Solderless chip method for light source

Abstract

The present invention relates to the technical field of light sources, and discloses a solderless patch method for light sources, comprising the following steps: 1) providing a light source, wherein the light source comprises a substrate, a light-emitting area is provided on the substrate, a plurality of light-emitting chips are provided in the light-emitting area, a power supply position is provided on the upper surface of the substrate, and the plurality of light-emitting chips are electrically connected to the power supply position; a through hole is provided in the substrate, and the through hole passes through the substrate from top to bottom and passes through the power supply position; 2) applying solder paste on a circuit board to which the light source needs to be connected, attaching the lower surface of the substrate to the solder paste, and the solder paste passes through the through hole, extends to the upper surface of the substrate, and covers the power supply position, so that the power supply position is electrically connected to the circuit board. In this way, the substrate is fixedly connected to the circuit board in a patch-type manner, and at the same time, because the solder paste is conductive, the power supply position and the circuit board can be electrically connected, and the overall operation is simple, and no soldering is required.

Description

Technical Field

[0001] The present invention relates to the technical field of light sources, and in particular to a solder-free patch method for light sources. Background Art

[0002] An object that can emit light and is emitting light is called a light source. Light sources can be divided into natural light sources and artificial light sources.

[0003] Artificial light sources typically use light-emitting chips, which are typically die-bonded onto a substrate. The substrate has a power supply that is electrically connected to the light-emitting chip. When a circuit board needs to be connected to a light source, soldering is performed between the substrate and the circuit board to achieve this connection.

[0004] In the prior art, adding a light source to a circuit board during production typically involves soldering. Holding a soldering iron in one hand and tin wire in the other, the operator first inserts the light source into a hole in the circuit board, then flips the board over and secures it with solder. Often, the light source falls or tilts due to gravity, affecting the aesthetics of the soldering process. This process often requires precise positioning and subsequent soldering, a process repeated multiple times, which is time-consuming and labor-intensive, impacting work efficiency. Summary of the Invention

[0005] The present invention provides a solder-free patch method for a light source, aiming to solve the problem in the prior art that a soldering operation needs to be performed after the power source is attached to a circuit board.

[0006] The present invention is implemented as follows: a solder-free patch method for a light source comprises the following steps:

[0007] 1) Provide a light source, the light source comprising a substrate, a light-emitting area being provided on the substrate, a plurality of light-emitting chips being provided in the light-emitting area, a power supply being provided on the upper surface of the substrate, the plurality of light-emitting chips being electrically connected to the power supply; a through hole being provided in the substrate, the through hole penetrating the substrate from top to bottom and penetrating the power supply;

[0008] 2) Apply solder paste on the circuit board that needs to be connected to the light source, attach the lower surface of the substrate to the solder paste, and the solder paste passes through the through hole, extends to the upper surface of the substrate, and covers the power supply position, so that the power supply position is electrically connected to the circuit board.

[0009] Optionally, in step 1), a dam is provided on the substrate, the dam surrounds the periphery of the light-emitting area, the light-emitting area is sprayed with a fluorescent adhesive layer, and the fluorescent adhesive layer covers the multiple light-emitting chips and the light-emitting area.

[0010] Optionally, the top of the fluorescent glue layer is arranged flush with the top of the dam.

[0011] Optionally, the power supply is arranged outside the dam.

[0012] Optionally, a plurality of power supply positions are provided on the substrate.

[0013] Optionally, the through hole passes through the power supply position to form an upper opening on the power supply position, and the through hole passes through the lower surface of the substrate to form a lower opening on the lower surface of the substrate; a plurality of raised rings made of a metal material are provided on the power supply position, and the plurality of raised rings are nested and arranged around the outer periphery of the upper opening, and an annular recessed space is formed between adjacent raised rings;

[0014] In the step 2), after the solder paste passes through the through hole, an upper covering layer covering the power supply position is formed, and the upper covering layer covers the plurality of raised rings.

[0015] Optionally, the upper covering layer completely fills the recessed space.

[0016] Optionally, the middle portion of the through hole contracts inwardly to form a contracted section; the upper portion of the through hole forms an upper section, which extends upward to the power supply position; the lower portion of the through hole forms a lower section, which extends downward to the lower surface of the substrate;

[0017] Along the direction from the upper opening to the contraction section, the diameter of the upper section gradually decreases; along the direction from the lower opening to the contraction section, the diameter of the lower section gradually decreases.

[0018] Optionally, in step 2), the circuit board has a coating area for applying solder paste, and an elastic rubber ring is protruded from the outer periphery of the coating area. The rubber ring is in a straight cylindrical shape and surrounds the outer periphery of the coating area; the rubber ring surrounds the outer periphery of the coating area to form a filling area, and the solder paste is applied to the filling area to fill the filling area.

[0019] The diameter of the lower opening is larger than the outer diameter of the rubber ring, and the diameter of the contraction section is smaller than the outer diameter of the rubber ring; an annular groove is provided on the inner side wall of the contraction section, and the annular groove is arranged around the circumference of the contraction section; a clamping ring is provided on the outer periphery of the top of the rubber ring, and the clamping ring is arranged around the circumference of the rubber ring;

[0020] In the step 2), during the process of attaching the lower surface of the light source to the circuit board, the adhesive ring enters the lower section from the lower opening, and the top of the adhesive ring is embedded in the contraction section, and the clamping ring is fixed in the annular groove; the adhesive ring is squeezed by the lower section and the contraction section, tilted inward and deformed, driving the solder paste in the filling area to be squeezed upward, passing through the lower section, the contraction section and the upper section in sequence, overflowing to the power supply position, and covering the power supply position.

[0021] Optionally, the raised ring is provided with a transversely arranged radial hole, the radial hole penetrating the raised ring in a radial direction of the raised ring; the radial holes of adjacent raised rings are staggered; the bottom of the radial hole is connected to the power supply position, and the top of the radial hole is closed; along the circumference of the raised ring, both sides of the radial hole protrude outward to form a recessed hole;

[0022] In the step 2), after the lower surface of the light source is attached to the circuit board, an upper solder paste layer is formed on the power supply position, and the upper solder paste layer passes through the radial holes of each raised ring and fills the recessed holes on both sides of the radial holes.

[0023] Compared with the prior art, the present invention provides a solderless patch method for light sources. First, solder paste is applied on the circuit board, and then the lower surface of the power supply is attached to the solder paste. The solder paste passes through the through hole and extends to the upper surface of the substrate. Since the through hole runs through the power supply position, the substrate is fixedly connected to the circuit board in a patch type. At the same time, since the solder paste is conductive, the power supply position and the circuit board can be electrically connected. The overall operation is simple and no soldering is required. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 is a schematic top view of a substrate provided by the present invention;

[0025] Figure 2 is a schematic cross-sectional view of a substrate provided by the present invention;

[0026] Figure 3 is a schematic cross-sectional view of a substrate provided by the present invention;

[0027] Figure 4 The present invention provides Figure 2 A partial schematic diagram of the middle part;

[0028] Figure 5 The present invention provides Figure 3 Partial schematic diagram at point B in the middle;

[0029] Figure 6 It is a schematic cross-sectional view of the raised ring provided by the present invention. DETAILED DESCRIPTION

[0030] In order to make the purpose, technical solutions and advantages of the present invention more clearly understood, the present invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0031] The implementation of the present invention is described in detail below with reference to specific embodiments.

[0032] The same or similar numbers in the drawings of this embodiment correspond to the same or similar parts; in the description of the present invention, it should be understood that if the terms "up", "down", "left", "right", etc. indicate directions or positional relationships, they are based on the directions or positional relationships shown in the drawings. This is only for the convenience of describing the present invention and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific direction, be constructed and operated in a specific direction. Therefore, the terms describing the positional relationship in the drawings are only used for illustrative purposes and cannot be understood as limiting the present invention. For ordinary technicians in this field, the specific meanings of the above terms can be understood according to specific circumstances.

[0033] Reference Figure 1-6 The figure shows a preferred embodiment of the present invention.

[0034] The solder-free chip-mounting method of the light source provided by the present invention comprises the following steps:

[0035] 1) Provide a light source, which includes a substrate 100, a light-emitting area provided on the substrate 100, a plurality of light-emitting chips 101 provided in the light-emitting area, a power supply position 102 provided on the upper surface of the substrate 100, and the plurality of light-emitting chips 101 being electrically connected to the power supply position 102; a through hole 103 is formed in the substrate 100, and the through hole 103 passes through the substrate 100 from top to bottom and passes through the power supply position 102;

[0036] 2) Apply solder paste 300 on the circuit board 200 to which the light source needs to be connected, and attach the lower surface of the substrate 100 to the solder paste 300. The solder paste 300 passes through the through hole 103 and extends to the upper surface of the substrate 100, covering the power supply position 102, so that the power supply position 102 is electrically connected to the circuit board 200.

[0037] The solderless patch method of the light source provided above first applies solder paste 300 on the circuit board 200, and then attaches the lower surface of the power supply to the solder paste 300, so that the solder paste 300 passes through the through hole 103 and extends to the upper surface of the substrate 100. Since the through hole 103 runs through the power supply position 102, the substrate 100 is fixedly connected to the circuit board 200 in a patch type manner. At the same time, since the solder paste 300 is conductive, the power supply position 102 and the circuit board 200 can be electrically connected. The overall operation is simple and no soldering is required.

[0038] In step 1), a dam 104 is provided on substrate 100. Dam 104 surrounds the periphery of the light-emitting area, which is then sprayed with a fluorescent adhesive layer 105. This fluorescent adhesive layer 105 covers the multiple light-emitting chips 101 and the light-emitting area. Thus, dam 104 serves as the edge material of the light source and also provides favorable conditions for encapsulating the light-emitting chips 101 in subsequent steps. When fluorescent adhesive layer 105 is injected in the later steps, dam 104 prevents uncured fluorescent adhesive layer 105 from flowing freely, ensuring that fluorescent adhesive layer 105 completely surrounds the light-emitting chips 101.

[0039] The top of the fluorescent glue layer 105 is flush with the top of the dam 104. In this way, the injected fluorescent glue layer 105 reaches the maximum value, which is the maximum value that the dam 104 can enclose. If the fluorescent glue layer 105 is further injected, the excess fluorescent glue layer 105 will flow out of the dam 104.

[0040] The power supply position 102 is arranged outside the dam 104 . Since the periphery of the power supply position 102 does not need to be filled with the fluorescent glue layer 105 , it is arranged outside the dam 104 .

[0041] The substrate 100 is provided with a plurality of power supply terminals 102. Since the current flows linearly, it enters from the power supply terminals 102 on one side of the substrate 100, passes through the light-emitting chip 101, etc., and exits from the power supply terminals 102 on the other side. The plurality of power supply terminals 102 form a multifunctional circuit structure.

[0042] The through hole 103 passes through the power supply position 102 to form an upper opening on the power supply position 102. The through hole 103 passes through the lower surface of the substrate 100 to form a lower opening on the lower surface of the substrate 100. The power supply position 102 is provided with a plurality of raised rings 1020 made of a metal material. The plurality of raised rings 1020 are nested and surround the outer periphery of the upper opening. An annular recessed space is formed between adjacent raised rings 1020.

[0043] In step 2), after solder paste 300 passes through through-hole 103, it forms an upper covering layer 301 covering power supply position 102. Upper covering layer 301 covers multiple raised rings 1020. Once upper covering layer 301 solidifies, solder paste 300 snaps into place within power supply position 102, electrically connecting power supply position 102 to circuit board 200.

[0044] The upper cover layer 301 fills the recessed space. Thus, after the upper cover layer 301 solidifies, the upper cover layer 301 is embedded in the recessed space, increasing the contact area between the solder paste 300 and the power supply position 102, making the connection between the circuit board 200 and the power supply position 102 more stable.

[0045] The middle portion of the through hole 103 contracts inwardly to form a contracted section; the upper portion of the through hole 103 forms an upper section, which extends upward through the power supply position 102; the lower portion of the through hole 103 forms a lower section, which extends downward through the lower surface of the substrate 100;

[0046] The diameter of the upper section gradually decreases from the upper opening to the contraction section, and the diameter of the lower section gradually decreases from the lower opening to the contraction section. Thus, when solder paste 300 passes through through-hole 103, it is squeezed into through-hole 103. After being squeezed into through-hole 103, a narrow middle portion is formed in through-hole 103, which gradually widens toward the top and bottom. Since the solidified solder paste 300 is integrated, after solidification, the solder paste 300, due to the narrow middle portion, cannot reach the top or bottom, and falls off through the middle portion, leaving the solidified solder paste 300 fixedly connected to through-hole 103.

[0047] In step 2), a coating area for applying solder paste 300 is provided on the circuit board 200. An elastic rubber ring 201 is provided protruding from the outer periphery of the coating area. The rubber ring 201 is in a straight cylindrical shape and surrounds the outer periphery of the coating area. The rubber ring 201 surrounds the outer periphery of the coating area to form a filling area. The solder paste 300 is applied to the filling area and the filling area is completely filled.

[0048] The diameter of the lower opening is larger than the outer diameter of the rubber ring 201, and the diameter of the contraction section is smaller than the outer diameter of the rubber ring 201. An annular groove 203 is provided on the inner sidewall of the contraction section, and the annular groove 203 is arranged circumferentially around the contraction section. A snap ring 202 is provided on the outer periphery of the top of the rubber ring 201, and the snap ring 202 is arranged circumferentially around the rubber ring 201.

[0049] In step 2), when the lower surface of the light source is attached to the circuit board 200, the adhesive ring 201 enters the lower section from the lower opening, and the top of the adhesive ring 201 is embedded in the contraction section, and the retaining ring 202 is locked and fixed with the annular groove 203; the adhesive ring 201 is squeezed by the lower section and the contraction section, tilting inward and deforming, driving the solder paste 300 in the filling area to be squeezed upward, passing through the lower section, the contraction section and the upper section in sequence, overflowing onto the power supply position 102, and covering the power supply position 102.

[0050] The snap ring 202 is engaged and fixed with the annular groove 203, so that the rubber ring 201 is fixedly connected to the through hole 103. At the same time, the rubber ring 201 is in an extruded state, and the solder paste 300 is squeezed out of the rubber ring 201. The solder paste 300 enters the lower section, and then enters the contraction section and the upper section, covering the power supply position 102. After the solder paste 300 solidifies, the circuit board 200 is fixedly connected to the power supply position 102.

[0051] The raised ring 1020 is provided with a transversely arranged radial hole 1021, which penetrates the raised ring 1020 in a radial direction. The radial holes 1021 of adjacent raised rings 1020 are staggered. The bottom of the radial hole 1021 is connected to the power supply 102, and the top of the radial hole 1021 is closed. Along the circumference of the raised ring 1020, the two sides of the radial hole 1021 protrude outward to form a recessed hole 1022.

[0052] In step 2), after the lower surface of the light source is attached to the circuit board 200, an upper solder paste layer is formed on the power supply position 102. The upper solder paste layer passes through the radial holes 1021 of each raised ring 1020 and fills the recessed holes 1022 on both sides of the radial holes 1021. In this way, after the solder paste 300 passes through the through hole 103, an upper covering layer 301 is formed. The upper covering layer 301 covers the power supply position 102, wherein the upper solder paste layer extends into the radial holes 1021 and simultaneously fills the recessed holes 1022. After the solder paste 300 solidifies, it becomes embedded, which greatly increases the bonding area between the solder paste 300 and the power supply position 102, making the connection between the circuit board 200 and the power supply position 102 more stable.

[0053] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A solderless chip method for light sources, characterized in that: The following steps are involved: 1) Provide a light source, the light source comprising a substrate, a light-emitting area being provided on the substrate, a plurality of light-emitting chips being provided in the light-emitting area, a power supply being provided on the upper surface of the substrate, the plurality of light-emitting chips being electrically connected to the power supply; a through hole being provided in the substrate, the through hole penetrating the substrate from top to bottom and penetrating the power supply; 2) Apply solder paste on the circuit board to which the light source is to be connected, and attach the lower surface of the substrate to the solder paste. The solder paste passes through the through hole, extends to the upper surface of the substrate, and covers the power supply position, so that the power supply position is electrically connected to the circuit board; The through hole passes through the power supply position to form an upper opening on the power supply position, and the through hole passes through the lower surface of the substrate to form a lower opening on the lower surface of the substrate; a plurality of raised rings made of metal material are provided on the power supply position, and the plurality of raised rings are nested and arranged around the outer periphery of the upper opening, and an annular recessed space is formed between adjacent raised rings; In the step 2), after the solder paste passes through the through hole, an upper covering layer covering the power supply position is formed, and the upper covering layer covers the plurality of raised rings.

2. The solderless chip-mounting method of a light source according to claim 1, wherein: In the step 1), a dam is provided on the substrate, the dam surrounds the periphery of the light-emitting area, the light-emitting area is sprayed with a fluorescent adhesive layer, and the fluorescent adhesive layer covers the multiple light-emitting chips and the light-emitting area.

3. The solderless chip-mounting method of a light source according to claim 2, wherein: The top of the fluorescent glue layer is flush with the top of the dam.

4. The solderless chip-mounting method of a light source according to claim 2, wherein: The power supply is arranged outside the dam.

5. The solderless chip-mounting method of a light source according to claim 1, wherein: A plurality of power supply positions are provided on the substrate.

6. The solderless chip-mounting method of any one of claims 1 to 5, wherein: The upper covering layer fully fills the concave space.

7. The solderless chip-mounting method of a light source according to claim 6, wherein: The middle portion of the through hole shrinks inward to form a shrinking section; the upper portion of the through hole forms an upper section, which extends upward to the power supply position; the lower portion of the through hole forms a lower section, which extends downward to the lower surface of the substrate; Along the direction from the upper opening to the contraction section, the diameter of the upper section gradually decreases; along the direction from the lower opening to the contraction section, the diameter of the lower section gradually decreases.

8. The solderless chip-mounting method of a light source according to claim 7, wherein: In step 2), the circuit board has a coating area for applying solder paste, and an elastic rubber ring is protruded from the outer periphery of the coating area. The rubber ring is in a straight cylindrical shape and surrounds the outer periphery of the coating area; the rubber ring surrounds the outer periphery of the coating area to form a filling area, and solder paste is applied to the filling area to fill the filling area. The diameter of the lower opening is larger than the outer diameter of the rubber ring, and the diameter of the contraction section is smaller than the outer diameter of the rubber ring; an annular groove is provided on the inner side wall of the contraction section, and the annular groove is arranged around the circumference of the contraction section; a clamping ring is provided on the outer periphery of the top of the rubber ring, and the clamping ring is arranged around the circumference of the rubber ring; In step 2), when the lower surface of the light source is attached to the circuit board, the adhesive ring enters the lower section from the lower opening, and the top of the adhesive ring is embedded in the contraction section, and the clamping ring is fixed in the annular groove; the adhesive ring is squeezed by the lower section and the contraction section, tilting and deforming inward, driving the solder paste in the filling area to be squeezed upward, passing through the lower section, the contraction section and the upper section in sequence, overflowing onto the power supply position, and covering the power supply position.

9. The solderless chip-mounting method of any one of claims 1 to 5, wherein: The raised ring is provided with a transversely arranged radial hole, which penetrates the raised ring in the radial direction of the raised ring; the radial holes of adjacent raised rings are staggered; the bottom of the radial hole is connected to the power supply position, and the top of the radial hole is closed; along the circumference of the raised ring, both sides of the radial hole protrude outward to form a concave hole; In step 2), after the lower surface of the light source is attached to the circuit board, an upper solder paste layer is formed on the power supply position, and the upper solder paste layer passes through the radial holes of each raised ring and fills the recessed holes on both sides of the radial holes.

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