A method for fabricating electronic circuits with a resolution of 2 nm

Abstract

This invention discloses a method for fabricating electronic circuits with a resolution of 2 nm, comprising the following steps: First, designing the required electronic circuit diagram. Based on the origami principle, a long-chain DNA is folded back and forth to form the required electronic circuit diagram framework. Suitable connection sites are designed, and a large number of short chains (staple chains) are introduced to fix the framework. All chains are mixed and annealed to form DNA origami patterns. The origami structure is limited by the length of the long chains, and can only form patterns of a few hundred nanometers in size, making it difficult to directly form macroscopic patterns. We deposit gold nanoparticles on a silicon wafer and perform surface treatment to form thiol gold bonds, making them complementary to the pre-designed short chain bases at the edge of the pattern, thus fixing each DNA pattern at a specific position on the silicon wafer. Different origami patterns are interconnected to synthesize a complete macroscopic electronic circuit diagram. Since the diameter of the DNA helix is ​​approximately 2 nanometers, the drawn electronic circuit diagram ensures both its macroscopic characteristics and achieves a minimum resolution of 2 nanometers. Advantages: Compared with conventional methods such as extreme ultraviolet lithography, it is low-cost and has high resolution, providing a feasible method for the development of electronic information.

Description

Technical Field

[0001] This invention relates to a method for preparing high-resolution circuit diagrams, and more particularly to a method for preparing macroscopic circuit diagrams with a resolution of approximately 2 nanometers. Background Technology

[0002] Chip manufacturing is a crucial pillar of technological development. With the increasing integration of electronic circuits, it is particularly important to manufacture a small-sized, high-resolution circuit template. However, conventional etching technologies such as ultraviolet lithography and extreme ultraviolet lithography are hindered by factors such as resolution limits and high manufacturing costs as etching precision gradually increases. Therefore, it is especially important to develop a low-cost and high-resolution manufacturing technology.

[0003] In recent years, with the continuous development of DNA technology, a bottom-up manufacturing technology - DNA origami - has gradually become known to people. By folding a long DNA strand and fixing it with a short strand, arbitrary patterns with nanometer resolution can be constructed, including two-dimensional and three-dimensional patterns.

[0004] DNA origami, limited by its long chain length, typically only forms structures a few hundred nanometers in size. This characteristic hinders its practical applications and development. We addressed this by introducing gold nanoparticles to treat its surface, connecting multiple small origami patterns to form a macroscopic electronic circuit diagram with a minimum resolution of 2 nanometers. Summary of the Invention

[0005] The technical problem this invention addresses is to propose a method for fabricating electronic circuits with a resolution of 2 nm. Based on the principles of origami, the required electronic circuit diagram is constructed. Since the diameter of a DNA helix is ​​approximately 2 nanometers, the drawn electronic circuit diagram can achieve a minimum resolution of 2 nanometers. However, due to the long chain length of the origami structure, each origami structure is approximately several hundred nanometers, which limits practical applications. We solve this problem by depositing gold nanoparticles on a silicon wafer surface, enabling the connection of each different origami structure to form a complete electronic circuit diagram. This invention ensures both high resolution and macroscopic application of the circuit, solving the problems of high cost, demanding conditions, and low resolution associated with conventional fabrication methods.

[0006] The technical solution adopted by this invention to solve the above-mentioned technical problems is as follows: a method for preparing electronic circuits with a resolution of 2 nm, characterized by how to construct macroscopic-scale circuit diagrams with a resolution of approximately 2 nanometers using DNA origami; the preparation method includes the following steps:

[0007] Step 1: Draw the required electronic circuit diagram.

[0008] Step Two: Origami Frame Design. Following the pattern design, fold the long chain (m13p18, approximately 900nt) back and forth to form a support structure. Design suitable connection points and introduce numerous short chains (staple chains) to secure the frame. Design short connecting chains at the ends of the origami frame that complement the thiol gold bonds for later use.

[0009] The origami pattern is formed. The designed long chains and all short chains (including connecting chains) are mixed in a molar ratio (1:10) and annealed. The annealing temperature is gradually reduced from 95℃ to 20℃, and the total time is less than 2 hours.

[0010] Step 4: Gold nanoparticle deposition. Gold nanoparticles are deposited at specific locations on the silicon substrate surface, and the surface of the gold nanoparticles is treated to form thiol gold bonds.

[0011] Step 5: Connecting the origami structure with gold nanoparticles. An annealed solution containing the origami structure is dropped onto the silicon wafer surface. The connecting chains at the endpoints of the origami pattern are complementary to the thiol gold bonds, connecting and fixing the origami pattern at specific positions. The origami patterns are sequentially connected to form a complete electronic circuit diagram.

[0012] Compared with the prior art, the advantages of the present invention are as follows:

[0013] 1) The experimental conditions are simple and do not require extreme experimental conditions;

[0014] 2) Low cost and simple DNA strand synthesis;

[0015] 3) High resolution, with a minimum resolution of 2 nanometers. Attached Figure Description

[0016] The present invention will now be described in further detail with reference to the accompanying drawings and specific embodiments.

[0017] Figure 1 A partial circuit diagram designed for this invention;

[0018] Figure 2 The process of forming a local DNA origami pattern designed for this invention;

[0019] Figure 3 A schematic diagram illustrating the connection principle between one end of the DNA pattern designed in this invention and gold nanoparticles. Detailed Implementation

[0020] The present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments. The specific embodiments listed below are not intended to limit the scope of the present invention.

[0021] Implementation Example 1:

[0022] Step 1: Create a geometric model of the DNA structure that approximates the desired shape.

[0023] Step 2: Fold a long DNA chain of M13p18 phage according to the circuit diagram in Step 1 to form a framework structure. Based on the base pairing principle, design a large number of short chain connection points to fix the framework structure to prevent the pattern from being deformed or twisted.

[0024] Step 3: Mix the long chains and all the short chains together and anneal them in one pot to form the desired pattern.

[0025] Step 4: Perform electrophoretic purification on the annealed pattern to obtain the relevant electrophoretic bands.

[0026] Step 5: The purified bands are cut and centrifuged for further purification, ready for later use.

[0027] Step 5: Take 3 μL of the purified sample for AFM imaging.

[0028] Step 6: Take 5 μL of the purified sample, stain with uranyl formate for 1 minute, let stand for 5 minutes, and then use it for TEM imaging.

Claims

1. A method for fabricating an electronic circuit with a resolution of 2 nm, characterized in that, include: The overall circuit diagram is obtained based on the target electronic circuit diagram, and the overall circuit diagram is divided into multiple local circuit diagrams, each local circuit diagram corresponding to a DNA origami pattern. For each local circuit diagram, a corresponding DNA origami framework is designed. Long chains are folded back and forth to form a scaffold structure. Short chains are introduced to fix the scaffold structure, and endpoint connecting chains are set at the ends of the DNA origami framework. The long chain is mixed with all the short chains, including the connecting strands, and then annealed to form the DNA origami pattern. Gold nanoparticles are deposited on the surface of a silicon substrate at predetermined positions corresponding to the endpoints of each DNA origami pattern, and the surface of the gold nanoparticles is treated to form thiol gold bonds to form connection sites for connection with the endpoint linkage. A solution containing the DNA origami pattern is applied to the surface of the silicon substrate, so that the endpoint connecting chains are connected to gold nanoparticles at corresponding preset positions; multiple DNA origami patterns are connected sequentially according to the overall circuit diagram, so that adjacent DNA origami patterns are connected through shared gold nanoparticles to form a complete electronic circuit.

2. The method for fabricating an electronic circuit with a resolution of 2 nm according to claim 1, characterized in that, The long chain and all short chains, including connecting chains, are mixed at a molar ratio of 1:10; the annealing temperature is gradually reduced from 95°C to 20°C, and the total annealing time is less than 2 hours.

3. The method for fabricating an electronic circuit with a resolution of 2 nm according to claim 1, characterized in that, The connection sites on the surface of the gold nanoparticles are specific, connecting only to the corresponding endpoints of the DNA origami pattern.

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