Sensing device and electronic device

Abstract

The application provides a sensor device and an electronic device, the sensor device comprising a substrate, a component and a corrosion-resistant adhesive, a surface of the substrate being provided with a pad; the component being arranged on the substrate, a surface of the component facing the substrate being provided with a welding portion, the welding portion being welded with the pad; and the corrosion-resistant adhesive being arranged between the component and the substrate and surrounding the welding portion. The technical scheme of the application can improve the corrosion resistance of the sensor device.

Description

Technical Field

[0001] This invention relates to the field of component packaging technology, and in particular to a sensor device and an electronic device. Background Technology

[0002] With the development of electronic devices, users have increasingly stringent requirements for their performance, such as waterproofing and corrosion resistance (chlorine water, salt spray, or others). These performance requirements naturally extend to the sensors inside the electronic devices, which need to have good corrosion resistance. Summary of the Invention

[0003] The main objective of this invention is to provide a sensor and electronic device that improves the corrosion resistance of the sensor.

[0004] To achieve the above objectives, the present invention provides a sensor device comprising:

[0005] A substrate, wherein the surface of the substrate is provided with solder pads;

[0006] Components, said components disposed on said substrate, said components having protruding solder portions on the surface of said components facing said substrate, said solder portions being soldered to said solder pads; and

[0007] A corrosion-resistant adhesive is disposed between the component and the substrate, and is arranged around the connection position between the solder part and the pad.

[0008] In one embodiment of this application, the substrate has a solder groove, the solder pad and the soldering portion are located in the solder groove, and the corrosion-resistant adhesive is filled in the solder groove.

[0009] In one embodiment of this application, the solder groove extends to the outside of the component, and the outer edge of the solder groove is spaced apart from the component.

[0010] In one embodiment of this application, the distance L between the outer edge of the solder groove and the component satisfies 30μm≤L≤100μm;

[0011] And / or, the depth h of the weld groove satisfies 20μm≤h≤100μm.

[0012] In one embodiment of this application, the bottom wall of the solder groove is provided with a support protrusion, and the solder pad is disposed on the top surface of the support protrusion and is disposed below the surface of the substrate.

[0013] In one embodiment of this application, the component is a signal pickup chip, the sensing part of the signal pickup chip is disposed facing the substrate, and the soldering part and the solder groove are both located on the periphery of the sensing part;

[0014] The sensing unit and the substrate form a sensing space that connects to the external environment.

[0015] In one embodiment of this application, the surface of the substrate is provided with a clearance groove that communicates with the external environment, the pad is located on the periphery of the clearance groove, and the sensing part on the bottom surface of the signal pickup chip is disposed opposite to the clearance groove.

[0016] In one embodiment of this application, the surface of the signal pickup chip facing the substrate is attached to the substrate, and a connecting groove is formed on the surface of the substrate. The connecting groove extends from the clearance groove to the outside of the component to connect the clearance groove with the external environment.

[0017] In one embodiment of this application, the sensor further includes a housing, which covers the surface of the substrate to form an encapsulation cavity with the substrate. At least one of the housing and the substrate has a communication hole that communicates with the outside and the encapsulation cavity. The component is disposed in the encapsulation cavity.

[0018] And / or, the component is an ASIC chip or a MEMS chip.

[0019] This application also proposes an electronic device comprising a sensor as described in any of the preceding claims.

[0020] The technical solution of the present invention involves wrapping corrosion-resistant adhesive around the connection position between the soldering part of the component and the substrate pad when the component is soldered to the substrate. This protects the connection position between the soldering part and the pad, prevents the soldering part from being corroded, improves the corrosion resistance of the sensor, and enhances the connection strength between the soldering part and the substrate pad through the corrosion-resistant adhesive. Attached Figure Description

[0021] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0022] Figure 1 This is a structural diagram of an embodiment of the present invention;

[0023] Figure 2 for Figure 1 Enlarged view of point A in the middle;

[0024] Figure 3 for Figure 1 Enlarged view of point B in the middle.

[0025] Explanation of icon numbers:

[0026] 100 Sensor devices 31 ASIC chips 10 substrate 33 MEMS chip 11 solder pads 35 Welding section 13 Welding pool 50 Corrosion-resistant adhesive 15 clearance slot 70 shell 17 Support protrusion 71 Encapsulation cavity 30 Components 73 Connecting hole

[0027] The realization of the objective, functional features and advantages of the present invention will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0028] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present invention.

[0029] It should be noted that all directional indications (such as up, down, left, right, front, back, etc.) in the embodiments of the present invention are only used to explain the relative positional relationship and movement of each component in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indication will also change accordingly.

[0030] In this invention, unless otherwise explicitly specified and limited, the terms "connection," "fixed," etc., should be interpreted broadly. For example, "fixed" can mean a fixed connection, a detachable connection, or an integral part; it can mean a mechanical connection or an electrical connection; it can mean a direct connection or an indirect connection through an intermediate medium; it can mean the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0031] Furthermore, in this invention, descriptions involving "first," "second," etc., are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of that feature. Additionally, the technical solutions of the various embodiments can be combined with each other, but only on the basis of being achievable by those skilled in the art. When the combination of technical solutions is contradictory or impossible to implement, such a combination of technical solutions should be considered non-existent and not within the scope of protection claimed by this invention.

[0032] The present invention proposes a sensor device 100.

[0033] Please refer to Figures 1 to 3 In some embodiments of the sensor device 100 of this application, the sensor device 100 includes:

[0034] Substrate 10, wherein the surface of substrate 10 is provided with pads 11;

[0035] Component 30, wherein the component 30 is disposed on the substrate 10, and the surface of the component 30 facing the substrate 10 has a protruding solder portion 35, the solder portion 35 being soldered to the solder pad 11; and

[0036] The corrosion-resistant adhesive 50 is disposed between the component 30 and the substrate 10, and is disposed around the connection position between the solder part 35 and the solder pad 11.

[0037] The sensor device 100 proposed in this application includes a substrate 10 and components 30. The substrate 10 is generally a circuit board, which includes an insulating dielectric layer and at least one circuit layer embedded in the insulating dielectric layer, as well as pads 11 embedded in the insulating dielectric layer and connected to the circuit layer. The components 30 can be resistors, capacitors, inductors, potentiometers, optoelectronic devices, sensor chips, relays, IC chips (Integrated Circuit Chips), etc. The components 30 are mounted on the substrate 10 by surface mounting technology. The surface of the components 30 facing the substrate 10 has a protruding solder portion 35, which is used to form a solder connection with the pads 11 on the surface of the substrate 10, thereby mounting the components 30 on the substrate 10 and realizing the signal connection between the components 30 and the substrate 10. The solder portion 35 is generally a solder ball, but it can also be other structural forms. During the soldering process, due to the influence of high temperature, the solder portion 35 may also melt or deform. Therefore, the specific form and structure of the solder portion 35 are not specifically limited here.

[0038] Furthermore, in this embodiment, a corrosion-resistant adhesive 50 is wrapped around the periphery of the welding portion 35. The corrosion-resistant adhesive 50 can be epoxy resin, silicone sealant, organic silicone, or sealant, etc. The corrosion-resistant adhesive 50 acts as an insulating layer, isolating the welding portion 35 and the welding area between the pad 11 and the welding portion 35 from the external environment. This protects the connection between the component 30 and the substrate 10, preventing corrosion from moisture or other substances, thereby improving the corrosion resistance of the connection between the component 30 and the substrate 10, and increasing its service life and performance stability. Additionally, the corrosion-resistant adhesive 50 also serves to bond the substrate 10 and the component 30, strengthening the connection between them. The corrosion-resistant adhesive 50 can either cover only the periphery of the welding part 35 or completely fill the space between the component 30 and the substrate 10, depending on the type of component 30 and actual requirements. For example, for a flip-chip packaged MEMS chip 33, its sensing part faces the substrate 10. In this case, the sensing part of the MEMS chip 33 should be avoided. At this time, a suitable avoidance area needs to be set between the substrate 10 and the component 30 and the avoidance area should be connected to the external environment. Therefore, the corrosion-resistant adhesive 50 cannot be completely filled between the MEMS chip 33 and the substrate 10.

[0039] Therefore, it can be understood that in the technical solution of the present invention, when the component 30 is soldered to the substrate 10, corrosion-resistant adhesive 50 is wrapped around the connection position between the solder part 35 of the component 30 and the pad 11 of the substrate 10 to protect the connection position between the solder part 35 and the pad 11, prevent the solder part 35 from being corroded, improve the corrosion resistance of the sensor 100, and improve the connection strength between the solder part 35 and the pad 11 of the substrate 10 through the corrosion-resistant adhesive 50.

[0040] Reference Figure 1 and Figure 3 In one embodiment of this application, the substrate 10 has a solder groove 13, the solder groove 13 is located on the periphery of the clearance groove 15, the solder pad 11 and the welding part 35 are located in the solder groove 13, and the corrosion resistant adhesive 50 is filled in the solder groove 13.

[0041] In the aforementioned embodiment, component 30 is welded to pad 11 of substrate 10 via welding part 35, and corrosion-resistant adhesive 50 is applied to the connection position between welding part 35 and pad 11. In this embodiment, a solder groove 13 is formed on the surface of substrate 10, so that pad 11 is disposed in the solder groove 13, thereby allowing welding part 35 to be embedded in solder groove 13 and connected to pad 11. Corrosion-resistant adhesive 50 is poured into solder groove 13 to cover welding part 35 and the connection position between welding part 35 and pad 11. With this configuration, component 30 and substrate 10 are not only fixed by welding and bonding, but also connected by the insertion relationship between welding part 35 and solder groove 13. This insertion relationship can be used to position and limit the installation of component 30, improving the connection strength between component 30 and substrate 10. At the same time, corrosion-resistant adhesive 50 is applied to the solder groove 13 to cover the welding part 35 and the connection position between welding part 35 and pad 11. The etching adhesive 50 is poured into the solder bath 13 to prevent it from flowing before it solidifies, thus failing to provide adequate protection for the solder joint 35 and the connection between the solder joint 35 and the pad 11. It also prevents the etching adhesive 50 from flowing to other areas of the substrate 10 and affecting the performance of the sensor 100. For example, in the following embodiment, when component 30 is a signal pickup chip and is fixed to the substrate 10 via flip-chip packaging, the sensing part of the signal pickup chip, used to sense external signals, faces the substrate 10. If the etching adhesive 50 flows to the sensing part area, it will affect the sensing sensitivity of the sensing part and the signal acquisition. In other words, the solder bath 13 in this embodiment not only improves the connection strength between component 30 and the substrate 10 but also effectively restricts the flow of the etching adhesive 50, thereby ensuring that the etching adhesive 50 effectively covers the solder joint 35 and the connection between the solder joint 35 and the pad 11.

[0042] It should be noted that when the welding part 35 is provided in the welding tank 13, the surface of the component 30 facing the substrate 10 can be attached to the substrate 10 or can be spaced apart from the substrate 10, and no specific limitation is made here.

[0043] Reference Figure 3 In one embodiment of this application, the solder groove 13 extends to the outside of the component 30, and the outer edge of the solder groove 13 is spaced apart from the component 30.

[0044] In this embodiment, the solder groove 13 for embedding the solder part 35 and filling the corrosion resistant adhesive 50 extends from the bottom of the component 30 to the outside of the component 30, and the edge of the outer extension end of the solder groove 13 is spaced apart from the component 30. This makes part of the groove of the solder groove 13 exposed on the outside of the component 30, which facilitates the pouring of corrosion resistant adhesive 50 into the solder groove 13 and improves the convenience of component 30 encapsulation.

[0045] In one embodiment of this application, the distance L between the outer edge of the solder groove 13 and the component 30 satisfies 30μm≤L≤100μm;

[0046] And / or, the depth h of the weld groove 13 satisfies 20μm≤h≤100μm.

[0047] In the aforementioned embodiment, the solder groove 13 extends to the outside of the component 30 so that part of the groove opening of the solder groove 13 is located on the outside of the component 30, thereby facilitating the filling of the solder groove 13 with corrosion-resistant adhesive 50. In this embodiment, the distance from the edge of the end of the solder groove 13 extending to the outside of the component 30 to the edge closest to the component 30 is defined as L, and L satisfies 30μm≤L≤100μm. At this time, L can take any value of 30μm, 40μm, 50μm, 60μm, 70μm, 80μm, 90μm, 100μm or any value between 30μm and 100μm, without limitation. If L is less than 30μm, the groove opening of the solder groove 13 exposed on the outside of the component 30 is small, and the filling of corrosion-resistant adhesive 50 is inconvenient. If L is greater than 100μm, the solder groove occupies a large space on the substrate 10, which will also increase the volume of the sensor 100. This ensures that L is between 30μm and 100μm, making it easy to inject the corrosion-resistant adhesive 50. The weld groove 13 has enough space to fill the corrosion-resistant adhesive 50, which provides good protection and adhesion, and also prevents the sensor component 100 from being too large.

[0048] In some embodiments, the depth h of the weld pool 13 satisfies 20μm≤h≤100μm. In this case, h can take any value between 20μm, 30μm, 40μm, 50μm, 60μm, 70μm, 80μm, 90μm, 100μm, or 20μm to 100μm, and is not limited here. If the depth h of the weld pool 13 is less than 20μm, the internal space of the weld pool 13 is small, the amount of corrosion-resistant adhesive 50 that can be filled is small, and for some components 30 with higher weld portions 35, it is impossible to... The solder groove 13 provides good positioning and protection for the welded part 35. If the groove depth h is greater than 100μm, it may damage the circuit layer inside the substrate 10 or require increasing the thickness of the substrate 10. A depth h between 20μm and 100μm ensures that the solder groove 13 has sufficient depth to accommodate the welded part 35 and the corrosion-resistant adhesive 50, providing good protection for the connection between the welded part 35 and the pad 11, while also reducing the risk of damage during processing and allowing for a reduction in the thickness of the substrate 10. The specific depth of the solder groove 13 can be set according to the height of the welded part 35 and actual requirements, and is not limited here.

[0049] Reference Figure 3In one embodiment of this application, the bottom wall of the solder groove 13 is provided with a support protrusion 17, and the solder pad 11 is disposed on the top surface of the support protrusion 17 and is disposed below the surface of the substrate 10.

[0050] Understandably, the height of the soldering part 35 varies for different components 30. If the depth of the soldering groove 13 is much greater than the height of the soldering part 35 in order to provide sufficient space for filling the corrosion-resistant adhesive 50, there may be a problem that the soldering part 35 and the solder pad 11 cannot be properly connected. In this embodiment, the inside of the soldering groove 13 is designed with a stepped structure, and a support protrusion 17 is provided on the bottom wall of the soldering groove 13, so that the solder pad 11 is placed on the top surface of the support protrusion 17. This design allows for a deeper space in the soldering groove 13 to fill the corrosion-resistant adhesive 50, thus fully covering the components. The coating on the connection between the soldering part 35 and the pad 11 provides good protection. The support protrusion 17 raises the height of the pad 11 without causing it to protrude beyond the opening of the solder groove 13. This allows the soldering part 35 to be well supported and soldered onto the pad 11. Furthermore, the connection between the soldering part 35 and the pad 11 is located within the solder groove 13 and is covered by the corrosion-resistant adhesive 50. In other words, the technical solution of this embodiment ensures a stable connection between the component 30 and the substrate 10 while ensuring that the corrosion-resistant adhesive 50 provides good protection for the pad 11 and the soldering part 35.

[0051] In one embodiment of this application, the component 30 is a signal pickup chip, the sensing part of the signal pickup chip is disposed facing the substrate 10, and the soldering part 35 and the solder groove 13 are both located on the periphery of the sensing part;

[0052] The sensing unit and the substrate 10 form a sensing space that communicates with the external environment.

[0053] Understandably, in the sensor device 100, some of the packaged components 30 are signal pickup chips, such as MEMS (Micro-Electro-Mechanical-System) devices, which can sense signals such as temperature, pressure, humidity, sound waves, magnetic force, and photoelectric signals. Generally, the signal pickup chip is provided with a sensing part, such as a pressure sensing part, a humidity sensing part, a temperature sensing part, etc., which can be a film, a plate, or other structural forms, and is not limited here. The sensing part is used to sense external environmental signals, so it needs to be connected to the external environment. In this embodiment, the signal pickup chip is connected to the substrate 10 in a flip-chip manner, that is, the sensing part is set on the surface of the signal pickup chip facing the substrate 10. At this time, in order for the sensing part to sense external signals, a sensing space communicating with the external environment is formed between the sensing part and the substrate 10. At this time, the sensing part and the surface of the substrate 10 can be spaced apart to form the sensing space. For example, when the pad 11 is set on the surface of the substrate 10, the sensing part and the surface of the substrate 10 will naturally be spaced apart after the soldering part 35 is soldered. If the surface of the substrate 10 is provided with solder grooves 13, This allows the soldering part 35 to not be completely submerged in the solder bath 13 after soldering with the solder pad 11, thus also allowing the sensing part to be spaced apart from the surface of the substrate 10. In some embodiments, the surface of the substrate 10 is provided with the solder bath 13, and the soldering part 35 is completely submerged in the solder bath 13 so that the surface of the signal pickup chip facing the substrate 10 is in contact with the substrate 10. In this case, an avoidance groove 15 is formed on the substrate 10 that is opposite to the sensing part. This may be to extend the avoidance groove 15 to the outside of the signal pickup chip, or to form a connecting groove that connects the avoidance groove 15 to the external environment. This is not limited here.

[0054] Reference Figure 1 and Figure 3 In one embodiment of this application, the surface of the substrate 10 is provided with a clearance groove 15 that communicates with the external environment, the pad 11 is located on the periphery of the clearance groove 15, and the sensing part on the bottom surface of the signal pickup chip is disposed opposite to the clearance groove 15.

[0055] Understandably, in order for the sensing unit of the signal pickup chip to sense the external environment, a sensing space communicating with the external environment needs to be provided between the sensing unit and the substrate 10. In this embodiment, a clearance groove 15 is formed on the surface of the substrate 10, which is opposite to the sensing unit. With this configuration, if the sensing unit and the surface of the substrate 10 are spaced apart, the clearance groove 15 increases the volume of the sensing space, making the environment of the sensing space more consistent with the external environment. This avoids the sensing space being too narrow, which would affect the sensing accuracy of environmental signals, and also allows the sensing unit to have a larger deformation space. If the surface of the signal pickup chip facing the substrate 10 is in contact with the substrate 10, then the clearance groove 15 serves as the sensing space. The clearance groove 15 can be extended to the outside of the signal pickup chip, or a connecting groove can be formed between the clearance groove 15 and the external environment, so that the sensing unit can collect external signals.

[0056] Reference Figure 1 and Figure 3 In one embodiment of this application, the surface of the signal pickup chip facing the substrate 10 is attached to the substrate 10, and a connecting groove is formed on the surface of the substrate 10. The connecting groove extends from the clearance groove 15 to the outside of the component 30 to connect the clearance groove 15 with the external environment.

[0057] In this embodiment, the soldering part 35 of the signal pickup chip is completely embedded in the solder groove 13, so that the soldering part 35 can be completely surrounded by the corrosion-resistant adhesive 50, which provides better protection for the soldering part 35 and prevents it from being damaged by corrosion. This structure also causes the surface of the signal pickup chip facing the substrate 10 to be attached to the substrate 10, thus closing the clearance groove 15 and preventing the sensing part from sensing external environmental signals. In this embodiment, a connecting groove is further formed on the surface of the substrate 10 to connect the clearance groove 15 and the external environment. The connecting groove forms a channel connecting the sensing space and the external environment, ensuring that the signal pickup chip can collect and sense external signals. In some embodiments, multiple connecting grooves can be formed around the clearance groove 15 to make the changes in the internal environment of the clearance groove 15 more consistent with the external environment and improve the sensing accuracy of the signal pickup chip.

[0058] Reference Figure 1 In one embodiment of this application, the sensor 100 further includes a housing 70, which covers the surface of the substrate 10 to form an encapsulation cavity 71 with the substrate 10. At least one of the housing 70 and the substrate 10 has a communication hole 73 that communicates with the outside and the encapsulation cavity 71.

[0059] The component 30 is disposed in the encapsulation cavity 71.

[0060] In this embodiment, the sensor device 100 includes a housing 70, which is disposed on the substrate 10 to enclose the component 30 in the encapsulation cavity 71 formed by the housing 70 and the substrate 10. At the same time, in order to enable the signal pickup chip and the like to sense external environmental signals, a connecting hole 73 is formed on the substrate 10 and / or the housing 70 to connect to the external environment. This arrangement avoids the housing 70 from causing the sensor device 100 to malfunction. Moreover, compared to leaving the component 30 completely exposed to the external environment, the housing 70 can delay the contact time between the component 30 and corrosive gases or substances, and can also reduce the risk of the component 30 being damaged by collisions with external substances.

[0061] Reference Figure 1 In one embodiment of this application, the component 30 is an ASIC chip 31 and / or a MEMS chip 33.

[0062] In some embodiments, the sensor 100 includes an ASIC chip 31 (Application Specific Integrated Circuit, signal processing circuit chip) and a MEMS chip 33 (Micro-Electro-Mechanical System, signal pickup chip). Both the ASIC chip 31 and the MEMS chip 33 are mounted on the substrate 10 to form a MEMS sensor. In this embodiment, the corrosion-resistant adhesive 50 may be applied around the connection between the solder portion 35 of the ASIC chip 31 and the pad 11 of the substrate 10, or the corrosion-resistant adhesive 50 may be applied around the connection between the solder portion 35 of the MEMS chip 33 and the pad 11 of the substrate 10, or the corrosion-resistant adhesive 50 may be applied to the solder portions 35 of both chips. No limitation is made here.

[0063] This application also proposes an electronic device including a sensor 100 as described in any of the foregoing embodiments. The specific structure of the sensor 100 is as described in the foregoing embodiments and will not be repeated here. Since the sensor 100 proposed in this application applies all the technical solutions of all the foregoing embodiments, it possesses at least all the beneficial effects brought by all the foregoing technical solutions, which will not be elaborated upon here.

[0064] The above description is merely a preferred embodiment of the present invention and does not limit the patent scope of the present invention. Any equivalent structural transformations made using the contents of the present invention's specification and drawings under the inventive concept of the present invention, or direct / indirect applications in other related technical fields, are included within the patent protection scope of the present invention.

Claims

1. A sensor device, characterized in that, include: The substrate has a solder groove on its surface, a support protrusion on the bottom wall of the solder groove, a solder pad on the top surface of the support protrusion, and the top surface of the solder pad is lower than the surface of the substrate. The substrate has a clearance groove on its surface that communicates with the external environment. The component is disposed on the substrate. A soldering portion is protruding from the surface of the component facing the substrate. The soldering portion is soldered to the pad. The component is a signal pickup chip. The surface of the signal pickup chip facing the substrate is attached to the substrate. The sensing portion of the signal pickup chip is disposed facing the substrate. The soldering portion and the solder groove are both located on the periphery of the sensing portion. The pad is located on the periphery of the clearance groove. The sensing portion on the bottom surface of the signal pickup chip is disposed opposite to the clearance groove. as well as A corrosion-resistant adhesive is disposed between the component and the substrate, fills the solder groove, and surrounds the connection position between the solder part and the solder pad; The corrosion-resistant adhesive is filled into the solder groove after the welding part is welded to the solder pad, and the solder groove restricts the flow of the corrosion-resistant adhesive to prevent it from flowing to the sensing part.

2. The sensor device as described in claim 1, characterized in that, The solder groove extends to the outside of the component, and the outer edge of the solder groove is spaced apart from the component.

3. The sensor device as described in claim 2, characterized in that, The distance L between the outer edge of the weld pool and the component satisfies 30μm≤L≤100μm; And / or, the depth h of the weld groove satisfies 20μm≤h≤100μm.

4. The sensor device as described in claim 1, characterized in that, A connecting groove is formed on the surface of the substrate, and the connecting groove extends from the clearance groove to the outside of the component to connect the clearance groove with the external environment.

5. The sensor device as described in any one of claims 1 to 4, characterized in that, The sensor also includes a housing, which covers the surface of the substrate to form an encapsulation cavity with the substrate. At least one of the housing and the substrate has a communication hole that connects to the outside and the encapsulation cavity. The component is disposed in the encapsulation cavity. And / or, the component is an ASIC chip or a MEMS chip.

6. An electronic device, characterized in that, The electronic device includes a sensor as described in any one of claims 1 to 5.

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