Electronic device and control method

Abstract

The application discloses an electronic device and a control method. The electronic device comprises a shell, a first accommodating position and a second accommodating position which are arranged side by side along a first direction, a first heat dissipation module arranged in the first accommodating position and used for dissipating heat of a first heat generating component of the electronic device, a second heat dissipation module arranged in the second accommodating position and used for dissipating heat of a second heat generating component of the electronic device, and a heat conduction member connected with the first heat dissipation module and the second heat dissipation module and capable of realizing heat exchange between the first heat dissipation module and the second heat dissipation module. The first heat dissipation module is arranged close to a first shell part of the shell, the second heat dissipation module is arranged close to a second shell part of the shell, the first shell part and the second shell part are two parts of the shell which are oppositely arranged along a second direction, and the second direction is perpendicular to the first direction.

Description

Technical Field

[0001] This application relates to the field of heat dissipation technology, and more specifically, to an electronic device and control method. Background Technology

[0002] In current computer case designs, both the motherboard and graphics card have their own independent cooling modules. During operation, each cooling module works independently to cool the components it is responsible for. With the continuous increase in CPU and / or graphics card power, to ensure effective cooling, one solution is to replace the cooling module with a larger one, and another is to increase the operating power of the existing cooling module. However, both solutions sacrifice user experience. Summary of the Invention

[0003] In view of the above, this application provides the following technical solution:

[0004] An electronic device, comprising:

[0005] The housing has a first receiving position and a second receiving position arranged side by side along a first direction;

[0006] A first heat dissipation module is disposed in the first receiving position and is used to dissipate heat from the first heat-generating component of the electronic device;

[0007] The second heat dissipation module is disposed in the second receiving position and is used to dissipate heat from the second heat-generating component of the electronic device;

[0008] A heat-conducting component connects the first heat dissipation module and the second heat dissipation module, enabling heat exchange between the first heat dissipation module and the second heat dissipation module;

[0009] The first heat dissipation module is disposed near the first housing portion of the housing, and the second heat dissipation module is disposed near the second housing portion of the housing. The first housing portion and the second housing portion are two parts of the housing disposed opposite to each other along a second direction, which is perpendicular to the first direction.

[0010] Optionally, it also includes:

[0011] The motherboard is disposed in the first receiving position via the second housing portion, the first heat-generating component is disposed on the first surface of the motherboard facing away from the second housing portion, and the first heat dissipation module is disposed on the first surface and thermally connected to the first heat-generating component.

[0012] An expansion board is disposed in the second receiving position. The second heating element is disposed on the second surface of the expansion board facing away from the first housing portion. The second heat dissipation module is disposed on the third surface of the second housing portion facing the first housing portion. The second heat dissipation module is thermally connected to the second heating element.

[0013] Optionally, a communication connection component is further provided between the motherboard and the expansion card to realize data exchange and / or power transmission between the motherboard and the expansion card;

[0014] The communication connection component includes a communication cable and an adapter card electrically connected to the first communication interface on the motherboard. One end of the communication cable is connected to the second communication interface on the expansion board, and the other end is connected to the adapter card. The length of the communication cable is greater than the distance between the expansion board and the motherboard.

[0015] Optionally, the first heat dissipation module and the second heat dissipation module include a fan and a heat dissipation fin assembly, and the electronic device further includes a first fixed connector disposed between the fan or the heat dissipation fin assembly of the first heat dissipation module and the second heat dissipation module, for limiting relative displacement between the first heat dissipation module and the second heat dissipation module; or,

[0016] The first heat dissipation module and the second heat dissipation module include a fan and a radiator. The electronic device also includes a second fixed connector disposed between the fan or the radiator of the first heat dissipation module and the second heat dissipation module, for limiting relative displacement between the first heat dissipation module and the second heat dissipation module.

[0017] Optionally, the fixing connector is disposed on the periphery of the heat-conducting component and is arranged intersectingly with the heat-conducting component.

[0018] This application also provides a control method applied to any of the above-mentioned electronic devices, the method comprising:

[0019] Obtain usage information for electronic devices;

[0020] Configure the power range of the electronic device based on the usage information; and,

[0021] Within the corresponding power range, control the first heat dissipation module and / or the second heat dissipation module of the electronic device to dissipate heat from the electronic device with the target heat dissipation parameters;

[0022] The first heat dissipation module and the second heat dissipation module can work together through the heat-conducting components between them to dissipate heat from the first heat-generating component and / or the second heat-generating component of the electronic device.

[0023] Optionally, configuring the power range of the electronic device based on the usage information includes at least one of the following:

[0024] If the usage information indicates that the electronic device is used by a first user, the electronic device is configured to a first power range.

[0025] If the usage information indicates that the electronic device is used by a second user, the electronic device is configured to a second power range.

[0026] If the usage information indicates that the electronic device is in a first usage scenario, the electronic device is configured to a first power range;

[0027] If the usage information indicates that the electronic device is in a second usage scenario, configure the electronic device to a second power range;

[0028] If the usage information indicates that the electronic device is in a first usage mode, configure the electronic device to a first power range;

[0029] If the usage information indicates that the electronic device is in a second usage mode, configure the electronic device to a second power range;

[0030] If the usage information represents the usage duration information of the electronic device, the power range of the electronic device is configured based on the usage duration information;

[0031] If the usage information guarantees the intended use of the electronic device, configure the power range of the electronic device based on the intended use;

[0032] Within the target duration, the total power consumption of the electronic device in the second power range is greater than its total power consumption in the first power range.

[0033] Optionally, controlling the first heat dissipation module and / or the second heat dissipation module of the electronic device to dissipate heat from the electronic device with target heat dissipation parameters within a corresponding power range includes at least one of the following:

[0034] If the electronic device is in the second power range, control the first heat dissipation module and the second heat dissipation module to perform heat dissipation operations with corresponding target heat dissipation parameters respectively;

[0035] If the electronic device is in the first power range, the heating parameters of the first heating component and the second heating component are obtained, and the first heat dissipation module and / or the second heat dissipation module are controlled to perform heat dissipation operations with corresponding target heat dissipation parameters based on the heating parameters.

[0036] Optionally, controlling the first heat dissipation module and / or the second heat dissipation module to perform heat dissipation operations with corresponding target heat dissipation parameters based on the heat dissipation parameters includes at least one of the following:

[0037] If the first heating parameter of the first heating component indicates that its temperature is not greater than the first threshold, the first heat dissipation module is controlled to stop working.

[0038] If the first heating parameter of the first heating component indicates that its temperature is greater than the first threshold, the corresponding first target heat dissipation parameter is determined based on the first temperature difference between it and the first threshold, and a heat dissipation operation is performed.

[0039] If the second heating parameter of the second heating component indicates that its temperature is not greater than the second threshold, the second heat dissipation module is controlled to stop working.

[0040] If the second heating parameter of the second heating component indicates that its temperature is greater than the second threshold, the corresponding second target heat dissipation parameter is determined based on the second temperature difference between it and the second threshold, and the heat dissipation operation is performed.

[0041] Optionally, it also includes:

[0042] Obtain usage change information of the electronic device, and adjust the target heat dissipation parameters corresponding to the first heat dissipation module and / or the second heat dissipation module based on the usage change information.

[0043] As can be seen from the above technical solutions, the embodiments of this application disclose an electronic device and a control method. In the electronic device, two heat dissipation modules arranged side by side are used to dissipate heat from different heat-generating components. A heat-conducting component is connected between the two heat dissipation modules to realize heat exchange between the two heat dissipation modules. Thus, during the operation of the electronic device, the two heat dissipation modules can work together through the heat-conducting component between them to dissipate heat from the first heat-generating component and / or the second heat-generating component of the electronic device, thereby improving heat dissipation efficiency. Attached Figure Description

[0044] To more clearly illustrate the technical solutions of the embodiments of this application, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only embodiments of this application. For those skilled in the art, other drawings can be obtained based on the provided drawings without creative effort.

[0045] Figure 1 This is a front view of the structure of an electronic device disclosed in an embodiment of this application;

[0046] Figure 2 This is a schematic diagram of the structure of another electronic device disclosed in an embodiment of this application;

[0047] Figure 3 This is a schematic diagram of the installation structure of a communication connection component disclosed in an embodiment of this application;

[0048] Figure 4 This is a schematic diagram of the structure of another electronic device disclosed in an embodiment of this application;

[0049] Figure 5 This is a flowchart of a control method disclosed in an embodiment of this application;

[0050] Figure 6 This is a schematic diagram illustrating the implementation process of the heat dissipation control method disclosed in the embodiments of this application;

[0051] Figure 7 This is a schematic diagram of the structure of a control device disclosed in an embodiment of this application. Detailed Implementation

[0052] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0053] The embodiments of this application do not limit the product form of the electronic device provided, which may include but is not limited to tablet computers, personal computers (PCs), netbooks, etc., and can be selected according to application requirements.

[0054] Figure 1 This is a front view of the structure of an electronic device disclosed in an embodiment of this application. To better illustrate the internal structure of the electronic device, the casing is not shown; however, it can be understood that the casing of the electronic device encloses... Figure 1 The structure shown has a flat, plate-like shape on its periphery. (See also...) Figure 1As shown, the electronic device may include: a housing 1 having a first receiving position and a second receiving position arranged side-by-side along a first direction; a first heat dissipation module 2 disposed in the first receiving position for dissipating heat from a first heat-generating component of the electronic device; a second heat dissipation module 3 disposed in the second receiving position for dissipating heat from a second heat-generating component of the electronic device; and a heat-conducting element 4 connecting the first heat dissipation module 2 and the second heat dissipation module 3, enabling heat exchange between the first heat dissipation module 2 and the second heat dissipation module 3. The first heat dissipation module 2 is disposed near a first housing portion 11 of the housing 1, and the second heat dissipation module 3 is disposed near a second housing portion 12 of the housing 1. The first housing portion 11 and the second housing portion 12 are two parts of the housing 1 arranged opposite each other along a second direction, which is perpendicular to the first direction.

[0055] The first direction can be horizontal, so that the two receiving positions are laid out horizontally, and the space formed by the outer edge of the entire shell 1 presents an overall flat shape, which is in line with the main design of devices such as laptops and tablets. Although the first and second receiving positions are laid out horizontally, the receiving directions of the two receiving positions are different. That is, one receiving position can accommodate the heat dissipation module on its side closer to the first shell part, while the other receiving position can accommodate the heat dissipation module on its side closer to the second shell part. The function of the shell 1 is to provide a fixed base for the two heat dissipation modules, and at the same time, to provide outer shell protection for the two heat dissipation modules and some connecting parts or auxiliary parts.

[0056] The first housing portion 11 and the second housing portion 12 can be integrally formed or assembled, and they can correspond to opposite upper and lower surfaces of the housing. In this embodiment, the first housing portion 11 can be the upper housing portion, and the second housing portion 12 can be the lower housing portion. It is understood that, in order to accommodate the placement of heat-conducting components and the arrangement of some connecting lines or structures, some necessary locations on the inner side of the housing 1 may be provided with structures such as screw holes, studs, and support columns to meet the installation and connection requirements of corresponding components. This application does not impose any fixed limitations on these structures.

[0057] The first heat-generating component can be a CPU (central processing unit), and the corresponding first heat dissipation module can be a CPU heat dissipation module; this heat dissipation module can be an air-cooled module or a water-cooled module. In the implementation of the air-cooled module, the heat dissipation component is a heat sink fin; in the implementation of the water-cooled module, the heat dissipation component is a radiator. The second heat-generating component can be a GPU (graphics processing unit), and the corresponding second heat dissipation module can be a GPU heat dissipation module; similarly, the GPU heat dissipation module can be an air-cooled module or a water-cooled module.

[0058] The heat-conducting component can be, but is not limited to, a heat pipe or a copper pipe. In the water-cooling implementation, a heat dissipation medium, which can be water, flows through the copper pipe structure. The two ends of the heat-conducting component can be connected to the substrates of two heat-generating components, respectively. Thus, when a heat-generating component generates heat during operation, its substrate absorbs the heat and transfers it to the substrate of the other heat-generating component through the heat-conducting component, achieving heat exchange between them. Therefore, when a heat-generating component needs to dissipate heat, the heat dissipation module of the heat-generating component itself can handle part of the heat dissipation, while the heat-conducting component can also transfer some of the heat from the higher-temperature heat-generating component, sharing the heat dissipation burden of the higher-temperature heat-generating component, thereby improving the overall heat dissipation efficiency of the electronic device.

[0059] Figure 2 This is a schematic diagram of the structure of another electronic device disclosed in an embodiment of this application. (In conjunction with...) Figure 3 As shown, in one implementation, the electronic device may further include: a motherboard 5, disposed in the first receiving position via the second housing portion 12, the first heat-generating component disposed on a first surface of the motherboard 5 facing away from the second housing portion 12, and the first heat dissipation module 2 disposed on the first surface and thermally connected to the first heat-generating component; an expansion board 6, disposed in the second receiving position, the second heat-generating component disposed on a second surface of the expansion board 6 facing away from the first housing portion 11, and the second heat dissipation module 3 disposed on a third surface of the second housing portion 12 facing the first housing portion 11, and the second heat dissipation module 3 thermally connected to the second heat-generating component.

[0060] The motherboard 5 is equipped with multiple I / O interfaces, including but not limited to USB, Python-C, power connectors, and a PSU (Power Supply Unit), to meet the communication and power supply needs between the motherboard and multiple components. The motherboard bracket is fixed to the second housing portion 12 to provide a stable support structure for the motherboard. Similarly, the expansion card 6 is also equipped with numerous I / O interfaces to meet data exchange requirements. The expansion card 6 can be fixed to the surface of the second heat dissipation module 3 facing the first housing portion 11, or it can be fixed to the inner surface of the first housing portion 11, i.e., the surface facing the receiving position.

[0061] In the specific implementation, the first heat-generating component is the CPU, located on the motherboard 5, and the second heat-generating component is the graphics card (GPU), located on the expansion card 6. Based on this system layout, the CPU and GPU cooling modules are arranged in opposite directions and connected by heat pipes to achieve shared cooling modules. During system operation, when only the CPU or GPU is loaded, the shared cooling modules maximize the efficiency of both modules, resulting in lower CPU / GPU temperatures compared to using independent cooling modules. Both cooling fans can operate simultaneously, leading to lower fan speeds and less system noise compared to using independent cooling modules.

[0062] In one implementation, a communication connection component 7 is further provided between the motherboard 5 and the expansion card 6 to realize data exchange and / or power transmission between the motherboard 5 and the expansion card 6. In different implementations, the communication connection component 7 can also realize power exchange between the two connected entities, such as the motherboard 5 supplying power to the graphics card GPU or some I / O interfaces on the expansion card 6 through the communication connection component 7.

[0063] The communication connection component 7 may include a communication cable 71 and an adapter card 72, also known as a risercard, electrically connected to the first communication interface of the motherboard 5. One end of the communication cable 71 is connected to the second communication interface on the expansion board 6, and the other end is connected to the adapter card 72. The length of the communication cable 71 is greater than the distance between the expansion board 6 and the motherboard 5 to prevent the communication cable from separating from the expansion board or the motherboard after the distance between the expansion board and the motherboard changes, thus avoiding communication or power interruption and ensuring operational stability. The communication cable 71 may be a flexible flat cable, which can be deformed in shape to meet the connection requirements of different spaces and connection relationships in the application environment.

[0064] Figure 3 This is a schematic diagram of the installation structure of a communication connection component disclosed in an embodiment of this application. See also... Figure 3As shown, the communication cable 71 is bent at both ends with the same direction, forming a horizontal "U" shape. This results in the length of the communication cable 71 being greater than the distance between the expansion card 6 and the motherboard 5. This horizontal "U" shape of the communication cable 71 serves two purposes: firstly, it changes the orientation of the adapter card 72's interface, allowing the GPU to be arranged horizontally relative to the CPU; secondly, it ensures the stability of the connection between the expansion card 6 and the motherboard 5, preventing it from easily detaching from the interface.

[0065] In one example, a flexible flat cable is used to expand the graphics card through the motherboard's PCIe (Peripheral Component Interconnect Express) slot and a Riser card. The CPU and graphics card are reversed using two differently oriented mounting positions, expanding the graphics card on the side horizontal to the CPU. This way, the overall thickness of the chassis does not increase, allowing for a relatively flat design that meets users' requirements for small device size. At the same time, there is enough space for the CPU and graphics card heatsinks, allowing for the installation of larger centrifugal fans, which produce less noise while providing the same airflow.

[0066] The communication connection component 7 and the heat-conducting component 4 are both disposed between the first heat dissipation module 2 and the second heat dissipation module 3. They do not overlap in the vertical direction and can be arranged sequentially, such as... Figure 2 As shown, the communication connection component 7 and the heat conduction component 4 do not affect each other. The heat conducted on the heat conduction component 4 will not affect the communication connection component 7, and the presence of the communication connection component 7 will not affect the routing of the heat conduction component (4).

[0067] In one implementation, the first heat dissipation module 2 and the second heat dissipation module 3 include a fan and a heat dissipation fin assembly. The electronic device further includes a first fixed connector disposed between the fans or heat dissipation fin assemblies of the first heat dissipation module 2 and the second heat dissipation module 3, the first fixed connector being used to limit relative displacement between the first heat dissipation module 2 and the second heat dissipation module 3; or, the first heat dissipation module 2 and the second heat dissipation module 3 include a fan and a radiator. The electronic device further includes a second fixed connector disposed between the fans or radiators of the first heat dissipation module 2 and the second heat dissipation module 3, the second fixed connector being used to limit relative displacement between the first heat dissipation module and the second heat dissipation module.

[0068] The fixing connector 8 is also disposed between the first heat dissipation module 2 and the second heat dissipation module 3, and it does not overlap with the communication connection component 7 in the vertical direction. In one implementation, the fixing connector 8 is disposed on the periphery of the heat-conducting component 4 and is arranged intersectingly with the heat-conducting component 4. Figure 4As shown in an illustrative example, in order to increase the connection stability of the fixed connector 8, it can be set as a frame. The heat conduction component 4 and the fixed connector 8 can be designed in a cross shape in the vertical section, with both ends fixedly connected to the surfaces of different sides of the two heat dissipation modules. In this way, there is no conflict in the installation or connection position of the two, and the heat conduction component 4 can be routed from inside the frame of the fixed connector 8, saving overall design space.

[0069] The electronic device described in this application has two heat dissipation modules arranged side by side for dissipating heat from different heat-generating components. A heat-conducting component connects the two heat dissipation modules, enabling heat exchange between them. Thus, during the operation of the electronic device, the two heat dissipation modules can work together through the heat-conducting component between them to dissipate heat from the first heat-generating component and / or the second heat-generating component of the electronic device, thereby improving heat dissipation efficiency and reducing noise generated by the operation of the heat dissipation modules.

[0070] The above-described embodiments of the present application describe the structure of the electronic device. For the electronic device disclosed in this application, its heat dissipation control can be implemented in various ways based on its structure. Therefore, this application also discloses a control method, and specific embodiments are given below for detailed description.

[0071] Figure 5 This is a flowchart of a control method disclosed in an embodiment of this application. Figure 5 The method shown is applied to any of the electronic devices described in the above embodiments, in combination with Figure 5 As shown, the control method may include:

[0072] Step 501: Obtain usage information for the electronic device.

[0073] The usage information may include at least one of the following: user information, usage scenario information, usage duration, usage mode, and usage purpose information. Differences in this usage information will result in different power consumption of the electronic device. Therefore, obtaining the usage information of the electronic device first facilitates subsequent corresponding control based on this information.

[0074] Regarding user information, different users have different habits when using electronic devices. These different habits may lead to differences in device operating modes, usage scenarios, etc., resulting in different heat generation and required cooling capabilities. For example, user A might be identified as a gamer, while user B might be identified as an e-book reader; therefore, the system operating parameters will differ significantly when they use their electronic devices. Regarding usage scenario information, it could be an office scenario or a gaming scenario. In an office scenario, the overall system power consumption is usually lower, while in a gaming scenario, the system power consumption is higher, and the system cooling requirements are also higher. Regarding usage duration information, it is generally recommended to switch to a low-power mode after an electronic device has been running in a high-power mode for an extended period to prolong the device's lifespan. Regarding usage mode information, users may actively switch usage modes during use, and different usage modes correspond to different operating power consumption. Regarding usage purpose information, different scenarios, such as using the electronic device for computing, screen projection, or as a Wi-Fi hotspot, will result in different power consumption.

[0075] Step 502: Configure the power range of the electronic device based on the usage information.

[0076] As mentioned earlier, different usage information leads to different power consumption of electronic devices. Therefore, during the operation of an electronic device, its power range can be dynamically adjusted based on its real-time usage. The power range of the electronic device mentioned here can be understood as the power range of a CPU.

[0077] For example, if user B, who enjoys reading ebooks, is using the electronic device, the system's overall power consumption is relatively low. However, if user A, who enjoys playing games, is also using the electronic device, the system will automatically adjust the device's power consumption parameters. These parameters can include steady-state power consumption PL1 and transient maximum power consumption PL2. Specifically, the steady-state power consumption PL1 and transient maximum power consumption PL2 will be increased to accommodate user A's higher power consumption. Different power consumption parameters correspond to different cooling modes, and different cooling modes have different cooling control logic and heat dissipation curves.

[0078] Step 503: Within the corresponding power range, control the first heat dissipation module and / or the second heat dissipation module of the electronic device to dissipate heat from the electronic device with the target heat dissipation parameters, wherein the first heat dissipation module and the second heat dissipation module can work together through the heat-conducting components between them to dissipate heat from the first heat-generating component and / or the second heat-generating component of the electronic device.

[0079] After determining the power range of the electronic device, within this power range, the latter refers to the corresponding heat dissipation mode, where the first heat dissipation module and / or the second heat dissipation module of the electronic device are controlled according to preset logic to dissipate heat. The target heat dissipation parameters can be determined at least based on the power range or the heat dissipation mode; in some implementations, they can also be determined by combining the temperature of the heat-generating components.

[0080] For example, in the first cooling mode, the CPU cooling module is first activated to cool the CPU based on the first cooling curve. Then, as the CPU temperature rises by 5°C after a period of operation, the GPU cooling module is activated simultaneously to provide auxiliary cooling to the CPU based on the second cooling curve.

[0081] Since the first and second heat dissipation modules of the electronic device can work together through the heat-conducting components between them to dissipate heat from the first and / or second heat-generating components of the electronic device, during the operation of the device, the first and second heat dissipation modules can be dynamically controlled to work individually or in combination based on the power range of the device to dissipate heat from the first and / or second heat-generating components and improve the overall heat dissipation efficiency of the electronic device.

[0082] In the above content, configuring the power range of the electronic device based on the usage information may include at least one of the following: if the usage information indicates that the electronic device is used by a first user, configure the electronic device to a first power range; if the usage information indicates that the electronic device is used by a second user, configure the electronic device to a second power range; if the usage information indicates that the electronic device is in a first usage scenario, configure the electronic device to a first power range; if the usage information indicates that the electronic device is in a second usage scenario, configure the electronic device to a second power range; if the usage information indicates that the electronic device is in a first usage mode, configure the electronic device to a first power range; if the usage information indicates that the electronic device is in a second usage mode, configure the electronic device to a second power range; if the usage information indicates usage duration information of the electronic device, configure the power range of the electronic device based on the usage duration information; if the usage information guarantees the intended use of the electronic device, configure the power range of the electronic device based on the intended use; wherein, within a target duration, the total power consumption of the electronic device in the second power range is greater than its total power consumption in the first power range.

[0083] For example, if the information indicates that the electronic device is running an office application and / or the electronic device is located in an office building, then the electronic device is determined to be in an office scenario and can be configured to a first power range with lower power consumption. If the information indicates that the electronic device is running an online game application and / or the electronic device is located in a residential area, then the electronic device is determined to be in a game scenario and can be configured to a second power range with higher power consumption.

[0084] For example, information can be used to indicate that an electronic device is in a high-frequency interaction mode. This high-frequency interaction includes, but is not limited to, network data interaction and data interaction between different devices. The electronic device can be configured to a second power range with higher power consumption. If the user manually switches the electronic device to a power-saving mode in the subsequent process, the electronic device can be configured to a first power range with lower power consumption.

[0085] For example, if information indicates that an electronic device has been used continuously for 5 hours, it means that the corresponding component has been running for a long time. Considering the lifespan of each component of the electronic device, the power range of the electronic device will be appropriately configured to be lower.

[0086] This application does not impose fixed restrictions on how to configure the power range of electronic devices based on usage information. Various reasonable and user-friendly designs can be made in combination with actual application scenarios and electronic device conditions, which will not be elaborated further here.

[0087] In the foregoing, controlling the first and / or second heat dissipation modules of the electronic device to dissipate heat with target heat dissipation parameters within a corresponding power range may include at least one of the following: if the electronic device is in a second power range, controlling the first and second heat dissipation modules to perform heat dissipation operations with corresponding target heat dissipation parameters; if the electronic device is in a first power range, acquiring the heating parameters of the first and second heating components, and controlling the first and / or second heat dissipation modules to perform heat dissipation operations with corresponding target heat dissipation parameters based on the heating parameters. The heating parameters may be temperature or duration.

[0088] In other words, when the electronic device is in the first power range, its overall power consumption is low. In this case, if the temperature of the heat-generating component is not higher than the set value, its corresponding heat dissipation module can be controlled independently to meet its heat dissipation needs. However, if the temperature of the heat-generating component is higher than the set value, it indicates that its heat dissipation demand is relatively large, and it is necessary to control the heat dissipation module of the other heat-generating component simultaneously. Due to the heat conduction effect between the two heat dissipation modules, the heat dissipation module of the other heat-generating component can assist in dissipating heat from the currently hotter component. When the electronic device is in the second power range, its overall power consumption is higher. In this case, it is necessary to control both heat dissipation modules to work simultaneously to dissipate heat from the electronic device.

[0089] Based on the heating parameters, the first heat dissipation module and / or the second heat dissipation module are respectively controlled to perform heat dissipation operations with corresponding target heat dissipation parameters, including at least one of the following: if the first heating parameter of the first heating component indicates that its temperature is not greater than a first threshold, the first heat dissipation module is controlled to stop working; if the first heating parameter of the first heating component indicates that its temperature is greater than the first threshold, a corresponding first target heat dissipation parameter is determined based on the first temperature difference between it and the first threshold to perform heat dissipation operations; if the second heating parameter of the second heating component indicates that its temperature is not greater than a second threshold, the second heat dissipation module is controlled to stop working; if the second heating parameter of the second heating component indicates that its temperature is greater than the second threshold, a corresponding second target heat dissipation parameter is determined based on the second temperature difference between it and the second threshold to perform heat dissipation operations.

[0090] Specifically, the greater the temperature difference between the heat-generating component and the threshold, the higher the heat dissipation performance corresponding to the target heat dissipation parameter should be, and the faster the fan speed should be. Conversely, the smaller the temperature difference between the heat-generating component and the threshold, the lower the heat dissipation performance corresponding to the target heat dissipation parameter should be, and the slower the fan speed should be. In implementation, the temperature difference value can be divided into several continuous intervals, with different interval gradients corresponding to different target heat dissipation parameters. Of course, the corresponding principle is that the greater the temperature difference, the higher the heat dissipation performance corresponding to the target heat dissipation parameter.

[0091] For example, when the CPU temperature is below 50°C, the CPU cooling fan does not run. When the temperature is above 50°C, such as 55°C, the temperature difference from the threshold temperature of 50°C is 5°C, and the CPU cooling fan is controlled to run at a speed of 2500 rpm. When the CPU temperature continues to rise to 62°C, the temperature difference from the threshold temperature of 50°C is 12°C, and the CPU cooling fan is controlled to run at a speed of 5000 rpm.

[0092] In one implementation, the control method may further include: obtaining usage change information of the electronic device, and adjusting the target heat dissipation parameters corresponding to the first heat dissipation module and / or the second heat dissipation module based on the usage change information. The usage change information indicates that the user information, usage scenario information, usage duration, usage mode, and / or usage purpose information of the electronic device have changed. Consequently, the power range of the electronic device will also change. Within different power ranges, the heat dissipation requirements of the electronic device differ. Therefore, it is necessary to adjust the target heat dissipation parameters corresponding to the first heat dissipation module and / or the second heat dissipation module based on the usage change information to adapt to the heat dissipation requirements within the current power range.

[0093] For example, when an electronic device is in an office setting, it controls the CPU fan to run at 3000 RPM to cool the CPU. Then, when the device is switched to a gaming setting, it controls the CPU fan to run at 5000 RPM to cool the CPU.

[0094] In implementation, to reduce noise from the fans in the heat dissipation modules, the fans can be turned off under low load conditions, meaning neither heat dissipation module works. When only the CPU or GPU is loaded, the corresponding single-sided fan is activated first to dissipate heat. When the load increases to a certain level, the other fan is activated, controlling both heat dissipation modules to dissipate heat simultaneously. For detailed control procedures, please refer to [link to relevant documentation]. Figure 6 .

[0095] Combination Figure 6 As shown in one example, after the electronic device is powered on, it first determines whether it is in a specific game scene. If so, it adjusts the power consumption parameters PL1 and PL2 of the electronic device to ModeB mode, which corresponds to the second power range with higher power. In ModeB mode, it controls the simultaneous activation of the CPU and GPU fans; the CPU fan is based on the fan curve F. B-CPU Running, GPU fan based on fan curve F B-GPU If the electronic device is not in a specific game scenario, its power consumption parameters PL1 and PL2 will be adjusted to Mode A, which corresponds to the lower power range. In Mode A, the control logic for the CPU fan and GPU fan is similar. The following explanation uses the CPU fan control as an example: First, the CPU temperature T is determined. CPU Is it greater than the threshold T? C0 If not, turn off the CPU fan; if yes, turn on the CPU fan and control it based on the fan curve F. A-CPU0 Run, and then determine the CPU temperature T CPU Is it greater than the threshold T? C1 T C1 Greater than TC0 If not, the CPU fan's operating state remains unchanged; if yes, the GPU fan is activated simultaneously, based on the fan curve F. A-GPU1 Run; if the control logic for the GPU fan determines that the GPU fan is based on F... A-GPU0 If the program is running, then further analysis of the fan curve F is needed. A-GPU1 and fan curve F A-GPU0 The size of the heat dissipation performance, when the fan curve F A-GPU1 Its heat dissipation performance is greater than that of the fan curve F. A-GPU0 When controlling the GPU fan's heat dissipation performance, the fan speed is controlled based on the fan curve F. A-GPU1 Running; when the fan curve F A-GPU1 Its heat dissipation performance is less than that of the fan curve F. A-GPU0 When controlling the GPU fan's heat dissipation performance, the fan speed is controlled based on the fan curve F. A-GPU0 run.

[0096] Since the first and second heat dissipation modules of the electronic device can work together through the heat-conducting components between them to dissipate heat from the first and / or second heat-generating components of the electronic device, the overall heat dissipation efficiency is improved, and the operating speed of the cooling fan usually does not need to be set very high. Therefore, the temperature control scheme based on this shared heat dissipation architecture can greatly improve the heat dissipation noise of the electronic device system. A comparison of experimental noise between the scheme of this application and the conventional scheme is shown in the table below.

[0097]

[0098] The control method described in this application is based on a structural design in which the first heat dissipation module and the second heat dissipation module in the electronic device can work together through the heat-conducting components between them to dissipate heat from the first heat-generating component and / or the second heat-generating component of the electronic device. This method can effectively improve the overall heat dissipation efficiency of the electronic device and reduce the noise generated by the operation of the heat dissipation module, thereby improving the user experience.

[0099] For the foregoing method embodiments, in order to simplify the description, they are all described as a series of actions. However, those skilled in the art should understand that this application is not limited to the described order of actions, because according to this application, some steps can be performed in other orders or simultaneously. Furthermore, those skilled in the art should also understand that the embodiments described in the specification are all preferred embodiments, and the actions and modules involved are not necessarily essential to this application.

[0100] This application also provides a control device. Figure 7 This is a schematic diagram of a control device disclosed in an embodiment of this application. (In conjunction with...) Figure 7 As shown, the control device 70 may include:

[0101] Information acquisition module 701 is used to acquire usage information of electronic devices.

[0102] The power determination module 702 is used to configure the power range of the electronic device based on the usage information.

[0103] The heat dissipation control module 703 is used to control the first heat dissipation module and / or the second heat dissipation module of the electronic device to dissipate heat from the electronic device with target heat dissipation parameters within a corresponding power range.

[0104] The first heat dissipation module and the second heat dissipation module can work together through the heat-conducting components between them to dissipate heat from the first heat-generating component and / or the second heat-generating component of the electronic device.

[0105] Since the first and second heat dissipation modules of the electronic device can work together through the heat-conducting components between them to dissipate heat from the first and / or second heat-generating components of the electronic device, during the operation of the device, the first and second heat dissipation modules can be dynamically controlled to work individually or in combination based on the power range of the device to dissipate heat from the first and / or second heat-generating components and improve the overall heat dissipation efficiency of the electronic device.

[0106] The control recording device described in the above embodiments includes a processor and a memory. The information acquisition module, power determination module, heat dissipation control module, etc. in the above embodiments are all stored as program modules in the memory, and the processor executes the above program modules stored in the memory to realize the corresponding functions.

[0107] The processor contains a kernel, which retrieves the corresponding program modules from memory. One or more kernels can be configured, and the processing of backtracking data can be achieved by adjusting kernel parameters.

[0108] The memory may include non-permanent memory in computer-readable media, such as random access memory (RAM) and / or non-volatile memory, such as read-only memory (ROM) or flash RAM, and the memory includes at least one memory chip.

[0109] In an exemplary embodiment, a computer-readable storage medium is also provided, which can be directly loaded into the internal memory of a computer, and contains software code. After being loaded and executed by the computer, the computer program can implement the steps shown in any of the embodiments of the control method described above.

[0110] In an exemplary embodiment, a computer program product is also provided, which can be directly loaded into the internal memory of a computer and contains software code. After being loaded and executed by the computer, the computer program can implement the steps shown in any of the embodiments of the control method described above.

[0111] The various embodiments in this specification are described in a progressive manner, with each embodiment focusing on its differences from other embodiments. Similar or identical parts between embodiments can be referred to interchangeably. For the apparatus disclosed in the embodiments, since they correspond to the methods disclosed in the embodiments, the description is relatively simple; relevant parts can be referred to the method section.

[0112] It should also be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0113] The steps of the methods or algorithms described in conjunction with the embodiments disclosed herein can be implemented directly by hardware, a software module executed by a processor, or a combination of both. The software module can be located in random access memory (RAM), main memory, read-only memory (ROM), electrically programmable ROM, electrically erasable programmable ROM, registers, hard disk, removable disk, CD-ROM, or any other form of storage medium known in the art.

[0114] The above description of the disclosed embodiments enables those skilled in the art to make or use this application. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of this application. Therefore, this application is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. An electronic device, comprising: The housing has a first receiving position and a second receiving position arranged side by side along a first direction; A first heat dissipation module is disposed in the first receiving position and is used to dissipate heat from the first heat-generating component of the electronic device; The second heat dissipation module is disposed in the second receiving position and is used to dissipate heat from the second heat-generating component of the electronic device; A heat-conducting component connects the first heat dissipation module and the second heat dissipation module, enabling heat exchange between the first heat dissipation module and the second heat dissipation module; Wherein, the first heat dissipation module is disposed near the first housing portion of the housing, and the second heat dissipation module is disposed near the second housing portion of the housing. The first housing portion and the second housing portion are two parts of the housing disposed opposite to each other along a second direction, and the second direction is perpendicular to the first direction. The electronic device also includes: A motherboard is disposed in the first receiving position, and the first heating element is disposed on the first surface of the motherboard facing away from the second housing portion; An expansion board is disposed in the second receiving position, and the second heating element is disposed on the second surface of the expansion board facing away from the first housing portion.

2. The electronic device according to claim 1, wherein: The motherboard is disposed in the first receiving position via the second housing portion, and the first heat dissipation module is disposed on the first surface and thermally connected to the first heat-generating component. The second heat dissipation module is disposed on the third surface of the second housing portion facing the first housing portion, and the second heat dissipation module is thermally connected to the second heat-generating component.

3. The electronic device according to claim 2, wherein, A communication connection component is also provided between the motherboard and the expansion card to realize data exchange and / or power transmission between the motherboard and the expansion card; The communication connection component includes a communication cable and an adapter card electrically connected to the first communication interface on the motherboard. One end of the communication cable is connected to the second communication interface on the expansion board, and the other end is connected to the adapter card. The length of the communication cable is greater than the distance between the expansion board and the motherboard.

4. The electronic device according to claim 1, wherein, The first heat dissipation module and the second heat dissipation module include a fan and a heat dissipation fin assembly. The electronic device also includes a first fixed connector disposed between the fan or the heat dissipation fin assembly of the first heat dissipation module and the second heat dissipation module, for limiting relative displacement between the first heat dissipation module and the second heat dissipation module. or, The first heat dissipation module and the second heat dissipation module include a fan and a radiator. The electronic device also includes a second fixed connector disposed between the fan or the radiator of the first heat dissipation module and the second heat dissipation module, for limiting relative displacement between the first heat dissipation module and the second heat dissipation module.

5. The electronic device according to claim 4, wherein, The fixing connector is disposed on the periphery of the heat-conducting component and is arranged intersectingly with the heat-conducting component.

6. A control method applied to the electronic device according to any one of claims 1 to 5, the method comprising: Obtain usage information for electronic devices; Configure the power range of the electronic device based on the usage information; as well as, Within the corresponding power range, control the first heat dissipation module and / or the second heat dissipation module of the electronic device to dissipate heat from the electronic device with the target heat dissipation parameters; The first heat dissipation module and the second heat dissipation module can work together through the heat-conducting components between them to dissipate heat from the first heat-generating component and / or the second heat-generating component of the electronic device.

7. The method according to claim 6, wherein, Configure the power range of the electronic device based on the usage information, including at least one of the following: If the usage information indicates that the electronic device is used by a first user, the electronic device is configured to a first power range. If the usage information indicates that the electronic device is used by a second user, the electronic device is configured to a second power range. If the usage information indicates that the electronic device is in a first usage scenario, the electronic device is configured to a first power range; If the usage information indicates that the electronic device is in a second usage scenario, configure the electronic device to a second power range; If the usage information indicates that the electronic device is in a first usage mode, configure the electronic device to a first power range; If the usage information indicates that the electronic device is in a second usage mode, configure the electronic device to a second power range; If the usage information represents the usage duration information of the electronic device, the power range of the electronic device is configured based on the usage duration information; If the usage information guarantees the intended use of the electronic device, configure the power range of the electronic device based on the intended use; Within the target duration, the total power consumption of the electronic device in the second power range is greater than its total power consumption in the first power range.

8. The method according to claim 6, wherein, Controlling the first heat dissipation module and / or the second heat dissipation module of the electronic device to dissipate heat from the electronic device with target heat dissipation parameters within a corresponding power range includes at least one of the following: If the electronic device is in the second power range, control the first heat dissipation module and the second heat dissipation module to perform heat dissipation operations with corresponding target heat dissipation parameters respectively; If the electronic device is in the first power range, the heating parameters of the first heating component and the second heating component are obtained, and the first heat dissipation module and / or the second heat dissipation module are controlled to perform heat dissipation operations with corresponding target heat dissipation parameters based on the heating parameters.

9. The method according to claim 8, wherein, Based on the heat dissipation parameters, the first heat dissipation module and / or the second heat dissipation module are controlled to perform heat dissipation operations with corresponding target heat dissipation parameters, including at least one of the following: If the first heating parameter of the first heating component indicates that its temperature is not greater than the first threshold, the first heat dissipation module is controlled to stop working. If the first heating parameter of the first heating component indicates that its temperature is greater than the first threshold, the corresponding first target heat dissipation parameter is determined based on the first temperature difference between it and the first threshold, and a heat dissipation operation is performed. If the second heating parameter of the second heating component indicates that its temperature is not greater than the second threshold, the second heat dissipation module is controlled to stop working. If the second heating parameter of the second heating component indicates that its temperature is greater than the second threshold, the corresponding second target heat dissipation parameter is determined based on the second temperature difference between it and the second threshold, and the heat dissipation operation is performed.

10. The method of claim 8, further comprising: Obtain usage change information of the electronic device, and adjust the target heat dissipation parameters corresponding to the first heat dissipation module and / or the second heat dissipation module based on the usage change information.

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