一种基于标准接口定义的收发处理器模组
By converting the ADC/DAC chip into a flip-chip structure with a standard interface and adopting a redistribution layer and packaging substrate design, the heat dissipation and electromagnetic compatibility issues of the ADC/DAC transceiver processor under high-density integration are solved, achieving greater versatility and a shorter design cycle.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- SOUTHWEST CHINA RES INST OF ELECTRONICS EQUIP
- Filing Date
- 2023-02-15
- Publication Date
- 2026-07-17
AI Technical Summary
Under the condition of multi-channel, high-density ADC/DAC transceiver processor integration, there are problems such as poor heat dissipation performance, poor electromagnetic compatibility and versatility, and long design cycle.
By converting the ADC/DAC chip into a flip-chip structure with a standard interface, and using a redistribution layer and packaging substrate design, signal layout optimization and increased heat dissipation channels are achieved. It is compatible with various high-density integration processes and adopts a transceiver processor module with a standard interface definition.
It improves the heat dissipation performance, electromagnetic compatibility, and versatility of ADC/DAC transceiver processors, shortens the design cycle, and reduces costs.
Smart Images
Figure CN116230661B_ABST