An electronic device

Abstract

This invention provides an electronic device in which a light-transmitting substrate is located outside a photosensitive chip. Ambient light first passes through the light-transmitting substrate and then enters the photosensitive surface of the photosensitive chip, enabling the photosensitive chip to collect the ambient light and convert the collected light signal into a corresponding electrical signal. The electronic device uses a fan-out packaging process to flip-chip multiple photosensitive chips onto the light-transmitting substrate, and the interconnection between the multiple photosensitive chips is achieved by combining the wiring layer between the light-transmitting substrate and the photosensitive chips. The total thickness of the light-transmitting substrate and the wiring layer is much smaller than the thickness of the base used in lens modules in the prior art, making it easier to achieve a thinner and lighter design for the electronic device. Furthermore, since the multiple photosensitive chips are interconnected through a first metal trace in the wiring layer, it is not necessary to perform extensive wiring within the base as in the prior art, thus avoiding problems such as larger bezel width, poor connection accuracy, lower yield, and higher power consumption caused by extensive wiring.

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