Substrate and optical module

Abstract

The application discloses a kind of substrate and optical module, belong to communication technical field.The one board surface of the substrate is arranged in parallel with limiting plate, and the other board surface of the substrate is provided with at least one buckle, and the limiting plate and the buckle are arranged out of the substrate.The substrate and optical module provided in the embodiment of the application can realize the clamping of the substrate on the PCB by the limiting cooperation of the buckle and the limiting plate, which can not only avoid the offset or falling of the substrate during use, ensure the stability of the optical signal, but also ensure the accurate positioning and installation of the substrate and the corresponding light emitting unit on the substrate, and ensure the packaging precision.

Description

Technical Field

[0001] This invention belongs to the field of communication technology, and more specifically, relates to a substrate and an optical module. Background Technology

[0002] With the continuous and rapid development of my country's optical communication industry and the updating and upgrading of communication technologies, optical modules, as the foundation for building modern high-speed information networks, play an irreplaceable role in the optical communication industry. As optical module technology develops, transmission rates are also constantly improving, gradually evolving from 1.25G to 10G, 25G, 100G, and even the current 200G, 400G, and 800G. The transmission rates of optical modules are getting higher and higher, while the required size is getting smaller and smaller.

[0003] In recent years, with the development and application of access networks and data centers, bandwidth has become increasingly wider, while costs have become increasingly lower. 400GCOB packaging is a low-cost, high-speed packaging solution. COB packaging technology mainly involves adhering components to a PCB board using conductive or non-conductive adhesive, and then using wire bonding to achieve their electrical connection.

[0004] To improve packaging efficiency, some components are first mounted on a substrate, which is then adhered to the PCB. However, high transmission rates lead to higher heat release from optical devices, causing the optical module to overheat during operation. The large substrate size also affects the bonding effect, resulting in substrate misalignment or even detachment during use. This misalignment of the optical transmission path within the optical module leads to the loss of photoelectric signals. Summary of the Invention

[0005] In view of the above-mentioned defects or improvement needs of the prior art, the present invention provides a substrate and an optical module, the purpose of which is not only to avoid substrate displacement or detachment caused by high temperature during the operation of the optical module and to ensure the stability of photoelectric signals, but also to ensure the precise positioning and installation of the optical emitting unit and to ensure packaging accuracy.

[0006] In a first aspect, the present invention provides a substrate, wherein a limiting plate is disposed parallel to one side of the substrate, and at least one buckle is disposed on the other side of the substrate, wherein both the limiting plate and the buckle protrude from the substrate.

[0007] In a second aspect, the present invention provides an optical module, the optical module comprising a PCB board, a substrate, an optical emitting unit, and an optical receiving unit;

[0008] The PCB board has positioning holes, the light emitting unit is located on the substrate, a limiting plate is arranged parallel to one side of the substrate, and at least one buckle that can pass through the positioning hole is provided on the other side of the substrate. The limiting plate and the buckle both protrude from the substrate. The substrate is inserted into the positioning hole, and the buckle and the limiting plate clamp the PCB board.

[0009] The light receiving unit is located on the PCB board, and both the light emitting unit and the light receiving unit are electrically coupled to the PCB board.

[0010] Optionally, a plurality of positioning posts are spaced apart on the surface of the limiting plate facing the substrate, and the PCB board has a plurality of through holes, with the plurality of positioning posts and the plurality of through holes corresponding one-to-one, and each positioning post being inserted into the corresponding through hole.

[0011] Optionally, each of the through holes is located on the side of the positioning hole and communicates with the positioning hole.

[0012] Optionally, the side of the buckle facing away from the substrate is a guide slope, and in the direction of extension of the guide slope from the limiting plate to the substrate, the guide slope gradually approaches the central axis of the positioning hole.

[0013] Optionally, the optical emitting unit includes multiple lasers, multiple collimating lenses, a multiplexer, a converging lens, and an output fiber optic connector. The multiple lasers, multiple collimating lenses, the multiplexer, and the converging lens are arranged sequentially on the substrate. The multiple lasers and multiple collimating lenses correspond one-to-one, and each laser is electrically connected to the PCB board.

[0014] Optionally, the substrate has a first positioning plane, a second positioning plane, and a third positioning plane. The first positioning plane, the second positioning plane, and the third positioning plane each have a plurality of first limiting surfaces, a plurality of second limiting surfaces, and a plurality of third limiting surfaces in their circumferential directions to form a first positioning groove, a second positioning groove, and a third positioning groove that are connected in sequence. The output fiber optic connector is located in the first positioning groove, the converging lens is located in the second positioning groove, and the multiplexer is located in the third positioning groove.

[0015] The limiting plate has a fourth positioning groove, which is located on one side of the substrate. The multi-channel laser and the multi-channel collimating lens are located in the fourth positioning groove. The first positioning groove, the second positioning groove, the third positioning groove and the fourth positioning groove are all rectangular structures and are aligned with each other to ensure the optical path alignment of the light emitting unit.

[0016] Optionally, a semiconductor cooler or an aluminum nitride carrier is installed in the fourth positioning groove, and multiple lasers are arrayed and attached to the semiconductor cooler or the aluminum nitride carrier.

[0017] Optionally, the optical receiving unit includes an input fiber optic connector, a demultiplexer, a multi-channel photodetector, and a transimpedance amplifier, which are sequentially disposed on the PCB board, and the transimpedance amplifier is electrically connected to the PCB board.

[0018] Optionally, the substrate, the limiting plate, and the buckle are integrally formed and made of tungsten copper alloy with a coefficient of thermal expansion of 8-10ppm.

[0019] The beneficial effects of the technical solution provided by the embodiments of the present invention are as follows:

[0020] In the optical module provided by this embodiment of the invention, the PCB board has positioning holes, the light emitting unit is located on the substrate, one side of the substrate is provided with a limiting plate parallel to it, and the other side of the substrate is provided with at least one buckle that can pass through the positioning hole. Both the limiting plate and the buckle protrude from the substrate. The substrate is inserted into the positioning hole, and the buckle and the limiting plate clamp the PCB board. Thus, the buckle and the substrate can be inserted into the positioning hole of the PCB board by pressing down. When the substrate is inserted into the positioning hole, the buckle can spring back and protrude from the positioning hole, which allows the buckle and the limiting plate to firmly clamp the substrate onto the PCB board, realizing the mounting of the substrate. Even if the optical module itself generates heat during operation, it will not cause the substrate to shift or fall off, ensuring the stability of the photoelectric signal. This avoids the problem of substrate shifting during the operation of the optical module due to the adhesive substrate, resulting in the loss of photoelectric signal. At the same time, due to the positioning function of the positioning hole, the substrate and the corresponding light emitting unit on the substrate can be accurately positioned and installed, ensuring the packaging accuracy.

[0021] In other words, the substrate and optical module provided in this embodiment of the invention can be mounted on the PCB board by means of the limiting cooperation of the buckle and the limiting plate. This not only avoids the substrate from shifting or falling off due to high temperature during the operation of the optical module, thus ensuring the stability of the photoelectric signal, but also ensures the precise positioning and installation of the substrate and the corresponding light emitting unit on the substrate, thus ensuring the packaging accuracy.

[0022] The optical module in this application embodiment has optical emitting units and optical receiving units with different shapes, thereby facilitating the assembly of the optical module and avoiding confusion during installation. A substrate is provided for the optical emitting unit to be mounted on a PCB board, eliminating the need for an additional substrate for the optical receiving unit. This reduces the cost of the optical module without affecting its performance and also helps to reduce the size of the optical module and / or the optical receiving unit. Attached Figure Description

[0023] Figure 1 This is a schematic diagram of the structure of an optical module provided in an embodiment of the present invention;

[0024] Figure 2 This is a schematic diagram of the PCB board structure provided in an embodiment of the present invention;

[0025] Figure 3 This is a schematic diagram of the substrate structure provided in an embodiment of the present invention;

[0026] Figure 4 This is a cross-sectional view of the substrate provided in an embodiment of the present invention.

[0027] The symbols in the diagram represent the following meanings:

[0028] 1. PCB board; 11. Positioning holes; 12. Through holes; 13. Digital signal processing chip; 14. Gold fingers;

[0029] 2. Base plate; 21. Limiting plate; 211. Positioning post; 212. Fourth positioning groove; 22. Buckle; 221. Guide slope; 23. First positioning plane; 231. First limiting surface; 24. Second positioning plane; 241. Second limiting surface; 25. Third positioning plane; 251. Third limiting surface; 26. Fifth positioning groove;

[0030] 3. Optical emitting unit; 31. Laser; 32. Collimating lens; 33. Wave combiner; 34. Converging lens; 35. Output fiber optic connector; 351. LC output port;

[0031] 4. Optical receiving unit; 41. Input fiber optic connector; 411. LC input port; 42. Demultiplexer; 43. Photodetector; 44. Transimpedance amplifier. Detailed Implementation

[0032] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the invention. Furthermore, the technical features involved in the various embodiments of this invention described below can be combined with each other as long as they do not conflict with each other.

[0033] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0034] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this invention, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0035] In this invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0036] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "over," and "on top" of the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0037] The present invention provides a substrate, wherein a limiting plate is arranged parallel to one side of the substrate, and at least one buckle is arranged on the other side of the substrate, wherein both the limiting plate and the buckle protrude from the substrate.

[0038] It is easy to understand that when the substrate 2 is inserted into the positioning hole of the part to be installed, the buckle 22 returns to its original shape after passing through the positioning hole and abuts against the part to be installed. This allows the buckle 22 and the limiting plate 21 to firmly clamp the substrate 2 onto the part to be installed, thus realizing the installation of the substrate 2. Even if the part to be installed itself generates heat during operation, it will not cause the substrate 2 to shift or fall off.

[0039] It should be noted that the component to be installed can be the PCB board 1 mentioned later or other photoelectric conversion components; this invention does not limit this. This invention uses the application of a substrate to the PCB board of an optical module as an example for illustration:

[0040] Figure 1 This is a schematic diagram of the structure of an optical module provided in an embodiment of the present invention, as shown below. Figure 1 As shown, the optical module includes a PCB board 1, a substrate 2, an optical emitting unit 3, and an optical receiving unit 4.

[0041] Figure 2 This is a schematic diagram of the PCB board structure provided in an embodiment of the present invention, as shown below. Figure 2 As shown, PCB board 1 has positioning holes 11.

[0042] Figure 3 This is a schematic diagram of the substrate structure provided in an embodiment of the present invention. Figure 4 This is a cross-sectional view of the substrate provided in an embodiment of the present invention, in conjunction with... Figure 3 and Figure 4 As shown, the light emitting unit 3 is located on the substrate 2. A limiting plate 21 is arranged parallel to one side of the substrate 2, and at least one buckle 22 that can pass through the positioning hole 11 is provided on the other side of the substrate 2. Both the limiting plate 21 and the buckle 22 protrude from the substrate 2. The substrate 2 is inserted into the positioning hole 11, and the buckle 22 and the limiting plate 21 clamp the PCB board 1.

[0043] The light receiving unit 4 is located on the PCB board 1, and both the light emitting unit 3 and the light receiving unit 4 are electrically coupled to the PCB board 1.

[0044] In an embodiment of the present invention, an optical module is provided. Since the PCB board 1 has a positioning hole 11, the light emitting unit 3 is located on the substrate 2. One side of the substrate 2 is provided with a limiting plate 21, and the other side of the substrate 2 is provided with at least one buckle 22 that can pass through the positioning hole 11. The limiting plate 21 and the buckle 22 both protrude from the substrate 2. The substrate 2 is inserted into the positioning hole 11, and the buckle 22 and the limiting plate 21 clamp the PCB board 1. When the PCB board 1 moves relative to the substrate 2, the clip 22 and the substrate 2 are inserted into the positioning hole 11 on the PCB board 1 in sequence. When the substrate 2 is inserted into the positioning hole 11, the clip 22 returns to its original shape after passing through the positioning hole 11 and abuts against the PCB board 1. This allows the clip 22 and the limiting plate 21 to firmly clamp the substrate 2 onto the PCB board 1, achieving fixation of the substrate 2 perpendicular to the PCB board 1. Even if the optical module itself generates heat during operation, it will not cause the substrate 2 to shift or fall off, ensuring the stability of the photoelectric signal. This avoids the problem of the substrate 2 falling off during the operation of the optical module due to adhesive bonding, which would cause the photoelectric signal to fail. At the same time, due to the positioning function of the positioning hole 11, the substrate 2 and the corresponding light emitting unit 3 on the substrate 2 can be accurately positioned and installed, ensuring packaging accuracy.

[0045] In other words, the optical module provided in this embodiment of the invention can fix the substrate 2 perpendicular to the PCB board 1 by the limiting cooperation of the buckle 22 and the limiting plate 21. This not only prevents the substrate 2 from shifting or falling off during use and ensures the stability of the photoelectric signal, but also ensures the precise positioning and installation of the substrate 2 and the corresponding light emitting unit 3 on the substrate 2, thus ensuring the packaging accuracy.

[0046] In this embodiment, there can be two buckles 22, and the two buckles 22 extend along the side length direction of the substrate 2, so that with the cooperation of the limiting plate 21, they form two rows of strip-shaped limiting, thereby further ensuring the clamping stability of the substrate 2.

[0047] For example, the positioning hole 11 is a square hole or other polygonal hole.

[0048] Combination Figure 2 and Figure 3 As shown, a plurality of positioning posts 211 are spaced apart on the surface of the limiting plate 21 facing the substrate 2. The PCB board 1 has a plurality of through holes 12. The plurality of positioning posts 211 and the plurality of through holes 12 correspond one-to-one, and each positioning post 211 is inserted into the corresponding through hole 12.

[0049] In the above embodiments, the cooperation between the through hole 12 and the positioning post 211 can not only ensure the insertion accuracy and orientation of the substrate 2, avoid the substrate displacement caused by high temperature during operation of the optical module, and ensure the stability of the optical signal, but also guide the insertion of the buckle 22 and the substrate 2, thereby improving the assembly efficiency.

[0050] For example, each through hole 12 is located on the side of the positioning hole 11 and is connected to the positioning hole 11.

[0051] It is easy to understand that the through hole 12 is located on the outer edge of the positioning hole 11 and is connected, which can reduce the machining difficulty and machining accuracy of the through hole 12.

[0052] For example, the positioning post 211 can be a cylindrical or semi-cylindrical structure.

[0053] In one implementation of the present invention, the side of the buckle 22 away from the substrate 2 is a guide slope 221, and in the extension direction of the guide slope 221 from the limiting plate 21 to the substrate 2, the guide slope 221 gradually approaches the central axis of the positioning hole 11.

[0054] In the above embodiment, the guide slope 221 can cause the buckle 22 to deform toward the center of the positioning hole 11 during the insertion of the substrate 2, so that the buckle 22 can be quickly inserted into the positioning hole 11.

[0055] See you again Figure 1 The optical emitting unit 3 includes a multi-channel laser 31, a multi-channel collimating lens 32, a combiner 33, a converging lens 34, and an output fiber optic connector 35. The multi-channel laser 31, the multi-channel collimating lens 32, the combiner 33, and the converging lens 34 are arranged sequentially on the substrate 2. The multi-channel laser 31 and the multi-channel collimating lens 32 correspond one-to-one, and each laser 31 is electrically connected to the PCB board 1.

[0056] It is easy to understand that the optical emitting unit 3 is configured such that the multi-channel laser 31 converts the received multiple electrical signals into multiple laser beams. The multiple laser beams emitted by the multi-channel laser 31 are respectively collimated by the multi-channel collimating lens 32 to form multiple parallel beams, and then converged into a single beam by the combiner 33. After passing through the converging lens 34, the beam enters the output fiber optic connector 35. Thus, through the cooperation of the multi-channel laser 31, the multi-channel collimating lens 32, the combiner 33, the converging lens 34, and the output fiber optic connector 35, the multiple electrical signals provided by the PCB board 1 can be converted into a single beam signal for transmission, thereby improving transmission efficiency.

[0057] It should be noted that the collimating lens 32 can be a single discrete lens, an array of multiple lenses, or a combination of multiple lenses.

[0058] In this embodiment, the substrate 2 has a first positioning plane 23, a second positioning plane 24 and a third positioning plane 25. The first positioning plane 23, the second positioning plane 24 and the third positioning plane 25 have a plurality of first limiting surfaces 231, a plurality of second limiting surfaces 241 and a plurality of third limiting surfaces 251 in the circumferential direction, so as to form a first positioning groove, a second positioning groove and a third positioning groove that are connected in sequence. The output fiber optic connector 35 is located in the first positioning groove, the converging lens 34 is located in the second positioning groove, and the multiplexer 33 is located in the third positioning groove.

[0059] The limiting plate 21 has a fourth positioning groove 212, which is located on one side of the substrate 2 (the first positioning groove is located on the other side of the substrate 2). The multi-channel laser 31 and the multi-channel collimating lens 32 are located in the fourth positioning groove 212. The first positioning groove, the second positioning groove, the third positioning groove and the fourth positioning groove 212 are all rectangular structures, and they are aligned in sequence to ensure the optical path alignment of the light emitting unit 3.

[0060] In the above embodiments, the positioning surface and the first limiting surface 231 provided by the first positioning plane 23 can be used to position and insert the output fiber optic connector 35; the positioning surface and the second limiting surface 241 provided by the second positioning plane 24 can be used to position and insert the converging lens 34; and the positioning surface and the third limiting surface 251 provided by the third positioning plane 25 can be used to position and insert the multiplexer 33 (i.e., the positioning surface and the corresponding limiting surface form a limiting groove). The positioning groove 212 can be used to position the multi-channel laser 31 and the multi-channel collimating lens 32. In addition, the first positioning groove, the second positioning groove, the third positioning groove and the fourth positioning groove are configured as described above, which not only facilitates the installation and positioning of each component, but also assists in aligning the optical path (each component is installed in the corresponding limiting groove, and the position provided by the limiting groove ensures that each component is aligned after installation).

[0061] In other words, by designing the positioning plane and limiting surface, the components of the light emitting unit 3 can be positioned to ensure the installation accuracy of each component and simplify the installation process.

[0062] In this embodiment, the substrate 2 has a fifth positioning groove 26, which connects the first positioning groove and the second positioning groove to ensure the passage of the optical path. However, when the thickness of the output fiber optic connector 35 is large (higher than the substrate 2), its optical path is not interfered with by the substrate 2, and the fifth positioning groove 26 may not be provided. This invention does not impose any restrictions on this.

[0063] For example, the left end of the output fiber optic connector 35 is an LC output port 351, and the right end of the fiber optic connector is a pigtail, which is positioned and inserted into the first positioning plane 23. The LC output port 351 can be connected to an external optical fiber.

[0064] In the optical emitting unit 3, the laser 31 is the main heat-generating device. To reduce the heat generated during operation of the optical module, a semiconductor cooler or aluminum nitride carrier is installed in the fourth positioning groove 212. The multiple lasers 31 are arrayed and mounted on the semiconductor cooler or aluminum nitride carrier. The semiconductor cooler or aluminum nitride carrier provides good heat dissipation for the multiple lasers 31.

[0065] In this embodiment, the optical receiving unit 4 includes an input fiber optic connector 41, a demultiplexer 42, a multi-channel photodetector 43, and a transimpedance amplifier 44, which are sequentially disposed on the PCB board 1. The transimpedance amplifier 44 is electrically connected to the PCB board 1.

[0066] It is easy to understand that the optical receiving unit 4 is configured such that the combined beam enters the demultiplexer 42 through the input fiber optic connector 41, and is split into multiple wavelength division beams by the demultiplexer 42. Each wavelength division beam passes through a corresponding photodetector 43, and each photodetector 43 converts the received corresponding wavelength division beam into an electrical signal and sends it to the transimpedance amplifier 44. Thus, through the cooperation of the input fiber optic connector 41, the demultiplexer 42, the multiple photodetectors 43, and the transimpedance amplifier 44, a combined beam is converted into multiple electrical signals, thereby improving transmission efficiency.

[0067] For example, the left end of the input fiber optic connector 41 is an LC input port 411, which can be connected to an external fiber optic cable.

[0068] For example, the multi-channel laser 31, the multi-channel collimating lens 32, and the multi-channel photodetector 43 can all be 4-channel or 8-channel.

[0069] In this embodiment, the substrate 2, the limiting plate 21, and the buckle 22 are integrally formed, which is easy to process, and the material is tungsten copper alloy (e.g., W70Cu30), with a thermal expansion coefficient of 8-10ppm. This allows the thermal expansion coefficient of the substrate 2 to be close to that of the PCB board 1, reducing stress and deformation during temperature changes, maintaining the stability of the optical path, providing good heat dissipation for the optical device, and reducing the overall power consumption of the device.

[0070] In addition, the PCB board 1 has a digital signal processing chip 13 (e.g., a DSP chip) and a gold finger 14. The light emitting unit 3 and the light receiving unit 4 are electrically connected to the digital signal processing chip 13 and the gold finger 14 in sequence. The transmission and processing of electrical signals can be realized through the digital signal processing chip 13 and the gold finger 14. Among them, the gold finger 14 can realize its electrical connection with the outside world.

[0071] For the optical emitting unit 3, the optical module transmits the multiple electrical signals received by the gold finger 14 to the multiple laser 31 through the digital signal processing chip 13.

[0072] For the optical receiving unit 4, each electrical signal is amplified by the transimpedance amplifier 44, converted into a voltage signal, input to the digital signal processing chip 13 for processing, and then output through the gold finger 14.

[0073] The present invention also provides a photoelectric conversion device, which includes an optical module as described above.

[0074] In summary, the beneficial effects of the above-described technical solutions conceived by this invention compared with the prior art include:

[0075] (1) The optical module of the present invention, on the one hand, securely clamps the substrate 2 onto the PCB board 1 through the buckle 22 and the limiting plate 21, thereby achieving the mounting of the substrate 2. Even if the optical module itself generates heat during operation, it will not cause the substrate 2 to shift or fall off, ensuring the stability of the photoelectric signal and thus avoiding the problem of photoelectric signal loss caused by the substrate 2 shifting during the operation of the optical module due to the bonding of the substrate 2. On the other hand, due to the positioning function of the positioning hole 11, the substrate 2 and the corresponding light emitting unit 3 on the substrate 2 can be accurately positioned and installed, ensuring the packaging accuracy.

[0076] (2) The optical module of the present invention can realize the positioning and insertion of the output fiber optic connector 35 through the positioning surface and the first limiting surface 231 provided by the first positioning plane 23, the positioning and insertion of the converging lens 34 through the positioning surface and the second limiting surface 241 provided by the second positioning plane 24, the positioning and insertion of the multiplexer 33 through the positioning surface and the third limiting surface 251 provided by the third positioning plane 25, and the positioning and insertion of the multi-channel laser 31 and the multi-channel collimating lens 32 through the positioning surface provided by the fourth positioning groove 212. This reduces the overall positioning difficulty of the optical emitting unit 3, facilitates the adjustment of optical coupling efficiency, and controls the final output optical power within the required range.

[0077] (3) The optical module of the present invention uses W70Cu30 substrate 2, which makes the thermal expansion coefficient of substrate 2 close to that of PCB board 1, reduces stress and deformation when temperature changes, maintains the stability of optical path, provides good heat dissipation for optical device, and reduces the overall power consumption of device.

[0078] (4) The optical module of the present invention, through the design of positioning post 211 and through hole 12, and the design of guide slope 221, can ensure the insertion accuracy and orientation of substrate 2, and can also guide the insertion of buckle 22 and substrate 2, thereby improving assembly efficiency.

[0079] (5) The optical module structure of the present invention is simple and can be directly produced by automated mounting equipment, reducing reliance on manual labor and improving production efficiency.

[0080] Those skilled in the art will readily understand that the above description is merely a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention should be included within the scope of protection of the present invention.

Claims

1. An optical module, characterized in that, The optical module includes a PCB board, a substrate, an optical emitting unit, and an optical receiving unit; The optical emitting unit includes a multi-channel laser, a multi-channel collimating lens, a multiplexer, a converging lens, and an output fiber optic connector; The substrate is provided with a first positioning groove, a second positioning groove and a third positioning groove that are connected. The output fiber optic connector is located in the first positioning groove, the converging lens is located in the second positioning groove, and the multiplexer is located in the third positioning groove. A limiting plate is provided parallel to one surface of the substrate. The limiting plate has a fourth positioning groove. The fourth positioning groove is located on one side of the substrate. The multi-channel laser and the multi-channel collimating lens are located in the fourth positioning groove. The first positioning groove, the second positioning groove, the third positioning groove and the fourth positioning groove are all rectangular structures and are aligned in sequence to ensure the optical path alignment of the light emitting unit. The PCB board has positioning holes, the light emitting unit is located on the substrate, and another surface of the substrate is provided with at least one buckle that can pass through the positioning hole. The buckle is an elastic strip structure that extends along the side length of the substrate. The limiting plate and the buckle both protrude from the substrate. The substrate is inserted into the positioning hole, and the PCB board is clamped between the buckle and the limiting plate. The limiting plate has a plurality of positioning posts spaced apart on its surface facing the substrate. The PCB board has a plurality of through holes, and the plurality of positioning posts and the plurality of through holes correspond one-to-one. Each positioning post is inserted into the corresponding through hole, and each through hole is located on the side of the positioning hole and communicates with the positioning hole. When the PCB moves relative to the substrate, the positioning hole is inserted into the buckle and the substrate in sequence. When the substrate is inserted into the positioning hole, the buckle passes through the positioning hole, restores its deformation, and abuts against the PCB. The light receiving unit is located on the PCB board, and both the light emitting unit and the light receiving unit are electrically coupled to the PCB board; The thermal expansion coefficient of the substrate is 8-10ppm, which is close to that of the PCB board.

2. An optical module according to claim 1, characterized in that, The side of the buckle facing away from the base plate is a guide slope, and in the direction of extension of the guide slope from the limiting plate to the base plate, the guide slope gradually approaches the central axis of the positioning hole.

3. An optical module according to claim 1, characterized in that, The multiple lasers, multiple collimating lenses, the combiner, and the converging lens are arranged sequentially on the substrate. The multiple lasers and multiple collimating lenses correspond one-to-one, and each laser is electrically connected to the PCB board.

4. An optical module according to claim 1, characterized in that, The substrate has a first positioning plane, a second positioning plane, and a third positioning plane. The first positioning plane, the second positioning plane, and the third positioning plane each have a plurality of first limiting surfaces, a plurality of second limiting surfaces, and a plurality of third limiting surfaces in their circumferential directions, so as to form a first positioning groove, a second positioning groove, and a third positioning groove that are connected in sequence.

5. An optical module according to claim 1, characterized in that, A semiconductor cooler or an aluminum nitride carrier is installed in the fourth positioning groove, and multiple lasers are arrayed and attached to the semiconductor cooler or the aluminum nitride carrier.

6. An optical module according to claim 1, characterized in that, The optical receiving unit includes an input fiber optic connector, a demultiplexer, a multi-channel photodetector, and a transimpedance amplifier, which are sequentially arranged on the PCB board. The transimpedance amplifier is electrically connected to the PCB board.

7. An optical module according to any one of claims 1-6, characterized in that, The substrate, the limiting plate, and the buckle are integrally formed and are made of tungsten copper alloy.

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