Electrostatic chuck cleaning apparatus and electrostatic chuck cleaning method

Abstract

The electrostatic chuck cleaning device is provided in the work cavity, and comprises a first air jet mechanism, a second air jet mechanism, a third air jet mechanism and a suction mechanism. The first air jet mechanism has a first air jet port, the second air jet mechanism has a second air jet port, and the first air jet port and the second air jet port are arranged on the upper sides of the electrostatic chuck. The third air jet mechanism has a third air jet port, the air jet path of the third air jet port intersects with the air jet path of the first air jet port, and the airflow sprayed by the first air jet port can make the airflow sprayed by the third air jet port turn to blow along the surface of the electrostatic chuck. The suction port of the suction mechanism is located in the work cavity. The cleaning method can form a transverse blowing airflow to clean the surface of the electrostatic chuck without opening the work cavity. Not only can the micro-particles attached to the surface of the electrostatic chuck be effectively removed, but also the micro-particles can be prevented from piling up on specific parts of the surface of the electrostatic chuck.

Description

Technical Field

[0001] This invention relates to the field of semiconductor technology, and in particular to an electrostatic chuck cleaning device and an electrostatic chuck cleaning method. Background Technology

[0002] In the manufacturing process of semiconductor devices, wafer etching is typically required. The wafer to be etched is usually placed on an electrostatic chuck, and after etching, it is transferred by a robotic arm to subsequent processing steps. Then, the next wafer to be etched is transferred to an empty electrostatic chuck. In actual use, the surface of the electrostatic chuck often becomes contaminated with microparticles generated during the wafer etching process or inside the equipment. These microparticles can become stuck between the wafer and the electrostatic chuck, causing slight tilting and contamination of the wafer, thus affecting the wafer etching yield and potentially causing wear on both the wafer and the electrostatic chuck. Summary of the Invention

[0003] Therefore, it is necessary to provide an electrostatic chuck cleaning device to address the problems mentioned above, so as to effectively clean residual particles on the surface of the electrostatic chuck and avoid affecting the wear of the wafer and the electrostatic chuck, as well as the yield of wafer etching.

[0004] According to some embodiments of this disclosure, an electrostatic chuck cleaning device is provided, wherein an electrostatic chuck is disposed in a working chamber, and the electrostatic chuck cleaning device includes a first jet mechanism, a second jet mechanism, a third jet mechanism, and a suction mechanism.

[0005] The first jet mechanism has a first jet port, the second jet mechanism has a second jet port, the first jet port and the second jet port are respectively located on the upper sides of the electrostatic chuck, and the jet direction of the first jet port and the jet direction of the second jet port are facing the upper surface of the electrostatic chuck; the third jet mechanism has a third jet port, and the jet path of the third jet port intersects with the jet path of the first jet port; the suction port of the suction mechanism is located in the working chamber.

[0006] In some embodiments of this disclosure, the third jet outlet is disposed below the first jet outlet, and the jet path of the third jet outlet intersects the jet path of the first jet outlet from bottom to top.

[0007] In some embodiments of this disclosure, the electrostatic chuck has a first gap between the side of the electrostatic chuck near the first jet port and the cavity wall of the working chamber, and the jet path of the third jet port intersects with the jet path of the first jet port after passing through the first gap.

[0008] The electrostatic chuck has a second gap between the side of the electrostatic chuck near the second jet nozzle and the cavity wall of the working chamber, and the airflow ejected from the second jet nozzle can redirect the airflow along the surface of the electrostatic chuck to pass through the second gap.

[0009] In some embodiments of this disclosure, the suction port is disposed below the electrostatic chuck and located between the third air jet and the second gap.

[0010] In some embodiments of this disclosure, the third jet mechanism further includes an openable and closable first sealing member disposed on the third jet port and used to close the third jet port; the suction mechanism further includes an openable and closable second sealing member disposed on the suction port and used to close the suction port.

[0011] In some embodiments of this disclosure, the jet direction of the first jet mechanism is adjustable, and / or

[0012] The jet direction of the second jet mechanism is adjustable.

[0013] Furthermore, according to some embodiments of this disclosure, an electrostatic chuck cleaning method is also provided, which employs the electrostatic chuck cleaning device according to any of the above embodiments. The electrostatic chuck cleaning method includes performing a gas purging process at least once, the gas purging process including the following steps:

[0014] Control the third jet mechanism to jet air towards the jet path of the first jet nozzle;

[0015] Control the first jet mechanism to continuously jet;

[0016] During the continuous jetting process of the first jetting mechanism, the second jetting mechanism is controlled to jet intermittently;

[0017] The third jet mechanism is controlled to stop jetting, and the suction mechanism is activated to extract gas through the suction port.

[0018] In some embodiments of this disclosure, in the step of controlling the third jet mechanism to spray air towards the jet path of the first jet nozzle, the time for controlling the third jet mechanism to spray air is 15s to 30s; and / or,

[0019] In the step of controlling the second jet mechanism to spray intermittently, the duration of each jet spray is controlled to be 5s to 10s, and the interval between two adjacent jet sprays is 1s to 5s.

[0020] In some embodiments of this disclosure, the ratio of the jet flow rate of the first jet mechanism to the jet flow rate of the third jet mechanism is (1:1.5) to (1:3).

[0021] In some embodiments of this disclosure, a judgment step is included before the gas purging process is performed. The judgment step includes: monitoring the working gas flow rate on the back of the electrostatic chuck, and when the working gas flow rate is detected to be higher than a preset flow rate, the gas purging process is performed.

[0022] In some embodiments of this disclosure, the determination step further includes: when the working gas flow rate is detected to be higher than the preset flow rate, determining the number of particles on the surface of the electrostatic chuck based on the value of the working gas flow rate at this time, and then controlling the jet flow rate of the third jet mechanism based on the number of particles on the surface of the electrostatic chuck.

[0023] In the electrostatic chuck cleaning device of the above embodiment, the first jet nozzle is positioned diagonally above the electrostatic chuck, ejecting an inclined airflow toward the electrostatic chuck. The jet path of the third jet nozzle intersects with that of the first jet nozzle. The gases ejected from the first, second, and third jet nozzles interact to form a variable-direction airflow along the surface of the electrostatic chuck, sweeping the surface of the electrostatic chuck. Combined with a suction mechanism, the airflow sweeping the electrostatic chuck carries contaminants away, thus completing the cleaning of the electrostatic chuck. This cleaning method can form a transverse sweeping airflow to clean the surface of the electrostatic chuck without opening the working chamber. It can not only effectively remove microparticles attached to the surface of the electrostatic chuck but also prevent microparticles from accumulating in specific areas of the electrostatic chuck surface.

[0024] The above description is merely an overview of the technical solution of the present invention. In order to better understand the technical means of the present invention and to implement it in accordance with the contents of the specification, the preferred embodiments of the present invention are described in detail below with reference to the accompanying drawings. Attached Figure Description

[0025] Figure 1 This is a schematic diagram of the structure of an electrostatic chuck cleaning device of the present invention;

[0026] Figure 2 This is a schematic diagram of the structure of the first jet pipe in the first jet mechanism;

[0027] Figure 3 This is a schematic cross-sectional view of the first jet nozzle in the first jet mechanism;

[0028] Figure 4 This is a schematic diagram of the third jet pipe in the third jet mechanism;

[0029] The reference numerals and their meanings in the attached figures are as follows:

[0030] 100. Electrostatic chuck; 110. First jet mechanism; 1101. First exhaust branch pipe; 1102. First connector; 1103. First intake branch pipe; 1104. First protective sleeve; 111. First jet nozzle; 1111. First jet inlet; 120. Second jet mechanism; 121. Second jet nozzle; 130. Third jet mechanism; 1301. Third exhaust branch pipe; 1302. Third connector; 1303. Third intake branch pipe; 1304. Third protective sleeve; 1305. First sealing piece; 131. Third jet nozzle; 200. Working chamber; 210. First gap; 220. Second gap. Detailed Implementation

[0031] To facilitate understanding of this application, a more complete description will be provided below with reference to the accompanying drawings, which illustrate preferred embodiments of the application. However, this application can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to make the disclosure of this application more thorough and complete.

[0032] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the specification of this application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0033] It should be understood that when an element or layer is referred to as "on," "adjacent to," "connected to," or "coupled to" other elements or layers, it may be directly on, adjacent to, connected to, or coupled to other elements or layers, or there may be intervening elements or layers. Conversely, when an element is referred to as "directly on," "directly adjacent to," "directly connected to," or "directly coupled to" other elements or layers, there are no intervening elements or layers. It should be understood that although the terms first, second, third, etc., may be used to describe various elements, components, areas, layers, and / or portions, these elements, components, areas, layers, and / or portions should not be limited by these terms. These terms are only used to distinguish one element, component, area, layer, or portion from another element, component, area, layer, or portion. Therefore, without departing from the teachings of this application, the first element, component, area, layer, or portion discussed below may be referred to as the second element, component, area, layer, or portion.

[0034] Spatial relation terms such as “below,” “under,” “below,” “under,” “above,” “above,” etc., are used herein for convenience of description to describe the relationship between one element or feature shown in the figure and other elements or features. It should be understood that, in addition to the orientation shown in the figure, spatial relation terms are intended to also include different orientations of the device in use and operation. For example, if the device in the figure is flipped, then the element or feature described as “below” or “under” the other element or feature will be oriented “above” the other element or feature. Therefore, the exemplary terms “below” and “under” can include both upper and lower orientations. The device may be otherwise oriented (rotated 90 degrees or otherwise) and the spatial descriptive terms used herein will be interpreted accordingly.

[0035] The terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the scope of this application. When used herein, the singular forms “a,” “an,” and “the” are also intended to include the plural forms unless the context clearly indicates otherwise. It should also be understood that the terms “comprising” and / or “including,” when used in this specification, identify the presence of the stated features, integers, steps, operations, elements, and / or components, but do not exclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or groups. When used herein, the term “and / or” includes any and all combinations of the associated listed items.

[0036] Embodiments of the application are described herein with reference to cross-sectional views that serve as schematic diagrams of preferred embodiments (and intermediate structures). Thus, variations from the illustrated shape can be anticipated due to, for example, manufacturing techniques and / or tolerances. Therefore, embodiments of the application should not be limited to the specific shapes of the regions shown herein, but rather include shape deviations due to, for example, manufacturing processes. The regions shown in the figures are substantially schematic, and their shapes are not intended to show the actual shapes of regions of the device and are not intended to limit the scope of the application.

[0037] This disclosure provides an electrostatic chuck cleaning device, wherein the electrostatic chuck is disposed in a working chamber. The electrostatic chuck cleaning device includes a first jet mechanism, a second jet mechanism, a third jet mechanism, and a suction mechanism. The first jet mechanism has a first jet port, and the second jet mechanism has a second jet port. The first and second jet ports are respectively disposed on opposite sides above the electrostatic chuck, with the jet directions of the first and second jet ports facing the upper surface of the electrostatic chuck. The third jet mechanism has a third jet port, the jet path of which intersects with the jet path of the first jet port, and the airflow from the first jet port can redirect the airflow from the third jet port to sweep along the surface of the electrostatic chuck. The suction port of the suction mechanism is located within the working chamber.

[0038] Specifically, the first, second, and third jetting mechanisms are used to eject gas into the working chamber. The ejected gas typically travels along the initial jetting direction, and the area traversed by the ejected gas is its jetting path. Since the jetting paths of the first and third jetting ports intersect, the airflow ejected from the first and third jetting ports merges when they meet, and the airflow direction changes.

[0039] In the electrostatic chuck cleaning device of the above embodiment, the first jet nozzle is positioned diagonally above the electrostatic chuck, ejecting an inclined airflow toward the electrostatic chuck. The jet path of the third jet nozzle intersects with that of the first jet nozzle. The gases ejected from the first, second, and third jet nozzles interact to form a variable-direction airflow along the surface of the electrostatic chuck, sweeping the surface of the electrostatic chuck. Combined with a suction mechanism, the airflow sweeping the electrostatic chuck carries contaminants away, thus completing the cleaning of the electrostatic chuck. This cleaning method can form a transverse sweeping airflow to clean the surface of the electrostatic chuck without opening the working chamber. It can not only effectively remove microparticles attached to the surface of the electrostatic chuck but also prevent microparticles from accumulating in specific areas of the electrostatic chuck surface.

[0040] To facilitate understanding of the structure and operation of the electrostatic chuck cleaning device of this disclosure, this disclosure... Figure 1 A schematic diagram of an electrostatic chuck cleaning device is shown. For ease of understanding, [the diagram is missing here]. Figure 1 The image also shows a working chamber 200 and an electrostatic chuck 100 disposed within the working chamber 200, wherein the working chamber 200 may be a sealed chamber.

[0041] Reference Figure 1 As shown, an electrostatic suction cup cleaning device is disclosed, which includes a first jet mechanism 110, a second jet mechanism 120, a third jet mechanism 130, and a suction mechanism.

[0042] The first jet mechanism 110 has a first jet port 111, the second jet mechanism 120 has a second jet port 121, and the third jet mechanism 130 has a third jet port 131. The first jet port 111 and the second jet port 121 are respectively located on the upper sides of the electrostatic chuck 100, and the jet direction of the first jet port 111 and the jet direction of the second jet port 121 are facing the upper surface of the electrostatic chuck 100.

[0043] Figure 1The dashed arrows indicate the direction of airflow. This direction is only used to help understand the approximate direction of movement in the electrostatic chuck cleaning device, and not to indicate the actual direction of airflow. In actual operation, the airflow may diverge to either side, or there may be slight deviations in direction, but this does not affect the implementation of the electrostatic chuck cleaning device of this disclosure. (Refer to...) Figure 1 As shown, the movement path of the gas ejected from the third jet nozzle 131 intersects with the movement path of the gas ejected from the first jet nozzle 111. As a result, the airflow ejected from the first jet nozzle 111 and the airflow ejected from the third jet nozzle 131 converge, and the converged airflows sweep along the surface of the electrostatic chuck 100.

[0044] Reference Figure 1 As shown, the electrostatic suction cup cleaning device also includes a suction mechanism, the suction port of which is located within the working chamber 200. It can be understood that the suction mechanism is used to extract the gas ejected by the first jet mechanism 110, the second jet mechanism 120, and the third jet mechanism 130.

[0045] Reference Figure 1 As shown, in some examples of this embodiment, the third jet nozzle 131 is disposed below the first jet nozzle 111, and the jet path of the third jet nozzle 131 intersects the jet path of the first jet nozzle 111 from bottom to top. It can be understood that since the first jet nozzle 111 is disposed on the upper side of the electrostatic chuck 100, the jet direction of the first jet nozzle 111 blows towards the electrostatic chuck 100 from the upper side. By disposing the third jet nozzle 131 below the first jet nozzle 111 and making the jet path of the third jet nozzle 131 intersect the jet path of the first jet nozzle 111 from bottom to top, the airflow ejected from the first jet nozzle 111 can also be redirected to sweep along the surface of the electrostatic chuck 100, enhancing the gas flow rate sweeping the surface of the electrostatic chuck 100.

[0046] Reference Figure 1 As shown, in some examples of this embodiment, the electrostatic chuck 100 has a first gap 210 between the side near the first jet port 111 and the cavity wall of the working chamber 200, and the jet path of the third jet port 131 intersects with the jet path of the first jet port 111 after passing through the first gap 210. In the actual working chamber 200, the electrostatic chuck 100 is usually located in the middle area of ​​the working chamber 200, and there is also a first gap 210 between the electrostatic chuck 100 and the cavity wall. By placing the third jet port 131 below the first gap 210, the airflow ejected from the third jet port 131 can be made as close as possible to the electrostatic chuck 100 without affecting the working chamber 200 and the electrostatic chuck 100.

[0047] Reference Figure 1As shown, in some examples of this embodiment, a second gap 220 is formed between the side of the electrostatic chuck 100 near the second air nozzle 121 and the cavity wall of the working chamber 200. The airflow ejected from the second air nozzle 121 can redirect the airflow along the surface of the electrostatic chuck 100 and allow it to pass through the second gap 220. Specifically, by controlling the spraying direction of the second air nozzle 121, the airflow along the surface of the electrostatic chuck 100 can be redirected downwards and pass through the second gap 220. Thus, after cleaning the surface of the electrostatic chuck 100, the airflow can transport contaminants from the surface of the electrostatic chuck 100 to below the electrostatic chuck 100.

[0048] Although the suction port can be located in different positions within the working chamber 200, in some examples of this embodiment, refer to Figure 1 As shown, the suction port is located below the electrostatic chuck 100, and is situated between the third jet port 131 and the second gap 220. After the airflow sweeps the electrostatic chuck 100, it passes through the second gap 220 and then reaches below the electrostatic chuck 100, carrying contaminants into the suction port.

[0049] Reference Figure 1 As shown, in some examples of this embodiment, to maximize the cleaning effect on the surface of the electrostatic chuck 100, the distance between the first air jet 111 and the upper surface of the electrostatic chuck 100 is 40mm to 50mm. In some examples of this embodiment, the distance between the second air jet 121 and the upper surface of the electrostatic chuck 100 is 40mm to 50mm. If the distance between the first air jet 111 and the upper surface of the electrostatic chuck 100 is too large, the airflow will diverge significantly, resulting in a poor cleaning effect. If the distance between the first air jet 111 and the upper surface of the electrostatic chuck 100 is too small, the cleaning area may be insufficient, increasing the risk of residual contaminants in local areas.

[0050] Reference Figure 1 As shown, the structural design of the electrostatic chuck cleaning device allows the airflow to be redirected from the third jet port 131 to the surface of the electrostatic chuck 100, where it joins the airflow from the first jet port 111 and the second jet port 121 to clean the surface of the electrostatic chuck 100, achieving a more comprehensive cleaning. Furthermore, the airflow sweeping along the surface of the electrostatic chuck 100 passes through the second gap 220 and reaches the extraction port, simultaneously cleaning the surface of the electrostatic chuck 100 and removing contaminants generated during cleaning from the working chamber 200, ensuring the cleanliness of the working chamber 200. This also completes airflow circulation, preventing the airflow cleaning the surface of the electrostatic chuck 100 from affecting the subsequent gases ejected by the jet mechanisms.

[0051] Furthermore, in some examples of this embodiment, the first jet mechanism 110 includes a first jet pipe penetrating the cavity wall of the working chamber 200. This disclosure Figure 2 A schematic diagram of a first jet pipe is shown. (Refer to...) Figure 2 As shown, the first jet nozzle 111 is disposed on the first jet pipe. It can be understood that the first jet nozzle 111 is opened on one side of the first jet pipe located in the working chamber 200.

[0052] Reference Figure 2 As shown, in some examples of this embodiment, the first jet pipe includes a first inlet branch pipe 1103, a first connector 1102, and a first outlet branch pipe 1101. A first jet nozzle 111 is formed on the first outlet branch pipe 1101. The first inlet branch pipe 1103 and the first outlet branch pipe 1101 are connected by the first connector 1102, which is rotatable. The rotatable first connector 1102 can drive the first outlet branch pipe 1101 to rotate, thereby adjusting the jet direction of the first jet nozzle 111. It can be understood that by adjusting the direction of the first jet nozzle 111, the subsequent movement direction of the airflow can be changed, thereby enabling the electrostatic chuck cleaning device to more thoroughly clean the surface of the electrostatic chuck 100. In some examples of this embodiment, the minimum rotatable angle of the first connector 1102 in two mutually perpendicular directions is ≥120°. For example, the first connector 1102 can rotate 120° vertically and 120° horizontally. Furthermore, the first connector 1102 can rotate in one direction while simultaneously rotating in another direction.

[0053] Reference Figure 2 As shown, in some examples of this embodiment, the first intake manifold 1103 passes through the cavity wall of the working chamber 200, and the first jet mechanism 110 further includes a first protective sleeve 1104, which is sleeved on the first intake manifold 1103. The first protective sleeve 1104 fills the space between the first intake manifold 1103 and the cavity wall of the working chamber 200. By sleeved on the first intake manifold 1103, the first protective sleeve 1104 serves two purposes: firstly, it seals the working chamber 200; secondly, it protects the first intake manifold 1103 and prevents wear.

[0054] Figure 3 A cross-sectional schematic diagram of the first jet nozzle 111 is shown. (Refer to...) Figure 3As shown, the first jet nozzle 111 includes a plurality of spaced-apart, arrayed first jet sub-nozzles 1111. By providing a plurality of first jet sub-nozzles 1111, the airflow ejected from the first jet nozzle 111 can be more uniform. The cross-sectional shape of the first jet sub-nozzle 1111 can be a regular shape, such as an equilateral triangle, square, rectangle, regular hexagon, or circle. The shape of the first jet nozzle 1111 can also be irregular. In this embodiment, the cross-sectional shape of the first jet nozzle 1111 is a regular hexagon.

[0055] It is understood that, in some examples of this embodiment, similar to the first jet mechanism 110, the second jet mechanism 120 also includes a second jet pipe passing through the cavity wall of the working chamber 200. The second jet port 121 is disposed on the second jet pipe, and it is understood that the second jet port 121 is opened on the side of the second jet pipe located in the working chamber 200.

[0056] In some examples of this embodiment, the second jet pipe includes a second intake branch pipe, a second connector, and a second exhaust branch pipe. A second jet port 121 is formed on the second exhaust branch pipe. The second intake branch pipe and the second exhaust branch pipe are connected by a second connector, which is rotatable. In some examples of this embodiment, the minimum rotatable angle of the second connector in two mutually perpendicular directions is ≥120°. For example, the second connector can rotate 120° vertically and 120° horizontally. Furthermore, the second connector can rotate in one direction while simultaneously rotating in the other direction.

[0057] In some examples of this embodiment, the second intake manifold passes through the wall of the working chamber 200, and the second jet mechanism 120 further includes a second protective sleeve fitted onto the second intake manifold. The second protective sleeve fills the space between the second intake manifold and the wall of the working chamber 200.

[0058] In some examples of this embodiment, the second jet nozzle 121 includes a plurality of spaced-apart, arrayed second jet sub-nozzles. By providing a plurality of second jet sub-nozzles, the airflow ejected from the second jet nozzle 121 can be made more uniform. The cross-sectional shape of the second jet sub-nozzles can be a regular shape, such as an equilateral triangle, square, rectangle, regular hexagon, or circle. The shape of the second jet sub-nozzles can also be irregular. In this embodiment, the cross-sectional shape of the second jet nozzle is a regular hexagon.

[0059] This is publicly available. Figure 4 A schematic diagram of a third painting mechanism is shown. (Refer to...) Figure 4As shown, in some examples of this embodiment, similar to the first jet mechanism 110, the third jet mechanism 130 also includes a third jet pipe that passes through the cavity wall of the working chamber 200. The third jet port 131 is disposed on the third jet pipe, and it can be understood that the third jet port 131 is opened on the side of the third jet pipe located in the working chamber 200.

[0060] Reference Figure 4 As shown, in some examples of this embodiment, the third jet pipe includes a third intake branch pipe 1303, a third connector 1302, and a third exhaust branch pipe 1301. A third jet port 131 is formed on the third exhaust branch pipe 1301. The third intake branch pipe 1303 and the third exhaust branch pipe 1301 are connected by the third connector 1302, which is rotatable. In some examples of this embodiment, the minimum rotatable angle of the third connector 1302 in two mutually perpendicular directions is ≥120°. For example, the third connector 1302 can rotate 120° vertically and 120° horizontally. Furthermore, the third connector 1302 can rotate in one direction while simultaneously rotating in the other direction.

[0061] Reference Figure 4 As shown, in some examples of this embodiment, the third intake branch pipe 1303 passes through the cavity wall of the working chamber 200, and the third jet mechanism 130 also includes a third protective sleeve 1304, which is sleeved on the third intake branch pipe 1303. The third protective sleeve 1304 fills the space between the third intake branch pipe 1303 and the cavity wall of the working chamber 200.

[0062] In some examples of this embodiment, the third jet outlet 131 includes a plurality of spaced-apart, arrayed third jet outlets. By providing a plurality of third jet outlets, the airflow ejected from the third jet outlet 131 can be made more uniform. The cross-sectional shape of the third jet outlet can be a regular shape, such as an equilateral triangle, square, rectangle, regular hexagon, or circle. The shape of the third jet outlet can also be irregular. In this embodiment, the cross-sectional shape of the third jet outlet is a regular hexagon.

[0063] Reference Figure 4As shown, in some examples of this embodiment, the third jet mechanism 130 further includes an openable and closable first sealing member 1305, which is disposed on the third jet port 131 and is used to close the third jet port 131. Additionally, the suction mechanism includes an openable and closable second sealing member (not shown in the figure), which is disposed on the suction port and is used to close the suction port. The first sealing member 1305 can be movably connected to the third jet pipe or can be separately disposed from the third jet pipe, as long as the first sealing member 1305 can control the opening and closing of the third jet port 131. In this embodiment, by providing the first sealing member 1305 on the third jet port 131 and the second sealing member on the suction port, the working time of the third jet port 131 and the suction port can be staggered, reducing the influence of the suction port on the airflow ejected from the third jet port 131 and preventing the airflow ejected from the third jet port 131 from directly turning into the suction port.

[0064] Furthermore, based on the electrostatic chuck 100 cleaning device disclosed in the above embodiments, this disclosure also provides an electrostatic chuck 100 cleaning method, which repeatedly performs a gas purging process at least once, the gas purging process including the following steps:

[0065] Control the third jet mechanism 130 to jet air towards the jet path of the first jet nozzle 111;

[0066] Control the first jet mechanism 110 to continuously jet;

[0067] During the continuous jetting process of the first jetting mechanism 110, the second jetting mechanism 120 is controlled to jet intermittently.

[0068] Control the third jet mechanism 130 to stop jetting and start the suction mechanism to extract gas through the suction port.

[0069] It is understandable that if only the first jet mechanism 110 and the second jet mechanism 120 are used for purging, although the surface of the electrostatic chuck 100 can be purged, this purging method will cause contaminants to easily accumulate in specific locations and be difficult to completely remove, thus forming a "map" on the surface of the electrostatic chuck 100 that is common in the art.

[0070] In some examples of this embodiment, reference can be made to Figure 1As shown, firstly, the third jet mechanism 130 is controlled to spray air upwards, while the first jet mechanism 110 is controlled to continuously spray air. When the gas sprayed by the third jet mechanism 130 and the gas sprayed by the first jet mechanism 110 converge, the converged gas turns to the left and sweeps the surface of the electrostatic chuck 100. Then, the second jet mechanism 120 is controlled to spray air intermittently, further converging with the converged gas to form turbulence, achieving a more comprehensive cleaning of the surface of the electrostatic chuck 100 and removing contaminants from the surface. Furthermore, the gas sprayed by the second jet mechanism 120 can also converge with the gas sweeping along the surface of the electrostatic chuck 100 and turn downwards to carry away contaminants, minimizing the accumulation of contaminants in certain specific areas of the electrostatic chuck 100 surface and reducing the appearance of map patterns.

[0071] It is understandable that during a gas purging process, the third jetting mechanism 130 can continuously jet gas throughout the entire process, or it can only jet gas once at the initial moment and then stop jetting. Furthermore, when the gas jetted by the third jetting mechanism 130 merges with the gas jetted by the first jetting mechanism 110, the flow direction of the merged gas will be affected by the directions and velocities of the two gases before the merger. Therefore, in actual gas purging processes, the jetting direction and / or flow rate of the first jetting mechanism 110 can be adjusted to create directionally adjustable gas for purging, achieving a more comprehensive cleaning of the electrostatic chuck 100 surface and minimizing particle accumulation in certain specific areas. However, the merged gas should still generally clean along the surface of the electrostatic chuck 100.

[0072] In some examples of this embodiment, during the cleaning process of controlling the second jet mechanism 120, the jet direction and / or flow rate of the second jet mechanism 120 can be adjusted to adjust the main cleaning area, thereby achieving a more comprehensive cleaning of the surface of the electrostatic chuck 100 and further reducing the accumulation of particles in certain specific areas. Then, the suction mechanism is activated to extract the gas used for cleaning, along with the contaminants blown out by the gas, to prevent contaminants from adhering to other areas inside the chamber and re-adhering to the surface of the electrostatic chuck 100 during subsequent gas cleaning processes.

[0073] In some examples of this embodiment, the ratio of the jet flow rate of the first jet mechanism 110 to the jet flow rate of the third jet mechanism 130 is (1:1.5) to (1:3) to ensure that the collected gas can be blown along the surface of the electrostatic chuck 100 as much as possible. Further, in some examples of this embodiment, the ratio of the jet flow rate of the first jet mechanism 110 to the jet flow rate of the third jet mechanism 130 is (1:1.5) to (1:2.5). For example, the ratio of the jet flow rate of the first jet mechanism 110 to the jet flow rate of the third jet mechanism 130 can be 1:2.

[0074] In particular, the total time for a single gas purging process can be kept relatively short, so as to make the gas flow direction more controllable.

[0075] For example, in some examples of this embodiment, in the step of controlling the third jet mechanism 130 to spray air towards the jet path of the first jet nozzle 111, the time for controlling the third jet mechanism 130 to spray air is 15s to 30s. Further, in some examples of this embodiment, the time for controlling the third jet mechanism 130 to spray air can be 18s to 28s. Further still, the time for controlling the third jet mechanism 130 to spray air can also be 20s to 25s.

[0076] For example, in some examples of this embodiment, in the step of controlling the second jet mechanism 120 to spray intermittently, the duration of each jet spray by the second jet mechanism 120 is controlled to be 5s to 10s, and the interval between two adjacent jet sprays is 1s to 5s. Further, in some examples of this embodiment, the duration of each jet spray by the second jet mechanism 120 can be controlled to be 6s to 10s, and the interval between two adjacent jet sprays can be 1s to 3s.

[0077] In some examples of this embodiment, a judgment step is included before performing the gas purging process. This judgment step includes monitoring the working gas flow rate on the back of the electrostatic chuck 100. When the working gas flow rate is detected to be higher than a preset flow rate, the gas purging process is performed. During actual operation, working gas typically flows from the back of the electrostatic chuck 100 towards the wafer located on the electrostatic chuck 100 within the working chamber 200. This disclosure has found that when a small amount of contaminants, such as particulate matter, are present on the surface of the electrostatic chuck 100, it can cause a slight tilting of the wafer surface, resulting in a significant change in the working gas flow rate. Therefore, technicians can set a preset flow rate based on the flow rate range of abnormal conditions. By monitoring the working gas flow rate and comparing it with the preset flow rate, the gas purging process can be performed when the working gas flow rate is greater than the preset flow rate.

[0078] Furthermore, this disclosure, through research, has also found that when the working gas flow rate is abnormal, there is a certain relationship between the magnitude of the working gas flow rate and the number of contaminants present on the surface of the electrostatic chuck 100. For example, when the number of contaminants is 10, the working gas flow rate reaches approximately 100 units; when the number of contaminants is 20 or 40, the working gas flow rate reaches approximately 400 units; and when the number of contaminants is 24, the working gas flow rate reaches approximately 500 units. Please note that the above data are only provided as examples to aid understanding and do not represent an absolute regularity. Moreover, this data is also related to the specific conditions of the working chamber 200, but the magnitude of the working gas flow rate is generally correlated with the number of contaminants.

[0079] Therefore, in some instances of this embodiment, when the working gas flow rate is detected to be higher than a preset value, the number of particles on the surface of the electrostatic chuck 100 is determined based on the value of the working gas flow rate at this time, and the jet flow rate of the third jet mechanism 130 is controlled based on the number of particles on the surface of the electrostatic chuck 100 to further optimize the cleaning effect of the electrostatic chuck 100 cleaning device of this disclosure.

[0080] Please note that the above embodiments are for illustrative purposes only and do not imply any limitation on this application.

[0081] It should be understood that, unless otherwise expressly stated herein, there is no strict order in which the steps are performed, and these steps may be performed in other orders. Moreover, at least some of the steps may include multiple sub-steps or multiple stages, which are not necessarily completed at the same time, but may be performed at different times, and the execution order of these sub-steps or stages is not necessarily sequential, but may be performed alternately or in turn with other steps or at least some of the sub-steps or stages of other steps.

[0082] The various embodiments in this specification are described in a progressive manner, with each embodiment focusing on the differences from other embodiments. The same or similar parts between the various embodiments can be referred to each other.

[0083] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

Claims

1. An electrostatic chuck cleaning device, characterized in that, The electrostatic chuck is disposed in the working chamber, and the electrostatic chuck cleaning device includes a first jet mechanism, a second jet mechanism, a third jet mechanism, and a suction mechanism; The first jet mechanism has a first jet port, and the second jet mechanism has a second jet port. The first jet port and the second jet port are respectively located on the upper sides of the electrostatic chuck, and the jet direction of the first jet port and the jet direction of the second jet port are facing the upper surface of the electrostatic chuck. The third jet mechanism has a third jet port, and the jet path of the third jet port intersects with the jet path of the first jet port. The airflow ejected from the first jet port can redirect the airflow ejected from the third jet port to sweep along the surface of the electrostatic chuck. The suction port of the suction mechanism is located inside the working chamber. The third jet nozzle is located below the first jet nozzle, and the jet path of the third jet nozzle intersects the jet path of the first jet nozzle from bottom to top. The electrostatic chuck has a first gap between the side of the electrostatic chuck near the first jet nozzle and the cavity wall of the working chamber, and the jet path of the third jet nozzle intersects with the jet path of the first jet nozzle after passing through the first gap. The electrostatic chuck has a second gap between the side of the electrostatic chuck near the second jet nozzle and the cavity wall of the working chamber, and the airflow ejected from the second jet nozzle can redirect the airflow along the surface of the electrostatic chuck to pass through the second gap.

2. The electrostatic chuck cleaning device according to claim 1, characterized in that, The suction port is located below the electrostatic chuck and between the third air jet and the second gap.

3. The electrostatic chuck cleaning device according to any one of claims 1 to 2, characterized in that, The third jet mechanism further includes an openable and closable first sealing member, which is disposed on the third jet port and is used to close the third jet port; the suction mechanism further includes an openable and closable second sealing member, which is disposed on the suction port and is used to close the suction port.

4. The electrostatic chuck cleaning device according to any one of claims 1 to 2, characterized in that, The jet direction of the first jet mechanism is adjustable, and / or The jet direction of the second jet mechanism is adjustable.

5. A method for cleaning with an electrostatic chuck, characterized in that, The electrostatic chuck cleaning device according to any one of claims 1 to 4 is used, wherein the electrostatic chuck cleaning method includes performing a gas purging process at least once, and the gas purging process includes the following steps: Control the third jet mechanism to jet air towards the jet path of the first jet nozzle; Control the first jet mechanism to continuously jet; During the continuous jetting process of the first jetting mechanism, the second jetting mechanism is controlled to jet intermittently; The third jet mechanism is controlled to stop jetting, and the suction mechanism is activated to extract gas through the suction port.

6. The electrostatic chuck cleaning method according to claim 5, characterized in that, In the step of controlling the third jet mechanism to spray air towards the jet path of the first jet nozzle, the time for controlling the third jet mechanism to spray air is 15s-30s; and / or, In the step of controlling the intermittent jetting of the second jetting mechanism, the duration of each jetting operation is controlled to be 5-10 seconds, and the interval between two adjacent jetting operations is 1-5 seconds; and / or, The ratio of the jet flow rate of the first jet mechanism to the jet flow rate of the third jet mechanism is (1:1.5) to (1:3).

7. The electrostatic chuck cleaning method according to any one of claims 5-6, characterized in that, Before performing the gas purging process, a judgment step is also included, which includes: monitoring the working gas flow rate on the back of the electrostatic chuck, and performing the gas purging process when the working gas flow rate is detected to be higher than the preset flow rate.

8. The electrostatic chuck cleaning method according to claim 7, characterized in that, The judgment step further includes: when the working gas flow rate is detected to be higher than the preset flow rate, determining the number of particles on the surface of the electrostatic chuck based on the value of the working gas flow rate at this time, and then controlling the jet flow rate of the third jet mechanism based on the number of particles on the surface of the electrostatic chuck.

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