Semiconductor element pickup device and its operation control method

Abstract

The present application is a semiconductor element pickup device and a method for controlling the operation thereof. The method for controlling the operation of the semiconductor element pickup device includes: a pickup operation lowering step for lowering a plurality of vacuum pickups for pickup height correction; a vacuum pressure monitoring step for confirming the vacuum pressure of each of the plurality of vacuum pickups to grasp a reference time point at which the vacuum pressures of all of the plurality of vacuum pickups satisfy a reference value; and a pickup height setting step for setting the pickup height of the plurality of vacuum pickups based on the lowering height at the grasped reference time point.

Description

Technical Field

[0001] The present invention relates, as a semiconductor element pickup device and its operation control method, more specifically to the following semiconductor element transfer technology: In the absence of prior information about the transfer object, i.e., the semiconductor element, the pickup height is corrected based on the vacuum pressure of multiple vacuum pickups; and when the semiconductor element is adsorbed onto the vacuum pickup, the thickness of the semiconductor element is determined based on a measurement of the lower surface of the semiconductor element, and the placement height of the semiconductor element is corrected accordingly. Background Technology

[0002] Typically, semiconductor devices can be formed on a silicon wafer, which serves as a semiconductor substrate, by repeatedly performing a series of manufacturing processes. Semiconductor devices formed in this way can be manufactured into semiconductor ribbons consisting of multiple semiconductor packages through slicing, die bonding, and injection molding processes.

[0003] The semiconductor ribbon manufactured in this way can be individually processed into multiple semiconductor packages through a slicing and sorting process, and then classified as good or defective. For example, the semiconductor ribbon can be loaded onto a chuck and then individually processed into multiple semiconductor packages using a slicing blade. These individual semiconductor packages can be cleaned and dried before being inspected via a video module. Furthermore, they can be classified as good or defective based on the inspection results obtained through the video module.

[0004] Specifically, the semiconductor package can be transferred to good and defective trays via a buffer stage for performing drying and inspection processes, a reversing stage for reversing the semiconductor package, and a sorting tray stage.

[0005] In subsequent processes of such semiconductor manufacturing, the transfer of semiconductor components can be performed using a vacuum pick-up device. This vacuum pick-up device can be used to simultaneously pick up individual semiconductor packages and sequentially transfer them to the buffer stage and the tray stage. Alternatively, the vacuum pick-up device can be used to individually pick up semiconductor packages and transfer them to the tray.

[0006] When picking up or placing semiconductor components using a vacuum pickup, the descent height setting of the vacuum pickup is a very important factor.

[0007] If, during a pick-up operation of a semiconductor device, the vacuum pickup operates at a height that fails to make proper contact with the device, insufficient vibration intensity will not be generated to pick it up. This can lead to problems such as the inability to pick up the device or the semiconductor device falling during transport by the vacuum pickup. Conversely, if the vacuum pickup descends too low to pick up the semiconductor device, damage to the vacuum pickup or the semiconductor device may occur.

[0008] In addition, during the placement of semiconductor components, if the vacuum pickup does not lower the semiconductor component at the appropriate height, the semiconductor component may not be properly placed in the tray recess and may instead hang on the outer surface. Conversely, if the vacuum pickup is lowered to too low a height to place the semiconductor component, the vacuum pickup or the semiconductor component may be damaged.

[0009] To eliminate such problems, the descent height for picking up or placing semiconductor components performed by the vacuum pickup is set based on measurements taken by the manager's naked eye, video sensors, or range sensors, thereby performing a guidance process for the vacuum pickup.

[0010] However, setting the descent height based on the manager's visual observation has a significant decrease in accuracy. When the descent height is set based on the measurements of various sensors, the thickness of the semiconductor components is not taken into account, and the descent height is set based on the vacuum pickup. Therefore, errors may occur when the process is applied to the transfer process of physical semiconductor components.

[0011] (Patent Document 0001) Korean Patent Publication No. 10-1227827

[0012] (Patent Document 0002) Korean Patent Publication No. 10-2096570 Summary of the Invention

[0013] The present invention is proposed to solve the problems of the prior art as described above, and its object is to provide a solution in which, in a semiconductor element pickup device for transporting semiconductor elements, when performing the pickup and placement operations of a vacuum pickup, the pickup height and placement height can be set even without prior information about the semiconductor elements, so that the semiconductor elements can be picked up and placed at accurate positions.

[0014] In particular, the aim is to propose a technology that can accurately pick up and place semiconductor components by knowing the thickness of the semiconductor components and reflecting the thickness of the semiconductor components.

[0015] In particular, the aim is to eliminate the problem that accuracy significantly decreases when the method of setting the descent height of the vacuum pickup is applied by the naked eye of the manager, and to solve the following problem: When the method of setting the descent height based on the measurement values ​​of various sensors is applied, errors occur when the actual thickness of the semiconductor element is not taken into account when the descent height is set based on the vacuum pickup, since the thickness of the semiconductor element is not taken into account.

[0016] The objectives of this invention are not limited to those described above, and other objectives and advantages of this invention not mentioned may be understood from the following description.

[0017] An embodiment of the operation control method for a semiconductor element pickup device according to the present invention includes: a pickup operation descent step, wherein a plurality of vacuum pickups are lowered for pickup height correction; a vacuum pressure monitoring step, wherein the vacuum pressure of each of the plurality of vacuum pickups is confirmed to determine a reference time point in which the vacuum pressure of all the plurality of vacuum pickups meets a reference value; and a pickup height setting step, wherein the pickup height of the plurality of vacuum pickups is set based on the descent height at the determined reference time point.

[0018] Preferably, the pickup height setting step may be based on the minimum thickness of the semiconductor element to set the pickup height.

[0019] As an example, the pickup descent step could involve lowering multiple vacuum pickups toward a set plate.

[0020] Furthermore, the operation control method of the semiconductor element pickup device may further include a pickup state determination step, which determines the state of the plurality of vacuum pickups based on the position information of each of the plurality of vacuum pickups before the pickup operation descent step.

[0021] Preferably, the pickup status determination step may include: a position pattern acquisition step, which acquires a position pattern based on the position information of each of the plurality of vacuum pickups; and an abnormal status determination step, which determines the abnormal status of the plurality of vacuum pickups based on the acquired position pattern.

[0022] As an example, the abnormal state judgment step may include: when the position pattern has a certain change pattern that deviates from the set range, a step of judging the abnormal state corresponding to the change pattern; and a state information providing step of providing abnormal state information of the entire set of vacuum pickups.

[0023] As another example, the abnormal state judgment step may include: when the position pattern has a change that deviates from the set range in a specific part, the step of identifying the vacuum pickup corresponding to the specific part among the multiple vacuum pickups; and the state information providing step of providing abnormal state information of the identified vacuum pickup.

[0024] As an example, the position pattern acquisition step may be based on the vacuum pressure of each of the multiple vacuum pickups to acquire the position information of the multiple vacuum pickups.

[0025] As another example, the position pattern acquisition step may acquire the position information of the multiple vacuum pickups based on distance measurements of each of the multiple vacuum pickups obtained by a video sensor or a ranging sensor.

[0026] An embodiment of the operation control method for the semiconductor element pickup device according to the present invention includes: a semiconductor element pickup step, wherein a plurality of vacuum pickups are lowered based on the pickup height for placement height correction, and a plurality of semiconductor elements are picked up and moved to the position of the sensor unit; a semiconductor element thickness determination step, wherein the thickness of the semiconductor element is determined based on a measurement value of the lower surface of the semiconductor element obtained by the sensor unit; and a placement height setting step, wherein the placement height of the plurality of vacuum pickups is set based on the pickup height of the vacuum pickups and the thickness of the semiconductor elements.

[0027] As an example, the semiconductor element thickness determination step may include: a step of taking a picture of the lower surface of the semiconductor element adsorbed on the vacuum pickup by means of a video sensor of the sensor unit while the vacuum pickup is moved vertically; a step of setting the height of the location where the captured image with a set focus is obtained as a reference height; and a step of determining the thickness of the semiconductor element based on the reference height.

[0028] As another example, the semiconductor element thickness determination step may include: measuring the distance between the semiconductor element and the lower surface of the semiconductor element adsorbed on the vacuum pickup using a distance sensor of the sensor unit; setting the measured distance as a reference height; and determining the thickness of the semiconductor element based on the reference height.

[0029] Alternatively, one embodiment of the semiconductor element pickup device according to the present invention may include: a plurality of vacuum pickups for conveying a plurality of arranged semiconductor elements; a pickup vacuum monitoring unit for monitoring the vacuum pressure of each of the plurality of vacuum pickups; and a pickup control unit for setting a pickup height based on a reference time point when all the vacuum pressures of the plurality of vacuum pickups meet a reference value while the plurality of vacuum pickups descend, and for the plurality of vacuum pickups that have picked up the plurality of semiconductor elements based on the pickup height, determining the thickness of the semiconductor element based on a measured value of the lower surface of the semiconductor element, and setting the placement height of the plurality of vacuum pickups taking into account the thickness of the semiconductor element.

[0030] Preferably, the pickup control unit may include: a pickup height setting unit that confirms the vacuum pressure of each of the plurality of vacuum pickups and sets the pickup height based on the height of a reference time point in which the vacuum pressure of all the plurality of vacuum pickups meets a reference value; and a placement height setting unit that, for the plurality of vacuum pickups that have adsorbed a plurality of semiconductor elements based on the pickup height, determines the thickness of the semiconductor element based on a measured value of the lower surface of the semiconductor element, and sets the placement height of the plurality of vacuum pickups based on the thickness of the semiconductor element.

[0031] As an example, the semiconductor element pickup device may further include: a video sensor for capturing the lower surface of the semiconductor element; the placement height setting unit, while capturing the lower surface of the semiconductor element through the video sensor, sets the height of the location where the captured image that satisfies the set focus as a reference height, and calculates the thickness of the semiconductor element based on the reference height.

[0032] As another example, the semiconductor element pickup device may further include: a distance sensor that measures the distance between itself and the lower surface of the semiconductor element; the placement height setting unit measures the distance between itself and the lower surface of the semiconductor element using the distance sensor and sets the distance as a reference height; and calculates the thickness of the semiconductor element based on the reference height.

[0033] Furthermore, the pickup control unit may further include a pickup state determination unit for determining the state of the plurality of vacuum pickups.

[0034] Preferably, the pickup status determination unit may acquire position patterns of multiple vacuum pickups and determine the abnormal status of multiple vacuum pickups based on the acquired position patterns.

[0035] Furthermore, the pickup status determination unit may provide the status information of the vacuum pickup.

[0036] A preferred embodiment of the operation control method for the semiconductor element pickup device according to the present invention includes: a pickup state determination step, which involves acquiring a position pattern based on the position information of each of a plurality of vacuum pickups, and determining an abnormal state of the plurality of vacuum pickups based on the acquired position pattern; and a pickup operation descent step, in which the plurality of vacuum pickups are oriented toward a fixed plate (Set) for pickup height correction. The process includes: a plate descent step; a vacuum pressure monitoring step, confirming the vacuum pressure of each of the plurality of vacuum pickups and determining a reference time point when the vacuum pressure of all the plurality of vacuum pickups meets a reference value; a pickup height setting step, setting the pickup height of the plurality of vacuum pickups based on the descent height at the determined reference time point; a semiconductor element pickup step, for placement height correction, lowering the plurality of vacuum pickups based on the pickup height and picking up the plurality of semiconductor elements and moving them to the position of the sensor unit; a semiconductor element thickness determination step, determining the thickness of the semiconductor element based on the measurement value obtained by the sensor unit relative to the lower surface of the semiconductor element; and a placement height setting step, setting the placement height of the plurality of vacuum pickups based on the pickup height of the vacuum pickups and the thickness of the semiconductor elements.

[0037] According to this invention, in a semiconductor element pickup device for conveying semiconductor elements, when performing pickup and placement operations with a vacuum pickup, a method is available to set the pickup height and placement height even without prior information about the semiconductor elements, enabling the accurate pickup and placement of the semiconductor elements.

[0038] In particular, by knowing the thickness of the semiconductor element and using it to correct the accurate height, it is possible to eliminate the problem of damage to the semiconductor element or vacuum pickup while accurately picking up and placing the semiconductor element.

[0039] Furthermore, by monitoring the status of the vacuum pickup, information on the status of the vacuum pickup in abnormal states can be provided, thereby enabling effective maintenance and management of the semiconductor component pickup device.

[0040] The effects of the present invention are not limited to those mentioned above. Other effects not mentioned can be clearly understood by those skilled in the art from the following description. Attached Figure Description

[0041] Figure 1A schematic diagram of a semiconductor package cutting and sorting apparatus applicable to the semiconductor component picking device according to the present invention is shown.

[0042] Figure 2 A structural diagram of an embodiment of a semiconductor element pickup device according to the present invention is shown.

[0043] Figure 3 An example of a semiconductor element pickup device according to the present invention is shown.

[0044] Figure 4 A structural diagram showing an embodiment of the pickup control section of a semiconductor element pickup device according to the present invention is provided.

[0045] Figure 5 A schematic flowchart illustrating an embodiment of an operation control method for a semiconductor element pickup device according to the present invention is shown.

[0046] Figure 6 A flowchart illustrating an embodiment of the state determination process of a vacuum pickup in the operation control method of a semiconductor element pickup device according to the present invention is shown.

[0047] Figures 7 to 12 This paper illustrates one example of various methods for determining the state of a vacuum pickup in the operation control method of a semiconductor element pickup device according to the present invention.

[0048] Figure 13 A flowchart illustrating an embodiment of the pickup height correction process of a vacuum pickup in the operation control method of a semiconductor element pickup device according to the present invention is shown.

[0049] Figure 14 An example of correcting the pickup height of a vacuum pickup unit in the operation control method of the semiconductor element pickup device according to the present invention is shown.

[0050] Figure 15 A flowchart illustrating an embodiment of the process of correcting the placement height of a vacuum pickup via a video sensor in the operation control method of a semiconductor element pickup device according to the present invention.

[0051] Figures 16 to 18 An example is shown of a method for controlling the operation of a semiconductor element pickup device according to the present invention, in which the placement height of a vacuum pickup is corrected by a video sensor.

[0052] Figure 19 A flowchart illustrating an embodiment of the process of correcting the placement height of a vacuum pickup via a distance sensor in the operation control method of a semiconductor element pickup device according to the present invention.

[0053] Figure 20 as well as Figure 21An example is shown in the operation control method of the semiconductor element pickup device according to the present invention, in which the placement height of the vacuum pickup is corrected by a distance sensor.

[0054] (Explanation of reference numerals in the attached diagram)

[0055] 100: Semiconductor component pickup device,

[0056] 110: Vacuum pickup device,

[0057] 112a: Pickup unit body,

[0058] 114a: Suction head,

[0059] 150: Pickup unit control section

[0060] 151: Pickup height setting unit,

[0061] 153: Placement of height setting unit,

[0062] 155: Pickup device status determination unit,

[0063] 160: Vacuum monitoring unit for pickup device.

[0064] 170: Sensors Department

[0065] 170a: Video sensor,

[0066] 170b: Distance sensor. Detailed Implementation

[0067] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings, but the present invention is not limited or restricted by the embodiments.

[0068] To illustrate the advantages of the present invention and the objectives achieved through its implementation, preferred embodiments of the present invention are described below with reference to these embodiments.

[0069] First, the terminology used in this application is for illustrative purposes only and is not intended to limit the invention. Unless otherwise explicitly stated in the context, singular expressions may include plural expressions. Furthermore, in this application, terms such as "comprising" or "having" refer to the presence of features, numbers, steps, actions, constituent elements, parts, or combinations thereof described in the specification, and should be understood as not precluding the presence or additional possibilities of one or more other features, numbers, steps, actions, constituent elements, parts, or combinations thereof.

[0070] In the description of this invention, detailed descriptions of related well-known structures or functions are omitted when it is determined that such detailed descriptions may obscure the spirit of the invention.

[0071] This invention proposes the following semiconductor device transport technology: In the absence of prior information about the transported semiconductor device, the pick-up height is corrected based on the vacuum pressure of multiple vacuum pickups; and when the semiconductor device is adsorbed onto the vacuum pickup, the thickness of the semiconductor device is determined based on measurements of its lower surface, and the placement height of the semiconductor device is corrected accordingly.

[0072] Figure 1 A schematic diagram of a semiconductor package cutting and sorting apparatus applicable to the semiconductor component picking device according to the present invention is shown.

[0073] The semiconductor package cutting and sorting equipment 10 can be used to cut semiconductor strip 1 formed by multiple semiconductor packages 2 into individual semiconductor packages 2, and then sort the individual semiconductor packages 2 according to the results after inspection.

[0074] The semiconductor package cutting and sorting equipment 10 may include a cutting module 20 for cutting semiconductor strip 1 into individual semiconductor packages 2 and a sorting module 30 for inspecting the semiconductor packages 2 and sorting the semiconductor packages 2 according to the inspection results.

[0075] A cassette 15 containing multiple semiconductor strips 1 can be configured on one side of the semiconductor package cutting and sorting equipment 10.

[0076] In addition, although not shown in detail, it may include clamps (not shown) for removing semiconductor strip 1 from the cassette 15, and the semiconductor strip 1 removed from the cassette 15 may be guided by a guide rail.

[0077] The semiconductor tape 1 can be picked up by the tape picker 25 and transferred to the vacuum chuck 40. The tape picker 25 can be configured to rotate to adjust the orientation of the semiconductor tape 1. For example, the tape picker 25 can pick up the semiconductor tape 1 taken from the cartridge 15, rotate the semiconductor tape 1, and then transfer the rotating semiconductor tape 1 to the vacuum chuck 40.

[0078] The vacuum chuck 40 can be supported by the chuck stage 41, which can move the semiconductor strip 1 to the cutting module 20. The cutting module 20 may include a rotary cutter 22 for cutting the semiconductor strip 1, and the chuck stage 41 can move the semiconductor strip 1 under the rotary cutter 22 by another drive unit (not shown).

[0079] The individualized semiconductor packages 2 obtained by the cutting module 20 can be picked up and transported by the package picker 55. The semiconductor package cutting and sorting equipment 10 may include a package transport unit 50 for moving the package picker 55, and the package transport unit 50 may include a package picker carrier 52 for holding the package picker 55. For example, the package transport unit 50 may include a Cartesian robot for moving the package picker carrier 52 in the horizontal and vertical directions.

[0080] The semiconductor package cutting and sorting equipment 10 may include a cleaning unit 60 for cleaning individualized semiconductor packages 2. A package transfer unit 50 picks up the semiconductor package 2 via a package picker 55 and moves the picker 55 above the cleaning unit 60, whereby the cleaning unit 60 removes foreign matter from the semiconductor package 2 using brushes and cleaning fluid. Additionally, the cleaning unit 60 can dry the semiconductor package 2 by spraying gas onto it.

[0081] After cleaning and drying the semiconductor package 2, the package transfer unit 50 can transfer the semiconductor package 2 to the sorting module 30. For example, the sorting module 30 may include a tray 31 for supporting the semiconductor package 2, and the package transfer unit 50 can transfer the semiconductor package 2 onto the tray 31.

[0082] The sorting module 30 may include a table conveying unit 32 for moving the pallet stage 31 in the horizontal direction and a video unit 35 disposed above the conveying path of the pallet stage 31 for inspecting the semiconductor package 2 on the pallet stage 31.

[0083] The sorting module 30 may include a tray 71 for receiving semiconductor packages 2 that are determined to be good by the video unit 35, and a container 75 for receiving semiconductor packages 2 that are determined to be defective. Additionally, the sorting module 30 may include a tray transfer unit 72 for moving the tray 71.

[0084] The workbench transfer unit 32 and the tray transfer unit 72 can move the pallet table 31 and the tray 71 to the sorting area. The sorting module 30 may include a chip picker 85 for receiving semiconductor packages 2 into the tray 71 and the container 75, and a chip picker transfer unit 80 for moving the chip picker 85. Additionally, the sorting module 30 may include a tray supply unit 70 for supplying the tray 71.

[0085] The semiconductor element picking device and its operation control method proposed in this invention can be applied to the technology of conveying semiconductor elements in semiconductor package cutting and sorting equipment as described above.

[0086] Preferably, the present invention can be applied to situations where multiple vacuum pickups of a semiconductor element pickup device are guided at a pickup height for performing a pickup operation on multiple semiconductor elements and at a placement height for performing a placement operation on multiple semiconductor elements.

[0087] The semiconductor element pickup device according to the present invention will be observed more specifically through embodiments.

[0088] Figure 2 A structural diagram of an embodiment of the semiconductor element pickup device according to the present invention is shown. Figure 3 An example of a semiconductor element pickup device according to the present invention is shown.

[0089] The semiconductor element mentioned below, as a material picked up and transferred by a semiconductor element pickup device, may include a semiconductor package.

[0090] The semiconductor device pickup device 100 may include a plurality of vacuum pickups 110. The plurality of vacuum pickups 110 can simultaneously transport a plurality of semiconductor devices, and may include a plurality of vacuum pickups 110a, 110b, 110c, ..., 110n corresponding to a column for transporting a plurality of semiconductor devices arranged in a column, or may include a plurality of vacuum pickups 110a, 110b, 110c, ..., 110n corresponding to a plurality of rows and columns for transporting a plurality of semiconductor devices arranged in a plurality of rows and columns.

[0091] In the Figure 3 For ease of explanation, multiple vacuum pickups 110a, 110b, 110c, 110d, and 110e are shown arranged in a column. The number of vacuum pickups arranged in a column can be changed as needed.

[0092] Referring to the above Figure 2 and the Figure 3 To observe the structure of the semiconductor component pickup device 100, the semiconductor component pickup device 100 may include multiple vacuum pickups 110a, 110b, 110c, 110d, 110e, a vertical drive unit 120, a support plate 130, a horizontal drive unit 140, etc.

[0093] Each vacuum pickup 110a, 110b, 110c, 110d, and 110e can pick up and transfer semiconductor elements arranged at a certain interval using vacuum pressure. The spacing between the multiple vacuum pickups 110a, 110b, 110c, 110d, and 110e can be adjusted according to the spacing of the arranged semiconductor elements.

[0094] The vertical drive unit 120 may include a linear motor (not shown) that moves the vacuum pickup 110 up and down in the vertical direction. The lifting and lowering of the vacuum pickup 110 can be controlled by controlling the operation of the linear motor using the pickup control unit 150. The vertical drive unit 120 can simultaneously move multiple vacuum pickups 110a, 110b, 110c, 110d, and 110e up and down.

[0095] The support plate 130 can be connected to the vertical drive unit 120 to support a plurality of vacuum pickups 110a, 110b, 110c, 110d, and 110e. The vertical drive unit 120 moves up and down on the support plate 130, thereby allowing the plurality of vacuum pickups 110a, 110b, 110c, 110d, and 110e to move up and down.

[0096] The horizontal drive unit 140 can move the support plate 130 in the horizontal direction. The horizontal drive unit 140 can perform horizontal movement operations under the control of the pickup control unit 150. The horizontal drive unit 140 may include a moving track (not shown) that supports the movement of the support plate 130 and a motor (not shown) that moves the support plate 130 in the execution direction.

[0097] The horizontal drive unit 140 moves the support plate 130 in the horizontal direction, thereby enabling the plurality of vacuum pickups 110a, 110b, 110c, 110d, and 110e to move in the horizontal direction.

[0098] Each vacuum pickup 110a, 110b, 110c, 110d, and 110e may include a pickup body 112a and a suction head 114a. The pickup body 112a may be connected to a vertical drive unit 120 and moved vertically via the vertical drive unit 120. The suction head 114a may be connected below the pickup body 112a and is supplied with a vacuum pressure for vacuum adsorption of semiconductor devices.

[0099] The vacuum pressure applied to each suction head 114a can be provided by the pickup vacuum monitoring unit 160, which can measure the vacuum pressure level of each suction head 114a. Furthermore, the vacuum pressure of each vacuum pickup 110a, 110b, 110c, 110d, and 110e measured in the pickup vacuum monitoring unit 160 can be provided to the pickup control unit 150.

[0100] The sensor unit 170 may optionally include a video sensor 170a and a ranging sensor 170b.

[0101] The video sensor 170a may include a camera or the like, and may capture images of the vacuum pickup 110 from below or to the side.

[0102] The distance sensor 170b can measure the distance between points below the vacuum pickup 110. The distance sensor 170b can measure distance using various methods, such as light sensing or sound wave sensing.

[0103] The pickup control unit 150 can calibrate and set the pickup height for pickup work and the placement height for placement work based on the measurement values ​​of the vacuum pickup 110 obtained by the sensor units 170 such as the video sensor 170a and the distance sensor 170b.

[0104] In this invention, it is possible to confirm the vacuum pressure conditions of all multiple vacuum pickups without prior information about the semiconductor components and to correct the pickup height based on them. Furthermore, in the case where multiple vacuum pickups have picked up multiple semiconductor components based on the pickup height, the thickness of the semiconductor components is determined based on the measurement value of the lower surface of the semiconductor components, and the placement height is corrected accordingly.

[0105] Such pickup height correction and placement height correction can be performed by the pickup control unit 150. Figure 4 A structural diagram showing an embodiment of the pickup control section of a semiconductor element pickup device according to the present invention is provided.

[0106] The pickup control unit 150 may include a pickup height setting unit 151, a placement height setting unit 153, a pickup status determination unit 155, etc. In addition, the pickup control unit 150 may include a structure for controlling the vertical and horizontal movement of the vacuum pickup 110, the description of which is omitted.

[0107] The pickup height setting unit 151 can confirm the vacuum pressure of each of the plurality of vacuum pickups 110 and set the pickup height based on the height of a reference time point when the vacuum pressure of all the plurality of vacuum pickups 110 meets the reference value.

[0108] The placement height setting unit 153 can determine the thickness of a semiconductor element based on the measured value of the lower surface of the semiconductor element obtained by the sensor unit 170 for a plurality of vacuum pickups 110 that have adsorbed a plurality of semiconductor elements based on the pickup height set in the pickup height setting unit 151, and set the placement height of the plurality of vacuum pickups 110 based on the thickness of the semiconductor element.

[0109] As an example, the placement height setting unit 153 can capture images of the lower surface of the semiconductor element using the video sensor 170a of the sensor unit 170, set the height of the location where the captured image with the set focus is obtained as a reference height, and calculate the thickness of the semiconductor element based on the reference height.

[0110] As another example, the placement height setting unit 153 can measure the distance between itself and the lower surface of the semiconductor element by the distance measuring sensor 170b of the sensor unit 170, set the distance as a reference height, and calculate the thickness of the semiconductor element based on the reference height.

[0111] The pickup status determination unit 155 can determine the status of multiple vacuum pickups 110.

[0112] As an example, the pickup status determination unit 155 can grasp the overall position pattern based on the position information of each of the multiple vacuum pickups 110, and determine whether the multiple vacuum pickups are abnormal based on the position pattern.

[0113] Furthermore, the pickup status determination unit 155 can provide the determined status information of the vacuum pickup 110 to various devices such as the central management device, the semiconductor component pickup device's work presentation device, and the manager's terminal.

[0114] Regarding the determination of the status of multiple vacuum pickups 110 and the correction of pickup height and placement height in the semiconductor element pickup device 100 according to the present invention, the following will observe in more detail through an embodiment of the operation control method of the semiconductor element pickup device according to the present invention.

[0115] The operation control method of the semiconductor element pickup device according to the present invention is implemented in the semiconductor element pickup device according to the present invention as previously observed, and will be described below together with reference to an embodiment of the semiconductor element pickup device according to the present invention.

[0116] Figure 5 A schematic flowchart illustrating an embodiment of an operation control method for a semiconductor element pickup device according to the present invention is shown.

[0117] The operation control method of the semiconductor element pickup device according to the present invention may include a process of determining the state of a plurality of vacuum pickups 110 (S100), a process of correcting and setting the pickup height of the plurality of vacuum pickups 110 (S200), and a process of correcting and setting the placement height of the plurality of vacuum pickups 110 (S300).

[0118] While all of the above processes can be executed sequentially, specific processes can also be executed individually depending on the situation.

[0119] The execution processes of the semiconductor element pickup device operation control method according to the present invention are observed sequentially through embodiments.

[0120] Figure 6 A flowchart illustrating an embodiment of the state determination process of the vacuum pickup in the operation control method of the semiconductor element pickup device according to the present invention is shown. Figures 7 to 12This paper illustrates one example of various methods for determining the state of a vacuum pickup in the operation control method of a semiconductor element pickup device according to the present invention.

[0121] The Figures 7 to 12 This is an embodiment of multiple vacuum pickups consisting of 4 rows and 8 columns. For ease of explanation, only 8 multiple vacuum pickups 110a to 110h corresponding to one column of a specific row are shown and explained.

[0122] The pickup control unit 150 can measure the height of each of the plurality of vacuum pickups 110a to 110h (S111) and obtain the position information of each of the plurality of vacuum pickups 110a to 110h (S113).

[0123] As an example, the height measurement of each of the multiple vacuum pickups 110a to 110h can be used to determine the vacuum pressure reference value of each of the multiple vacuum pickups 110a to 110h at a time point when they descend onto the fixed plate 200, and position information can be obtained based on the descent height of each of the multiple vacuum pickups 110a to 110h.

[0124] As another example, it is also possible to use a video sensor to capture images of multiple vacuum pickups 110a to 110h from below or to the side, and to determine the relative height of each of the multiple vacuum pickups 110a to 110h based on the captured images, thereby obtaining the position information of each of the multiple vacuum pickups 110a to 110h.

[0125] As another example, the height of each of the multiple vacuum pickups 110a to 110h can be determined by measuring the distance between them below the multiple vacuum pickups 110a to 110h using a range sensor, and position information can be obtained based on this.

[0126] The pickup control unit 150 can grasp a position pattern based on the position information of each of the multiple vacuum pickups 110a to 110h and compare the position pattern with a set range to determine whether the multiple vacuum pickups 110a to 110h are in an abnormal state. Here, the set range can be set to the allowable height difference between the multiple vacuum pickups 110a to 110h that can form a stable operation when the same pickup height or the same placement height is applied to each of the multiple vacuum pickups 110a to 110h for pickup or placement operations.

[0127] If the position pattern presents a change pattern that deviates from the set range (S121), the pickup control unit 150 can analyze the position pattern (S123) to grasp the shape of the change pattern and determine the corresponding abnormal state (S125), thereby providing the status information of multiple vacuum pickups 110a to 110h to the manager, etc. (S127).

[0128] As for the case where the positional pattern has a directional property that changes to one side, refer to the above. Figure 7 as well as Figure 8 .

[0129] As described Figure 7 As shown in (a), the pickup control unit 150 can lower multiple vacuum pickups 110a to 110h onto the fixed plate 200 while the pickup vacuum monitoring unit 160 monitors the position pattern based on the vacuum pressure measurement value of each of the multiple vacuum pickups 110a to 110h.

[0130] As described Figure 7 As in (b), when the vacuum pickups in the right column and the vacuum pickups in the left column exceed the set range, and the position of the vacuum pickups gradually decreases as they move from the right column to the left column, and such a directional change pattern is presented approximately as a whole in the multiple vacuum pickups in each row, it can be determined that the state requires the overall assembly and inspection of multiple vacuum pickups 110a to 110h.

[0131] Then, the abnormal status judgment result for such a location pattern can be provided to managers, etc. The abnormal status judgment result can be provided to managers, etc., as described above. Figure 8 The inspection that resulted in multiple vacuum pickups 110a to 110h being tilted in one direction can be managed by adjusting the positions of all vacuum pickups 110a to 110h to ensure that all positions of the multiple vacuum pickups 110a to 110h meet the set range.

[0132] In the case where the positional pattern has a high-low pattern, refer to the above. Figure 9 as well as Figure 10 .

[0133] As described Figure 9 As shown in (a), the pickup control unit 150 can lower multiple vacuum pickups 110a to 110h onto the fixed plate 200 while the pickup vacuum monitoring unit 160 monitors the position pattern based on the vacuum pressure measurement value of each of the multiple vacuum pickups 110a to 110h.

[0134] As described Figure 9As in (b), when the vacuum pickups in the right or left column and the middle vacuum pickup exceed the set range, and the position of the vacuum pickups has a high-low pattern, and such a high-low pattern is presented approximately as a whole in the multiple vacuum pickups in each row, it can be determined that the overall assembly direction of the multiple vacuum pickups 110a to 110h needs to be checked.

[0135] Then, the abnormal status judgment result for such a location pattern can be provided to managers, etc. The abnormal status judgment result can be provided to managers, etc., as described above. Figure 10 This way, multiple vacuum pickups 110a to 110h with high and low positions can be inspected. By adjusting the directionality of multiple vacuum pickups 110a to 110h, the positions of all multiple vacuum pickups 110a to 110h can be managed to meet the set range.

[0136] If, although the position pattern does not present a certain change pattern, it presents a form that deviates from the set range in a specific part (S131), the pickup control unit 150 can grasp the vacuum pickup in the specific part that deviates from the set range (S133), and can determine the abnormal state of the grasped vacuum pickup (S135) and provide its status information to the manager, etc. (S137).

[0137] As for the case where the positional pattern changes in a specific part, refer to the above. Figure 11 as well as Figure 12 .

[0138] As mentioned above Figure 7 as well as Figure 8 Similarly, in the above Figure 11 In (a), the pickup control unit 150 can lower multiple vacuum pickups 110a to 110h onto the fixed plate 200 while the pickup vacuum monitoring unit 160 monitors the position pattern based on the vacuum pressure measurement value of each of the multiple vacuum pickups 110a to 110h.

[0139] As described Figure 11 As in (b), when the fourth vacuum pickup 110d among the multiple vacuum pickups 110a to 110h arranged in the second row has a position outside the set range, and the seventh vacuum pickup 110g is still in the initial position and does not descend, it is possible to determine that the fourth vacuum pickup 110d and the seventh vacuum pickup 110g are in an abnormal state by identifying the vacuum pickups that have not left the set range or have not moved in position.

[0140] Then, the abnormal state judgment results of the vacuum pickups 110d and 110g in response to such abnormal states can be provided to the administrator, etc. The abnormal state judgment results can be provided to the administrator, etc., as described above. Figure 12 The inspection of vacuum pickups 110d and 110g that are in an abnormal state among the multiple vacuum pickups 110a to 110h can be managed so that the positions of all vacuum pickups 110a to 110h meet the set range by selectively maintaining the vacuum pickups 110d and 110g that are in an abnormal state.

[0141] When the position pattern meets the set range (S141), the pickup control unit 150 can determine that the multiple vacuum pickups 110a to 110h are in normal condition (S145).

[0142] The above process can be used to determine the status of multiple vacuum pickups 110a to 110h installed in the semiconductor element pickup device 100.

[0143] Regarding the process of calibrating and setting the pickup height of multiple vacuum pickups 110, Figure 13 A flowchart illustrating an embodiment of the pickup height correction process of the vacuum pickup unit in the operation control method of the semiconductor element pickup device according to the present invention is shown. Figure 14 An example of correcting the pickup height of a vacuum pickup unit in the operation control method of the semiconductor element pickup device according to the present invention is shown.

[0144] The pickup control unit 150 can determine the initial height of the multiple vacuum pickups 110a to 110h by measuring the height of the multiple vacuum pickups 110a to 110h through the sensor unit 170 (S210) (S220).

[0145] Then, the pickup control unit 150 can lower the plurality of vacuum pickups 110a to 110h in order to correct the pickup height (S230) while the pickup vacuum monitoring unit 160 confirms the vacuum pressure of each of the plurality of vacuum pickups 110a to 110h (S240).

[0146] Here, multiple vacuum pickups 110a to 110h can be lowered toward a set plate that is not in the state of having semiconductor elements. Alternatively, multiple vacuum pickups 110a to 110h can be lowered toward an area where multiple semiconductor elements are arranged.

[0147] The pickup control unit 150 can lower multiple vacuum pickups 110a to 110h until the vacuum pressure of all multiple vacuum pickups 110a to 110h meets the reference value, and determine the reference time point when the vacuum pressure of all multiple vacuum pickups 110a to 110h meets the reference value (S250), and set the pickup height of multiple vacuum pickups 110a to 110h based on the descent height at the reference time point (S260).

[0148] The pickup height can be set based on the minimum thickness of the semiconductor element being picked up. That is, the pickup height can be set to drop to a position higher than the minimum thickness of the semiconductor element.

[0149] Regarding the pickup height correction process, please refer to the following... Figure 14 The pickup control unit 150 can lower multiple vacuum pickups 110a to 110h toward the set plate 200, which is in a state without semiconductor elements, as described above. Figure 14 Even if the vacuum pressure of some of the multiple vacuum pickups 110a to 110h, such as vacuum pickups 110c, 110f, and 110g, meets the reference value, but the vacuum pressure of the remaining vacuum pickups 110a, 110b, 110d, 110e, and 110h does not reach the reference value, as in (a), the vacuum pickups 110a, 110b, 110d, 110e, and 110h continue to decrease until they reach the value described above. Figure 14 (b) up to the point in time when all the vacuum pressures of the multiple vacuum pickups 110a to 110h reach the reference value.

[0150] Then, the pickup control unit 150 can set the descent height at the time point when all the vacuum pressures of the multiple vacuum pickups 110a to 110h reach the reference value as the pickup height of the multiple vacuum pickups 110a to 110h.

[0151] The following section will examine the process of calibrating and setting the placement height of the multiple vacuum pickups 110, distinguishing between cases applicable to video sensors and cases applicable to range sensors.

[0152] Figure 15 The flowchart illustrates an embodiment of the process for correcting the placement height of a vacuum pickup via a video sensor in the operation control method of a semiconductor element pickup device according to the present invention. Figures 16 to 18 An example is shown of a method for controlling the operation of a semiconductor element pickup device according to the present invention, in which the placement height of a vacuum pickup is corrected by a video sensor.

[0153] The pickup control unit 150 can lower multiple vacuum pickups 110a to 110h and pick up multiple semiconductor devices 300 based on a preset pickup height for placement height correction. Then, as described... Figure 16 This causes the multiple vacuum pickups 110a to 110h, which have the semiconductor element 300 adsorbed on them, to move to a position above the video sensor 170a (S311).

[0154] The pickup control unit 150 can move multiple vacuum pickups 110a to 110h vertically (S312) while simultaneously capturing images of the lower surface of the semiconductor element 300 adsorbed on the lower surface of the vacuum pickups 110a to 110h via the video sensor 170a (S313).

[0155] Multiple vacuum pickups 110a to 110h can be repeatedly moved vertically (S312) until the captured image obtained by the video sensor 170a satisfies the set focus (S314).

[0156] Here, "focus satisfaction" in image capture can mean that, when a semiconductor package is used as a semiconductor element, the image quality of the captured image taken from a ball positioned on the lower surface of the semiconductor package meets a certain level.

[0157] The pickup control unit 150 can set the height of the location where the captured image satisfies the set focus as a reference height (S315), and determine the thickness of the semiconductor element based on the reference height (S316).

[0158] Regarding the process of determining the thickness of semiconductor components, please refer to the following... Figure 17 In the Figure 17 In (a) and (b), the distance FD that satisfies the set focus can be the same in the captured images taken by the same video sensor 170a.

[0159] When picking up and adsorbing semiconductor packages 300a1 and 300a2 with different thicknesses, the distance by which the vacuum pickup 110 lowers the focal distance FD to satisfy the set focus for image capture will differ due to the thickness difference. The vacuum pickup picking up the relatively thin semiconductor package 300a1 (thickness D11) will lower the semiconductor package thickness difference S1 more than the vacuum pickup picking up the relatively thick semiconductor package 300a2 (thickness D12) in order to capture an image that satisfies the set focus.

[0160] Through this process, the thicknesses D11 and D12 of the semiconductor packages 300a1 and 300a2 can be determined based on the descent distance of the vacuum pickup 110 at the location where the focus of the captured image is set.

[0161] Furthermore, height differences may occur due to various factors such as the flatness of the lower surface of the semiconductor package and the size of the formed sphere. For example, referring to the above... Figure 18 When the height is determined based on the positioned sphere in an image captured on the lower surface of the semiconductor package, differences may arise in the minimum height (Min), maximum height (Max), and average height (Avg). Such height differences can be appropriately compensated for by considering various factors such as the contents of the applicable semiconductor package transport equipment, the size or characteristics of the semiconductor package to be transported, etc. Alternatively, the administrator may configure the system to select any one of the minimum height (Min), maximum height (Max), and average height (Avg) considering the aforementioned factors.

[0162] If the thickness of the semiconductor element is known (S316), the pickup control unit 150 can simultaneously consider the preset pickup height and the thickness of the semiconductor element to set the placement height of multiple vacuum pickups 110a to 110h (S317). For example, the placement height can be set by subtracting the thickness of the semiconductor element from the preset pickup height.

[0163] In this way, the placement of semiconductor components can be performed by applying a set placement height to multiple vacuum pickups 110a to 110h (S330).

[0164] Figure 19 The flowchart illustrates an embodiment of the process for correcting the placement height of a vacuum pickup via a distance sensor in the operation control method of a semiconductor element pickup device according to the present invention. Figure 20 as well as Figure 21 An example is shown in the operation control method of the semiconductor element pickup device according to the present invention, in which the placement height of the vacuum pickup is corrected by a distance sensor.

[0165] The pickup control unit 150 can lower multiple vacuum pickups 110a to 110h and pick up multiple semiconductor devices 300 based on a preset pickup height for placement height correction. Then, as described... Figure 20 This causes the multiple vacuum pickups 110a to 110h, which have the semiconductor element 300 adsorbed, to move to a position above the ranging sensor 170b (S321).

[0166] The pickup control unit 150 can measure the distance between the semiconductor element 300 adsorbed on the lower surface of the vacuum pickup 110a to 110h and the lower surface of the semiconductor element 300 by the distance sensor 170b (S322) and set the measured distance as the reference height (S323).

[0167] Then the pickup control unit 150 can determine the thickness of the semiconductor element based on the reference height (S324).

[0168] Regarding the process of determining the thickness of semiconductor components, please refer to the following... Figure 21 In the Figure 21 In (a) and (b), when the vacuum pickup 110, which has picked up and adsorbed semiconductor packages 300b1 and 300b2 of different thicknesses, is located at a set pickup height, if the distance between the vacuum pickup 110 and the lower surface of the semiconductor packages 300b1 and 300b2 is measured by the distance sensor 170b, the distance measured by the distance sensor 170b will be different due to the thickness difference of the semiconductor packages 300b1 and 300b2.

[0169] The separation distance H1 between the lower surface of the relatively thin semiconductor package 300b1 with a thickness of D21 can be measured to be higher than the separation distance H2 between the lower surface of the relatively thick semiconductor package 300a2 with a thickness of D12, which is greater than the thickness difference of the semiconductor package.

[0170] Therefore, the thicknesses D21 and D22 of the semiconductor packages 300b1 and 300b2 can be determined based on the position of the vacuum pickup 110 and the distances H1 and H2 between the vacuum pickup and the lower surfaces of the semiconductor packages 300b1 and 300b2 as measured by the distance sensor 170b.

[0171] If the thickness of the semiconductor element is known (S324), the pickup control unit 150 can simultaneously consider the preset pickup height and the thickness of the semiconductor element to set the placement height of multiple vacuum pickups 110a to 110h (S325). For example, the placement height can be set by subtracting the thickness of the semiconductor element from the preset pickup height.

[0172] In this way, the placement of semiconductor components can be performed by applying a set placement height to multiple vacuum pickups 110a to 110h (S330).

[0173] Furthermore, the thickness information of the semiconductor element obtained through the process of observing and determining the thickness of the semiconductor element can be reflected in the preset pickup height to correct and reset the pickup height.

[0174] After setting the pickup height and placement height of the vacuum pickup according to the present invention as observed above, a guidance process for the pickup height and placement height is performed, thereby executing a semiconductor element transfer process through the semiconductor element pickup device.

[0175] According to this invention, in a semiconductor element pickup device for conveying semiconductor elements, when performing pickup and placement operations with a vacuum pickup, a method is available to set the pickup height and placement height even without prior information about the semiconductor elements, enabling the accurate pickup and placement of the semiconductor elements.

[0176] In particular, in this invention, by knowing the thickness of the semiconductor element and reflecting the thickness of the semiconductor element to correct the accurate height, it is possible to eliminate the problem of damage to the semiconductor element or vacuum pickup while accurately picking up and placing the semiconductor element.

[0177] The above description is merely illustrative of the technical concept of the present invention. Those skilled in the art can make various modifications and variations without departing from the essential characteristics of the invention. Therefore, the embodiments described herein are for illustrating the technical concept and not for limiting it; the technical concept of the invention is not limited by such embodiments. The scope of protection of the present invention should be interpreted according to the appended claims, and all technical concepts within the same scope are included within the scope of the claims.

Claims

1. A method for controlling the operation of a semiconductor element pickup device, characterized in that, include: The pickup status determination step determines the status of the multiple vacuum pickups based on the position information of each of the multiple vacuum pickups; The pickup descent step involves lowering multiple vacuum pickups for pickup height correction. The vacuum pressure monitoring step confirms the vacuum pressure of each of the multiple vacuum pickups to determine the reference time point when the vacuum pressure of all the multiple vacuum pickups meets the reference value; and The pickup height setting step involves setting the pickup height of multiple vacuum pickups based on the descent height at the known reference time point. The pickup status determination step includes: The position pattern acquisition step involves acquiring a position pattern based on the position information of each of the multiple vacuum pickups. as well as The abnormal state judgment step determines the abnormal state of multiple vacuum pickups based on the known position pattern.

2. The operation control method of the semiconductor element pickup device according to claim 1, characterized in that, The pickup height setting step is based on the minimum thickness of the semiconductor element to set the pickup height.

3. The operation control method of the semiconductor element pickup device according to claim 1, characterized in that, The picking-up descent step causes the plurality of vacuum pickups to descend toward the fixed plate.

4. The operation control method of the semiconductor element pickup device according to claim 1, characterized in that, The abnormal state determination steps include: When the position pattern has a certain change pattern that deviates from the set range, the step of determining the abnormal state corresponding to the change pattern; and The status information provision step provides abnormal status information for the entire set of vacuum pickups.

5. The operation control method of the semiconductor element pickup device according to claim 1, characterized in that, The abnormal state determination steps include: When the position pattern deviates from a set range in a specific portion, the steps for mastering the vacuum pickup corresponding to the specific portion among the multiple vacuum pickups; and The status information provision step provides abnormal status information of the vacuum pickup that is known.

6. The operation control method of the semiconductor element pickup device according to claim 1, characterized in that, The position pattern acquisition step is based on the vacuum pressure of each of the multiple vacuum pickups to acquire the position information of the multiple vacuum pickups.

7. The operation control method of the semiconductor element pickup device according to claim 1, characterized in that, The position pattern acquisition step acquires the position information of the multiple vacuum pickups based on the distance measurements of each of the multiple vacuum pickups obtained by video sensors or range sensors.

8. The operation control method of the semiconductor element pickup device according to claim 1, characterized in that, The operation control method of the semiconductor element pickup device includes: In the semiconductor element pickup step, multiple vacuum pickups are lowered based on the pickup height for placement height correction, and multiple semiconductor elements are picked up and moved to the position of the sensor section; The semiconductor element thickness determination step determines the thickness of the semiconductor element based on the measured value of the lower surface of the semiconductor element obtained by the sensor unit; and The placement height setting step involves setting the placement height of multiple vacuum pickups based on the pickup height of the vacuum pickup and the thickness of the semiconductor element.

9. The operation control method of the semiconductor element pickup device according to claim 8, characterized in that, The semiconductor element thickness determination step includes: The step of taking a picture of the lower surface of the semiconductor element adsorbed on the vacuum pickup while the vacuum pickup is moved vertically; The step of setting the height of the location where the captured image satisfies the set focus as the reference height; and The step of determining the thickness of the semiconductor element based on the reference height.

10. The operation control method of the semiconductor element pickup device according to claim 8, characterized in that, The semiconductor element thickness determination step includes: The step of measuring the distance between the semiconductor element and the lower surface of the semiconductor element adsorbed on the vacuum pickup by the ranging sensor of the sensor unit; The step of setting the measured separation distance as a reference height; and The step of determining the thickness of the semiconductor element based on the reference height.

11. A semiconductor element pickup device, characterized in that, include: Multiple vacuum pickups are used to transfer multiple arranged semiconductor components; The vacuum monitoring unit of the pickup monitors the vacuum pressure of each of the plurality of vacuum pickups; and The pickup control unit lowers multiple vacuum pickups while setting a pickup height based on a reference time point when the vacuum pressure of all multiple vacuum pickups meets a reference value. For the multiple vacuum pickups that have picked up the states of multiple semiconductor elements based on the pickup height, the unit determines the thickness of the semiconductor element based on the measured value of the lower surface of the semiconductor element, and sets the placement height of the multiple vacuum pickups taking into account the thickness of the semiconductor element. The pickup control unit includes: The pickup status determination unit acquires the position pattern of each of the plurality of vacuum pickups and determines the abnormal status of the plurality of vacuum pickups based on the acquired position pattern.

12. The semiconductor device pickup device according to claim 11, characterized in that, The pickup control unit also includes: The pickup height setting unit confirms the vacuum pressure of each of the plurality of vacuum pickups and sets the pickup height based on the height at a reference time point when the vacuum pressure of all the plurality of vacuum pickups meets the reference value; and The placement height setting unit determines the thickness of the semiconductor element based on a measured value of the lower surface of the semiconductor element for multiple vacuum pickups that have adsorbed multiple semiconductor elements based on the pickup height, and sets the placement height of the multiple vacuum pickups based on the thickness of the semiconductor element.

13. The semiconductor element pickup device according to claim 12, characterized in that, The semiconductor element pickup device further includes: A video sensor captures images of the lower surface of the semiconductor element. The placement height setting unit sets the height of the location where the captured image that satisfies the set focus is obtained as the reference height while the video sensor captures the lower surface of the semiconductor element, and calculates the thickness of the semiconductor element based on the reference height.

14. The semiconductor element pickup device according to claim 12, characterized in that, The semiconductor element pickup device further includes: A ranging sensor measures the distance between itself and the lower surface of the semiconductor element. The placement height setting unit measures the distance between itself and the lower surface of the semiconductor element using the distance sensor, sets the distance as a reference height, and calculates the thickness of the semiconductor element based on the reference height.

15. The semiconductor device pickup apparatus according to claim 11, characterized in that, The pickup status determination unit provides the status information of the vacuum pickup.

16. A method for controlling the operation of a semiconductor element pickup device, characterized in that, include: The pickup status judgment step involves obtaining a position pattern based on the position information of each of the multiple vacuum pickups, and judging the abnormal status of the multiple vacuum pickups based on the obtained position pattern. The pickup descent step involves multiple vacuum pickups descending toward the stationary plate for pickup height correction. The vacuum pressure monitoring step confirms the vacuum pressure of each of the multiple vacuum pickups and determines the reference time point when the vacuum pressure of all the multiple vacuum pickups meets the reference value. The pickup height setting step involves setting the pickup height of multiple vacuum pickups based on the descent height at the reference time point. In the semiconductor element pickup step, multiple vacuum pickups are lowered based on the pickup height for placement height correction, and multiple semiconductor elements are picked up and moved to the position of the sensor section; The semiconductor element thickness determination step determines the thickness of the semiconductor element based on the measured value obtained by the sensor unit relative to the lower surface of the semiconductor element. as well as The placement height setting step involves setting the placement height of multiple vacuum pickups based on the pickup height of the vacuum pickup and the thickness of the semiconductor element.

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