Parameter sensing and computer modeling for gas delivery health monitoring

CN116209965BActive Publication Date: 2026-09-08APPLIED MATERIALS INC
View PDF 2 Cites 0 Cited by

Patent Information

Application Number
CN202180064973.X
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Priority Date
2020-09-22
Filing Date
2021-09-21
Publication Date
2026-09-08
Estimated Expiration
2041-09-21

AI Technical Summary

Technical Problem

这种冷凝可以吸收颗粒并且将颗粒携带到处理腔室中且在基板上沉积颗粒,从而在基板和任何所得的制造装置上导致颗粒缺陷

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure CN116209965B_ABST
    Figure CN116209965B_ABST
Patent Text Reader

Abstract

A method includes receiving measurement data from a plurality of sensors positioned along a delivery line that delivers a liquid as a gas to one of a gas panel or a process chamber; simulating, using a computer-generated model, one or more process parameters associated with the delivery line and a plurality of heater sheaths positioned around the delivery line; comparing the measurement data to values of the one or more process parameters; and determining, based on at least a threshold deviation between the measurement data and the values of the one or more process parameters, that there is a fault associated with maintaining a temperature within the delivery line consistent with a gaseous state of the liquid.
Need to check novelty before this filing date? Find Prior Art

Description

Technical Field

[0001] This specification generally pertains to gas delivery in processing chambers. More specifically, this specification pertains to parameter sensing and computer modeling for health monitoring of gas delivery.

[0002] background

[0003] The fabrication of modern materials often involves various deposition techniques, such as chemical vapor deposition (CVD) or physical vapor deposition (PVD), in which one or more types of atoms or molecules are deposited on a wafer (substrate) held in a low or high vacuum environment provided by a vacuum processing chamber (e.g., deposition, etching, etc.). For example, CVD deposition processes are used in a wide range of applications. These applications range from patterned films to insulating materials in transistor structures and between conductive metal layers forming circuits. Applications include shallow trench isolation, pre-metallic dielectrics, intermetallic dielectrics, and passivation. These are also used in strain engineering, which uses compressive or tensile stress films to enhance transistor performance through improved conductivity. Depending on the type of film to be deposited on the substrate, a precursor (gas or liquid) is delivered to a processing chamber where thermal oxidation or reaction results in the deposition of the desired film.

[0004] Precursors (and other liquids) induce chemical reactions during semiconductor manufacturing by introducing various types of reactive gases into the processing (or reaction) chamber. In CVD processes, there is a growing preference for using liquid precursors instead of gases. The popularity of liquid precursors is partly based on their physical properties, which make them less hazardous, flammable, corrosive, and toxic than gaseous precursors. For example, one of the more common liquids used in the manufacture of semiconductor devices is tetraethyl orthosilicate (TEOS), which frequently replaces silanes. Using TEOS, conformal silica (SiO2) films without detectable defects can be deposited, exhibiting better step coverage and significantly less hazard compared to silanes. In metal-organic CVD (MOCVD) processes, liquid precursors for metals such as copper are frequently used because gaseous precursors are unavailable.

[0005] Because the liquid precursor (and other processing liquids) is the first liquid, it is converted into a gaseous state to be transported as a gas through the delivery line. Failures in the manufacturing operation or delivery line environment (especially those affecting temperature and pressure) can cause some of the gas in the delivery line to condense. This condensation can absorb particles and carry them into the processing chamber and deposit them on the substrate, thus causing particle defects on the substrate and any resulting manufacturing apparatus. Attached Figure Description

[0006] Figure 1A An exemplary embodiment of health monitoring within a liquid conversion and gas delivery system to a processing chamber, according to some implementations, is shown.

[0007] Figure 1B This is an exemplary cross-sectional view of a portion of a delivery line, according to some embodiments, including multiple heater jackets positioned around the delivery line.

[0008] Figure 1C The diagram illustrates delivery lines positioned inside and outside a gas panel according to one embodiment.

[0009] Figure 2A This is an exemplary cross-section of a dual delivery pipeline carrying different gases, according to some embodiments.

[0010] Figure 2B This is a graph illustrating, according to one embodiment, how vapor pressure changes with the temperature of tetraethyl orthosilicate (TEOS) in a delivery pipeline.

[0011] Figure 3 This is a flowchart of a method for monitoring the health of a gaseous liquid being delivered to a processing chamber, according to some embodiments.

[0012] Figure 4 This is a flowchart of a method for generating and calibrating a computer-generated model according to some implementation methods.

[0013] Figure 5 This is a flowchart of a method for training a machine learning model to predict faults in liquid conversion and gas delivery systems, according to some implementation methods.

[0014] Figure 6 It is a collection of graphs showing sensor measurement data compared to a computer-generated model of one or more processing parameters, according to one implementation method, and from which patterns of change may be produced.

[0015] Figure 7 A block diagram depicts an example computing device that operates according to one or more aspects of this disclosure and is capable of parameter sensing and computer modeling for gas transport health monitoring according to various embodiments. Summary of the Invention

[0016] In one embodiment, a method is disclosed that includes receiving measurement data from multiple sensors positioned along a delivery line that delivers liquid as a gas to either a gas panel or a processing chamber. The method further includes simulating one or more processing parameters associated with the delivery line and multiple heater sheaths positioned around the delivery line using a computer-generated model executed on a processing device. The method further includes comparing the measurement data with values ​​of the one or more processing parameters by means of the processing device. The method further includes determining, by means of the processing device, the presence of a fault associated with maintaining temperature consistency with the gaseous state of the liquid within the delivery line based on at least a threshold deviation between the measurement data and the values ​​of the one or more processing parameters.

[0017] In another embodiment, a system is disclosed, including a memory and a processing device operatively coupled to the memory for receiving measurement data from a plurality of sensors positioned along a processing subsystem that delivers liquid as a gas into a processing chamber. The processing device further executes a computer-generated model to simulate one or more processing parameters associated with the processing subsystem. The processing device further compares the measurement data with values ​​of the one or more processing parameters. The processing device further determines, based on at least a threshold deviation between the measurement data and the values ​​of the one or more processing parameters, the presence of a fault associated with maintaining temperature and pressure within the processing subsystem consistent with the gaseous state of the liquid.

[0018] In another embodiment, a non-transitory computer-readable storage medium is disclosed that stores instructions, when executed by a processing device, causing the processing device to perform multiple operations, including receiving measurement data from multiple sensors positioned along a delivery line that delivers liquid as a gas into a processing chamber. The operations further include simulating one or more processing parameters associated with the delivery line and multiple heater sheaths positioned around the delivery line by executing a computer-generated model. The operations further include comparing the measurement data with values ​​of the one or more processing parameters. The operations further include determining the presence of a fault associated with maintaining temperature and pressure within the delivery line consistent with the gaseous state of the liquid, based on at least a threshold deviation between the measurement data and the values ​​of the one or more processing parameters. Detailed Implementation

[0019] The various embodiments disclosed herein provide parameter sensing and computer modeling for health monitoring of precursors and other gas deliveries. For example, a precursor (such as TEOS) is a liquid with a boiling point of 168°C at room temperature. Therefore, TEOS is typically a liquid precursor delivered as a gas to the processing chamber after passing through a gas panel. Thus, methods such as boiling, bubbing, or injection are used to convert the precursor into a gaseous state. To prevent condensation of the gaseous precursor, the delivery line is heated by using multiple heater jackets wound around the line. Improper installation of any heater jacket, heater jacket failure (physical damage or control problems), or inconsistencies in heater jacket installation after preventative maintenance can all cause the gas pressure to drop below the gas saturation pressure and condensation in the line. Condensation subsequently leads to particle defects, potential wafer scrap, and lengthy and costly unplanned maintenance procedures.

[0020] Although this application relates to precursors by way of example, this disclosure is applicable to any gas that will be maintained within a temperature range to prevent condensation back into a liquid state. For example, the gas may be located in a fore-gas line (where gas is entering the processing chamber) or an exhaust gas line (where processed gas is leaving the processing chamber), and the gas deposited as a liquid will be avoided within the gas line and elsewhere in the gas delivery system. Preventing this type of conversion to liquid and corresponding deposition within the delivery line can prevent blockages or other adverse pumping performance.

[0021] Therefore, to address these shortcomings in current technologies employing gaseous liquids, this embodiment tracks parameters related to maintaining the liquid in this gaseous state. For example, these parameters may be one or more of the following: temperature, pressure, gas concentration, gas flow rate, and / or the power output of the heater sheath. More specifically, this embodiment employs a computing device to calibrate or machine learn a computer-generated model that is physics-based and characterizes the physical system of the delivery pipeline and heater sheath over time by predicting one or more of these parameters.

[0022] In various embodiments, the computing device may then compare the predicted value of a parameter with measurement data received from multiple sensors positioned (e.g., attached) along the delivery line. If there is a change in the predicted value and the measured data value for a parameter that at least meets a threshold deviation, the computing device detects a fault. In some embodiments, predicted and measured values ​​for more than one parameter may be combined. The computing device may further determine (or identify) a deviation pattern of this threshold deviation, at least in terms of the measured data and the predicted value of the parameter. The computing device may compare the deviation pattern with predetermined deviation patterns previously associated with various faults to determine a specific fault. The computing device may further warn the operator of the specific fault and, where appropriate, suspend processing when the specific fault is resolved and the operator clears the process to continue.

[0023] This approach can be further applied to larger assemblies of physical processing subsystems, such as those comprising delivery lines, heater sheaths positioned around the delivery lines, gas panels, and processing chambers. In this way, the computer-generated model can be extended for preventative maintenance, fault detection, or automated diagnostics of the gaseous state of precursors or other gases, both outside and inside the processing chamber.

[0024] In some implementations, the computer-generated model integrates statistical analysis of measurement data received from sensors. Furthermore, the computing device can further utilize measurement data from sensors located along the delivery pipeline (or processing subsystem) to perform reinforcement learning on the computer-generated (e.g., machine learning) model. Reinforcement learning and / or statistical analysis enable the updating of the computer-generated model and the tracking of trends in parameters across sections, elbows, and zones of the delivery pipeline (in addition to other components across the processing subsystem, such as gas panels and processing chambers).

[0025] The disclosed embodiments relate to various manufacturing techniques using processing chambers (which may include deposition chambers, etching chambers, and similar chambers), such as chemical vapor deposition (CVD), physical vapor deposition (PVD), plasma-enhanced CVD, plasma-enhanced PVD, sputtering deposition, atomic layer CVD, combustion CVD, catalytic CVD, evaporation deposition, molecular beam epitaxy, and so on. The disclosed embodiments can be employed in techniques using vacuum deposition chambers (e.g., ultra-high vacuum CVD or PVD, low-pressure CVD, etc.) as well as in atmospheric pressure deposition chambers.

[0026] Figure 1AAn exemplary embodiment of health monitoring within a liquid conversion and gas delivery system 100 to a processing chamber, according to some implementations, is shown. The liquid conversion portion of system 100 may include a carrier gas line 102 and a push gas line 104. Carrier gas line 102 may include a flow control valve and a mass flow controller (MFC) to allow a carrier gas (typically an inert gas) to enter an evaporator 110. Push gas line 104 may include a flow control valve, a liquid storage container 114, and a liquid flow meter (LFM) to also deliver liquid to the evaporator 110. The evaporator 110 may subsequently convert the liquid (such as a precursor) into a gas by boiling, foaming, or injecting the carrier gas into the liquid precursor while simultaneously heating the gas with an ambient heater.

[0027] In various embodiments, the liquid conversion and gas delivery system 100 includes a gas delivery system 118, which in turn includes an assembly of delivery lines 120 preceding and following the gas panel 124, and a plurality of heater sheaths 128 positioned around the assembly of delivery lines 120. For example, the assembly of delivery lines 120 may include an assembly of facility gas lines 120A from a gas source within the facility (e.g., the evaporator 110 in the disclosed embodiments) and coupled to the gas panel 124, and an assembly of chamber gas lines 120B coupled between the gas panel 124 and the processing chamber 115 (or multiple processing chambers).

[0028] The heater sheath 128 is shown in a simplified manner and separated from the assembly of delivery lines 120, so as not to obscure the illustration of these components. However, Figure 1B This is an exemplary cross-sectional view of a portion of a delivery line 120, according to some embodiments, including a plurality of heater sheaths 128A, 128B, 128C, and 128D positioned around the delivery line 120. In other words, the plurality of heater sheaths completely wrap around the outer surface of the delivery line 120. The length of the delivery line 120 can thus be covered by these heater sheaths 128 to maintain the gas in a gaseous state by sufficiently heating the delivery line 120.

[0029] In these embodiments, the heater housings 128A, 128B, 128C, and 128D will each typically include one or more heating elements 132 connected to a power source and have a power output that can be tracked as measurement data. Each heater housing 128 will also typically include at least one thermocouple 136 (e.g., a temperature sensor) to track the temperature of the heater housing. In some embodiments, the heater housing includes a function coupled between the power source and the heater housing, similar to closed-loop control of a thermostat. When the heater housing 128 reaches a target temperature, the thermocouple 136 levels off the power supplied to the heater housing. The thermocouple 136 can then periodically measure the temperature of the heater housing, and when the temperature drops below a threshold temperature value, the power supplied to the heater housing can be increased again until the target temperature is reached.

[0030] Figure 1C An assembly of delivery lines 120 positioned inside and outside a gas panel 124 according to one embodiment is shown. As shown, the assembly of delivery lines 120 entering the gas panel 124 may be a plurality of facility gas lines 120A or a feed running from facility gas lines as discussed. The assembly of delivery lines 120 exiting the gas panel 124 may be an assembly of chamber gas lines 120B coupled between the gas panel 124 and a processing chamber (such as processing chamber 115). The ends of the chamber gas lines 120B may be attached to chamber gas passages 138, which are attached to a plurality of processing chambers.

[0031] In some embodiments, the assembly of delivery lines 120 is identified by segments or regions and includes various bends, curves, and other changes in orientation. These non-linear characteristics of the assembly of delivery lines 120 make it more challenging to completely and reliably cover the entire outer surface of the assembly of delivery lines 120 using heater sheaths 128. Additionally, heater sheaths 128 are removed from the assembly of delivery lines 120 during preventative (or required ad hoc) maintenance. If these heater sheaths 128 are not properly reinstalled around the assembly of delivery lines 120 in the congested space, which is sometimes the gas delivery system 118, the delivery lines 120 may still be at least partially exposed to ambient air. This exposure can lead to incorrect temperature variations in those areas and thus the risk of gas condensing back into a liquid state within at least a portion of the delivery lines.

[0032] As a specific example Figure 2AThis is an exemplary cross-section of a dual delivery line 220 carrying different gases according to some embodiments. The dual delivery line 220 includes a top delivery line carrying TEOS and argon (Ar) and a bottom delivery line carrying nitrous oxide (N2O). Note that the various light-colored arrows indicate heat flow from a heater sheath 228 positioned around the dual delivery line 220. For example, heat flows from the heater sheath 228 to the stainless steel (or other metal) conduit of the dual delivery line 220. Heat also flows across both sections of each delivery line until heat also flows in the gap between the dual delivery lines 220. Within the dual delivery line 220, heat also flows from the heated gas to the stainless steel conduit of the dual delivery line 220. The physics-based model, which will be discussed in more detail, takes into account factors of these surfaces (including contact resistance) and the gases themselves in the fluid dynamics and heat transfer equations.

[0033] Figure 2B This is a graph illustrating, according to one embodiment, how the vapor pressure changes with the temperature of TEOS in the top delivery line. Therefore, temperature itself affects the pressure within the delivery line, which will remain sufficiently constant and above the saturation pressure to prevent condensation.

[0034] Additional References Figure 1A Multiple sensors 140 are located along the gas delivery system 118, including an assembly along the delivery line 120 and, where appropriate, also inside the gas panel 124 and the processing chamber 115 (together referred to herein as the processing subsystem). Figure 1C Some potential locations of these sensors 140 are shown as a star pattern overlaid at various locations along the delivery line 120. In one embodiment, the sensors 140 are a collection of temperature sensors synchronized and coupled to a computing device 101, which includes a processing device operatively coupled to a processing unit (see...). Figure 7 The sensor 140 may be wirelessly and / or wirelessly coupled to the computing device 101 via a wired connection. In an alternative embodiment, the computing device 101 is or includes an edge device locally located from the sensor 140.

[0035] In various embodiments, these sensors 140 may include one or more of the following: thermocouples, pressure sensors, concentration sensors, optical sensors, gas flow sensors, or heater sheath power output sensors. Thus, some sensors 140 are attached to the delivery line 120, while others are located or attached inside the delivery line, within the gas panel 124 and / or within the processing chamber 115. Temperature sensors can detect temperature, such as a reference temperature... Figure 2BThe discussion relates to pressure. Alternatively, pressure can be measured directly by a pressure sensor. The pressure in the delivery line can be correlated with a specific gas (e.g., precursor) mixture and it can be determined whether the pressure in the delivery line has dropped below the saturation pressure of the specific gas mixture, and therefore condenses.

[0036] In several related or different embodiments, a concentration sensor can sense the gas concentration in the delivery line, which can be another way to detect condensation. For example, the concentration sensor can be a piezoelectric cone. Alternatively, optical sensors, such as tomographic sensors or nondispersive infrared (NDIR) sensors, can be used, where the gas concentration is proportional to the absorption at a specific wavelength and can identify specific compounds in the scanned gas. Optical sensors can thus detect phase changes in the liquid that indicate condensation. A heater jacket power output sensor can be coupled to the heater jacket and detect anomalies or other deviations from the expected standard of power, which can indicate a defective heater jacket.

[0037] In various embodiments, Figure 1A The computing device 101 can execute instructions stored in memory to instantiate various modules or components of the computing device 101, including a sensor control module (SCM) 150, a sensor statistics module (SSM) 152, a machine learning module (MLM) 154, and a fault detection module (FDM) 170. In some embodiments, computer-generated models including machine learning models can be stored in memory and referenced during parameter sensing and computer modeling for gas transport health monitoring.

[0038] SCM 150 can activate sensors, deactivate sensors, place sensors in an idle state, change sensor settings, detect sensor hardware or software problems, and so on. In some implementations, SCM 150 can keep track of the processing operations performed by system 100 and determine which sensors 140 will be sampled for specific processing (or diagnostic, maintenance, etc.) operations of system 100.

[0039] SSM 152 can process raw data obtained from sensor 140 via SCM 150 and determine statistics representing the raw data. For example, for each or some of the raw sensor data distributions, SCM 150 can determine one or more parameters of the distribution, such as the mean, median, mode, upper limit, lower limit, variance (or standard deviation), skewness (third moment), kurtosis (fourth moment), or any other moment or cumulative quantity of the data distribution. In some implementations, SCM 150 can model the raw data using various model distributions (normal distribution, log-normal distribution, binomial distribution, Poisson distribution, gamma distribution, or any other distribution) (e.g., fitting via regression analysis). In such implementations, one or more parameters may include the identification of a fitted distribution used with fitting parameters determined by SCM 150.

[0040] In some implementations, the SCM 150 can use multiple distributions to fit raw data from a single sensor, such as the principal and tail distributions for outlier data points. The parameters of the distributions obtained by the SCM 150 can be sensor-specific. For example, for some sensors, a small number of parameters (mean, median, variance) can be determined, while for others, more (e.g., 10 or 20) torques can be determined.

[0041] In various embodiments, the computer-generated model 160 includes at least one of the following: fluid dynamics equations, heat transfer equations, and / or thermal contact resistance equations associated with the delivery pipeline or the processing subsystem. The heat transfer equations can be of at least three types, including but not limited to heat conduction, heat convection, and heat radiation. The thermal contact resistance equations can model less-than-perfect heat transfer (e.g., conduction) between two surfaces in contact with each other, such as in the case of various sensors. Other equations based on thermodynamics or physics are envisioned. The computer-generated model can be an aggregation or mixture of at least some of these equations.

[0042] In some implementations, computing device 101 can calibrate computer-generated model 160, such as by referencing... Figure 4 More detailed discussion follows. In several other embodiments, the MLM 154 of computing device 101 can use a training dataset as input to train a machine learning model. This training dataset is measured by multiple sensors 140 and associated with one or more processing parameters to provide a computer-generated model 160 instead of rigorous algorithmic fusion. Implementations of the machine learning model will be referred to... Figure 5 For more details, in some implementations, the MLM 154 resides on a remote server or may be distributed across multiple processing devices and operates on the training dataset to train the machine learning model, and sends the machine learning model back to the computing device 101 for storage and use.

[0043] In various embodiments, FDM 170 can compare predicted parameter values ​​with measurement data received from multiple sensors 140 located (e.g., attached) along delivery line 120. If a change in the predicted value for a parameter differs from the measured data value by at least a threshold deviation, FDM 170 detects a fault. In some embodiments, FDM 170 can combine predicted and measured data values ​​for more than one parameter, e.g., statistically or otherwise, to determine a fault based on more than one parameter, such as temperature, pressure, gas concentration, gas flow rate, and / or heater sheath power output. FDM 170 can further determine (or identify) a deviation pattern of this threshold deviation between the measured and predicted values ​​of at least the parameter. FDM 170 can compare the deviation pattern with predetermined deviation patterns previously associated with various faults to determine a specific fault. Computing device 101 can further alert the operator to the specific fault and, where appropriate, suspend processing when the specific fault is resolved and the operator clears the process to continue.

[0044] In some implementations, during calibration runs and while tracking parameter values ​​that tend to change over time and are associated with identified faults, additional or more subtle patterns of change can be associated with specific faults and stored in tables or other data structures, such as the memory of computing device 101. FDM 170 can access this table or data structure during automated diagnostics or post-preventive maintenance analysis to determine if a fault has been detected. Specific faults that FDM 170 can identify include, but are not limited to: ambient air leakage through heater sheath 128 into direct contact with delivery line 120; lack of sensitivity to changes in gas flow rate; a partial pressure of gas predicted by computer-generated model 160 below the saturation pressure of the liquid; input power to one or more of the multiple heater sheaths outside a predetermined range for maintaining a target temperature within the delivery line; a gas temperature in the chamber manifold below historical temperature values; or unexpected fluctuations in sensor signals from one of the multiple sensors 140.

[0045] The above approach can be further applied to larger collections of physical processing subsystems, such as those including delivery lines 120 (or multiple delivery lines), heater sheaths 128 positioned (e.g., wound) around delivery lines 120, gas panels 124, and processing chambers 115. In this way, the computer-generated model 160 can be extended for preventative maintenance, fault detection, or automated diagnostics of the gaseous state of liquids both outside and inside the processing chamber 115.

[0046] In some implementations, the computer-generated model 160 integrates statistical analysis of measurement data received from sensor 140. Furthermore, the computing device 101 may further utilize measurement data from sensors located along the delivery line (or processing subsystem) to perform reinforcement learning on the computer-generated model 160 (or machine learning model). Reinforcement learning and / or statistical analysis enable the updating of the computer-generated model and the tracking of trends in parameters across sections, bends, and regions of the delivery line (in addition to other components of the processing subsystem, such as gas panel 124 and processing chamber 115). Additionally, comparing measurement data with values ​​of one or more processing parameters may include comparing measurement data of one section of a plurality of sections of the delivery line with specific values ​​of one or more processing parameters corresponding to that section. Therefore, the diagnostic analysis discussed herein can be performed at the granularity of different sections, regions, or bends of the delivery line 120, or as a collection of such components.

[0047] Furthermore, by means of reinforcement learning and other updates performed on the computer-generated model 160, the computing device 101 can take one or more of the multiple sensors 140 offline. Alternatively, for example, during preventative maintenance, when an operator accesses the sensors 140, one or more of the multiple sensors 140 can be removed. This is because the computer-generated model 160 will be adequately calibrated or trained to maintain accuracy with only sparse and / or infrequent measurement data. The need for fewer sensors 140 saves resources in the long run and simplifies the system 100.

[0048] Figure 3 This is a flowchart of a method 300 for monitoring the health of a gaseous liquid being delivered to a processing chamber according to some embodiments. Method 300 can be executed by processing logic, which may include hardware (e.g., processing device, circuitry, dedicated logic, programmable logic, microcode, device hardware, integrated circuits, etc.), software (e.g., instructions that run or execute on the processing device), or a combination thereof. In some embodiments, method 300 is executed by... Figures 1A to 2A The system 100 and components shown, or any combination thereof, are executed. Method 300 can be executed using a single processing device or multiple processing devices. As indicated by the dashed lines, some operations of method 300 may be optional. In various embodiments, some operations of method 300 are executed by the processing device (processor, central processing unit (CPU)) of computing device 101, for example, in response to instructions issued by fault detection module (FDM) 170.

[0049] In various embodiments of method 300, at operation 310, the processing logic executes a sequence of plans for processing the substrate in processing chamber 115 and other processing chambers, the sequence of plans including planned idle times. At operation 320, the processing logic proceeds to the next plan or item in the sequence of plans. In one embodiment, the next plan to be processed is a preventative maintenance recovery check.

[0050] In operation 325, the processing logic receives measurement data from a plurality of sensors 140 positioned along a delivery line that delivers liquid as gas to either a gas panel or a processing chamber. In another embodiment, operation 325 is extended to include receiving measurement data from a plurality of sensors 140 positioned along a processing subsystem that delivers liquid as gas to a processing chamber.

[0051] In operation 330, the processing logic simulates one or more processing parameters associated with delivery line 120 and multiple heater sheaths 128 positioned (e.g., wound) around the delivery line by executing a computer-generated model. In another embodiment, operation 330 is extended to include simulating one or more processing parameters across components of the processing subsystem, such as delivery line 120, gas panel 124, multiple heater sheaths 128, and processing chamber 115. In some embodiments, operations 325 and 330 are executed in parallel. In these and alternative embodiments, operations 325 and 330 are executed periodically or continuously during processing to perform real-time diagnostics on at least delivery line 120 and, where appropriate, the processing subsystem.

[0052] In operation 340, the processing logic compares the measurement data (from multiple sensors 140) with the values ​​of one or more processing parameters. This comparison may be, for example, a comparison of a first signal received from the multiple sensors 140 with a second signal generated by a computing device 101 executing a computer-generated model 160.

[0053] In operation 350, the processing logic determines whether the difference between the measured data and the value of one or more processing parameters meets at least a threshold deviation. If so, operation 350 proceeds, and subsequently in operation 352, this threshold deviation can trigger the processing logic to determine that a fault has been detected and trigger a corrective action. For example, in operation 355, the processing logic can suspend processing (e.g., within processing chamber 115) in response to the fault determination. Other corrective actions may also be taken, such as compensating for temperature deviations in the heater housing by increasing the power to the heater housing and similar actions. If no at least a threshold deviation is detected, the processing logic can loop back to operation 310, where the next processing step in the sequence of actions is executed without interruption.

[0054] Additional References Figure 3In operation 360, the processing logic determines a deviation pattern of at least a threshold deviation between the measured data and the values ​​of one or more processing parameters. In operation 370, the processing logic determines whether the deviation pattern corresponds to any one or more predetermined faults, the processing logic referring to... Figure 1A The discussion can be accessed in tables or other data structures in the memory of computing device 101. If operation 370 produces a negative response, then in operation 380, the processing logic warns the operator of a known fault, such as a specific, identified fault. If operation 370 produces a positive response, then in operation 390, the processing logic warns the operator of an unknown fault. This unknown fault may be a reason for performing preventative maintenance or taking additional diagnostic steps to attempt to verify a sufficient cause of the unknown fault. The processing logic can send or issue these warnings to the operator via input / output (I / O) devices of the processing unit coupled to computing device 101.

[0055] In either case, at operation 395, the processing logic may wait for operator input (e.g., via an I / O device) indicating that processing should proceed before continuing. This may force the processing logic into a safety cycle (similar to the emergency stop paused at operation 355) until the operator manually inserts a command to continue after verifying that the fault has been resolved.

[0056] Figure 4 This is a flowchart of a method 400 for generating and calibrating a computer-generated model according to some embodiments. Method 400 can be executed by processing logic, which may include hardware (e.g., processing device, circuit system, dedicated logic, programmable logic, microcode, device hardware, integrated circuit, etc.), software (e.g., instructions that run or execute on the processing device), or a combination thereof. In some embodiments, method 400 is executed by... Figures 1A to 2A The system 100 and components shown, or any combination thereof, are executed. Method 400 can be executed using a single processing device or multiple processing devices. Some operations of method 400 may be optional, as indicated by the dashed lines. In an embodiment, some operations of method 400 are executed by the processing device (processor, central processing unit (CPU)) of computing device 101.

[0057] In operation 410, the processing logic incorporates algorithms for fluid dynamics, heat transfer, and / or, depending, thermal contact resistance associated with the gas delivery line (or processing subsystem) to produce a computer-generated model. In operation 420, the processing logic receives a dataset of baseline measurements from multiple sensors 140. The baseline measurement data can be obtained when system 100 is first brought online or after preventative maintenance and reset of system 100.

[0058] In operation 430, the processing logic inputs a dataset into a computer-generated model, for example, for calibration purposes. In operation 440, the processing logic executes the computer-generated model to predict one or more faults based on the input dataset. In this way, the processing logic calibrates the computer-generated model 160 using baseline measurement data, which is compared with an updated dataset of measurement data (or inferred from an updated dataset of measurement data). In operation 450, the processing logic compares the faults predicted by the computer-generated model with known faults that have occurred, for calibration purposes.

[0059] In operation 460, the processing logic determines, based on comparison, whether the prediction determined in operation 450 is correct. For example, the prediction may be determined to ensure that the computer-generated model 160 predicts a fault within an accuracy threshold criterion, and therefore is a correct prediction. If the prediction determined in operation 450 is correct, then in operation 470, the processing logic outputs a calibrated model as the computer-generated model 160 for fault diagnosis of the delivery pipeline 120 and / or the processing subsystem. Although temporarily completed in operation 470, method 400 can use historical measurement data received in the interim to repeat at a later date, thereby producing an updated calibrated model based on measurement data received during a time period. If the prediction determined in operation 450 is incorrect, then in operation 480, the processing logic updates the computer-generated model based on the prediction failure and loops back to operation 410 to continue calibrating the computer-generated model.

[0060] Figure 5 This is a flowchart of a method 500 for training a machine learning model to predict faults in a liquid conversion and gas delivery system, according to some embodiments. Method 500 can be executed by processing logic, which may include hardware (e.g., processing device, circuit system, dedicated logic, programmable logic, microcode, device hardware, integrated circuit, etc.), software (e.g., instructions that run or execute on the processing device), or a combination thereof. In some embodiments, method 500 is executed by... Figures 1A to 2A The system 100 and components shown, or any combination thereof, are executed. Method 500 can be executed using a single processing device or multiple processing devices. As indicated by the dashed lines, some operations of method 500 may be optional. In various embodiments, some operations of method 500 are executed by the processing device (processor, central processing unit (CPU)) of computing device 101, for example, in response to instructions issued by machine learning module (MLM) 154.

[0061] In operation 510, the processing logic initializes (or updates, if in a later iteration of method 500) the untrained machine learning model. In operation 520, the processing logic receives a training dataset of measurement data from multiple sensors 140. Depending on the focus of the machine learning model, this measurement data may come from different types of sensors or multiple types of sensors. In one embodiment, the focus of the machine learning model is to predict a single parameter, such as temperature, and this may be performed multiple times for different parameters, such as pressure, gas concentration, or power output of the heater sheath 128. In another embodiment, the focus of the machine learning model is to predict a combination of parameters, which may be related to, for example, temperature and pressure, or the concentration and composition of molecules detected from optical sensors.

[0062] In operation 530, the processing logic inputs the training dataset into the untrained machine learning module. In operation 540, the processing logic trains the untrained machine learning module to produce a machine learning model that is at least partially trained. In operation 550, the processing logic compares the faults predicted by the (at least partially) trained machine learning model with the generated known faults for the purpose of supervised learning.

[0063] Continue to refer to Figure 5 In operation 560, the processing logic determines whether the prediction determined in operation 550 matches a known fault, wherein the processing logic compares the prediction with the known fault. If the prediction is incorrect, the processing logic loops back to operation 510 to continue (at least partially) training the still untrained machine learning model. However, if the prediction is correct, in operation 570, the processing logic outputs the trained machine learning model as a computer-generated model 160 for fault diagnosis of gas delivery pipeline 120 and / or the previously discussed processing subsystem.

[0064] Figure 6This is a set of graphs showing sensor measurement data compared to a computer-generated model of one or more processing parameters, according to one embodiment, and from which patterns of change can be generated. For example, a set of sensor measurement data 605 (temperature for illustrative purposes) received from at least one sensor is identified as Ch36(C) at the fourth bend of delivery line 120. This sensor measurement data 605 can be plotted against gas flow (e.g., the flow rate of a gaseous precursor liquid). Sensor measurement data 605 can then be plotted on a single graph 607, which is shown as a lower line. The computer-generated model 160 (or machine learning model) can output its own predictions to the single graph 607, such as the upper line in this case. Note that although there is a correspondence between the upper and lower lines, there are some deviations that can be considered significant enough to be considered faults, particularly as seen over time at the beginning and inflection points. The computing device 101 can generate a deviation pattern by subtracting the lower line from the upper line, which can then be used when compared with a pre-stored deviation pattern to determine whether the deviation pattern matches one of a number of possible faults.

[0065] Figure 7 A block diagram depicts an example computing device 700 that operates according to one or more aspects of this disclosure and is capable of parameter sensing and computer modeling for gas transport health monitoring according to various embodiments. In one embodiment, the computing device 700 may be... Figure 1A The computing device 101 or the microcontroller of the computing device 101.

[0066] Example computing device 700 can be connected to other processing devices in a LAN, intranet, extranet, and / or the Internet. Computing device 700 can be a personal computer (PC), a set-top box (STB), a server, a network router, a switch or bridge, or any device capable of executing a set of instructions (continuously or otherwise) that specifies the actions to be taken by the device. Furthermore, although only a single example processing device is shown, the term "processing device" should also be considered to include any set of processing devices (e.g., computers) that independently or jointly execute a set of instructions (or multiple sets of instructions) to perform any one or more methods discussed herein.

[0067] Example computing device 700 may include processing device 702 (e.g., CPU), main memory 704 (e.g., read-only memory (ROM), flash memory, dynamic random access memory (DRAM) such as synchronous DRAM (SDRAM)), static memory 706 (e.g., flash memory, static random access memory (SRAM)), and auxiliary memory (e.g., data storage device 718), which communicate with each other via bus 730.

[0068] Processing device 702 represents one or more general-purpose processing devices, such as microprocessors, central processing units, or similar devices. More specifically, processing device 702 may be a complex instruction set computing (CISC) microprocessor, a reduced instruction set computing (RISC) microprocessor, a very long instruction word (VLIW) microprocessor, a processor implementing other instruction sets, or a processor implementing a combination of instruction sets. Processing device 702 may also be one or more special-purpose processing devices, such as application-specific integrated circuits (ASICs), field-programmable gate arrays (FPGAs), digital signal processors (DSPs), network processors, or similar devices. According to one or more aspects of this disclosure, processing device 702 may be configured to execute instructions for implementing methods 300 and / or 400 and 500 of monitoring the transport health of a gaseous liquid.

[0069] The example computing device 700 may further include a network interface device 708 communicatively coupled to a network 720. The example computing device 700 may further include a video display 710 (e.g., a liquid crystal display (LCD), a touchscreen, or a cathode ray tube (CRT)), an alphanumeric input device 712 (e.g., a keyboard), an input control device 714 (e.g., a cursor control device, a touchscreen control device, a mouse), and a signal generation device 716 (e.g., an acoustic speaker).

[0070] The computing device may include a data storage device 718, including a computer-readable storage medium (or more specifically, a non-transitory computer-readable storage medium) 728 on which one or more sets of executable instructions 722 are stored. According to one or more aspects of this disclosure, the executable instructions 722 may include executable instructions for implementing methods 300 and / or 400 and 500 for monitoring the transport health of a gaseous liquid.

[0071] The executable instructions 722 may also be wholly or at least partially housed within the main memory 704 and / or the processing device 702 during execution of the instructions 722 via the example computing device 700, which also constitutes a computer-readable storage medium, the main memory 704, and the processor 702. The executable instructions 722 may further be transmitted or received over a network via a network interface device 708.

[0072] Despite Figure 7 The term "computer-readable storage medium" (or "non-transitory computer-readable medium storing instructions") is defined as a single medium, and should be understood to include a single medium or multiple media (e.g., a centralized or distributed dataset, and / or associated caches and servers) that store one or more sets of operational instructions. The term "computer-readable storage medium" (or "non-transitory computer-readable medium storing instructions") should also be understood to include any medium capable of storing or encoding a set of instructions for execution by a machine, which causes the machine to perform any one or more methods described herein. The term "computer-readable storage medium" (or "non-transitory computer-readable medium") should therefore be understood to include, but is not limited to, solid-state storage, and optical and magnetic media.

[0073] It should be understood that the above description is intended to be illustrative rather than restrictive. Many other embodiments will become apparent to those skilled in the art upon reading and understanding the above description. Although specific examples are described in this disclosure, it will be appreciated that the systems and methods of this disclosure are not limited to the examples described herein, but may be practiced with modifications within the scope of the appended claims. Therefore, the specification and drawings are to be considered illustrative rather than restrictive. Consequently, the scope of this disclosure should be determined by referring to the entire scope of the appended claims together with their equivalents.

[0074] The methods, hardware, software, firmware, or code described above can be implemented via instructions or code stored on a machine-accessible, machine-readable, computer-accessible, or computer-readable medium executable by a processing element. "Memory" includes any mechanism that provides (i.e., stores and / or transmits) information in a form readable by a machine (such as a computer or electronic system). For example, "memory" includes random-access memory (RAM), such as static RAM (SRAM) or dynamic RAM (DRAM); ROM; magnetic or optical storage media; flash memory devices; electrical storage devices; optical storage devices; acoustic storage devices; and any type of tangible machine-readable medium suitable for storing or transmitting electronic instructions or information in a form readable by a machine (e.g., a computer).

[0075] Throughout this specification, references to "one embodiment" or "an embodiment" mean that a particular feature, structure, or characteristic described in connection with that embodiment is included in at least one embodiment of this disclosure. Therefore, the phrases "in one embodiment" or "in an embodiment" appearing in various places throughout this specification do not necessarily refer to the same embodiment. Furthermore, a particular feature, structure, or characteristic may be combined in any suitable manner in one or more embodiments.

[0076] In the foregoing description, detailed descriptions have been given with reference to specific exemplary embodiments. However, it will be appreciated that various modifications and changes can be made thereto without departing from the broader spirit and scope of this disclosure as set forth in the appended claims. The description and drawings are therefore to be regarded as illustrative rather than restrictive. Furthermore, the foregoing use of embodiments, implementations, and / or other exemplary language does not necessarily refer to the same embodiments or the same instances, but may refer to different and dissimilar embodiments, as well as potentially the same embodiments.

[0077] The terms “example” or “exemplary” are used herein to mean serving as an instance, example, or illustration. Any aspect or design described herein as an “example” or “exemplary” is not necessarily to be construed as preferred or advantageous over other aspects or designs. Rather, the use of the terms “example” or “exemplary” is intended to provide a concept in a specific manner. As used in this application, the term “or” is intended to mean an inclusive “or” rather than an exclusive “or.” That is, unless otherwise stated or clear from the context, “X includes A or B” is intended to mean any naturally included substitution. That is, “X includes A or B” is satisfied in any of the foregoing cases if X includes A; X includes B; or X includes both A and B. Furthermore, the article “a / an” as used in this application and the appended claims should generally be construed as meaning “one or more” unless otherwise stated or clear from the context involving the singular form. Additionally, the use of the terms “an embodiment” or “one implementation” or “one embodiment” throughout the text is not intended to mean the same implementation or implementation unless so described. Furthermore, as used herein, the terms “first,” “second,” “third,” “fourth,” etc., mean markers for distinguishing different elements and do not necessarily have ordinal meanings based on the numbers of the different elements.

Claims

1. A method for monitoring the health of gas transport, comprising the following steps: Measurement data is received from multiple sensors positioned along a delivery line that delivers liquid as a gas to either a gas panel or a processing chamber, wherein the delivery line comprises multiple sections, including bends and areas; A computer-generated model executed on the processing device is used to simulate one or more processing parameters related to the delivery pipeline and the multiple heater sheaths positioned around the delivery pipeline. The processing device compares the measurement data of one segment of the plurality of segments with the values ​​of one or more processing parameters corresponding to the segment. The processing device determines, based on at least a threshold deviation between the measured data and the values ​​of one or more processing parameters of the section, the existence of a fault associated with maintaining the temperature within the section of the delivery pipeline consistent with the gaseous state of the liquid; and In response to determining the fault, perform at least one of the following: The processing within the processing chamber is paused; or The operator is alerted to the fault via an input / output device coupled to the processing unit.

2. The method of claim 1 further comprises the step of: triggering a correction action in response to determining that the fault exists.

3. The method of claim 1, in response to the step of determining the fault, Waiting for input from the operator via the input / output device, the input indicating that the process should continue.

4. The method of claim 1, wherein the one or more processing parameters are at least one of the following: the temperature, pressure, concentration of the gas, or the power output of the plurality of heater sheaths, wherein the method further comprises the step of: training a machine learning model to provide the computer-generated model using a training dataset measured by the plurality of sensors and associated with the one or more processing parameters as input.

5. The method of claim 1, wherein the computer-generated model comprises at least one of the following: a fluid dynamics equation, a heat transfer equation, or a thermal contact resistance equation associated with the delivery pipeline.

6. The method of claim 1, wherein the method further comprises the following steps: Reinforcement learning is performed based on the values ​​of one or more processing parameters to update the computer-generated model, while processing is carried out within the processing chamber; and Remove one or more of the plurality of sensors or take one or more of the plurality of sensors offline.

7. The method of claim 1, further comprising the following steps: Determine the deviation pattern of the at least threshold deviation between the measurement data and the values ​​of the one or more processing parameters; and Identify the specific fault corresponding to the deviation mode of the one or more processing parameters.

8. The method of claim 7, wherein the specific fault comprises at least one of the following: The leakage of ambient air, passing through the multiple heater sheaths, comes into direct contact with the delivery pipeline; It lacks sensitivity to changes in the flow rate of the gas; The partial pressure of the gas, predicted by the computer-generated model, is lower than the saturation pressure of the liquid. The input power to one or more of the plurality of heater sheaths is outside the predetermined range for maintaining the target temperature in the delivery line; or Unexpected fluctuations in the sensor signal from one of the multiple sensors.

9. A system for monitoring the health of gas transport, comprising: Memory; Multiple sensors are positioned along a delivery line that transports liquid as a gas to either a gas panel or a processing chamber. The delivery line comprises multiple sections, including bends and areas. A processing device, operatively coupled to the memory and the plurality of sensors, the processing device being used for: Receive measurement data from the plurality of sensors; The computer-generated model is executed to simulate one or more processing parameters related to the delivery pipeline and the multiple heater sheaths positioned around the delivery pipeline; The measurement data of one segment of the plurality of segments is compared with the values ​​of one or more processing parameters corresponding to the segment; and Based on at least a threshold deviation between the measured data and the values ​​of one or more processing parameters of the section, a fault is determined to exist that is associated with maintaining the temperature and pressure within the section of the delivery pipeline in a consistent state with the gaseous state of the liquid; and In response to determining the fault, perform at least one of the following: The processing within the processing chamber is paused; or The operator is alerted to the fault via an input / output device coupled to the processing unit.

10. The system of claim 9, wherein the processing means further calibrates the computer-generated model using baseline measurement data from the plurality of sensors to ensure that the computer-generated model predicts the fault within a threshold criterion of accuracy.

11. The system of claim 9, wherein the computer-generated model comprises at least one of the following: a fluid dynamics equation, a heat transfer equation, or a thermal contact resistance equation associated with a statistical analysis of the delivery pipeline and measurement data received from the plurality of sensors.

12. The system of claim 9, further comprising a processing subsystem, the processing subsystem comprising: The assembly of delivery pipelines for carrying the liquid as the gas; A gas panel, coupled to the assembly of delivery lines, the gas panel being used to feed the gas through the delivery lines into the processing chamber; The plurality of heater sheaths are positioned around the delivery line to maintain the temperature and pressure of the delivery line, thereby maintaining the liquid in the gaseous state; and The processing chamber.

13. The system of claim 12, wherein the plurality of sensors comprises one or more of the following: thermocouples, pressure sensors, optical sensors, concentration sensors, gas flow sensors, or heater sheath power output sensors, and the processing device further uses a training dataset measured by the plurality of sensors and associated with the one or more processing parameters as input to train a machine learning model to provide the computer-generated model.

14. The system of claim 12, wherein the processing device is further configured to: Determine the deviation pattern of the at least threshold deviation between the measurement data and the values ​​of the one or more processing parameters; and Identify the specific fault corresponding to the deviation mode of the one or more processing parameters.

15. The system of claim 14, wherein the specific fault comprises at least one of the following: The leakage of ambient air, passing through the multiple heater sheaths, comes into direct contact with the delivery pipeline; It lacks sensitivity to changes in the flow rate of the gas; The partial pressure of the gas, predicted by the computer-generated model, is lower than the saturation pressure of the liquid. The input power to one or more of the plurality of heater sheaths is outside the predetermined range for maintaining the target temperature in the delivery line; The temperature of the gas in the chamber manifold is lower than the historical temperature value; or Unexpected fluctuations in the sensor signal from one of the multiple sensors.

16. A non-transitory computer-readable medium storing instructions that, when executed by a processing device, perform a plurality of operations, including the following steps: Measurement data is received from multiple sensors positioned along a delivery pipeline that delivers liquid as a gas into a processing chamber, wherein the delivery pipeline comprises multiple sections, including bends and areas; One or more processing parameters related to the delivery pipeline and multiple heater sheaths positioned around the delivery pipeline are simulated by executing a computer-generated model. The measurement data of one segment of the plurality of segments is compared with the values ​​of one or more processing parameters corresponding to the segment; and Based on at least a threshold deviation between the measured data and the values ​​of one or more processing parameters of the section, a fault is determined to exist that is associated with maintaining the temperature and pressure within the section of the delivery pipeline in a consistent state with the gaseous state of the liquid; and In response to determining the fault, perform at least one of the following: The processing within the processing chamber is paused; or The operator is alerted to the fault via an input / output device coupled to the processing unit.

17. The non-transitory computer-readable medium of claim 16, wherein the operation further comprises the step of: calibrating the computer-generated model using baseline measurement data from the plurality of sensors to ensure that the computer-generated model predicts the fault within a threshold criterion of accuracy.

18. The non-transitory computer-readable medium of claim 16, wherein the computer-generated model comprises at least one of the following: a fluid dynamics equation, a heat transfer equation, or a thermal contact resistance equation associated with a statistical analysis of the delivery pipeline and measurement data received from the plurality of sensors.

19. The non-transitory computer-readable medium of claim 16, wherein the one or more processing parameters are at least one of the following: the temperature, pressure, concentration of the gas, or the power output of the plurality of heater sheaths, wherein the plurality of operations further comprises the step of: training a machine learning model to provide the computer-generated model using a training dataset measured by the plurality of sensors and associated with the one or more processing parameters as input.

Citation Information

Patent Citations

  • Monitoring a system during low-pressure processes

    US20070239375A1

  • Substrate processing apparatus and non-transitory computer-readable recording medium

    US20180120822A1