Combined refrigeration device

Abstract

The application provides a combined refrigeration device, which comprises a refrigeration device, a semiconductor refrigeration box and an assembling mechanism, the refrigeration device has a storage chamber, the semiconductor refrigeration box is detachably assembled in the refrigeration device through the assembling mechanism, the assembling mechanism comprises a mounting seat arranged on the inner wall of the refrigeration device and protruding towards the storage chamber, the semiconductor refrigeration box is provided with a groove recessed inward from the outer wall surface thereof, the mounting seat is clamped in the groove and can move relative to the groove, and the semiconductor refrigeration box comprises a semiconductor refrigeration sheet, when the semiconductor refrigeration box is assembled in the refrigeration device, the semiconductor refrigeration sheet is arranged in a manner that the hot end thereof exchanges heat with an evaporator of the refrigeration device. When the semiconductor refrigeration box of the application is assembled in the refrigeration device, the heat generated by the hot end can be prevented from being transmitted to the cold end of the semiconductor refrigeration sheet, the cold quantity generated by the cold end can be increased, the temperature in the semiconductor refrigeration box is lowered, and the semiconductor refrigeration box is convenient to carry and keep warm when going out.

Description

Technical Field

[0001] This invention relates to the field of refrigeration equipment technology, and more particularly to a combined refrigeration equipment. Background Technology

[0002] With the development of science and technology and the improvement of residents' living standards, people are paying more and more attention to the quality of life. One manifestation of this is the increasing emphasis on the preservation of frozen foods such as fish and meat. As a result, higher requirements are placed on the low-temperature storage environment of household appliances. On the other hand, people hope to have fresh drinks or food anytime and anywhere.

[0003] However, creating a sub--40°C environment places extremely high demands on the refrigeration system. Not only is the system complex and the manufacturing process difficult, but it also requires high-pressure refrigerants, posing safety hazards. Currently, when food needs to be transported outdoors or at low temperatures, ice packs are often placed around the food or beverage for preservation. However, ice packs melt easily, have limited insulation time, and require advance preparation, making them extremely inconvenient to use. Summary of the Invention

[0004] To address the aforementioned technical problems, the present invention aims to provide a combined refrigeration device that solves the problems of existing refrigeration devices being unable to achieve deep-freezing below -40°C and being difficult to transport and carry.

[0005] To achieve one of the above-mentioned objectives, one embodiment of the present invention provides a combined refrigeration device, including a refrigeration unit, a semiconductor refrigeration box, and an assembly mechanism. The refrigeration unit has a storage chamber. The semiconductor refrigeration box is detachably assembled into the refrigeration unit via the assembly mechanism. The assembly mechanism includes a mounting seat disposed on the inner wall of the refrigeration unit and protruding into the storage chamber. The semiconductor refrigeration box has a groove recessed inward from its outer wall surface. The mounting seat is engaged in the groove and can move relative to the groove. The semiconductor refrigeration box includes a semiconductor refrigeration chip. When the semiconductor refrigeration box is assembled into the refrigeration unit, the semiconductor refrigeration chip is configured such that its hot end exchanges heat with the evaporator of the refrigeration unit.

[0006] As a further improvement of one embodiment of the present invention, the refrigeration device includes an inner liner, an outer shell, and a foam layer located between the inner liner and the outer shell. The inner liner is provided with an opening, and the mounting seat is disposed in the foam layer and protrudes through the opening toward the storage chamber.

[0007] As a further improvement of one embodiment of the present invention, the mounting base includes a limiting portion and a protruding portion connected to the limiting portion. The protruding portion passes through the opening and protrudes toward the storage chamber. The limiting portion is located in the foam layer, and the surface of the limiting portion toward the storage chamber abuts against the portion of the inner liner located around the opening.

[0008] As a further improvement of one embodiment of the present invention, a pair of guide bars are provided at the end of the mounting base away from the inner liner. The mounting base includes a pair of side plates arranged opposite to each other. The pair of side plates are perpendicular to the inner liner. The pair of guide bars are respectively provided on the pair of side plates and protrude away from each other. The groove includes a pair of groove sidewalls arranged opposite to each other. The pair of groove sidewalls are respectively provided with guide grooves. The guide bars are placed in the guide grooves and can move along the guide grooves.

[0009] As a further improvement of one embodiment of the present invention, the guide bar gradually tilts towards the inner liner along the assembly direction of the semiconductor refrigeration box.

[0010] As a further improvement of one embodiment of the present invention, the included angle between the guide strip and the inner liner is 0.5 to 5°.

[0011] As a further improvement of one embodiment of the present invention, the evaporator includes a first evaporator, the refrigeration device further includes an evaporator heat sink, the mounting base has a through hole, the evaporator heat sink includes a thermally conductive substrate and a thermally conductive bump disposed on the thermally conductive substrate, the evaporator heat sink is placed in the mounting base and the thermally conductive bump is located in the through hole, the evaporator tube of the first evaporator is embedded in the thermally conductive substrate, and when the semiconductor refrigeration box is assembled in the refrigeration device, the evaporator heat sink is in contact with the semiconductor refrigeration chip.

[0012] As a further improvement of one embodiment of the present invention, the combined refrigeration equipment further includes a cover, which covers the outside of the mounting base when the semiconductor refrigeration box is separated from the refrigeration device.

[0013] As a further improvement of one embodiment of the present invention, the combined refrigeration equipment further includes a heat spreader plate disposed between the housing and the mounting base.

[0014] As a further improvement of one embodiment of the present invention, the combined refrigeration device further includes an external heat dissipation module. When the semiconductor refrigeration box is separated from the refrigeration device, the semiconductor refrigeration chip of the semiconductor refrigeration box is connected to the external heat dissipation module.

[0015] Compared with the prior art, the present invention has the following beneficial effects: When the semiconductor refrigeration box of the present invention is assembled in the refrigeration device, the hot end of the semiconductor refrigeration chip exchanges heat with the evaporator of the refrigeration device, thereby enabling the hot end of the semiconductor refrigeration chip to dissipate heat quickly. On the one hand, it can prevent the heat generated at the hot end from being transferred to the cold end of the semiconductor refrigeration chip. On the other hand, it can increase the cooling capacity generated at the cold end, thereby reducing the temperature in the semiconductor refrigeration box. In addition, when there is a need for transporting or outdoor use of medicines, beverages, food, etc. that require low-temperature preservation, force can be applied to the semiconductor refrigeration box to move the mounting base relative to the groove, so as to remove the semiconductor refrigeration box from the refrigeration device, and then place the cold drinks and food, etc., into the semiconductor refrigeration box for carrying and keeping warm when going out. The semiconductor refrigeration chip can then provide cooling to medicines, beverages, food, etc. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of a semiconductor cooling box assembled in a refrigeration device according to an embodiment of the present invention;

[0017] Figure 2 This is a schematic diagram of the assembly structure of a semiconductor cooling box and its inner liner according to an embodiment of the present invention;

[0018] Figure 3 for Figure 2 An explosion diagram;

[0019] Figure 4 for Figure 2 Left view of the inner lining;

[0020] Figure 5 for Figure 2 The right view;

[0021] Figure 6 for Figure 3 Enlarged schematic diagram of the mounting bracket;

[0022] Figure 7 This is a three-dimensional structural diagram of a semiconductor cooling box according to an embodiment of the present invention;

[0023] Figure 8 for Figure 7 The right view;

[0024] Figure 9 This is a schematic diagram of the refrigeration circuit according to an embodiment of the present invention;

[0025] Figure 10 This is an explosion diagram of the inner liner according to an embodiment of the present invention, which shows the state in which the cover is placed on the mounting base.

[0026] Figure 11 This is a schematic diagram of a semiconductor cooling box assembled with an external heat dissipation module according to an embodiment of the present invention;

[0027] Figure 12 for Figure 11 Left view of the external heat dissipation module in the middle;

[0028] Figure 13 This is a logic flowchart of a control method for a semiconductor cooling box according to another embodiment of the present invention. Detailed Implementation

[0029] The present invention will now be described in detail with reference to the specific embodiments shown in the accompanying drawings.

[0030] In the various illustrations of this invention, for ease of illustration, certain dimensions of structures or parts may be enlarged relative to other structures or parts; therefore, only the basic structure of the subject matter of this invention is used to illustrate the invention.

[0031] It should be understood that although the terms first, second, etc., may be used in this document to describe various elements or structures, the objects being described should not be limited by these terms. These terms are only used to distinguish these objects from one another.

[0032] See Figures 1 to 8 An embodiment of the present invention provides a combined refrigeration device, including a refrigeration device 1, a semiconductor refrigeration box 2, and an assembly mechanism. The refrigeration device 1 has a storage chamber 11. The semiconductor refrigeration box 2 is detachably assembled into the refrigeration device 1 through the assembly mechanism. The assembly mechanism includes a mounting seat 3 provided on the inner wall of the refrigeration device 1 and protruding into the storage chamber 11. The semiconductor refrigeration box 2 has a groove 21 recessed from its outer wall surface inward. The mounting seat 3 is engaged in the groove 21 and can move relative to the groove 21. The semiconductor refrigeration box 2 includes a semiconductor refrigeration chip 22. When the semiconductor refrigeration box 2 is assembled into the refrigeration device 1, the semiconductor refrigeration chip 22 is configured such that its hot end 221 exchanges heat with the evaporator of the refrigeration device 1.

[0033] In this way, when the thermoelectric cooler 2 is assembled in the refrigeration device 1, the hot end 221 of the thermoelectric cooler 22 exchanges heat with the evaporator of the refrigeration device 1, thereby enabling the hot end 221 of the thermoelectric cooler 22 to dissipate heat quickly. On the one hand, this prevents the heat generated by the hot end 221 from being transferred to the cold end 222 of the thermoelectric cooler 22; on the other hand, it increases the cooling capacity generated by the cold end 222, thereby reducing the temperature in the thermoelectric cooler 2. In addition, when there is a need for transporting medicines, beverages, food, etc. that require low-temperature preservation, or for outdoor use, force can be applied to the thermoelectric cooler 2 to move the mounting base 3 relative to the groove 21, so that the thermoelectric cooler 2 can be removed from the refrigeration device 1, and then the cold drinks and food can be placed in the thermoelectric cooler 2 for carrying and keeping warm when going out. The thermoelectric cooler 22 can then provide cooling for medicines, drinks, food, etc.

[0034] Combination Figure 9The refrigeration device 1 includes a cabinet 12 and a door 13. A storage compartment is located in the cabinet 12, and the door 13 is used to open or close the storage compartment. The refrigeration device 1 also includes a refrigeration system, which is located in the cabinet 12 and supplies cooling to the storage compartment. Specifically, in this embodiment, the refrigeration system includes a refrigeration circuit 14 and a refrigerant located in the refrigeration circuit 14. The refrigeration circuit 14 includes a compressor 141, a condenser 142, and an evaporator connected in sequence. The refrigeration system also includes a regenerator 144, which includes a capillary tube 1441 and a regenerator tube 1442 connected in parallel and exchanging heat with each other. The inlet of the capillary tube 1441 is connected to the outlet of the condenser 142, the outlet of the capillary tube 1441 is connected to the inlet of the evaporator, the inlet of the regenerator tube 1442 is connected to the outlet of the evaporator, the outlet of the regenerator tube 1442 is connected to the inlet of the compressor 141, and the outlet of the compressor 141 is connected to the inlet of the condenser 142.

[0035] By connecting the heat exchanger tube 1442 and the capillary tube 1441 in parallel, the refrigerant can exchange heat and cool down before entering the evaporator. It can also exchange heat and heat up before entering the compressor 141 after leaving the evaporator. By making reasonable use of the heat exchange of the refrigeration system itself, the pressure between the outlet of the compressor 141 and the inlet of the capillary tube 1441 can be controlled within the range that the compressor 141 can withstand during stable operation of the refrigeration system. It can also significantly reduce energy consumption and has great environmental significance.

[0036] Specifically, the capillary tube 1441 and the heat recovery tube 1442 can be arranged side by side or wrapped together, so that they can exchange heat.

[0037] Further, in this embodiment, the refrigerant includes a first working substance and a second working substance, wherein the mass percentage of the first working substance is 10-60%, the mass percentage of the second working substance is 40-90%, the first working substance is one of R170, R1150, R23 or R14, and the second working substance is any one of R290, R600, R600a, R134a, R1234fy or R1234ze.

[0038] The refrigerant, formed by mixing the two working fluids, and by adjusting their ratio, can not only maintain the required amount of flammable refrigerant in the refrigeration system while achieving a temperature of -90℃ to -40℃ in the storage compartment of the refrigeration unit 1, thus providing optimal preservation for food stored there, but also reduce power consumption and noise. Furthermore, it can control the pressure between the outlet of compressor 141 and the inlet of capillary tube 1441 during stable operation within the range that compressor 141 can withstand. In practical applications, the mass percentage of the two working fluids can be adjusted according to the volume of the refrigeration unit 1, the ambient temperature, and the application scenario to achieve the desired preservation effect.

[0039] Preferably, the first working fluid is R170 or R1150, and the second working fluid is any one of R290, R600, and R600a, with the first working fluid accounting for 20-50% by mass and the second working fluid accounting for 50-80% by mass. The resulting binary refrigerant mixture not only meets the temperature requirement of -90℃ to -40℃ but is also environmentally friendly, thus having significant environmental protection value.

[0040] Preferably, the first working refrigerant is R23 or R14, and the second working refrigerant is any one of R290, R600, and R600a. The mass percentage of the first working refrigerant is 10-40%, and the mass percentage of the second working refrigerant is 60-90%. The binary mixed refrigerant prepared in this way can not only meet the temperature requirement of -90℃ to -40℃, but also has flame retardant effect, improving the safety of the refrigeration system operation.

[0041] Preferably, the first working refrigerant is R170 or R1150, and the second working refrigerant is any one of R134a, R1234fy, and R1234ze, with the first working refrigerant having a mass percentage of 10-40% and the second working refrigerant having a mass percentage of 60-90%. The resulting binary refrigerant mixture not only meets the temperature requirement of -90℃ to -40℃ but also exhibits flame-retardant properties, improving the safety of the refrigeration system operation.

[0042] Preferably, the first working refrigerant is R23 or R14, and the second working refrigerant is any one of R134a, R1234fy, and R1234ze. The mass percentage of the first working refrigerant is 20-50%, and the mass percentage of the second working refrigerant is 50-80%. The binary mixed refrigerant prepared in this way can not only meet the temperature requirement of -90℃ to -40℃, but also has flame retardant effect, improving the safety of the refrigeration system operation.

[0043] In other embodiments, the refrigerant may also be configured to include a low-temperature refrigerant, a medium-temperature refrigerant, and a high-temperature refrigerant, wherein the mass percentage of the low-temperature refrigerant is 20-40%, the mass percentage of the medium-temperature refrigerant is 20-40%, the mass percentage of the high-temperature refrigerant is 40-60%, the low-temperature refrigerant is any one of R23, R14, R170, and R1150, the medium-temperature refrigerant is any one of R134a, R290, and R1270, and the high-temperature refrigerant is any one of R600 and R600a.

[0044] The refrigerant, formed by mixing the three working fluids mentioned above, and by adjusting their ratio, can achieve a lower evaporation temperature and pressure while meeting the requirements of the refrigeration system for the amount of combustible refrigerant to be charged. When applied to the aforementioned refrigeration system, it can reduce the compression ratio of compressor 141, thereby reducing throttling and heat transfer losses, improving refrigeration efficiency, and enhancing the refrigeration effect. This allows the temperature inside the storage compartment of the refrigeration unit 1 to reach -90℃ to -40℃, which is beneficial for the preservation of frozen foods such as meat and fish. Furthermore, it can reduce the technical requirements on compressor 141. In practical applications, the mass percentage of the three working fluids can be adjusted according to the volume of the refrigeration unit 1, the ambient temperature, and the application scenario to achieve the desired preservation effect.

[0045] Specifically, the refrigeration unit 1 can be configured as a freezer, refrigerator, etc., to meet the needs of different users and different application scenarios.

[0046] In this embodiment, a freezer is used as an example for detailed description. The direction from the freezer body 12 to the door 13 is defined as up, and the opposite direction is defined as down. Thus, the freezer door 13 is located above the freezer body 12.

[0047] Furthermore, the freezer includes an inner liner 121, an outer shell 122, and a foam layer 123 located between the inner liner 121 and the outer shell 122. The inner liner 121 has an opening 1211, and the mounting base 3 is disposed in the foam layer 123 and protrudes through the opening 1211 toward the storage compartment 11. This facilitates the assembly of the semiconductor refrigeration equipment into or from the freezer through the cooperation of the mounting base 3 and the groove 21.

[0048] Specifically, in this embodiment, the mounting base 3 is located on the side wall of the freezer, and correspondingly, the groove 21 is also located on the side wall of the semiconductor refrigeration box 2 and extends vertically. When the door 13 is opened, the semiconductor refrigeration box 2 can be disassembled and taken out from bottom to top along the groove 21, or the semiconductor refrigeration box 2 can be assembled onto the mounting base 3 from top to bottom.

[0049] Furthermore, the mounting base 3 includes a limiting part 31 and a protruding part 32 connected to the limiting part 31. The protruding part 32 passes through the opening 1211 and protrudes toward the storage chamber 11. The limiting part 31 is located in the foaming layer 123, and the surface of the limiting part 31 facing the storage chamber 11 abuts against the portion of the inner liner 121 located around the opening 1211. That is, the limiting part 31 restricts the mounting base 3 from detaching from the foaming layer 123, thereby improving the assembly firmness of the mounting base 3, so that when the semiconductor cooling chip 22 is assembled in the refrigeration device 1, the hot end 221 of the semiconductor cooling chip 22 and the evaporator can be exchanged normally.

[0050] Combination Figure 6Furthermore, a pair of guide bars 33 are provided at the end of the mounting base 3 away from the inner liner 121. The mounting base 3 includes a pair of oppositely arranged side plates 34, which are perpendicular to the inner liner 121. The pair of guide bars 33 are respectively provided on the pair of side plates 34 and protrude away from each other. The groove 21 includes a pair of oppositely arranged groove sidewalls 211, each of which has a guide groove 2111. The guide bars 33 are placed in the guide grooves 2111 and can move along the guide grooves 2111. By limiting the guide bars 33 with the pair of guide grooves 2111, the assembly firmness of the semiconductor refrigeration box 2 and the refrigeration device 1 can be improved, and misalignment of the hot end 221 of the semiconductor refrigeration chip 22 and the evaporator can be avoided.

[0051] Specifically, in this embodiment, the side plate 34 extends vertically, and correspondingly, the guide strip 33, the groove sidewall 211, and the guide groove 2111 also extend vertically, thereby facilitating the assembly and disassembly of the semiconductor cooling box 2.

[0052] Furthermore, the guide bar 33 gradually tilts towards the inner liner 121 along the assembly direction of the semiconductor refrigeration box 2. Specifically, in this embodiment, the semiconductor refrigeration box 2 is assembled into the refrigeration device 1 from top to bottom, so the guide bar 33 also gradually tilts towards the inner liner 121 from top to bottom. When the semiconductor refrigeration box 2 is installed into the refrigeration device 1 from top to bottom, the semiconductor refrigeration chip 22 gradually approaches the evaporator, thereby avoiding interference between the semiconductor refrigeration chip 22 and the evaporator during the assembly process, which could lead to damage to the semiconductor refrigeration chip 22 and the evaporator.

[0053] Furthermore, the groove depth of the groove 21 is 12-35mm to ensure both installation firmness and efficient use of space. The guide groove 2111 is located at one end of the groove 21 near its bottom wall 212.

[0054] Furthermore, the angle between the guide bar 33 and the inner liner 121 is 0.5 to 5°, that is, the angle between the guide bar 33 and the vertical direction is 0.5 to 5°. This not only ensures that there is sufficient fitting space between the groove 21 and the mounting base 3, but also allows the semiconductor cooling box 2 to gradually approach the evaporator in the vertical direction when it is installed into the refrigeration device 1 from top to bottom, and the semiconductor cooling plate 22 to gradually move away from the evaporator in the vertical direction when it is disassembled from bottom to top.

[0055] Referring further to the figure, the evaporator includes a first evaporator 1431 and a second evaporator 1432 connected in series. The refrigeration device 1 also includes an evaporator heat sink 15. The mounting base 3 has a through hole 35. The evaporator heat sink 15 includes a heat-conducting substrate 151 and heat-conducting bumps 152 disposed on the heat-conducting substrate 151. The evaporator heat sink 15 is placed in the mounting base 3 and the heat-conducting bumps 152 are located in the through hole 35. The evaporator tube of the first evaporator 1431 is embedded in the heat-conducting substrate 151. When the semiconductor refrigeration box 2 is assembled in the refrigeration device 1, the evaporator heat sink 15 is in contact with the semiconductor refrigeration chip 22. Specifically, the evaporator heat sink 15 is in contact with the hot end 221 of the semiconductor refrigeration chip 22 so that the heat generated by the hot end 221 of the semiconductor refrigeration chip 22 can be exchanged with the cold air in the evaporator tube through the evaporator heat sink 15, thereby increasing the cold air of the cold end 222 of the semiconductor refrigeration chip 22 and reducing the temperature inside the semiconductor refrigeration box 2 to below -40°C.

[0056] Specifically, in this embodiment, the outlet of the capillary tube 1441 is connected to the inlet of the second evaporator 1432, the outlet of the second evaporator 1432 is connected to the inlet of the first evaporator 1431, and the outlet of the first evaporator 1431 is connected to the inlet of the regenerator tube 1442.

[0057] In this embodiment, two heat-conducting bumps 152 are arranged vertically at intervals, and correspondingly, two through holes 35 are also arranged vertically at intervals, so as to increase the heat exchange area between the hot end 221 of the semiconductor cooling chip 22 and the heat sink 15 of the evaporator, thereby improving the heat dissipation efficiency of the hot end 221 and the cooling efficiency of the cold end 222 of the semiconductor cooling chip 22.

[0058] Combination Figure 10 Furthermore, the combined refrigeration equipment also includes a housing 4. When the semiconductor refrigeration box 2 is separated from the refrigeration unit 1, the housing 4 covers the outside of the mounting base 3. In this way, it can be avoided that after the semiconductor refrigeration box 2 is disassembled and removed, the evaporator heat sink 15 will be directly exposed to the storage chamber 11, which would lead to frost on the mounting base 3 and damage to the evaporator heat sink 15. The cold energy generated by the evaporator tubes can be dissipated from the evaporator heat sink 15 to the storage chamber 11 through the housing 4.

[0059] The cover 4 is also provided with a buckle that cooperates with the guide rail. The buckle and the guide rail cooperate with each other, so that the cover 4 can be easily installed on the mounting base 3 or removed from the mounting base 3.

[0060] Furthermore, the combined refrigeration equipment also includes a heat spreader 5 located between the housing 4 and the mounting base 3. The heat spreader 5 is a metal plate, which transfers the cold energy generated by the evaporator tubes to the entire heat spreader 5 after being conducted through the evaporator heat sink 15, thereby increasing the heat dissipation area, which is conducive to the dissipation of cold energy and improving the refrigeration efficiency.

[0061] Combination Figures 11 to 12 Furthermore, the combined refrigeration equipment also includes an external heat dissipation module 6. When the semiconductor refrigeration box 2 is separated from the refrigeration device 1, the semiconductor refrigeration chip 22 of the semiconductor refrigeration box 2 is connected to the external heat dissipation module 6. The external heat dissipation module 6 dissipates heat from the hot end 221 of the semiconductor refrigeration chip 22, thereby generating a large amount of cooling at the cold end 222 of the semiconductor refrigeration chip 22, which in turn supplies cooling to the semiconductor refrigeration box 2 to maintain a low internal temperature.

[0062] Specifically, the external heat dissipation module 6 includes a substrate 61 and a heat sink 62, a cooling fan 63, an air inlet 64, and an air outlet 65 disposed in the substrate 61. When the semiconductor cooling box 2 is connected to the external heat dissipation module 6, the hot end 221 of the semiconductor cooling chip 22 contacts the heat sink 62, thereby dissipating heat from the hot end 221.

[0063] Specifically, the power supply for the external heat dissipation module 6 can be a rechargeable battery for easy portability.

[0064] Furthermore, the combined refrigeration equipment also includes a sensing device and a controller. The sensing device includes a female sensor terminal disposed on the semiconductor refrigeration box 2 and a female sensor terminal A disposed on the refrigeration device 1.

[0065] Specifically, the female end of the sensor is located in the groove 21 of the semiconductor cooling box 2. Preferably, the female end of the sensor is located on the bottom wall 212 of the groove, while the female end of the sensor is located on the mounting base 3 to improve the sensing sensitivity.

[0066] The controller is connected to the sensing device and is used for:

[0067] Detect whether the female terminal of the sensor receives a signal;

[0068] When a signal is received from sensor terminal A, the semiconductor refrigeration box 2 is controlled to connect to the power supply of the refrigeration device 1, and the operating voltage of the semiconductor refrigeration box 2 is controlled according to the difference ΔT between the actual temperature Tc and the set temperature Ts in the semiconductor refrigeration box 2.

[0069] When the female terminal of the sensor receives a signal from the female terminal of the sensor, it indicates that the thermoelectric cooler 2 is assembled in the refrigeration device 1, and the hot end 221 of the thermoelectric cooler 22 is in contact with the heat sink 15 of the evaporator. At this time, the thermoelectric cooler 2 is powered on, and the thermoelectric cooler 2 can be connected to the power supply of the refrigeration device 1, so that the thermoelectric cooler 22 and the refrigeration system of the refrigeration device 1 interact with each other. The evaporator of the refrigeration device 1 dissipates heat from the hot end 221 of the thermoelectric cooler 22. The operating voltage of the thermoelectric cooler 2 is controlled by the difference ΔT between the actual temperature Tc and the set temperature Ts in the thermoelectric cooler 2, so that the thermoelectric cooler 2 can quickly reach the set temperature and improve the refrigeration efficiency.

[0070] Specifically, when 0 < ΔT ≤ 1, the operating voltage of the control semiconductor refrigeration box 2 is U1;

[0071] When 1 < ΔT ≤ 2, the operating voltage of the control semiconductor refrigeration box 2 is U2;

[0072] When 2 < ΔT ≤ 4, the operating voltage of the control semiconductor refrigeration box 2 is U3;

[0073] When △T>4, the operating voltage of the control semiconductor refrigeration box 2 is U4;

[0074] Where, △T=Tc-Ts, U1 <U2<U3<U4。

[0075] Specifically, in this embodiment, U1 is 0-5V, U2 is 5-12V, U3 is 12-25V, and U4 is 25V.

[0076] Preferably, the operating voltage of the semiconductor cooling box 2 is linearly related to ΔT. That is, the larger ΔT is, the larger the operating voltage of the semiconductor cooling box 2 is, so as to improve the cooling efficiency and make the temperature inside the semiconductor cooling box 2 reach the set temperature as soon as possible.

[0077] The semiconductor cooling box 2 can be selectively connected to the cooling device 1 or to the external heat dissipation module 6. The sensing device further includes a sensor sub-terminal B disposed on the external heat dissipation module 6. The controller is connected to the sensor sub-terminal B and is used for:

[0078] When the signal from the sensor daughter terminal B is received at the female terminal of the sensor, the semiconductor cooling box 2 is powered on and its operating voltage is controlled to be 5V.

[0079] When the female terminal of the sensor receives a signal from the female terminal of the sensor, it indicates that the semiconductor cooling box 2 has been removed from the cooling device 1 and connected to the external heat dissipation module 6. At this time, the power supply of the semiconductor cooling box 2 and the external heat dissipation module 6 is connected and powered on, so that the external heat dissipation module 6 dissipates heat from the hot end 221 of the semiconductor cooling chip 22, thereby cooling the cold end 222 of the semiconductor cooling box 2 and keeping the temperature inside the semiconductor cooling box 2 low.

[0080] Preferably, the sensing device is an electromagnetic sensor, a photoelectric sensor, or a photosensitive sensor. The signal between the female terminal of the sensor and the female terminal A or B of the sensor is a magnetic signal, an electrical signal, or an optical signal.

[0081] Combination Figure 13 Another embodiment of the present invention also provides a control method for a semiconductor cooling box 2, using the aforementioned semiconductor cooling box 2, the control method comprising:

[0082] Detect whether the sensor female terminal of the semiconductor cooling box 2 receives a signal;

[0083] When a signal is received from the sensor terminal A located in the refrigeration device 1, the semiconductor refrigeration box 2 is controlled to turn on the power supply of the refrigeration device 1, and the operating voltage of the semiconductor refrigeration box 2 is controlled according to the difference ΔT between the actual temperature Tc and the set temperature Ts in the semiconductor refrigeration box 2.

[0084] When the female terminal of the sensor receives a signal from the female terminal of the sensor, it indicates that the thermoelectric cooler 2 is assembled in the refrigeration device 1, and the hot end 221 of the thermoelectric cooler 22 is in contact with the heat sink 15 of the evaporator. At this time, the thermoelectric cooler 2 is powered on, and the thermoelectric cooler 2 can be connected to the power supply of the refrigeration device 1, so that the thermoelectric cooler 22 and the refrigeration system of the refrigeration device 1 interact with each other. The evaporator of the refrigeration device 1 dissipates heat from the hot end 221 of the thermoelectric cooler 22. The operating voltage of the thermoelectric cooler 2 is controlled by the difference ΔT between the actual temperature Tc and the set temperature Ts in the thermoelectric cooler 2, so that the thermoelectric cooler 2 can quickly reach the set temperature and improve the refrigeration efficiency.

[0085] Furthermore, "controlling the operating voltage of the semiconductor cooling box 2 based on the difference ΔT between the actual temperature Tc and the set temperature Ts in the semiconductor cooling box 2" specifically includes:

[0086] When 0 < ΔT ≤ 1, the operating voltage of the control semiconductor refrigeration box 2 is U1;

[0087] When 1 < ΔT ≤ 2, the operating voltage of the control semiconductor refrigeration box 2 is U2;

[0088] When 2 < ΔT ≤ 4, the operating voltage of the control semiconductor refrigeration box 2 is U3;

[0089] When △T>4, the operating voltage of the control semiconductor refrigeration box 2 is U4;

[0090] Where, △T=Tc-Ts, U1 <U2<U3<U4。

[0091] Specifically, in this embodiment, U1 is 0-5V, U2 is 5-12V, U3 is 12-25V, and U4 is 25V.

[0092] Preferably, the operating voltage of the semiconductor cooling box 2 is linearly related to ΔT. That is, the larger ΔT is, the larger the operating voltage of the semiconductor cooling box 2 is, so as to improve the cooling efficiency and make the temperature inside the semiconductor cooling box 2 reach the set temperature as soon as possible.

[0093] Furthermore, the control method also includes: when a signal is received from the sensor sub-terminal B of the external heat dissipation module 6, controlling the semiconductor cooling box 2 to be powered on and controlling its operating voltage to 5V.

[0094] When the mother terminal of the sensor receives a signal from the daughter terminal of the sensor, it indicates that the semiconductor cooling box 2 is connected to the external heat dissipation module 6, but not to the cooling device 1. At this time, the power supply of the semiconductor cooling box 2 and the external heat dissipation module 6 is connected and powered on, so that the external heat dissipation module 6 dissipates heat from the hot end 221 of the semiconductor cooling chip 22, thereby cooling the cold end 222 of the semiconductor cooling box 2 and keeping the temperature inside the semiconductor cooling box 2 low.

[0095] Preferably, the external heat dissipation module 6 is powered by a storage battery, which not only meets the power requirements of the semiconductor cooling box 2, but is also easy to carry.

[0096] Preferably, the signal between the female terminal of the sensor and the female terminal A or B of the sensor is a magnetic signal, an electrical signal, or an optical signal.

[0097] Furthermore, the control method also includes: when the sensor female terminal does not receive a signal, controlling the semiconductor cooling box 2 to not be powered on.

[0098] Compared with the prior art, the combined refrigeration equipment and control method of the semiconductor refrigeration box 2 provided by the present invention have the following advantages: When the semiconductor refrigeration box 2 of the present invention is assembled in the refrigeration device 1, the hot end 221 of the semiconductor refrigeration chip 22 exchanges heat with the evaporator of the refrigeration device 1, thereby enabling the hot end 221 of the semiconductor refrigeration chip 22 to dissipate heat quickly. On the one hand, it can prevent the heat generated by the hot end 221 from being transferred to the cold end 222 of the semiconductor refrigeration chip 22. On the other hand, it can increase the cooling capacity generated by the cold end 222, thereby reducing the temperature in the semiconductor refrigeration box 2. In addition, when there is a need for transporting or outdoor use of medicines, beverages, food, etc. that require low-temperature preservation, force can be applied to the semiconductor refrigeration box 2 to move the mounting base 3 relative to the groove 21 so that the semiconductor refrigeration box 2 can be removed from the refrigeration device 1, and then the cold drinks and food can be placed in the semiconductor refrigeration box 2 for carrying and keeping warm when going out. The semiconductor refrigeration chip 22 can then provide cooling to medicines, beverages, food, etc. The control method of the semiconductor cooling box 2 of the present invention, when the female terminal of the sensor receives a signal from the male terminal of the sensor, indicating that the semiconductor cooling box 2 is assembled in the refrigeration device 1 and the hot end 221 of the semiconductor cooling chip 22 is in contact with the heat sink 15 of the evaporator, controls the semiconductor cooling box 2 to be powered on. The semiconductor cooling box 2 can be connected to the power supply of the refrigeration device 1, so that the semiconductor cooling chip 22 and the refrigeration system of the refrigeration device 1 interact with each other. The evaporator of the refrigeration device 1 dissipates heat from the hot end 221 of the semiconductor cooling chip 22. The operating voltage of the semiconductor cooling box 2 is controlled by the difference ΔT between the actual temperature Tc and the set temperature Ts in the semiconductor cooling box 2, so that the semiconductor cooling box 2 can quickly reach the set temperature and improve the refrigeration efficiency.

[0099] It should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This way of describing the specification is only for clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

[0100] The detailed descriptions listed above are merely specific descriptions of feasible embodiments of the present invention, and are not intended to limit the scope of protection of the present invention. All equivalent embodiments or modifications made without departing from the spirit of the present invention should be included within the scope of protection of the present invention.

Claims

1. A combined refrigeration device, comprising a refrigeration unit, characterized in that, The device also includes a semiconductor refrigeration box and an assembly mechanism. The refrigeration device has a storage chamber. The semiconductor refrigeration box is detachably assembled into the refrigeration device via the assembly mechanism. The assembly mechanism includes a mounting base located on the inner wall of the refrigeration device and protruding into the storage chamber. The semiconductor refrigeration box has a groove recessed inward from its outer wall. The mounting base is engaged in the groove and can move relative to the groove. The semiconductor refrigeration box includes a semiconductor refrigeration chip. When the semiconductor refrigeration box is assembled into the refrigeration device, the semiconductor refrigeration chip is configured such that its hot end exchanges heat with the evaporator of the refrigeration device. The evaporator includes a first evaporator. The refrigeration device also includes an evaporator heat sink. The mounting base has a through hole. The evaporator heat sink includes a heat-conducting substrate and a heat-conducting protrusion located on the heat-conducting substrate. The evaporator heat sink is placed in the mounting base and the heat-conducting protrusion is located in the through hole. The evaporator tube of the first evaporator is embedded in the heat-conducting substrate. When the semiconductor refrigeration box is assembled into the refrigeration device, the evaporator heat sink is in contact with the semiconductor refrigeration chip.

2. The combined refrigeration equipment according to claim 1, characterized in that, The refrigeration device includes an inner liner, an outer shell, and a foam layer located between the inner liner and the outer shell. The inner liner has an opening, and the mounting seat is disposed in the foam layer and protrudes through the opening toward the storage compartment.

3. The combined refrigeration equipment according to claim 2, characterized in that, The mounting base includes a limiting portion and a protruding portion connected to the limiting portion. The protruding portion passes through the opening and protrudes toward the storage chamber. The limiting portion is located in the foam layer, and the surface of the limiting portion toward the storage chamber abuts against the portion of the inner liner located around the opening.

4. The combined refrigeration equipment according to claim 2, characterized in that, The mounting base has a pair of guide bars at one end away from the inner liner. The mounting base includes a pair of side plates arranged opposite each other. The pair of side plates are perpendicular to the inner liner. The pair of guide bars are respectively disposed on the pair of side plates and protrude away from each other. The groove includes a pair of groove sidewalls arranged opposite each other. The pair of groove sidewalls are respectively provided with guide grooves. The guide bars are placed in the guide grooves and can move along the guide grooves.

5. The combined refrigeration equipment according to claim 4, characterized in that, The guide bar gradually tilts towards the inner liner along the assembly direction of the semiconductor refrigeration box.

6. The combined refrigeration equipment according to claim 5, characterized in that, The angle between the guide bar and the inner liner is 0.5 to 5°.

7. The combined refrigeration equipment according to claim 1, characterized in that, It also includes a cover, which covers the outside of the mounting base when the semiconductor refrigeration box is separated from the refrigeration device.

8. The combined refrigeration equipment according to claim 7, characterized in that, It also includes a heat spreader plate disposed between the housing and the mounting base.

9. The combined refrigeration equipment according to claim 1, characterized in that, It also includes an external heat dissipation module. When the semiconductor refrigeration box is separated from the refrigeration device, the semiconductor refrigeration chip of the semiconductor refrigeration box is connected to the external heat dissipation module.

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