Packaging structure manufacturing method and packaging structure

Abstract

This invention discloses a method for manufacturing an encapsulation structure and the encapsulation structure itself. The method involves depositing a photosensitive adhesive layer and a soluble adhesive layer on a carrier substrate. The photosensitive adhesive layer covers only a portion of the carrier substrate surface, with the remaining portion exposed. The soluble adhesive layer covers both the photosensitive adhesive layer and the exposed portion of the carrier substrate surface. This method ensures effective adhesion while reducing the amount of photosensitive material required for the photosensitive adhesive layer, thereby lowering production costs. The method first uses laser irradiation to detach the photosensitive adhesive layer from the carrier substrate. Then, a release solution is used to immerse the encapsulation unit. The release solution can penetrate the gap between the carrier substrate and the photosensitive adhesive layer, resulting in a large contact area with the soluble adhesive layer. This allows the soluble adhesive layer to dissolve more quickly in the release solution, facilitating faster separation of the encapsulation structure from the carrier substrate and improving production efficiency.

Description

Technical Field

[0001] This invention relates to the field of semiconductor technology, and in particular to a method for manufacturing a packaging structure and a packaging structure. Background Technology

[0002] In fan-out panel-level packaging, the packaging process needs to be completed on a carrier substrate, and then the package structure needs to be peeled off from the carrier substrate. Two common peeling methods are used in related technologies. One method involves covering the carrier substrate with an adhesive layer formed by a photosensitive material. After the packaging process is completed, a laser is used to irradiate the carrier substrate, causing the adhesive layer to detach from it. However, the photosensitive material used in this method is usually expensive, resulting in high production costs. The other method involves covering the carrier substrate with an adhesive layer formed by a soluble material. After the packaging process is completed, the assembly of the package structure, adhesive layer, and carrier substrate is immersed in a peeling solution used to dissolve the adhesive layer. However, this method has a slow dissolution rate and low production efficiency. Summary of the Invention

[0003] This invention aims to at least solve one of the technical problems existing in the prior art. To this end, this invention proposes a method for manufacturing an encapsulation structure that combines photosensitive materials and soluble materials, thereby reducing the amount of photosensitive materials used while increasing the dissolution rate of the soluble materials, thus reducing production costs and improving production efficiency.

[0004] The present invention also proposes a packaging structure manufactured by the above-described packaging structure manufacturing method.

[0005] The packaging structure manufacturing method provided in the first aspect of the present invention includes the following steps:

[0006] Prepare the substrate;

[0007] A photosensitive adhesive layer is covered on one side surface of the carrier substrate, and a portion of the carrier substrate is exposed from the photosensitive adhesive layer;

[0008] A soluble adhesive layer is covered on the side of the photosensitive adhesive layer away from the carrier substrate, such that a portion of the soluble adhesive layer contacts the photosensitive adhesive layer, and the remaining portion of the soluble adhesive layer contacts the carrier substrate.

[0009] An encapsulation step is performed on the side of the soluble adhesive layer away from the carrier substrate to form a plurality of interconnected encapsulation structures on the side of the soluble adhesive layer away from the carrier substrate.

[0010] A laser is used to irradiate the side of the carrier substrate away from the photosensitive adhesive layer, creating a gap between the photosensitive adhesive layer and the carrier substrate.

[0011] The assembly of multiple interconnected packaging structures with the carrier substrate, the photosensitive adhesive layer, and the soluble adhesive layer is divided to form multiple separate packaging units, each of which includes one of the packaging structures.

[0012] The encapsulation unit is placed in a release solution, which dissolves the soluble adhesive layer in the release solution, thereby detaching the encapsulation structure from the carrier substrate.

[0013] The packaging structure manufacturing method provided in the first aspect of the present invention has at least the following beneficial effects: a photosensitive adhesive layer and a soluble adhesive layer are disposed on a carrier substrate. The photosensitive adhesive layer only covers a portion of the surface of the carrier substrate, with the remaining portion exposed from the photosensitive adhesive layer. The soluble adhesive layer covers the photosensitive adhesive layer and the portion of the carrier substrate exposed from the photosensitive adhesive layer. While ensuring the bonding effect, the amount of photosensitive material required for the photosensitive adhesive layer is reduced, thereby reducing production costs. After the packaging step is completed, the photosensitive adhesive layer is first irradiated with a laser to detach it from the carrier substrate. Then, the packaging unit is immersed in a release solution. The release solution can enter the gap between the carrier substrate and the photosensitive adhesive layer. The contact area between the release solution and the soluble adhesive layer is large, so the soluble adhesive layer can dissolve in the release solution more quickly, allowing the packaging structure to separate from the carrier substrate more quickly, thereby improving production efficiency.

[0014] In some embodiments of the present invention, the step of covering one side surface of the carrier substrate with a photosensitive adhesive layer and exposing a portion of the carrier substrate from the photosensitive adhesive layer includes the following steps:

[0015] Multiple photosensitive adhesive strips are coated on one side surface of the carrier substrate. The photosensitive adhesive strips extend along a first direction and are spaced apart in a direction perpendicular to the first direction.

[0016] In some embodiments of the present invention, the step of covering one side surface of the carrier substrate with a photosensitive adhesive layer and exposing a portion of the carrier substrate from the photosensitive adhesive layer includes the following steps:

[0017] On one side of the carrier substrate, a plurality of photosensitive adhesive strips extending along a first direction and spaced apart in a direction perpendicular to the first direction are coated.

[0018] On the same side of the carrier substrate, a plurality of photosensitive adhesive strips extending along a second direction and spaced apart in a direction perpendicular to the second direction are coated, wherein the first direction and the second direction intersect each other.

[0019] In some embodiments of the present invention, the width of the photosensitive adhesive strip is 0.1 mm to 1 mm.

[0020] And / or,

[0021] The spacing between two parallel and adjacent photosensitive adhesive strips is 1mm to 10mm.

[0022] And / or,

[0023] The thickness of the photosensitive adhesive strip is 5 μm to 10 μm.

[0024] In some embodiments of the present invention, the material of the photosensitive adhesive layer is photosensitive polyimide.

[0025] In some embodiments of the present invention, the material of the soluble adhesive layer is an acrylic resin or a phenolic resin, and the stripping liquid is an organic alkaline solution.

[0026] In some embodiments of the present invention, the packaging step includes the following steps:

[0027] An adhesive layer is applied to the side of the soluble adhesive layer away from the carrier substrate, and the adhesive layer is not easily soluble in the release solution;

[0028] A wafer is attached to the side of the adhesive layer away from the soluble adhesive layer;

[0029] A redistribution layer is formed on the side of the adhesive layer away from the soluble adhesive layer, so that the redistribution layer is electrically connected to the wafer;

[0030] A molding layer is applied to the side of the redistribution layer away from the adhesive layer;

[0031] Solder bumps are formed on the side of the molding layer away from the redistribution layer, so that the solder bumps are electrically connected to the redistribution layer.

[0032] In some embodiments of the present invention, the adhesive layer is made of epoxy resin or polyethylene terephthalate.

[0033] In some embodiments of the present invention, the laser is a 308nm UV laser.

[0034] The packaging structure provided in the second aspect of the present invention is manufactured by the packaging structure manufacturing method provided in any embodiment of the first aspect of the present invention.

[0035] The packaging structure provided by the second aspect of the present invention has at least the following beneficial effects: the packaging structure manufactured by the packaging structure manufacturing method provided by any embodiment of the first aspect of the present invention requires less photosensitive material during the production process, has lower production cost, and higher production efficiency.

[0036] Additional aspects and advantages of the invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0037] The present invention will be further described below with reference to the accompanying drawings and embodiments, wherein:

[0038] Figure 1 A flowchart illustrating a method for manufacturing a packaging structure according to a first aspect embodiment of the present invention;

[0039] Figure 2 for Figure 1 The flowchart of step S200 shown in some embodiments;

[0040] Figure 3 for Figure 1 The flowchart of step S200 shown in some other embodiments;

[0041] Figure 4 for Figure 1 The flowchart of the packaging steps in step S400 is shown;

[0042] Figure 5 for Figure 1 Top view of the assembly of the carrier substrate and photosensitive adhesive layer after the completion of step S200;

[0043] Figure 6 for Figure 5 The sectional view of point A at section BB;

[0044] Figure 7 for Figure 1 A schematic diagram showing the completion of the S300 steps;

[0045] Figure 8 for Figure 1 A schematic diagram showing the completion of the S400 steps;

[0046] Figure 9 for Figure 1 A schematic diagram illustrating the implementation process of the S500 standard.

[0047] Figure 10 for Figure 1 A schematic diagram illustrating the implementation process of S600;

[0048] Figure 11 for Figure 1 A schematic diagram illustrating the implementation process of S700 in China;

[0049] Figure 12 for Figure 1 Another schematic diagram illustrating the implementation process of the S700 procedure;

[0050] Figure 13 for Figure 1 A schematic diagram showing the completion of the S700 steps;

[0051] Figure 14 For some other embodiments Figure 1 A top view of the assembly of the carrier substrate and the photosensitive adhesive layer after the completion of step S200.

[0052] Figure label:

[0053] The package includes a substrate 100, a photosensitive adhesive layer 200, a photosensitive adhesive strip 210, a first photosensitive adhesive strip 211, a second photosensitive adhesive strip 212, a gap 220, a soluble adhesive layer 300, a packaging structure 400, an adhesive layer 410, a chip 420, a redistribution layer 430, a molding compound 440, solder bumps 450, a packaging unit 500, and a release solution 600. Detailed Implementation

[0054] Embodiments of the present invention are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be construed as limiting the present invention.

[0055] In the description of this invention, it should be understood that the orientation descriptions, such as up, down, left, right, etc., are based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limiting this invention.

[0056] In the description of this invention, unless otherwise explicitly defined, terms such as "set up," "install," and "connect" should be interpreted broadly, and those skilled in the art can reasonably determine the specific meaning of the above terms in this invention in conjunction with the specific content of the technical solution.

[0057] In the description of this invention, references to terms such as "one embodiment," "some embodiments," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the invention. In this specification, illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0058] In fan-out panel-level packaging, the packaging process needs to be completed on the carrier substrate 100, and then the package structure is peeled off from the carrier substrate 100. In related technologies, there are two commonly used peeling methods. One method is to cover the carrier substrate 100 with an adhesive layer formed of photosensitive material. After the packaging process is completed, a laser is used to irradiate the carrier substrate 100, causing the adhesive layer to detach from the carrier substrate. However, the photosensitive material used in this method is usually expensive, resulting in high production costs. The other method is to cover the carrier substrate 100 with an adhesive layer formed of a soluble material. After the packaging process is completed, the assembly of the package structure, adhesive layer, and carrier substrate 100 is immersed in a peeling solution used to dissolve the adhesive layer. However, in this method, the contact area between the peeling solution and the adhesive layer is limited, and the peeling solution needs to gradually dissolve the adhesive layer from the edge to the inside, resulting in a slow dissolution rate and low production efficiency.

[0059] Based on this, refer to Figure 1 , Figures 5 to 13 The packaging structure manufacturing method provided in the first aspect of the present invention includes the following steps:

[0060] S100, Prepare the substrate 100;

[0061] S200, refer to Figure 5 and Figure 6 A photosensitive adhesive layer 200 is covered on one side surface of the carrier substrate 100, and a portion of the carrier substrate 100 is exposed from the photosensitive adhesive layer 200.

[0062] S300, refer to Figure 7 A soluble adhesive layer 300 is covered on the side of the photosensitive adhesive layer 200 away from the carrier substrate 100, such that a portion of the soluble adhesive layer 300 contacts the photosensitive adhesive layer 200, and the remaining portion of the soluble adhesive layer 300 contacts the carrier substrate 100.

[0063] S400, refer to Figure 8 An encapsulation step is performed on the side of the soluble adhesive layer 300 away from the carrier substrate 100 to form a plurality of interconnected encapsulation structures 400 on the side of the soluble adhesive layer away from the carrier substrate 100.

[0064] S500, refer to Figure 9 A laser is used to irradiate the side of the carrier substrate 100 away from the photosensitive adhesive layer 200 in the direction of the arrow, so that a gap 220 is created between the photosensitive adhesive layer 200 and the carrier substrate 100. Specifically, a 308nm UV laser can be used.

[0065] S600, refer to Figure 10The assembly of multiple interconnected packaging structures 400 with the carrier substrate 100, photosensitive adhesive layer 200 and soluble adhesive layer 300 is divided to form multiple mutually separated packaging units 500, each packaging unit 500 including a packaging structure 400.

[0066] S700, reference Figures 11 to 13 The packaging unit 500 is placed in the release liquid 600, so that the soluble adhesive layer 300 dissolves in the release liquid 600, thereby allowing the packaging structure 400 to detach from the carrier substrate 100.

[0067] A photosensitive adhesive layer 200 and a soluble adhesive layer 300 are disposed on a carrier substrate 100. The photosensitive adhesive layer 200 only covers a portion of the surface of the carrier substrate 100, with the remaining portion exposed from the photosensitive adhesive layer 200. The soluble adhesive layer 300 covers the photosensitive adhesive layer 200 and the portion of the carrier substrate 100 exposed from the photosensitive adhesive layer 200. While ensuring the bonding effect, compared to coating the entire surface with photosensitive material, the amount of photosensitive material required by the photosensitive adhesive layer 200 is reduced, thereby reducing production costs.

[0068] After the encapsulation process is completed, the photosensitive adhesive layer 200 is first irradiated with a laser, causing it to absorb laser energy and break the molecular bonds between it and the carrier substrate 100, thus detaching it from the carrier substrate 100. At this point, a gap 220 is created between the photosensitive adhesive layer 200 and the carrier substrate 100, while the soluble adhesive layer 300 remains bonded to the carrier substrate 100. Then, the encapsulation unit 500 is immersed in a release solution 600. The release solution 600 can penetrate into the gap 220 between the carrier substrate 100 and the photosensitive adhesive layer 200. The release solution 600 and the soluble adhesive layer 300 can contact each other both at the outer edge and inside the soluble adhesive layer 300, resulting in a large contact area. Therefore, the soluble adhesive layer 300 can dissolve in the release solution 600 more quickly, allowing the encapsulation structure 400 to separate from the carrier substrate 100 more quickly, thereby improving production efficiency.

[0069] Understandably, in step S500, a laser is used to irradiate the side of the carrier substrate 100 away from the photosensitive adhesive layer 200 in the direction of the arrow, so that a gap 220 is created between the photosensitive adhesive layer 200 and the carrier substrate 100. In order to ensure that the laser can penetrate the carrier substrate 100, the carrier substrate 100 needs to be made of a light-transmitting material. Specifically, the material of the carrier substrate 100 is glass.

[0070] It should be noted that, for the purpose of facilitating the demonstration of the structure, Figures 6 to 13The diagram only shows the manufacturing process of two adjacent encapsulation structures 400. In actual production, a larger carrier substrate 100 can be used, and more encapsulation structures 400 can be manufactured on it to improve production efficiency. For example, the carrier substrate 100 can be a square plate with a side length greater than 300 mm.

[0071] It should be noted that the packaging structure manufacturing method provided in the first aspect of the present invention can be applied to advanced packaging at the fan-out panel level, advanced packaging at the fan-out wafer level, semiconductor packaging, etc.

[0072] The shape of the photosensitive adhesive layer 200 can be configured according to actual needs, ensuring that a gap 220 is created between the carrier substrate 100 and the photosensitive adhesive layer 200 in each packaging unit 500, allowing the release liquid 600 to enter the soluble adhesive layer 300. Two exemplary forms of the photosensitive adhesive layer 200 are given below:

[0073] In some embodiments, refer to Figure 2 S200 includes the following steps:

[0074] S210, a plurality of photosensitive adhesive strips 210 are coated on one side surface of the substrate 100. The photosensitive adhesive strips 210 extend along a first direction and are spaced apart in a direction perpendicular to the first direction.

[0075] Reference Figure 14 Multiple photosensitive adhesive strips 210 together constitute the photosensitive adhesive layer 200. The photosensitive adhesive strips 210 extend along the first direction and are in a straight line, which is relatively simple in shape and the control logic during coating is relatively simple, which helps to reduce production costs. Multiple photosensitive adhesive strips 210 are spaced apart in a direction perpendicular to the first direction, and the substrate 100 is exposed between two adjacent photosensitive adhesive strips 210. The exposed surface is available for the soluble adhesive layer 300 to bond, and the structural layout is relatively reasonable.

[0076] It should be noted that when laying out the photosensitive adhesive strip 210, it should be ensured that after dividing the assembly of multiple interconnected encapsulation structures 400, carrier substrate 100, photosensitive adhesive layer 200, and soluble adhesive layer 300 into multiple encapsulation units 500 in step S600, each encapsulation unit 500 has at least one photosensitive adhesive strip 210, and the photosensitive adhesive strip 210 is located at a non-edge position of the soluble adhesive layer 300, so as to ensure that after a gap 220 is generated between the photosensitive adhesive strip 210 and the carrier substrate 100, in step S700, the release liquid 600 can enter the interior of the soluble adhesive layer 300 along the gap 220, increasing the contact area with the soluble adhesive layer 300.

[0077] In other embodiments, reference is made to Figure 3 S200 includes the following steps:

[0078] S220, On one side of the substrate 100, a plurality of photosensitive adhesive strips 210 extending along the first direction and spaced apart in a direction perpendicular to the first direction are coated. For ease of description, the photosensitive adhesive strips 210 extending along the first direction are named the first photosensitive adhesive strips 211.

[0079] S230, on the same side of the substrate 100, a plurality of photosensitive adhesive strips 210 extending along the second direction and spaced apart in a direction perpendicular to the second direction are coated. For ease of description, the photosensitive adhesive strips 210 extending along the second direction are named second photosensitive adhesive strips 212. The first direction and the second direction intersect each other.

[0080] Reference Figure 5 Multiple first photosensitive adhesive strips 211 and multiple second photosensitive adhesive strips 212 together constitute the photosensitive adhesive layer 200. The first photosensitive adhesive strips 211 extend along a first direction, and the second photosensitive adhesive strips 212 extend along a second direction, both being linear in shape. This simple shape simplifies the control logic during coating and helps reduce production costs. Simultaneously, by providing first photosensitive adhesive strips 211 and second photosensitive adhesive strips 212 extending in different directions, the release liquid 600 can enter the soluble adhesive layer 300 through the gap 220 between the first photosensitive adhesive strip 211 and the carrier substrate 100, and also through the gap between the second photosensitive adhesive strip 212 and the carrier substrate 100. The gaps 220 between the substrates 100 enter the interior of the soluble adhesive layer 300, which can further increase the contact area between the release liquid 600 and the soluble adhesive layer 300, thereby further improving the dissolution speed and production efficiency. Multiple first photosensitive adhesive strips 211 are spaced apart in a direction perpendicular to the first direction, and multiple second photosensitive adhesive strips 212 are spaced apart in a direction perpendicular to the second direction. The substrate 100 is exposed from the grid formed by two adjacent first photosensitive adhesive strips 211 and two adjacent second photosensitive adhesive strips 212. The exposed surface is used for bonding by the soluble adhesive layer 300, and the structural layout is relatively reasonable.

[0081] It should be noted that when laying out the first photosensitive adhesive strip 211 and the second photosensitive adhesive strip 212, it should be ensured that after dividing the assembly of multiple interconnected encapsulation structures 400, carrier substrate 100, photosensitive adhesive layer 200, and soluble adhesive layer 300 into multiple encapsulation units 500 in step S600, each encapsulation unit 500 has at least one first photosensitive adhesive strip 211 and at least one second photosensitive adhesive strip 212, and both the first photosensitive adhesive strip 211 and the second photosensitive adhesive strip 212 are located on the soluble adhesive layer. In step S700, after gaps 220 are created between the first photosensitive adhesive strip 211 and the carrier substrate 100, and between the second photosensitive adhesive strip 212 and the carrier substrate 100, the release liquid 600 can enter the interior of the soluble adhesive layer 300 along the gaps 220 between the first photosensitive adhesive strip 211 and the carrier substrate 100 and between the second photosensitive adhesive strip 212 and the carrier substrate 100, so as to further increase the contact area with the soluble adhesive layer 300.

[0082] Furthermore, since the first direction and the second direction are perpendicular to each other, coating the first photosensitive adhesive strip 211 and the second photosensitive adhesive strip 212 along the two perpendicular directions can further simplify the control logic during coating. Specifically, when coating the first photosensitive adhesive strip 211, coating along the first direction can be completed by simply changing the coordinates of the coating head in the first direction. When coating the second photosensitive adhesive strip 212, coating along the second direction can be completed by simply changing the coordinates of the coating head in the second direction, which helps to reduce production costs.

[0083] It should be noted that the shape of the photosensitive adhesive layer 200 is not limited to... Figure 5 and Figure 14 The two structural forms shown can also be set to wavy, diamond, or other shapes, depending on actual needs.

[0084] The dimensional parameters of the photosensitive adhesive strip 210 can be set according to actual needs. For example, refer to... Figure 5 and Figure 14 The width d of the photosensitive adhesive strip 210 is 0.1mm to 1mm, refer to Figure 6 The thickness h of the photosensitive adhesive strip 210 is 5μm to 10μm, ensuring that while reducing the amount of photosensitive material used, the size of the gap 220 is sufficient for the release liquid 600 to enter; refer to Figure 5 and Figure 14 The spacing D between two parallel and adjacent photosensitive adhesive strips 210 is 1mm to 10mm. While ensuring a reduction in the amount of photosensitive material used, it ensures that each encapsulation unit 500 has at least one photosensitive adhesive strip 210, and the photosensitive adhesive strip 210 is located at a non-edge position of the soluble adhesive layer 300.

[0085] The material of the photosensitive adhesive layer 200 should be selected to be able to adhere to the carrier substrate 100 and to be able to separate from the carrier substrate 100 under laser irradiation. Specifically, the material of the photosensitive adhesive layer 200 is photosensitive polyimide.

[0086] The material of the soluble adhesive layer 300 should be selected to be able to adhere to the carrier substrate 100 and the photosensitive adhesive layer 200 and be soluble in a certain solvent. The release liquid 600 should be selected to be a liquid that can dissolve the soluble adhesive layer 300. Specifically, the material of the soluble adhesive layer 300 is an acrylic resin or a phenolic resin, and the release liquid 600 is an organic alkaline solution.

[0087] Reference Figure 4 The packaging steps in S400 include the following steps:

[0088] S410, an adhesive layer 410 is covered on the side of the soluble adhesive layer 300 away from the carrier substrate 100, and the adhesive layer 410 is not easily soluble in the release liquid 600.

[0089] S420, the chip 420 is attached to the side of the adhesive layer 410 away from the soluble adhesive layer 300;

[0090] S430, a redistribution layer 430 is formed on the side of the adhesive layer 410 away from the soluble adhesive layer 300, so that the redistribution layer 430 is electrically connected to the chip 420.

[0091] S440, covering the side of the redistribution layer 430 away from the adhesive layer 410 with a molding compound 440;

[0092] S450, a solder bump 450 is made on the side of the molding compound 440 away from the redistribution layer 430, so that the solder bump 450 is electrically connected to the redistribution layer 430.

[0093] Reference Figure 8 The above steps can form multiple interconnected packaging structures 400 at once, resulting in high production efficiency.

[0094] To prevent the adhesive layer 410 from dissolving in step S700, the material of the adhesive layer 410 must be selected to be insoluble in the stripping solution 600. Specifically, the material of the adhesive layer 410 is epoxy resin or polyethylene terephthalate.

[0095] The encapsulation structure 400 provided in the second aspect embodiment of the present invention is manufactured by the encapsulation structure manufacturing method provided in any embodiment of the first aspect of the present invention. The encapsulation structure 400 manufactured by the encapsulation structure manufacturing method provided in any embodiment of the first aspect of the present invention requires less photosensitive material during the production process, has lower production costs, and higher production efficiency.

[0096] The embodiments of the present invention have been described in detail above with reference to the accompanying drawings. However, the present invention is not limited to the above embodiments. Within the scope of knowledge possessed by those skilled in the art, various changes can be made without departing from the spirit of the present invention. Furthermore, the embodiments of the present invention and the features thereof can be combined with each other unless otherwise specified.

Claims

1. A method of manufacturing a package structure, characterized by, The method comprises the steps of: preparing a carrier substrate; covering a photosensitive adhesive layer on one side surface of the carrier substrate, and exposing part of the carrier substrate from the photosensitive adhesive layer; covering a soluble adhesive layer on the side of the photosensitive adhesive layer away from the carrier substrate, so that part of the soluble adhesive layer contacts the photosensitive adhesive layer, and the rest of the soluble adhesive layer contacts the carrier substrate; performing an encapsulation step on the side of the soluble adhesive layer away from the carrier substrate to form a plurality of interconnected encapsulation structures on the side of the soluble adhesive layer away from the carrier substrate; irradiating the side of the carrier substrate away from the photosensitive adhesive layer with a laser to form a gap between the photosensitive adhesive layer and the carrier substrate; segmenting the combination of the plurality of interconnected encapsulation structures, the carrier substrate, the photosensitive adhesive layer, and the soluble adhesive layer to form a plurality of mutually separated encapsulation units, each of which comprises one encapsulation structure; immersing the encapsulation units in a stripping solution to dissolve the soluble adhesive layer in the stripping solution, so that the encapsulation structures are separated from the carrier substrate.

2. The package structure manufacturing method according to claim 1, wherein The step of covering a photosensitive adhesive layer on one side surface of the carrier substrate, and exposing part of the carrier substrate from the photosensitive adhesive layer comprises the steps of: coating a plurality of photosensitive adhesive strips on one side surface of the carrier substrate, the photosensitive adhesive strips extending in a first direction, and a plurality of the photosensitive adhesive strips being spaced apart in a direction perpendicular to the first direction.

3. The method of claim 1, wherein The step of covering a photosensitive adhesive layer on one side surface of the carrier substrate, and exposing part of the carrier substrate from the photosensitive adhesive layer comprises the steps of: coating a plurality of photosensitive adhesive strips on one side of the carrier substrate, the photosensitive adhesive strips extending in a first direction and being spaced apart in a direction perpendicular to the first direction; coating a plurality of photosensitive adhesive strips on the same side of the carrier substrate, the photosensitive adhesive strips extending in a second direction and being spaced apart in a direction perpendicular to the second direction, the first direction and the second direction intersecting each other.

4. The package structure manufacturing method according to claim 2 or 3, wherein The width of the photosensitive adhesive strip is 0.1 mm to 1 mm, and / or, the distance between two photosensitive adhesive strips parallel to and adjacent to each other is 1 mm to 10 mm, and / or, the thickness of the photosensitive adhesive strip is 5 μm to 10 μm.

5. The method of claim 1, wherein The material of the photosensitive adhesive layer is photosensitive polyimide.

6. The method of claim 1, wherein The material of the soluble adhesive layer is acrylic resin or phenol formaldehyde resin, and the stripping solution is an organic alkali solution.

7. The method of claim 1, wherein The encapsulation step comprises the steps of: covering a glue layer on the side of the soluble adhesive layer away from the carrier substrate, the glue layer being not easily dissolved in the stripping solution; attaching a wafer on the side of the glue layer away from the soluble adhesive layer; making a redistribution layer on the side of the glue layer away from the soluble adhesive layer, so that the redistribution layer is electrically connected to the wafer; covering a plastic encapsulation layer on the side of the redistribution layer away from the glue layer; making a solder bump on the side of the plastic encapsulation layer away from the redistribution layer, so that the solder bump is electrically connected to the redistribution layer.

8. The method of claim 7, wherein The material of the glue layer is epoxy resin or polyethylene terephthalate.

9. The method of claim 1, wherein The laser is a 308 nm UV laser.

10. A package structure, characterized by, The packaging structure is manufactured by the packaging structure manufacturing method according to any one of claims 1 to 9. The packaging structure is manufactured by the packaging structure manufacturing method according to any one of claims 1 to 9.

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