A power amplifier component and its working method

Abstract

This application discloses a power amplifier component and its operating method. The power amplifier component includes a power amplifier module with an LDMOS device, an AC / DC power supply, and a modulation pulse integrator. The AC / DC power supply powers both the power amplifier module and the modulation pulse integrator. The modulation pulse integrator includes an RC integral adjustment circuit that provides a working pulse with a pulse rise pattern to the power amplifier module based on the pulse input. The pulse rise excitation signal compensates for the pulse drop in the power amplifier module, resulting in an extremely low pulse drop characteristic in the output signal pulse power within the pulse. This invention significantly reduces the internal power drop of the pulse by compensating for the pulse drop signal within the pulse of the power amplifier module through the pulse rise signal output by the RC integral adjustment circuit.

Description

Technical Field

[0001] This application relates to the field of power amplifier technology, and more specifically, to a power amplifier assembly and its operating method. Background Technology

[0002] Traditional pulse power amplifier components include: a final-stage power amplifier, a power supply, a power divider, a power combiner, and a control circuit. Traditional pulse power amplifier components using LDMOS solid-state power amplifier devices are limited by the solid-state devices and circuit structure, and due to the physical characteristics of the amplifier devices themselves and the influence of heat accumulation, the pulse power drop is generally around 1% (100µs pulse width). Under these conditions, if further reduction of the pulse drop is required, the traditional method of adding energy storage capacitors is no longer sufficient to achieve the desired effect, and cannot meet the application scenarios with extremely high requirements for the stability of the output power within the pulse, such as resonant cavity power injection. Summary of the Invention

[0003] One objective of this invention is to provide a power amplifier component and its operating method to solve the problem of large power drop within the pulse caused by the inherent characteristics of LDMOS solid-state amplifier components when amplifying P-band microwaves.

[0004] To achieve one of the above objectives, this application adopts the following technical solution: This application provides a power amplifier assembly, which includes a power amplification module of LDMOS devices, an AC / DC power supply, and a modulation pulse integrator; AC / DC power supply is used to power the power amplifier module and the modulation pulse integrator respectively; The modulated pulse integrator includes an RC integral adjustment circuit that provides a working pulse with a pulse rise pattern to the power amplification module based on the pulse input, so that the output signal pulse power exhibits a very low pulse drop characteristic within the pulse.

[0005] Optionally, the RC integral adjustment circuit includes a first resistor, a capacitor, a diode, a pulse driver, and a variable resistor, forming an LDMOS device gate modulation pulse integral circuit; The first end of the first resistor is connected to the input terminal of the pulse driver, and the other end is connected to the ground terminal of the pulse driver and grounded. The output terminal of the pulse driver is connected to the positive terminal of the diode, the negative terminal of the diode is connected to the first terminal of the capacitor, and the second terminal of the capacitor is grounded. The first terminal of the variable resistor is connected to the power supply, the tap terminal is connected to the first terminal of the capacitor, and the second terminal is grounded, which is used to provide bias voltage for the power amplifier module.

[0006] Optionally, the RC integral adjustment circuit further includes a second resistor, the first end of which is connected to the first end of the capacitor, and the second end of which is grounded.

[0007] Optionally, the magnitude of the pulse rise can be adjusted by the integration circuit parameters of the modulated pulse integrator.

[0008] Optionally, the power amplifier module includes A first-stage power amplifier amplifies the input signal based on the first gate modulation signal from the modulation pulse integrator, such that the output power of the amplified signal exhibits a peak-up pattern within the pulse. A power divider is used to distribute a signal amplified by a primary power amplifier to multiple secondary power amplifiers. Each secondary power amplifier amplifies the signal from the power divider a second time based on the second gate modulation signal from the modulation pulse integrator, so that the output power of the amplified signal exhibits a peak shape within the pulse.

[0009] Optionally, the modulation pulse integrator independently adjusts the first-stage power amplifier and the second-stage power amplifier.

[0010] Optionally, the power amplifier assembly includes a radio frequency switch unidirectionally connected to the power amplifier module, which transmits microwave input to the power amplifier module based on an enable signal from the modulation pulse integrator.

[0011] Optionally, the power amplifier assembly includes a primary isolator connected between the primary power amplifier and the power divider, and a plurality of secondary isolators respectively connected between the plurality of secondary power amplifiers and the power combiner.

[0012] Optionally, the AC / DC power supply is unidirectionally connected to both the power amplifier module and the modulation pulse integrator.

[0013] On the other hand, this application also provides a method for operating a power amplifier component, the method comprising: The modulation pulse integrator integrates the pulse modulation signal and outputs a gate bias pulse modulation signal that exhibits a pulse rise pattern within the working pulse. The gate pulse modulation signal is output to the first-stage power amplifier and multiple second-stage power amplifiers respectively. The rise of the gate modulation signal of the first-stage power amplifier and multiple second-stage power amplifiers can be adjusted independently to meet the needs of output pulse power rise and fall adjustment of different power amplifier devices. The output power of the first-stage power amplifier is input to multiple second-stage power amplifiers through a power divider for a second power amplification. The gate modulation of the first-stage and second-stage power amplifiers exhibits a rise-up pattern within the pulse. By compensating the integration parameters of the modulation pulse integrator, the output pulses of the first-stage and second-stage power amplifiers show an internal drop, so that the amplified signal output pulse power exhibits an extremely low pulse drop characteristic within the pulse.

[0014] The beneficial effects of this application are as follows: Compared with the prior art, the present invention sets up a modulation pulse integrator and performs integration processing on the gate modulation signal through the RC integration adjustment circuit in the modulation pulse integrator, so that the voltage at the capacitor input terminal gradually increases, thereby making the gate modulation pulse signal present a pulse rise form within the working pulse. Furthermore, the gate pulse modulation signal is output to the first-stage power amplifier and several second-stage power amplifiers to compensate for the downward trend of the pulse power due to the physical characteristics of the amplifiers themselves, thereby reducing the internal power drop of the first-stage power amplifier and several second-stage power amplifiers. Attached Figure Description

[0015] The specific embodiments of the present invention will be described in further detail below with reference to the accompanying drawings.

[0016] Figure 1 A schematic diagram of the power amplifier component in one embodiment of this application is shown.

[0017] Figure 2 A schematic diagram of a modulation pulse integrator in one embodiment of this application is shown. Detailed Implementation

[0018] In the following description, numerous specific details are set forth for illustrative purposes and to provide a comprehensive understanding of one or more embodiments. However, it will be apparent that these embodiments can also be implemented without these specific details.

[0019] In the description of this application, it should be noted that the terms "upper," "lower," etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application. Unless otherwise expressly specified and limited, the terms "installed," "connected," and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication between two elements. For those skilled in the art, the specific meaning of the above terms in this application can be understood according to the specific circumstances.

[0020] It should also be noted that, in the description of this application, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0021] To address the problems existing in the prior art, this application proposes a radar power amplifier component with low pulse drop capability suitable for the P-band, solving the problem of large pulse power drop in pulse power amplifier components of LDMOS solid-state power amplifier devices due to limitations imposed by solid-state devices, circuit structure, and heat accumulation. Figure 1-2 As shown, the power amplifier assembly includes: a power amplifier module, an AC / DC power supply 15, and a modulation pulse integrator. Specifically, the modulation pulse integrator is a gate modulation pulse integrator 14.

[0022] The power amplification module includes: a first-stage power amplifier 2, which amplifies the input signal based on the first gate modulation signal from the gate modulation pulse integrator 14, so that the output power of the amplified signal exhibits a peak shape within the pulse; Power divider 4 is used to distribute the signal amplified by the first-stage power amplifier 2 to multiple second-stage power amplifiers; Each secondary power amplifier amplifies the signal from the power divider 4 a second time based on the second gate modulation signal from the gate modulation pulse integrator 14, so that the output power of the amplified signal exhibits a peak shape within the pulse. Multiple secondary power amplifiers include: secondary power amplifier A5, secondary power amplifier B6, secondary power amplifier C7, and secondary power amplifier D8. Each secondary power amplifier is connected in parallel to the output of power divider 4 through its input terminal.

[0023] The power amplifier assembly includes a primary isolator 3 connected between the primary power amplifier 2 and the power divider 4, and multiple secondary isolators connected between the multiple secondary power amplifiers and the power combiner 13, respectively. Multiple secondary isolators include: secondary isolator A9, secondary isolator B10, secondary isolator C11, and secondary isolator D12. Each secondary isolator is connected in parallel between the output of each secondary power amplifier and the input of the power combiner 13. The stability of the link transmission is ensured by setting up secondary isolators.

[0024] The power amplifier assembly also includes an RF switch 1 that is unidirectionally connected to the power amplifier module, which transmits microwave input to the power amplifier module based on an enable signal from the gate modulation pulse integrator 14.

[0025] Specifically, the interfaces of the RF switch 1 include a microwave input interface, the power divider 4 has 5 interfaces, namely a, b, c, d and e, the power combiner 13 has 5 interfaces, namely a, b, c, d and e, the output interface of the power combiner 13 is a microwave output interface, the gate modulation pulse integrator 14 has 5 interfaces, namely a, b, c, d and e, and the AC / DC power supply 15 has 4 interfaces, namely a, b, c and d.

[0026] RF switch 1 is unidirectionally connected to first-stage power amplifier 2 via microstrip; first-stage power amplifier 2 is unidirectionally connected to first-stage isolator 3; first-stage isolator 3 is unidirectionally connected to the e-port of power divider 4; power divider 4's a-port is unidirectionally connected to second-stage power amplifier A5; second-stage isolator A9 is unidirectionally connected to the a-port of power combiner 13; power divider 4's b-port is unidirectionally connected to second-stage power amplifier B6; second-stage power amplifier B6 is unidirectionally connected to second-stage isolator B10; second-stage isolator B10 is unidirectionally connected to the b-port of power combiner 13; power divider 4's c-port is unidirectionally connected to second-stage power amplifier C7; second-stage power amplifier C7 is unidirectionally connected to second-stage isolator C11; second-stage isolator C11 is unidirectionally connected to the c-port of power combiner 13; power divider 4's d-port is unidirectionally connected to second-stage power amplifier D8. The secondary power amplifier D8 is unidirectionally connected to the secondary isolator D12, and the secondary isolator D12 is unidirectionally connected to the d port of the power combiner 13. The b interface of the gate modulation pulse integrator 14 is unidirectionally connected to the RF switch 1, the c interface of the gate modulation pulse integrator 14 is unidirectionally connected to the primary power amplifier 2, the d interface of the gate modulation pulse integrator 14 is connected to the secondary power amplifiers A5, B6, C7, and D8 respectively, the e interface of the gate modulation pulse integrator 14 is unidirectionally connected to the d interface of the AC / DC power supply 15, the b interface of the AC / DC power supply 15 is unidirectionally connected to the primary power amplifier 2, and the c interface of the AC / DC power supply 15 is unidirectionally connected to the secondary power amplifiers A5, B6, C7, and D8 respectively.

[0027] When the power amplifier assembly amplifies the P-band microwave signal, the microwave signal is input from the RF switch 1 and passes sequentially through the first-stage power amplifier 2, the first-stage isolator 3, the power divider 4, each second-stage power amplifier and each second-stage isolator before being output by the power combiner 13.

[0028] The gate modulation pulse integrator 14 can output an enable signal to the power amplifier module. Specifically, the gate modulation pulse integrator 14 inputs the enable signal to the RF switch 1 and the first-stage power amplifier 2 respectively, thereby enabling the corresponding functions of the RF switch 1 and the first-stage power amplifier 2.

[0029] AC / DC power supply 15 is used to power the gate modulation pulse integrator 14 and the power amplifier module respectively; further, AC / DC power supply 15 powers the first-stage power amplifier 2, second-stage power amplifier A5, second-stage power amplifier B6, second-stage power amplifier C7 and second-stage power amplifier D8 of the power amplifier module respectively.

[0030] During operation, the AC / DC power supply 15 first outputs 5V and 50V DC voltages. The 5V DC voltage is input to the e-port of the gate modulation pulse integrator 14 through the d-port of the AC / DC power supply 15, providing operating power for the gate modulation pulse integrator 14. The 50V DC voltage provides drain operating voltage for the first-stage power amplifier 2, second-stage power amplifier A5, second-stage power amplifier B6, second-stage power amplifier C7, and second-stage power amplifier D8, respectively. The host computer provides enable signals to the RF switch 1 and the first-stage power amplifier 2 through the a-port of the gate modulation pulse integrator 14. The power output from the microwave excitation signal after passing through the RF switch 1 and the first-stage power amplifier 2 is input to the second-stage power amplifiers A5, B6, C7, and D8 through the power divider 4 for a second power amplification. Then, it is input to the power combiner 13 through the second-stage isolators A9, B10, C11, and D12, and finally outputs microwave power after passing through the power combiner 13. Meanwhile, the gate modulation signal is integrated by the gate modulation pulse integrator 14 within the modulation pulse. The integrated gate pulse modulation signal presents a pulse rise form within the working pulse, and is then output to the first-stage power amplifier 2 and the four second-stage power amplifiers respectively through the gate modulation pulse integrator 14.

[0031] Specifically, the power within the gate modulation signal pulse of the first-stage power amplifier 2 increases to compensate for the decreasing trend of power within the pulse caused by the heat accumulation of the first-stage power amplifier 2 itself, so that the output power of the first-stage power amplifier exhibits a peak-rise pattern within the pulse. The processing process of the modulation pulses of the second-stage power amplifiers A5, B6, C7 and D8 is the same as the gate modulation pulse processing process of the first-stage power amplifier 2. By changing the adjustment of the integration parameters of the gate modulation pulse integrator 14, the microwave output pulse power of the amplification component exhibits the characteristic of extremely low pulse peak drop within the pulse.

[0032] The gate modulation signals of the first-stage power amplifier 2 and the four second-stage power amplifiers adopt independent integral adjustment circuits, which can independently adjust the magnitude of the rise of the gate modulation signals of the first-stage power amplifier 2 and the four second-stage power amplifiers to meet the needs of different power amplifier output pulse power rise adjustment.

[0033] In one specific embodiment, the gate modulation pulse integrator 14 includes an RC integral adjustment circuit. The RC integral adjustment circuit provides a working pulse with a pulse rise pattern to the first-stage power amplifier 2 and each of the second-stage power amplifiers of the power amplifier module based on the pulse input, so that the output signal pulse power exhibits the characteristic of extremely low pulse rise within the pulse.

[0034] like Figure 2As shown, the RC integral adjustment circuit includes a first resistor R1, a capacitor C1, a diode D1, a pulse driver, a second resistor R2, and a variable resistor VR1. The above components constitute the gate modulation pulse integral circuit of the LDMOS device. The first end of the first resistor R1 is connected to the input terminal of the pulse driver, and the other end is connected to the ground terminal of the pulse driver and grounded. The output terminal of the pulse driver is connected to the positive terminal of diode D1, the negative terminal of diode D1 is connected to the first terminal of capacitor C1, and the second terminal of capacitor C1 is grounded. The first terminal of the variable resistor VR1 is connected to the power supply, the tap terminal is connected to the first terminal of the capacitor C1, and the second terminal is grounded, which is used to provide bias voltage for the power amplifier module. The first end of the second resistor R2 is connected to the first end of the capacitor C1, and the second end of the second resistor R2 is grounded.

[0035] Furthermore, terminal a of the first resistor R1 is connected to the input terminal of the pulse driver, and terminal b of the first resistor R1 is grounded; terminal a of the diode D1 is connected to the output terminal of the pulse driver, and terminal b of the diode D1 is connected to terminal a of the second resistor R2, and terminal b of the second resistor R2 is grounded; terminal b of the diode D1 is connected to terminal a of the capacitor C1, and terminal b of the capacitor C1 is grounded; the tap of the variable resistor VR1 is connected to terminal a of the capacitor C1, terminal a of the variable resistor VR1 is connected to the power supply, and terminal b of the variable resistor VR1 is grounded.

[0036] The modulated pulse signal is first amplified by the pulse driver in the gate modulation pulse integrator 14 to improve its driving capability. Then, it passes through the diode D1 in the gate modulation pulse integrator 14 to allow the positive pulse signal to pass through, preventing the capacitor C1 in the gate modulation pulse integrator 14 from discharging through the pulse driver. The modulated pulse signal passing through the diode D1 charges the capacitor C1. The voltage at port a of the capacitor C1 continuously increases within the pulse. Throughout the entire operating pulse width, the voltage at port a of the capacitor C1 shows a sloping upward trend, reaching its maximum value at the end of the modulation pulse. At the end of the pulse, the charge in the capacitor C1 is discharged through R1 in the gate modulation pulse integrator 14. The main function of the variable resistor VR1 in the gate modulation pulse integrator 14 is to divide the voltage at port a of the capacitor C1, providing a suitable gate bias level for the power amplifier device.

[0037] The pulse boost magnitude of the gate modulation pulse integrator 14 can be adjusted by changing the parameters of the integration adjustment circuit, that is, by changing the number of the second resistor R2 and capacitor C1 connected in parallel and by changing the resistance value of the second resistor R2 and the capacitance value of the capacitor C1.

[0038] To ensure a more stable operating temperature for this power amplifier assembly, the power amplifier assembly also includes water-cooling pipes located at the bottom of the housings of the primary power amplifier 2 and each secondary power amplifier.

[0039] The P-band microwave signal processed by this invention has a relative operating bandwidth of 42%, a pulse power drop of less than 0.2%, a pulse power stability of better than 0.2%, and a compact structure.

[0040] Obviously, the above embodiments of the present invention are merely examples for clearly illustrating the present invention, and are not intended to limit the implementation of the present invention. For those skilled in the art, other variations or modifications can be made based on the above description. It is impossible to exhaustively list all the implementation methods here. All obvious variations or modifications derived from the technical solutions of the present invention are still within the protection scope of the present invention.

Claims

1. A power amplifier component, characterized in that, The power amplifier assembly includes a power amplifier module with LDMOS devices, an AC / DC power supply, and a modulation pulse integrator. AC / DC power supply is used to power the power amplifier module and the modulation pulse integrator respectively; The modulated pulse integrator includes an RC integral adjustment circuit that provides a working pulse with a pulse rise pattern to the power amplification module based on the pulse input, so that the output signal pulse power exhibits extremely low pulse rise characteristics within the pulse. The RC integral adjustment circuit includes a first resistor, a capacitor, a diode, a pulse driver, and a variable resistor, forming an LDMOS device gate modulation pulse integral circuit. The first end of the first resistor is connected to the input terminal of the pulse driver, and the other end is connected to the ground terminal of the pulse driver and grounded. The output terminal of the pulse driver is connected to the positive terminal of the diode, the negative terminal of the diode is connected to the first terminal of the capacitor, and the second terminal of the capacitor is grounded. The first end of the variable resistor is connected to the power supply, the tap end is connected to the first end of the capacitor, and the second end is grounded, which is used to provide bias voltage for the power amplifier module. The RC integral adjustment circuit further includes a second resistor, the first end of which is connected to the first end of the capacitor, and the second end of which is grounded. The magnitude of the pulse rise can be adjusted by the integration circuit parameters of the modulation pulse integrator.

2. The power amplifier component according to claim 1, characterized in that, The power amplifier module includes A first-stage power amplifier amplifies the input signal based on the first gate modulation signal from the modulation pulse integrator, such that the output power of the amplified signal exhibits a peak-up pattern within the pulse. A power divider is used to distribute a signal amplified by a primary power amplifier to multiple secondary power amplifiers. Each secondary power amplifier amplifies the signal from the power divider a second time based on the second gate modulation signal from the modulation pulse integrator, so that the output power of the amplified signal exhibits a peak shape within the pulse.

3. The power amplifier component according to claim 2, characterized in that, The modulation pulse integrator independently adjusts the first-stage power amplifier and the second-stage power amplifier.

4. The power amplifier component according to claim 1, characterized in that, The power amplifier assembly includes a radio frequency switch that is unidirectionally connected to the power amplifier module, and transmits microwave input to the power amplifier module based on an enable signal from the modulation pulse integrator.

5. The power amplifier component according to claim 2, characterized in that, The power amplifier assembly includes a primary isolator connected between the primary power amplifier and the power divider, and multiple secondary isolators connected between the multiple secondary power amplifiers and the power combiner, respectively.

6. The power amplifier component according to claim 1, characterized in that, The AC / DC power supply is unidirectionally connected to the power amplifier module and the modulation pulse integrator, respectively.

7. The method of operating the power amplifier component according to claim 1, characterized in that, The method includes The modulation pulse integrator integrates the pulse modulation signal and outputs a gate bias pulse modulation signal that exhibits a pulse rise pattern within the working pulse. The gate pulse modulation signal is output to the first-stage power amplifier and multiple second-stage power amplifiers respectively. The rise of the gate modulation signal of the first-stage power amplifier and multiple second-stage power amplifiers can be adjusted independently to meet the needs of output pulse power rise and fall adjustment of different power amplifier devices. The output power of the first-stage power amplifier is input to multiple second-stage power amplifiers through a power divider for a second power amplification. The gate modulation of the first-stage and second-stage power amplifiers exhibits a rise-up pattern within the pulse. By compensating the integration parameters of the modulation pulse integrator, the output pulses of the first-stage and second-stage power amplifiers show an internal drop, so that the amplified signal output pulse power exhibits an extremely low pulse drop characteristic within the pulse.

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