first main body portion 1311A is the same as the direction in which the second connecting portion 1312B protrudes from the second main body portion 1312A.

[0524] In some examples, such as Figure 53 and Figure 54 As shown, the first electrode 131 of the second color sub-pixel 202 includes a third main body portion 1313A and a third connecting portion 1313B. The third connecting portion 1313B is connected to the third main body portion 1313A and is configured to be connected to the pixel driving circuit 250.

[0525] In some examples, such as Figure 53 and Figure 54 As shown, the third connecting part 1313B is located on the extension line of the diagonal of the third main body part 1313A, that is, the third connecting part 1313B protrudes outward from one corner of the third main body part 1313A.

[0526] In some examples, such as Figure 53 and Figure 54 As shown, the display substrate 100 further includes a pixel defining layer 150 located on the substrate 110; the pixel defining layer 150 is partially located on the side of the first electrode 131 away from the substrate 110; the pixel defining layer 150 includes a plurality of pixel openings 152 and pixel spacing openings 154; the plurality of pixel openings 152 correspond one-to-one with a plurality of sub-pixels 200 to define the effective light-emitting area of ​​the plurality of sub-pixels 200; the pixel openings 152 are configured to expose the first electrode 131 so that the first electrode 131 can contact the subsequently formed light-emitting functional layer 120. The pixel spacing openings 154 are located between adjacent first electrodes 131, and at least a portion of the partition structure 140 is located between the pixel defining layer 150 and the substrate 110, that is, at least a portion of the partition structure 140 is covered by the pixel defining layer 150.

[0527] In the arrangement direction of adjacent sub-pixels, since at least part of the partition structure is located between the pixel defining layer and the substrate, the charge generation layer in the light-emitting functional layer is only disconnected once at the location where the partition structure is outside the pixel defining layer; similarly, the second electrode is also only disconnected once at the location where the partition structure is outside the pixel defining layer, instead of being disconnected twice on both sides of the partition structure in the arrangement direction of adjacent sub-pixels. Therefore, the second electrode can better maintain continuity, thereby better transmitting the cathode. In addition, since the second electrode is only disconnected once at the location where the partition structure is outside the pixel defining layer, the formation of a sharp structure can be reduced or even avoided, thereby avoiding the phenomenon of sharp discharge. It should be noted that the aforementioned arrangement direction of adjacent sub-pixels can be the extension direction of the line connecting the brightness centers of the effective light-emitting areas of adjacent sub-pixels.

[0528] In some examples, such as Figure 53 and Figure 54 As shown, in the arrangement direction of adjacent sub-pixels, one edge of the partition structure 140 is located between the pixel defining layer 150 and the substrate 110, while the other edge is located within the pixel spacing opening 154. In this case, the second electrode also breaks only once at the edge of the partition structure located within the pixel spacing opening, instead of breaking twice on both sides of the partition structure in the arrangement direction of adjacent sub-pixels. Therefore, the second electrode can better maintain continuity, thereby better transmitting the cathode.

[0529] In some examples, such as Figure 53 and Figure 54 As shown, in the arrangement direction of adjacent sub-pixels, the partition structure 140 includes a partition surface 149 on one side of the arrangement direction, and the angle between the partition surface 149 and the plane containing the substrate 110 ranges from 80 to 100 degrees. Thus, the partition surface can effectively disconnect the charge generation layer. Of course, the partition structure provided in this embodiment can also adopt other structures, as long as they can disconnect the charge generation layer.

[0530] In some examples, such as Figure 53 and Figure 54 As shown, the dimensions of the partition structure 140 in the direction perpendicular to the substrate 110 range from [value missing]. Of course, the embodiments disclosed herein include, but are not limited to, the dimensions of the partition structure in the direction perpendicular to the substrate can be set according to actual conditions.

[0531] For example, the material of the pixel defining layer may include organic materials such as polyimide, acrylic, or polyethylene terephthalate.

[0532] In some examples, such as Figure 53 As shown, a plurality of first color sub-pixels 201 and a plurality of third color sub-pixels 203 are alternately arranged along a first direction and a second direction to form a plurality of first pixel rows 310 and a plurality of first pixel columns 320. A ...

Claims

1. A display substrate, comprising: Substrate; Multiple sub-pixels are located on the substrate, each sub-pixel includes a light-emitting element, the light-emitting element includes a light-emitting functional layer and a first electrode and a second electrode located on both sides of the light-emitting functional layer, the first electrode is located between the light-emitting functional layer and the substrate, and the light-emitting functional layer includes multiple sub-functional film layers; as well as A pixel-separating structure is located between adjacent sub-pixels, and at least one of the plurality of sub-functional film layers in the light-emitting functional layer is broken at the location of the pixel-separating structure. The pixel isolation structure includes a first sub-pixel isolation portion, a second sub-pixel isolation portion, and a third sub-pixel isolation portion stacked along a direction perpendicular to the substrate. The second sub-pixel isolation portion is located on the side of the first sub-pixel isolation portion away from the substrate, and the third sub-pixel isolation portion is located on the side of the second sub-pixel isolation portion away from the first sub-pixel isolation portion. The second sub-pixel partition includes a plurality of sub-partition layers stacked along a direction perpendicular to the substrate. At least one of the sub-partition layers has a first protrusion extending beyond the first sub-pixel partition in the arrangement direction of two adjacent sub-pixels. The third sub-pixel partition has a second protrusion extending beyond at least one sub-partition layer in the arrangement direction of two adjacent sub-pixels. The display substrate further includes a planarization layer, which is located between the substrate and the first sub-pixel partition. The first sub-pixel partition and the planarization layer are integrally formed. Both the first sub-pixel partition and the planarization layer are made of organic materials.

2. The display substrate according to claim 1, wherein, At least one of the sub-blocking layers has its orthogonal projection on the substrate falling within the orthogonal projection of the third sub-pixel blocking portion on the substrate.

3. The display substrate according to claim 2, wherein, The orthographic projection of the second sub-pixel partition on the substrate falls within the orthographic projection of the third sub-pixel partition on the substrate.

4. The display substrate according to any one of claims 1-3, wherein, The plurality of sub-functional film layers include a charge generation layer and a first light-emitting layer and a second light-emitting layer located on both sides of the charge generation layer in a direction perpendicular to the substrate, wherein the charge generation layer is disconnected at the location of the pixel isolation structure.

5. The display substrate according to any one of claims 1-3, wherein, In the arrangement direction of two adjacent sub-pixels, the average size of the second sub-pixel partition is smaller than the average size of the third sub-pixel partition.

6. The display substrate according to any one of claims 1-3, wherein, The material of the third sub-pixel partition includes a first metal, and the material of the second sub-pixel partition includes a second metal.

7. The display substrate according to any one of claims 1-3, wherein, The material of the third sub-pixel partition includes a first inorganic non-metallic material, and the material of the second sub-pixel partition includes a second inorganic non-metallic material.

8. The display substrate according to claim 7, wherein, The first inorganic non-metallic material includes silicon oxide, and the second inorganic non-metallic material includes silicon nitride.

9. The display substrate according to any one of claims 1-3, wherein, Multiple pixel separation structures are provided between two adjacent sub-pixels.

10. The display substrate according to any one of claims 1-3, further comprising: A pixel defining layer is located on the substrate. The pixel defining layer is located on the side of the first electrode away from the substrate. The pixel defining layer includes a plurality of pixel openings, each corresponding to a plurality of sub-pixels to define the light-emitting area of ​​the sub-pixels. The pixel openings are configured to expose the first electrode. The pixel isolation structure is located between adjacent pixel openings and on the side of the pixel defining layer away from the substrate.

11. The display substrate according to any one of claims 1-3, further comprising: A pixel defining layer is located on the substrate. The pixel defining layer is located on the side of the first electrode away from the substrate. The pixel defining layer includes multiple pixel openings and pixel spacing openings. Each pixel opening corresponds to one of the multiple sub-pixels to define the light-emitting area of ​​the multiple sub-pixels. The pixel openings are configured to expose the first electrode. The pixel spacing opening is located between adjacent first electrodes, and the pixel separation structure is at least partially located within the pixel spacing opening.

12. The display substrate according to any one of claims 1-3, further comprising: A pixel defining layer is located on the substrate. The pixel defining layer is located on the side of the first electrode away from the substrate. The pixel defining layer includes a plurality of pixel openings, each corresponding to a plurality of sub-pixels to define the light-emitting area of ​​the sub-pixels. The pixel openings are configured to expose the first electrode. The pixel partition structure is located at least partially within the pixel opening.

13. The display substrate according to claim 12, wherein, The pixel isolation structure is located at the edge of the first electrode, and the surface of the pixel isolation structure away from the substrate is at least partially covered by the material of the first electrode. The orthographic projection of the pixel isolation structure on the substrate at least partially overlaps with the orthographic projection of the pixel defining layer on the substrate.

14. The display substrate according to any one of claims 1-3, wherein, The substrate includes a display area and a peripheral area surrounding the display area. The display area includes an opening area, and an opening partition structure is provided at the edge of the opening area. The cross-sectional structure of the opening partition structure along the direction perpendicular to the substrate is the same as the cross-sectional structure of the pixel partition structure. The material of the opening partition structure is the same as the material of the pixel partition structure.

15. The display substrate according to any one of claims 1-3, wherein, The second electrode is disconnected at the location of the partition structure; or, The second electrode is located on the side of the light-emitting functional layer away from the substrate; the pixel partition structure surrounds the sub-pixel and includes at least one notch, and the second electrode is continuous at the location of the pixel partition structure.

16. A display device comprising the display substrate according to any one of claims 1-15.

17. A method for manufacturing a display substrate, comprising: Multiple first electrodes are formed on the substrate. A pixel separation structure is formed on the substrate. A light-emitting functional layer is formed on the side of the pixel isolation structure and the plurality of first electrodes away from the substrate, the light-emitting functional layer comprising a plurality of sub-functional layers; as well as A second electrode is formed on the side of the light-emitting functional layer away from the substrate. The second electrode, the light-emitting functional layer, and a plurality of first electrodes form a plurality of light-emitting elements for sub-pixels. The pixel separation structure is located between adjacent sub-pixels. The pixel separation structure includes a first sub-pixel separation portion, a second sub-pixel separation portion, and a third sub-pixel separation portion stacked together. The second sub-pixel separation portion is located on the side of the first sub-pixel separation portion away from the substrate, and the third sub-pixel separation portion is located on the side of the second sub-pixel separation portion away from the first sub-pixel separation portion. The second sub-pixel partition includes a plurality of sub-partition layers stacked along a direction perpendicular to the substrate. At least one of the sub-partition layers has a first protrusion extending beyond the first sub-pixel partition in the arrangement direction of two adjacent sub-pixels. The third sub-pixel partition has a second protrusion extending beyond at least one sub-partition layer in the arrangement direction of two adjacent sub-pixels. The display substrate further includes a planarization layer, which is located between the substrate and the first sub-pixel partition. The first sub-pixel partition and the planarization layer are integrally formed. Both the first sub-pixel partition and the planarization layer are made of organic materials.

18. The method for manufacturing a display substrate according to claim 17, wherein, At least one of the sub-blocking layers has its orthogonal projection on the substrate falling within the orthogonal projection of the third sub-pixel blocking portion on the substrate.

19. The method for manufacturing a display substrate according to claim 17, wherein, The orthographic projection of the second sub-pixel partition on the substrate falls within the orthographic projection of the third sub-pixel partition on the substrate.

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