Laser device

Abstract

The present disclosure relates to a laser apparatus including a first vacuum chamber in which processing is performed on a target substrate seated in the first vacuum chamber, a laser facing the first vacuum chamber, a carrier disposed in the first vacuum chamber with the target substrate seated on the carrier, a chamber window disposed in one surface of the first vacuum chamber through which a laser beam emitted by the laser passes, a first protective window between the carrier and the chamber window, a second vacuum chamber disposed at a first side of the first vacuum chamber, and a transfer unit configured to transfer the first protective window to the second vacuum chamber.

Description

[0001] This case is a divisional application, and its parent application is an invention patent application filed on August 5, 2020, with application number 202010778290.8 and invention title "Laser Device". Technical Field

[0002] This disclosure relates to laser equipment and laser processing methods. Background Technology

[0003] With the development of multimedia, the demand for displays is increasing. Therefore, various displays such as liquid crystal displays (LCDs) and organic light-emitting displays (OLEDs) are being used.

[0004] Organic light-emitting displays (OLEDs) use organic light-emitting diodes (OLEDs) to display images, where light is generated through the recombination of electrons and holes. Typically, OLEDs have relatively fast response times, relatively high brightness, and wide viewing angles. Furthermore, OLEDs can be driven with low power consumption.

[0005] In the fabrication processes used for organic light-emitting displays, such as in semiconductor manufacturing, various physical and chemical methods are employed. For example, etching or drilling processes using lasers can be used. Compared to other methods, laser-based fabrication on substrates is widely used due to its simple structure and short processing time.

[0006] Furthermore, when a laser module is used to perform the processing, the protective window of the laser equipment must be replaced or cleaned because particles that detach and separate from the substrate accumulate on it during the processing. In this case, since the vacuum chamber must be opened for replacement or cleaning and the processing must be stopped until the chamber is under vacuum after replacement or cleaning, production efficiency may be reduced.

[0007] Furthermore, since organic light-emitting diodes are not resistant to moisture and oxygen, a high-vacuum environment in the chamber is used when laser processing is performed on the substrate (SUB) of an organic light-emitting display. Summary of the Invention

[0008] Exemplary embodiments of this disclosure are intended to provide a laser device that improves processing quality and production efficiency.

[0009] According to an exemplary embodiment of the present disclosure, a laser device includes: a first vacuum chamber, wherein processing is performed on a target substrate within the first vacuum chamber; a laser facing the first vacuum chamber; a carrier disposed within the first vacuum chamber, wherein the target substrate is seated on the carrier; a chamber window disposed in a surface of the first vacuum chamber, wherein a laser beam emitted by the laser passes through the chamber window; a first protective window located between the carrier and the chamber window; a second vacuum chamber disposed on a first side of the first vacuum chamber; and a transfer unit configured to transfer the first protective window to the second vacuum chamber.

[0010] In an exemplary embodiment of this disclosure, the first vacuum chamber further includes a processing area in which processing is performed on the target substrate by means of the laser beam; and the first protective window is transferred from the processing area to the second vacuum chamber via the transfer unit.

[0011] In an exemplary embodiment of this disclosure, the transfer unit is located between the processing area and the second vacuum chamber.

[0012] In an exemplary embodiment of this disclosure, the laser beam is configured to pass through the chamber window and the first protective window and be emitted onto a surface of the target substrate.

[0013] In an exemplary embodiment of this disclosure, the laser device further includes a plurality of second protective windows disposed in the second vacuum chamber, wherein a second protective window among the plurality of second protective windows is transmitted to the first vacuum chamber via the transmission unit.

[0014] In an exemplary embodiment of this disclosure, the laser device further includes a housing disposed in the second vacuum chamber, wherein the second protective window is mounted on the housing.

[0015] In an exemplary embodiment of this disclosure, the first protective window and the second protective window each comprise a quartz material.

[0016] In an exemplary embodiment of this disclosure, the laser device further includes a chamber door located on one side of the second vacuum chamber, wherein the second protective window is configured to enter and exit the second vacuum chamber through the chamber door.

[0017] In an exemplary embodiment of this disclosure, the laser device further includes a contamination detector configured to detect whether the first protective window is contaminated.

[0018] In an exemplary embodiment of this disclosure, the laser device further includes a controller configured to control the transmission unit based on a detection signal from the contamination detector.

[0019] In an exemplary embodiment of this disclosure, the first protective window includes a first region located on one side of the center of the first protective window and a second region located on the other side of the center of the first protective window; and the laser device further includes a protective window moving module configured to move the first protective window.

[0020] In an exemplary embodiment of this disclosure, the laser device further includes a controller configured to control the protective window movement module such that an uncontaminated one of the first region and the second region moves into the path of the laser beam of the laser used to process the target substrate. Attached Figure Description

[0021] The above aspects and features of this disclosure will become more apparent from the detailed description of exemplary embodiments thereof with reference to the accompanying drawings, in which:

[0022] Figure 1 This is a structural diagram illustrating a laser device according to an exemplary embodiment of the present disclosure;

[0023] Figure 2 , Figure 3 , Figure 4 , Figure 5 and Figure 6 It is a structural diagram for describing the process operation of a laser device processing method according to an exemplary embodiment of the present disclosure;

[0024] Figure 7 This is a control block diagram of a laser device according to exemplary embodiments of the present disclosure;

[0025] Figure 8 , Figure 9 , Figure 10 , Figure 11 , Figure 12 , Figure 13 and Figure 14 This is a structural diagram illustrating the process operation of a laser device processing method according to exemplary embodiments of the present disclosure; and

[0026] Figure 15 This is a control block diagram of a laser device according to exemplary embodiments of the present disclosure. Detailed Implementation

[0027] This disclosure will now be described more fully below with reference to the accompanying drawings, in which exemplary embodiments of the disclosure are illustrated. However, this disclosure may be implemented in different forms and should not be construed as limited to the exemplary embodiments set forth herein.

[0028] It will also be understood that when a layer, element, or substrate is referred to as being “on” another layer, element, or substrate, that layer, element, or substrate may be directly on the other layer, element, or substrate, or there may be an intermediate layer or element between them.

[0029] For ease of explanation, spatial relative terms such as “below,” “under,” “below,” “above,” and “above” are used herein to describe the relationship of one element or feature to another element (or feature) or feature (or feature) as shown in the accompanying drawings. It will be understood that, in addition to the orientations depicted in the drawings, the spatial relative terms are also intended to cover different orientations of the device in use or operation. For example, if the device in the drawings is flipped, an element described as “below” or “below” other elements or features will subsequently be oriented “above” other elements or features. Thus, the example terms “below” and “below” can cover all orientations above, below, and below. The device may be oriented in other ways (e.g., rotated 90 degrees or in other orientations), and the spatial relative terms used herein may be interpreted accordingly.

[0030] Throughout the specification, the same reference numerals may indicate the same components, and therefore their descriptions may be omitted.

[0031] In the following description, exemplary embodiments of the present disclosure will be described with reference to the accompanying drawings. In the specification, a first direction DR1 represents the Z-axis direction, and a second direction DR2 represents a direction intersecting the first direction DR1. For example, the second direction DR2 may be the X-axis direction or the Y-axis direction.

[0032] Figure 1 This is a structural diagram illustrating a laser device according to an exemplary embodiment of the present disclosure.

[0033] Reference Figure 1 The laser device according to an exemplary embodiment of the present disclosure may include a first vacuum chamber CH1, a carrier CR, a laser module LM, a chamber window CW, a first protective window PW1, a contamination detector 200, a transmission unit 300, a second vacuum chamber CH2, a housing CS, and a second protective window PW2.

[0034] The first vacuum chamber CH1 may be the space where etching or drilling processes are performed on the substrate SUB. The first vacuum chamber CH1 may include the processing area A1 where laser processing is performed on the substrate SUB.

[0035] The substrate SUB is the target object of the laser device according to exemplary embodiments of the present disclosure, and can be any kind of substrate, such as an organic light-emitting display, a micro-light-emitting diode display, a quantum dot light-emitting display, or an inorganic light-emitting display. An organic light-emitting display can use an organic light-emitting diode including an organic light-emitting layer. A micro-light-emitting diode display can use a micro-light-emitting diode (micro-LED). A quantum dot light-emitting display can use a quantum dot LED including a quantum dot light-emitting layer, and an inorganic light-emitting display can use an inorganic LED including an inorganic semiconductor. The substrate SUB will be described below as a substrate for an organic light-emitting display.

[0036] exist Figure 1 The diagram schematically shows a portion of the first vacuum chamber CH1. For example, the first vacuum chamber CH1 can be maintained in a vacuum state by a vacuum pump and a vacuum valve.

[0037] A first gate valve G1 can be located on one side of the first vacuum chamber CH1. The substrate SUB can be supplied to the first vacuum chamber CH1 through the first gate valve G1. For example, the first gate valve G1 can provide a path for the substrate SUB to enter and exit the first vacuum chamber CH1.

[0038] The second gate valve G2 can be located on the opposite side of the first vacuum chamber CH1. For example, the first gate valve G1 and the second gate valve G2 can be located on opposite sides. Protective windows PW1 and PW2 can be conveyed through the second gate valve G2, and protective windows PW1 and PW2 will be described below.

[0039] The carrier CR can be disposed in the first vacuum chamber CH1. The carrier CR can adsorb and move the substrate SUB, and includes an electrostatic chuck for adsorbing the substrate SUB.

[0040] The laser module LM can be located outside the first vacuum chamber CH1. The laser module LM can be configured to overlap with the processing area A1 of the first vacuum chamber CH1.

[0041] A laser module LM (e.g., a laser) emits a laser beam L onto a surface of a substrate SUB to perform processing on the substrate SUB. The laser beam L emitted by the laser module LM passes through a cavity window CW and a first protective window PW1 and is emitted onto the substrate SUB, thus enabling etching or drilling processes. The laser module LM may include laser units, lenses, mirrors, beam expanders, filters, and / or scanners, etc.

[0042] The chamber window CW can be located on the lower side of the first vacuum chamber CH1. For example, the chamber window CW can be located in the lower surface of the first vacuum chamber CH1. The chamber window CW can be configured to overlap with the processing area A1 of the first vacuum chamber CH1.

[0043] The chamber window CW can be formed of a transparent material capable of transmitting the laser beam L emitted by the laser module LM. The laser beam L emitted by the laser module LM, which is located outside the first vacuum chamber CH1, can enter the first vacuum chamber CH1 through the chamber window CW.

[0044] The chamber window CW can be positioned between the laser module LM and the carrier CR (or, for example, the substrate SUB). For example, the chamber window CW can be configured to overlap with the laser module LM and the carrier CR (or, for example, the substrate SUB). For example, the laser module LM, the chamber window CW, the first protective window PW1, and the carrier CR can overlap each other.

[0045] The chamber window (CW) can be formed from, for example, a quartz material. Figure 1 The illustration shows a case where the cavity window CW comprises a single window, but this disclosure is not limited thereto. For example, the cavity window CW may comprise multiple windows corresponding to the number of laser modules LM.

[0046] When viewed from above, the chamber window CW can have, for example, a quadrilateral shape. However, this disclosure is not limited thereto. For example, when viewed from above, the chamber window CW can have a circular shape.

[0047] A first protective window PW1 can be disposed above the chamber window CW in the first vacuum chamber CH1. The first protective window PW1 can also be disposed in the processing area A1 of the first vacuum chamber CH1. Furthermore, the first protective window PW1 can be disposed between the carrier CR (or, for example, the substrate SUB) and the chamber window CW. For example, the first protective window PW1 can be configured to overlap with both the carrier CR (or, for example, the substrate SUB) and the chamber window CW.

[0048] The first protective window PW1 can be formed of a transparent material capable of transmitting the laser beam L that has passed through the chamber window CW into the first vacuum chamber CH1. For example, the first protective window PW1 can be formed of quartz material, and can also be formed of the same material as the chamber window CW.

[0049] The first protective window PW1 allows the laser beam L to pass through it and prevents the chamber window CW from being detached from the substrate SUB and / or separated by particles P (see [reference]) during laser processing. Figure 2 Contamination is eliminated. Therefore, processing quality can be improved because the degradation of refractive index or transmittance caused by particles P from the substrate SUB on the chamber window CW can be prevented. Furthermore, since the replacement or cleaning of the chamber window CW is not performed, and the time period for opening the first vacuum chamber CH1 to replace the chamber window CW is not increased, the production efficiency of the laser equipment can be improved.

[0050] exist Figure 1The diagram illustrates a case where the first protective window PW1 comprises a single window, but this disclosure is not limited thereto. For example, the first protective window PW1 may also comprise multiple windows corresponding to the number of laser modules LM. When viewed from above, the first protective window PW1 may have, for example, a quadrilateral or circular shape. Furthermore, the planar shape of the first protective window PW1 may substantially match the planar shape of the chamber window CW, but this disclosure is not limited thereto.

[0051] A contamination detector 200 can be installed on the first vacuum chamber CH1. The contamination detector 200 can detect the cumulative amount of particulate P accumulated on the first protective window PW1 to detect the contamination level of the first protective window PW1.

[0052] The contamination detector 200 can be configured to overlap with the processing area A1 of the first vacuum chamber CH1. Additionally, the contamination detector 200 can be configured to overlap with the first protective window PW1. Figure 1 The diagram shows a configuration where the contamination detector 200 is located outside the first vacuum chamber CH1. However, the contamination detector 200 can be located anywhere from which it can detect the accumulated amount of particles P on the first protective window PW1, etc. For example, the contamination detector 200 can be located inside the first vacuum chamber CH1.

[0053] The transfer unit 300 may be disposed within the first vacuum chamber CH1. For example, the transfer unit 300 may be disposed in an area of ​​the first vacuum chamber CH1 other than the processing area A1. However, this disclosure is not limited thereto, and the transfer unit 300 may reciprocate within the first vacuum chamber CH1 and partially overlap with the processing area A1. The transfer unit 300 may be connected to an external power source and may reciprocate laterally within the first vacuum chamber CH1. For example, the transfer unit 300 may include a tray and / or plate, an actuator, and a motor.

[0054] The transmission unit 300 can be used to transmit the first protective window PW1 and the second protective window PW2, which will be described below. The first protective window PW1 and the second protective window PW2 can be transmitted from the first vacuum chamber CH1 to the second vacuum chamber CH2, or from the second vacuum chamber CH2 to the first vacuum chamber CH1, via the transmission unit 300.

[0055] The second vacuum chamber CH2 can be the space where the second protective window PW2 is stored. Figure 1The diagram schematically illustrates a portion of the second vacuum chamber CH2. The second vacuum chamber CH2 can be maintained under vacuum by a vacuum pump and a vacuum valve. The second vacuum chamber CH2 can have any shape, as long as the second protective window PW2 can be stored within it. For example, the second vacuum chamber CH2 can have a quadrilateral shape such as a rectangle. As an additional example, the second vacuum chamber CH2 can be located on one side of the first vacuum chamber CH1.

[0056] A chamber door CHD can be installed on one side of the second vacuum chamber CH2. The inventory of protective windows PW1 and PW2 can be managed independently of the first vacuum chamber CH1, for example, by cleaning protective windows PW1 and PW2 through the chamber door CHD or by replacing protective windows PW1 and PW2 with new ones.

[0057] The housing CS can be disposed within the second vacuum chamber CH2. The housing CS can be fixed within the second vacuum chamber CH2. Furthermore, the housing CS can be raised or lowered via a separate lift, and can also be loaded into the second vacuum chamber CH2 from the outside or unloaded to the outside. The housing CS may include multiple supports (e.g., support walls) and multiple slots SL protruding from the supports.

[0058] Multiple slots SL can be positioned facing each other. Slots SL can support a second protective window PW2 and provide space for mounting the second protective window PW2. Figure 1 The diagram shows a case where the housing CS comprises a total of five pairs of slots SL, but the number of slots SL in the housing CS is not limited to this.

[0059] The second protective window PW2 can be located in the second vacuum chamber CH2. For example, the second protective window PW2 can be mounted on the slot SL of the housing CS.

[0060] Since the second protective window PW2 is a replacement protective window, it can replace the first protective window PW1 if the first protective window PW1 is contaminated. Therefore, processing quality can be improved because the degradation of refractive index or transmittance caused by particles P in the first protective window PW1 can be prevented. Furthermore, since the process of opening a chamber (e.g., the first vacuum chamber CH1) to replace or clean the first protective window PW1 is not performed, the production efficiency of the laser equipment can be improved.

[0061] Furthermore, even when the protective window (e.g., the first protective window PW1) is replaced, the second vacuum chamber CH2 can be maintained in a vacuum state by the vacuum pump and vacuum valve. Therefore, even when the second gate valve G2 is opened to transfer the second protective window PW2, the vacuum level of the first vacuum chamber CH1 can remain unaffected. For example, when the first protective window PW1 is contaminated, it can be replaced with the second protective window PW2 while maintaining the high vacuum environment of the first vacuum chamber CH1. Therefore, laser processing can be continuously performed in a high vacuum environment without opening the chamber (e.g., the first vacuum chamber CH1).

[0062] Furthermore, since laser processing can be performed in a high-vacuum environment, the penetration of moisture or oxygen into the LEDs of the substrate SUB can be minimized. Therefore, the reliability of the substrate SUB, for example, the reliability of display components, can be improved.

[0063] Furthermore, since the second protective window PW2 can be managed for extended periods independently of the first vacuum chamber CH1 in which laser processing is performed, the laser equipment can be operated for long periods without opening the first vacuum chamber CH1. Therefore, the production efficiency of the laser equipment can be improved.

[0064] The second protective window PW2 can be formed of the same material as the first protective window PW1. For example, the second protective window PW2 can be formed of a transparent material capable of transmitting the laser beam L. For example, the second protective window PW2 can be formed of quartz material.

[0065] The second protective window PW2 can have a planar shape that is substantially the same as that of the first protective window PW1. For example, when viewed from above, the second protective window PW2 can have a quadrilateral or circular shape.

[0066] exist Figure 1 The diagram illustrates a scenario where five second protective windows (PW2) are stored in the second vacuum chamber CH2, but the number of second protective windows (PW2) is not limited to this. For example, the inventory management of the second protective windows (PW2) can be varied based on the time cycle of the laser processing process, the number of laser processing processes that have been performed or will be performed, and the contamination cycle of the protective windows.

[0067] As described above, in the laser apparatus according to an exemplary embodiment of the present disclosure, when the first protective window PW1 is contaminated, the first protective window PW1 can be replaced with a second protective window PW2 while maintaining the high vacuum environment of the first vacuum chamber CH1. Therefore, since laser processing can be continuously performed in a high vacuum environment without opening the chamber (e.g., the first vacuum chamber CH1), the production efficiency of the laser apparatus can be improved.

[0068] Furthermore, since laser processing can be performed in a high-vacuum environment, the penetration of moisture or oxygen into the LEDs of the substrate SUB can be minimized. Therefore, the reliability of the substrate SUB, for example, the reliability of display components, can be improved.

[0069] Next, a laser processing method using a laser apparatus according to exemplary embodiments of this disclosure will be described. Figure 1 Components that are essentially the same will be represented by the same labels, and their detailed descriptions will be omitted.

[0070] Figures 2 to 6 This is a structural diagram illustrating the process operation of a laser device processing method according to exemplary embodiments of the present disclosure.

[0071] Reference Figure 2 Laser processing is performed on a first substrate SUB1. The laser module LM can emit a laser beam L onto a surface of the first substrate SUB1 to perform processing on the first substrate SUB1. Here, processing may include etching or drilling processes. The first substrate SUB1 can be compared with a reference... Figure 1 The base SUB shown is essentially the same.

[0072] The laser beam L emitted by the laser module LM can pass through the chamber window CW and enter the first vacuum chamber CH1. The light that has passed through the chamber window CW can pass through the first protective window PW1 and be emitted on a surface of the first substrate SUB1.

[0073] As an etching or drilling process is performed on the first substrate SUB1, particles P detaching from the first substrate SUB1 may fall toward the first protective window PW1 and accumulate on one surface of the first protective window PW1. In this case, due to the particles P, the refractive index of the first protective window PW1 and the transmittance of the laser beam L may decrease, and therefore the quality of the laser processing may be reduced.

[0074] Then, refer to Figure 3 The contamination of the first protective window PW1 is detected by the contamination detector 200. The contamination detector 200 can detect the cumulative amount of particles P accumulated on the first protective window PW1 and detect whether the first protective window PW1 is contaminated.

[0075] The contamination detector 200 includes a light emitter 210 and a light receiver 220. The light emitter 210 emits light onto a surface of a first protective window PW1, and the light receiver 220 receives the light reflected by the first protective window PW1. Therefore, the contamination detector 200 can detect the amount of particles P accumulated on the first protective window PW1.

[0076] The contamination detector 200 can automatically detect contamination of the first protective window PW1 at predetermined time intervals. Here, the detection cycle of the contamination detector 200 can be set by taking into account the time period of the laser processing process and the number of laser processing processes to be performed.

[0077] The detection cycle of the contamination detector 200 can be matched with the replacement cycle of the first substrate SUB1. Contamination of the first protective window PW1 can be detected at the point in time when the laser processing performed on the first substrate SUB1 ends. For example, contamination detection of the first protective window PW1 can be performed while the first substrate SUB1 is being unloaded from the processing area A1 of the first vacuum chamber CH1 by the carrier CR.

[0078] Furthermore, the first substrate SUB1 may include multiple substrates, and in this case, the replacement time point of the first substrate SUB1 may be the time point at which the processing performed on the multiple substrates ends.

[0079] Reference Figure 4 and Figure 5 If the contamination level of the first protective window PW1 reaches a critical value, the contaminated first protective window PW1 can be automatically transferred by the transfer unit 300 to the outside of the processing area A1 of the first vacuum chamber CH1 (e.g., an area adjacent to the processing area A1). The first protective window PW1 can be transferred to the second vacuum chamber CH2 by the transfer unit 300. Here, the first protective window PW1 can be transferred to the second vacuum chamber CH2 by the second gate valve G2.

[0080] Furthermore, the second protective window PW2, stored in the second vacuum chamber CH2, is transferred to the processing area A1 of the first vacuum chamber CH1 via the transfer unit 300. For example, the transfer unit 300 can replace the contaminated first protective window PW1 with the second protective window PW2. Alternatively, the transfer unit 300 can remove the first protective window PW1 from the processing area A1 and move the second protective window PW2 into the processing area A1. The second protective window PW2 can be transferred to the first vacuum chamber CH1 via the second gate valve G2.

[0081] As described above, even when the protective window (e.g., the first protective window PW1) is replaced, the second vacuum chamber CH2 can be maintained in a vacuum state by the vacuum pump and vacuum valve. Therefore, even when the second gate valve G2 is opened to transfer the second protective window PW2, the vacuum level of the first vacuum chamber CH1 can remain unaffected. For example, when the first protective window PW1 is contaminated, it can be replaced with the second protective window PW2 while maintaining the high vacuum environment of the first vacuum chamber CH1. Therefore, laser processing can be performed in a high vacuum environment without opening the chamber (e.g., the first vacuum chamber CH1).

[0082] exist Figure 4 and Figure 5 The diagram illustrates a scenario where a first protective window PW1 is transmitted first, followed by a second protective window PW2; however, this disclosure is not limited to this. For example, after the second protective window PW2 is transmitted to the processing area A1 of the first vacuum chamber CH1, the first protective window PW1 may be unloaded, or the first protective window PW1 and the second protective window PW2 may be transmitted simultaneously to replace each other. For example, there may be two transmission units 300.

[0083] Reference Figure 6 Laser processing is performed on the second substrate SUB2. The laser module LM can emit a laser beam L onto one surface of the second substrate SUB2 to perform processing on the second substrate SUB2. The second substrate SUB2 can be compared with a reference... Figure 2 The first substrate SUB1 described is essentially the same.

[0084] The laser beam L emitted by the laser module LM can pass through the chamber window CW and enter the first vacuum chamber CH1. The light that has passed through the chamber window CW can be emitted through the second protective window PW2 onto a surface of the second substrate SUB2.

[0085] As described above, the laser processing method according to an exemplary embodiment of this disclosure may include detecting contamination of the first protective window PW1 using a contamination detector 200, and automatically replacing the first protective window PW1 with a second protective window PW2 while maintaining a high vacuum environment in the first vacuum chamber CH1. Therefore, since laser processing can be continuously performed in a high vacuum environment without opening the chamber (e.g., the first vacuum chamber CH1), the production efficiency of the laser equipment can be improved.

[0086] Furthermore, since laser processing can be performed in a high-vacuum environment, the penetration of moisture or oxygen into the LEDs of the substrate SUB can be minimized. Therefore, the reliability of the substrate SUB, that is, the component reliability of the display, can be improved. Here, the first substrate SUB1 and the second substrate SUB2 can be referred to as the substrate SUB.

[0087] Figure 7 This is a control block diagram of a laser device according to exemplary embodiments of the present disclosure.

[0088] Reference Figure 7The laser apparatus according to an exemplary embodiment of the present disclosure may further include a controller 100 configured to control the operation of the transmission unit 300. The transmission unit 300 may be operated by the controller 100 to transmit a first protective window PW1 or a second protective window PW2. In this case, the controller 100 receives a signal to control the operation of the transmission unit 300, and the signal may be provided by at least one of the contamination detector 200, the process time detector 410, and the process quantity detector 420.

[0089] The pollution detector 200 detects the cumulative amount of particles P accumulated on the first protective window PW1 and transmits this information to the controller 100.

[0090] The process time detector 410 detects the etching and / or drilling process time cycles of each substrate SUB and transmits its information to the controller 100.

[0091] The process quantity detector 420 detects the number of etching and / or drilling processes performed on the substrate SUB and transmits the information to the controller 100.

[0092] exist Figure 7 The diagram illustrates all possible uses of the contamination detector 200, process time detector 410, and process quantity detector 420, but this disclosure is not limited thereto. For example, at least one of the contamination detector 200, process time detector 410, and process quantity detector 420 may be used. For example, the controller 100 may receive information from the contamination detector 200, process time detector 410, or process quantity detector 420, and may control the transmission unit 300 to automatically replace the protective windows PW1 and PW2 with each other.

[0093] The controller 100 may include a central processing unit 110 and a memory 120.

[0094] The central processing unit 110 may be one of various computer processors that are industrially applicable to control the transmission unit 300 to transmit protective windows PW1 and PW2 after receiving information from the contamination detector 200, the process time detector 410 and / or the process quantity detector 420.

[0095] The memory 120 can be connected to the central processing unit 110. The memory 120 is a computer-readable recording medium and can be installed at a local or remote site. For example, the memory 120 can be one of random access memory (RAM), read-only memory (ROM), floppy disk, hard disk, and any digital storage medium.

[0096] The controller 100 can receive information from the contamination detector 200, the process time detector 410, and / or the process quantity detector 420, and control the transfer unit 300 to transfer the protection windows PW1 and PW2. In this case, a series of processes can be stored in the memory 120. For example, a series of processes may include the controller 100 receiving information from the contamination detector 200, the process time detector 410, and / or the process quantity detector 420, and controlling the transfer unit 300 to transfer the protection windows PW1 and PW2. Furthermore, software routines can be stored in the memory 120. These software routines can be stored or executed by another central processing unit.

[0097] Furthermore, although the process operations of controller 100 are described as being executed by software routines, at least some process operations can also be executed by hardware. For example, the process can be implemented by software executing on a computer system, or it can be implemented by hardware such as integrated circuits. Moreover, the process can be implemented by a combination of software and hardware.

[0098] In the following, exemplary embodiments of this disclosure will be described. In the following exemplary embodiments of this disclosure, the same components as those described above will be represented by the same reference numerals, and repeated descriptions may be omitted or simplified.

[0099] Figures 8 to 14 This is a structural diagram illustrating the process operation of a laser device processing method according to exemplary embodiments of the present disclosure.

[0100] Reference Figure 8 The laser device according to this embodiment and Figures 1 to 7 The laser device in the embodiment differs in that the first protective window PW1' includes a first region PA1 and a second region PA2, and according to this embodiment, the laser device also includes a protective window moving module 500 configured to move the first protective window PW1'.

[0101] The first region PA1 of the first protective window PW1' can be located on one side of the center of the first protective window PW1', and the second region PA2 can be located on the other side of the center of the first protective window PW1'. For example, a portion of the first protective window PW1' can be the first region PA1, and another portion of the first protective window PW1' can be the second region PA2.

[0102] The first region PA1 and / or the second region PA2 of the first protective window PW1' can be disposed in the processing area A1 of the first vacuum chamber CH1. Furthermore, the first region PA1 and / or the second region PA2 of the first protective window PW1' can be disposed above the chamber window CW and overlap with the laser module LM. Therefore, the first region PA1 and / or the second region PA2 of the first protective window PW1' can allow the laser beam L to pass through it and can prevent contamination of the chamber window CW due to particles P detaching and / or separating from the target substrate (e.g., the first substrate SUB1) during laser processing. Thus, as described above, degradation of the refractive index or transmittance of the chamber window CW due to particles P can be prevented, and the production efficiency of the laser equipment can be improved.

[0103] The first region PA1 and / or the second region PA2 of the first protective window PW1' reciprocate within the first vacuum chamber CH1 via a protective window moving module 500, which partially overlaps with the first region PA1 and the second region PA2. For example, the protective window moving module 500 can move the first protective window PW1' such that the first region PA1 and / or the second region PA2 are located within the area where particles P accumulate on the first protective window PW1'. For example, the protective window moving module 500 may include actuators and motors.

[0104] For example, when laser processing is performed on the first substrate SUB1, the first region PA1 of the first protective window PW1' may overlap with the cavity window CW and the region therein from which the laser beam L is emitted. In this case, the protective window moving module 500 can move the first protective window PW1' a predetermined distance from the center of the laser module LM in the second direction DR2. For example, the first region PA1 of the first protective window PW1' may be in the path of the laser beam L emitted from the laser module LM, and the protective window moving module 500 may not be in the path of the laser beam L.

[0105] The laser beam L emitted by the laser module LM can pass through the chamber window CW and enter the first vacuum chamber CH1. The light that has passed through the chamber window CW can be emitted through the first protective window PW1' onto a surface of the first substrate SUB1.

[0106] As an etching or drilling process is performed on the first substrate SUB1, particles P that detach from the first substrate SUB1 may fall toward the first region PA1 of the first protective window PW1' and accumulate on one surface of the first region PA1 of the first protective window PW1'.

[0107] Since it has already been referenced Figures 1 to 7 The laser module LM and cavity window CW, in addition to the above, are described. Therefore, their repeated descriptions will be omitted.

[0108] Reference Figure 9 The contamination of the first region PA1 of the first protective window PW1' is detected by the contamination detector 200. The contamination detector 200 can detect the cumulative amount of particles P accumulated on the first region PA1 of the first protective window PW1' to detect whether the first region PA1 of the first protective window PW1' is contaminated.

[0109] The contamination detector 200 includes a light emitter 210 and a light receiver 220. The light emitter 210 emits light onto a surface of a first region PA1 of the first protective window PW1'. The light receiver 220 receives the light reflected by the first region PA1 of the first protective window PW1'. Therefore, the contamination detector 200 can detect the accumulated amount of particles P on the first region PA1 of the first protective window PW1'.

[0110] The contamination detector 200 can automatically detect contamination in the first region PA1 of the first protective window PW1' at predetermined time intervals. Here, the detection cycle of the contamination detector 200 can be set by taking into account the time period of the laser processing process and the number of laser processing processes.

[0111] The detection cycle of the contamination detector 200 can be matched with the replacement cycle of the first substrate SUB1. Contamination of the first region PA1 of the first protective window PW1' can be detected at the point in time when the laser processing performed on the first substrate SUB1 ends. For example, contamination detection of the first region PA1 of the first protective window PW1' can be performed while the first substrate SUB1 is being unloaded from the processing area A1 of the first vacuum chamber CH1 by the carrier CR.

[0112] Furthermore, the first substrate SUB1 may include multiple substrates, and in this case, the replacement time point of the first substrate SUB1 may be the time point at which the processing performed on the multiple substrates ends.

[0113] Reference Figure 10 When the contamination level of the first protective window PW1' reaches a predetermined threshold (e.g., a critical value), the first protective window PW1' moves a predetermined distance via the protective window moving module 500. Here, since the protective window moving module 500 moves the first region PA1 of the first protective window PW1' from the center of the laser module LM in a direction opposite to the second direction DR2, the second region PA2 of the first protective window PW1' can be configured to overlap with the region where the emitted laser beam L is located. For example, the first region PA1 of the first protective window PW1' can be moved out of the path of the laser beam L by the protective window moving module 500, and the second region PA2 of the first protective window PW1' can be moved into the path of the laser beam L by the protective window moving module 500.

[0114] Therefore, laser processing can be continuously performed using the second region PA2 instead of the contaminated first region PA1 in the area of ​​the first protective window PW1'. For example, the production efficiency of the laser equipment can be improved because the replacement cycle of the first protective window PW1' can be increased.

[0115] After the first protective window PW1' is moved, laser processing is performed on the second substrate SUB2. The laser beam L emitted by the laser module LM can pass through the chamber window CW and enter the first vacuum chamber CH1. The light that has passed through the chamber window CW can pass through the second region PA2 of the first protective window PW1' and be emitted on a surface of the second substrate SUB2.

[0116] As an etching or drilling process is performed on the second substrate SUB2, particles P that detach from the second substrate SUB2 may fall toward the second region PA2 of the first protective window PW1' and accumulate on one surface of the second region PA2 of the first protective window PW1'.

[0117] Reference Figure 11 The contamination of the second region PA2 of the first protective window PW1' is detected by the contamination detector 200. The contamination detector 200 can detect the cumulative amount of particles P accumulated on the second region PA2 of the first protective window PW1' to detect whether the second region PA2 of the first protective window PW1' is contaminated.

[0118] The contamination detector 200 includes a light emitter 210 and a light receiver 220. The light emitter 210 emits light onto a surface of a second region PA2 of the first protective window PW1'. The light receiver 220 receives the light reflected by the second region PA2 of the first protective window PW1', and thus, the contamination detector 200 can detect the amount of particle P accumulated on the second region PA2 of the first protective window PW1'.

[0119] The contamination detector 200 can automatically detect contamination in the second region PA2 of the first protective window PW1' at predetermined time intervals. For example, the detection cycle of the contamination detector 200 can be set by taking into account the time period of the laser processing process and the number of laser processing processes.

[0120] The detection cycle of the contamination detector 200 can be matched with the replacement cycle of the second substrate SUB2. Contamination of the second region PA2 of the first protective window PW1' can be detected at the point in time when the laser processing performed on the second substrate SUB2 ends. For example, contamination detection of the second region PA2 of the first protective window PW1' can be performed while the second substrate SUB2 is being unloaded from the processing area A1 of the first vacuum chamber CH1 by the carrier CR.

[0121] Furthermore, the second substrate SUB2 may include multiple substrates, and in this case, the replacement time point of the second substrate SUB2 may be the time point at which the processing performed on the multiple substrates ends.

[0122] Reference Figure 12 and Figure 13 When the front surface of the first protective window PW1', for example, the first region PA1 and the second region PA2, reaches a contamination threshold (e.g., a critical value), the first protective window PW1' is automatically conveyed by the conveying unit 300 to the outside of the processing area A1 of the first vacuum chamber CH1. The first protective window PW1' can also be conveyed by the conveying unit 300 to the second vacuum chamber CH2. Here, the first protective window PW1' can be conveyed to the second vacuum chamber CH2 via the second gate valve G2.

[0123] Furthermore, the second protective window PW2' stored in the second vacuum chamber CH2 is transferred to the processing area A1 of the first vacuum chamber CH1 via the transfer unit 300. For example, a contaminated first protective window PW1' and a second protective window PW2' that replaces the first protective window PW1' can be interchanged with each other via the transfer unit 300. The second protective window PW2' can be transferred to the first vacuum chamber CH1 via the second gate valve G2.

[0124] As described above, even when the protective window (e.g., the first protective window PW1') is replaced, the second vacuum chamber CH2 can be maintained in a vacuum state by the vacuum pump and vacuum valve. Therefore, even when the second gate valve G2 is opened to transfer the second protective window PW2', the vacuum level of the first vacuum chamber CH1 can remain unaffected. For example, when the first protective window PW1' is contaminated, the first protective window PW1' can be replaced with the second protective window PW2' while maintaining the high vacuum environment of the first vacuum chamber CH1. Therefore, laser processing can be performed in a high vacuum environment without opening the chamber (e.g., the first vacuum chamber CH1).

[0125] exist Figure 12 and Figure 13 The illustration shows the case where the first protective window PW1' is first transferred, but this disclosure is not limited thereto. For example, after the second protective window PW2' is transferred to the processing area A1 of the first vacuum chamber CH1, the first protective window PW1' may be unloaded, or the first protective window PW1' and the second protective window PW2' may be transferred simultaneously to replace each other.

[0126] Reference Figure 14Laser processing is performed on the third substrate SUB3. When laser processing is performed on the third substrate SUB3, the first region PA1 of the second protective window PW2' can overlap with the cavity window CW and the region in which the laser beam L is emitted. For example, the first region PA1 of the second protective window PW2' can overlap with the laser module LM and can be in the path of the laser beam L emitted by the laser module LM. In this case, the protective window moving module 500 can be used to move the second protective window PW2' such that the first region PA1 of the second protective window PW2' overlaps with the region in which the laser beam L is emitted. For example, the protective window moving module 500 can move the second protective window PW2' a predetermined distance in a direction opposite to the second direction DR2, such that the first region PA1 of the second protective window PW2' overlaps with the laser module LM.

[0127] The laser beam L emitted by the laser module LM can pass through the chamber window CW and enter the first vacuum chamber CH1. The light that has passed through the chamber window CW can pass through the first region PA1 of the second protective window PW2' and be emitted on a surface of the third substrate SUB3.

[0128] As described above, in the laser device and laser processing method according to this embodiment, when the first region PA1 of each of the protective windows PW1' and PW2' is contaminated, since particles P have accumulated on the surface of the first region PA1, the protective window moving module 500 can move each of the protective windows PW1' and PW2' a predetermined distance to use the second region PA2 of the protective windows PW1' and PW2'. Therefore, since the replacement cycle of each of the protective windows PW1' and PW2' can be increased, the production efficiency of the laser device can be improved.

[0129] Furthermore, while the contamination detector 200 detects contamination of the first protective window PW1' and maintains a high vacuum environment in the first vacuum chamber CH1, the first protective window PW1' can be automatically replaced by the second protective window PW2'. Therefore, laser processing can be continuously performed in a high vacuum environment without opening the chamber (e.g., the first vacuum chamber CH1). Moreover, since laser processing can be performed in a high vacuum environment, moisture or oxygen infiltration into the LEDs of the substrate SUB can be minimized. Therefore, the reliability of the substrate SUB, for example, the component reliability of a display, can be improved. Here, the first substrate SUB1, the second substrate SUB2, and the third substrate SUB3 can be referred to as the substrate SUB.

[0130] Figure 15 This is a control block diagram of a laser device according to exemplary embodiments of the present disclosure.

[0131] Reference Figure 15According to this embodiment, the controller 100 of the laser device can control the operation of the protective window moving module 500. The protective window moving module 500 can move each of the protective windows PW1' and PW2' a predetermined distance so that a specific area of ​​each of the protective windows PW1' and PW2' overlaps with the laser module LM while being operated by the controller 100.

[0132] In this case, the controller 100 receives a signal to control the operation of the protective window moving module 500, and the signal may be provided by at least one of the contamination detector 200, the process time detector 410, and the process quantity detector 420.

[0133] The contamination detector 200 detects the cumulative amount of particles P accumulated on each of the protective windows PW1' and PW2' and transmits this information to the controller 100.

[0134] Process time detector 410 detects the etching or drilling process time cycle for each substrate SUB and transmits its information to controller 100.

[0135] The process quantity detector 420 detects the number of etching or drilling processes performed on the substrate SUB and transmits the information to the controller 100.

[0136] exist Figure 15 The diagram illustrates the use of a contamination detector 200, a process time detector 410, and a process quantity detector 420, but this disclosure is not limited thereto. For example, at least one of the contamination detector 200, process time detector 410, and process quantity detector 420 may also be used. For example, the controller 100 may receive information from the contamination detector 200, the process time detector 410, and / or the process quantity detector 420, and control the protective window movement module 500 such that a portion of each of the protective windows PW1' and PW2' that are not contaminated by particles P is positioned to overlap with the laser module LM.

[0137] The controller 100 may include a central processing unit 110 and a memory 120.

[0138] Since it has already been referenced Figure 7 The central processing unit 110 and memory 120 have been described, so their repeated descriptions will be omitted.

[0139] Although this disclosure has been described with reference to exemplary embodiments thereof, those skilled in the art will understand that various changes in form and detail may be made therein without departing from the spirit and scope of this disclosure.

Claims

1. A laser device, wherein, The laser device includes: A first vacuum chamber includes a processing area, wherein processing is performed on a target substrate within the processing area; A carrier is disposed in the first vacuum chamber and configured to hold the target substrate; A chamber window is disposed in one surface of the first vacuum chamber and is formed of a transparent material; The laser module overlaps with the cavity window; The second vacuum chamber is located on the first side of the first vacuum chamber; A second gate valve is located between the first vacuum chamber and the second vacuum chamber; and The transfer unit is configured to transfer a first protective window located in the first vacuum chamber between the carrier and the chamber window to the second vacuum chamber via the second gate valve.

2. The laser device according to claim 1, wherein: The chamber window overlaps with the processing area, and In the processing area, processing is performed on the target substrate by a laser beam irradiated from the laser module.

3. The laser device according to claim 1, wherein: The first protective window is transferred from the processing area to the second vacuum chamber via the transfer unit.

4. The laser device according to claim 1, wherein, The laser beam emanating from the laser module and passing through the chamber window passes through the first protective window and is irradiated onto a surface of the target substrate.

5. The laser device according to claim 1, wherein, The transmission unit transmits the second protective window located in the second vacuum chamber to the first vacuum chamber via the second gate valve.

6. The laser device according to claim 5, wherein, The laser device also includes a housing disposed in the second vacuum chamber. The second protective window is mounted on the groove of the box body.

7. The laser device according to claim 5, wherein, The first protective window and the second protective window each comprise quartz material.

8. The laser device according to claim 5, wherein, The laser device also includes a chamber door located on one side of the second vacuum chamber. The second protective window is configured to allow entry and exit from the second vacuum chamber through the chamber door.

9. The laser device according to claim 1, wherein, The laser device further includes a first gate valve, which is disposed on a second side of the first vacuum chamber opposite to the first side of the first vacuum chamber. The target substrate is configured to enter and exit the first vacuum chamber through the first gate valve.

10. The laser device according to any one of claims 1 to 9, wherein, The laser device also includes a protective window moving module configured to move the first protective window. The first protective window includes a first region located on one side of the center of the first protective window and a second region located on the other side of the center of the first protective window.

11. The laser device according to claim 10, wherein, The laser device also includes a controller configured to control the operation of the protective window movement module. The controller, configured to control the operation of the protective window moving module, controls the protective window moving module such that either the uncontaminated area in the first region or the second region moves into the path of the laser beam.

12. A laser device, wherein, The laser device includes: A first vacuum chamber includes a processing area, wherein processing is performed on a target substrate within the processing area; A carrier is disposed in the first vacuum chamber and configured to hold the target substrate; A chamber window is disposed in one surface of the first vacuum chamber and is formed of a transparent material; The laser module overlaps with the cavity window; The second vacuum chamber is located on the first side of the first vacuum chamber; A contamination detector, configured to detect whether a first protective window located between the carrier and the chamber window, and between the contamination detector and the chamber window, is contaminated; and A transfer unit is configured to transfer the first protective window located between the carrier and the chamber window to the second vacuum chamber.

13. The laser device according to claim 12, wherein, The chamber window is positioned between the laser module and the contamination detector.

14. The laser device according to claim 13, wherein, The laser device also includes a controller configured to control the transmission unit based on detection signals from the contamination detector.

15. The laser device according to any one of claims 12 to 14, wherein, The laser device also includes a protective window moving module configured to move the first protective window. The first protective window includes a first region located on one side of the center of the first protective window and a second region located on the other side of the center of the first protective window.

16. The laser device according to claim 15, wherein, The laser device also includes a controller configured to control the operation of the protective window movement module. The controller, configured to control the operation of the protective window moving module, controls the protective window moving module such that either the uncontaminated area in the first region or the second region moves into the path of the laser beam.

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