A method, system, and storage medium for solving the expansion and contraction problem of PCB products.
By collecting and analyzing PCB expansion and contraction factors, a pre-amplification data model is established, and the expansion and contraction pre-amplification value is optimized to solve functional defects in PCB manufacturing, improve production efficiency, and reduce costs.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- HUANGSHI HUSHI ELECTRONICS CO LTD
- Filing Date
- 2023-01-10
- Publication Date
- 2026-06-30
Smart Images
Figure CN116227404B_ABST
Abstract
Description
Technical Field
[0001] This invention relates to a method, system, and storage medium for solving the expansion and contraction problem of PCB products, belonging to the field of PCB technology. Background Technology
[0002] During PCB manufacturing, the PCB will undergo expansion and contraction deformation from the inner layer production to the solder mask process due to factors such as the product structure, board type, inner layer copper thickness, residual copper ratio and size. In particular, the lamination process, severe expansion and contraction can directly cause the layers of the multilayer board to shift after lamination and become unusable. Slight expansion and contraction can cause the board surface pattern to shift from the drill to the solder mask production process, affecting the soldering. Drilling can also break the inner or outer layer hole ring, resulting in functional defects. Summary of the Invention
[0003] The purpose of this invention is to overcome the shortcomings of the prior art and provide a method, system and storage medium for solving the problem of expansion and contraction in PCB products, thereby solving the problem of product functionality defects caused by expansion and contraction during PCB manufacturing.
[0004] To achieve the above objectives, the present invention is implemented using the following technical solution:
[0005] In a first aspect, the present invention provides a method for solving the expansion and contraction problem of PCB products, comprising:
[0006] Collect raw data to determine the factors affecting PCB expansion and contraction;
[0007] Analyze the factors affecting PCB expansion and contraction, and identify the key factors and their corresponding values.
[0008] Simulation and combination experiments were conducted on the key factors affecting PCB expansion and contraction and their corresponding values to determine the PCB expansion and contraction pre-amplification value and optimize the PCB expansion and contraction pre-amplification value, and to establish an expansion and contraction pre-amplification data model.
[0009] Import the expansion / contraction preamplification data model and match the corresponding expansion / contraction preamplification value based on the entered PCB product information.
[0010] Furthermore, the factors affecting PCB expansion and contraction include board type, inner layer copper thickness, residual copper ratio, size, production conditions, and process flow.
[0011] Furthermore, the analysis of factors affecting PCB expansion and contraction, and the identification of key factors and their corresponding values, include:
[0012] The DOE method was used to analyze and filter the factors affecting PCB expansion and contraction.
[0013] Furthermore, the big data model includes factors, values, and output variables. The factors are those that affect the expansion and contraction of the PCB, the values are those that affect the expansion and contraction of the PCB, and the output variables are the pre-expansion values for the expansion and contraction of the PCB.
[0014] Furthermore, the analysis of factors affecting PCB expansion and contraction, and the determination of key factors affecting PCB expansion and contraction and their corresponding values, also includes:
[0015] First-order and second-order fitting optimization were performed on all factors affecting PCB expansion and contraction.
[0016] Furthermore, the simulation and combination experiments conducted on the key factors affecting PCB expansion and contraction and their corresponding values to determine and optimize the PCB expansion and contraction pre-expansion value include:
[0017] The key factors affecting PCB expansion and contraction and their corresponding values were analyzed using the random variable method.
[0018] Secondly, the present invention provides a system for solving the expansion and contraction problem of PCB products, comprising:
[0019] Expansion / contraction data acquisition module: Collects raw data and determines the factors affecting PCB expansion / contraction;
[0020] Swelling and contraction data analysis module: Analyzes the factors affecting PCB swelling and contraction, and identifies the key factors affecting PCB swelling and contraction and their corresponding values;
[0021] Expansion / Contraction Pre-amplification Module: Conducts simulation and combination experiments on key factors affecting PCB expansion / contraction and their corresponding values, determines the PCB expansion / contraction pre-amplification value, optimizes and improves the PCB expansion / contraction pre-amplification value, and establishes an expansion / contraction pre-amplification data model.
[0022] Automatic import module for expansion and contraction preamplification: Imports expansion and contraction preamplification data models and matches corresponding expansion and contraction preamplification values based on the entered PCB product information.
[0023] Thirdly, the present invention provides a computer storage medium storing a computer program, which, when executed by a processor, implements the steps of a method for solving the expansion and contraction problem of PCB products as described in the first aspect.
[0024] Compared with the prior art, the beneficial effects achieved by the present invention are as follows:
[0025] This invention provides a method, system, and computer storage medium for solving the expansion and contraction problem in PCB products. The system utilizes an expansion and contraction data acquisition module to collect raw data and identify factors affecting PCB expansion and contraction. An expansion and contraction data analysis module analyzes these factors, identifying key factors and their corresponding values. An expansion and contraction pre-amplification confirmation module conducts simulated combination experiments on the key factors and their corresponding values to determine and optimize the PCB's expansion and contraction pre-amplification values, establishing an expansion and contraction pre-amplification data model. An automatic expansion and contraction pre-amplification import module imports the data model and matches the corresponding pre-amplification values based on the entered PCB product information. This invention effectively solves the problem of functional defects caused by expansion and contraction during PCB manufacturing, significantly reducing product scrap due to these issues. It eliminates the need to re-apply for films or tools due to expansion and contraction problems, improving production efficiency. System management improves data accuracy and reduces production costs. Attached Figure Description
[0026] Figure 1 This is a flowchart illustrating a method for solving the expansion and contraction problem of PCB products according to an embodiment of the present invention;
[0027] Figure 2 This is a flowchart illustrating a system for solving the expansion and contraction problem of PCB products, provided by an embodiment of the present invention. Detailed Implementation
[0028] The technical solution of the present invention will be described in detail below with reference to the accompanying drawings and specific embodiments. It should be understood that the embodiments and specific features in the embodiments are detailed descriptions of the technical solution of the present application, rather than limitations thereof. In the absence of conflict, the embodiments and technical features in the embodiments can be combined with each other.
[0029] In this article, the term "and / or" is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, or B existing alone. Additionally, the character " / " in this article generally indicates that the preceding and following related objects have an "or" relationship.
[0030] Example 1:
[0031] like Figure 1 As shown, this embodiment provides a method for solving the expansion and contraction problem of PCB products, including:
[0032] Collect raw data to determine the factors affecting PCB expansion and contraction;
[0033] Analyze the factors affecting PCB expansion and contraction, and identify the key factors and their corresponding values.
[0034] Simulation and combination experiments were conducted on the key factors affecting PCB expansion and contraction and their corresponding values to determine the PCB expansion and contraction pre-amplification value and optimize the PCB expansion and contraction pre-amplification value, and to establish an expansion and contraction pre-amplification data model.
[0035] Import the expansion / contraction preamplification data model and match the corresponding expansion / contraction preamplification value based on the entered PCB product information.
[0036] The factors influencing PCB expansion and contraction include board type, inner layer copper thickness, residual copper ratio, dimensions, production conditions, and process flow. The big data model includes factors, values, and output variables. The factors are the elements affecting PCB expansion and contraction, the values are the values of these elements, and the output variables are the pre-expansion values for PCB expansion and contraction.
[0037] The analysis of factors affecting PCB expansion and contraction, and the identification of key factors and their corresponding values, involves using the DOE method to analyze and filter multiple factors affecting PCB expansion and contraction, simulating and combining all factors, and performing primary and secondary fitting optimization processes to determine the key factors and their corresponding values.
[0038] It should be noted that, when conducting simulation and combination experiments on the key factors affecting PCB expansion and contraction and their corresponding values, and determining and optimizing the pre-expansion values for PCB expansion and contraction, a random variable method was used to analyze the key factors affecting PCB expansion and contraction and their corresponding values, combined with data verification and anti-interference measures. A big data model was established to find the expansion and contraction values of the PCB after lamination under different factors and values. Based on the above expansion and contraction values, the expansion and contraction pre-expansion settings of the inner layer of the PCB were set before lamination to determine the expansion and contraction level after lamination, and fine-tuning was performed to obtain the pre-expansion values of inner layer expansion and contraction under different factors and values.
[0039] This embodiment proposes a method to solve the problem of PCB product expansion and contraction. It collects a large amount of raw data to identify the factors affecting PCB expansion and contraction. These factors are then filtered and analyzed to determine the key factors and their corresponding values. Simulation and combination experiments are conducted on these key factors and their corresponding values to determine and optimize the PCB expansion and contraction pre-amplification value, establishing a pre-amplification data model. This model is imported into the system and put into production use, matching the appropriate pre-amplification value based on the entered PCB product information. This embodiment effectively solves the problem of functional defects caused by PCB expansion and contraction during manufacturing, significantly reducing product scrap due to these issues. It eliminates the need to re-apply for films or tools due to expansion and contraction problems, improving production efficiency. System management improves data accuracy and reduces production costs.
[0040] Example 2:
[0041] like Figure 2 As shown, this embodiment provides a system for solving the expansion and contraction problem of PCB products. The system includes:
[0042] Expansion / contraction data acquisition module: Collects raw data and determines the factors affecting PCB expansion / contraction;
[0043] Swelling and contraction data analysis module: Analyzes the factors affecting PCB swelling and contraction, and identifies the key factors affecting PCB swelling and contraction and their corresponding values;
[0044] Expansion / Contraction Pre-amplification Module: Conducts simulation and combination experiments on key factors affecting PCB expansion / contraction and their corresponding values, determines the PCB expansion / contraction pre-amplification value, optimizes and improves the PCB expansion / contraction pre-amplification value, and establishes an expansion / contraction pre-amplification data model.
[0045] Automatic import module for expansion and contraction preamplification: Imports expansion and contraction preamplification data models and matches corresponding expansion and contraction preamplification values based on the entered PCB product information.
[0046] This embodiment presents a system for resolving PCB product expansion and contraction issues. Utilizing expansion and contraction data acquisition, analysis, and pre-amplification modules, it collects a large amount of raw data. This raw data is analyzed, processed, and simulated through combination experiments to establish a PCB expansion and contraction pre-amplification data model. This model is then put into production, matching corresponding expansion and contraction pre-amplification values based on the entered PCB product information. This effectively solves the problem of functional defects caused by expansion and contraction during PCB manufacturing, significantly reducing product scrap due to these issues. It eliminates the need to re-apply for films or tools due to expansion and contraction problems, improving production efficiency. System management enhances data accuracy and reduces production costs.
[0047] Example 3:
[0048] This embodiment provides a computer storage medium storing a computer program, which, when executed by a processor, implements any one of the steps of a method for solving the expansion and contraction problem of PCB products.
[0049] The above description is only a preferred embodiment of the present invention. It should be noted that for those skilled in the art, several improvements and modifications can be made without departing from the technical principles of the present invention, and these improvements and modifications should also be considered within the scope of protection of the present invention.
Claims
1. A method for solving the expansion and contraction problem of a PCB product, characterized by, include: Collect raw data to determine the factors affecting PCB expansion and contraction; Analyze the factors affecting PCB expansion and contraction, and identify the key factors and their corresponding values. Simulation and combination experiments were conducted on the key factors affecting PCB expansion and contraction and their corresponding values to determine the PCB expansion and contraction pre-amplification value and optimize the PCB expansion and contraction pre-amplification value, and to establish an expansion and contraction pre-amplification data model. Import the expansion and contraction pre-amplification data model and match the corresponding expansion and contraction pre-amplification values according to the entered PCB product information; The random variable method was used to analyze the key factors affecting PCB expansion and contraction and their corresponding values, and a big data model was established to find the expansion and contraction values of PCB after lamination under different factors and values. Based on the above expansion and contraction values, the expansion and contraction of the inner layer of the PCB is pre-set before lamination to determine the expansion and contraction level after lamination and make fine adjustments, thereby obtaining the pre-set expansion and contraction values of the inner layer under different factors and values. The analysis examines the factors affecting PCB expansion and contraction, identifying key factors and their corresponding values, including: The DOE method was used to analyze and filter the factors affecting PCB expansion and contraction.
2. The method of claim 1, wherein the PCB product is a flexible PCB product. The factors affecting PCB expansion and contraction include board type, inner layer copper thickness, residual copper ratio, size, production conditions, and process flow.
3. The method of claim 1, wherein the PCB product is a flexible PCB product. The big data model includes factors, values, and output variables. The factors are those that affect the expansion and contraction of PCBs, the values are those that affect the expansion and contraction of PCBs, and the output variables are the pre-expansion values for the expansion and contraction of PCBs.
4. The method for solving the expansion and contraction problem of PCB products according to claim 1, characterized in that, The analysis of factors affecting PCB expansion and contraction, and the identification of key factors and their corresponding values, also includes: First-order and second-order fitting optimization were performed on all factors affecting PCB expansion and contraction.
5. The method for solving the expansion and contraction problem of PCB products according to claim 1, characterized in that, The simulation and combination experiments on key factors affecting PCB expansion and contraction and their corresponding values are used to determine and optimize the PCB expansion and contraction pre-expansion value, including: The key factors affecting PCB expansion and contraction and their corresponding values were analyzed using the random variable method.
6. A system for solving the problem of dimensional expansion and contraction in PCB products, characterized in that, include: Expansion / contraction data acquisition module: Collects raw data and determines the factors affecting PCB expansion / contraction; Swelling and contraction data analysis module: Analyzes the factors affecting PCB swelling and contraction, and identifies the key factors affecting PCB swelling and contraction and their corresponding values; Expansion / Contraction Pre-amplification Module: Conducts simulation and combination experiments on key factors affecting PCB expansion / contraction and their corresponding values, determines the PCB expansion / contraction pre-amplification value, optimizes and improves the PCB expansion / contraction pre-amplification value, and establishes an expansion / contraction pre-amplification data model. Automatic import module for expansion and contraction preamplification: Imports expansion and contraction preamplification data models and matches corresponding expansion and contraction preamplification values based on the entered PCB product information; The random variable method was used to analyze the key factors affecting PCB expansion and contraction and their corresponding values, and a big data model was established to find the expansion and contraction values of PCB after lamination under different factors and values. Based on the above expansion and contraction values, the expansion and contraction of the inner layer of the PCB is pre-set before lamination to determine the expansion and contraction level after lamination and make fine adjustments, thereby obtaining the pre-set expansion and contraction values of the inner layer under different factors and values. The analysis examines the factors affecting PCB expansion and contraction, identifying key factors and their corresponding values, including: The DOE method was used to analyze and filter the factors affecting PCB expansion and contraction.
7. A computer storage medium, characterized in that, The computer storage medium stores a computer program, which, when executed by a processor, implements the steps of a method for solving the expansion and contraction problem of PCB products as described in any one of claims 1-5.