Material recycling device and evaporation device

Abstract

The application relates to a material recycling device and an evaporation device. The material recycling device comprises a lining layer and a solvent supply assembly. A plurality of first through holes are arranged on the lining layer. The lining layer defines an evaporation cavity for accommodating evaporation material. The solvent supply assembly is configured to accommodate and provide dissolving agent, and make the dissolving agent flow to the inner wall of the evaporation cavity through the first through holes to dissolve the evaporation material attached to the inner wall of the evaporation cavity. When recycling the evaporation material, the device does not need to manually scrape the evaporation material on the lining layer, so that material recycling is simpler, the labor cost is reduced, and meanwhile, the way that the dissolving agent dissolves the evaporation material can recycle the evaporation material on the lining layer more cleanly and completely, so that the material recycling rate is improved.

Description

Technical Field

[0001] This application relates to the field of vapor deposition technology, and in particular to a material recovery device and a vapor deposition device. Background Technology

[0002] Currently, the mainstream fabrication process for Organic Light-Emitting Diodes (OLEDs) is vapor deposition technology. This technology utilizes the principle of thermal evaporation of organic materials. Organic materials are filled into a vapor deposition assembly, heated in a vacuum environment, causing them to melt, volatilize, or sublimate into a gaseous state. This gaseous flow of organic material is deposited onto a substrate, forming a corresponding organic film layer, thus fabricating an OLED device. However, during vapor deposition, a large amount of organic material adheres to the cavity lining, easily leading to material waste. To improve the utilization rate of organic materials, a common approach is to use a scraper to initially scrape and collect the adhered material from the cavity lining, then leach it, and finally purify and reuse the collected material. However, this method suffers from the problems of complex material collection and low recycling efficiency. Summary of the Invention

[0003] Therefore, it is necessary to provide a material recycling device and a vapor deposition device that can simplify material recycling in response to the above-mentioned technical problems.

[0004] In a first aspect, this application provides a material recovery apparatus, including an inner liner and a solvent supply assembly. The inner liner has a plurality of first through-holes. The inner liner defines a vapor deposition chamber for receiving vapor deposition material.

[0005] The solvent supply assembly is configured to contain and supply a solvent, and to allow the solvent to flow through the first through-hole to the inner wall of the vapor deposition chamber to dissolve the vapor deposition material adhering to the inner wall of the vapor deposition chamber.

[0006] The aforementioned material recovery device incorporates a first through-hole in the inner liner and a solvent supply component for providing the solvent. During vapor deposition, the solvent supply component supplies solvent, which flows through the first through-hole to the inner wall of the vapor deposition chamber (the inner wall of the inner liner). This solvent dissolves the vapor-deposited material on the inner wall. Over time, the solution droplets on the inner wall of the vapor deposition chamber coalesce and grow larger, eventually flowing down the inner wall, thus separating the vapor-deposited material from the inner wall of the liner. This structure eliminates the need for manual scraping of the vapor-deposited material from the liner during recovery, simplifying the process and reducing labor costs. Furthermore, the solvent-based dissolution of the vapor-deposited material allows for a cleaner and more complete recovery of the material from the liner, thereby improving the material recovery rate.

[0007] In one embodiment, an auxiliary layer is provided on the side of the inner liner facing the vapor deposition chamber, and a plurality of second through holes are provided on the auxiliary layer, the second through holes communicating with the first through holes.

[0008] By setting an auxiliary layer on the inner liner, the solution formed by the vapor deposition material and the solvent can flow on the auxiliary layer; on the other hand, the adhesion of the vapor deposition material to the material recovery device can be reduced, making it easier for the solvent to dissolve the vapor deposition material.

[0009] Furthermore, the auxiliary layer is made of polytetrafluoroethylene. This reduces the difficulty and cost of preparing the auxiliary layer.

[0010] Furthermore, each of the first through holes is evenly distributed on the inner liner layer.

[0011] Furthermore, each of the second through holes is evenly arranged on the auxiliary layer.

[0012] Furthermore, the porosity of the inner liner and the auxiliary layer is between 5% and 20%.

[0013] This allows the solvent to dissolve the vapor-deposited material on the auxiliary layer more evenly, thereby improving the material recovery rate of the vapor-deposited material.

[0014] In one embodiment, the liner includes an interconnected top and side portions, with a flow guide provided at the junction of the top and the side portions for guiding the solution on the top to the side portions.

[0015] This allows the solution at the top to flow more easily to the side, facilitating subsequent solution collection.

[0016] In one embodiment, the flow guide portion is provided with an arc-shaped flow guide surface, one end of which is connected to the inner wall surface of the top, and the other end of which is connected to the inner wall surface of the side portion. This simplifies the structure of the flow guide portion and makes it easier to manufacture.

[0017] In one embodiment, the solvent supply assembly includes a supply element, a main pipe, and a plurality of branch pipes. The supply element is used to supply the solvent. The inlet end of the main pipe is connected to the supply element, and the main pipe is provided with a plurality of outflow holes. The inlet end of each branch pipe is connected to the outflow hole, and the outlet end of each branch pipe is connected to the first through hole.

[0018] This simplifies the structure of the solvent supply assembly and allows for rapid supply of solvent to the first through-hole.

[0019] Furthermore, the solvent includes N-methyl-2-pyridinyl ketone.

[0020] In one embodiment, the material recovery device further includes a cooling assembly for cooling the solvent within the solvent supply assembly.

[0021] This keeps the solvent within a suitable temperature range, preventing it from evaporating and causing waste.

[0022] In one embodiment, the cooling assembly includes a cooling pipe for cooling the solvent within the solvent supply assembly.

[0023] This not only simplifies the structure of the cooling components but also increases their cooling efficiency.

[0024] In one embodiment, the material recovery device further includes a collection tank for collecting solvents on the inner wall of the vapor deposition chamber that have dissolved the vapor deposition material.

[0025] In this way, the solvent of the dissolved vapor-deposited material can be collected through the collection tank, that is, the solution formed by dissolution is collected, making the collection of vapor-deposited material more convenient.

[0026] Secondly, this application provides a vapor deposition apparatus, including the material recovery device described in the first aspect.

[0027] The aforementioned vapor deposition apparatus incorporates a first through-hole in the inner liner and a solvent supply component for providing the solvent. During vapor deposition, the solvent supply component supplies the solvent, which flows through the first through-hole to the inner wall of the vapor deposition chamber (the inner wall of the inner liner). This solvent dissolves the vapor deposition material on the inner wall. Over time, the solution droplets on the inner wall of the vapor deposition chamber coalesce and grow larger, eventually flowing down the inner wall, thus separating the vapor deposition material from the inner wall of the inner liner. This structure eliminates the need for manual scraping of the vapor deposition material from the inner liner during material recovery, simplifying the process and reducing labor costs. Furthermore, the solvent-based dissolution of the vapor deposition material allows for a cleaner and more complete recovery of the material from the inner liner, thereby improving the material recovery rate.

[0028] In one embodiment, the vapor deposition apparatus includes a cavity wall, and the material recovery device is detachably disposed on the cavity wall.

[0029] This facilitates the maintenance and replacement of the material recycling device, extending the service life of the vapor deposition equipment. Attached Figure Description

[0030] To more clearly illustrate the technical solutions in the embodiments of this application or the conventional technology, the drawings used in the description of the embodiments or the conventional technology will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0031] Figure 1 This is a schematic diagram of the structure of a material recycling device provided in one embodiment of this application;

[0032] Figure 2 This is a schematic diagram of the structure of another material recycling device provided in one embodiment of this application;

[0033] Figure 3 for Figure 2 The diagram shows the structure of the solvent supply component of the material recovery device.

[0034] Figure 4 for Figure 2 The diagram shows the structure of the cooling component of the material recovery device.

[0035] Figure 5 This is a schematic diagram of the vapor deposition apparatus provided in one embodiment of this application.

[0036] Explanation of reference numerals in the attached figures:

[0037] 10-Evaporation apparatus; 10a-Evaporation chamber; 11-Material recovery device; 111-Inner liner; 111a-First through hole; 1111-Top; 1112-Side; 1113-Flow guide; 1113a-Arc-shaped flow guide surface; 112-Solvent supply assembly; 1121-Supply component; 1122-Main pipe; 1123-Branch pipe; 113-Auxiliary layer; 113a-Second through hole; 114-Cooling assembly; 1141-Cooling pump; 1142-Cooling pipe; 12-Crucible; 13-Angle limiting plate; 14-Collection bottle; 20-Mask plate; 30-Substrate. Detailed Implementation

[0038] To facilitate understanding of this application, a more complete description will be provided below with reference to the accompanying drawings. Preferred embodiments of this application are shown in the drawings. However, this application can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a thorough and complete understanding of the disclosure of this application.

[0039] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the specification of this application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0040] When describing positional relationships, unless otherwise specified, when an element such as a layer, film, or substrate is referred to as being "on" another element, it may be directly on the other element or there may be intermediate elements present. Furthermore, when a layer is referred to as being "below" another layer, it may be directly below it or there may be one or more light-emitting units present. It is also understood that when a layer is referred to as being "between" two layers, it may be the only layer between the two layers, or there may be one or more light-emitting units present.

[0041] When using the terms “including,” “having,” and “comprising” as described herein, another component may be added unless explicitly qualifying terms such as “only,” “consisting of,” etc. are used. Unless otherwise stated, singular terms may include plural forms and should not be construed as having a quantity of one.

[0042] It should be understood that although the terms “first,” “second,” etc., may be used herein to describe various elements, these elements should not be limited by these terms. These terms are used only to distinguish one element from another. For example, without departing from the scope of this application, a first element may be referred to as a second element, and similarly, a second element may be referred to as a first element.

[0043] It should also be understood that, in interpreting an element, although not explicitly described, the element is interpreted as including a range of error, which should be within the acceptable deviation range of a particular value as determined by a person skilled in the art. For example, "approximately," "about," or "substantially" can mean within one or more standard deviations, without limitation herein.

[0044] Furthermore, in the instruction manual, the phrase "planar distribution diagram" refers to the diagram when the target part is viewed from above, and the phrase "cross-sectional diagram" refers to the diagram when the target part is viewed from the side as a cross-section taken by vertically cutting the target part.

[0045] Furthermore, the accompanying drawings are not drawn to a 1:1 scale, and the relative dimensions of the components are shown in the drawings only as examples and not necessarily to actual scale.

[0046] As described in the background section, a common method to improve the utilization rate of organic materials is to initially scrape and collect the adhering material on the cavity lining using a scraper, then soak it in a dissolving solution. After the solution dissolves the organic material on the lining, it is then purified by distillation. However, on the one hand, the material deposition area on the cavity lining is relatively large and the film thickness is relatively thin, making scraping with a scraper not only cumbersome but also inefficient; on the other hand, the lining needs to be disassembled periodically for material recovery, which also makes the operation cumbersome.

[0047] In view of this, embodiments of this application provide a material recycling apparatus and a vapor deposition apparatus that can simplify material recycling.

[0048] Firstly, referring to Figure 1 As shown, this application embodiment provides a material recycling device 11, which can be used in a vapor deposition apparatus 10. It should be noted that the material recycling device 11 can be integrally formed with the cavity wall of the vapor deposition apparatus 10, or it can be detachably connected to the cavity wall of the vapor deposition apparatus 10. Furthermore, the material recycling device 11 can also be reused as the inner wall of the vapor deposition apparatus 10. This application embodiment does not limit the configuration of the material recycling device 11.

[0049] Specifically, the material recovery device 11 includes an inner liner 111 and a solvent supply assembly 112. The inner liner 111 is provided with a plurality of first through holes 111a. The inner liner 111 defines a vapor deposition chamber 10a for receiving vapor deposition material.

[0050] Specifically, the solvent supply assembly 112 is configured to contain and supply a solvent for dissolving the vapor deposition material, and to allow the solvent to flow through the first through-hole 111a to the inner wall of the vapor deposition chamber 10a to dissolve the vapor deposition material adhering to the inner wall of the vapor deposition chamber 10a.

[0051] Here, "inner wall of vapor deposition chamber 10a" refers to the surface of the liner 111 facing the vapor deposition chamber 10a. It is understood that the first through-hole 111a can penetrate the liner 111. Here, "penetrates the liner 111" means that one end of the first through-hole 111a is located on the surface of the liner 111 facing the vapor deposition chamber 10a, and the other end is located on the surface of the liner 111 away from the vapor deposition chamber 10a. It should be emphasized that if the material recovery device 11 is reused as the inner wall of the vapor deposition device 10, the first through-hole 111a cannot penetrate the liner 111.

[0052] In one example, the solvent supply assembly 112 may be located inside the vapor deposition apparatus 10. Further, the solvent supply assembly 112 may be disposed on the side of the inner liner 111 facing away from the vapor deposition chamber 10a. In another example, the solvent supply assembly 112 may be located outside the vapor deposition apparatus 10. Here, "inside the vapor deposition apparatus 10" refers to the interior of the receiving cavity of the vapor deposition apparatus 10, and "outside the vapor deposition apparatus 10" refers to the exterior of the receiving cavity of the vapor deposition apparatus 10.

[0053] The aforementioned material recovery device 11 incorporates a first through-hole 111a on the inner liner 111 and a solvent supply component 112 for providing a solvent. During vapor deposition, the solvent supply component 112 supplies a solvent, which flows through the first through-hole 111a to the inner wall surface of the vapor deposition chamber 10a (the inner wall surface of the inner liner 111), dissolving the vapor deposition material on the inner wall surface. Over time, the solution droplets on the inner wall surface of the vapor deposition chamber 10a agglomerate and grow larger, eventually flowing down the inner wall surface, thus achieving separation of the vapor deposition material from the inner wall surface of the inner liner 111. This structure eliminates the need for manual scraping of the vapor deposition material from the inner liner 111 during material recovery, simplifying the process and reducing labor costs. Furthermore, the solvent-based dissolution of the vapor deposition material allows for cleaner and more complete recovery of the material from the inner liner 111, thereby improving the material recovery rate.

[0054] In one embodiment, reference Figure 2 As shown, an auxiliary layer 113 is provided on the side of the inner liner 111 facing the vapor deposition chamber 10a. The auxiliary layer 113 has a plurality of second through holes 113a, which communicate with the first through holes 111a. In one example, the second through holes 113a can penetrate through the auxiliary layer 113.

[0055] In this way, the surface of the auxiliary layer 113 is equivalent to the inner wall surface of the vapor deposition chamber 10a. During vapor deposition, the vapor deposition material adheres to the surface of the auxiliary layer 113, and at the same time, the solvent can flow to the surface of the auxiliary layer 113 to dissolve the vapor deposition material. After dissolution, the solution can flow rapidly along the surface of the auxiliary layer 113.

[0056] By providing an auxiliary layer 113 on the inner liner 111, it is possible to facilitate the flow of the solution formed by the vapor deposition material and the solvent on the auxiliary layer 113.

[0057] It is understandable that the auxiliary layer 113 can also be equivalent to a "non-stick layer", that is, reducing the adhesion of the vapor-deposited material on the surface of the auxiliary layer 113, so that after the vapor-deposited material dissolves, it can flow downward more easily under the action of gravity, minimizing the residue of vapor-deposited material on the surface of the auxiliary layer 113, thereby improving the material recovery rate.

[0058] Furthermore, the auxiliary layer 113 is made of polytetrafluoroethylene (PTFE). PTFE has the advantages of being resistant to acids and alkalis, resistant to various organic solvents, resistant to high temperatures, and almost insoluble in all solvents. At the same time, it has a low coefficient of friction and provides lubrication.

[0059] By using polytetrafluoroethylene (PTFE) as the auxiliary layer 113, on the one hand, because PTFE is inexpensive and easy to prepare, the preparation difficulty and cost of the auxiliary layer 113 can be reduced; on the other hand, because PTFE has a low coefficient of friction, the solution formed by the solvent and the vapor deposition material can flow on the auxiliary layer 113, thereby facilitating the collection of the vapor deposition material.

[0060] Furthermore, each of the first through holes 111a is uniformly arranged on the inner liner layer 111. Furthermore, each of the second through holes 113a is uniformly arranged on the auxiliary layer 113. In this way, the solvent can be evenly distributed on the surface of the auxiliary layer 113, thereby maximizing the dissolution of the vapor-deposited material on the surface of the auxiliary layer 113 and improving the material recovery rate.

[0061] Furthermore, the porosity of the inner liner 111 and the auxiliary layer 113 is between 5% and 20%. For example, the porosity of the inner liner 111 and the auxiliary layer 113 may be 5%, 10%, 15%, 18%, or 20%.

[0062] By ensuring that the porosity of the inner liner 111 and the auxiliary layer 113 is within the aforementioned range, the pore distribution on the inner liner 111 and the auxiliary layer 113 can be optimized. That is, with a lower porosity, it can be ensured that the solvent dissolves most of the vapor-deposited material on the surface of the auxiliary layer 113.

[0063] In one embodiment, reference Figure 1 and Figure 2 As shown, the inner liner 111 includes a top portion 1111 and a side portion 1112 that are connected to each other. A guide portion 1113 is provided at the connection between the top portion 1111 and the side portion 1112. The guide portion 1113 is used to guide droplets on the top portion 1111 to the side portion 1112. Here, "top portion 1111" can be understood as the portion of the inner liner 111 arranged in the horizontal direction. "Side portion 1112" can be understood as the portion of the inner liner 111 arranged in the vertical direction.

[0064] By providing a guide section 1113 at the connection between the top 1111 and the side 1112, the solution on the top 1111 can flow more easily to the side 1112, facilitating subsequent solution collection.

[0065] Understandably, in one example, the flow guide 1113 can be an integral structure with the inner liner 111. In another example, the flow guide 1113 can be a separate structure from the inner liner 111.

[0066] It can be understood that the top 1111 of the inner lining layer 111 may be provided with one evaporation port, or may be provided with a plurality of evaporation ports. With reference to Figure 2 as shown, when the top 1111 of the inner lining layer 111 is provided with a plurality of evaporation ports, a "几"-shaped structure can be formed between the plurality of evaporation ports. The "几"-shaped structure is also provided with the inner lining layer 111 and the auxiliary layer 113, the inner lining layer 111 is provided with a first through hole 111a, and the auxiliary layer 113 is provided with a second through hole 113a. Meanwhile, the inner lining layer 111 is also provided with a flow guiding portion 1113. In this way, the solvent supply assembly 112 supplies the dissolving agent, the dissolving agent flows through the first through hole 111a and the second through hole 113a to the inner wall surface of the "几"-shaped structure, so as to dissolve the evaporation material on the inner wall surface of the "几"-shaped structure to form a dissolving solution, and the dissolving solution can flow along the inner wall surface of the "几"-shaped structure sequentially through the top 1111 of the inner lining layer 111 below the "几"-shaped structure and the side portion 1112 of the inner lining layer 111 below the "几"-shaped structure.

[0067] In one embodiment, with reference to Figure 1 and Figure 2 as shown, the flow guiding portion 1113 is provided with an arc-shaped flow guiding surface 1113a, one end of the arc-shaped flow guiding surface 1113a is connected to the inner wall surface of the top 1111, and the other end of the arc-shaped flow guiding surface 1113a is connected to the inner wall surface of the side portion 1112.

[0068] In this way, by providing the arc-shaped flow guiding surface 1113a, the structure of the flow guiding portion 1113 can be simple and easy to manufacture, and at the same time, the solution on the top 1111 flows to the side portion 1112 through the arc-shaped flow guiding surface 1113a.

[0069] It can be understood that when the material recovery device 11 includes the auxiliary layer 113, at this time, a part of the auxiliary layer 113 is formed on the arc-shaped flow guiding surface 1113a of the flow guiding portion 1113, and this part of the auxiliary layer 113 is also formed with an "arc-shaped flow guiding surface", thereby performing a flow guiding function.

[0070] In one embodiment, with reference to Figure 3 as shown, the solvent supply assembly 112 includes: a supply member 1121, a main pipe 1122 and a plurality of branch pipes 1123. The supply member 1121 is used for supplying the dissolving agent. The inlet end of the main pipe 1122 is in communication with the supply member 1121, and the main pipe 1122 is provided with a plurality of outflow holes (not shown in the figure). The inlet end of each branch pipe 1123 is in communication with the outflow hole, and the outlet end of each branch pipe 1123 is in communication with the first through hole 111a. In this way, on the one hand, the structure of the solvent supply assembly 112 is simple, and on the other hand, the dissolving agent can be quickly supplied into the first through hole 111a.

[0071] In one example, the inlet end of each branch pipe 1123 can be connected to each outlet hole in a one-to-one correspondence, and the outlet end of each branch pipe 1123 can be connected to each first through hole 111a in a one-to-one correspondence. In another example, the outlet end of one branch pipe 1123 can be connected to multiple first through holes 111a.

[0072] Specifically, the supply component 1121 can be maintained at a slight positive pressure to allow the solvent within it to continuously flow into the first through-hole 111a through the main pipe 1122 and the branch pipe 1123. It is understood that the pressure within the supply component 1121 can be maintained between 1 and 10 Pa to ensure a certain flow rate of solvent within the first through-hole 111a. This flow rate is neither too high nor too low, allowing it to slowly flow towards the inner wall surface of the material recovery device 11 (the surface of the liner layer 111 or the surface of the auxiliary layer 113), completely dissolving the vapor-deposited material on the inner wall surface and thus avoiding waste of the solvent. In one example, the supply component 1121 can be a supply bottle.

[0073] Furthermore, the solvent includes N-methyl-2-pyridinyl ketone. By setting the solvent to N-methyl-2-pyridinyl ketone, the solvent can be made non-toxic and harmless, avoiding any harm to the operator's body.

[0074] In one embodiment, reference Figure 2 As shown, the material recovery device 11 also includes a cooling assembly 114, which is used to cool the solvent in the solvent supply assembly 112. This keeps the solvent within a suitable temperature range, preventing solvent evaporation and waste.

[0075] In one example, the cooling assembly 114 may be disposed on the side of the inner liner 111 opposite to the vapor deposition chamber 10a and in contact with the solvent supply assembly 112. In this way, the cooling assembly 114 can cool the solvent supply assembly 112 through direct contact.

[0076] Furthermore, the cooling component 114 can be disposed on the side of the solvent supply component 112 opposite to the inner liner 111. The cooling temperature of the cooling component 114 can be between 10-25°C and below. 。 This ensures that the temperature of the solvent is below 25°C, preventing the solvent from evaporating, and also prevents the solvent from freezing and solidifying.

[0077] It is understandable that the cooling component 114 can be cooled by air cooling, liquid cooling, etc.

[0078] In one embodiment, reference Figure 4 As shown, the cooling assembly 114 includes a cooling pipe 1142, which is used to cool the solvent in the solvent supply assembly 112.

[0079] Furthermore, the cooling assembly 114 also includes a cooling pump 1141, which is connected to a cooling pipe 1142, and the cooling pipe 1142 is in contact with the solvent supply assembly 112. For example, the cooling medium in the cooling pipe 1142 can be water, ether, etc. This not only simplifies the structure of the cooling assembly 114 but also improves its cooling efficiency.

[0080] Specifically, the inlet of the cooling pipe 1142 is connected to the outlet of the cooling pump 1141, and the outlet of the cooling pipe 1142 is connected to the inlet of the cooling pump 1141. A heat exchanger can be installed inside the cooling pump 1141 to cool the cooling medium entering the cooling pump 1141.

[0081] In one embodiment, combined Figure 5 As shown, the material recycling device 11 also includes a collector for collecting the solution left on the inner wall of the material recycling device 11. Exemplarily, the collector may be a collection bottle 14 or a collection tank.

[0082] Understandably, after the solution is collected by the collecting device, it can be distilled and purified, thereby allowing the purified vapor-deposited material to be reused.

[0083] Secondly, referring to Figure 5 As shown, this application provides a vapor deposition apparatus 10, which includes the material recovery device 11 described in the first aspect.

[0084] Specifically, the vapor deposition apparatus 10 also includes a crucible 12 and an angle limiting plate 13, both of which are located within the vapor deposition chamber 10a. During vapor deposition, the mask plate 20 and the substrate 30 are stacked at the opening of the vapor deposition chamber 10a. Heating causes the solid vapor deposition material to melt and evaporate or sublimate to form a gaseous state. The gaseous flow of the vapor deposition material is deposited onto the substrate 30 to form a thin film.

[0085] The aforementioned vapor deposition apparatus 10 incorporates a first through-hole 111a on the inner liner 111 and a solvent supply component 112. During vapor deposition, the solvent supply component 112 supplies a solvent, which flows through the first through-hole 111a to the inner wall surface of the vapor deposition chamber 10a (the inner wall surface of the inner liner 111). This solvent dissolves the vapor deposition material on the inner wall surface. As time progresses, the solution droplets on the inner wall surface of the vapor deposition chamber 10a agglomerate and grow larger, eventually flowing down the inner wall surface, thus achieving separation of the vapor deposition material from the inner wall surface of the inner liner 111. This structure eliminates the need for manual scraping of the vapor deposition material from the inner liner 111 during material recovery, simplifying the process and reducing labor costs. Furthermore, the solvent-based dissolution of the vapor deposition material allows for cleaner and more complete recovery of the material from the inner liner 111, thereby improving the material recovery rate.

[0086] It is understandable that the material recycling device 11 can be integrated with the cavity wall of the vapor deposition device 10. In this case, it can be considered that the material recycling device 11 is reused as the cavity wall of the vapor deposition device 10.

[0087] In one embodiment, the vapor deposition apparatus 10 includes a cavity wall (not shown), and a material recovery device 11 is detachably disposed on the cavity wall. Thus, the material recovery device 11 and the cavity wall are equivalent to separate structures, that is: the cavity wall forms a receiving cavity, the material recovery device 11 is located inside the receiving cavity, and is disposed on the cavity wall as a liner.

[0088] This configuration facilitates the maintenance and replacement of the material recycling device 11, extending the service life of the vapor deposition device 10.

[0089] In one embodiment, the material recovery device 11 further includes a collection tank (not shown) for collecting the dissolved liquid on the inner wall of the vapor deposition chamber 10a.

[0090] In this way, the solution formed by the solvent and the vapor deposition material can be collected in the collection tank, making the collection of vapor deposition material more convenient.

[0091] In one example, the collection tank can be located on the bottom wall of the vapor deposition apparatus 10, with the orthographic projection of the inner liner 111 onto the bottom wall located inside the collection tank. Here, the collection tank is equivalent to being located directly below the side portion 1112 of the inner liner 111, allowing the solution on the inner liner 111 to fall directly into the collection tank.

[0092] In another embodiment, a collection bottle 14 may be provided inside the vapor deposition chamber 10a, located directly below the side portion 1112 of the inner liner layer 111. This allows the solution on the inner liner layer 111 to fall directly into the collection bottle 14. It is understood that after the solution is collected by the collection bottle 14, it can be distilled and purified, thereby allowing the purified vapor deposition material to be reused.

[0093] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0094] The embodiments described above are merely illustrative of several implementations of the present invention, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the invention patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of the present invention, and these all fall within the protection scope of the present invention. Therefore, the protection scope of this invention patent should be determined by the appended claims.

Claims

1. A material recycling device, characterized in that, include: An inner liner defining a vapor deposition cavity for accommodating vapor deposition material, the inner liner having a plurality of first through holes; A solvent supply assembly is configured to contain and supply a solvent. During vapor deposition, the solvent supply assembly supplies the solvent and allows the solvent to flow through the first through-hole to the inner wall of the vapor deposition chamber to dissolve the vapor deposition material adhering to the inner wall of the vapor deposition chamber. The solvent supply assembly includes: A supply component for supplying the solvent; The main pipe has an inlet end connected to the supply component, and the main pipe is provided with multiple outlet holes; Multiple branch pipes, the inlet end of each branch pipe is connected to the outlet hole, and the outlet end of each branch pipe is connected to the first through hole; The inner liner includes a top and a side that are connected to each other. A flow guide is provided at the connection between the top and the side, and the flow guide is used to guide the solution on the top to the side. The flow guide is provided with an arc-shaped flow guide surface, one end of which is connected to the inner wall surface of the top, and the other end of which is connected to the inner wall surface of the side. The material recovery device further includes a cooling component for cooling the solvent within the solvent supply component; The cooling assembly includes a cooling pipe for cooling the solvent within the solvent supply assembly; The material recovery device also includes a collection tank for collecting the solution and solvent on the inner wall of the vapor deposition chamber.

2. The material recycling device according to claim 1, characterized in that, An auxiliary layer is provided on the side of the inner liner facing the vapor deposition chamber. The auxiliary layer has a plurality of second through holes, which are connected to the first through holes.

3. The material recycling device according to claim 2, characterized in that, The auxiliary layer is made of polytetrafluoroethylene.

4. The material recycling device according to claim 2, characterized in that, Each of the first through holes is evenly arranged on the inner liner layer; each of the second through holes is evenly arranged on the auxiliary layer.

5. The material recycling device according to claim 2, characterized in that, The porosity of the inner lining and the auxiliary layer is between 5% and 20%.

6. The material recycling device according to any one of claims 1-5, characterized in that, The solvent includes N-methyl-2-pyridinone.

7. A vapor deposition apparatus, characterized in that, Includes a material recycling device as described in any one of claims 1-6.

8. The vapor deposition apparatus according to claim 7, characterized in that, The vapor deposition apparatus includes a cavity wall, and the material recovery device is detachably mounted on the cavity wall.

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